US20170047362A1 - Optoelectronic module with customizable spacers - Google Patents
Optoelectronic module with customizable spacers Download PDFInfo
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- US20170047362A1 US20170047362A1 US15/232,932 US201615232932A US2017047362A1 US 20170047362 A1 US20170047362 A1 US 20170047362A1 US 201615232932 A US201615232932 A US 201615232932A US 2017047362 A1 US2017047362 A1 US 2017047362A1
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- customizable
- optical
- spacer
- optoelectronic module
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Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
Definitions
- This disclosure relates to optoelectronic modules with customizable features.
- Optoelectronic modules include multiple components (such as transparent covers, optical filters, and lens or optical assemblies). Optoelectronic modules are often manufactured from mass-produced components. Due to manufacturing tolerances, or other fabrication variations, these mass-produced components can have variable dimensions, while in other cases ostensibly identical lens or optical assemblies can in fact possess variable focal lengths or tilted optical axes. Components with variable dimensions can cause significant problems in optoelectronic modules whose optimal optical performance requires tight tolerances (e.g., optoelectronic modules with high-resolution sensors).
- components that exhibit dimensional variation may be matched (i.e., binned) to other components with complementing dimensional variations.
- this binning process is accomplished only with considerable time and expense.
- the present disclosure describes customizable optoelectronic modules and methods of fabricating the customizable optoelectronic modules.
- Various approaches are described to provide adjustments to reduce dimensional variations of various components (such as transparent covers, optical filters, and optical assemblies) from component to component, and in some cases within components.
- approaches are described to reduce the occurrence of tilt of the optical assemblies and/or optical elements.
- the described implementations obviate the need for binning of components when manufacturing optoelectronic modules.
- a customizable optoelectronic module includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly include a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal defining a customizable spacer surface disposed.
- implementations can include an optical filter of a thickness, the first thickness including the thickness of the optical filter and the thickness of the cover. While other implementations can include an optical assembly, the optical assembly including a plurality of optical elements mounted within an optical housing. In this implementation the optical assembly has a focal length and an optical axis where the customizable spacer surface is modifiable such that the focal length is incident on the sensor.
- a plurality of customizable optoelectronic modules wherein each customizable optoelectronic module comprising the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface is provided. Further, a value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules is determined.
- a data set of values, wherein the data set associates each first thickness with each respective customizable optoelectronic module is compiled.
- the customizable spacer surface of each respective customizable optoelectronic module according to the data set such that the sum of each second thickness and each respective first thickness is substantially equal to a first standard value, the first standard value being substantially the same for each customizable optoelectronic module is modified.
- FIG. 1 depicts an example of an optoelectronic module with an optical assembly that is focused on a sensitive area of a sensor.
- FIG. 2A and FIG. 2B depict example optoelectronic modules with optical assemblies that are not focused on their respective sensors.
- FIG. 3A - FIG. 3F depict example optoelectronic modules with customizable spacers configured to focus optical assemblies on their respective sensors.
- FIG. 4A and FIG. 4B depict example optoelectronic modules with customizable spacers and optical filters.
- FIGS. 5-11 depict example methods for standardizing the customizable optoelectronic modules depicted in FIGS. 3-4 .
- FIG. 1 depicts an example of an optoelectronic module 100 (e.g., an imaging module such as a camera) as discussed above.
- the optoelectronic module 100 can include a sensor 102 (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array).
- the sensor 102 is electrically coupled to a substrate 105 (e.g., a PCB) via electrical contacts 106 (such as wires, vias, solder bumps/bump-bonding).
- a cover 107 can be located adjacent to the sensor 102 (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of the optoelectronic module 100 ).
- the cover 107 can be a thin layer of glass, for example, or other highly transmissive optical polymer.
- the transparent cover 107 can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths).
- the transparent cover 107 can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material). In such instances, the coated transparent cover 107 can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors). Still further, in such instances the transparent cover 107 can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array).
- the optoelectronic module 100 further includes an optical assembly 110 .
- the optical assembly 110 includes a plurality of optical elements 111 mounted and/or integrated into an optical housing 112 .
- the optical elements 111 and their respective position can delineate a focal length 113 of the optical assembly 110 and an optical axis 114 (depicted in FIG. 1 as substantially orthogonal to the sensor 102 ).
- the thickness of the transparent cover 107 and/or variations in focal length 113 can vary from module to module (e.g., due to manufacturing tolerances). Such variations can result in optoelectronic modules with respective focal lengths that are not focused on their respective sensors.
- the optical elements 111 can be mounted and/or integrated into an optical element housing 112 at a tilt with respect to a desired optical axis.
- the optical axis 114 can be tilted with respect to a desired optical axis.
- Both variations in focal length and/or optical-axis tilt i.e., cant
- these variations can give rise to reduced image quality and/or varying image quality from module to module. Examples of each variation are depicted in FIG. 2A and FIG. 2B , respectively.
- FIG. 2A and FIG. 2B depict the aforementioned described example variations that can occur in the example optoelectronic module depicted in FIG. 1 .
- FIG. 2A depicts an optoelectronic module 100 A.
- the optoelectronic module 100 A can include a sensor 102 A (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array).
- the sensor 102 A is electrically coupled to a substrate 105 A (e.g., a PCB) via electrical contacts 106 A (such as wires, vias, solder bumps/bump-bonding).
- a cover 107 A can be located adjacent to the sensor 102 A (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of the optoelectronic module 100 A).
- the cover 107 A has a cover thickness 120 A.
- the cover 107 A can be a thin layer of glass, for example, or other highly transmissive optical polymer.
- the transparent cover 107 A can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths).
- the transparent cover 107 A can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material).
- the coated transparent cover 107 A can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors).
- the transparent cover 107 A can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array).
- the optoelectronic module 100 A further includes an optical assembly 110 A.
- the optical assembly 110 A includes a plurality of optical elements 111 A mounted and/or integrated into an optical housing 112 A.
- the optical elements 111 A and their respective position can delineate a focal length 113 A of the optical assembly 110 A and an optical axis 114 A (depicted in FIG. 2A as substantially orthogonal to the sensor 102 A).
- the optoelectronic module 100 A can have a variation in the cover thickness 120 A of the transparent cover 107 A. Accordingly, the focal length 113 A is not focused on the sensor 102 A.
- FIG. 2B depicts an optoelectronic module 100 B.
- the optoelectronic module 100 B can include a sensor 102 B (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array).
- the sensor 102 B is electrically coupled to a substrate 105 B (e.g., a PCB) via electrical contacts 106 B (such as wires, vias, solder bumps/bump-bonding).
- a cover 107 B can be located adjacent to the sensor 102 B (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of the optoelectronic module 100 B).
- the cover 107 B has a cover thickness 120 B.
- the cover 107 B can be a thin layer of glass, for example, or other highly transmissive optical polymer.
- the transparent cover 107 B can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths).
- the transparent cover 107 B can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material).
- the coated transparent cover 107 B can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors).
- the transparent cover 107 B can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array).
- the optoelectronic module 100 B further includes an optical assembly 110 B.
- the optical assembly 110 B includes a plurality of optical elements 111 B mounted and/or integrated into an optical housing 112 B.
- the optical elements 111 B and their respective position can delineate a focal length 113 B of the optical assembly 110 B and an optical axis 114 B.
- the optical axis 114 B depicted in FIG. 2B is at a tilt t with respect to a desired optical axis 114 B′.
- FIG. 3A depicts an example customizable optoelectronic module 300 A.
- the customizable optoelectronic module 300 A includes a customizable spacer assembly 301 A configured to mitigate a thickness variation in a cover 307 A (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 301 A includes a sensor 302 A (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further the sensor 302 A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- electromagnetic radiation e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 302 A is electrically coupled to a substrate 305 A (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 306 A (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 301 A further includes a cover 307 A adjacent to the sensor 302 A, and a customizable spacer 308 A.
- the cover has a first thickness 320 A and a peripheral surface 319 A (e.g., the circumferential surface of the cover 307 A).
- the peripheral spacer surface 319 A of the cover 307 A can be laterally surrounded by the spacer 308 A.
- the spacer 308 A can be substantially non-transparent to wavelengths of light detectable by the sensor 302 A.
- the spacer 308 A can be configured to mitigate, insulate against electrostatic discharge (EDS).
- the spacer 308 A can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 308 A includes a spacer extension 321 A extending from the customizable spacer 308 A with a second thickness 322 A.
- the spacer extension 321 A terminates with a customizable spacer surface 309 A of a second thickness 322 A.
- the customizable spacer surface 309 A can be customizable or modifiable (e.g., machined) such that the first thickness 320 A and the second thickness 322 A sum to a first standard value 323 .
- the standard value 323 for example, should be the same for a plurality of customizable optoelectronic modules 300 A in order to avoid binning.
- FIG. 3B depicts another customizable optoelectronic module 300 B.
- the customizable optoelectronic module 300 B includes components as described above in FIG. 3A .
- the customizable optoelectronic module 300 B includes a first thickness 320 B and a second thickness 322 B (akin to the customizable optoelectronic module 300 A depicted in FIG. 3A ).
- the first thickness 320 A of the customizable optoelectronic module 300 A depicted in FIG. 3A and the first thickness 320 B of the customizable optoelectronic module 300 B depicted in FIG. 3B may not be equal.
- the second thickness 322 A of the customizable optoelectronic module 300 A depicted in FIG. 3A , and the second thickness 322 B of the customizable optoelectronic module 300 B depicted in FIG. 3B are also not equal.
- the first standard value 323 depicted in both FIG. 3A and FIG. 3B may be equal.
- An example optoelectronic module can also include an optical assembly as depicted in FIG. 3C .
- a customizable optoelectronic module 300 C includes components as described above in FIG. 3A and FIG. 3B .
- customizable optoelectronic module 300 C includes a customizable spacer assembly 301 C configured to mitigate a thickness variation in a cover 307 C (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 301 C includes a sensor 302 C (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned).
- the sensor 302 A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 302 C is electrically coupled to a substrate 305 C (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 306 C (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 301 C further includes a cover 307 C adjacent to the sensor 302 C, and a customizable spacer 308 C.
- the cover has a first thickness 320 C and a peripheral surface 319 C (e.g., the circumferential surface of the cover 307 C).
- the peripheral spacer surface 319 C of the cover 307 C can be laterally surrounded by the spacer 308 C.
- the spacer 308 C can be substantially non-transparent to wavelengths of light detectable by the sensor 302 C. Further the spacer 308 C can be configured to mitigate, insulate against electrostatic discharge (EDS).
- EDS electrostatic discharge
- the spacer 308 C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 308 C includes a spacer extension 321 C extending from the customizable spacer 308 C with a second thickness 322 C.
- the spacer extension 321 C terminates with a customizable spacer surface 309 C of a second thickness 322 C.
- the customizable spacer surface 309 C can be customizable or modifiable (e.g., machined) such that the first thickness 320 C and the second thickness 322 C sum to a first standard value 323 C.
- the standard value 323 C should be the same for a plurality of customizable optoelectronic modules 300 C in order to avoid binning.
- variations in the first standard value 323 C among a plurality of customizable optoelectronic module 300 C is possible to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below.
- the customizable optoelectronic module 300 C also includes an optical assembly 310 C.
- the optical assembly 310 C includes a plurality of optical elements 311 C mounted and/or integrated within an optical housing 312 C.
- the optical housing 312 C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the optical assembly 310 C can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances the optical assembly 310 C can be configured for optical autofocus. For example, the optical assembly 310 C can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of the optical elements 311 C.
- actuating components e.g., piezoelectric and/or voice-coil actuating elements
- any or all of the optical elements 311 C can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field).
- the optical elements 311 C can be manufactured from a glass or glass-like material via molding, grinding, or polishing.
- the optical elements 311 C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process.
- the optical elements 311 C can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations.
- the optical assembly 310 C can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions.
- the optical elements 311 C can delineate a focal length 313 C of the optical assembly 310 C, and an optical axis 314 C.
- the customizable spacer assembly 301 C depicted in FIG. 3C can be configured such that it can mitigate thickness variations in the cover 307 C (i.e., a first thickness 320 C) as described above, thereby ensuring that the focal length 313 C is focused on the sensor 302 C.
- the customizable spacer surface 309 C can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in transparent cover 307 C thickness, such that the optical assembly 310 C is focused on the sensor 302 C.
- FIG. 3D Another example of an optoelectronic module with an optical assembly is depicted in FIG. 3D .
- a customizable optoelectronic module 300 D includes components as described above in FIG. 3A - FIG. 3C .
- customizable optoelectronic module 300 D includes a customizable spacer assembly 301 D configured to mitigate a thickness variation in a cover 307 D (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 301 D includes a sensor 302 D (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned).
- the sensor 302 D can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 302 D is electrically coupled to a substrate 305 D (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 306 D (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 301 D further includes a cover 307 D adjacent to the sensor 302 D, and a customizable spacer 308 D.
- the cover has a first thickness 320 D and a peripheral surface 319 D (e.g., the circumferential surface of the cover 307 D).
- the peripheral spacer surface 319 D of the cover 307 C can be laterally surrounded by the spacer 308 D.
- the spacer 308 D can be substantially non-transparent to wavelengths of light detectable by the sensor 302 D. Further the spacer 308 D can be configured to mitigate, insulate against electrostatic discharge (EDS).
- the spacer 308 D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 308 D includes a spacer extension 321 D extending from the customizable spacer 308 D with a second thickness 322 D.
- the spacer extension 321 D terminates with a customizable spacer surface 309 D of a second thickness 322 D.
- the customizable spacer surface 309 C can be customizable or modifiable (e.g., machined) such that in some cases, the first thickness 320 D and the second thickness 322 D sum to a first standard value 323 D.
- the first standard value 323 D should be the same for a plurality of customizable optoelectronic modules 300 D in order to avoid binning. However, variations in the first standard value 323 D among a plurality of customizable optoelectronic module 300 D is possible to correct for other dimensional variations, such as tilted optical assemblies, as discussed below.
- the customizable optoelectronic module 300 D also includes such an optical assembly 310 D.
- the optical assembly 310 D includes a plurality of optical elements 311 D mounted and/or integrated within an optical housing 312 D.
- the optical housing 312 D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the optical assembly 310 D can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances the optical assembly 310 D can be configured for optical autofocus. For example, the optical assembly 310 D can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of the optical elements 311 D.
- actuating components e.g., piezoelectric and/or voice-coil actuating elements
- any or all of the optical elements 311 D can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field).
- the optical elements 311 D can be manufactured from a glass or glass-like material via molding, grinding, or polishing.
- the optical elements 311 D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process.
- the optical elements 311 D can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations.
- the optical assembly 310 D can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions.
- the optical elements 311 D can delineate a focal length 313 D of the optical assembly 310 D, and an optical axis 314 D.
- the optical axis can be canted with a tilt t.
- the customizable spacer assembly 301 D depicted in FIG. 3D can be configured such that it can mitigate thickness variations in the cover 307 D (i.e., a first thickness 320 D) as well as the tilt t, thereby ensuring that the focal length 313 D is focused on the sensor 302 D and that the optical axis 314 D is substantially orthogonal to the sensor 302 D.
- the customizable spacer surface 309 D can be customized or modified (e.g., machined) by a thickness, even by a varying thickness when correcting for tilt t.
- FIG. 3E Another example of an optoelectronic module with an optical assembly is depicted in FIG. 3E .
- a customizable optoelectronic module 300 E includes components as described above in FIG. 3A - FIG. 3D .
- customizable optoelectronic module 300 E includes a customizable spacer assembly 301 E configured to mitigate a thickness variation in a cover 307 E (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 301 E includes a sensor 302 E (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned).
- the sensor 302 E can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 302 E is electrically coupled to a substrate 305 E (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 306 E (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 301 E further includes a cover 307 E adjacent to the sensor 302 E, and a customizable spacer 308 E.
- the cover has a first thickness 320 E and a peripheral surface 319 E (e.g., the circumferential surface of the cover 307 E).
- the peripheral spacer surface 319 E of the cover 307 E can be laterally surrounded by the spacer 308 E.
- the spacer 308 E can be substantially non-transparent to wavelengths of light detectable by the sensor 302 E. Further the spacer 308 E can be configured to mitigate, insulate against electrostatic discharge (EDS).
- the spacer 308 E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 308 E includes a spacer extension 321 E extending from the customizable spacer 308 C with a second thickness 322 E.
- the spacer extension 321 E terminates with a customizable spacer surface 309 E of a second thickness 322 E.
- the customizable spacer surface 309 E can be customizable or modifiable (e.g., machined) such that the first thickness 320 E and the second thickness 322 E sum to a first standard value 323 E.
- the standard value 323 E should be the same for a plurality of customizable optoelectronic modules 300 E in order to avoid binning.
- variations in the first standard value 323 E among a plurality of customizable optoelectronic module 300 E is possible in order to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below.
- the customizable optoelectronic module 300 E also includes an optical assembly 310 E.
- the optical assembly 310 E includes a plurality of optical elements 311 E mounted and/or integrated within an optical housing 312 E.
- the optical housing 312 E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the optical assembly 310 E can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances the optical assembly 310 E can be configured for optical autofocus. For example, the optical assembly 310 E can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of the optical elements 311 E.
- actuating components e.g., piezoelectric and/or voice-coil actuating elements
- any or all of the optical elements 311 E can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field).
- the optical elements 311 E can be manufactured from a glass or glass-like material via molding, grinding, or polishing.
- the optical elements 311 E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process.
- the optical elements 311 E can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations.
- the optical assembly 310 E can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions.
- the optical elements 311 E can delineate a focal length 313 E of the optical assembly 310 E, and an optical axis 314 E.
- the customizable spacer assembly 301 E depicted in FIG. 3E can be configured such that it can mitigate thickness variations in the cover 307 E (i.e., a first thickness 320 E) as described above as well as variations in the optical housing 312 E (e.g., variations due to the positioning of the optical elements 311 E within the optical housing 312 E), thereby ensuring that the focal length 313 E is focused on the sensor 302 E.
- the customizable spacer surface 309 E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320 E) of the cover 307 E or a variation in the position of the optical elements 311 E within the optical housing 312 E, such that the optical assembly 310 E is focused on the sensor 302 E.
- the optical housing 312 E depicted in FIG. 3E further includes a customizable optical housing extension 315 E extending from the optical housing 312 E with a third thickness 317 E.
- the customizable optical housing extension 315 E terminates with a customizable optical housing extension surface 316 E.
- the customizable optical housing extension surface 316 E is customizable or modifiable akin to the spacer extension 321 E.
- the customizable optical housing extension surface 316 E can be configured such that it can mitigate thickness variations in the cover 307 E (i.e., a first thickness 320 E) as described above as well as variations in the optical housing 312 E (e.g., variations due to the positioning of the optical elements 311 E within the optical housing 312 E), thereby ensuring that the focal length 313 E is focused on the sensor 302 E.
- the customizable optical housing extension surface 316 E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320 E) of the cover 307 E or a variation in the position of the optical elements 311 E within the optical housing 312 E, such that the optical assembly 310 E is focused on the sensor 302 E.
- FIG. 3F Another example of an optoelectronic module with an optical assembly is depicted in FIG. 3F .
- a customizable optoelectronic module 300 F includes components as described above in FIG. 3A - FIG. 3E .
- customizable optoelectronic module 300 F includes a customizable spacer assembly 301 F configured to mitigate a thickness variation in a cover 307 F (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 301 F includes a sensor 302 F (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned).
- the sensor 302 F can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 302 F is electrically coupled to a substrate 305 F (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 306 F (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 301 F further includes a cover 307 F adjacent to the sensor 302 F, and a customizable spacer 308 F.
- the cover has a first thickness 320 F and a peripheral surface 319 F (e.g., the circumferential surface of the cover 307 F).
- the peripheral spacer surface 319 F of the cover 307 F can be laterally surrounded by the spacer 308 F.
- the spacer 308 F can be substantially non-transparent to wavelengths of light detectable by the sensor 302 F. Further the spacer 308 F can be configured to mitigate, insulate against electrostatic discharge (EDS).
- EDS electrostatic discharge
- the spacer 308 F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 308 F includes a spacer extension 321 F extending from the customizable spacer 308 F with a second thickness 322 F.
- the spacer extension 321 F terminates with a customizable spacer surface 309 F of a second thickness 322 F.
- the customizable spacer surface 309 F can be customizable or modifiable (e.g., machined) such that the first thickness 320 F and the second thickness 322 F sum to a first standard value 323 F.
- the standard value 323 F should be the same for a plurality of customizable optoelectronic modules 300 F in order to avoid binning.
- variations in the first standard value 323 F among a plurality of customizable optoelectronic module 300 F is possible in order to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below.
- the customizable optoelectronic module 300 F also includes an optical assembly 310 F.
- the optical assembly 310 F includes a plurality of optical elements 311 F mounted and/or integrated within an optical housing 312 F.
- the optical housing 312 F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the optical assembly 310 F can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances the optical assembly 310 F can be configured for optical autofocus. For example, the optical assembly 310 F can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of the optical elements 311 F.
- actuating components e.g., piezoelectric and/or voice-coil actuating elements
- any or all of the optical elements 311 F can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field).
- the optical elements 311 F can be manufactured from a glass or glass-like material via molding, grinding, or polishing.
- the optical elements 311 F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process.
- the optical elements 311 F can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations.
- the optical assembly 310 F can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions.
- the optical elements 311 F can delineate a focal length 313 F of the optical assembly 310 F, and an optical axis 314 F.
- the customizable spacer assembly 301 F depicted in FIG. 3F can be configured such that it can mitigate thickness variations in the cover 307 F (i.e., a first thickness 320 F) as described above as well as variations in the optical housing 312 F (e.g., variations due to the positioning of the optical elements 311 F within the optical housing 312 F), thereby ensuring that the focal length 313 E is focused on the sensor 302 F.
- the customizable spacer surface 309 E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320 F) of the cover 307 F or a variation in the position of the optical elements 311 F within the optical housing 312 F, such that the optical assembly 310 E is focused on the sensor 302 F.
- the optical housing 312 F depicted in FIG. 3F further includes a customizable optical housing extension 315 F extending from the optical housing 312 F with a third thickness 317 F.
- the customizable optical housing extension 315 F terminates with a customizable optical housing extension surface 316 F.
- the customizable optical housing extension surface 316 F is customizable or modifiable akin to the spacer extension 321 F. That is, the customizable optical housing extension surface 316 F can be configured such that it can mitigate thickness variations in the cover 307 F (i.e., a first thickness 320 F) as described above as well as variations in the optical housing 312 F (e.g., variations due to the positioning of the optical elements 311 F within the optical housing 312 F), and further can mitigate tilt (as depicted in FIG.
- the customizable optical housing extension surface 316 F can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320 F) of the cover 307 F, and/or a variation in the position of the optical elements 311 F within the optical housing 312 F, and/or a tilt, such that the optical assembly 310 F is focused on the sensor 302 F.
- FIG. 4A depicts an example customizable optoelectronic module 400 A.
- the customizable optoelectronic module 400 A includes a customizable spacer assembly 401 A configured to mitigate a thickness variation in a cover 407 A (e.g., the thickness variation depicted in the cover 107 A in FIG. 2A ).
- the customizable spacer assembly 401 A includes a sensor 402 A (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned).
- the sensor 402 A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation.
- the sensor 402 A is electrically coupled to a substrate 405 A (such as PCB glass-fiber laminate, and/or silicon) via electrical contacts 406 A (such as wires, vias, solder bumps/bump-bonding).
- the customizable spacer assembly 401 A further includes a cover 407 A adjacent to the sensor 402 A, and a customizable spacer 408 A.
- the cover 407 A includes a first optical filter 403 A.
- the cover 407 A and the first optical filter 403 A together have a first thickness 420 A and a peripheral surface 419 A (e.g., the circumferential surface of the cover 407 A and the first optical filter 403 A).
- the peripheral spacer surface 419 A of the cover 407 A and the first optical filter 403 A can be laterally surrounded by the spacer 408 A.
- the spacer 408 A can be substantially non-transparent to wavelengths of light detectable by the sensor 402 A. Further the spacer 408 A can be configured to mitigate, insulate against electrostatic discharge (EDS).
- EDS electrostatic discharge
- the spacer 408 A can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler).
- the customizable spacer 408 A includes a spacer extension 421 A extending from the customizable spacer 408 A with a second thickness 422 A.
- the spacer extension 421 A terminates with a customizable spacer surface 409 A of a second thickness 422 A.
- the customizable spacer surface 409 A can be customizable or modifiable (e.g., machined) such that the first thickness 420 A and the second thickness 422 A sum to a first standard value 423 (as described above).
- the standard value 423 for example, should be the same for a plurality of customizable optoelectronic modules 400 A in order to avoid binning.
- FIG. 4B depicts another customizable optoelectronic module 400 B with an additional optical filter.
- the customizable optoelectronic module 400 B includes components as described above in FIG. 4A .
- the customizable optical assembly 400 B includes a second optical filter 404 B. Together the cover 407 B, the first optical filter 403 B, and the second optical filter 404 B have a first thickness 420 B and a peripheral surface 419 B (e.g., the circumferential surface of the cover 407 B, the first optical filter 403 B, and the second optical filter 404 B).
- the customizable optoelectronic module 400 B includes a first thickness 420 B and a second thickness 422 B (akin to the customizable optoelectronic module 400 A depicted in FIG. 4A ).
- first thickness 420 B of the customizable optoelectronic module 400 B depicted in FIG. 4B and the first thickness 420 B of the customizable optoelectronic module 400 B depicted in FIG. 4B may not be equal.
- second thickness 422 B of the customizable optoelectronic module 400 B depicted in FIG. 4B , and the second thickness 422 B of the customizable optoelectronic module 400 B depicted in FIG. 4B are also not equal.
- FIG. 5 depicts an example method 500 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 A, 300 B as depicted above in FIG. 3A and FIG. 3B , respectively.
- the method of standardizing a plurality of customizable optoelectronic modules 500 includes a providing step 502 , a determining step 504 , a compiling step 506 , and a modifying step 508 .
- the providing step 502 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface.
- the determining step 504 includes determining a value of each first thickness of each customizable optoelectronic module within the plurality of optoelectronic modules.
- the first thickness can be determined optically, for example.
- the compiling step 506 includes compiling a data set of values, wherein the data set associates each first thickness with each respective customizable optoelectronic module.
- the modifying step 508 includes modifying the customizable spacer surface of each respective customizable optoelectronic module according to the data set such that the sum of each second thickness and each respective first thickness is substantially equal to a first standard value, the first standard value being substantially the same for each customizable optoelectronic module within the plurality of optoelectronic modules.
- the customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases.
- FIG. 6 depicts an example method 600 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 C as depicted above in FIG. 3C .
- the method of standardizing a plurality of customizable optoelectronic modules 600 includes a providing step 602 , a determining step 604 , a compiling step 606 , and a modifying step 608 .
- the providing step 602 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis.
- the determining step 604 includes determining a value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the compiling step 606 includes compiling a data set of values, wherein the data set associates each focal length with each respective optoelectronic module.
- the modifying step 608 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases.
- FIG. 7 depicts an example method 700 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 D as depicted above in FIG. 3D .
- the method of standardizing a plurality of customizable optoelectronic modules 700 includes a providing step 702 , a first determining step 704 , a second determining step 706 , a first compiling step 708 , a second compiling step 710 , and a modifying step 712 .
- the providing step 702 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis.
- the first determining step 704 includes determining a value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the second determining step 706 includes determining a cant value for each optical axis of each respective optical assembly.
- the cant of each optical axis can be determined optically (e.g., via optical inspection methods).
- the first compiling step 708 includes compiling a data set of values, wherein the data set associates each focal length with each respective optoelectronic module.
- the second compiling step 710 includes compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module.
- the modifying step 712 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases.
- FIG. 8 depicts another example method 800 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 C as depicted in FIG. 3C .
- the method of standardizing a plurality of customizable optoelectronic modules 800 includes a providing step 802 , a first determining step 804 , a second determining step 806 , a compiling step 808 , and a modifying step 810 .
- the providing step 802 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis.
- the first determining step 804 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules.
- the first thickness can be determined optically, for example.
- the second determining step 806 includes determining a second value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the compiling step 808 includes compiling a data set of first and second values, wherein the data set associates each first and second value with each respective customizable optoelectronic module.
- the modifying step 810 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases.
- FIG. 9 depicts another example method 900 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 D as depicted in FIG. 3D .
- the method of standardizing a plurality of customizable optoelectronic modules 900 includes a providing step 902 , a first determining step 904 , a second determining step 906 , a third determining step 908 , a first compiling step 910 , a second compiling step 912 , and modifying step 914 .
- the providing step 902 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis.
- the first determining step 904 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules.
- the first thickness can be determined optically, for example.
- the second determining step 906 includes determining a second value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the third determining step 908 includes determining a cant value for each optical axis of each respective optical assembly.
- the cant of each optical axis can be determined optically (e.g., via optical inspection methods).
- the first compiling step 910 includes compiling a data set of first and second values, wherein the data set associates each first and second value with each respective customizable optoelectronic module.
- the second compiling step 912 includes compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module.
- the modifying step 914 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases.
- FIG. 10 depicts another example method 1000 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 E as depicted in FIG. 3E .
- the method of standardizing a plurality of customizable optoelectronic modules 1000 includes a providing step 1002 , a first determining step 1004 , a second determining step 1006 , a compiling step 1008 , and a modifying step 1010 .
- the providing step 1002 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis and the optical housing includes a customizable optical housing extension extending from the optical housing with a third thickness having a terminal end defining a customizable optical housing extension surface.
- the first determining step 1004 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules.
- the first thickness can be determined optically, for example.
- the second determining step 1006 includes determining a second value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the compiling step 1008 includes compiling a data set of first and second values that associates each first and second values with each respective customizable optoelectronic module.
- the modifying step 1010 includes modifying the customizable spacer surface and/or modifying the customizable optical housing extension surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface and/or the customizable optical housing extension surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by an automated machine in some cases.
- FIG. 11 depicts another example method 1100 of standardizing a plurality of customizable optoelectronic modules such as the customizable optoelectronic modules 300 F as depicted in FIG. 3F .
- the method of standardizing a plurality of customizable optoelectronic modules 1100 includes a providing step 1102 , a first determining step 1104 , a second determining step 1106 , a third determining step 1108 , a first compiling step 1110 , a second compiling step 1112 , and a modifying step 1114 .
- the providing step 1102 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above.
- Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis and the optical housing includes a customizable optical housing extension extending from the optical housing with a third thickness having a terminal end defining a customizable optical housing extension surface.
- the first determining step 1104 includes determining a first value of each first thickness of each customizable optoelectronic module within the plurality of optoelectronic modules.
- the first thickness can be determined optically, for example.
- the second determining step 1106 includes determining a second value of each focal length of each respective optical assembly.
- the focal length can be determined optically (e.g., via optical inspection methods).
- the third determining step 1108 includes determining a cant value for each optical axis of each respective optical assembly.
- the cant of each optical axis can be determined optically (e.g., via optical inspection methods).
- the first compiling step 1110 includes compiling a data set of first and second values that associates each first and second values with each respective customizable optoelectronic module.
- the second compiling step 1112 include compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module.
- the modifying step 1114 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module.
- the customizable spacer surface and/or the customizable optical housing extension surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by an automated machine in some cases.
Abstract
The disclosure describes customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules. The customizable optoelectronic modules can be configured to mitigate dimensional variations and misalignments in a number of their respective constituent components such as optical assemblies and sensor covers. The customizable optoelectronic modules and methods for standardizing a plurality of the customizable optoelectronic modules can obviate the need for binning during manufacturing thereby saving considerable resources such as time and expense.
Description
- This disclosure relates to optoelectronic modules with customizable features.
- Optoelectronic modules include multiple components (such as transparent covers, optical filters, and lens or optical assemblies). Optoelectronic modules are often manufactured from mass-produced components. Due to manufacturing tolerances, or other fabrication variations, these mass-produced components can have variable dimensions, while in other cases ostensibly identical lens or optical assemblies can in fact possess variable focal lengths or tilted optical axes. Components with variable dimensions can cause significant problems in optoelectronic modules whose optimal optical performance requires tight tolerances (e.g., optoelectronic modules with high-resolution sensors).
- In some cases components that exhibit dimensional variation may be matched (i.e., binned) to other components with complementing dimensional variations. However, this binning process is accomplished only with considerable time and expense.
- The present disclosure describes customizable optoelectronic modules and methods of fabricating the customizable optoelectronic modules. Various approaches are described to provide adjustments to reduce dimensional variations of various components (such as transparent covers, optical filters, and optical assemblies) from component to component, and in some cases within components. For example, approaches are described to reduce the occurrence of tilt of the optical assemblies and/or optical elements. The described implementations obviate the need for binning of components when manufacturing optoelectronic modules.
- For example, in a first implementation a customizable optoelectronic module includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly include a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal defining a customizable spacer surface disposed.
- In some cases, other implementations can include an optical filter of a thickness, the first thickness including the thickness of the optical filter and the thickness of the cover. While other implementations can include an optical assembly, the optical assembly including a plurality of optical elements mounted within an optical housing. In this implementation the optical assembly has a focal length and an optical axis where the customizable spacer surface is modifiable such that the focal length is incident on the sensor.
- Further, in other implementations, methods are described for standardizing a plurality of customizable optoelectronic modules. In an example implementation, a plurality of customizable optoelectronic modules, wherein each customizable optoelectronic module comprising the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface is provided. Further, a value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules is determined. Further, a data set of values, wherein the data set associates each first thickness with each respective customizable optoelectronic module is compiled. Finally, the customizable spacer surface of each respective customizable optoelectronic module according to the data set such that the sum of each second thickness and each respective first thickness is substantially equal to a first standard value, the first standard value being substantially the same for each customizable optoelectronic module is modified.
- In the following description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments which may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, and it is to be understood that other embodiments may be utilized and that structural changes may be made without departing from the scope of the present invention. The following description of example embodiments is, therefore, not to be taken in a limited sense, and the scope of the present invention is defined by the appended claims.
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FIG. 1 depicts an example of an optoelectronic module with an optical assembly that is focused on a sensitive area of a sensor. -
FIG. 2A andFIG. 2B depict example optoelectronic modules with optical assemblies that are not focused on their respective sensors. -
FIG. 3A -FIG. 3F depict example optoelectronic modules with customizable spacers configured to focus optical assemblies on their respective sensors. -
FIG. 4A andFIG. 4B depict example optoelectronic modules with customizable spacers and optical filters. -
FIGS. 5-11 depict example methods for standardizing the customizable optoelectronic modules depicted inFIGS. 3-4 . -
FIG. 1 depicts an example of an optoelectronic module 100 (e.g., an imaging module such as a camera) as discussed above. Theoptoelectronic module 100 can include a sensor 102 (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array). Thesensor 102 is electrically coupled to a substrate 105 (e.g., a PCB) via electrical contacts 106 (such as wires, vias, solder bumps/bump-bonding). In some instances, e.g., when thesensor 102 is thin, acover 107 can be located adjacent to the sensor 102 (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of the optoelectronic module 100). Thecover 107 can be a thin layer of glass, for example, or other highly transmissive optical polymer. In other instances, thetransparent cover 107 can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths). Still in other instances thetransparent cover 107 can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material). In such instances, the coatedtransparent cover 107 can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors). Still further, in such instances thetransparent cover 107 can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array). Theoptoelectronic module 100 further includes anoptical assembly 110. Theoptical assembly 110 includes a plurality ofoptical elements 111 mounted and/or integrated into anoptical housing 112. Theoptical elements 111 and their respective position can delineate afocal length 113 of theoptical assembly 110 and an optical axis 114 (depicted inFIG. 1 as substantially orthogonal to the sensor 102). In some instances, for example, when manufacturing optoelectronic modules on the wafer level or a large scale, the thickness of thetransparent cover 107 and/or variations infocal length 113 can vary from module to module (e.g., due to manufacturing tolerances). Such variations can result in optoelectronic modules with respective focal lengths that are not focused on their respective sensors. Further, theoptical elements 111 can be mounted and/or integrated into anoptical element housing 112 at a tilt with respect to a desired optical axis. Accordingly, theoptical axis 114 can be tilted with respect to a desired optical axis. Both variations in focal length and/or optical-axis tilt (i.e., cant) give rise to an optical assembly that is not focused on itsrespective sensor 102; accordingly, these variations can give rise to reduced image quality and/or varying image quality from module to module. Examples of each variation are depicted inFIG. 2A andFIG. 2B , respectively. -
FIG. 2A andFIG. 2B depict the aforementioned described example variations that can occur in the example optoelectronic module depicted inFIG. 1 .FIG. 2A depicts anoptoelectronic module 100A. Theoptoelectronic module 100A can include asensor 102A (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array). Thesensor 102A is electrically coupled to asubstrate 105A (e.g., a PCB) viaelectrical contacts 106A (such as wires, vias, solder bumps/bump-bonding). In some instances, e.g., when thesensor 102A is thin, acover 107A can be located adjacent to thesensor 102A (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of theoptoelectronic module 100A). Thecover 107A has acover thickness 120A. Further, thecover 107A can be a thin layer of glass, for example, or other highly transmissive optical polymer. In other instances, thetransparent cover 107A can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths). Still in other instances thetransparent cover 107A can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material). In such instances, the coatedtransparent cover 107A can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors). Still further, in such instances thetransparent cover 107A can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array). Theoptoelectronic module 100A further includes anoptical assembly 110A. Theoptical assembly 110A includes a plurality ofoptical elements 111A mounted and/or integrated into anoptical housing 112A. Theoptical elements 111A and their respective position can delineate afocal length 113A of theoptical assembly 110A and anoptical axis 114A (depicted inFIG. 2A as substantially orthogonal to thesensor 102A). However, theoptoelectronic module 100A can have a variation in thecover thickness 120A of thetransparent cover 107A. Accordingly, thefocal length 113A is not focused on thesensor 102A. -
FIG. 2B depicts anoptoelectronic module 100B. Theoptoelectronic module 100B can include asensor 102B (e.g., a complementary metal-oxide semiconductor, charge-couple device or other pixel, e.g., modulation pixel, array). Thesensor 102B is electrically coupled to asubstrate 105B (e.g., a PCB) viaelectrical contacts 106B (such as wires, vias, solder bumps/bump-bonding). In some instances, e.g., when thesensor 102B is thin, acover 107B can be located adjacent to thesensor 102B (i.e., for structural support and/or protection from dust and/or other particles that can arise, for example, during the manufacture and assembly of theoptoelectronic module 100B). Thecover 107B has acover thickness 120B. Further, thecover 107B can be a thin layer of glass, for example, or other highly transmissive optical polymer. In other instances, thetransparent cover 107B can be implemented as a filter (e.g., an infrared pass filter, IR cut filter, or a filter that can be configured to pass or block any other wavelength or range of wavelengths). Still in other instances thetransparent cover 107B can also be coated or partly coated (e.g., with a filter material such as a polymer and/or dielectric material). In such instances, the coatedtransparent cover 107B can pass and/or block any wavelength or range of wavelengths (such as infrared, ultraviolet, or wavelengths corresponding to red, green, blue or other visible colors). Still further, in such instances thetransparent cover 107B can be partly coated with a plurality and/or array of coatings and/or a filter array (such as a color filter array). Theoptoelectronic module 100B further includes anoptical assembly 110B. Theoptical assembly 110B includes a plurality ofoptical elements 111B mounted and/or integrated into anoptical housing 112B. Theoptical elements 111B and their respective position can delineate afocal length 113B of theoptical assembly 110B and anoptical axis 114B. However, theoptical axis 114B depicted inFIG. 2B is at a tilt t with respect to a desiredoptical axis 114B′. -
FIG. 3A depicts an example customizableoptoelectronic module 300A. The customizableoptoelectronic module 300A includes acustomizable spacer assembly 301A configured to mitigate a thickness variation in acover 307A (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). Thecustomizable spacer assembly 301A includes asensor 302A (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 302A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 302A is electrically coupled to asubstrate 305A (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 306A (such as wires, vias, solder bumps/bump-bonding). Thecustomizable spacer assembly 301A further includes acover 307A adjacent to thesensor 302A, and acustomizable spacer 308A. The cover has afirst thickness 320A and aperipheral surface 319A (e.g., the circumferential surface of thecover 307A). Theperipheral spacer surface 319A of thecover 307A can be laterally surrounded by thespacer 308A. Thespacer 308A can be substantially non-transparent to wavelengths of light detectable by thesensor 302A. Further thespacer 308A can be configured to mitigate, insulate against electrostatic discharge (EDS). Thespacer 308A can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Thecustomizable spacer 308A includes aspacer extension 321A extending from thecustomizable spacer 308A with asecond thickness 322A. Thespacer extension 321A terminates with acustomizable spacer surface 309A of asecond thickness 322A. Thecustomizable spacer surface 309A can be customizable or modifiable (e.g., machined) such that thefirst thickness 320A and thesecond thickness 322A sum to a firststandard value 323. Thestandard value 323, for example, should be the same for a plurality of customizableoptoelectronic modules 300A in order to avoid binning. - For example,
FIG. 3B depicts another customizableoptoelectronic module 300B. The customizableoptoelectronic module 300B includes components as described above inFIG. 3A . The customizableoptoelectronic module 300B includes afirst thickness 320B and asecond thickness 322B (akin to the customizableoptoelectronic module 300A depicted inFIG. 3A ). However, thefirst thickness 320A of the customizableoptoelectronic module 300A depicted inFIG. 3A and thefirst thickness 320B of the customizableoptoelectronic module 300B depicted inFIG. 3B may not be equal. Further, thesecond thickness 322A of the customizableoptoelectronic module 300A depicted inFIG. 3A , and thesecond thickness 322B of the customizableoptoelectronic module 300B depicted inFIG. 3B are also not equal. However, the firststandard value 323 depicted in bothFIG. 3A andFIG. 3B may be equal. - An example optoelectronic module can also include an optical assembly as depicted in
FIG. 3C . A customizableoptoelectronic module 300C includes components as described above inFIG. 3A andFIG. 3B . For example, customizableoptoelectronic module 300C includes acustomizable spacer assembly 301C configured to mitigate a thickness variation in acover 307C (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). Thecustomizable spacer assembly 301C includes asensor 302C (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 302A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 302C is electrically coupled to asubstrate 305C (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 306C (such as wires, vias, solder bumps/bump-bonding). Thecustomizable spacer assembly 301C further includes acover 307C adjacent to thesensor 302C, and acustomizable spacer 308C. The cover has afirst thickness 320C and a peripheral surface 319C (e.g., the circumferential surface of thecover 307C). The peripheral spacer surface 319C of thecover 307C can be laterally surrounded by thespacer 308C. Thespacer 308C can be substantially non-transparent to wavelengths of light detectable by thesensor 302C. Further thespacer 308C can be configured to mitigate, insulate against electrostatic discharge (EDS). Thespacer 308C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Thecustomizable spacer 308C includes aspacer extension 321C extending from thecustomizable spacer 308C with asecond thickness 322C. Thespacer extension 321C terminates with a customizable spacer surface 309C of asecond thickness 322C. The customizable spacer surface 309C can be customizable or modifiable (e.g., machined) such that thefirst thickness 320C and thesecond thickness 322C sum to a firststandard value 323C. Thestandard value 323C, for example, should be the same for a plurality of customizableoptoelectronic modules 300C in order to avoid binning. However, variations in the firststandard value 323C among a plurality of customizableoptoelectronic module 300C is possible to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below. - The customizable
optoelectronic module 300C also includes anoptical assembly 310C. Theoptical assembly 310C includes a plurality ofoptical elements 311C mounted and/or integrated within anoptical housing 312C. Theoptical housing 312C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Theoptical assembly 310C can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances theoptical assembly 310C can be configured for optical autofocus. For example, theoptical assembly 310C can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of theoptical elements 311C. Further any or all of theoptical elements 311C can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field). Theoptical elements 311C can be manufactured from a glass or glass-like material via molding, grinding, or polishing. In other implementations theoptical elements 311C can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process. Still in other implementations theoptical elements 311C can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations. Theoptical assembly 310C can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions. Theoptical elements 311C can delineate afocal length 313C of theoptical assembly 310C, and anoptical axis 314C. Thecustomizable spacer assembly 301C depicted inFIG. 3C can be configured such that it can mitigate thickness variations in thecover 307C (i.e., afirst thickness 320C) as described above, thereby ensuring that thefocal length 313C is focused on thesensor 302C. For example, the customizable spacer surface 309C can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation intransparent cover 307C thickness, such that theoptical assembly 310C is focused on thesensor 302C. - Another example of an optoelectronic module with an optical assembly is depicted in
FIG. 3D . Acustomizable optoelectronic module 300D includes components as described above inFIG. 3A -FIG. 3C . For example, customizableoptoelectronic module 300D includes acustomizable spacer assembly 301D configured to mitigate a thickness variation in acover 307D (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). Thecustomizable spacer assembly 301D includes asensor 302D (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 302D can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 302D is electrically coupled to asubstrate 305D (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 306D (such as wires, vias, solder bumps/bump-bonding). Thecustomizable spacer assembly 301D further includes acover 307D adjacent to thesensor 302D, and acustomizable spacer 308D. The cover has afirst thickness 320D and a peripheral surface 319D (e.g., the circumferential surface of thecover 307D). The peripheral spacer surface 319D of thecover 307C can be laterally surrounded by thespacer 308D. Thespacer 308D can be substantially non-transparent to wavelengths of light detectable by thesensor 302D. Further thespacer 308D can be configured to mitigate, insulate against electrostatic discharge (EDS). Thespacer 308D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Thecustomizable spacer 308D includes aspacer extension 321D extending from thecustomizable spacer 308D with asecond thickness 322D. Thespacer extension 321D terminates with acustomizable spacer surface 309D of asecond thickness 322D. The customizable spacer surface 309C can be customizable or modifiable (e.g., machined) such that in some cases, thefirst thickness 320D and thesecond thickness 322D sum to a firststandard value 323D. The firststandard value 323D, for example, should be the same for a plurality of customizableoptoelectronic modules 300D in order to avoid binning. However, variations in the firststandard value 323D among a plurality of customizableoptoelectronic module 300D is possible to correct for other dimensional variations, such as tilted optical assemblies, as discussed below. - The customizable
optoelectronic module 300D also includes such anoptical assembly 310D. Theoptical assembly 310D includes a plurality ofoptical elements 311D mounted and/or integrated within anoptical housing 312D. Theoptical housing 312D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Theoptical assembly 310D can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances theoptical assembly 310D can be configured for optical autofocus. For example, theoptical assembly 310D can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of theoptical elements 311D. Further any or all of theoptical elements 311D can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field). Theoptical elements 311D can be manufactured from a glass or glass-like material via molding, grinding, or polishing. In other implementations theoptical elements 311D can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process. Still in other implementations theoptical elements 311D can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations. Theoptical assembly 310D can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions. Theoptical elements 311D can delineate afocal length 313D of theoptical assembly 310D, and anoptical axis 314D. However in some cases, as depicted inFIG. 3D , the optical axis can be canted with a tilt t. Thecustomizable spacer assembly 301D depicted inFIG. 3D can be configured such that it can mitigate thickness variations in thecover 307D (i.e., afirst thickness 320D) as well as the tilt t, thereby ensuring that thefocal length 313D is focused on thesensor 302D and that theoptical axis 314D is substantially orthogonal to thesensor 302D. For example, thecustomizable spacer surface 309D can be customized or modified (e.g., machined) by a thickness, even by a varying thickness when correcting for tilt t. - Another example of an optoelectronic module with an optical assembly is depicted in
FIG. 3E . Acustomizable optoelectronic module 300E includes components as described above inFIG. 3A -FIG. 3D . For example, customizableoptoelectronic module 300E includes acustomizable spacer assembly 301E configured to mitigate a thickness variation in acover 307E (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). Thecustomizable spacer assembly 301E includes asensor 302E (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 302E can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 302E is electrically coupled to asubstrate 305E (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 306E (such as wires, vias, solder bumps/bump-bonding). Thecustomizable spacer assembly 301E further includes acover 307E adjacent to thesensor 302E, and acustomizable spacer 308E. The cover has a first thickness 320E and a peripheral surface 319E (e.g., the circumferential surface of thecover 307E). The peripheral spacer surface 319E of thecover 307E can be laterally surrounded by thespacer 308E. Thespacer 308E can be substantially non-transparent to wavelengths of light detectable by thesensor 302E. Further thespacer 308E can be configured to mitigate, insulate against electrostatic discharge (EDS). Thespacer 308E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Thecustomizable spacer 308E includes aspacer extension 321E extending from thecustomizable spacer 308C with a second thickness 322E. Thespacer extension 321E terminates with acustomizable spacer surface 309E of a second thickness 322E. Thecustomizable spacer surface 309E can be customizable or modifiable (e.g., machined) such that the first thickness 320E and the second thickness 322E sum to a first standard value 323E. The standard value 323E, for example, should be the same for a plurality of customizableoptoelectronic modules 300E in order to avoid binning. However, variations in the first standard value 323E among a plurality of customizableoptoelectronic module 300E is possible in order to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below. - The customizable
optoelectronic module 300E also includes anoptical assembly 310E. Theoptical assembly 310E includes a plurality ofoptical elements 311E mounted and/or integrated within anoptical housing 312E. Theoptical housing 312E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Theoptical assembly 310E can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances theoptical assembly 310E can be configured for optical autofocus. For example, theoptical assembly 310E can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of theoptical elements 311E. Further any or all of theoptical elements 311E can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field). Theoptical elements 311E can be manufactured from a glass or glass-like material via molding, grinding, or polishing. In other implementations theoptical elements 311E can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process. Still in other implementations theoptical elements 311E can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations. Theoptical assembly 310E can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions. Theoptical elements 311E can delineate afocal length 313E of theoptical assembly 310E, and anoptical axis 314E. Thecustomizable spacer assembly 301E depicted inFIG. 3E can be configured such that it can mitigate thickness variations in thecover 307E (i.e., a first thickness 320E) as described above as well as variations in theoptical housing 312E (e.g., variations due to the positioning of theoptical elements 311E within theoptical housing 312E), thereby ensuring that thefocal length 313E is focused on thesensor 302E. For example, thecustomizable spacer surface 309E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320E) of thecover 307E or a variation in the position of theoptical elements 311E within theoptical housing 312E, such that theoptical assembly 310E is focused on thesensor 302E. - The
optical housing 312E depicted inFIG. 3E further includes a customizableoptical housing extension 315E extending from theoptical housing 312E with athird thickness 317E. The customizableoptical housing extension 315E terminates with a customizable opticalhousing extension surface 316E. The customizable opticalhousing extension surface 316E is customizable or modifiable akin to thespacer extension 321E. That is, the customizable opticalhousing extension surface 316E can be configured such that it can mitigate thickness variations in thecover 307E (i.e., a first thickness 320E) as described above as well as variations in theoptical housing 312E (e.g., variations due to the positioning of theoptical elements 311E within theoptical housing 312E), thereby ensuring that thefocal length 313E is focused on thesensor 302E. For example, the customizable opticalhousing extension surface 316E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320E) of thecover 307E or a variation in the position of theoptical elements 311E within theoptical housing 312E, such that theoptical assembly 310E is focused on thesensor 302E. - Another example of an optoelectronic module with an optical assembly is depicted in
FIG. 3F . A customizableoptoelectronic module 300F includes components as described above inFIG. 3A -FIG. 3E . For example, customizableoptoelectronic module 300F includes a customizable spacer assembly 301F configured to mitigate a thickness variation in acover 307F (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). The customizable spacer assembly 301F includes asensor 302F (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 302F can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 302F is electrically coupled to asubstrate 305F (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 306F (such as wires, vias, solder bumps/bump-bonding). The customizable spacer assembly 301F further includes acover 307F adjacent to thesensor 302F, and a customizable spacer 308F. The cover has a first thickness 320F and a peripheral surface 319F (e.g., the circumferential surface of thecover 307F). The peripheral spacer surface 319F of thecover 307F can be laterally surrounded by the spacer 308F. The spacer 308F can be substantially non-transparent to wavelengths of light detectable by thesensor 302F. Further the spacer 308F can be configured to mitigate, insulate against electrostatic discharge (EDS). The spacer 308F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). The customizable spacer 308F includes aspacer extension 321F extending from the customizable spacer 308F with a second thickness 322F. Thespacer extension 321F terminates with acustomizable spacer surface 309F of a second thickness 322F. Thecustomizable spacer surface 309F can be customizable or modifiable (e.g., machined) such that the first thickness 320F and the second thickness 322F sum to a first standard value 323F. The standard value 323F, for example, should be the same for a plurality of customizableoptoelectronic modules 300F in order to avoid binning. However, variations in the first standard value 323F among a plurality of customizableoptoelectronic module 300F is possible in order to correct for other dimensional variations, such as a plurality of respective optical assemblies with variable focal lengths, as discussed below. - The customizable
optoelectronic module 300F also includes anoptical assembly 310F. Theoptical assembly 310F includes a plurality ofoptical elements 311F mounted and/or integrated within anoptical housing 312F. Theoptical housing 312F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). Theoptical assembly 310F can include any one of, or combinations of, the following optical elements: a diffraction grating, a microlens array, a lens, an anamorphic lens, a prism, a micro-prism array, a diffractive optical element, or a plurality of any one of the aforementioned or their respective combinations. Further, in other instances theoptical assembly 310F can be configured for optical autofocus. For example, theoptical assembly 310F can include actuating components (e.g., piezoelectric and/or voice-coil actuating elements) to actuate any or all of theoptical elements 311F. Further any or all of theoptical elements 311F can be implemented as tunable lenses (i.e., tunable via an external stimulus such as an electric field). Theoptical elements 311F can be manufactured from a glass or glass-like material via molding, grinding, or polishing. In other implementations theoptical elements 311F can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding, or other replication process. Still in other implementations theoptical elements 311F can each be manufactured from a glass or glass-like material, or from a curable polymeric material, or their respective combinations. Theoptical assembly 310F can further include apertures, filters, spacers, alignment features, and other components pertinent to their respective functions. Theoptical elements 311F can delineate afocal length 313F of theoptical assembly 310F, and anoptical axis 314F. The customizable spacer assembly 301F depicted inFIG. 3F can be configured such that it can mitigate thickness variations in thecover 307F (i.e., a first thickness 320F) as described above as well as variations in theoptical housing 312F (e.g., variations due to the positioning of theoptical elements 311F within theoptical housing 312F), thereby ensuring that thefocal length 313E is focused on thesensor 302F. For example, thecustomizable spacer surface 309E can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320F) of thecover 307F or a variation in the position of theoptical elements 311F within theoptical housing 312F, such that theoptical assembly 310E is focused on thesensor 302F. - The
optical housing 312F depicted inFIG. 3F further includes a customizableoptical housing extension 315F extending from theoptical housing 312F with athird thickness 317F. The customizableoptical housing extension 315F terminates with a customizable optical housing extension surface 316F. The customizable optical housing extension surface 316F is customizable or modifiable akin to thespacer extension 321F. That is, the customizable optical housing extension surface 316F can be configured such that it can mitigate thickness variations in thecover 307F (i.e., a first thickness 320F) as described above as well as variations in theoptical housing 312F (e.g., variations due to the positioning of theoptical elements 311F within theoptical housing 312F), and further can mitigate tilt (as depicted inFIG. 3F ), thereby ensuring that thefocal length 313F is focused on thesensor 302F. For example, the customizable optical housing extension surface 316F can be customized or modified (e.g., machined) by a thickness substantially equivalent to a variation in the thickness (first thickness 320F) of thecover 307F, and/or a variation in the position of theoptical elements 311F within theoptical housing 312F, and/or a tilt, such that theoptical assembly 310F is focused on thesensor 302F. - In some implementations, the covers as described above can include an optical filter as depicted in FIG: 4A.
FIG. 4A depicts an example customizable optoelectronic module 400A. The customizable optoelectronic module 400A includes acustomizable spacer assembly 401A configured to mitigate a thickness variation in acover 407A (e.g., the thickness variation depicted in thecover 107A inFIG. 2A ). Thecustomizable spacer assembly 401A includes asensor 402A (such as an array of photodiodes, intensity pixels, demodulation pixels, or a combination of any of the aforementioned). Further thesensor 402A can be configured to detect any wavelength or range of wavelengths of electromagnetic radiation (e.g., visible or non-visible radiation such as near-, mid-, or far-infrared radiation. Thesensor 402A is electrically coupled to asubstrate 405A (such as PCB glass-fiber laminate, and/or silicon) viaelectrical contacts 406A (such as wires, vias, solder bumps/bump-bonding). Thecustomizable spacer assembly 401A further includes acover 407A adjacent to thesensor 402A, and a customizable spacer 408A. Thecover 407A includes a firstoptical filter 403A. Thecover 407A and the firstoptical filter 403A together have afirst thickness 420A and a peripheral surface 419A (e.g., the circumferential surface of thecover 407A and the firstoptical filter 403A). The peripheral spacer surface 419A of thecover 407A and the firstoptical filter 403A can be laterally surrounded by the spacer 408A. The spacer 408A can be substantially non-transparent to wavelengths of light detectable by thesensor 402A. Further the spacer 408A can be configured to mitigate, insulate against electrostatic discharge (EDS). The spacer 408A can be manufactured from a curable polymeric material (such as epoxy) via injection molding, vacuum injection molding or other replication process, and can further contain substantially non-transparent filler and/or low-thermal-expansion filler (such as carbon black and/or inorganic filler). The customizable spacer 408A includes aspacer extension 421A extending from the customizable spacer 408A with asecond thickness 422A. Thespacer extension 421A terminates with acustomizable spacer surface 409A of asecond thickness 422A. Thecustomizable spacer surface 409A can be customizable or modifiable (e.g., machined) such that thefirst thickness 420A and thesecond thickness 422A sum to a first standard value 423 (as described above). Thestandard value 423, for example, should be the same for a plurality of customizable optoelectronic modules 400A in order to avoid binning. - For example,
FIG. 4B depicts another customizable optoelectronic module 400B with an additional optical filter. The customizable optoelectronic module 400B includes components as described above inFIG. 4A . The customizable optical assembly 400B includes a secondoptical filter 404B. Together thecover 407B, the firstoptical filter 403B, and the secondoptical filter 404B have afirst thickness 420B and a peripheral surface 419B (e.g., the circumferential surface of thecover 407B, the firstoptical filter 403B, and the secondoptical filter 404B). The customizable optoelectronic module 400B includes afirst thickness 420B and asecond thickness 422B (akin to the customizable optoelectronic module 400A depicted inFIG. 4A ). However, thefirst thickness 420B of the customizable optoelectronic module 400B depicted inFIG. 4B and thefirst thickness 420B of the customizable optoelectronic module 400B depicted inFIG. 4B may not be equal. Further, thesecond thickness 422B of the customizable optoelectronic module 400B depicted inFIG. 4B , and thesecond thickness 422B of the customizable optoelectronic module 400B depicted inFIG. 4B are also not equal. -
FIG. 5 depicts anexample method 500 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules FIG. 3A andFIG. 3B , respectively. The method of standardizing a plurality of customizableoptoelectronic modules 500 includes a providingstep 502, a determiningstep 504, a compilingstep 506, and a modifyingstep 508. - The providing
step 502 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface. Further the determiningstep 504 includes determining a value of each first thickness of each customizable optoelectronic module within the plurality of optoelectronic modules. The first thickness can be determined optically, for example. Further, the compilingstep 506 includes compiling a data set of values, wherein the data set associates each first thickness with each respective customizable optoelectronic module. The modifyingstep 508 includes modifying the customizable spacer surface of each respective customizable optoelectronic module according to the data set such that the sum of each second thickness and each respective first thickness is substantially equal to a first standard value, the first standard value being substantially the same for each customizable optoelectronic module within the plurality of optoelectronic modules. The customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases. -
FIG. 6 depicts anexample method 600 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300C as depicted above inFIG. 3C . The method of standardizing a plurality of customizableoptoelectronic modules 600 includes a providingstep 602, a determiningstep 604, a compiling step 606, and a modifyingstep 608. - The providing
step 602 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis. Further, the determiningstep 604 includes determining a value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). Further, the compiling step 606 includes compiling a data set of values, wherein the data set associates each focal length with each respective optoelectronic module. Finally, the modifyingstep 608 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module. The customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases. -
FIG. 7 depicts anexample method 700 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300D as depicted above inFIG. 3D . The method of standardizing a plurality of customizableoptoelectronic modules 700 includes a providingstep 702, a first determiningstep 704, a second determiningstep 706, a first compiling step 708, asecond compiling step 710, and a modifyingstep 712. - The providing
step 702 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis. The first determiningstep 704 includes determining a value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). The second determiningstep 706 includes determining a cant value for each optical axis of each respective optical assembly. The cant of each optical axis can be determined optically (e.g., via optical inspection methods). The first compiling step 708 includes compiling a data set of values, wherein the data set associates each focal length with each respective optoelectronic module. Thesecond compiling step 710 includes compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module. Finally, the modifyingstep 712 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module. The customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases. -
FIG. 8 depicts anotherexample method 800 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300C as depicted inFIG. 3C . The method of standardizing a plurality of customizableoptoelectronic modules 800 includes a providingstep 802, a first determiningstep 804, a second determiningstep 806, a compiling step 808, and a modifyingstep 810. - The providing
step 802 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis. The first determiningstep 804 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules. The first thickness can be determined optically, for example. The second determiningstep 806 includes determining a second value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). The compiling step 808 includes compiling a data set of first and second values, wherein the data set associates each first and second value with each respective customizable optoelectronic module. Finally, the modifyingstep 810 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module. The customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases. -
FIG. 9 depicts anotherexample method 900 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300D as depicted inFIG. 3D . The method of standardizing a plurality of customizableoptoelectronic modules 900 includes a providingstep 902, a first determiningstep 904, a second determiningstep 906, a third determiningstep 908, afirst compiling step 910, asecond compiling step 912, and modifyingstep 914. - The providing
step 902 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis. Further, the first determiningstep 904 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules. The first thickness can be determined optically, for example. The second determiningstep 906 includes determining a second value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). Further, the third determiningstep 908 includes determining a cant value for each optical axis of each respective optical assembly. The cant of each optical axis can be determined optically (e.g., via optical inspection methods). Further, thefirst compiling step 910 includes compiling a data set of first and second values, wherein the data set associates each first and second value with each respective customizable optoelectronic module. Thesecond compiling step 912 includes compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module. Finally, the modifyingstep 914 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module. The customizable spacer surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by such an automated machine in some cases. -
FIG. 10 depicts anotherexample method 1000 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300E as depicted inFIG. 3E . The method of standardizing a plurality of customizableoptoelectronic modules 1000 includes a providingstep 1002, a first determiningstep 1004, a second determining step 1006, a compilingstep 1008, and a modifyingstep 1010. - The providing
step 1002 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis and the optical housing includes a customizable optical housing extension extending from the optical housing with a third thickness having a terminal end defining a customizable optical housing extension surface. Further, the first determiningstep 1004 includes determining a first value of each first thickness of each customizable optoelectronic module comprising the plurality of optoelectronic modules. The first thickness can be determined optically, for example. The second determining step 1006 includes determining a second value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). The compilingstep 1008 includes compiling a data set of first and second values that associates each first and second values with each respective customizable optoelectronic module. Finally, the modifyingstep 1010 includes modifying the customizable spacer surface and/or modifying the customizable optical housing extension surface of each customizable optoelectronic module according to the data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module. The customizable spacer surface and/or the customizable optical housing extension surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by an automated machine in some cases. -
FIG. 11 depicts anotherexample method 1100 of standardizing a plurality of customizable optoelectronic modules such as the customizableoptoelectronic modules 300F as depicted inFIG. 3F . The method of standardizing a plurality of customizableoptoelectronic modules 1100 includes a providingstep 1102, a first determiningstep 1104, a second determiningstep 1106, a third determining step 1108, afirst compiling step 1110, asecond compiling step 1112, and a modifyingstep 1114. - The providing
step 1102 includes providing a plurality of customizable optoelectronic modules for example as depicted in the figures above. Each customizable optoelectronic module within the plurality of customizable optoelectronic modules includes a substrate on which is electrically mounted a sensor, a cover having a first thickness disposed over the sensor, a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover, and a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface, and an optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis and the optical housing includes a customizable optical housing extension extending from the optical housing with a third thickness having a terminal end defining a customizable optical housing extension surface. Further, the first determiningstep 1104 includes determining a first value of each first thickness of each customizable optoelectronic module within the plurality of optoelectronic modules. The first thickness can be determined optically, for example. The second determiningstep 1106 includes determining a second value of each focal length of each respective optical assembly. The focal length can be determined optically (e.g., via optical inspection methods). The third determining step 1108 includes determining a cant value for each optical axis of each respective optical assembly. The cant of each optical axis can be determined optically (e.g., via optical inspection methods). Further, thefirst compiling step 1110 includes compiling a data set of first and second values that associates each first and second values with each respective customizable optoelectronic module. Thesecond compiling step 1112 include compiling a supplemental data set that associates each cant value with each respective customizable optoelectronic module. Finally, the modifyingstep 1114 includes modifying the customizable spacer surface of each customizable optoelectronic module according to the data set and the supplemental data set such that the focal length of each respective optical assembly is incident on the sensor of each respective customizable optoelectronic module and the optical axis of each respective customizable optoelectronic module is substantially orthogonal to the sensor of each respective customizable optoelectronic module. The customizable spacer surface and/or the customizable optical housing extension surface can be machined, for example, by an automated dicing, cutting, or grinding machine. Further the data set may be compiled by an automated machine in some cases. - Although the steps described above and depicted in
FIG. 5 -FIG. 11 are described in a particular order, the order can be different in some implementations. Accordingly, other implementations are within the scope of the appended claims.
Claims (16)
1. A customizable optoelectronic module, the customizable optoelectronic module comprising:
a substrate on which is electrically mounted a sensor;
a cover having a first thickness disposed over the sensor;
a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover;
a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface; and
wherein the customizable spacer surface is modifiable such that the sum of the first and second thicknesses is a first standard value.
2. The customizable optoelectronic module of claim 1 , the cover further comprising an optical filter of a thickness, wherein the first thickness further includes the thickness of the optical filter.
3. The customizable optoelectronic module of claim 1 , wherein the sensor is comprised of an array of intensity pixels.
4. The customizable optoelectronic module of claim 3 , wherein the intensity pixels are complementary metal-oxide semiconductor pixels and/or charge-coupled device pixels.
5. The customizable optoelectronic module of claim 1 , wherein the sensor is comprised of an array of demodulation pixels operable to determine distance data based on time-of-flight.
6. The customizable optoelectronic module of claim 1 , the cover further comprising a color filter array.
7. The customizable optoelectronic module of claim 2 , wherein the optical filter substantially attenuates incident light of the infrared spectrum.
8. The customizable optoelectronic module of claim 1 , wherein the customizable spacer includes substantially non-transparent filler.
9. The customizable optoelectronic module of claim 1 , wherein the customizable spacer is operable to mitigate electrostatic discharge.
10. A customizable optoelectronic module, the customizable optoelectronic module comprising:
a substrate on which is electrically mounted a sensor;
a cover having a first thickness disposed over the sensor;
a customizable spacer assembly having a customizable spacer laterally surrounding a peripheral surface of the cover;
a spacer extension extending from the customizable spacer with a second thickness having a terminal end defining a customizable spacer surface; and
an optical assembly, the optical assembly including a plurality of optical elements mounted within an optical housing, wherein the optical assembly has a focal length and an optical axis.
11. The customizable optoelectronic module of claim 10 wherein the customizable spacer surface is modifiable such that the focal length is incident on the sensor.
12. The customizable optoelectronic module of claim 10 wherein the optical housing further includes a customizable optical housing extension extending form the optical housing with a third thickness having a terminal end defining a customizable optical housing extension surface.
13. The customizable optoelectronic module of claim 12 wherein the customizable optoelectronic housing extension surface is modifiable such that the first, second, and third thicknesses is a second standard value.
14. The customizable optoelectronic module of claim 12 wherein the customizable optical housing extension surface is modifiable such that the focal length of the optical assembly is incident on the sensor.
15. The customizable optoelectronic module of claim 12 wherein the customizable optoelectronic housing extension surface is modifiable such that a the optical axis is substantially orthogonal to the sensor.
16-22. (canceled)
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US20030059178A1 (en) * | 2001-09-21 | 2003-03-27 | Citizen Electronics Co., Ltd. | Bidirectional optical transmission device |
US20110050979A1 (en) * | 2007-12-19 | 2011-03-03 | Heptagon Oy | Optical module, wafer scale package, and method for manufacturing those |
WO2013091829A1 (en) * | 2011-12-22 | 2013-06-27 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
US20140361200A1 (en) * | 2011-12-22 | 2014-12-11 | Heptagon Micro Optics Pte. Ltd. | Opto-Electronic Modules, In Particular Flash Modules, and Method For Manufacturing The Same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
EP4025948A4 (en) * | 2019-09-06 | 2023-04-26 | Schott Glass Technologies (Suzhou) Co. Ltd. | Micro-optical element having high bonding strength between glass substrate and micro-structure layer |
Also Published As
Publication number | Publication date |
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TWI700822B (en) | 2020-08-01 |
US20180240824A1 (en) | 2018-08-23 |
TW202044567A (en) | 2020-12-01 |
TW201729403A (en) | 2017-08-16 |
US10438984B2 (en) | 2019-10-08 |
TWI768421B (en) | 2022-06-21 |
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