US20140239569A1 - Universal clamping fixture to maintain laminate flatness during chip join - Google Patents
Universal clamping fixture to maintain laminate flatness during chip join Download PDFInfo
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- US20140239569A1 US20140239569A1 US13/777,229 US201313777229A US2014239569A1 US 20140239569 A1 US20140239569 A1 US 20140239569A1 US 201313777229 A US201313777229 A US 201313777229A US 2014239569 A1 US2014239569 A1 US 2014239569A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/061—Work-clamping means adapted for holding a plurality of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75703—Mechanical holding means
- H01L2224/75704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/4984—Retaining clearance for motion between assembled parts
- Y10T29/49842—Between tube-forming helical coils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49998—Work holding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/50—Convertible metal working machine
Definitions
- the present disclosure relates to a clamping apparatus and method for clamping a workpiece during processing, and more particularly, a clamping apparatus and method for clamping a workpiece during processing which connects the workpiece to another workpiece on a laminate.
- Fabrication of organic flip chip electronic modules typically includes a chip join reflow on a laminate, such as a thin-laminate organic circuit board, for example, a printed wiring board (PWB) or printed circuit board (PCB).
- a laminate such as a thin-laminate organic circuit board, for example, a printed wiring board (PWB) or printed circuit board (PCB).
- PWB printed wiring board
- PCB printed circuit board
- Undesirable laminate warpage can also occur during processing of a chip/die and a laminate, for example, during flip chip fabrication which can present itself in a variety of shapes and each shape can affect the process in a different way. Die stresses can manifest themselves as a cracked die, or separations of the dielectric layers within the die (e.g., typically, white bumps). Increased laminate warpage (also referred to as warping) during die reflow can also lead to increased module warpage at the end of a bond and assembly process, which can cause the module to fail final co-planarity specifications. Laminates can have varying shapes depending on their location within the panel prior to dicing, which can lead to varying results after chip join reflow if there are no provisions to compensate for the laminate warpage.
- Laminate warpage or warping may be defined by the laminate's curvature from a flat surface of the bottom of the laminate.
- laminate warpage may be defined by a planar surface mating with the bottom of the laminate, thereby providing a horizontal plane to reference any warping of the laminate.
- Previous attempt to alleviate the problem of laminate warpage during processing includes using: A) Copper balancing methods in the substrate design, which have the disadvantage of placing constraints on the design of the package that may preclude the product from meeting electrical performance requirements; B) Permanent stiffeners that are attached to the laminate around the perimeter, which have the disadvantage of being expensive, permanent, and have limited success in keeping the chipsite area flat; C) Temporary stiffeners also have the disadvantage of being expensive and difficult to remove, and can interfere with the standard manufacturing process; and D) Fixtures that rigidly constrain the laminate and have the disadvantage of not allowing for thermal expansions have limited effectiveness and interfere with standard processes.
- Two sets of opposing clamping mechanisms are mounted to the base and each of the clamping mechanisms include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece.
- Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads are configured to mate with a top surface of the first workpiece.
- a biasing member is coupled to each of the housings.
- the biasing members communicate with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- a method of manufacturing a clamping apparatus for maintaining a workpiece flatness during processing includes: mounting two sets of opposing clamping mechanisms on a base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removably overlapping relation to a first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and coupling a biasing member to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- a method for maintaining a workpiece flatness during processing includes: receiving a first workpiece on a base having a planar surface; positioning a second workpiece between two sets of opposing clamping mechanisms mounted to the base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for receiving the second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and applying a downward vertical pressure to the first workpiece using a biasing member coupled to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- FIG. 1 is an isometric view of a clamping fixture including clamping mechanisms in an engaged position on a base having a frame, according to according to an embodiment of the disclosure;
- FIG. 2 is an isometric view of the clamping fixture shown in FIG. 1 having the clamping mechanism in a non-engaged position;
- FIG. 3 is a side elevational view of the clamping fixture shown in FIG. 1 ;
- FIG. 4 is a detail side elevational view of the clamping mechanism and the base shown in FIGS. 1 and 3 ;
- FIG. 5 is a detail side elevation view of an alternative embodiment of a clamping mechanism having a spring loaded element in an expanded state and having a housing of the clamping mechanism in a rest state;
- FIG. 6 is a detail side elevational view of the clamping mechanism shown in FIG. 5 having the spring loaded element in a compressed state and the housing in an elevated position.
- a clamping fixture 10 includes a frame 14 over a base 20 (also shown in FIG. 4 ).
- the frame 14 divides the fixture into four work areas 18 and is used to locate the first workpieces in a X,Y direction. Alternatively, the frame can be divided into another number of work areas depending on the overall size of the fixture and the size of the workpieces.
- the frame may be comprise, for example, stainless steel.
- the clamping fixture 10 is an embodiment of a clamping apparatus may be used in a corresponding method according to an embodiment of the invention.
- the base 20 includes a planar surface configured to receive a first workpiece embodied as a laminate 70 .
- the frame 14 may have work areas 55 mm long to accommodate 55 mm laminates.
- Each clamping mechanism 30 includes a clamp head 32 at a distal end of a rod embodied as spring wire 34 extending from a housing 40 .
- the spring wire may be comprised of, for example, 304 grade stainless steel. Alternatively, the spring wire may be comprised of 316 stainless steel, or 17-7 stainless steel. For example, in higher temperature applications (processing greater than 290° C.), austenitic nickel-chromium-based superalloys (for example, InconelTM) can be used as an alternative to stainless steel.
- the clamping mechanism via the spring wire may apply a force to the laminate in the range of about, 0.1 lbs to 2 lbs per clamping head.
- a range of compliance of the clamping heads may be, for example, between about 0.010′′ to 0.050′′.
- the housings 40 are mounted through the frame 14 and to the base 20 as shown in FIG. 1 , which includes four housings on the interior of the frame which have opposing spring wires 34 and clamp heads 32 in opposing relation to each other to extend over two work areas 18 .
- the spring wire may be hardened to a specified hardness.
- the spring wire 34 may be attached to the housing at an attachment junction or junction point.
- the clamp head 32 is in overlapping relation to the laminate 70 .
- Each set of the clamp heads 32 for a work area 18 are in opposing spaced relationship to each other defining a second workpiece area 72 for a second workpiece embodied as a die 80 .
- the die 80 is positioned over the laminate 70 , as shown in FIG. 4 .
- the opposing clamp heads 32 may define the second workpiece area 72 with specified dimensions which can be adjusted for different sized workpieces.
- the clamp heads 32 are configured to mate with the top surface of the laminate 70 .
- the clamp heads 32 may be positioned at various locations around a second workpiece (or around the second workpiece area 72 ), in the present disclosure, the die 80 , to provide the vertical downward force to the laminate thereby maintaining flatness of the laminate within the die area (i.e., the second workpiece area 72 ) during a chip join to the laminate.
- the location of the clamp heads 32 may be just outside a chip edge where capacitors may be absent. Because of the vertical force of the clamp heads 32 on the laminate, the laminate 70 is free to move in a horizontal direction in a plane parallel to the planar surface of the base 20 as the laminate experiences thermal expansion, and the laminate does not expand out of the horizontal plane in the vertical direction.
- a biasing member embodied as a spring washer 50 is coupled to each of the housings 40 .
- the spring washer 50 communicates with the spring wires 34 via the housings 40 and apply a downward vertical force to the housings 40 and the spring wires 34 and therethrough the clamp heads 32 for applying a downward vertical pressure to the laminate 70 .
- the spring washer 50 is affixed to a bottom side of the base 20 using a fastener 54 beneath the spring washer 50 .
- the fastener 54 is fastened to a shaft 52 which extends through the base 20 and is integral with the housing 40 on a top side of the base 20 .
- the clamping mechanisms 30 are rotatably connected through the frame 14 and connected to the base 20 , and rotate in a horizontal plane defined by the planar surface of the base 20 to a non-engaged position, as shown in FIG. 2 , freeing the clamp heads 32 from overlapping the laminate 70 .
- the clamping heads 32 are rotatable to be positioned along axes defined by each leg 15 of the frame 14 .
- the spring wires 34 and clamp heads 32 are rotatable to an engaged position (as shown in FIG. 1 ) with each set of the clamp heads 32 in opposing spaced relationship to each other overlapping the laminate 70 for the clamp heads 32 to provide the downward vertical pressure to the laminate 70 .
- an alternative clamping mechanism 100 is vertically moveable and includes similar elements as the clamping mechanism 30 shown in FIGS. 1-4 which elements have the same reference numerals.
- the moveable clamping mechanism 100 includes a spring loaded element embodied as a spring 110 wrapped around a moveable shaft 120 .
- the spring 110 has a specified stiffness to exert a downward force on the housing 40 and thereby the clamping heads 32 , similar to the clamping mechanism 30 .
- the spring 110 has a higher compliance to allow the spring 110 to be compressed as shown in FIG. 6 .
- the housing via the extension of the shaft through the base 20 , is elevated off of the base 20 .
- the clamping heads 32 are likewise elevated off of the laminate 70 in a disengaged position.
- the housing 40 rests on the base 20 and likewise the clamping heads 32 rest on the laminate 70 in an engaged position.
- the movement of the housing as described above can be initiated automatically using a tool which may include electrical impulses to activate the spring, housing, shaft interaction for the housing to be elevated off and onto the base 20 .
- a tool which may include electrical impulses to activate the spring, housing, shaft interaction for the housing to be elevated off and onto the base 20 .
- an automated tool may consist of a mechanism that engages the bottom of the shaft 52 , moving it in the vertical direction.
- the tool can activate the spring, and the shaft can be rotated, once the spring is compressed and the clamping heads 32 are no longer resting on the laminate 70 .
- a method according to an embodiment of the invention for maintaining a workpiece flatness during processing includes receiving the first workpiece, i.e., the lamination 70 on the planar surface of the base 20 .
- the second workpiece, i.e., the die 80 is positioned between the two sets of clamp heads 32 of the opposing clamping mechanisms 30 , as shown in FIG. 4 and is shown logically in relation to the second workpiece area 72 shown in FIG. 1 defined by the clamp heads 32 .
- the clamp heads 32 are configured to mate with the top surface of the laminate 70 .
- the spring washer 50 applies downward force to the housing and thereby the spring wires 34 and the clamp heads 32 on the laminate 70 .
- the downward vertical force to the laminate 70 results in the laminate maintaining flatness during processing of the laminate 70 and the die 80 .
- the laminate 70 may be placed in the clamping fixture 10 prior to applying flux to connect the laminate to the die 80 .
- the laminate may remain in the fixture 10 through a chip join reflow process.
- the fixture 10 is configured to permit almost full access to the top surface of the laminate so that, for example, capacitors can be placed and reflowed at the same time as the chip.
- the clamping fixture 10 uses the rotating clamping mechanisms 30 that can be rotated out of the way for loading/unloading of the laminate 70 , and then rotated back for engagement of the clamp heads 32 .
- Advantages of the rotating clamping mechanisms include ease of use, and discouraging damage/debris generation as the clamp 32 is rotated into an engagement position over the laminate.
- the ability of the clamping mechanism 30 to apply force can be specified or adjusted by adjusting the diameter of the spring wire, the length of the spring wire, as well as the material of the spring wire, and can be optimized for the particular application.
- the fixture of the present disclosure can be re-configured for different laminate sizes, different die sizes, and different laminate constructions.
- the present disclosure constrains the laminate along a vertical axis, while allowing for movement in the horizontal axis due to thermal expansion. This allows for maintaining a flat chip site area, through reflow, with minimal impact (e.g., cost and process) to the manufacturing line.
- the fixture 10 can be configured for any shape laminate, or laminate construction (coreless, thin-core, etc.), while the fixture maintains a high chip join yield by improving the laminate flatness. Further, the fixture of the present disclosure may allow a greater tolerance of a flatness specification on incoming laminates, which improves the laminate provider's yield, and thus can reduce costs.
- the embodiments of the invention provide a temporary apparatus and method of maintaining laminate flatness (particularly in the chipsite area), during a chip join process so as to ensure desirable chip join yields.
- the present disclosure enables nearly full access to the top surface of the laminate, discrete components (capacitors, etc.) can be placed and reflowed at the same time as the chip to provide a solder connection.
- the present disclosure also has the advantage of allowing for easy implementation of the clamping fixture in a multi workspace configuration (as shown in FIGS. 1-2 ) to increase manufacturing efficiency.
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Jigs For Machine Tools (AREA)
Abstract
A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.
Description
- The present disclosure relates to a clamping apparatus and method for clamping a workpiece during processing, and more particularly, a clamping apparatus and method for clamping a workpiece during processing which connects the workpiece to another workpiece on a laminate.
- Fabrication of organic flip chip electronic modules typically includes a chip join reflow on a laminate, such as a thin-laminate organic circuit board, for example, a printed wiring board (PWB) or printed circuit board (PCB). During fabrication of an organic flip chip electronic module, particularly those modules using thin core and coreless organic laminates, it is important that the laminate remain as flat as possible in the chip site area during a chip join reflow. Failure to keep the laminate flat can result in undesirable solder bridging (that is, shorts), as well as chip interconnect opens. Undesirable die stresses can also result from variations in the laminate shape during reflow. Undesirable laminate warpage can also occur during processing of a chip/die and a laminate, for example, during flip chip fabrication which can present itself in a variety of shapes and each shape can affect the process in a different way. Die stresses can manifest themselves as a cracked die, or separations of the dielectric layers within the die (e.g., typically, white bumps). Increased laminate warpage (also referred to as warping) during die reflow can also lead to increased module warpage at the end of a bond and assembly process, which can cause the module to fail final co-planarity specifications. Laminates can have varying shapes depending on their location within the panel prior to dicing, which can lead to varying results after chip join reflow if there are no provisions to compensate for the laminate warpage.
- Laminate warpage or warping may be defined by the laminate's curvature from a flat surface of the bottom of the laminate. Alternatively, laminate warpage may be defined by a planar surface mating with the bottom of the laminate, thereby providing a horizontal plane to reference any warping of the laminate.
- Previous attempt to alleviate the problem of laminate warpage during processing, for example, during flip chip electronic module processing, includes using: A) Copper balancing methods in the substrate design, which have the disadvantage of placing constraints on the design of the package that may preclude the product from meeting electrical performance requirements; B) Permanent stiffeners that are attached to the laminate around the perimeter, which have the disadvantage of being expensive, permanent, and have limited success in keeping the chipsite area flat; C) Temporary stiffeners also have the disadvantage of being expensive and difficult to remove, and can interfere with the standard manufacturing process; and D) Fixtures that rigidly constrain the laminate and have the disadvantage of not allowing for thermal expansions have limited effectiveness and interfere with standard processes.
- It would therefore be desirable to provide an apparatus and method for constraining a laminate particularly along a vertical axis, while allowing for movement along a horizontal plane due to thermal expansion. It is further desirable to maintain a flat chip site area through a reflow processing step with minimal impact on the process, including cost and processing time to the manufacturing line.
- In an aspect of the invention a clamping apparatus for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and each of the clamping mechanisms include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings. The biasing members communicate with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- In another aspect of the invention, a method of manufacturing a clamping apparatus for maintaining a workpiece flatness during processing includes: mounting two sets of opposing clamping mechanisms on a base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removably overlapping relation to a first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and coupling a biasing member to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- In another aspect of the invention, a method for maintaining a workpiece flatness during processing includes: receiving a first workpiece on a base having a planar surface; positioning a second workpiece between two sets of opposing clamping mechanisms mounted to the base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for receiving the second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and applying a downward vertical pressure to the first workpiece using a biasing member coupled to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
- These and other objects, features and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings. The various features of the drawings are not to scale as the illustrations are for clarity in facilitating one skilled in the art in understanding the invention in conjunction with the detailed description. In the drawings:
-
FIG. 1 is an isometric view of a clamping fixture including clamping mechanisms in an engaged position on a base having a frame, according to according to an embodiment of the disclosure; -
FIG. 2 is an isometric view of the clamping fixture shown inFIG. 1 having the clamping mechanism in a non-engaged position; -
FIG. 3 is a side elevational view of the clamping fixture shown inFIG. 1 ; -
FIG. 4 is a detail side elevational view of the clamping mechanism and the base shown inFIGS. 1 and 3 ; -
FIG. 5 is a detail side elevation view of an alternative embodiment of a clamping mechanism having a spring loaded element in an expanded state and having a housing of the clamping mechanism in a rest state; and -
FIG. 6 is a detail side elevational view of the clamping mechanism shown inFIG. 5 having the spring loaded element in a compressed state and the housing in an elevated position. - Referring to
FIGS. 1 and 2 , aclamping fixture 10 includes aframe 14 over a base 20 (also shown inFIG. 4 ). Theframe 14 divides the fixture into fourwork areas 18 and is used to locate the first workpieces in a X,Y direction. Alternatively, the frame can be divided into another number of work areas depending on the overall size of the fixture and the size of the workpieces. The frame may be comprise, for example, stainless steel. Theclamping fixture 10 is an embodiment of a clamping apparatus may be used in a corresponding method according to an embodiment of the invention. Thebase 20 includes a planar surface configured to receive a first workpiece embodied as alaminate 70. For example, theframe 14 may have work areas 55 mm long to accommodate 55 mm laminates. Two sets of opposingclamping mechanisms 30 are mounted through theframe 14 and to thebase 20. The frame may be about 0.5 mm thick, and is positioned on the base to locate thelaminates 70. Eachclamping mechanism 30 includes aclamp head 32 at a distal end of a rod embodied asspring wire 34 extending from ahousing 40. The spring wire may be comprised of, for example, 304 grade stainless steel. Alternatively, the spring wire may be comprised of 316 stainless steel, or 17-7 stainless steel. For example, in higher temperature applications (processing greater than 290° C.), austenitic nickel-chromium-based superalloys (for example, Inconel™) can be used as an alternative to stainless steel. In an example, the clamping mechanism via the spring wire may apply a force to the laminate in the range of about, 0.1 lbs to 2 lbs per clamping head. A range of compliance of the clamping heads may be, for example, between about 0.010″ to 0.050″. - The
housings 40 are mounted through theframe 14 and to thebase 20 as shown inFIG. 1 , which includes four housings on the interior of the frame which have opposingspring wires 34 andclamp heads 32 in opposing relation to each other to extend over twowork areas 18. The spring wire may be hardened to a specified hardness. Thespring wire 34 may be attached to the housing at an attachment junction or junction point. Theclamp head 32 is in overlapping relation to thelaminate 70. - Each set of the
clamp heads 32 for awork area 18 are in opposing spaced relationship to each other defining asecond workpiece area 72 for a second workpiece embodied as adie 80. The die 80 is positioned over thelaminate 70, as shown inFIG. 4 . Theopposing clamp heads 32 may define thesecond workpiece area 72 with specified dimensions which can be adjusted for different sized workpieces. Theclamp heads 32 are configured to mate with the top surface of thelaminate 70. Theclamp heads 32 may be positioned at various locations around a second workpiece (or around the second workpiece area 72), in the present disclosure, thedie 80, to provide the vertical downward force to the laminate thereby maintaining flatness of the laminate within the die area (i.e., the second workpiece area 72) during a chip join to the laminate. The location of theclamp heads 32 may be just outside a chip edge where capacitors may be absent. Because of the vertical force of theclamp heads 32 on the laminate, thelaminate 70 is free to move in a horizontal direction in a plane parallel to the planar surface of thebase 20 as the laminate experiences thermal expansion, and the laminate does not expand out of the horizontal plane in the vertical direction. - Referring to
FIG. 4 , a biasing member embodied as aspring washer 50 is coupled to each of thehousings 40. Thespring washer 50 communicates with thespring wires 34 via thehousings 40 and apply a downward vertical force to thehousings 40 and thespring wires 34 and therethrough theclamp heads 32 for applying a downward vertical pressure to thelaminate 70. Thespring washer 50 is affixed to a bottom side of thebase 20 using afastener 54 beneath thespring washer 50. Thefastener 54 is fastened to ashaft 52 which extends through thebase 20 and is integral with thehousing 40 on a top side of thebase 20. - Referring to
FIG. 2 , the clampingmechanisms 30 are rotatably connected through theframe 14 and connected to thebase 20, and rotate in a horizontal plane defined by the planar surface of the base 20 to a non-engaged position, as shown inFIG. 2 , freeing the clamp heads 32 from overlapping the laminate 70. Thus, the clamping heads 32 are rotatable to be positioned along axes defined by eachleg 15 of theframe 14. Thespring wires 34 and clamp heads 32 are rotatable to an engaged position (as shown inFIG. 1 ) with each set of the clamp heads 32 in opposing spaced relationship to each other overlapping the laminate 70 for the clamp heads 32 to provide the downward vertical pressure to thelaminate 70. - Referring to
FIGS. 5-6 , analternative clamping mechanism 100 is vertically moveable and includes similar elements as theclamping mechanism 30 shown inFIGS. 1-4 which elements have the same reference numerals. Themoveable clamping mechanism 100 includes a spring loaded element embodied as aspring 110 wrapped around amoveable shaft 120. Thespring 110 has a specified stiffness to exert a downward force on thehousing 40 and thereby the clamping heads 32, similar to theclamping mechanism 30. However, thespring 110 has a higher compliance to allow thespring 110 to be compressed as shown inFIG. 6 . When thespring 110 is in a compressed state as shown inFIG. 6 , the housing, via the extension of the shaft through thebase 20, is elevated off of thebase 20. The clamping heads 32 are likewise elevated off of the laminate 70 in a disengaged position. When thespring 110 is in an expanded state, as shown inFIG. 5 , thehousing 40 rests on thebase 20 and likewise the clamping heads 32 rest on the laminate 70 in an engaged position. The movement of the housing as described above can be initiated automatically using a tool which may include electrical impulses to activate the spring, housing, shaft interaction for the housing to be elevated off and onto thebase 20. For example, an automated tool (not shown) may consist of a mechanism that engages the bottom of theshaft 52, moving it in the vertical direction. Thus, the tool can activate the spring, and the shaft can be rotated, once the spring is compressed and the clamping heads 32 are no longer resting on thelaminate 70. - Referring to
FIGS. 1-6 , a method according to an embodiment of the invention for maintaining a workpiece flatness during processing includes receiving the first workpiece, i.e., thelamination 70 on the planar surface of thebase 20. The second workpiece, i.e., thedie 80 is positioned between the two sets of clamp heads 32 of the opposingclamping mechanisms 30, as shown inFIG. 4 and is shown logically in relation to thesecond workpiece area 72 shown inFIG. 1 defined by the clamp heads 32. The clamp heads 32 are configured to mate with the top surface of the laminate 70. Thespring washer 50 applies downward force to the housing and thereby thespring wires 34 and the clamp heads 32 on thelaminate 70. The downward vertical force to the laminate 70 results in the laminate maintaining flatness during processing of the laminate 70 and thedie 80. - In the embodiment of the disclosure, the laminate 70 may be placed in the
clamping fixture 10 prior to applying flux to connect the laminate to thedie 80. The laminate may remain in thefixture 10 through a chip join reflow process. Thefixture 10 is configured to permit almost full access to the top surface of the laminate so that, for example, capacitors can be placed and reflowed at the same time as the chip. - In the present embodiment of the disclosure shown in
FIGS. 1 and 2 , the clampingfixture 10 uses therotating clamping mechanisms 30 that can be rotated out of the way for loading/unloading of the laminate 70, and then rotated back for engagement of the clamp heads 32. Advantages of the rotating clamping mechanisms include ease of use, and discouraging damage/debris generation as theclamp 32 is rotated into an engagement position over the laminate. - The ability of the
clamping mechanism 30 to apply force, that is, the downward vertical force of theclamp head 32 on the laminate 70, can be specified or adjusted by adjusting the diameter of the spring wire, the length of the spring wire, as well as the material of the spring wire, and can be optimized for the particular application. Additionally, the fixture of the present disclosure can be re-configured for different laminate sizes, different die sizes, and different laminate constructions. The present disclosure constrains the laminate along a vertical axis, while allowing for movement in the horizontal axis due to thermal expansion. This allows for maintaining a flat chip site area, through reflow, with minimal impact (e.g., cost and process) to the manufacturing line. - One advantage to the present disclosure is that the
fixture 10 can be configured for any shape laminate, or laminate construction (coreless, thin-core, etc.), while the fixture maintains a high chip join yield by improving the laminate flatness. Further, the fixture of the present disclosure may allow a greater tolerance of a flatness specification on incoming laminates, which improves the laminate provider's yield, and thus can reduce costs. - Thereby, as disclosed above, the embodiments of the invention provide a temporary apparatus and method of maintaining laminate flatness (particularly in the chipsite area), during a chip join process so as to ensure desirable chip join yields. As the present disclosure enables nearly full access to the top surface of the laminate, discrete components (capacitors, etc.) can be placed and reflowed at the same time as the chip to provide a solder connection. The present disclosure also has the advantage of allowing for easy implementation of the clamping fixture in a multi workspace configuration (as shown in
FIGS. 1-2 ) to increase manufacturing efficiency. - While embodiments of the present invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that changes in forms and details may be made without departing from the spirit and scope of the present application. It is therefore intended that the present invention not be limited to the exact forms and details described and illustrated herein, but falls within the scope of the appended claims.
Claims (20)
1. A clamping apparatus for maintaining a workpiece flatness during processing, comprising:
a base having a planar surface for receiving a first workpiece;
two sets of opposing clamping mechanisms mounted to the base and each of the clamping mechanisms including a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and
a biasing member coupled to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
2. The clamping apparatus of claim 1 , wherein the first workpiece is a laminate, and the second workpiece is a die positionable over the laminate.
3. The clamping apparatus of claim 1 , wherein the second workpiece is receivable by the planar surface and positionable over the first workpiece being configured for a processing interaction between the first and the second workpiece.
4. The clamping apparatus of claim 3 , wherein the second workpiece is positioned on the planar surface in the second workpiece area, the second workpiece being positionable between the opposing sets of clamp heads and over the first workpiece.
5. The clamping apparatus of claim 1 , wherein the rod and the clamp head of each of the clamping mechanisms is rotatably connected at the housing to rotate in the horizontal plane defined by the planar surface to a non-engaged position free from overlapping the first workpiece, and the rod and the clamp heads being rotatable to an engaged position with each set of the clamp heads being in opposing spaced relationship to each other overlapping the first workpiece for the clamp heads to provide the downward vertical pressure to the first workpiece.
6. The clamping apparatus of claim 1 , further comprising:
a frame defining a work area over the base, and the housings being mounted to the base.
7. The clamping apparatus of claim 1 , further comprising:
a frame defining multiple work areas over the base, and the two sets of opposing clamping mechanisms being configured for each of the multiple work areas such that the housing are mounted to the base to provide the downward vertical force to the housings and rods and therethrough the clamp heads for applying the downward vertical pressure to a plurality of the first workpieces wherein each of the first workpieces are in the multiple work areas.
8. The clamping apparatus of claim 7 , wherein the rod and the clamp head of each of the clamping mechanisms is rotatably connected at the housings to rotate in the horizontal plane defined by the planar surface to a non-engaged position free from overlapping the first workpiece such that the rods of each of the clamping mechanisms are positioned along an axis defined by each leg of the frame, and the rod and the clamp heads being rotatable to an engaged position with each set of the clamp heads being in opposing spaced relationship to each other overlapping the first workpiece for the clamp heads to provide the downward vertical pressure to the first workpiece.
9. The clamping apparatus of claim 1 , wherein the biasing member includes a spring loaded metal element fixed to a bottom side of the base and attached to the housing on a top side of the base via a shaft through the base.
10. The clamping apparatus of claim 9 , wherein the spring loaded element compresses to a compressed state to enable the shaft to reversibly extend through the base positioning the housing in an elevated position such that the housing is in spaced relation with the base, and the shaft being movable in a reverse direction positioning the housing in a rest position such that the housing is on the base and the spring loaded element is in an expanded state.
11. The clamping apparatus of claim 1 , wherein the second workpiece area defined by the clamp heads includes specified dimensions for receiving the first workpiece.
12. The clamping apparatus of claim 1 , wherein the downward vertical force applied to the housings is applied to the rods at an attachment junction between the rods and the housings, and the downward vertical force is applied to the clamp heads via the rods.
13. A method of manufacturing a clamping apparatus for maintaining a workpiece flatness during processing, comprising:
mounting two sets of opposing clamping mechanisms on a base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removably overlapping relation to a first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for a second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and
coupling a biasing member to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads for applying a downward vertical pressure to the first workpiece such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
14. The method of claim 13 , wherein the second workpiece is receivable by the planar surface and positionable over the first workpiece for a processing interaction between the first and the second workpiece, and the second workpiece is positioned on the planar surface in the second workpiece area, the second workpiece being positionable between the opposing sets of clamp heads and over the first workpiece.
15. The method of claim 13 , further comprising:
rotatably connecting the rod and the clamp head at each of the housings of each of the clamping mechanisms such that the housings rotate in a horizontal plane defined by the planar surface to a non-engaged position free from overlapping the first workpiece, and the rod and the clamp heads being rotatable to an engaged position with each set of the clamp heads being in opposing spaced relationship to each other overlapping the first workpiece for the clamp heads to provide the downward vertical pressure to the first workpiece.
16. The method of claim 13 , further comprising:
defining multiple work areas using a frame over the base, and the two sets of opposing clamping mechanisms being configured for each of the multiple work areas such that the housings are mounted to the base with the frame therebetween to provide the downward vertical force to the housings and rods and therethrough the clamp heads for applying the downward vertical pressure to each of the first workpieces on each of the multiple work areas.
17. The method of claim 13 , further comprising:
rotatably connecting the rod and the clamp head of each of the clamping mechanisms to the housings to rotate in the horizontal plane defined by the planar surface to a non-engaged position free from overlapping the first workpiece such that the rods of each of the clamping mechanisms are positioned along an axis defined by each leg of the frame, and the rod and the clamp heads being rotatable to an engaged position with each set of the clamp heads being in opposing spaced relationship to each other overlapping the first workpiece for the clamp heads to provide the downward vertical pressure to the first workpiece.
18. The method of claim 13 , further comprising:
affixing the biasing member including a spring loaded metal element to a bottom side of the base, the biasing member being connected to the housing on a top side of the base via a shaft through the base.
19. The clamping apparatus of claim 9 , wherein the spring loaded element compresses to a compressed state to enable the shaft to reversibly extend through the base positioning the housing in an elevated position such that the housing is in spaced relation with the base, and the shaft being movable in a reverse direction positioning the housing in a rest position such that the housing is on the base and the spring loaded element is in an expanded state.
20. A method for maintaining a workpiece flatness during processing, comprising:
receiving a first workpiece on a base having a planar surface;
positioning a second workpiece between two sets of opposing clamping mechanisms mounted to the base and each clamping mechanism including a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece, each set of the clamp heads being in opposing spaced relationship to each other defining a second workpiece area for receiving the second workpiece, and the clamp heads being configured to mate with a top surface of the first workpiece; and
applying a downward vertical pressure to the first workpiece using a biasing member coupled to each of the housings, the biasing members communicating with the rods via the housings and applying a downward vertical force to the housings and rods and therethrough the clamp heads such that the first workpiece is discouraged to thermally expand in a vertical direction with respect to a horizontal plane defined by the planar surface and is thermally expandable along the horizontal plane.
Priority Applications (3)
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US13/777,229 US20140239569A1 (en) | 2013-02-26 | 2013-02-26 | Universal clamping fixture to maintain laminate flatness during chip join |
US14/840,004 US9735041B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
US14/840,001 US9716028B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
Applications Claiming Priority (1)
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US13/777,229 US20140239569A1 (en) | 2013-02-26 | 2013-02-26 | Universal clamping fixture to maintain laminate flatness during chip join |
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US14/840,004 Division US9735041B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
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US14/840,001 Expired - Fee Related US9716028B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
US14/840,004 Expired - Fee Related US9735041B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
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US14/840,004 Expired - Fee Related US9735041B2 (en) | 2013-02-26 | 2015-08-30 | Universal clamping fixture to maintain laminate flatness during chip join |
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Also Published As
Publication number | Publication date |
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US9735041B2 (en) | 2017-08-15 |
US20150371888A1 (en) | 2015-12-24 |
US9716028B2 (en) | 2017-07-25 |
US20150371887A1 (en) | 2015-12-24 |
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