US20150021513A1 - Cmp slurry composition for polishing an organic layer and method of forming a semiconductor device using the same - Google Patents
Cmp slurry composition for polishing an organic layer and method of forming a semiconductor device using the same Download PDFInfo
- Publication number
- US20150021513A1 US20150021513A1 US14/311,857 US201414311857A US2015021513A1 US 20150021513 A1 US20150021513 A1 US 20150021513A1 US 201414311857 A US201414311857 A US 201414311857A US 2015021513 A1 US2015021513 A1 US 2015021513A1
- Authority
- US
- United States
- Prior art keywords
- acid
- polishing
- layer
- slurry composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 111
- 238000005498 polishing Methods 0.000 title claims abstract description 102
- 239000012044 organic layer Substances 0.000 title claims abstract description 70
- 239000002002 slurry Substances 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title abstract description 63
- 239000004065 semiconductor Substances 0.000 title abstract description 37
- 239000010410 layer Substances 0.000 claims abstract description 133
- 239000002245 particle Substances 0.000 claims abstract description 38
- 239000007800 oxidant agent Substances 0.000 claims abstract description 33
- 239000004094 surface-active agent Substances 0.000 claims abstract description 27
- 230000001590 oxidative effect Effects 0.000 claims abstract description 26
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000126 substance Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 54
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 25
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 24
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 18
- XTEGARKTQYYJKE-UHFFFAOYSA-N chloric acid Chemical compound OCl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-N 0.000 claims description 18
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 16
- -1 dioxygenyl Chemical compound 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 14
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 14
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims description 14
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 13
- 229910017604 nitric acid Inorganic materials 0.000 claims description 13
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 claims description 12
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 12
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 150000007522 mineralic acids Chemical class 0.000 claims description 8
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001413 amino acids Chemical class 0.000 claims description 7
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 claims description 7
- 150000002978 peroxides Chemical class 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 6
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 6
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 6
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 6
- 235000019253 formic acid Nutrition 0.000 claims description 6
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- LEHBURLTIWGHEM-UHFFFAOYSA-N pyridinium chlorochromate Chemical compound [O-][Cr](Cl)(=O)=O.C1=CC=[NH+]C=C1 LEHBURLTIWGHEM-UHFFFAOYSA-N 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims description 5
- 229910002651 NO3 Inorganic materials 0.000 claims description 5
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 5
- 125000000129 anionic group Chemical group 0.000 claims description 5
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims description 5
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- 229910002567 K2S2O8 Inorganic materials 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 4
- 229960000686 benzalkonium chloride Drugs 0.000 claims description 4
- 229940077388 benzenesulfonate Drugs 0.000 claims description 4
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 claims description 4
- 229910001919 chlorite Inorganic materials 0.000 claims description 4
- 229910052619 chlorite group Inorganic materials 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- JGTNAGYHADQMCM-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-M 0.000 claims description 3
- YFSUTJLHUFNCNZ-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YFSUTJLHUFNCNZ-UHFFFAOYSA-M 0.000 claims description 3
- SNGREZUHAYWORS-UHFFFAOYSA-M 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluorooctanoate Chemical compound [O-]C(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-M 0.000 claims description 3
- UZUFPBIDKMEQEQ-UHFFFAOYSA-M 2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,9-heptadecafluorononanoate Chemical compound [O-]C(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F UZUFPBIDKMEQEQ-UHFFFAOYSA-M 0.000 claims description 3
- CDOUZKKFHVEKRI-UHFFFAOYSA-N 3-bromo-n-[(prop-2-enoylamino)methyl]propanamide Chemical compound BrCCC(=O)NCNC(=O)C=C CDOUZKKFHVEKRI-UHFFFAOYSA-N 0.000 claims description 3
- 229940046305 5-bromo-5-nitro-1,3-dioxane Drugs 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004475 Arginine Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004471 Glycine Substances 0.000 claims description 3
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- 150000001298 alcohols Chemical class 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 claims description 3
- 229940063953 ammonium lauryl sulfate Drugs 0.000 claims description 3
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 claims description 3
- 235000010323 ascorbic acid Nutrition 0.000 claims description 3
- 229960005070 ascorbic acid Drugs 0.000 claims description 3
- 239000011668 ascorbic acid Substances 0.000 claims description 3
- UREZNYTWGJKWBI-UHFFFAOYSA-M benzethonium chloride Chemical compound [Cl-].C1=CC(C(C)(C)CC(C)(C)C)=CC=C1OCCOCC[N+](C)(C)CC1=CC=CC=C1 UREZNYTWGJKWBI-UHFFFAOYSA-M 0.000 claims description 3
- XVBRCOKDZVQYAY-UHFFFAOYSA-N bronidox Chemical compound [O-][N+](=O)C1(Br)COCOC1 XVBRCOKDZVQYAY-UHFFFAOYSA-N 0.000 claims description 3
- 229960000800 cetrimonium bromide Drugs 0.000 claims description 3
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 claims description 3
- 229940005991 chloric acid Drugs 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 229940077239 chlorous acid Drugs 0.000 claims description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 3
- 150000001845 chromium compounds Chemical class 0.000 claims description 3
- 229940117975 chromium trioxide Drugs 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 claims description 3
- PSLWZOIUBRXAQW-UHFFFAOYSA-M dimethyl(dioctadecyl)azanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC PSLWZOIUBRXAQW-UHFFFAOYSA-M 0.000 claims description 3
- REZZEXDLIUJMMS-UHFFFAOYSA-M dimethyldioctadecylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC REZZEXDLIUJMMS-UHFFFAOYSA-M 0.000 claims description 3
- 235000019329 dioctyl sodium sulphosuccinate Nutrition 0.000 claims description 3
- SMVRDGHCVNAOIN-UHFFFAOYSA-L disodium;1-dodecoxydodecane;sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC SMVRDGHCVNAOIN-UHFFFAOYSA-L 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- 229940074046 glyceryl laurate Drugs 0.000 claims description 3
- 150000002366 halogen compounds Chemical class 0.000 claims description 3
- IRHTZOCLLONTOC-UHFFFAOYSA-N hexacosan-1-ol Chemical class CCCCCCCCCCCCCCCCCCCCCCCCCCO IRHTZOCLLONTOC-UHFFFAOYSA-N 0.000 claims description 3
- 229960002050 hydrofluoric acid Drugs 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004310 lactic acid Substances 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 239000001272 nitrous oxide Substances 0.000 claims description 3
- YYELLDKEOUKVIQ-UHFFFAOYSA-N octaethyleneglycol monododecyl ether Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCO YYELLDKEOUKVIQ-UHFFFAOYSA-N 0.000 claims description 3
- SMGTYJPMKXNQFY-UHFFFAOYSA-N octenidine dihydrochloride Chemical compound Cl.Cl.C1=CC(=NCCCCCCCC)C=CN1CCCCCCCCCCN1C=CC(=NCCCCCCCC)C=C1 SMGTYJPMKXNQFY-UHFFFAOYSA-N 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 150000002924 oxiranes Chemical class 0.000 claims description 3
- WURFKUQACINBSI-UHFFFAOYSA-M ozonide Chemical compound [O]O[O-] WURFKUQACINBSI-UHFFFAOYSA-M 0.000 claims description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 3
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 claims description 3
- FHHJDRFHHWUPDG-UHFFFAOYSA-N peroxysulfuric acid Chemical compound OOS(O)(=O)=O FHHJDRFHHWUPDG-UHFFFAOYSA-N 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229950008882 polysorbate Drugs 0.000 claims description 3
- 229920000136 polysorbate Polymers 0.000 claims description 3
- 239000012286 potassium permanganate Substances 0.000 claims description 3
- ARIWANIATODDMH-UHFFFAOYSA-N rac-1-monolauroylglycerol Chemical compound CCCCCCCCCCCC(=O)OCC(O)CO ARIWANIATODDMH-UHFFFAOYSA-N 0.000 claims description 3
- 108700004121 sarkosyl Proteins 0.000 claims description 3
- KSAVQLQVUXSOCR-UHFFFAOYSA-M sodium lauroyl sarcosinate Chemical compound [Na+].CCCCCCCCCCCC(=O)N(C)CC([O-])=O KSAVQLQVUXSOCR-UHFFFAOYSA-M 0.000 claims description 3
- 229940045885 sodium lauroyl sarcosinate Drugs 0.000 claims description 3
- MDSQKJDNWUMBQQ-UHFFFAOYSA-M sodium myreth sulfate Chemical compound [Na+].CCCCCCCCCCCCCCOCCOCCOCCOS([O-])(=O)=O MDSQKJDNWUMBQQ-UHFFFAOYSA-M 0.000 claims description 3
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 claims description 3
- 229960001922 sodium perborate Drugs 0.000 claims description 3
- YKLJGMBLPUQQOI-UHFFFAOYSA-M sodium;oxidooxy(oxo)borane Chemical compound [Na+].[O-]OB=O YKLJGMBLPUQQOI-UHFFFAOYSA-M 0.000 claims description 3
- 239000003760 tallow Substances 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 claims description 3
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 3
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims 1
- 230000015654 memory Effects 0.000 description 24
- 239000000377 silicon dioxide Substances 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 22
- 239000000758 substrate Substances 0.000 description 13
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- 238000007517 polishing process Methods 0.000 description 8
- 230000010365 information processing Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 5
- DFGKGUXTPFWHIX-UHFFFAOYSA-N 6-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]acetyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)C1=CC2=C(NC(O2)=O)C=C1 DFGKGUXTPFWHIX-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 150000002823 nitrates Chemical class 0.000 description 5
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 2
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000003826 tablet Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31058—After-treatment of organic layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0338—Process specially adapted to improve the resolution of the mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
- H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Definitions
- Example embodiments of the inventive concept relate to a chemical mechanical polishing (CMP) slurry composition for polishing a layer and method of forming a semiconductor device using the same.
- CMP chemical mechanical polishing
- an organic layer containing a hydrocarbon compound has a good etch selectivity with respect to a silicon-containing layer, and thus, the organic layer containing the hydrocarbon compound can be used as a mask layer or as a sacrificial layer.
- Etch selectivity is the ratio of the etch rates between two different materials, in this case between the organic layer and the silicon-containing layer.
- Example embodiments of the inventive concept provide a CMP slurry composition capable of effectively polishing an organic layer.
- the CMP slurry composition is usable in the manufacture of V-NAND flash memory devices or for polishing a hydrocarbon layer using double patterning technology (DPT).
- DPT double patterning technology
- a chemical mechanical polishing (CMP) slurry composition for polishing a low silicon layer such as, for example, an organic layer or a silicon-free organic layer
- CMP chemical mechanical polishing
- a low silicon layer such as, for example, an organic layer or a silicon-free organic layer
- a chemical mechanical polishing (CMP) slurry composition for polishing a low silicon layer may include from about0.001% to about 5% by weight of oxide-polishing particles; from about 0.1% to about 5% by weight of an oxidant; from about 0% to about 5% by weight of a polishing regulator; from about 0% to about 3% by weight of a surfactant; from about 0% to about 3% by weight of a pH regulator; and from about 79% to about 99.889% by weight of deionized water.
- the polishing particle may include at least one of silica (SiO 2 ), ceria (CeO 2 ), and alumina (Al 2 O 3 ).
- the polishing particle has a grain size ranging from about 30 nm to about 120 nm.
- the oxidant may include at least one of hydrogen peroxide, superoxide, dioxygenyl, ozone, ozonide, peroxide, fluorine, chlorine, chlorite, chlorate, perchlorate, halogen compounds, nitric acid, nitrate, hypochlorite, hypohalite, chromium trioxide, pyridinium chlorochromate, chromate, dichromate, chromium compound, potassium permanganate, permanganate, sodium perborate, nitrous oxide, 2,2′-dipyridisulfide, lead dioxide (PbO 2 ), manganese dioxide (MnO 2 ), copper oxide (CuO), ferric trichloride (FeCl 3 ), perchloric acid (HClO 4 ), ferric nitrate (Fe(NO) 3 ), sulfate and potassium persulfate (K 2 S 2 O 8 )
- the polishing regulator may include at least one of organic acid, inorganic acid, nitric acid, nitrate, sulfuric acid, peroxydisulfuric acid, peroxymonosulfuric acid, sulfonic acid, acetic acid, citric acid, formic acid, gluconic acid, lactic acid, oxalic acid, tartaric acid, carboxylic acid, chloric acid, chlorous acid, hypochlorous acid, perchloric acid, halogen oxoacid, ascorbic acid, vinylogous carboxylic acid, amino acid, histidine, glycine, arginine, hydrochloric acid, fluoric acid and phosphoric acid.
- the surfactant may be anionic or non-ionic.
- the surfactant may include at least one of lauryl myristyl alcohol series, methyl-oxirane polymer series, whose hydrophile lipophile balance (HLB) may be 12 or higher, ethylenediamine, ethoxylated and propoxylated alcohol series, 2-methyloxirane, oxirane series, polyethylene glycol, and polysorbate series.
- HLB hydrophile lipophile balance
- the surfactant may further include at least one of benzalkonium chloride, alkyl benzene sulfonate, phemerol chloride, ammonium lauryl sulfate, sodium lauryl ether sulfate, sodium myreth sulfate, dioctyl sodium sulfosuccinate, perfluorooctanesulfonate, perfluorobutanesulfonate, linear alkylbenzene sulfonate, sodium stearate, sodium lauroyl sarcosinate, cetyl trimethylammonium bromide, cetyl trimethylammonium chloride, perfluorononanoate, perfluorooctanoate, octenidine dihydrochloride, 5-bromo-5-nitro-1,3-dioxane, dimethyldioctadecylammonium chloride, cetrimonium bromide, dioctadec
- the pH regulator may include at least one acidic material from poly acrylic acid, carboxylic acid, nitric acid, sulfuric acid and sulfonic acid or at least one basic material from potassium hydroxide, sodium hydroxide, ammonia water, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabuthylammonium hydroxide.
- a method of fabricating a semiconductor device may include forming a first structure having a first recess region on a substrate, forming a low silicon layer such as, for example, an organic layer or a silicon-free organic layer on the first structure to fill the first recess region, and performing a CMP process using the CMP slurry composition on the organic layer to expose a top surface of the first structure.
- the composition may have a pH in the range of 2.0 ⁇ 5.0.
- the first recess region may be formed to include a first hole exposing the substrate, and the method may further include, after performing the CMP process on the organic layer, forming a second structure including a second hole exposing a top surface of the organic layer on the first structure, removing the organic layer through the second hole, forming an active pillar covering at least sidewalls of the first and second holes, and forming a conductive line in the first and second structures.
- each of the first and second structures may be formed to include a plurality of insulating layers and a plurality of sacrificial layers that may be alternatively stacked on the substrate, and the forming of the conductive line in the first and second structures may include selectively removing the sacrificial layers to form an inter-layered empty region, and forming the conductive line in the inter-layered empty region.
- the first structure may include etch-target layer provided on the substrate, a plurality of line-shaped first mask patterns provided parallel to each other on the etch-target layer, and a second mask layer conformally covering side and top surfaces of the first mask patterns, the second mask layer may have the first recess region between the first mask patterns, and exposing the top surface of the first structure may be performed to expose a top surface of the second mask layer.
- a space between the first mask patterns may be about three times a thickness of the second mask layer, and the organic layer may be disposed between the first mask patterns.
- the method may further include an anisotropic etching process to remove the exposed second mask layer and form a second mask pattern below the organic layer.
- an oxide layer may be provided on the first structure, and the CMP slurry composition may be configured to allow the organic layer to be polished with respect to the oxide layer with a selectivity higher than about 6:1.
- the removing of the portion of the organic layer may be performed not to expose a top surface of the first structure.
- a chemical mechanical polishing (CMP) slurry composition includes a first concentration of oxide-polishing particles, a second concentration of an oxidant, a third concentration of a polishing regulator, a fourth concentration of a surfactant, a fifth concentration of a pH regulator, and a sixth concentration of deionized water, the slurry composition being configured to etch a first type of layer at a different rate than a second type of layer.
- the first type of layer is an oxide layer and the second type of layer comprises an organic layer, an etch selectivity of the oxide layer with respect to the organic layer is in a range between 6:1 and 430:1, and the organic layer is a mask layer.
- FIGS. 1 , 2 A, and 2 B are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments.
- FIGS. 3 through 10 are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments.
- FIGS. 11 to 17 are sectional views illustrating a process of fabricating a semiconductor device, according to other example embodiments.
- FIG. 18 is a schematic block diagram illustrating an example of memory systems including a semiconductor device fabricated by the process of example embodiments.
- FIG. 19 is a schematic block diagram illustrating an example of memory cards including a semiconductor device fabricated by the process of example embodiments.
- FIG. 20 is a schematic block diagram illustrating an example of information processing systems including a semiconductor device fabricated by the process of example embodiments.
- Example embodiments will now be described more fully with reference to the accompanying drawings, in which example embodiments are shown.
- Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those of ordinary skill in the art.
- the thicknesses of layers and regions are exaggerated for clarity.
- Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
- first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
- Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region.
- a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place.
- the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
- the cross-sectional view(s) of device structures illustrated herein provide support for a plurality of device structures that extend along two different directions as would be illustrated in a plan view, and/or in three different directions as would be illustrated in a perspective view.
- the two different directions may or may not be orthogonal to each other.
- the three different directions may include a third direction that may be orthogonal to the two different directions.
- the plurality of device structures may be integrated in a same electronic device.
- an electronic device may include a plurality of the device structures (e.g., memory cell structures or transistor structures), as would be illustrated by a plan view of the electronic device.
- the plurality of device structures may be arranged in an array and/or in a two-dimensional pattern.
- a fabrication process to be described below may be applied to a nonvolatile memory device (for example, having a three-dimensional V-NAND flash memory structure or for polishing a hydrocarbon layer using double patterning technology (DPT)).
- a nonvolatile memory device for example, having a three-dimensional V-NAND flash memory structure or for polishing a hydrocarbon layer using double patterning technology (DPT)).
- DPT double patterning technology
- FIGS. 1 , 2 A, and 2 B are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments of the inventive concept.
- a structure 110 may be formed on a substrate 100 to include a recessed region 115 .
- the structure 110 may include a top portion 112 made of oxide.
- An organic layer 120 may be formed on the structure 110 .
- the organic layer 120 may be referred to as a spin-on-carbon layer or a spin-on-hard mask layer.
- the organic layer 120 may also be a low silicon layer such as, for example, an organic layer or a silicon-free organic layer.
- the formation of the organic layer 120 may include a spin-coating step and a drying or baking step.
- the organic layer 120 may be formed to fill the recessed region 115 .
- a polishing process may be performed to polish the organic layer 120 , according to at least one example embodiment.
- the process may be performed to remove a portion of the organic layer 120 from a top surface of the structure 110 .
- the polishing process may be a chemical-mechanical polishing (CMP) process.
- CMP chemical-mechanical polishing
- an organic pattern 120 a may be formed on the structure 110 to have a predetermined thickness.
- the polishing process may be performed in such a way that the top surface of the structure 110 is exposed and the organic pattern 120 a remains in the recessed region 115 .
- the CMP process may be performed using a CMP slurry composition including, for example, from about 0.001% to about 5% by weight of oxide-polishing particles; from about 0.1% to about 5% by weight of an oxidant; from 0% to about 5% by weight of a polishing regulator; from 0% to about 3% by weight of a surfactant; from 0% to about 3% by weight of a pH regulator; and from about 79% to about 99.889% by weight of deionized water.
- a CMP slurry composition including, for example, from about 0.001% to about 5% by weight of oxide-polishing particles; from about 0.1% to about 5% by weight of an oxidant; from 0% to about 5% by weight of a polishing regulator; from 0% to about 3% by weight of a surfactant; from 0% to about 3% by weight of a pH regulator; and from about 79% to about 99.889% by weight of deionized water.
- the polishing particle may include at least one of silica (SiO 2 ), ceria (CeO 2 ), and alumina (Al 2 O 3 ).
- the polishing particle may be provided to have a grain size ranging from about 10 nm to about 100 nm and preferably ranging from about 30 nm to about 120 nm.
- the oxidant may induce oxidation of the organic layer, which allows to obtain a desired polishing rate.
- the oxidant may include at least one of peroxide series (e.g., hydrogen peroxide, superoxide, dioxygenyl, ozone, and ozonide), halogen series (e.g., fluorine and chlorine), halogen compound series (e.g., chlorite, chlorate and perchlorate), nitrate series (e.g., nitric acid), hypochlorite or hypohalite series (e.g., home cleaner), chromium compound series (e.g., chromium trioxide, pyridinium chlorochromate, chromate, and dichromate), permanganate series (e.g., potassium permanganate), a metal compound having a high oxidation number (e.g., lead dioxide(PbO 2 ), manganese dioxide(MnO 2 ), copper oxide(CuO), ferric trichloride
- the chlorite or the chlorate series may be used as the oxidant.
- the polishing regulator may cut carbon chains in the organic layer.
- Organic or inorganic acid may be used as the polishing regulator.
- the polishing regulator may include at least one of nitrate series (e.g., nitric acid), sulfonic series (e.g., sulfuric acid, peroxydisulfuric acid, and peroxymonosulfuric acid), carboxylic acid series (e.g., acetic acid, citric acid, formic acid, gluconic acid, lactic acid, oxalic acid, and tartaric acid), halogen oxoacid series (e.g., chloric acid, chlorous acid, hypochlorous acid, and perchloric acid), vinylogous carboxylic acid series (e.g., ascorbic acid), amino acid series (e.g., histidine, glycine, and arginine) and inorganic acid (e.g., hydrochloric acid, fluoric acid and phosphoric acid).
- the surfactant may improve wettability on a surface of the organic layer of the CMP slurry composition and thereby increase the polishing rate.
- the surfactant may be anionic or non-ionic.
- the surfactant may include at least one of lauryl myristyl alcohol series, methyl-oxirane polymer series, whose hydrophile lipophile balance (HLB) is 12 or higher, ethylenediamine, C1-16 ethoxylated and propoxylated alcohol series, 2-methyloxirane, oxirane series, polyethylene glycol, or polysorbate series.
- the surfactant may include at least one of benzalkonium chloride, alkyl benzene sulfonate, phemerol chloride, ammonium lauryl sulfate, sodium lauryl ether sulfate, sodium myreth sulfate, dioctyl sodium sulfosuccinate, perfluorooctanesulfonate, perfluorobutanesulfonate, linear alkylbenzene sulfonate, sodium stearate, sodium lauroyl sarcosinate, cetyl trimethylammonium bromide, cetyl trimethylammonium chloride, perfluorononanoate, perfluorooctanoate, octenidine dihydrochloride, 5-bromo-5-nitro-1,3-dioxane, dimethyldioctadecylammonium chloride, cetrimonium bromide, dioctadec
- the pH regulator may control pH of the CMP slurry composition. Since the polishing regulator includes acid, it may also serve as a pH regulator.
- the pH regulator may be acid or basic.
- the pH regulator may include acid materials, such as poly acrylic acid, carboxylic acid, nitric acid, sulfuric acid and sulfonic acid, or basic materials, such as potassium hydroxide, sodium hydroxide, ammonia water, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabuthylammonium hydroxide.
- the CMP slurry composition preferably may have a pH in the range 2.0 ⁇ 5.0.
- CMP slurry compositions serving as polishing agent are prepared to contain about 1% by weight of silica, about 98% by weight of deionized water, and about 1% by weight of an oxidant.
- the type of oxidant contained in the CMP slurry compositions is changed to peroxide series, chlorate, nitrate series, and compounds having a high oxidation number.
- hydrogen peroxide is used as one of the peroxide series.
- Perchloric acid(HClO 4 ) is used as one of the chlorate series.
- Ferric nitrate(Fe(NO) 3 ) is used as one of the nitrate series.
- the compounds having a high oxidation number mean a compound of metal such as lead dioxide(PbO 2 ), manganese dioxide(MnO 2 ), copper oxide(CuO), ferric trichloride(FeCl 3 ).
- ferric trichloride(FeCl 3 ) is used as one of the compounds having a high oxidation number.
- Mean grain size of the silica is about 60 nm.
- CMP processes are performed on the eight wafers using respective CMP slurry compositions. The following Table 1 shows experiment results (e.g., polishing rate and selectivity) measured after the CMP processes.
- polishing rate and selectivity are the highest for the chlorate series.
- the selectivity is higher than 6:1 for other oxidants (e.g., peroxide or nitrate series), which illustrates the fact that other oxidants can also be effectively used as antioxidants in the polishing process of an organic layer.
- polishing properties according to contents of the chlorate series and the silica are examined, when the chlorate series and the silica are used as the oxidant and the polishing particles, respectively.
- 34 wafers are prepared. Silicon-free organic layers are formed on 17 wafers, and TEOS layers, one of silicon oxide series, are formed on the remaining 17 wafers.
- the chlorate series having concentrations of 0.1 wt %-3.0 wt % and the silica having concentrations of 0.01 wt %-1.0 wt % are used as the oxidant and polishing particle of the CMP slurry composition, respectively.
- polishing properties are measured. Table 2 shows the measurement results.
- perchloric acid(HClO 4 ) is used as one of the chlorate series.
- the mean grain size of the silica is about 60 nm.
- the highest etch selectivity of 397.4 is obtained when the chlorate series had an oxidant content of 3 wt %, and the silica polishing particle had a concentration of 0.01 wt %. Furthermore, other combinations of concentrations of oxidant and polishing particles provided etch selectivities higher than 6, which illustrate the fact that the other combinations can also be effectively used for a polishing process of an organic layer.
- polishing properties according to the type and content of the polishing regulator are examined, when 1.0 wt % chlorate series and 0.4 wt % silica are used as the oxidant and the polishing particles of the CMP slurry composition.
- eighteen wafers are prepared. Silicon-free organic layers are formed on nine wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining nine wafers.
- the carboxylic acid having contents of 0.1 wt %-1.0wt % are used as the polishing regulator or sulfonic acid, amino acid, inorganic acid, and nitric acid are used in place of the carboxylic acid.
- polishing properties are measured. Table 3 shows the measurement results.
- perchloric acid(HClO 4 ) is used as one of the chlorate series.
- Formic acid is used as one of the carboxylic acid.
- Histidine is used as one of the amino acids.
- Hydrochloric acid is used as one of the inorganic acid.
- Mean grain size of the silica is about 60 nm.
- the highest selectivity of 79.5 is obtained when the CMP slurry composition is formed to contain 1.0 wt % of chlorate-series for the oxidant, 0.4 wt % of silica for the polishing particles, 1.0 wt % of carboxylic acid for the polishing regulator, and deionized water being the remaining content.
- the selectivity is higher than 38, which illustrates the fact that the other types of polishing regulators can be effectively used for the polishing process of an organic layer.
- polishing properties according to the type and content of the polishing regulator are examined, when 1.0 wt % of chlorate series and 0.2 wt % of silica are used as the oxidant and the polishing particles of the CMP slurry composition, respectively.
- six wafers are prepared. Silicon-free organic layers are formed on three wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining three wafers.
- carboxylic acids having the contents of 0.7 wt %, 1.0 wt %, and 1.3 wt % are used as the polishing regulator.
- polishing properties are measured. Table 4 shows the measurement results. .
- perchloric acid(HClO 4 ) is used as one of the chlorate series.
- Formic acid is used as one of the carboxylic acid.
- Mean grain size of the silica is about 60 nm.
- substantially high selectivities of 108.3-210.0 are obtained when 1.0 wt % of chlorate-based oxidant, 0.2 wt % of silica for the polishing particles, 0.7-1.3 wt % of carboxylic acids for the polishing regulator are used.
- polishing properties according to the type of the surfactant are examined, when 1.0 wt % of the oxidant of chlorate series, 0.4 wt % of the polishing particles of silica, and 0.3 wt % of carboxylic acid are used for the CMP slurry composition.
- cationic, anionic, and non-ionic surfactants are added in the CMP slurry composition. Firstly, six wafers are prepared. Silicon-free organic layers are formed on three wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining three wafers. Next, CMP slurry compositions are formed to contain surfactants that are different from each other, as described above.
- the contents of the added surfactants are 0.5 wt % relative to the total weight of the composition.
- CMP processes are performed to the wafers using the CMP slurry compositions, respectively.
- Table 5 shows experimental results measured after the CMP processes.
- perchloric acid(HClO 4 ) is used as one of the chlorate series.
- Formic acid is used as one of the carboxylic acid.
- Histidine is used as one of the amino acid.
- Hydrochloric acid is used as one of the inorganic acid.
- Mean grain size of the silica is about 60 nm.
- Benzalkonium chloride is used as one of the cationic surfactants.
- Alkyl benzene sulfonate is used as one of the anionic surfactants.
- Polyethylene glycol is used as one of the non-ionic surfactants.
- the highest selectivity of 102 is obtained, when the non-ionic surfactant is added. Regardless of the type of the surfactant, a high selectivity of 56 or higher is obtained by merely adding a surfactant. The non-ionic surfactant produced the highest selectivity, and the second highest selectivity is produced by the anionic surfactant at a selectivity of 73. Further, a peeling phenomenon on a surface of the organic layer is significantly improved when the surfactant is added with respect to when the surfactant is not added. The presence of the surfactant may make it possible to improve wettability of the CMP composition on a surface of the organic layer. By virtue to the improved wettability of the CMP composition, the polishing process may be performed on the surface with increased uniformity. The improvement of the peeling phenomenon may result from the improved wettability of the CMP composition.
- polishing selectivities are examined by varying pH of the CMP composition.
- silica having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and perchloric acid(HClO 4 ) is subsequently added as one of the oxidants with a concentration of about 1.0 wt. %, thereby forming 8 composition samples with a pH of about 2.1.
- pH regulators may then be added into 7 composition samples out of the total 8 composition samples, respectively, with a concentration less than 3 wt. %.
- nitric acid is added as a pH regulator into two composition samples, thereby decreasing pH of the two composition samples to 1. 8 and 2.0, respectively.
- potassium hydroxide is added as a pH regulator into five composition samples, thereby increasing pH of the five composition samples to 2.2, 2.4, 2.6, 2.8, 3.0, respectively.
- CMP processes are performed to organic layers and TEOS layers using the 8 CMP slurry composition samples, respectively.
- Table 6 shows experimental results measured after the CMP processes.
- a preferable pH of the CMP composition of the experimental example 5-1 is about 2.1 ⁇ 2.6 in the condition of 0.5 wt. % of silica and 1.0 wt. % of perchloric acid.
- polishing particle stabilities are examined by varying the pH of the CMP composition.
- silica having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and potassium persulfate (K 2 S 2 O 8 ) is subsequently added as one of the oxidants with a concentration of about 0.3 wt. %, thereby forming 3 composition samples with a pH of about 4.2.
- pH regulators are subsequently added into 2 composition samples out of the total 3 composition samples, respectively, with a concentration less than 3 wt. %.
- a preferable pH of the CMP composition of the experimental example 5-2 is about 3.5 ⁇ 5.0 in the condition of 0.5 wt. % of silica and 0.3 wt. % of potassium persulfate.
- polishing particle stabilities are examined by varying pH of the CMP composition.
- ceria having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and ferric nitrate (Fe(NO) 3 ) is subsequently added as one of the oxidants with a concentration of about 0.3 wt. %, thereby forming 3 composition samples with a pH of about 2.1.
- pH regulators are added into 2 composition samples out of the total 3 composition samples, respectively, with a concentration less than 3 wt. %.
- nitric acid is added as a pH regulator into one composition sample and the adding amount of the sulfuric acid is increased incrementally, by checking pH of the one composition sample and by macroscopically examining the polishing particle stability.
- pH of the CMP composition of the experimental example 5-3 is lower than 2.0, the polishing particle stability is poor.
- potassium hydroxide is added as a pH regulator into another composition sample and the adding amount of the potassium hydroxide is increased incrementally, by checking pH of the another composition sample and by macroscopically examining the polishing particle stability.
- the pH of the CMP composition of the experimental example 5-3 is higher than 2.8, the polishing particle stability is poor. Therefore, a preferable pH of the CMP composition of the experimental example 5-3 is about 2.0 ⁇ 2.8 in the condition of 0.5 wt. % of ceria and 0.3 wt. % of ferric nitrate.
- polishing selectivities are examined by varying a grain size of silica.
- silica is added in the composition with a concentration of about 0.5 wt. %, and perchloric acid(HClO 4 ) is subsequently added as one of the oxidants with a concentration of about 1.0 wt. %, thereby forming 4 composition samples.
- the grain sizes of silica in the 4 composition samples are 30 nm, 60 nm, 80 nm, and 120 nm, respectively.
- CMP processes are performed to organic layers and TEOS layers using the 4 CMP slurry composition samples, respectively.
- Table 7 shows experimental results measured after the CMP processes.
- polishing selectivities are examined by varying a grain size of ceria.
- ceria is added in the composition with a concentration of about 0.05 wt. %, and ferric nitrate is subsequently added as one of the oxidants with a concentration of about 3.0 wt. %, thereby forming 3 composition samples.
- the grain sizes of ceria in the 3 composition samples are 30 nm, 60 nm and 80 nm, respectively.
- CMP processes are performed to organic layers and TEOS layers using the 4 CMP slurry composition samples, respectively.
- Table 8 shows experimental results measured after the CMP processes.
- the CMP composition can be formed in such a way that an etch selectivity between the organic layer and the oxide layer is in a range of from about 6:1 to about 430:1.
- a CMP composition having an etch selectivity suitable for a desired semiconductor device can be used in the CMP process.
- the CMP composition may be used in a process of fabricating a semiconductor device. An example of such processes will be described in more detail below.
- FIGS. 3 through 10 are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments of the inventive concept.
- first gate interlayered insulating layers 3 and first sacrificial layers 5 may be alternatively stacked on a substrate 1 to form a first structure 10 , according to at least one example embodiment.
- the first sacrificial layers 5 may be formed of a material having an etch selectivity with respect to the first gate interlayered insulating layers 3 .
- the first gate interlayered insulating layers 3 may be silicon oxide layers, and the first sacrificial layers 5 may be silicon nitride layers.
- the first sacrificial layers 5 and the first gate interlayered insulating layers 3 may be sequentially etched to form first holes 12 , thus exposing the substrate 1 .
- a silicon-free organic layer 14 may be formed on the first structure 10 to fill the first holes 12 , according to at least one example embodiment.
- a CMP process using the CMP composition may be performed on the organic layer 14 to remove the organic layer 14 from a top surface of the first structure 10 and expose the uppermost first gate interlayered insulating layer 3 , according to at least one example embodiment. Because the use of the CMP composition makes it possible to rapidly polish the organic layer with a high polishing selectivity with respect to an oxide layer, the CMP process can be quickly performed without process failure. As the result of the CMP process, organic patterns 14 a may remain in the first holes 12 .
- second gate interlayered insulating layers 23 and second sacrificial layers 25 may be alternatively stacked on the first structure 10 to form a second structure 20 , according to at least one example embodiment.
- the second sacrificial layers 25 may be formed of the same material as the first sacrificial layers 5 .
- the second gate interlayered insulating layers 23 may be formed of the same material as the first gate interlayered insulating layers 3 .
- the second sacrificial layers 25 and the second gate interlayered insulating layers 23 may be sequentially etched to form second holes 22 exposing the organic pattern 14 a .
- the organic pattern 14 a may make it possible to protect the first holes 12 and the substrate 1 thereunder.
- the stacking number of the structures may be three or more, according to various example embodiments.
- an ashing process using oxygen may be performed to selectively remove the organic pattern 14 a exposed by the second hole 22 , according to at least one example embodiment. Accordingly, the substrate 1 may be partially exposed through the first holes 12 .
- a polysilicon layer may be conformally formed on the substrate 1 , and a first insulating gapfill layer may be formed to fill the holes 12 and 22 , according to at least one example embodiment. Thereafter, a planarization etching process may be performed to form active pillars 27 and first insulating gapfill patterns 29 .
- the active pillars 27 may be formed in the holes 12 and 22 to cover the side and bottom surfaces thereof.
- the first insulating gapfill patterns 29 may be formed to fill the holes 12 and 22 after the active pillars 27 are formed. Thereafter, an ion implantation process may be performed to form drain regions 31 in upper portions of the active pillars 27 .
- the structures 20 and 10 may be patterned to form grooves 32 exposing the substrate 1 , according to at least one example embodiment.
- the grooves 32 may be formed and spaced apart from the active pillars 27 .
- the sacrificial layers 5 and 25 may be removed to form inter-layered empty regions.
- the grooves 32 may be used as paths for supplying etchant in the process of removing the sacrificial layers 5 and 25 .
- a gate insulating layer 34 may be conformally formed in the inter-layered empty regions, and a conductive layer may be formed to fill the inter-layered empty regions and the groove 32 .
- the gate insulating layer 34 may include a tunnel insulating layer, a charge-trap layer, and a blocking insulating layer.
- the conductive layer may be a doped polysilicon layer or a metal-containing layer.
- the conductive layer may be removed from the groove 32 to expose the substrate 1 .
- a lower selection line LSL, word lines WL 0 -WL 3 , and upper selection lines USL 0 and USL 1 may be formed in the inter-layered empty regions.
- an ion implantation process may be performed to form a common source line CSL below the groove 32 , according to at least one example embodiment.
- a second insulating gapfill layer may be formed to fill the grooves 32 , and then, be planarized to form second insulating gapfill patterns 34 remaining in the grooves 32 .
- a plurality of bit lines BL may be formed on the second gate interlayered insulating layer 23 .
- the bit lines BL may be connected to the drain region 31 and spaced apart from each other.
- the CMP composition according to example embodiments may be used to fabricate 3D vertical NAND FLASH memory devices.
- FIGS. 11 to 17 are sectional views illustrating a process of fabricating a semiconductor device, according to other example embodiments.
- an etch-target layer 53 may be formed on a substrate 51 , according to at least one example embodiment.
- the etch-target layer 53 may be formed of or include, for example, a silicon oxide layer, a silicon nitride layer, or a polysilicon layer.
- a first mask layer 55 may be formed on the etch-target layer 53 .
- the first mask layer 55 may be formed of a material (for example, a silicon-free organic material) having an etch selectivity with respect to the etch-target layer 53 .
- a second mask pattern 57 may be formed on the first mask layer 55 .
- the second mask pattern 57 may be formed of a material having an etch selectivity with respect to the first mask layer 55 .
- the second mask pattern 57 may be formed to have a width W 1 .
- the width W 1 may be substantially equal to a minimum line width that can be obtained by a photolithography process.
- the second mask patterns 57 may be formed to have a space W 2 that is larger than the width W 1 of the second mask pattern 57 .
- a ratio of the width W 1 to the space W 2 may be about 3:5.
- Spacers 59 may be formed to cover sidewalls of the second mask pattern 57 .
- Each of the spacers 59 may be formed to have a width W 3 that may be equivalent to about one-third of the width W 1 of the second mask pattern 57 .
- the second mask pattern 57 may be removed, according to at least one example embodiment.
- the first mask layer 55 may be etched using the spacers 59 as an etch mask to form first mask patterns 55 a .
- a space between the first mask patterns 55 a may be substantially equivalent to the width W 1 of the second mask pattern 57 .
- a third mask layer 61 may be formed to cover conformally top and side surfaces of the first mask patterns 55 , according to at least one example embodiment.
- the third mask layer 61 may be, for example, a silicon oxide layer.
- the third mask layer 61 may be formed to have a thickness T 1 that is substantially equivalent to the width W 3 of the spacer 59 .
- an organic layer 63 may be formed on the third mask layer 61 , according to at least one example embodiment.
- the organic layer 63 may include a silicon-free organic layer.
- the organic layer 63 may be formed to fill gaps between the first mask patterns 55 a.
- a CMP process using the CMP composition may be performed on the organic layer 63 to remove the organic layer 63 from the uppermost surface of the third mask layer 61 and expose the uppermost surface of the third mask layer 61 , according to at least one example embodiment.
- organic patterns 63 a may be formed between the first mask patterns 55 a.
- an anisotropic etching process may be performed on the exposed third mask layer 61 to remove portions of the third mask layer 61 between the organic patterns 63 a and expose the first mask patterns 55 a , according to at least one example embodiment.
- third mask patterns 61 a which are remaining portions of the third mask layer 61 , may remain below the organic patterns 63 a .
- a space between the first mask pattern 55 a and the organic pattern 63 a may be substantially equal to the width W 3 of the spacer 59 .
- the etch-target layer 53 may be etched using the first mask pattern 55 a and the organic pattern 63 a as an etch mask to form etch-target patterns 53 a , according to at least one example embodiment. Thereafter, the first and third mask patterns 55 a and 61 a and the organic pattern 63 a may be removed. Accordingly, the etch-target patterns 53 a can have a line width that is smaller than the minimum line width that can be obtained by a photolithography process.
- the method described with reference to FIGS. 11 through 17 may be applied to form word lines or bit lines of DRAM devices.
- FIG. 18 is a schematic block diagram illustrating an example of memory systems including a semiconductor device fabricated by the process of example embodiments.
- a memory system 1100 may be applied to a PDA (personal digital assistant), a portable computer, a web tablet, a wireless phone, a mobile phone, a digital music player, a memory card and/or all the devices that can transmit and/or receive data in a wireless communication environment.
- PDA personal digital assistant
- portable computer a portable computer
- web tablet a wireless phone
- mobile phone a mobile phone
- digital music player a memory card and/or all the devices that can transmit and/or receive data in a wireless communication environment.
- the memory system 1100 may include a controller 1110 , an input/output device 1120 (e.g., a keypad and/or a display device), a memory 1130 , an interface 1140 and a bus 1150 .
- the memory 1130 and the interface 1140 may communicate with each other through the bus 1150 .
- the controller 1110 may include a microprocessor, a digital signal processor, a micro controller and/or other process devices similar to or the same as the microprocessor, the digital signal processor and the micro controller.
- the memory 1130 may be used to store an instruction executed by the controller 1110 .
- the input/output device 1120 may receive data and/or a signal from the outside of the system 1100 and/or transmit data and/or a signal to the outside of the system 1100 .
- the input/output device 1120 may include a keyboard, a keypad and/or a displayer.
- the memory 1130 may include the nonvolatile memory device according to example embodiments of the inventive concept.
- the memory 1130 may further include a different type of memory, a volatile memory device capable of random access and various types of memories.
- the interface 1140 may transmit data to a communication network and/or may receive data from a communication network.
- FIG. 19 is a schematic block diagram illustrating an example of memory cards including a semiconductor device fabricated by the process of example embodiments.
- a memory card 1200 for supporting a storage capability of a large capacity may be fitted with a semiconductor memory device 1210 according to example embodiments of the inventive concept.
- the memory card 1200 may include a memory controller 1220 that may control every data exchange between a host and the semiconductor memory device 1210 .
- a static random access memory (SRAM) 1221 may be used as an operation memory of a processing unit 1222 .
- a host interface 1223 may include data exchange protocols of a host that may be connected to the memory card 1200 .
- An error correction block 1224 may detect and/or may correct errors that may be included in data readout from a multi bit semiconductor memory device 1210 .
- a memory interface 1225 may interface with the semiconductor memory device 1210 of at least some example embodiments.
- the processing unit 1222 may perform every control operation for exchanging data of the memory controller 1220 . Even though not depicted in drawings, it may be apparent to one of ordinary skill in the art that the memory card 1200 according to example embodiments of the inventive concept may include a ROM (not illustrated) storing code data for interfacing with the host.
- FIG. 20 is a schematic block diagram illustrating an example of information processing systems including a semiconductor device fabricated by the process of example embodiments.
- an information processing system 1300 may include a 3 D semiconductor memory system 1310 including a 3D semiconductor memory device according to example embodiments of the inventive concept.
- the semiconductor memory system 1310 may be mounted to an information processing system, for example, a mobile device and/or a desktop computer.
- the information processing system 1300 may also include a modem 1320 , a central processing unit (CPU) 1330 , a RAM 1340 , and a user interface 1350 , that may be electrically connected to a system bus 1360 .
- the semiconductor memory system 1310 may be configured similarly to that described with respect to FIG. 20 , and may include a 3D semiconductor memory device 1311 , and a memory controller 1312 .
- a memory system 1310 may be a solid state drive SSD, and data that may be processed by the CPU 1330 and/or input from the outside may be stored in the SSD.
- the information processing system 1300 configured as described and including a 3D semiconductor memory device may reliably store a large amount of data in the semiconductor memory system 1310 .
- the semiconductor memory system 1310 may conserve resources for error correction and a high speed data exchange function may be provided.
- the information processing system 1300 may also include an application chipset, a camera image processor (CIS) and/or an input/output device.
- CIS camera image processor
- a semiconductor memory device and/or memory system may be packaged in various types of ways.
- the semiconductor memory device and/or memory system may be employed in a Package on Package (PoP), Ball Grid Array (BGA), Chip Scale Package (CSP), Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-line Package (PDIP), Die in Waffle Pack, Die in Wafer Form, Chip On Board (COB), Ceramic Dual In-line Package (CERDIP), Plastic Metric Quad Flat Pack (MQFP), Thin Quad Flat Pack (TQFP), Small Outline Integrated Circuit (SOIC), Shrink Small Outline Package (SSOP), Thin Small Outline Package (TSOP), System In Package (SIP), Multi Chip Package (MCP), Wafer-level Fabricated Package (WFP), and/or Wafer-level Processed Stack Package (WSP).
- PoP Package on Package
- BGA Ball Grid Array
- CSP Chip Scale Package
- PLCC Plastic Leaded Chip Carrier
- PDIP Plastic Dual In-line Package
- COB Chip On
- the use of the CMP slurry composition allows a silicon-free organic layer to be polished with selectivity higher than 6:1 with respect to an oxide layer.
- an etch selectivity which is a ratio in etch rate of the organic layer with respect to the oxide layer, ranging from about 6:1 to about 430:1.
- a CMP composition having an etch selectivity suitable for a desired semiconductor device can be used in the CMP process.
- the use of the CMP slurry composition may not result in a process failure, such as peeling of delamination. Accordingly, it is possible to fabricate semiconductor devices without the process failure.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A chemical mechanical polishing (CMP) slurry composition for polishing an organic layer and a method of forming a semiconductor device using the same are disclosed. The CMP slurry composition may include from 0.001% to 5% by weight of oxide-polishing particles; from 0.1% to 5% by weight of an oxidant; from 0% to 5% by weight of a polishing regulator; from 0% to 3% by weight of a surfactant; from 0% to 3% by weight of a pH regulator; and from 79% to 99.889% by weight of deionized water. The use of the CMP slurry composition makes it possible to allow a silicon-free organic layer to be polished with a selectivity higher than 6:1 with respect to an oxide layer.
Description
- This application claims priority from Korean Patent Application No. 10-2013-0084279, filed on July 17, 2013, in the Korean Intellectual Property Office (KIPO), Korean Patent Application No. 10-2014-0005583, filed on Jan. 16, 2014, and Korean Patent Application No. 10-2014-0056408, filed on May 12, 2014, in the KIPO, the entire contents of both of which are incorporated herein by reference.
- Example embodiments of the inventive concept relate to a chemical mechanical polishing (CMP) slurry composition for polishing a layer and method of forming a semiconductor device using the same.
- As an integration density of semiconductor devices increases, there is an increasing demand for fine patterns and multi-layered circuitry. To meet such a demand, it may be helpful to use layers having etch rates that are different from each other. For example, an organic layer containing a hydrocarbon compound has a good etch selectivity with respect to a silicon-containing layer, and thus, the organic layer containing the hydrocarbon compound can be used as a mask layer or as a sacrificial layer. Etch selectivity is the ratio of the etch rates between two different materials, in this case between the organic layer and the silicon-containing layer. In a process of fabricating a semiconductor device, there may be a need to remove the organic layer using a CMP process. However, conventional CMP slurries have not been used to effectively polish organic layers.
- Example embodiments of the inventive concept provide a CMP slurry composition capable of effectively polishing an organic layer. For example, the CMP slurry composition is usable in the manufacture of V-NAND flash memory devices or for polishing a hydrocarbon layer using double patterning technology (DPT).
- Other example embodiments of the inventive concept provide a process of fabricating a semiconductor using the slurry composition.
- According to example embodiments of the inventive concept, a chemical mechanical polishing (CMP) slurry composition for polishing a low silicon layer such as, for example, an organic layer or a silicon-free organic layer, may include from about0.001% to about 5% by weight of oxide-polishing particles; from about 0.1% to about 5% by weight of an oxidant; from about 0% to about 5% by weight of a polishing regulator; from about 0% to about 3% by weight of a surfactant; from about 0% to about 3% by weight of a pH regulator; and from about 79% to about 99.889% by weight of deionized water.
- In example embodiments, the polishing particle may include at least one of silica (SiO2), ceria (CeO2), and alumina (Al2O3).
- In example embodiments, the polishing particle has a grain size ranging from about 30 nm to about 120 nm.
- In example embodiments, the oxidant may include at least one of hydrogen peroxide, superoxide, dioxygenyl, ozone, ozonide, peroxide, fluorine, chlorine, chlorite, chlorate, perchlorate, halogen compounds, nitric acid, nitrate, hypochlorite, hypohalite, chromium trioxide, pyridinium chlorochromate, chromate, dichromate, chromium compound, potassium permanganate, permanganate, sodium perborate, nitrous oxide, 2,2′-dipyridisulfide, lead dioxide (PbO2), manganese dioxide (MnO2), copper oxide (CuO), ferric trichloride (FeCl3), perchloric acid (HClO4), ferric nitrate (Fe(NO)3), sulfate and potassium persulfate (K2S2O8)
- In example embodiments, the polishing regulator may include at least one of organic acid, inorganic acid, nitric acid, nitrate, sulfuric acid, peroxydisulfuric acid, peroxymonosulfuric acid, sulfonic acid, acetic acid, citric acid, formic acid, gluconic acid, lactic acid, oxalic acid, tartaric acid, carboxylic acid, chloric acid, chlorous acid, hypochlorous acid, perchloric acid, halogen oxoacid, ascorbic acid, vinylogous carboxylic acid, amino acid, histidine, glycine, arginine, hydrochloric acid, fluoric acid and phosphoric acid.
- In example embodiments, the surfactant may be anionic or non-ionic. For example, the surfactant may include at least one of lauryl myristyl alcohol series, methyl-oxirane polymer series, whose hydrophile lipophile balance (HLB) may be 12 or higher, ethylenediamine, ethoxylated and propoxylated alcohol series, 2-methyloxirane, oxirane series, polyethylene glycol, and polysorbate series.
- The surfactant may further include at least one of benzalkonium chloride, alkyl benzene sulfonate, phemerol chloride, ammonium lauryl sulfate, sodium lauryl ether sulfate, sodium myreth sulfate, dioctyl sodium sulfosuccinate, perfluorooctanesulfonate, perfluorobutanesulfonate, linear alkylbenzene sulfonate, sodium stearate, sodium lauroyl sarcosinate, cetyl trimethylammonium bromide, cetyl trimethylammonium chloride, perfluorononanoate, perfluorooctanoate, octenidine dihydrochloride, 5-bromo-5-nitro-1,3-dioxane, dimethyldioctadecylammonium chloride, cetrimonium bromide, dioctadecyldimethylammonium bromide, octaethylene glycol monododecyl ether, glyceryl laurate, and polyethoxylated tallow amine.
- In example embodiments, the pH regulator may include at least one acidic material from poly acrylic acid, carboxylic acid, nitric acid, sulfuric acid and sulfonic acid or at least one basic material from potassium hydroxide, sodium hydroxide, ammonia water, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabuthylammonium hydroxide.
- According to example embodiments of the inventive concept, a method of fabricating a semiconductor device may include forming a first structure having a first recess region on a substrate, forming a low silicon layer such as, for example, an organic layer or a silicon-free organic layer on the first structure to fill the first recess region, and performing a CMP process using the CMP slurry composition on the organic layer to expose a top surface of the first structure. The composition may have a pH in the range of 2.0˜5.0.
- In example embodiments, the first recess region may be formed to include a first hole exposing the substrate, and the method may further include, after performing the CMP process on the organic layer, forming a second structure including a second hole exposing a top surface of the organic layer on the first structure, removing the organic layer through the second hole, forming an active pillar covering at least sidewalls of the first and second holes, and forming a conductive line in the first and second structures.
- In example embodiments, each of the first and second structures may be formed to include a plurality of insulating layers and a plurality of sacrificial layers that may be alternatively stacked on the substrate, and the forming of the conductive line in the first and second structures may include selectively removing the sacrificial layers to form an inter-layered empty region, and forming the conductive line in the inter-layered empty region.
- In example embodiments, the first structure may include etch-target layer provided on the substrate, a plurality of line-shaped first mask patterns provided parallel to each other on the etch-target layer, and a second mask layer conformally covering side and top surfaces of the first mask patterns, the second mask layer may have the first recess region between the first mask patterns, and exposing the top surface of the first structure may be performed to expose a top surface of the second mask layer.
- In example embodiments, a space between the first mask patterns may be about three times a thickness of the second mask layer, and the organic layer may be disposed between the first mask patterns.
- In example embodiments, the method may further include an anisotropic etching process to remove the exposed second mask layer and form a second mask pattern below the organic layer.
- In example embodiments, an oxide layer may be provided on the first structure, and the CMP slurry composition may be configured to allow the organic layer to be polished with respect to the oxide layer with a selectivity higher than about 6:1.
- In example embodiments, the removing of the portion of the organic layer may be performed not to expose a top surface of the first structure.
- According to at least one example embodiment, a chemical mechanical polishing (CMP) slurry composition includes a first concentration of oxide-polishing particles, a second concentration of an oxidant, a third concentration of a polishing regulator, a fourth concentration of a surfactant, a fifth concentration of a pH regulator, and a sixth concentration of deionized water, the slurry composition being configured to etch a first type of layer at a different rate than a second type of layer. For example, the first type of layer is an oxide layer and the second type of layer comprises an organic layer, an etch selectivity of the oxide layer with respect to the organic layer is in a range between 6:1 and 430:1, and the organic layer is a mask layer.
- Example embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings. The accompanying drawings represent non-limiting, example embodiments as described herein.
-
FIGS. 1 , 2A, and 2B are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments. -
FIGS. 3 through 10 are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments. -
FIGS. 11 to 17 are sectional views illustrating a process of fabricating a semiconductor device, according to other example embodiments. -
FIG. 18 is a schematic block diagram illustrating an example of memory systems including a semiconductor device fabricated by the process of example embodiments. -
FIG. 19 is a schematic block diagram illustrating an example of memory cards including a semiconductor device fabricated by the process of example embodiments. -
FIG. 20 is a schematic block diagram illustrating an example of information processing systems including a semiconductor device fabricated by the process of example embodiments. - It should be noted that these figures are intended to illustrate the general characteristics of methods, structure and/or materials utilized in certain example embodiments and to supplement the written description provided below. These drawings are not, however, to scale and may not precisely reflect the precise structural or performance characteristics of any given embodiment, and should not be interpreted as defining or limiting the range of values or properties encompassed by example embodiments. For example, the relative thicknesses and positioning of molecules, layers, regions and/or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numbers in the various drawings is intended to indicate the presence of a similar or identical element or feature.
- Example embodiments will now be described more fully with reference to the accompanying drawings, in which example embodiments are shown. Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those of ordinary skill in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
- It will be understood that when an element is referred to as being “on,” “connected” or “coupled” to another element, it can be directly on, directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly on,” “directly connected” or “directly coupled” to another element, there are no intervening elements present. Like numbers indicate like elements throughout. As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items. Other words used to describe the relationship between elements or layers should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versus “directly on”).
- It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
- Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises”, “comprising”, “includes” and/or “including,” if used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
- Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
- Although corresponding plan views and/or perspective views of some cross-sectional view(s) may not be shown, the cross-sectional view(s) of device structures illustrated herein provide support for a plurality of device structures that extend along two different directions as would be illustrated in a plan view, and/or in three different directions as would be illustrated in a perspective view. The two different directions may or may not be orthogonal to each other. The three different directions may include a third direction that may be orthogonal to the two different directions. The plurality of device structures may be integrated in a same electronic device. For example, when a device structure (e.g., a memory cell structure or a transistor structure) is illustrated in a cross-sectional view, an electronic device may include a plurality of the device structures (e.g., memory cell structures or transistor structures), as would be illustrated by a plan view of the electronic device. The plurality of device structures may be arranged in an array and/or in a two-dimensional pattern.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments of the inventive concepts belong. It will be further understood that terms, such as those defined in commonly-used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
- In example embodiments, a fabrication process to be described below may be applied to a nonvolatile memory device (for example, having a three-dimensional V-NAND flash memory structure or for polishing a hydrocarbon layer using double patterning technology (DPT)).
-
FIGS. 1 , 2A, and 2B are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments of the inventive concept. - Referring to
FIG. 1 , astructure 110 may be formed on asubstrate 100 to include a recessedregion 115. Thestructure 110 may include atop portion 112 made of oxide. Anorganic layer 120 may be formed on thestructure 110. In an example embodiment, theorganic layer 120 may be referred to as a spin-on-carbon layer or a spin-on-hard mask layer. Theorganic layer 120 may also be a low silicon layer such as, for example, an organic layer or a silicon-free organic layer. The formation of theorganic layer 120 may include a spin-coating step and a drying or baking step. Theorganic layer 120 may be formed to fill the recessedregion 115. - Referring to
FIGS. 2A and 2B , a polishing process may be performed to polish theorganic layer 120, according to at least one example embodiment. For example, the process may be performed to remove a portion of theorganic layer 120 from a top surface of thestructure 110. In example embodiments, the polishing process may be a chemical-mechanical polishing (CMP) process. In an example embodiment, as shown inFIG. 2A , anorganic pattern 120 a may be formed on thestructure 110 to have a predetermined thickness. Alternatively, as shown inFIG. 2B , the polishing process may be performed in such a way that the top surface of thestructure 110 is exposed and theorganic pattern 120 a remains in the recessedregion 115. In example embodiments, the CMP process may be performed using a CMP slurry composition including, for example, from about 0.001% to about 5% by weight of oxide-polishing particles; from about 0.1% to about 5% by weight of an oxidant; from 0% to about 5% by weight of a polishing regulator; from 0% to about 3% by weight of a surfactant; from 0% to about 3% by weight of a pH regulator; and from about 79% to about 99.889% by weight of deionized water. - The polishing particle may include at least one of silica (SiO2), ceria (CeO2), and alumina (Al2O3). The polishing particle may be provided to have a grain size ranging from about 10 nm to about 100 nm and preferably ranging from about 30 nm to about 120 nm.
- The oxidant may induce oxidation of the organic layer, which allows to obtain a desired polishing rate. The oxidant may include at least one of peroxide series (e.g., hydrogen peroxide, superoxide, dioxygenyl, ozone, and ozonide), halogen series (e.g., fluorine and chlorine), halogen compound series (e.g., chlorite, chlorate and perchlorate), nitrate series (e.g., nitric acid), hypochlorite or hypohalite series (e.g., home cleaner), chromium compound series (e.g., chromium trioxide, pyridinium chlorochromate, chromate, and dichromate), permanganate series (e.g., potassium permanganate), a metal compound having a high oxidation number (e.g., lead dioxide(PbO2), manganese dioxide(MnO2), copper oxide(CuO), ferric trichloride(FeCl3)), sulfate(e.g., potassium persulfate(K2S2O8)), perchloric acid (HClO4), ferric nitrate (Fe(NO)3), sodium perborate, nitrous oxide, and 2,2′-dipyridisulfide.
- In example embodiments, the chlorite or the chlorate series may be used as the oxidant.
- The polishing regulator may cut carbon chains in the organic layer. Organic or inorganic acid may be used as the polishing regulator. For example, the polishing regulator may include at least one of nitrate series (e.g., nitric acid), sulfonic series (e.g., sulfuric acid, peroxydisulfuric acid, and peroxymonosulfuric acid), carboxylic acid series (e.g., acetic acid, citric acid, formic acid, gluconic acid, lactic acid, oxalic acid, and tartaric acid), halogen oxoacid series (e.g., chloric acid, chlorous acid, hypochlorous acid, and perchloric acid), vinylogous carboxylic acid series (e.g., ascorbic acid), amino acid series (e.g., histidine, glycine, and arginine) and inorganic acid (e.g., hydrochloric acid, fluoric acid and phosphoric acid). In example embodiments, the carboxylic acid series may be used as the polishing regulator.
- The surfactant may improve wettability on a surface of the organic layer of the CMP slurry composition and thereby increase the polishing rate. The surfactant may be anionic or non-ionic. For example, the surfactant may include at least one of lauryl myristyl alcohol series, methyl-oxirane polymer series, whose hydrophile lipophile balance (HLB) is 12 or higher, ethylenediamine, C1-16 ethoxylated and propoxylated alcohol series, 2-methyloxirane, oxirane series, polyethylene glycol, or polysorbate series. Furthermore, the surfactant may include at least one of benzalkonium chloride, alkyl benzene sulfonate, phemerol chloride, ammonium lauryl sulfate, sodium lauryl ether sulfate, sodium myreth sulfate, dioctyl sodium sulfosuccinate, perfluorooctanesulfonate, perfluorobutanesulfonate, linear alkylbenzene sulfonate, sodium stearate, sodium lauroyl sarcosinate, cetyl trimethylammonium bromide, cetyl trimethylammonium chloride, perfluorononanoate, perfluorooctanoate, octenidine dihydrochloride, 5-bromo-5-nitro-1,3-dioxane, dimethyldioctadecylammonium chloride, cetrimonium bromide, dioctadecyldimethylammonium bromide, octaethylene glycol monododecyl ether, glyceryl laurate, and polyethoxylated tallow amine.
- The pH regulator may control pH of the CMP slurry composition. Since the polishing regulator includes acid, it may also serve as a pH regulator. The pH regulator may be acid or basic. For example, the pH regulator may include acid materials, such as poly acrylic acid, carboxylic acid, nitric acid, sulfuric acid and sulfonic acid, or basic materials, such as potassium hydroxide, sodium hydroxide, ammonia water, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabuthylammonium hydroxide. The CMP slurry composition preferably may have a pH in the range 2.0˜5.0.
- By using the CMP slurry composition, it may be possible to efficiently polish an organic layer such as
organic layer 120. - The CMP slurry composition according to example embodiments will be described with reference to the experimental examples below.
- According to at various example embodiments, eight wafers are prepared. Silicon-free organic layers are formed on four wafers, and TEOS layers, one of silicon oxide series, are formed on the remaining four wafers. CMP slurry compositions serving as polishing agent are prepared to contain about 1% by weight of silica, about 98% by weight of deionized water, and about 1% by weight of an oxidant. The type of oxidant contained in the CMP slurry compositions is changed to peroxide series, chlorate, nitrate series, and compounds having a high oxidation number. In an example embodiment, hydrogen peroxide is used as one of the peroxide series. Perchloric acid(HClO4) is used as one of the chlorate series. Ferric nitrate(Fe(NO)3) is used as one of the nitrate series. The compounds having a high oxidation number mean a compound of metal such as lead dioxide(PbO2), manganese dioxide(MnO2), copper oxide(CuO), ferric trichloride(FeCl3). In an example embodiment, ferric trichloride(FeCl3) is used as one of the compounds having a high oxidation number. Mean grain size of the silica is about 60 nm. CMP processes are performed on the eight wafers using respective CMP slurry compositions. The following Table 1 shows experiment results (e.g., polishing rate and selectivity) measured after the CMP processes.
-
TABLE 1 Polishing Rate (Å/min) Organic TEOS Selectivity Type of Oxidant Layer (A) (B) (A/B) 1 Peroxide series 1250 115 10.9 2 Chlorate series 1530 95 16.1 3 Nitrate series 920 89 10.3 4 Compounds having a high 870 112 7.8 oxidation number - According to Table 1, polishing rate and selectivity are the highest for the chlorate series. However, the selectivity is higher than 6:1 for other oxidants (e.g., peroxide or nitrate series), which illustrates the fact that other oxidants can also be effectively used as antioxidants in the polishing process of an organic layer.
- In the experimental example 2, according to various example embodiments, polishing properties according to contents of the chlorate series and the silica are examined, when the chlorate series and the silica are used as the oxidant and the polishing particles, respectively. Firstly, 34 wafers are prepared. Silicon-free organic layers are formed on 17 wafers, and TEOS layers, one of silicon oxide series, are formed on the remaining 17 wafers. As shown in Table 2 below, the chlorate series having concentrations of 0.1 wt %-3.0 wt % and the silica having concentrations of 0.01 wt %-1.0 wt % are used as the oxidant and polishing particle of the CMP slurry composition, respectively. After performing the CMP process on the wafers, polishing properties are measured. Table 2 shows the measurement results. In an example embodiment, perchloric acid(HClO4) is used as one of the chlorate series. The mean grain size of the silica is about 60 nm.
-
TABLE 2 Polishing Oxidant Particle Polishing Rate (Å/min) Content Content Organic PE-TEOS Selectivity (wt %) (wt %) Layer (A) (B) (A/B) 1 1.2 0.4 1650 45 36.7 2 1.0 0.4 1620 40 40.5 3 0.7 0.4 1510 42 35.9 4 0.5 0.4 1400 40 35.0 5 1.0 0.7 1630 89 18.3 6 1.0 0.5 1620 62 26.1 7 1.0 0.3 1590 42 37.8 8 0.3 1.0 1158 121 9.6 9 0.2 1.0 941 124 7.6 10 0.1 1.0 804 129 6.2 11 3 0.01 1987 5 397.4 12 3 0.05 2100 6 350 13 3 0.1 2230 28 79.6 14 3 0.2 2480 48 51.7 15 3 0.5 2670 77 34.7 16 1 0.05 1505 8 188.1 17 1 0.1 1600 31 51.6 - According to Table 2, the highest etch selectivity of 397.4 is obtained when the chlorate series had an oxidant content of 3 wt %, and the silica polishing particle had a concentration of 0.01 wt %. Furthermore, other combinations of concentrations of oxidant and polishing particles provided etch selectivities higher than 6, which illustrate the fact that the other combinations can also be effectively used for a polishing process of an organic layer.
- In the experimental example 3-1, polishing properties according to the type and content of the polishing regulator are examined, when 1.0 wt % chlorate series and 0.4 wt % silica are used as the oxidant and the polishing particles of the CMP slurry composition. Firstly, eighteen wafers are prepared. Silicon-free organic layers are formed on nine wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining nine wafers. As shown in Table 3 below, the carboxylic acid having contents of 0.1 wt %-1.0wt % are used as the polishing regulator or sulfonic acid, amino acid, inorganic acid, and nitric acid are used in place of the carboxylic acid. After performing the CMP process to the wafers, polishing properties are measured. Table 3 shows the measurement results. In an example embodiment, perchloric acid(HClO4) is used as one of the chlorate series. Formic acid is used as one of the carboxylic acid. Histidine is used as one of the amino acids. Hydrochloric acid is used as one of the inorganic acid. Mean grain size of the silica is about 60 nm.
-
TABLE 3 Polishing regulator Polishing Rate (Å/min) Content Organic PE-TEOS Selectivity Material (wt %) Layer (A) (B) (A/B) 1 Carboxylic acid 0.5 2010 48 41.9 2 Carboxylic acid 0.3 1990 42 47.4 3 Carboxylic acid 0.1 1820 41 44.4 4 Carboxylic acid 0.7 2580 45 57.3 5 Carboxylic acid 1.0 3340 42 79.5 6 Sulfonic acid 0.3 1800 47 38.3 7 Amino acid 0.3 1710 45 38.0 8 Inorganic acid 0.3 1690 43 39.3 9 Nitric acid 0.3 1720 43 40.0 - According to Table 3, the highest selectivity of 79.5 is obtained when the CMP slurry composition is formed to contain 1.0 wt % of chlorate-series for the oxidant, 0.4 wt % of silica for the polishing particles, 1.0 wt % of carboxylic acid for the polishing regulator, and deionized water being the remaining content. Furthermore, with respect to the other types of polishing regulators, the selectivity is higher than 38, which illustrates the fact that the other types of polishing regulators can be effectively used for the polishing process of an organic layer.
- In the experimental example 3-2, polishing properties according to the type and content of the polishing regulator are examined, when 1.0 wt % of chlorate series and 0.2 wt % of silica are used as the oxidant and the polishing particles of the CMP slurry composition, respectively. Firstly, six wafers are prepared. Silicon-free organic layers are formed on three wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining three wafers. As shown in Table 4, carboxylic acids having the contents of 0.7 wt %, 1.0 wt %, and 1.3 wt % are used as the polishing regulator. After performing the CMP process to the wafers, polishing properties are measured. Table 4 shows the measurement results. . In an example embodiment, perchloric acid(HClO4) is used as one of the chlorate series. Formic acid is used as one of the carboxylic acid. Mean grain size of the silica is about 60 nm.
-
TABLE 4 Polishing regulator Polishing Rate (Å/min) Content Organic PE-TEOS Selectivity Material (wt %) Layer (A) (B) (A/B) 1 carboxylic acid 0.7 2600 24 108.3 2 carboxylic acid 1.0 3500 22 159.1 3 carboxylic acid 1.3 4410 21 210.0 - According to Table 4, substantially high selectivities of 108.3-210.0 are obtained when 1.0 wt % of chlorate-based oxidant, 0.2 wt % of silica for the polishing particles, 0.7-1.3 wt % of carboxylic acids for the polishing regulator are used.
- In the experimental example 4, polishing properties according to the type of the surfactant are examined, when 1.0 wt % of the oxidant of chlorate series, 0.4 wt % of the polishing particles of silica, and 0.3 wt % of carboxylic acid are used for the CMP slurry composition. In the experimental example 4, cationic, anionic, and non-ionic surfactants are added in the CMP slurry composition. Firstly, six wafers are prepared. Silicon-free organic layers are formed on three wafers, and PE-TEOS layers, one of silicon oxide series, are formed on the remaining three wafers. Next, CMP slurry compositions are formed to contain surfactants that are different from each other, as described above. The contents of the added surfactants are 0.5 wt % relative to the total weight of the composition. CMP processes are performed to the wafers using the CMP slurry compositions, respectively. The following Table 5 shows experimental results measured after the CMP processes. In an example embodiment, perchloric acid(HClO4) is used as one of the chlorate series. Formic acid is used as one of the carboxylic acid. Histidine is used as one of the amino acid. Hydrochloric acid is used as one of the inorganic acid. Mean grain size of the silica is about 60 nm. Benzalkonium chloride is used as one of the cationic surfactants. Alkyl benzene sulfonate is used as one of the anionic surfactants. Polyethylene glycol is used as one of the non-ionic surfactants.
-
TABLE 5 Surfactant Surfactant Selectivity Type content (wt %) (organic layer/PETEOS) 1 Cationic 0.5 56 2 Anionic 0.5 73 3 Non-ionic 0.5 102 - According to Table 5, the highest selectivity of 102 is obtained, when the non-ionic surfactant is added. Regardless of the type of the surfactant, a high selectivity of 56 or higher is obtained by merely adding a surfactant. The non-ionic surfactant produced the highest selectivity, and the second highest selectivity is produced by the anionic surfactant at a selectivity of 73. Further, a peeling phenomenon on a surface of the organic layer is significantly improved when the surfactant is added with respect to when the surfactant is not added. The presence of the surfactant may make it possible to improve wettability of the CMP composition on a surface of the organic layer. By virtue to the improved wettability of the CMP composition, the polishing process may be performed on the surface with increased uniformity. The improvement of the peeling phenomenon may result from the improved wettability of the CMP composition.
- In the experimental example 5-1, polishing selectivities are examined by varying pH of the CMP composition. First, silica having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and perchloric acid(HClO4) is subsequently added as one of the oxidants with a concentration of about 1.0 wt. %, thereby forming 8 composition samples with a pH of about 2.1. pH regulators may then be added into 7 composition samples out of the total 8 composition samples, respectively, with a concentration less than 3 wt. %. In order to decrease the pH, nitric acid is added as a pH regulator into two composition samples, thereby decreasing pH of the two composition samples to 1. 8 and 2.0, respectively. In order to increase pH, potassium hydroxide is added as a pH regulator into five composition samples, thereby increasing pH of the five composition samples to 2.2, 2.4, 2.6, 2.8, 3.0, respectively. CMP processes are performed to organic layers and TEOS layers using the 8 CMP slurry composition samples, respectively. The following Table 6 shows experimental results measured after the CMP processes.
-
TABLE 6 Polishing Rate (Å/min) polishing Composition Organic TEOS Selectivity particle pH Layer (A) (B) (A/B) stability 1 1.8 1403 55 25.5 bad 2 2.0 1470 57 25.8 bad 3 2.1 1580 60 26.3 good 4 2.2 1620 62 26.1 good 5 2.4 1610 60 26.8 good 6 2.6 1520 61 24.9 good 7 2.8 1480 59 25.1 bad 8 3.0 1420 58 24.5 bad
According to Table 6, regardless of the pH of the composition, a high selectivity of 24.5 or higher is obtained. The meaning of ‘bad’ in the polishing particle stability is that polishing particles may sink (or precipitate), or the color of the polishing particles may be changed in the composition, thereby non-uniformly polishing a surface of the layers. Therefore, a preferable pH of the CMP composition of the experimental example 5-1 is about 2.1˜2.6 in the condition of 0.5 wt. % of silica and 1.0 wt. % of perchloric acid. - In the experimental example 5-2, polishing particle stabilities are examined by varying the pH of the CMP composition. First, silica having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and potassium persulfate (K2S2O8) is subsequently added as one of the oxidants with a concentration of about 0.3 wt. %, thereby forming 3 composition samples with a pH of about 4.2. pH regulators are subsequently added into 2 composition samples out of the total 3 composition samples, respectively, with a concentration less than 3 wt. %. In order to decrease pH, sulfuric acid is added as a pH regulator into one composition sample and the adding amount of the sulfuric acid is increased incrementally, by checking pH of the one composition sample and by macroscopically examining the polishing particle stability. When the pH of the CMP composition of the experimental example 5-2 is lower than 3.5, the polishing particle stability is poor. In order to increase pH, potassium hydroxide is added as a pH regulator into another composition sample and the adding amount of the potassium hydroxide is increased incrementally, by checking pH of the another composition sample and by macroscopically examining the polishing particle stability. When the pH of the CMP composition of the experimental example 5-2 is higher than 5.0, the polishing particle stability is poor. Therefore, a preferable pH of the CMP composition of the experimental example 5-2 is about 3.5˜5.0 in the condition of 0.5 wt. % of silica and 0.3 wt. % of potassium persulfate.
- In the experimental example 5-3, polishing particle stabilities are examined by varying pH of the CMP composition. First, ceria having a grain size of about 60 nm is added in the composition with a concentration of about 0.5 wt. %, and ferric nitrate (Fe(NO)3) is subsequently added as one of the oxidants with a concentration of about 0.3 wt. %, thereby forming 3 composition samples with a pH of about 2.1. Then, pH regulators are added into 2 composition samples out of the total 3 composition samples, respectively, with a concentration less than 3 wt. %. In order to decrease pH, nitric acid is added as a pH regulator into one composition sample and the adding amount of the sulfuric acid is increased incrementally, by checking pH of the one composition sample and by macroscopically examining the polishing particle stability. When the pH of the CMP composition of the experimental example 5-3 is lower than 2.0, the polishing particle stability is poor. In order to increase pH, potassium hydroxide is added as a pH regulator into another composition sample and the adding amount of the potassium hydroxide is increased incrementally, by checking pH of the another composition sample and by macroscopically examining the polishing particle stability. When the pH of the CMP composition of the experimental example 5-3 is higher than 2.8, the polishing particle stability is poor. Therefore, a preferable pH of the CMP composition of the experimental example 5-3 is about 2.0˜2.8 in the condition of 0.5 wt. % of ceria and 0.3 wt. % of ferric nitrate.
- In the experimental example 6, polishing selectivities are examined by varying a grain size of silica. First, silica is added in the composition with a concentration of about 0.5 wt. %, and perchloric acid(HClO4) is subsequently added as one of the oxidants with a concentration of about 1.0 wt. %, thereby forming 4 composition samples. In an example embodiment, the grain sizes of silica in the 4 composition samples are 30 nm, 60 nm, 80 nm, and 120 nm, respectively. CMP processes are performed to organic layers and TEOS layers using the 4 CMP slurry composition samples, respectively. The following Table 7 shows experimental results measured after the CMP processes.
-
TABLE 7 Polishing Rate (Å/min) Grain size(nm) Organic TEOS Selectivity of Silica Layer (A) (B) (A/B) 1 30 1550 50 31 2 60 1620 62 26.1 3 80 2100 88 23.9 4 120 2430 101 24.1
According to Table 7, a high selectivity of 23.9 or higher is obtained when the grain size of silica is 120 nm or less. - In the experimental example 7, polishing selectivities are examined by varying a grain size of ceria. First, ceria is added in the composition with a concentration of about 0.05 wt. %, and ferric nitrate is subsequently added as one of the oxidants with a concentration of about 3.0 wt. %, thereby forming 3 composition samples. In an example embodiment, the grain sizes of ceria in the 3 composition samples are 30 nm, 60 nm and 80 nm, respectively. CMP processes are performed to organic layers and TEOS layers using the 4 CMP slurry composition samples, respectively. The following Table 8 shows experimental results measured after the CMP processes.
-
TABLE 8 Polishing Rate (Å/min) Grain size(nm) Organic TEOS Selectivity of Ceria Layer (A) (B) (A/B) 1 30 1720 4 430 2 60 2100 6 350 3 80 2450 12 204
According to Table 8, high selectivities of 204˜430 are obtained when the ceria is used as an oxide-polishing particle. Furthermore, selectivity is increased as the grain size of the ceria is decreased. - According to the afore-described several experimental examples, the CMP composition can be formed in such a way that an etch selectivity between the organic layer and the oxide layer is in a range of from about 6:1 to about 430:1. Thus, a CMP composition having an etch selectivity suitable for a desired semiconductor device can be used in the CMP process.
- The CMP composition may be used in a process of fabricating a semiconductor device. An example of such processes will be described in more detail below.
-
FIGS. 3 through 10 are sectional views illustrating a process of fabricating a semiconductor device, according to example embodiments of the inventive concept. - Referring to
FIG. 3 , first gate interlayered insulatinglayers 3 and firstsacrificial layers 5 may be alternatively stacked on asubstrate 1 to form afirst structure 10, according to at least one example embodiment. The firstsacrificial layers 5 may be formed of a material having an etch selectivity with respect to the first gate interlayered insulatinglayers 3. In example embodiments, the first gate interlayered insulatinglayers 3 may be silicon oxide layers, and the firstsacrificial layers 5 may be silicon nitride layers. The firstsacrificial layers 5 and the first gate interlayered insulatinglayers 3 may be sequentially etched to formfirst holes 12, thus exposing thesubstrate 1. - Referring to
FIG. 4 , a silicon-freeorganic layer 14 may be formed on thefirst structure 10 to fill thefirst holes 12, according to at least one example embodiment. - Referring to
FIG. 5 , a CMP process using the CMP composition may be performed on theorganic layer 14 to remove theorganic layer 14 from a top surface of thefirst structure 10 and expose the uppermost first gate interlayered insulatinglayer 3, according to at least one example embodiment. Because the use of the CMP composition makes it possible to rapidly polish the organic layer with a high polishing selectivity with respect to an oxide layer, the CMP process can be quickly performed without process failure. As the result of the CMP process,organic patterns 14 a may remain in the first holes 12. - Referring to
FIG. 6 , second gate interlayered insulatinglayers 23 and secondsacrificial layers 25 may be alternatively stacked on thefirst structure 10 to form asecond structure 20, according to at least one example embodiment. The secondsacrificial layers 25 may be formed of the same material as the firstsacrificial layers 5. The second gate interlayered insulatinglayers 23 may be formed of the same material as the first gate interlayered insulatinglayers 3. The secondsacrificial layers 25 and the second gate interlayered insulatinglayers 23 may be sequentially etched to formsecond holes 22 exposing theorganic pattern 14 a. Theorganic pattern 14 a may make it possible to protect thefirst holes 12 and thesubstrate 1 thereunder. - Although two
structures FIG. 6 , the stacking number of the structures may be three or more, according to various example embodiments. - Referring to
FIG. 7 , an ashing process using oxygen may be performed to selectively remove theorganic pattern 14 a exposed by thesecond hole 22, according to at least one example embodiment. Accordingly, thesubstrate 1 may be partially exposed through the first holes 12. - Referring to
FIG. 8 , a polysilicon layer may be conformally formed on thesubstrate 1, and a first insulating gapfill layer may be formed to fill theholes active pillars 27 and first insulatinggapfill patterns 29. Theactive pillars 27 may be formed in theholes gapfill patterns 29 may be formed to fill theholes active pillars 27 are formed. Thereafter, an ion implantation process may be performed to formdrain regions 31 in upper portions of theactive pillars 27. - Referring to
FIG. 9 , thestructures grooves 32 exposing thesubstrate 1, according to at least one example embodiment. Thegrooves 32 may be formed and spaced apart from theactive pillars 27. Thesacrificial layers grooves 32 may be used as paths for supplying etchant in the process of removing thesacrificial layers gate insulating layer 34 may be conformally formed in the inter-layered empty regions, and a conductive layer may be formed to fill the inter-layered empty regions and thegroove 32. Thegate insulating layer 34 may include a tunnel insulating layer, a charge-trap layer, and a blocking insulating layer. The conductive layer may be a doped polysilicon layer or a metal-containing layer. Next, the conductive layer may be removed from thegroove 32 to expose thesubstrate 1. As a result, a lower selection line LSL, word lines WL0-WL3, and upper selection lines USL0 and USL1 may be formed in the inter-layered empty regions. - Referring to
FIG. 10 , an ion implantation process may be performed to form a common source line CSL below thegroove 32, according to at least one example embodiment. A second insulating gapfill layer may be formed to fill thegrooves 32, and then, be planarized to form second insulatinggapfill patterns 34 remaining in thegrooves 32. Thereafter, a plurality of bit lines BL may be formed on the second gate interlayered insulatinglayer 23. The bit lines BL may be connected to thedrain region 31 and spaced apart from each other. - As described with reference to
FIGS. 3 through 10 , the CMP composition according to example embodiments may be used to fabricate 3D vertical NAND FLASH memory devices. -
FIGS. 11 to 17 are sectional views illustrating a process of fabricating a semiconductor device, according to other example embodiments. - Referring to
FIG. 11 , an etch-target layer 53 may be formed on asubstrate 51, according to at least one example embodiment. The etch-target layer 53 may be formed of or include, for example, a silicon oxide layer, a silicon nitride layer, or a polysilicon layer. Afirst mask layer 55 may be formed on the etch-target layer 53. Thefirst mask layer 55 may be formed of a material (for example, a silicon-free organic material) having an etch selectivity with respect to the etch-target layer 53. Asecond mask pattern 57 may be formed on thefirst mask layer 55. Thesecond mask pattern 57 may be formed of a material having an etch selectivity with respect to thefirst mask layer 55. Thesecond mask pattern 57 may be formed to have a width W1. In example embodiments, the width W1 may be substantially equal to a minimum line width that can be obtained by a photolithography process. Thesecond mask patterns 57 may be formed to have a space W2 that is larger than the width W1 of thesecond mask pattern 57. For example, a ratio of the width W1 to the space W2 may be about 3:5.Spacers 59 may be formed to cover sidewalls of thesecond mask pattern 57. Each of thespacers 59 may be formed to have a width W3 that may be equivalent to about one-third of the width W1 of thesecond mask pattern 57. - Referring to
FIG. 12 , thesecond mask pattern 57 may be removed, according to at least one example embodiment. Thefirst mask layer 55 may be etched using thespacers 59 as an etch mask to formfirst mask patterns 55 a. A space between thefirst mask patterns 55 a may be substantially equivalent to the width W1 of thesecond mask pattern 57. - Referring to
FIG. 13 , athird mask layer 61 may be formed to cover conformally top and side surfaces of thefirst mask patterns 55, according to at least one example embodiment. Thethird mask layer 61 may be, for example, a silicon oxide layer. Thethird mask layer 61 may be formed to have a thickness T1 that is substantially equivalent to the width W3 of thespacer 59. - Referring to
FIG. 14 , anorganic layer 63 may be formed on thethird mask layer 61, according to at least one example embodiment. Theorganic layer 63 may include a silicon-free organic layer. Theorganic layer 63 may be formed to fill gaps between thefirst mask patterns 55 a. - Referring to
FIG. 15 , a CMP process using the CMP composition may be performed on theorganic layer 63 to remove theorganic layer 63 from the uppermost surface of thethird mask layer 61 and expose the uppermost surface of thethird mask layer 61, according to at least one example embodiment. As a result,organic patterns 63 a may be formed between thefirst mask patterns 55 a. - Referring to
FIG. 16 , an anisotropic etching process may be performed on the exposedthird mask layer 61 to remove portions of thethird mask layer 61 between theorganic patterns 63 a and expose thefirst mask patterns 55 a, according to at least one example embodiment. As a result,third mask patterns 61 a, which are remaining portions of thethird mask layer 61, may remain below theorganic patterns 63 a. A space between thefirst mask pattern 55 a and theorganic pattern 63 a may be substantially equal to the width W3 of thespacer 59. - Referring to
FIG. 17 , the etch-target layer 53 may be etched using thefirst mask pattern 55 a and theorganic pattern 63 a as an etch mask to form etch-target patterns 53 a, according to at least one example embodiment. Thereafter, the first andthird mask patterns organic pattern 63 a may be removed. Accordingly, the etch-target patterns 53 a can have a line width that is smaller than the minimum line width that can be obtained by a photolithography process. - The method described with reference to
FIGS. 11 through 17 may be applied to form word lines or bit lines of DRAM devices. -
FIG. 18 is a schematic block diagram illustrating an example of memory systems including a semiconductor device fabricated by the process of example embodiments. - Referring to
FIG. 18 , amemory system 1100 may be applied to a PDA (personal digital assistant), a portable computer, a web tablet, a wireless phone, a mobile phone, a digital music player, a memory card and/or all the devices that can transmit and/or receive data in a wireless communication environment. - The
memory system 1100 may include a controller 1110, an input/output device 1120 (e.g., a keypad and/or a display device), amemory 1130, aninterface 1140 and abus 1150. Thememory 1130 and theinterface 1140 may communicate with each other through thebus 1150. - The controller 1110 may include a microprocessor, a digital signal processor, a micro controller and/or other process devices similar to or the same as the microprocessor, the digital signal processor and the micro controller. The
memory 1130 may be used to store an instruction executed by the controller 1110. The input/output device 1120 may receive data and/or a signal from the outside of thesystem 1100 and/or transmit data and/or a signal to the outside of thesystem 1100. For example, the input/output device 1120 may include a keyboard, a keypad and/or a displayer. - The
memory 1130 may include the nonvolatile memory device according to example embodiments of the inventive concept. Thememory 1130 may further include a different type of memory, a volatile memory device capable of random access and various types of memories. - The
interface 1140 may transmit data to a communication network and/or may receive data from a communication network. -
FIG. 19 is a schematic block diagram illustrating an example of memory cards including a semiconductor device fabricated by the process of example embodiments. - Referring to
FIG. 19 , amemory card 1200 for supporting a storage capability of a large capacity may be fitted with asemiconductor memory device 1210 according to example embodiments of the inventive concept. Thememory card 1200 according to example embodiments of the inventive concept may include amemory controller 1220 that may control every data exchange between a host and thesemiconductor memory device 1210. - A static random access memory (SRAM) 1221 may be used as an operation memory of a
processing unit 1222. Ahost interface 1223 may include data exchange protocols of a host that may be connected to thememory card 1200. Anerror correction block 1224 may detect and/or may correct errors that may be included in data readout from a multi bitsemiconductor memory device 1210. Amemory interface 1225 may interface with thesemiconductor memory device 1210 of at least some example embodiments. Theprocessing unit 1222 may perform every control operation for exchanging data of thememory controller 1220. Even though not depicted in drawings, it may be apparent to one of ordinary skill in the art that thememory card 1200 according to example embodiments of the inventive concept may include a ROM (not illustrated) storing code data for interfacing with the host.FIG. 20 is a schematic block diagram illustrating an example of information processing systems including a semiconductor device fabricated by the process of example embodiments. - Referring to
FIG. 20 , aninformation processing system 1300 may include a 3Dsemiconductor memory system 1310 including a 3D semiconductor memory device according to example embodiments of the inventive concept. Thesemiconductor memory system 1310 may be mounted to an information processing system, for example, a mobile device and/or a desktop computer. Theinformation processing system 1300 may also include amodem 1320, a central processing unit (CPU) 1330, aRAM 1340, and auser interface 1350, that may be electrically connected to asystem bus 1360. Thesemiconductor memory system 1310 may be configured similarly to that described with respect toFIG. 20 , and may include a 3Dsemiconductor memory device 1311, and amemory controller 1312. Amemory system 1310 may be a solid state drive SSD, and data that may be processed by theCPU 1330 and/or input from the outside may be stored in the SSD. Theinformation processing system 1300 configured as described and including a 3D semiconductor memory device may reliably store a large amount of data in thesemiconductor memory system 1310. Thesemiconductor memory system 1310 may conserve resources for error correction and a high speed data exchange function may be provided. Although not illustrated in the drawing, it may be apparent to those of ordinary skill in the art that theinformation processing system 1300 may also include an application chipset, a camera image processor (CIS) and/or an input/output device. - Furthermore, a semiconductor memory device and/or memory system that may include the same may be packaged in various types of ways. For instance, the semiconductor memory device and/or memory system may be employed in a Package on Package (PoP), Ball Grid Array (BGA), Chip Scale Package (CSP), Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-line Package (PDIP), Die in Waffle Pack, Die in Wafer Form, Chip On Board (COB), Ceramic Dual In-line Package (CERDIP), Plastic Metric Quad Flat Pack (MQFP), Thin Quad Flat Pack (TQFP), Small Outline Integrated Circuit (SOIC), Shrink Small Outline Package (SSOP), Thin Small Outline Package (TSOP), System In Package (SIP), Multi Chip Package (MCP), Wafer-level Fabricated Package (WFP), and/or Wafer-level Processed Stack Package (WSP).
- According to example embodiments, the use of the CMP slurry composition allows a silicon-free organic layer to be polished with selectivity higher than 6:1 with respect to an oxide layer. For example, when a polishing process is performed using the CMP slurry composition, it is possible to obtain an etch selectivity, which is a ratio in etch rate of the organic layer with respect to the oxide layer, ranging from about 6:1 to about 430:1. Thus, a CMP composition having an etch selectivity suitable for a desired semiconductor device can be used in the CMP process. Further, the use of the CMP slurry composition may not result in a process failure, such as peeling of delamination. Accordingly, it is possible to fabricate semiconductor devices without the process failure.
- While example embodiments have been particularly shown and described, it will be understood by one of ordinary skill in the art that variations in form and detail may be made therein without departing from the spirit and scope of the attached claims.
Claims (18)
1. A chemical mechanical polishing (CMP) slurry composition for polishing a layer, the composition comprising:
from about 0.001% to about 5% by weight of oxide-polishing particles;
from about 0.1% to about 5% by weight of an oxidant;
from 0% to about 5% by weight of a polishing regulator;
from 0% to about 3% by weight of a surfactant;
from 0% to about 3% by weight of a pH regulator; and
from about 79% to about 99.889% by weight of deionized water.
2. The CMP slurry composition of claim 1 , wherein the oxide-polishing particles include at least one of silica (SiO2), ceria (CeO2), and alumina (Al2O3).
3. The CMP slurry composition of claim 1 , wherein the oxide-polishing particles have a grain size ranging from about 30 nm to about 120 nm.
4. The CMP slurry composition of claim 1 , wherein the oxidant comprises at least one of hydrogen peroxide, superoxide, dioxygenyl, ozone, ozonide, peroxide, fluorine, chlorine, chlorite, chlorate, perchlorate, halogen compounds, nitric acid, nitrate, hypochlorite, hypohalite, chromium trioxide, pyridinium chlorochromate, chromate, dichromate, chromium compound, potassium permanganate, permanganate, sodium perborate, nitrous oxide, 2,2′-dipyridisulfide, lead dioxide(PbO2), manganese dioxide(MnO2), copper oxide(CuO), ferric trichloride(FeCl3), perchloric acid (HClO4), ferric nitrate(Fe(NO)3), sulfate, and potassium persulfate,(K2S2O8).
5. The CMP slurry composition of claim 1 , wherein the polishing regulator comprises at least one of organic acid, inorganic acid, nitric acid, nitrate, sulfuric acid, peroxydisulfuric acid, peroxymonosulfuric acid, sulfonic acid, acetic acid, citric acid, formic acid, gluconic acid, lactic acid, oxalic acid, tartaric acid, carboxylic acid, chloric acid, chlorous acid, hypochlorous acid, perchloric acid, halogen oxoacid, ascorbic acid, vinylogous carboxylic acid, amino acid, histidine, glycine, arginine, hydrochloric acid, fluoric acid, and phosphoric acid.
6. The CMP slurry composition of claim 1 , wherein the surfactant is anionic or non-ionic.
7. The CMP slurry composition of claim 1 , wherein the surfactant comprises at least one of lauryl myristyl alcohol series, methyl-oxirane polymer series, whose hydrophile lipophile balance (HLB) is 12 or higher, ethylenediamine, ethoxylated and propoxylated alcohol series, 2-methyloxirane, oxirane series, polyethylene glycol, and polysorbate series.
8. The CMP slurry composition of claim 1 , wherein the surfactant comprises at least one of benzalkonium chloride, alkyl benzene sulfonate, phemerol chloride, ammonium lauryl sulfate, sodium lauryl ether sulfate, sodium myreth sulfate, dioctyl sodium sulfosuccinate, perfluorooctanesulfonate, perfluorobutanesulfonate, linear alkylbenzene sulfonate, sodium stearate, sodium lauroyl sarcosinate, cetyl trimethylammonium bromide, cetyl trimethylammonium chloride, perfluorononanoate, perfluorooctanoate, octenidine dihydrochloride, 5-bromo-5-nitro-1,3-dioxane, dimethyl dioctadecylammonium chloride, cetrimonium bromide, dioctadecyldimethylammonium bromide, octaethylene glycol monododecyl ether, glyceryl laurate, and polyethoxylated tallow amine.
9. The CMP slurry composition of claim 1 , wherein the pH regulator includes at least one acidic material comprising one of poly acrylic acid, carboxylic acid, nitric acid, sulfuric acid and sulfonic acid or at least one basic material comprising one of potassium hydroxide, sodium hydroxide, ammonia water, tetramethylammonium hydroxide, tetraethylammonium hydroxide, and tetrabuthylammonium hydroxide.
10. The CMP slurry composition of claim 1 , wherein the composition has a pH in a range of 2.0˜5.0.
11-19. (canceled)
20. A chemical mechanical polishing (CMP) slurry composition, comprising:
a first concentration of oxide-polishing particles;
a second concentration of an oxidant;
a third concentration of a polishing regulator;
a fourth concentration of a surfactant;
a fifth concentration of a pH regulator; and
a sixth concentration of deionized water;
the slurry composition being configured to etch a first type of layer at a different rate than a second type of layer.
21. The CMP slurry composition of claim 20 , wherein:
the first type of layer comprises an organic layer; and
the second type of layer comprises an oxide layer.
22. The CMP slurry composition of claim 21 , wherein:
an etch selectivity of the organic layer with respect to the oxide layer is in a range between 6:1 and 430:1; and
the organic layer is a mask layer.
23. The CMP slurry composition of claim 20 , wherein:
the first concentration ranges from about 0.001% to about 5% by weight;
the second concentration ranges from about 0.1% to about 5% by weight;
the third concentration ranges from 0% to about 5% by weight;
the fourth concentration ranges from 0% to about 3% by weight;
the fifth concentration ranges from 0% to about 3% by weight; and
the sixth concentration ranges from about 79% to about 99.889% by weight.
24. The composition of claim 21 , wherein the organic layer comprises at least one of a low silicon layer and a silicon-free layer.
25. (canceled)
26. The CMP slurry composition of claim 1 , wherein the layer comprises at least one of an organic layer, a low silicon layer and a silicon-free layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/825,846 US9343326B2 (en) | 2013-07-17 | 2015-08-13 | CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130084279 | 2013-07-17 | ||
KR10-2013-0084279 | 2013-07-17 | ||
KR1020140005583A KR20150009914A (en) | 2013-07-17 | 2014-01-16 | CMP composition for polishing an organic layer and method of forming a semiconductor device using the composition |
KR10-2014-0005583 | 2014-01-16 | ||
KR1020140056408A KR102352229B1 (en) | 2013-07-17 | 2014-05-12 | CMP composition for polishing an organic layer and method of forming a semiconductor device using the composition |
KR10-2014-0056408 | 2014-05-12 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/825,846 Continuation US9343326B2 (en) | 2013-07-17 | 2015-08-13 | CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20150021513A1 true US20150021513A1 (en) | 2015-01-22 |
Family
ID=52342804
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/311,857 Abandoned US20150021513A1 (en) | 2013-07-17 | 2014-06-23 | Cmp slurry composition for polishing an organic layer and method of forming a semiconductor device using the same |
US14/825,846 Active US9343326B2 (en) | 2013-07-17 | 2015-08-13 | CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/825,846 Active US9343326B2 (en) | 2013-07-17 | 2015-08-13 | CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same |
Country Status (1)
Country | Link |
---|---|
US (2) | US20150021513A1 (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170107405A1 (en) * | 2014-11-14 | 2017-04-20 | Samsung Electronics Co., Ltd. | Slurry compounds and methods of fabricating semiconductor devices using the same |
CN107636110A (en) * | 2015-05-15 | 2018-01-26 | 三星Sdi株式会社 | For organic film slurry composition for CMP and use its Ginding process |
US9960169B2 (en) | 2015-09-01 | 2018-05-01 | Samsung Electronics Co., Ltd. | Methods of manufacturing semiconductor devices |
CN108054085A (en) * | 2017-03-30 | 2018-05-18 | 睿力集成电路有限公司 | Memory and preparation method thereof |
US10032890B2 (en) | 2015-12-08 | 2018-07-24 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor devices |
US10287468B2 (en) * | 2014-11-19 | 2019-05-14 | Samsung Sdi Co., Ltd. | CMP slurry composition for organic film and polishing method using same |
US10640681B1 (en) * | 2018-10-20 | 2020-05-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for tungsten |
US10665500B1 (en) * | 2018-12-07 | 2020-05-26 | Yangtze Memory Technologies Co., Ltd. | Methods of semiconductor device fabrication |
CN111286334A (en) * | 2020-03-19 | 2020-06-16 | 厦门思美科新材料有限公司 | Etching solution for one-step etching of ITO/Ag/ITO film |
CN111315836A (en) * | 2017-11-10 | 2020-06-19 | 三星Sdi株式会社 | Organic film CMP slurry composition and polishing method using the same |
WO2021023748A1 (en) * | 2019-08-08 | 2021-02-11 | Basf Se | Compositions for tungsten etching inhibition |
CN112680227A (en) * | 2020-12-23 | 2021-04-20 | 江苏奥首材料科技有限公司 | LED chip roughening liquid and preparation method and application thereof |
US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
US20220235461A1 (en) * | 2021-01-25 | 2022-07-28 | SK Hynix Inc. | Method of area-selective deposition and method of fabricating an electronic device using the same |
WO2022221248A1 (en) * | 2021-04-16 | 2022-10-20 | Entegris, Inc. | Cmp compositions for polishing dielectric materials |
US11479863B2 (en) * | 2018-09-12 | 2022-10-25 | Fujifilm Corporation | Chemical solution and method for treating substrate |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10570313B2 (en) | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
CN108091553B (en) * | 2016-11-23 | 2020-10-09 | 中芯国际集成电路制造(北京)有限公司 | Method for forming mask pattern |
KR20180071100A (en) | 2016-12-19 | 2018-06-27 | 삼성전자주식회사 | Vertical structure non-volatile memory device and method for manufacturing the same |
US10037889B1 (en) | 2017-03-29 | 2018-07-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films |
WO2022060735A1 (en) | 2020-09-18 | 2022-03-24 | Cmc Materials, Inc. | Silica-based slurry for selective polishing of carbon-based films |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070043230A1 (en) * | 2003-07-30 | 2007-02-22 | Jha Sunil C | Polishing slurries and methods for chemical mechanical polishing |
US20130248756A1 (en) * | 2010-12-10 | 2013-09-26 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100360787B1 (en) * | 1996-02-07 | 2003-01-29 | 히다치 가세고교 가부시끼가이샤 | A cerium oxide abrasive, a semiconductor chip and a semiconductor device, a manufacturing method thereof, and a substrate magic |
JP3265199B2 (en) | 1996-09-30 | 2002-03-11 | 株式会社東芝 | Chemical mechanical polishing method, abrasive used in chemical mechanical polishing method, and method for manufacturing semiconductor device |
KR100456319B1 (en) * | 2000-05-19 | 2004-11-10 | 주식회사 하이닉스반도체 | Method for forming gate of semiconductor device by using polishing selectivity difference between polymer and oxide layer |
KR20050057208A (en) * | 2002-09-06 | 2005-06-16 | 아사히 가라스 가부시키가이샤 | Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit |
TWI241626B (en) * | 2003-06-02 | 2005-10-11 | Toshiba Corp | Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
JP4202826B2 (en) | 2003-06-02 | 2008-12-24 | 株式会社東芝 | Chemical mechanical polishing method of organic film and manufacturing method of semiconductor device |
US20110045741A1 (en) | 2005-04-28 | 2011-02-24 | Techno Semichem Co., Ltd. | Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer |
JP4768335B2 (en) * | 2005-06-30 | 2011-09-07 | 株式会社東芝 | Chemical mechanical polishing method of organic film, semiconductor device manufacturing method, and program |
JP4868840B2 (en) | 2005-11-30 | 2012-02-01 | Jsr株式会社 | Manufacturing method of semiconductor device |
KR100771891B1 (en) | 2006-11-10 | 2007-11-01 | 삼성전자주식회사 | Method of forming fine patterns of semiconductor device using double patterning process |
KR20090026984A (en) | 2007-09-11 | 2009-03-16 | 테크노세미켐 주식회사 | A slurry composition for chemical mechanical polishing of insulation layer |
JP2009123782A (en) * | 2007-11-12 | 2009-06-04 | Toshiba Corp | Method for manufacturing semiconductor device |
JP2010041027A (en) | 2008-02-18 | 2010-02-18 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and method of manufacturing the same, and chemical mechanical polishing method |
JP2010129941A (en) | 2008-12-01 | 2010-06-10 | Fujifilm Corp | Metal polishing liquid, and chemical mechanical polishing method |
KR101396232B1 (en) * | 2010-02-05 | 2014-05-19 | 한양대학교 산학협력단 | Slurry for polishing phase change material and method for patterning polishing phase change material using the same |
JP5141792B2 (en) | 2010-06-29 | 2013-02-13 | 日立化成工業株式会社 | CMP polishing liquid and polishing method |
-
2014
- 2014-06-23 US US14/311,857 patent/US20150021513A1/en not_active Abandoned
-
2015
- 2015-08-13 US US14/825,846 patent/US9343326B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070043230A1 (en) * | 2003-07-30 | 2007-02-22 | Jha Sunil C | Polishing slurries and methods for chemical mechanical polishing |
US20130248756A1 (en) * | 2010-12-10 | 2013-09-26 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170107405A1 (en) * | 2014-11-14 | 2017-04-20 | Samsung Electronics Co., Ltd. | Slurry compounds and methods of fabricating semiconductor devices using the same |
US9994737B2 (en) * | 2014-11-14 | 2018-06-12 | Samsung Electronics Co., Ltd. | Slurry compounds and methods of fabricating semiconductor devices using the same |
US10287468B2 (en) * | 2014-11-19 | 2019-05-14 | Samsung Sdi Co., Ltd. | CMP slurry composition for organic film and polishing method using same |
CN107636110A (en) * | 2015-05-15 | 2018-01-26 | 三星Sdi株式会社 | For organic film slurry composition for CMP and use its Ginding process |
US9960169B2 (en) | 2015-09-01 | 2018-05-01 | Samsung Electronics Co., Ltd. | Methods of manufacturing semiconductor devices |
US10032890B2 (en) | 2015-12-08 | 2018-07-24 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor devices |
US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
CN108054085A (en) * | 2017-03-30 | 2018-05-18 | 睿力集成电路有限公司 | Memory and preparation method thereof |
US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
CN111315836A (en) * | 2017-11-10 | 2020-06-19 | 三星Sdi株式会社 | Organic film CMP slurry composition and polishing method using the same |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US11479863B2 (en) * | 2018-09-12 | 2022-10-25 | Fujifilm Corporation | Chemical solution and method for treating substrate |
US10640681B1 (en) * | 2018-10-20 | 2020-05-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for tungsten |
TWI716804B (en) * | 2018-12-07 | 2021-01-21 | 大陸商長江存儲科技有限責任公司 | Method of fabricating a semiconductor device |
WO2020113551A1 (en) * | 2018-12-07 | 2020-06-11 | Yangtze Memory Technologies Co., Ltd. | Methods of semiconductor device fabrication |
US10665500B1 (en) * | 2018-12-07 | 2020-05-26 | Yangtze Memory Technologies Co., Ltd. | Methods of semiconductor device fabrication |
CN114080473A (en) * | 2019-08-08 | 2022-02-22 | 巴斯夫欧洲公司 | Composition for inhibiting tungsten etching |
WO2021023748A1 (en) * | 2019-08-08 | 2021-02-11 | Basf Se | Compositions for tungsten etching inhibition |
CN111286334A (en) * | 2020-03-19 | 2020-06-16 | 厦门思美科新材料有限公司 | Etching solution for one-step etching of ITO/Ag/ITO film |
CN112680227A (en) * | 2020-12-23 | 2021-04-20 | 江苏奥首材料科技有限公司 | LED chip roughening liquid and preparation method and application thereof |
US20220235461A1 (en) * | 2021-01-25 | 2022-07-28 | SK Hynix Inc. | Method of area-selective deposition and method of fabricating an electronic device using the same |
WO2022221248A1 (en) * | 2021-04-16 | 2022-10-20 | Entegris, Inc. | Cmp compositions for polishing dielectric materials |
Also Published As
Publication number | Publication date |
---|---|
US20150348798A1 (en) | 2015-12-03 |
US9343326B2 (en) | 2016-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9343326B2 (en) | CMP slurry composition for polishing an organic layer and method of forming a semiconductor device using the same | |
KR102352229B1 (en) | CMP composition for polishing an organic layer and method of forming a semiconductor device using the composition | |
US10903327B2 (en) | Three-dimensional semiconductor memory devices and methods of fabricating the same | |
US9490371B2 (en) | Nonvolatile memory devices and methods of fabricating the same | |
US8883611B2 (en) | Methods of fabricating semiconductor devices having air gaps in dielectric layers | |
KR102046976B1 (en) | Semiconductor memory device and method for fabricating the same | |
US20150249093A1 (en) | Semiconductor devices | |
US8377817B2 (en) | Three dimensional semiconductor memory device and method of manufacturing the same | |
US20120146125A1 (en) | Non-volatile memory devices and methods of fabricating the same | |
US9728446B2 (en) | Method of fabricating semiconductor device | |
US9287167B2 (en) | Vertical type memory device | |
US9269720B1 (en) | Methods of fabricating semiconductor devices | |
US20150348988A1 (en) | Semiconductor memory element and production method therefor | |
US9576955B2 (en) | Semiconductor device having strained channel layer and method of manufacturing the same | |
US9601496B2 (en) | Semiconductor device having sacrificial layer pattern with concave sidewalls and method fabricating the same | |
US9378979B2 (en) | Methods of fabricating semiconductor devices and devices fabricated thereby | |
KR101489457B1 (en) | Semiconductor memory device | |
US20110147827A1 (en) | Flash memory with partially removed blocking dielectric in the wordline direction | |
US20100093165A1 (en) | Method of fabricating integrated circuit semiconductor device having gate metal silicide layer | |
KR20100048731A (en) | Method of forming semiconductor device using the alo mask | |
US11393688B2 (en) | Semiconductor contact formation | |
KR20120121725A (en) | Method for fabricating semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIM, YUN-JEONG;KIM, SANGKYUN;KIM, KWANGBOK;AND OTHERS;SIGNING DATES FROM 20140526 TO 20140609;REEL/FRAME:033168/0643 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |