US20160047050A1 - Method for production of metal skin layer particles with controllable layer thickness - Google Patents

Method for production of metal skin layer particles with controllable layer thickness Download PDF

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US20160047050A1
US20160047050A1 US14/828,804 US201514828804A US2016047050A1 US 20160047050 A1 US20160047050 A1 US 20160047050A1 US 201514828804 A US201514828804 A US 201514828804A US 2016047050 A1 US2016047050 A1 US 2016047050A1
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metal
liquid mixture
nanoparticle core
hydrogen
layer
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Zhenmeng Peng
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University of Akron
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
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    • C23C18/1637Composition of the substrate metallic substrate
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
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    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1803Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831Use of metal, e.g. activation, sensitisation with noble metals
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating

Definitions

  • the present invention relates to producing metal skin layer nanoparticles.
  • the present invention further relates to a method for producing metal skin layer nanoparticles having uniform and controlled layer thickness, which are adjustable from sub-monolayer to multiple layers.
  • Metal nanoparticles have important uses in many applications, such as in industry and in research. For example, metal nanoparticles, which can catalyze chemical, electrochemical, and/or photochemical reactions, are used to promote reaction kinetics. Metal nanoparticles can also exhibit extraordinary optical, magnetic, thermal, and electrical properties. These extraordinary properties enable their application in many fields including imagining, sensing, information storage, biology, and medicine. Depending upon the application, the form used for the metal nanoparticles can be quite different.
  • metal nanoparticles are often put on a support when being used as a catalyst.
  • Catalysis is primarily a surface phenomenon and therefore large surfaces can be obtained by making the metals into tiny particles.
  • the use of a support is for separation and stabilization of the metal nanoparticles from agglomeration and sintering.
  • the creation of large specific surfaces is especially important for precious metals.
  • the use of a miniscule amount of precious metal nanoparticles on a support can improve the utilization of the precious metal while at the same time decreasing their overall usage.
  • unsupported metal nanoparticles are often used when their optical properties are needed and applied.
  • the driving force to produce metal skin layer nanoparticles with controlled thickness is multifold.
  • Second, for non-precious metals it is often that their catalytic, optical, and electrical properties can be improved when one thin layer of these metals are put on other metallic substrates. By making skin layer nanoparticles in which these metals consist of the surface layer/layers, and some other metal makes up the core, the property of the particles can be improved.
  • UPD Electrochemical underpotential deposition
  • the UPD methods cannot be easily scaled up.
  • An electrode is needed in these methods and the production rate is determined by the surface area of the electrode.
  • the production rate is largely limited because the electrodes cannot be made large enough.
  • the method is applicable only to a limited combination of core and skin layer metals. Most metals are not electrochemically stable under the reaction conditions and are thus not appropriate to serve as particle cores.
  • the support materials have to be electron conductive and the production cost is high because of the complex electrochemical equipment needed. The potential of the electrode needs to be precisely controlled, which can only be done with complex equipment.
  • An electroless deposition method for depositing a second metal on the surface of core metal nanoparticles has also been developed.
  • a reducing reagent and skin-layer forming metal salts are added to a dispersion of core metal nanoparticles.
  • the reduced metal atoms tend to grow on the core metal particle surfaces which lead to formation of core shell-like structures.
  • this method has a lack of good control over the metal deposition onto the core metal particles. It is often that some metal core particles are deposited with thick metal layers while some other metal core particles still have bare surfaces because any slight differences among core metal particles can alter metal deposition behavior.
  • the deposited layers are often not uniform in thickness even on the same particle, with some parts having multiple layers while the other parts have no layer at all.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core comprising the steps of: (a) selecting a metal to deposit; (b) dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture; (c) bubbling a hydrogen containing gas through the liquid mixture to form a layer of adsorbed hydrogen atoms on the surface of the metal nanoparticle core; and (d) adding the selected metal to the liquid mixture to form a metal skin layer on the metal nanoparticle core.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in the first embodiment, wherein the selected metal is incapable of adsorbing and dissociating hydrogen molecules (M I ).
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in either the first or second embodiment, wherein the selected metal is capable of adsorbing and dissociating hydrogen molecules (M C ).
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fourth embodiments, wherein the entire method is repeated multiple times so as to deposit multiple layers of M C .
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fifth embodiments, wherein prior to step (d) the method further comprises the steps of: adding a MR to the liquid mixture wherein MR is reduced by the adsorbed hydrogen atoms to form a layer of MR on the metal nanoparticle core; purging the liquid mixture of all excess hydrogen; and adding a M C to the liquid mixture.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through sixth embodiments, wherein every step prior to step d is repeated multiple times so as to deposit multiple layers of M C , and then once step d occurs; the added M I will replace the multiple layers of M C to form multiple layers of M I .
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through seventh embodiments, wherein M I is selected from the Group 11 through Group 15 metals of the Periodic Table.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through eighth embodiments, wherein M C is selected from the Group 3 to Group 10 metals of the Periodic Table.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through ninth embodiments, wherein the metal nanoparticle core is selected from the Group 3 to Group 10 metals of the Periodic Table.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through tenth embodiments, wherein the electrolyte solvent is selected from any solvent capable of dissolving metal salts.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through eleventh embodiments, wherein the electrolyte solvent is selected from the group consisting of water, methanol, ethanol, propanol, organic electrolytes and ionic liquids.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through twelfth embodiments, wherein M R is selected from M R 's that can undergo a reduction reaction wherein the reduced form of the M R is a metal in solid form.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through thirteenth embodiments, wherein M R is selected from M R 's that can undergo a reduction reaction wherein the reduced form of the M R is a metal in solid form.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fourteenth embodiments, wherein the hydrogen containing gas is selected from pure hydrogen gas or a mixture of hydrogen gas with other gases selected from nitrogen, argon, carbon dioxide, and carbon monoxide.
  • the hydrogen containing gas is selected from pure hydrogen gas or a mixture of hydrogen gas with other gases selected from nitrogen, argon, carbon dioxide, and carbon monoxide.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fifteenth embodiments, wherein the temperature of the liquid mixture is less than about 100° C.
  • the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through sixteenth embodiments, wherein the pH of the liquid mixture is between about 0 and about 14.
  • This invention relates to a new method for producing metal skin layer nanoparticles.
  • the method is able to produce metal skin layer nanoparticles with uniform and controlled layer thickness, adjustable from sub-monolayer to multiple layers.
  • the metal skin layer is formed from metal ions that in metal form are incapable of adsorbing and dissociating hydrogen molecules (M I ).
  • the metal skin layer is formed from metal ions that in metal form are capable of adsorbing and dissociating hydrogen molecules (M C ).
  • the method is applicable for producing a broad range of metal skin layer nanoparticles with controlled layer thickness.
  • the metal nanoparticle core can be selected from the Group 3 to Group 10 metals of the Periodic Table, particularly, but not limited to platinum, iridium, palladium, rhodium, ruthenium, nickel, cobalt, iron, tungsten, and rhenium.
  • the selection of the metal nanoparticle core does not limit the practice of this invention.
  • the metal skin layer is formed from metal ions that in metal form are incapable of adsorbing and dissociating hydrogen molecules (M I ). These M I metals are incapable of adsorbing and dissociating hydrogen molecules because they do not have strong electronic interaction with hydrogen molecules due to saturated d-electron orbitals.
  • M I metals can be selected from the Group 11 through Group 15 metals of the Periodic Table, particularly, but not limited to copper, silver, gold, zinc, cadmium, mercury, indium, gallium, tin, lead, and bismuth. The particular M I is selected based on the desired end use of the metal skin layer nanoparticle.
  • the metal skin layer is formed from metal ions that in metal form are capable of adsorbing and dissociating hydrogen molecules M C .
  • These metal ions are capable of adsorbing and dissociating hydrogen molecules because they have strong electronic interaction with hydrogen molecules due to having unsaturated d-electron orbitals.
  • M C metals can be selected from the Group 3 through Group 10 metals of the Periodic Table, particularly, but not limited to platinum, iridium, palladium, rhodium, ruthenium, nickel, cobalt, iron, tungsten, and rhenium. The particular M C is selected based on the desired end use of the metal skin layer nanoparticle.
  • the next step is to disperse the metal nanoparticle core in an electrolyte solvent to form a liquid mixture.
  • the electrolyte solvent is selected from any solvent capable of dissolving metal salts.
  • the electrolyte solvent is selected from the group consisting of water, methanol, ethanol, propanol, organic electrolytes and ionic liquids.
  • the hydrogen-containing gas is pure hydrogen gas.
  • the hydrogen-containing gas is a mixture of hydrogen gas with other gases such as nitrogen, argon, carbon dioxide, and carbon monoxide.
  • Hydrogen is the only gas that is chemisorbed because hydrogen has the unique chemical behavior that it can dissociatively adsorb to Group 3 through Group 10 metals of the Periodic Table and generate adsorbed hydrogen atoms.
  • the use of hydrogen mixed with other gases is only used to tune the partial pressure of hydrogen and thus the adsorption behavior of the hydrogen gas.
  • the bubbling of the hydrogen-containing gas through the liquid mixture leads to the formation of one monolayer of adsorbed hydrogen atoms on the metal nanoparticle core.
  • the selected metal to be deposited is an M I
  • the M I ion is added to the liquid mixture and the M I ion will be reduced by the adsorbed hydrogen atoms on the metal nanoparticle core and one monolayer of M I will be deposited and forms a metal skin layer on the surface of the metal nanoparticle core.
  • the selected metal to be deposited is an M C
  • a few additional steps must take place prior to forming the metal skin layer on the surface of the metal nanoparticle core.
  • M R metal ion or metal ion complex
  • the selected M R must be able to undergo a reduction reaction with the adsorbed hydrogen atoms on the metal nanoparticle core so that the reduced form of the M R is a metal in solid form.
  • the M R is selected from the following list of redox couples [M R +ne ⁇ M(solid)]:
  • the M R is added to the liquid mixture, the M R is reduced by the adsorbed hydrogen atoms to form a layer of the M R on the metal nanoparticle core. Once there is a layer of the M R on the metal nanoparticle core, then the liquid mixture is purged of all excess hydrogen-containing gas. The liquid mixture is purged of all excess hydrogen-containing gas because the excess hydrogen molecules in the liquid can continue to adsorb to the M C metal layer after its deposition and reduce the M C ions, leading to M C over-deposition.
  • the M C ions are added to the liquid mixture and the M C will be reduced by the layer of the M R on the metal nanoparticle core and one monolayer of M C will be deposited and forms a metal skin layer on the surface of the metal nanoparticle core.
  • To deposit multiple M C layers on a metal nanoparticle core take the process of dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture, bubbling a hydrogen containing gas though the liquid mixture, adding to the liquid mixture a M R , purging the system of all excess hydrogen containing gas, and adding the M C to the liquid mixture; and repeat it X amount of times to deposit X amount of M C layers on the metal nanoparticle core.
  • the layer of adsorbed hydrogen atoms will form on top of that first layer of M C and the M R will be reduced by the adsorbed hydrogen atoms to form a layer of the M R on top of the first layer of M C .
  • the second round of M C ions it will replace the M R on top of the first layer of M C and then there will be two layers of M C on the metal nanoparticle core.
  • To deposit multiple M I layers on a metal nanoparticle core take the process of dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture, bubbling a hydrogen containing gas through the liquid mixture, adding to the liquid mixture a M R , purging the system of all excess hydrogen containing gas, and adding M C to the liquid mixture; and repeat it X amount of time to deposit X amount of M C layers on the metal nanoparticle core.
  • the layer of adsorbed hydrogen atoms will form on top of that first layer of M C and the M R will be reduced by the adsorbed hydrogen atoms to form a layer of the M R on top of the first layer of M C .
  • the second round of M C ions it will replace the M R on top of the first layer of M C and then there will be two layers of M C on the metal nanoparticle core.
  • the M I ions are added to the liquid mixture and the M I will be reduced by X amount of layers of M C on the nanoparticle core, and the M I will replace the X amount of layers of M C forming a metal nanoparticle core having X amount of M I skin layers.
  • the temperature of the liquid mixture should be less than about 100° C. and the pH of the liquid mixture should be between about 0 and about 14.
  • the present invention significantly advances the art by providing a method of depositing at least one metal skin layer on a metal nanoparticle core that is structurally and functionally improved in a number of ways. While particular embodiments of the invention have been disclosed in detail herein, it should be appreciated that the invention is not limited thereto or thereby inasmuch as variations on the invention herein will be readily appreciated by those of ordinary skill in the art. The scope of the invention shall be appreciated from the claims that follow.
  • Pd(NO 3 ) 2 aqueous solution containing Pd ions is added and reacted for about 10 minutes, which results in formation of Pd one monolayer on the Pt core nanoparticles.
  • Pd has more positive reduction potential than Cu and because of this; Pd ions are reduced to Pd by Cu, which are oxidized by Pd ions to Cu ions.
  • the formation of one Pd monolayer on the Pt/C core nanoparticles was confirmed using TEM, HRTEM, EDX elemental mapping, and EDX quantitative analyses characterizations.
  • Example 2 Preparation of multiple palladium layers on carbon-supported platinum core nanoparticles.
  • the experimental procedure in Example 1 is repeated multiple times for making multiple palladium layers on Pt/C core nanoparticles.
  • the formation of multiple palladium layers on the Pt/C core nanoparticles was confirmed using TEM, HRTEM, EDX elemental mapping, and EDX quantitative analyses characterizations.

Abstract

A method of depositing at least one metal skin layer on a metal nanoparticle core is disclosed. The first step of the method is selecting a metal to deposit. Then, the metal nanoparticle core is dispersed in an electrolyte solvent to form a liquid mixture. Next, a hydrogen containing gas is bubbled through the liquid mixture to form a layer of adsorbed hydrogen atoms on the surface of the metal nanoparticle core. Finally, the selected metal is added to the liquid mixture to form a metal skin layer on the metal nanoparticle core.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims priority from U.S. Provisional Application No. 62/038,443 filed on Aug. 18, 2014 the contents of which are incorporated herein by reference.
  • FIELD OF THE INVENTION
  • The present invention relates to producing metal skin layer nanoparticles. The present invention further relates to a method for producing metal skin layer nanoparticles having uniform and controlled layer thickness, which are adjustable from sub-monolayer to multiple layers.
  • BACKGROUND OF THE INVENTION
  • Metal nanoparticles have important uses in many applications, such as in industry and in research. For example, metal nanoparticles, which can catalyze chemical, electrochemical, and/or photochemical reactions, are used to promote reaction kinetics. Metal nanoparticles can also exhibit extraordinary optical, magnetic, thermal, and electrical properties. These extraordinary properties enable their application in many fields including imagining, sensing, information storage, biology, and medicine. Depending upon the application, the form used for the metal nanoparticles can be quite different.
  • For instance, metal nanoparticles are often put on a support when being used as a catalyst. Catalysis is primarily a surface phenomenon and therefore large surfaces can be obtained by making the metals into tiny particles. The use of a support is for separation and stabilization of the metal nanoparticles from agglomeration and sintering. The creation of large specific surfaces is especially important for precious metals. The use of a miniscule amount of precious metal nanoparticles on a support can improve the utilization of the precious metal while at the same time decreasing their overall usage. In another instance, unsupported metal nanoparticles are often used when their optical properties are needed and applied.
  • The driving force to produce metal skin layer nanoparticles with controlled thickness is multifold. First, for precious metals, minimization of their usage is always under pursuit for cost reasons. By making skin layer nanoparticles in which precious metals are only located on the particle surface layer/layers, and having less expensive metals serve as the particle core; the precious metal utilization is maximized while reducing cost. Second, for non-precious metals, it is often that their catalytic, optical, and electrical properties can be improved when one thin layer of these metals are put on other metallic substrates. By making skin layer nanoparticles in which these metals consist of the surface layer/layers, and some other metal makes up the core, the property of the particles can be improved. Finally, when unstable metal nanoparticles which have important applications are used, it is essential to protect the particles from degradation. By depositing skin layers of more stable metals onto the unstable metal particle surface, the stability of these nanoparticles is improved.
  • Despite the many advantages of metal skin layer nanoparticles, there is currently not a production method for facile and scalable production at a low cost. Electrochemical underpotential deposition (UPD) methods have been developed for making metal skin layer nanoparticles. UPD is a phenomenon of electrodeposition of a species (typically reduction of a metal cation to a solid metal) at a potential less negative than the equilibrium (Nernst) potential for the reduction of this metal. The equilibrium potential for the reduction of a metal in this context is the potential at which it will deposit onto itself. However these methods have obvious limitations.
  • Firstly, the UPD methods cannot be easily scaled up. An electrode is needed in these methods and the production rate is determined by the surface area of the electrode. Thus, the production rate is largely limited because the electrodes cannot be made large enough. Secondly, the method is applicable only to a limited combination of core and skin layer metals. Most metals are not electrochemically stable under the reaction conditions and are thus not appropriate to serve as particle cores. Finally, the support materials have to be electron conductive and the production cost is high because of the complex electrochemical equipment needed. The potential of the electrode needs to be precisely controlled, which can only be done with complex equipment.
  • An electroless deposition method for depositing a second metal on the surface of core metal nanoparticles has also been developed. In this method, a reducing reagent and skin-layer forming metal salts are added to a dispersion of core metal nanoparticles. The reduced metal atoms tend to grow on the core metal particle surfaces which lead to formation of core shell-like structures. However, this method has a lack of good control over the metal deposition onto the core metal particles. It is often that some metal core particles are deposited with thick metal layers while some other metal core particles still have bare surfaces because any slight differences among core metal particles can alter metal deposition behavior. The deposited layers are often not uniform in thickness even on the same particle, with some parts having multiple layers while the other parts have no layer at all.
  • Therefore, there is a need in the art for a method for producing metal skin layer nanoparticles wherein the metal skin layer nanoparticles have uniform and controlled layer thickness; wherein the metal skin layer nanoparticles are adjustable from sub-monolayers to multiple layers; and wherein the method can be readily scalable for mass production with low production costs.
  • SUMMARY OF THE INVENTION
  • In a first embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core comprising the steps of: (a) selecting a metal to deposit; (b) dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture; (c) bubbling a hydrogen containing gas through the liquid mixture to form a layer of adsorbed hydrogen atoms on the surface of the metal nanoparticle core; and (d) adding the selected metal to the liquid mixture to form a metal skin layer on the metal nanoparticle core.
  • In a second embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in the first embodiment, wherein the selected metal is incapable of adsorbing and dissociating hydrogen molecules (MI).
  • In a third embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in either the first or second embodiment, wherein the selected metal is capable of adsorbing and dissociating hydrogen molecules (MC).
  • In a fourth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through third embodiments, wherein prior to step (d) the method further comprises the steps of: adding a metal ion or metal ion complex (MR) to the liquid mixture wherein MR is reduced by the adsorbed hydrogen atoms to form a layer of MR on the metal nanoparticle core; and purging the liquid mixture of all excess hydrogen
  • In a fifth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fourth embodiments, wherein the entire method is repeated multiple times so as to deposit multiple layers of MC.
  • In a sixth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fifth embodiments, wherein prior to step (d) the method further comprises the steps of: adding a MR to the liquid mixture wherein MR is reduced by the adsorbed hydrogen atoms to form a layer of MR on the metal nanoparticle core; purging the liquid mixture of all excess hydrogen; and adding a MC to the liquid mixture.
  • In a seventh embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through sixth embodiments, wherein every step prior to step d is repeated multiple times so as to deposit multiple layers of MC, and then once step d occurs; the added MI will replace the multiple layers of MC to form multiple layers of MI.
  • In an eighth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through seventh embodiments, wherein MI is selected from the Group 11 through Group 15 metals of the Periodic Table.
  • In a ninth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through eighth embodiments, wherein MC is selected from the Group 3 to Group 10 metals of the Periodic Table.
  • In a tenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through ninth embodiments, wherein the metal nanoparticle core is selected from the Group 3 to Group 10 metals of the Periodic Table.
  • In an eleventh embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through tenth embodiments, wherein the electrolyte solvent is selected from any solvent capable of dissolving metal salts.
  • In a twelfth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through eleventh embodiments, wherein the electrolyte solvent is selected from the group consisting of water, methanol, ethanol, propanol, organic electrolytes and ionic liquids.
  • In a thirteenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through twelfth embodiments, wherein MR is selected from MR's that can undergo a reduction reaction wherein the reduced form of the MR is a metal in solid form.
  • In a fourteenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through thirteenth embodiments, wherein MR is selected from MR's that can undergo a reduction reaction wherein the reduced form of the MR is a metal in solid form.
  • In a fifteenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fourteenth embodiments, wherein the hydrogen containing gas is selected from pure hydrogen gas or a mixture of hydrogen gas with other gases selected from nitrogen, argon, carbon dioxide, and carbon monoxide.
  • In a sixteenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through fifteenth embodiments, wherein the temperature of the liquid mixture is less than about 100° C.
  • In a seventeenth embodiment, the present invention provides a method of depositing at least one metal skin layer on a metal nanoparticle core as in any of the first through sixteenth embodiments, wherein the pH of the liquid mixture is between about 0 and about 14.
  • DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
  • This invention relates to a new method for producing metal skin layer nanoparticles. The method is able to produce metal skin layer nanoparticles with uniform and controlled layer thickness, adjustable from sub-monolayer to multiple layers. In some embodiments, the metal skin layer is formed from metal ions that in metal form are incapable of adsorbing and dissociating hydrogen molecules (MI). In yet other embodiments, the metal skin layer is formed from metal ions that in metal form are capable of adsorbing and dissociating hydrogen molecules (MC).
  • The method is applicable for producing a broad range of metal skin layer nanoparticles with controlled layer thickness. The metal nanoparticle core can be selected from the Group 3 to Group 10 metals of the Periodic Table, particularly, but not limited to platinum, iridium, palladium, rhodium, ruthenium, nickel, cobalt, iron, tungsten, and rhenium. The selection of the metal nanoparticle core does not limit the practice of this invention.
  • To deposit a single metal skin layer on a metal nanoparticle core, a metal ion to be deposited on the metal nanoparticle core must be selected. In some embodiments of the present invention, the metal skin layer is formed from metal ions that in metal form are incapable of adsorbing and dissociating hydrogen molecules (MI). These MI metals are incapable of adsorbing and dissociating hydrogen molecules because they do not have strong electronic interaction with hydrogen molecules due to saturated d-electron orbitals. MI metals can be selected from the Group 11 through Group 15 metals of the Periodic Table, particularly, but not limited to copper, silver, gold, zinc, cadmium, mercury, indium, gallium, tin, lead, and bismuth. The particular MI is selected based on the desired end use of the metal skin layer nanoparticle.
  • In yet other embodiments of the present invention, the metal skin layer is formed from metal ions that in metal form are capable of adsorbing and dissociating hydrogen molecules MC. These metal ions are capable of adsorbing and dissociating hydrogen molecules because they have strong electronic interaction with hydrogen molecules due to having unsaturated d-electron orbitals. MC metals can be selected from the Group 3 through Group 10 metals of the Periodic Table, particularly, but not limited to platinum, iridium, palladium, rhodium, ruthenium, nickel, cobalt, iron, tungsten, and rhenium. The particular MC is selected based on the desired end use of the metal skin layer nanoparticle.
  • Once the metal ion to be deposited on the metal nanoparticle core is selected, the next step is to disperse the metal nanoparticle core in an electrolyte solvent to form a liquid mixture. The electrolyte solvent is selected from any solvent capable of dissolving metal salts. In particular embodiments, the electrolyte solvent is selected from the group consisting of water, methanol, ethanol, propanol, organic electrolytes and ionic liquids.
  • Once the liquid mixture is formed, a hydrogen-containing gas is bubbled through the liquid mixture. In one embodiment, the hydrogen-containing gas is pure hydrogen gas. In other embodiments, the hydrogen-containing gas is a mixture of hydrogen gas with other gases such as nitrogen, argon, carbon dioxide, and carbon monoxide. Hydrogen is the only gas that is chemisorbed because hydrogen has the unique chemical behavior that it can dissociatively adsorb to Group 3 through Group 10 metals of the Periodic Table and generate adsorbed hydrogen atoms. The use of hydrogen mixed with other gases is only used to tune the partial pressure of hydrogen and thus the adsorption behavior of the hydrogen gas. The bubbling of the hydrogen-containing gas through the liquid mixture leads to the formation of one monolayer of adsorbed hydrogen atoms on the metal nanoparticle core. Then, if the selected metal to be deposited is an MI, the MI ion is added to the liquid mixture and the MI ion will be reduced by the adsorbed hydrogen atoms on the metal nanoparticle core and one monolayer of MI will be deposited and forms a metal skin layer on the surface of the metal nanoparticle core.
  • However, if the selected metal to be deposited is an MC, then a few additional steps must take place prior to forming the metal skin layer on the surface of the metal nanoparticle core. If the selected metal is an MC, then, after the formation of one monolayer of adsorbed hydrogen atoms on the metal nanoparticle core, a metal ion or metal ion complex (MR) is added to the liquid mixture. The selected MR must be able to undergo a reduction reaction with the adsorbed hydrogen atoms on the metal nanoparticle core so that the reduced form of the MR is a metal in solid form. In particular embodiments, the MR is selected from the following list of redox couples [MR+ne
    Figure US20160047050A1-20160218-P00001
    M(solid)]:
  • Reaction [MR + ne
    Figure US20160047050A1-20160218-P00002
     M(solid)]
    Zn2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Zn
    Ga3+ + 3e
    Figure US20160047050A1-20160218-P00002
     Ga
    Cd2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Cd
    In3+ + 3e
    Figure US20160047050A1-20160218-P00002
     In
    Tl+ + e
    Figure US20160047050A1-20160218-P00002
     Tl
    Ga+ + e
    Figure US20160047050A1-20160218-P00002
     Ga
    In+ + e
    Figure US20160047050A1-20160218-P00002
     In
    Sn2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Sn
    Pb2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Pb
    Cu2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Cu
    Cu+ + e
    Figure US20160047050A1-20160218-P00002
     Cu
    W3+ + 3e
    Figure US20160047050A1-20160218-P00002
     W
    Ge4+ + 4e
    Figure US20160047050A1-20160218-P00002
     Ge
    Bi3+ + 3e
    Figure US20160047050A1-20160218-P00002
     Bi
    Bi+ + e
    Figure US20160047050A1-20160218-P00002
      Bi
    BiO+ + 2H+ + 3e
    Figure US20160047050A1-20160218-P00002
     Bi + 2H2O
    Ag+ + e
    Figure US20160047050A1-20160218-P00002
     Ag
    Hg2+ + 2e
    Figure US20160047050A1-20160218-P00002
     Hg
    SbO+ + 2H+ + 3e
    Figure US20160047050A1-20160218-P00002
     Sb + 2H2O
  • Once the MR is added to the liquid mixture, the MR is reduced by the adsorbed hydrogen atoms to form a layer of the MR on the metal nanoparticle core. Once there is a layer of the MR on the metal nanoparticle core, then the liquid mixture is purged of all excess hydrogen-containing gas. The liquid mixture is purged of all excess hydrogen-containing gas because the excess hydrogen molecules in the liquid can continue to adsorb to the MC metal layer after its deposition and reduce the MC ions, leading to MC over-deposition. Then, once the liquid mixture is purged of all excess hydrogen containing gas, the MC ions are added to the liquid mixture and the MC will be reduced by the layer of the MR on the metal nanoparticle core and one monolayer of MC will be deposited and forms a metal skin layer on the surface of the metal nanoparticle core.
  • To deposit multiple MC layers on a metal nanoparticle core, take the process of dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture, bubbling a hydrogen containing gas though the liquid mixture, adding to the liquid mixture a MR, purging the system of all excess hydrogen containing gas, and adding the MC to the liquid mixture; and repeat it X amount of times to deposit X amount of MC layers on the metal nanoparticle core. Once the first layer of MC has been deposited, the layer of adsorbed hydrogen atoms will form on top of that first layer of MC and the MR will be reduced by the adsorbed hydrogen atoms to form a layer of the MR on top of the first layer of MC. Then, once the second round of MC ions is added, it will replace the MR on top of the first layer of MC and then there will be two layers of MC on the metal nanoparticle core.
  • To deposit multiple MI layers on a metal nanoparticle core, take the process of dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture, bubbling a hydrogen containing gas through the liquid mixture, adding to the liquid mixture a MR, purging the system of all excess hydrogen containing gas, and adding MC to the liquid mixture; and repeat it X amount of time to deposit X amount of MC layers on the metal nanoparticle core. As stated above, once the first layer of MC has been deposited, the layer of adsorbed hydrogen atoms will form on top of that first layer of MC and the MR will be reduced by the adsorbed hydrogen atoms to form a layer of the MR on top of the first layer of MC. Then, once the second round of MC ions is added, it will replace the MR on top of the first layer of MC and then there will be two layers of MC on the metal nanoparticle core.
  • Once the process has been repeated X amount of time to deposit X amount of MC layers on the metal nanoparticle core, the MI ions are added to the liquid mixture and the MI will be reduced by X amount of layers of MC on the nanoparticle core, and the MI will replace the X amount of layers of MC forming a metal nanoparticle core having X amount of MI skin layers.
  • Whether depositing a single layer of MI, a single layer of MC, or multiple layers of either MI or MC on the nanoparticle core, the temperature of the liquid mixture should be less than about 100° C. and the pH of the liquid mixture should be between about 0 and about 14.
  • In light of the foregoing, it should be appreciated that the present invention significantly advances the art by providing a method of depositing at least one metal skin layer on a metal nanoparticle core that is structurally and functionally improved in a number of ways. While particular embodiments of the invention have been disclosed in detail herein, it should be appreciated that the invention is not limited thereto or thereby inasmuch as variations on the invention herein will be readily appreciated by those of ordinary skill in the art. The scope of the invention shall be appreciated from the claims that follow.
  • EXAMPLES Example 1
  • Preparation of one palladium (Pd) monolayer layer on carbon-supported platinum core nanoparticles. Platinum (Pt) nanoparticles on carbon (C) support (Pt/C) are firstly dispersed in water and stirred for mixing. The liquid mixture is bubbled with hydrogen gas for about 10 minutes. A CuSO4 aqueous solution containing copper (Cu) ions is added and reacted for about 10 minutes, which results in formation of one Cu monolayer on the Pt core nanoparticles. The adsorbed hydrogen atoms reduce the Cu and the reduced Cu cannot adsorb hydrogen, thus the reduction stops once one Cu monolayer is generated and covers the Pt nanoparticles. The liquid mixture is then purged by nitrogen for about 20 minutes for removal of excess hydrogen dissolved in the mixture. Pd(NO3)2 aqueous solution containing Pd ions is added and reacted for about 10 minutes, which results in formation of Pd one monolayer on the Pt core nanoparticles. Pd has more positive reduction potential than Cu and because of this; Pd ions are reduced to Pd by Cu, which are oxidized by Pd ions to Cu ions. The formation of one Pd monolayer on the Pt/C core nanoparticles was confirmed using TEM, HRTEM, EDX elemental mapping, and EDX quantitative analyses characterizations.
  • Example 2
  • Preparation of multiple palladium layers on carbon-supported platinum core nanoparticles. The experimental procedure in Example 1 is repeated multiple times for making multiple palladium layers on Pt/C core nanoparticles. The formation of multiple palladium layers on the Pt/C core nanoparticles was confirmed using TEM, HRTEM, EDX elemental mapping, and EDX quantitative analyses characterizations.

Claims (17)

What is claimed is:
1. A method of depositing at least one metal skin layer on a metal nanoparticle core comprising the steps of:
a. selecting a metal to deposit;
b. dispersing the metal nanoparticle core in an electrolyte solvent to form a liquid mixture;
c. bubbling a hydrogen containing gas through the liquid mixture to form a layer of adsorbed hydrogen atoms on the surface of the metal nanoparticle core; and
d. adding the selected metal to the liquid mixture to form a metal skin layer on the metal nanoparticle core
2. The method of claim 1, wherein the selected metal is incapable of adsorbing and dissociating hydrogen molecules (MI).
3. The method of claim 1, wherein the selected metal is capable of adsorbing and dissociating hydrogen molecules (MC).
4. The method of claim 3, wherein prior to step d the method further comprises the steps of:
a. adding a metal ion or metal ion complex (MR) to the liquid mixture wherein MR is reduced by the adsorbed hydrogen atoms to form a layer of MR on the metal nanoparticle core; and
b. purging the liquid mixture of all excess hydrogen.
5. The method of claim 4, wherein the entire method is repeated multiple times so as to deposit multiple layers of MC.
6. The method of claim 2, wherein prior to step d the method further comprises the steps of:
a. adding a MR to the liquid mixture wherein MR is reduced by the adsorbed hydrogen atoms to form a layer of MR on the metal nanoparticle core;
b. purging the liquid mixture of all excess hydrogen; and
c. adding a MC to the liquid mixture.
7. The method of claim 6, wherein every step prior to step d is repeated multiple times so as to deposit multiple layers of MC, and then once step d occurs; the added MI will replace the multiple layers of MC to form multiple layers of MI.
8. The method of claim 2, wherein MI is selected from the Group 11 through Group 15 metals of the Periodic Table.
9. The method of claim 3, wherein MC is selected from the Group 3 to Group 10 metals of the Periodic Table.
10. The method of claim 1, wherein the metal nanoparticle core is selected from the Group 3 to Group 10 metals of the Periodic Table.
11. The method of claim 1, wherein the electrolyte solvent is selected from any solvent capable of dissolving metal salts.
12. The method of claim 11, wherein the electrolyte solvent is selected from the group consisting of water, methanol, ethanol, propanol, organic electrolytes and ionic liquids.
13. The method of claim 4, wherein MR is selected from MR's that can undergo a reduction reaction wherein the reduced form of the MR is a metal in solid form.
14. The method of claim 6, wherein MR is selected from MR's that can undergo a reduction reaction wherein the reduced form of the MR is a metal in solid form.
15. The method of claim 1, wherein the hydrogen containing gas is selected from pure hydrogen gas or a mixture of hydrogen gas with other gases selected from nitrogen, argon, carbon dioxide, and carbon monoxide.
16. The method of claim 1, wherein the temperature of the liquid mixture is less than about 100° C.
17. The method of claim 1, wherein the pH of the liquid mixture is between about 0 and about 14.
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