US20150159969A1 - Thermal transfer catalytic heat dissipation structure - Google Patents

Thermal transfer catalytic heat dissipation structure Download PDF

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Publication number
US20150159969A1
US20150159969A1 US14/288,516 US201414288516A US2015159969A1 US 20150159969 A1 US20150159969 A1 US 20150159969A1 US 201414288516 A US201414288516 A US 201414288516A US 2015159969 A1 US2015159969 A1 US 2015159969A1
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US
United States
Prior art keywords
heat dissipation
thermal transfer
conductive carrier
thermal conductive
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/288,516
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English (en)
Inventor
Hung-Chih Lu
Chung-Pin Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCY-TEC Corp
Original Assignee
TCY-TEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCY-TEC Corp filed Critical TCY-TEC Corp
Assigned to TCY-TEC CORPORATION reassignment TCY-TEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LU, HUNG-CHIH, YANG, CHUNG-PIN
Publication of US20150159969A1 publication Critical patent/US20150159969A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives

Definitions

  • the present invention is related to a thermal transfer catalytic heat dissipation structure, and particularly to a thermal transfer catalytic heat dissipation structure where a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film is used to dissipate the heat when a thermal conductive carrier absorbs the heat from heat source, so that the heat source is effectively transferred to the ambient through the film, avoiding a thermal transfer gap with respect to the air, and achieving in that a thermal transfer effectiveness is promoted, a thermal transfer bottleneck is effectively reduced, heat sink is never necessary, a heat dissipation cost is largely reduced, a volume and weight is reduced, and a waste of the raw material, carbon, and energy consumption can be reduced.
  • a heat dissipation adhesive or high thermal transfer layer is disposed between a thermal conductive carrier and a heat source, and heat sink are further disposed on the thermal conductive carrier, so that the thermal conductive carrier is used to dissipate a heat.
  • the adhesive has a relatively smaller thermal transfer coefficient
  • a high heat dissipation insulating layer having a relatively larger thermal transfer coefficient, is used in replace of the adhesive.
  • the bottleneck and barrier of the thermal transfer does not occur on an interface between the heat source and the thermal conductive carrier, but on the contact between the thermal conductive carrier and the ambient (like as air).
  • thermal transfer gap Since there is a very huge thermal transfer gap at the interface between the thermal conductive carrier and the air, i.e. the thermal conductive carrier has a large thermal transfer while the air has a small thermal transfer, a thermal backflow is generated along a thermal transfer path when the heat is transferred to between the thermal conductive carrier and the air through the heat transfer path in the heat sink, although the prior art heat dissipation uses a high heat dissipation insulating layer having a relatively large heat transfer coefficient in replace of the adhesive to promote the thermal transfer efficiency. Thus, the bottleneck and barrier of thermal transfer are formed.
  • the heat sink may also increase the heat dissipation cost, increase the volume and weight of the apparatus, and waste the raw material, except for the above mentioned disadvantages.
  • the inventor of the present invention provides a thermal transfer catalytic heat dissipation structure, after many efforts and researches to overcome the shortcoming encountered in the prior art.
  • a heat dissipation adhesive or high thermal transfer layer is disposed between a thermal conductive carrier and a heat source, and heat sink are further disposed on the thermal conductive carrier, so that the thermal conductive carrier is used to dissipate a heat.
  • the adhesive has a relatively smaller thermal transfer coefficient
  • a high heat dissipation insulating layer having a relatively larger thermal transfer coefficient, is used in replace of the adhesive.
  • the bottleneck and barrier of the thermal transfer does not occur on an interface between the heat source and the thermal conductive carrier, but on the contact between the thermal conductive carrier and the air.
  • thermal transfer gap Since there is a very huge thermal transfer gap at the interface between the thermal conductive carrier and the air, i.e. the thermal conductive carrier has a large thermal transfer while the air has a small thermal transfer, a thermal backflow is generated along a thermal transfer path when the heat is transferred to between the thermal conductive carrier and the air through the heat transfer path in the heat sink, although the prior art heat dissipation uses a high heat dissipation insulating layer having a relatively large heat transfer coefficient in replace of the adhesive to promote the thermal transfer efficiency. Thus, the bottleneck and barrier of thermal transfer are formed.
  • the heat sink may also increase the heat dissipation cost, increase the volume and weight of the apparatus, and waste the raw material, except for the above mentioned disadvantages.
  • the inventor of the present invention provides a thermal transfer catalytic heat dissipation structure, after many efforts and researches to overcome the shortcoming encountered in the prior art.
  • FIG. 1 is a cross sectional view showing the schematic diagram of the first embodiment according to the present invention
  • FIG. 2 is a schematic diagram of a thermal transfer state of the first embodiment according to the present invention.
  • FIG. 3 is a cross sectional view showing the schematic diagram of a second embodiment according to the present invention.
  • FIG. 4 is a cross sectional view showing the schematic diagram of a third embodiment according to the present invention.
  • FIG. 1 and FIG. 2 is a schematic diagram of a cross sectional view showing the schematic diagram of the first embodiment according to the present invention; and a schematic diagram of a thermal transfer state of the first embodiment according to the present invention, respectively.
  • the thermal transfer catalytic heat dissipation structure comprises a thermal conductive carrier 1 , a heat source 2 and a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 .
  • the thermal conductive carrier 1 may be but not limited only to a heat dissipation assembly, a fan and a water cooler heat dissipation element.
  • the thermal conductive carrier 1 and the heat source 2 are combined with each other through a adhesive 11 .
  • the carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 is at least disposed on the other face of the thermal conductive carrier 1 , i.e. the face where the thermal conductive carrier and the air contact to each other. As such, a novel thermal transfer catalytic heat dissipation structure.
  • a heat is produced from the heat source 2 and transferred outwards, in which the heat source 2 may be but not only limited to a central processing unit, a graphic chip, LED chip, a solar energy chip, and an internal combustion engine.
  • the heat from the heat source 2 is absorbed by the thermal conductive carrier 1 , and dissipated by the hexagonal carbon ringed carbon heat dissipation film 3 . Since when the heat from the heat source 1 transfers outwards, an thermal transfer path of thermal conductive adhesive 111 has a relatively lower thermal transfer coefficient and thus has relative lowered thermal transfer efficiency.
  • a thermal transfer path of thermal conductive carrier 112 of the thermal conductive carrier 1 has relative higher thermal transfer efficiency.
  • thermal transfer efficiency in the air is pretty low, highest and lowest thermal transfer efficiency will cause a thermal transfer gap or barrier at the interface between thermal conductive carrier 112 and air.
  • the carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 of the present invention may overcome effectively the bottleneck or barrier of the thermal transfer between the thermal conductive carrier 1 and the air, i.e. the nano heat dissipation film 113 is effectively used to transferred the heat from thermal conductive carrier 1 to the air, whereby effectively promoting the thermal transfer effect.
  • the volume and weight of the structure may be reduced, and a waste of the raw material, carbon, and energy consumption can be reduced.
  • FIG. 3 a cross sectional view showing the schematic diagram of a second embodiment according to the present invention is shown.
  • the present invention can further have the structure of the second embodiment, and the difference between the second and the first embodiments is that a high heat dissipation insulating layer 4 is combined between the thermal conductive carrier 1 and the heat source 2
  • the heat generated from the heat source 1 is transferred to the thermal conductive carrier 1 through the high heat dissipation insulating layer 4 .
  • a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly.
  • FIG. 4 a cross sectional view showing the schematic diagram of a third embodiment according to the present invention is shown.
  • the present invention can further have the structure of the third embodiment, and the difference of the third and the first embodiments is that a carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 a is combined between the thermal conductive carrier 1 and the heat source 2 .
  • the heat generated from the heat source 1 is transferred to the thermal conductive carrier 1 through the first carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 a .
  • a second carbon nanoparticles which have hexagonal carbon ring geometry based heat dissipation film 3 is used together to dissipate the heat, whereby achieving in the efficacy of promoting the thermal transfer efficiency and effectively reducing thermal transfer bottleneck, similarly.
  • the present invention can further satisfy a requirement for a practical use.
US14/288,516 2013-12-11 2014-05-28 Thermal transfer catalytic heat dissipation structure Abandoned US20150159969A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102223395 2013-12-11
TW102223395U TWM483543U (zh) 2013-12-11 2013-12-11 熱傳遞催化散熱結構

Publications (1)

Publication Number Publication Date
US20150159969A1 true US20150159969A1 (en) 2015-06-11

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US14/288,516 Abandoned US20150159969A1 (en) 2013-12-11 2014-05-28 Thermal transfer catalytic heat dissipation structure

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US (1) US20150159969A1 (zh)
CN (1) CN204131895U (zh)
TW (1) TWM483543U (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180151463A1 (en) * 2016-11-26 2018-05-31 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US10790228B2 (en) 2016-11-26 2020-09-29 Texas Instruments Incorporated Interconnect via with grown graphitic material
US10811334B2 (en) 2016-11-26 2020-10-20 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure in interconnect region
US10861763B2 (en) 2016-11-26 2020-12-08 Texas Instruments Incorporated Thermal routing trench by additive processing
US11004680B2 (en) 2016-11-26 2021-05-11 Texas Instruments Incorporated Semiconductor device package thermal conduit
US11676880B2 (en) 2016-11-26 2023-06-13 Texas Instruments Incorporated High thermal conductivity vias by additive processing

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827588B2 (ja) * 2017-08-01 2021-02-10 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． 照明デバイス、及び照明デバイスを製造する方法
CN110491846B (zh) * 2019-07-16 2021-01-15 广东埃文低碳科技股份有限公司 一种采用微热发电机的芯片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US7542290B2 (en) * 2006-09-26 2009-06-02 Hewlett-Packard Development Company, L.P. Computer device cooling system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US7542290B2 (en) * 2006-09-26 2009-06-02 Hewlett-Packard Development Company, L.P. Computer device cooling system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180151463A1 (en) * 2016-11-26 2018-05-31 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US10529641B2 (en) * 2016-11-26 2020-01-07 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US10790228B2 (en) 2016-11-26 2020-09-29 Texas Instruments Incorporated Interconnect via with grown graphitic material
US10811334B2 (en) 2016-11-26 2020-10-20 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure in interconnect region
US10861763B2 (en) 2016-11-26 2020-12-08 Texas Instruments Incorporated Thermal routing trench by additive processing
US11004680B2 (en) 2016-11-26 2021-05-11 Texas Instruments Incorporated Semiconductor device package thermal conduit
US11676880B2 (en) 2016-11-26 2023-06-13 Texas Instruments Incorporated High thermal conductivity vias by additive processing

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Publication number Publication date
CN204131895U (zh) 2015-01-28
TWM483543U (zh) 2014-08-01

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Owner name: TCY-TEC CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LU, HUNG-CHIH;YANG, CHUNG-PIN;REEL/FRAME:032974/0963

Effective date: 20140512

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION