US20140198437A1 - Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis - Google Patents
Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis Download PDFInfo
- Publication number
- US20140198437A1 US20140198437A1 US13/739,574 US201313739574A US2014198437A1 US 20140198437 A1 US20140198437 A1 US 20140198437A1 US 201313739574 A US201313739574 A US 201313739574A US 2014198437 A1 US2014198437 A1 US 2014198437A1
- Authority
- US
- United States
- Prior art keywords
- layer
- bamboo
- information handling
- fiber layer
- handling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27J—MECHANICAL WORKING OF CANE, CORK, OR SIMILAR MATERIALS
- B27J1/00—Mechanical working of cane or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K3/00—Impregnating wood, e.g. impregnation pretreatment, for example puncturing; Wood impregnation aids not directly involved in the impregnation process
- B27K3/02—Processes; Apparatus
- B27K3/15—Impregnating involving polymerisation including use of polymer-containing impregnating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
- B27K9/00—Chemical or physical treatment of reed, straw, or similar material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
Definitions
- This disclosure relates generally to information handling systems, and relates more particularly to the use of continuous bamboo fiber reinforced polymer in an information handling system chassis.
- An information handling system generally processes, compiles, stores, or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements can vary between different applications, information handling systems can also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information can be processed, stored, or communicated. The variations in information handling systems allow information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems can include a variety of hardware and software resources that can be configured to process, store, and communicate information and can include one or more computer systems, data storage systems, and networking systems.
- FIG. 1 illustrates an information handling system according to an embodiment of the present disclosure
- FIG. 2 illustrates a base portion of a chassis of the information handling system of FIG. 1 ;
- FIG. 3 illustrates a cross section of a chassis bottom of the base portion of the chassis of FIG. 2 ;
- FIG. 4 illustrates a sectional view of the chassis bottom of FIG. 3 ;
- FIG. 5 is a flow chart illustrating a method of using continuous bamboo fiber reinforced polymer in an information handling system chassis according to an embodiment of the present disclosure.
- FIG. 6 is a block diagram of an information handling system according to an embodiment of the present disclosure.
- FIG. 1 illustrates an information handling system 100 .
- an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes.
- an information handling system may be a personal computer, a cellular telephone, a smart phone, a tablet computer, a consumer electronic device, a network server or storage device, a switch router or other network communication device, or any other suitable device and may vary in size, shape, performance, functionality, and price.
- the information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic, and operates to execute code. Additional components of the information handling system may include one or more storage devices that can store code, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components. A illustrated here, information handling system is represented by a laptop computer system, however the teachings disclosed herein are generally applicable to other types of information handling systems.
- processing resources such as a central processing unit (CPU) or hardware or software control logic
- Additional components of the information handling system may include one or more storage devices that can store code, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display.
- I/O input and output
- the information handling system may also include one or more
- Information handling system 100 includes a base 110 and a lid 120 .
- Base 110 houses one or more portions of the mechanisms that perform the functions of information handling system 100 , such as electronic circuit boards, disk drives, sockets and connectors for power or to connect to other devices, and interface devices such as a keyboard 112 , a touchpad device 114 , and function buttons 116 .
- Lid 120 houses other portions of the mechanisms that perform the functions of information handling system 100 , such as wireless communications (WiFi) antennas, indicators, and a display 122 .
- WiFi wireless communications
- FIG. 2 illustrates base portion 200 of a chassis for information handling system 100 , including a chassis bottom 210 and a chassis bottom cover 220 .
- Chassis bottom 210 provides fastening locations for mounting the mechanisms housed in base 110 , and includes various openings to accommodate the sockets and connections.
- chassis bottom 210 includes a hard-drive opening 212 and a battery opening 214 .
- Hard-drive opening 212 and battery opening 214 are configured to accept respective covers and are operable to permit a user of information handling system 100 to access a hard-drive and a battery for service, repair, or replacement of the respective components within the information handling system.
- Chassis bottom cover 220 provides fastening locations for attaching the bottom cover to chassis bottom 210 for the purpose of enclosing the mechanisms housed in base 110 .
- Chassis bottom cover 220 includes a keyboard opening 222 , a touchpad device opening 224 , and a function button opening 226 , for allowing the respective keyboard 112 , touchpad 114 , and function buttons 116 to protrude through the bottom cover.
- FIG. 3 illustrates a cut-away view 300 of chassis bottom 210 .
- Cut-away view 300 is a view along cross-section 230 of FIG. 2 , and illustrates that chassis bottom 210 is constructed using a layered composite construction technique as shown in section 310 .
- chassis bottom 210 is constructed by layering various prepregnated fiber materials with a matrix material, placing the prepregnated fiber materials in a mould and curing the mould to form the desired shape of the bottom housing.
- the matrix material includes a polymer or resin matrix material, and can be a thermoplastic matrix or a thermosetting matrix material.
- the matrix material can include an epoxy resin, a phenolic resin, polyester resin, vinyl ester resin, another matrix material, or a combination thereof.
- the fiber materials can include glass fiber, carbon fiber, aramid fiber, natural fiber, or another type of fiber that is prepregnated with the matrix material.
- the fiber materials can be strands of the fiber material, a woven fabric of the fiber material, or a combination thereof.
- the skilled artisan will recognize that there are several methods of prepregnating the fiber material, including a hot melt prepregnation process, a solvent dip prepregnation process, another prepregnation process, or a combination thereof.
- construction of chassis bottom 210 includes a layer of prepregnated bamboo, as described further, below.
- the moulding process can include a vacuum bag or pressure bag moulding process, a press moulding process, another moulding process, or a combination thereof, as needed or desired.
- FIG. 4 illustrates section 310 including an outer layer 410 , a bonding material 420 , a fiber layer 430 , a bamboo layer 440 , and another fiber layer 450 .
- the bonding material 420 is between a top portion of outer layer 410 and fiber layer 430 , between fiber layer 430 and bamboo layer 440 , between bamboo layer 440 and fiber layer 450 , and between fiber layer 450 and a bottom portion of outer layer 410 .
- outer layer 410 provides a tough and visually appealing outer finish to section 310 .
- outer layer 410 provides a decorative finish, such as an in-mold release, an in-mold label, a spray painting, a physical vapor deposition, a sputter plating, a paint film, or another decorative finish, as needed or desired.
- Bonding material 420 includes a matrix material that, when cured or treated, bonds the layers together.
- Fiber layers 430 and 450 are prepregnated with matrix material, and are represented here as woven fabrics of the fiber material. In a particular embodiment, one or more of fiber layers 430 and 450 are made up of bundles of continuous filaments that provide a unidirectional reinforcement to section 310 .
- fiber layer 430 can include prepregnated bundles of filaments that are laid out in a first direction
- fiber layers 450 can include prepregnated bundles of filaments that are laid out perpendicularly to the filaments of fiber layer 430
- one or more additional layers of prepregnated fiber material are included in section 310 .
- bamboo layer 440 is prepregnated with matrix material and provides stiffness and rigidity to section 310 , and by extension to chassis bottom 210 .
- bamboo layer 440 is prepregnated with matrix material, and is represented here as a thin sheet of bamboo.
- section 310 can include one or more additional layers of bamboo, and the layers can be laid out such that the grain pattern in the bamboo sheets are perpendicular to each other, such that the grain pattern in the bamboo sheets are parallel to each other, or in another configuration.
- bamboo mat 445 is a woven mat of bamboo slats or fibers that are prepregnated with matrix material and incorporated into section 310 , either in addition to bamboo layer 440 , or as a substitute for the bamboo layer.
- the material used to prepregnate one or more of fiber layers 430 and 450 and bamboo layer 440 is the same material as used for bonding material 420 .
- FIG. 5 illustrates a method for using continuous bamboo fiber reinforced polymer in an information handling system chassis, starting at block 500 .
- An outer layer of a case for an information handling system is placed into a form in block 502 .
- a bottom portion of outer layer 410 can be placed into a form for chassis bottom 210 .
- a bonding material is applied to the outer layer on block 504 .
- bonding material 420 can be applied to outer layer 410 .
- a prepregnated fiber layer is placed into the form in block 506 .
- fiber layer 450 can be placed on top of outer layer 410 .
- a decision is made as to whether or not the fiber layer placed in the form is the last fiber layer to be place before adding the bamboo layers in decision block 508 .
- each layer is prepregnated with matrix material prior to placement into the form.
- the layers are provided in a lamination of layers prior to placement into the form.
- the “YES” branch of decision block 508 is taken, and the bonding material is applied to the last fiber layer on block 510 .
- bonding material 420 can be applied to outer layer 410 .
- a prepregnated bamboo layer is placed into the form in block 512 .
- bamboo layer 440 can be placed on top of fiber layer 430 .
- a decision is made as to whether or not the bamboo layer placed in the form is the last bamboo layer to be place before adding the additional fiber layers in decision block 514 . If not, the “NO” branch of decision block 514 is taken and the method returns to block 510 where the bonding material is applied to the bamboo layer.
- the “YES” branch of decision block 514 is taken, and the bonding material is applied to the last bamboo layer on block 516 .
- a prepregnated fiber layer is placed into the form in block 518 .
- fiber layer 430 can be placed on top of bamboo layer 440 .
- a decision is made as to whether or not the fiber layer placed in the form is the last fiber layer to be place before adding a second outer layers in decision block 520 . If not, the “NO” branch of decision block 520 is taken and the method returns to block 516 where the bonding material is applied to the fiber layer.
- the “YES” branch of decision block 520 is taken, and the bonding material is applied to the last fiber layer on block 522 .
- the second outer layer is placed into the form in block 524 .
- outer layer 410 can be placed on top of fiber layer 430 .
- the form is cured and processed as needed or desired in block 526 , and the method ends in block 528 .
- the form with the layers can be pressure treated, heat treated, chemically treated, subjected to another treatment, or a combination thereof.
- the method is described in terms of the layer arrangement of section 310 , other arrangements and layering orders can be performed as needed or desired.
- FIG. 6 illustrates a generalized information handling system 600 that can be utilized to carry the methods and to instantiate the devices and modules as described herein.
- information handling system 600 can include one or more computer-readable storage mediums that include machine-executable code for performing the methods or that are operated on by the devices and modules for carrying out the operations of the devices and modules described herein.
- Information handling system 600 includes a processor 602 and one or more additional processors 604 , a chipset 610 , a memory 620 , a graphics interface 630 , include a basic input and output system/extensible firmware interface (BIOS/EFI) module 640 , a disk controller 650 , a disk emulator 660 , an input/output (I/O) interface 670 , a network interface 680 , and a management controller (MC) 690 .
- BIOS/EFI basic input and output system/extensible firmware interface
- Processor 602 is connected to chipset 610 via processor interface 606
- processor 604 is connected to the chipset via processor interface 608 .
- Memory 620 is connected to chipset 610 via a memory bus 622 .
- Graphics interface 630 is connected to chipset 610 via a graphics interface 632 , and provides a video display output 636 to a video display 634 .
- information handling system 600 includes separate memories that are dedicated to each of processors 602 and 604 via separate memory interfaces.
- An example of memory 620 includes random access memory (RAM) such as static RAM (SRAM), dynamic RAM (DRAM), non-volatile RAM (NV-RAM), or the like, read only memory (ROM), another type of memory, or a combination thereof.
- RAM random access memory
- SRAM static RAM
- DRAM dynamic RAM
- NV-RAM non-volatile RAM
- ROM read only memory
- BIOS/EFI module 640 disk controller 650 , and I/O interface 670 are connected to chipset 610 via an I/O channel 612 .
- I/O channel 612 includes a Peripheral Component Interconnect (PCI) interface, a PCI-Extended (PCI-X) interface, a high-speed PCI-Express (PCIe) interface, another industry standard or proprietary communication interface, or a combination thereof.
- PCI Peripheral Component Interconnect
- PCI-X PCI-Extended
- PCIe high-speed PCI-Express
- Chipset 610 can also include one or more other I/O interfaces, including an Industry Standard Architecture (ISA) interface, a Small Computer Serial Interface (SCSI) interface, an Inter-Integrated Circuit (I 2 C) interface, a System Packet Interface (SPI), a Universal Serial Bus (USB), another interface, or a combination thereof.
- BIOS/EFI module 640 includes BIOS/EFI code operable to detect resources within information handling system 600 , to provide drivers for the resources, initialize the resources, and access the resources.
- BIOS/EFI module 640 includes code that operates to detect resources within information handling system 600 , to provide drivers for the resources, to initialize the resources, and to access the resources.
- Disk controller 650 includes a disk interface 652 that connects the disc controller to a hard disk drive (HDD) 654 , to an optical disk drive (ODD) 656 , and to disk emulator 660 .
- disk interface 652 includes an Integrated Drive Electronics (IDE) interface, an Advanced Technology Attachment (ATA) such as a parallel ATA (PATA) interface or a serial ATA (SATA) interface, a SCSI interface, a USB interface, a proprietary interface, or a combination thereof.
- Disk emulator 660 permits a solid-state drive 664 to be coupled to information handling system 600 via an external interface 662 .
- An example of external interface 662 includes a USB interface, an IEEE 1394 (Firewire) interface, a proprietary interface, or a combination thereof.
- solid-state drive 664 can be disposed within information handling system 600 .
- I/O interface 670 includes a peripheral interface 672 that connects the I/O interface to an add-on resource 674 and to network interface 680 .
- Peripheral interface 672 can be the same type of interface as I/O channel 612 , or can be a different type of interface.
- I/O interface 670 extends the capacity of I/O channel 612 when peripheral interface 672 and the I/O channel are of the same type, and the I/O interface translates information from a format suitable to the I/O channel to a format suitable to the peripheral channel 672 when they are of a different type.
- Add-on resource 674 can include a data storage system, an additional graphics interface, a network interface card (NIC), a sound/video processing card, another add-on resource, or a combination thereof.
- Add-on resource 674 can be on a main circuit board, on separate circuit board or add-in card disposed within information handling system 600 , a device that is external to the information handling system, or a combination thereof.
- Network interface 680 represents a NIC disposed within information handling system 600 , on a main circuit board of the information handling system, integrated onto another component such as chipset 610 , in another suitable location, or a combination thereof.
- Network interface device 680 includes network channels 682 and 684 that provide interfaces to devices that are external to information handling system 600 .
- network channels 682 and 684 are of a different type than peripheral channel 672 and network interface 680 translates information from a format suitable to the peripheral channel to a format suitable to external devices.
- An example of network channels 682 and 684 includes InfiniBand channels, Fibre Channel channels, Gb Ethernet channels, proprietary channel architectures, or a combination thereof.
- Network channels 682 and 684 can be coupled to external network resources (not illustrated).
- the network resource can include another information handling system, a data storage system, another network, a grid management system, another suitable resource, or a combination thereof.
- MC 690 is connected to processors 602 and 604 , chipset 610 , memory 620 , and BIOS/EFI module 640 via a system communication bus 692 .
- MC 690 may be on a main circuit board (e.g., a baseboard, a motherboard, or a combination thereof), integrated onto another component such as chipset 610 , in another suitable location, or a combination thereof.
- main circuit board e.g., a baseboard, a motherboard, or a combination thereof
- one or more additional resources of information handling system 600 such as graphics interface 630 , video display 634 , I/O interface 670 , disk controller 650 , and network interface 680 are connected to MC 690 .
- MC 690 can be part of an integrated circuit or a chip set within information handling system 600 , and can be on a main circuit board, on separate circuit board or add-in card disposed within the information handling system, or a combination thereof.
- An example of MC 690 includes a baseboard management controller (BMC), an integrated Dell remote access controller (iDRAC), another controller, or a combination thereof.
- An example of system communication bus 692 includes an inter-integrated circuit (I 2 C) bus, a system management bus (SMBus), a serial peripheral interface (SPI) bus, a low pin count (LPC) bus, another bus, or a combination thereof.
- MC 690 is connected via a network channel 694 to a management station 696 that is external to information handling system 600 .
- Management station 696 operates in conjunction with management controller 690 to provide out-of-band management of information handling system 600 .
- Commands, communications, or other signals are communicated between MC 690 and management station 696 to monitor status of information handling system 600 , to control the operations of the resources of the information handling system, and to update the resources.
- MC 690 is powered by a separate power plane in information handling system 600 , so that the MC can be operated while other portions of the information handling system are powered off.
- MC 690 is operated during boot of information handling system 600 ).
Abstract
Description
- This disclosure relates generally to information handling systems, and relates more particularly to the use of continuous bamboo fiber reinforced polymer in an information handling system chassis.
- As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements can vary between different applications, information handling systems can also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information can be processed, stored, or communicated. The variations in information handling systems allow information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems can include a variety of hardware and software resources that can be configured to process, store, and communicate information and can include one or more computer systems, data storage systems, and networking systems.
- It will be appreciated that for simplicity and clarity of illustration, elements illustrated in the Figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements are exaggerated relative to other elements. Embodiments incorporating teachings of the present disclosure are shown and described with respect to the drawings presented herein, in which:
-
FIG. 1 illustrates an information handling system according to an embodiment of the present disclosure; -
FIG. 2 illustrates a base portion of a chassis of the information handling system ofFIG. 1 ; -
FIG. 3 illustrates a cross section of a chassis bottom of the base portion of the chassis ofFIG. 2 ; -
FIG. 4 illustrates a sectional view of the chassis bottom ofFIG. 3 ; -
FIG. 5 is a flow chart illustrating a method of using continuous bamboo fiber reinforced polymer in an information handling system chassis according to an embodiment of the present disclosure; and -
FIG. 6 is a block diagram of an information handling system according to an embodiment of the present disclosure. - The use of the same reference symbols in different drawings indicates similar or identical items.
- The following description in combination with the Figures is provided to assist in understanding the teachings disclosed herein, and will focus on specific implementations and embodiments of the teachings. This focus is provided to assist in describing the teachings, and should not be interpreted as a limitation on the scope or applicability of the teachings. Other teachings can be used in conjunction with this application, and the teachings herein can be used in other applications, and with different types of structures and architectures.
-
FIG. 1 illustrates aninformation handling system 100. For purpose of this disclosure, an information handling system may include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes. For example, an information handling system may be a personal computer, a cellular telephone, a smart phone, a tablet computer, a consumer electronic device, a network server or storage device, a switch router or other network communication device, or any other suitable device and may vary in size, shape, performance, functionality, and price. The information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic, and operates to execute code. Additional components of the information handling system may include one or more storage devices that can store code, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display. The information handling system may also include one or more buses operable to transmit communications between the various hardware components. A illustrated here, information handling system is represented by a laptop computer system, however the teachings disclosed herein are generally applicable to other types of information handling systems. -
Information handling system 100 includes abase 110 and alid 120.Base 110 houses one or more portions of the mechanisms that perform the functions ofinformation handling system 100, such as electronic circuit boards, disk drives, sockets and connectors for power or to connect to other devices, and interface devices such as akeyboard 112, atouchpad device 114, andfunction buttons 116.Lid 120 houses other portions of the mechanisms that perform the functions ofinformation handling system 100, such as wireless communications (WiFi) antennas, indicators, and adisplay 122. -
FIG. 2 illustratesbase portion 200 of a chassis forinformation handling system 100, including achassis bottom 210 and achassis bottom cover 220.Chassis bottom 210 provides fastening locations for mounting the mechanisms housed inbase 110, and includes various openings to accommodate the sockets and connections. In addition,chassis bottom 210 includes a hard-drive opening 212 and abattery opening 214. Hard-drive opening 212 andbattery opening 214 are configured to accept respective covers and are operable to permit a user ofinformation handling system 100 to access a hard-drive and a battery for service, repair, or replacement of the respective components within the information handling system.Chassis bottom cover 220 provides fastening locations for attaching the bottom cover tochassis bottom 210 for the purpose of enclosing the mechanisms housed inbase 110.Chassis bottom cover 220 includes akeyboard opening 222, a touchpad device opening 224, and afunction button opening 226, for allowing therespective keyboard 112,touchpad 114, andfunction buttons 116 to protrude through the bottom cover. -
FIG. 3 illustrates a cut-away view 300 ofchassis bottom 210. Cut-awayview 300 is a view alongcross-section 230 ofFIG. 2 , and illustrates thatchassis bottom 210 is constructed using a layered composite construction technique as shown insection 310. As such,chassis bottom 210 is constructed by layering various prepregnated fiber materials with a matrix material, placing the prepregnated fiber materials in a mould and curing the mould to form the desired shape of the bottom housing. In a particular embodiment, the matrix material includes a polymer or resin matrix material, and can be a thermoplastic matrix or a thermosetting matrix material. For example, the matrix material can include an epoxy resin, a phenolic resin, polyester resin, vinyl ester resin, another matrix material, or a combination thereof. The fiber materials can include glass fiber, carbon fiber, aramid fiber, natural fiber, or another type of fiber that is prepregnated with the matrix material. The fiber materials can be strands of the fiber material, a woven fabric of the fiber material, or a combination thereof. The skilled artisan will recognize that there are several methods of prepregnating the fiber material, including a hot melt prepregnation process, a solvent dip prepregnation process, another prepregnation process, or a combination thereof. In addition to the prepregnated fiber materials, construction ofchassis bottom 210 includes a layer of prepregnated bamboo, as described further, below. The moulding process can include a vacuum bag or pressure bag moulding process, a press moulding process, another moulding process, or a combination thereof, as needed or desired. -
FIG. 4 illustratessection 310 including anouter layer 410, abonding material 420, afiber layer 430, abamboo layer 440, and anotherfiber layer 450. Thebonding material 420 is between a top portion ofouter layer 410 andfiber layer 430, betweenfiber layer 430 andbamboo layer 440, betweenbamboo layer 440 andfiber layer 450, and betweenfiber layer 450 and a bottom portion ofouter layer 410. In a particular embodiment,outer layer 410 provides a tough and visually appealing outer finish tosection 310. In another embodiment,outer layer 410 provides a decorative finish, such as an in-mold release, an in-mold label, a spray painting, a physical vapor deposition, a sputter plating, a paint film, or another decorative finish, as needed or desired.Bonding material 420 includes a matrix material that, when cured or treated, bonds the layers together.Fiber layers fiber layers section 310. For example,fiber layer 430 can include prepregnated bundles of filaments that are laid out in a first direction, andfiber layers 450 can include prepregnated bundles of filaments that are laid out perpendicularly to the filaments offiber layer 430. In another embodiment, one or more additional layers of prepregnated fiber material are included insection 310. - Bamboo
layer 440 is prepregnated with matrix material and provides stiffness and rigidity tosection 310, and by extension tochassis bottom 210. Bamboolayer 440 is prepregnated with matrix material, and is represented here as a thin sheet of bamboo. In a particular embodiment,section 310 can include one or more additional layers of bamboo, and the layers can be laid out such that the grain pattern in the bamboo sheets are perpendicular to each other, such that the grain pattern in the bamboo sheets are parallel to each other, or in another configuration. In another embodiment,bamboo mat 445 is a woven mat of bamboo slats or fibers that are prepregnated with matrix material and incorporated intosection 310, either in addition tobamboo layer 440, or as a substitute for the bamboo layer. In a particular embodiment, the material used to prepregnate one or more offiber layers bamboo layer 440 is the same material as used forbonding material 420. -
FIG. 5 illustrates a method for using continuous bamboo fiber reinforced polymer in an information handling system chassis, starting atblock 500. An outer layer of a case for an information handling system is placed into a form inblock 502. For example, a bottom portion ofouter layer 410 can be placed into a form forchassis bottom 210. A bonding material is applied to the outer layer onblock 504. For example,bonding material 420 can be applied toouter layer 410. A prepregnated fiber layer is placed into the form inblock 506. Here,fiber layer 450 can be placed on top ofouter layer 410. A decision is made as to whether or not the fiber layer placed in the form is the last fiber layer to be place before adding the bamboo layers indecision block 508. If not, the “NO” branch ofdecision block 508 is taken and the method returns to block 504 where the bonding material is applied to the fiber layer. In a particular embodiment, each layer is prepregnated with matrix material prior to placement into the form. In another embodiment, the layers are provided in a lamination of layers prior to placement into the form. - If the fiber layer is the last fiber layer to be place before adding the bamboo layer, the “YES” branch of
decision block 508 is taken, and the bonding material is applied to the last fiber layer onblock 510. For example,bonding material 420 can be applied toouter layer 410. A prepregnated bamboo layer is placed into the form inblock 512. Here,bamboo layer 440 can be placed on top offiber layer 430. A decision is made as to whether or not the bamboo layer placed in the form is the last bamboo layer to be place before adding the additional fiber layers indecision block 514. If not, the “NO” branch ofdecision block 514 is taken and the method returns to block 510 where the bonding material is applied to the bamboo layer. - If the bamboo layer is the last bamboo layer to be place before adding the additional fiber layers, the “YES” branch of
decision block 514 is taken, and the bonding material is applied to the last bamboo layer onblock 516. A prepregnated fiber layer is placed into the form inblock 518. Here,fiber layer 430 can be placed on top ofbamboo layer 440. A decision is made as to whether or not the fiber layer placed in the form is the last fiber layer to be place before adding a second outer layers indecision block 520. If not, the “NO” branch ofdecision block 520 is taken and the method returns to block 516 where the bonding material is applied to the fiber layer. - If the fiber layer is the last fiber layer to be place before adding the second outer layer, the “YES” branch of
decision block 520 is taken, and the bonding material is applied to the last fiber layer onblock 522. The second outer layer is placed into the form inblock 524. Here,outer layer 410 can be placed on top offiber layer 430. The form is cured and processed as needed or desired inblock 526, and the method ends inblock 528. For example, the form with the layers can be pressure treated, heat treated, chemically treated, subjected to another treatment, or a combination thereof. The skilled artisan will recognize that, although the method is described in terms of the layer arrangement ofsection 310, other arrangements and layering orders can be performed as needed or desired. -
FIG. 6 illustrates a generalizedinformation handling system 600 that can be utilized to carry the methods and to instantiate the devices and modules as described herein. As such,information handling system 600 can include one or more computer-readable storage mediums that include machine-executable code for performing the methods or that are operated on by the devices and modules for carrying out the operations of the devices and modules described herein.Information handling system 600 includes aprocessor 602 and one or moreadditional processors 604, achipset 610, amemory 620, agraphics interface 630, include a basic input and output system/extensible firmware interface (BIOS/EFI)module 640, a disk controller 650, adisk emulator 660, an input/output (I/O)interface 670, anetwork interface 680, and a management controller (MC) 690.Processor 602 is connected tochipset 610 viaprocessor interface 606, andprocessor 604 is connected to the chipset viaprocessor interface 608.Memory 620 is connected tochipset 610 via amemory bus 622. Graphics interface 630 is connected tochipset 610 via agraphics interface 632, and provides avideo display output 636 to avideo display 634. In a particular embodiment,information handling system 600 includes separate memories that are dedicated to each ofprocessors memory 620 includes random access memory (RAM) such as static RAM (SRAM), dynamic RAM (DRAM), non-volatile RAM (NV-RAM), or the like, read only memory (ROM), another type of memory, or a combination thereof. - BIOS/
EFI module 640, disk controller 650, and I/O interface 670 are connected tochipset 610 via an I/O channel 612. An example of I/O channel 612 includes a Peripheral Component Interconnect (PCI) interface, a PCI-Extended (PCI-X) interface, a high-speed PCI-Express (PCIe) interface, another industry standard or proprietary communication interface, or a combination thereof.Chipset 610 can also include one or more other I/O interfaces, including an Industry Standard Architecture (ISA) interface, a Small Computer Serial Interface (SCSI) interface, an Inter-Integrated Circuit (I2C) interface, a System Packet Interface (SPI), a Universal Serial Bus (USB), another interface, or a combination thereof. BIOS/EFI module 640 includes BIOS/EFI code operable to detect resources withininformation handling system 600, to provide drivers for the resources, initialize the resources, and access the resources. BIOS/EFI module 640 includes code that operates to detect resources withininformation handling system 600, to provide drivers for the resources, to initialize the resources, and to access the resources. - Disk controller 650 includes a
disk interface 652 that connects the disc controller to a hard disk drive (HDD) 654, to an optical disk drive (ODD) 656, and todisk emulator 660. An example ofdisk interface 652 includes an Integrated Drive Electronics (IDE) interface, an Advanced Technology Attachment (ATA) such as a parallel ATA (PATA) interface or a serial ATA (SATA) interface, a SCSI interface, a USB interface, a proprietary interface, or a combination thereof.Disk emulator 660 permits a solid-state drive 664 to be coupled toinformation handling system 600 via anexternal interface 662. An example ofexternal interface 662 includes a USB interface, an IEEE 1394 (Firewire) interface, a proprietary interface, or a combination thereof. Alternatively, solid-state drive 664 can be disposed withininformation handling system 600. - I/
O interface 670 includes aperipheral interface 672 that connects the I/O interface to an add-onresource 674 and to networkinterface 680.Peripheral interface 672 can be the same type of interface as I/O channel 612, or can be a different type of interface. As such, I/O interface 670 extends the capacity of I/O channel 612 whenperipheral interface 672 and the I/O channel are of the same type, and the I/O interface translates information from a format suitable to the I/O channel to a format suitable to theperipheral channel 672 when they are of a different type. Add-onresource 674 can include a data storage system, an additional graphics interface, a network interface card (NIC), a sound/video processing card, another add-on resource, or a combination thereof. Add-onresource 674 can be on a main circuit board, on separate circuit board or add-in card disposed withininformation handling system 600, a device that is external to the information handling system, or a combination thereof. -
Network interface 680 represents a NIC disposed withininformation handling system 600, on a main circuit board of the information handling system, integrated onto another component such aschipset 610, in another suitable location, or a combination thereof.Network interface device 680 includesnetwork channels information handling system 600. In a particular embodiment,network channels peripheral channel 672 andnetwork interface 680 translates information from a format suitable to the peripheral channel to a format suitable to external devices. An example ofnetwork channels Network channels -
MC 690 is connected toprocessors chipset 610,memory 620, and BIOS/EFI module 640 via asystem communication bus 692.MC 690 may be on a main circuit board (e.g., a baseboard, a motherboard, or a combination thereof), integrated onto another component such aschipset 610, in another suitable location, or a combination thereof. In a particular embodiment, one or more additional resources ofinformation handling system 600, such as graphics interface 630,video display 634, I/O interface 670, disk controller 650, andnetwork interface 680 are connected toMC 690.MC 690 can be part of an integrated circuit or a chip set withininformation handling system 600, and can be on a main circuit board, on separate circuit board or add-in card disposed within the information handling system, or a combination thereof. An example ofMC 690 includes a baseboard management controller (BMC), an integrated Dell remote access controller (iDRAC), another controller, or a combination thereof. An example ofsystem communication bus 692 includes an inter-integrated circuit (I2C) bus, a system management bus (SMBus), a serial peripheral interface (SPI) bus, a low pin count (LPC) bus, another bus, or a combination thereof. -
MC 690 is connected via anetwork channel 694 to amanagement station 696 that is external toinformation handling system 600.Management station 696 operates in conjunction withmanagement controller 690 to provide out-of-band management ofinformation handling system 600. Commands, communications, or other signals are communicated betweenMC 690 andmanagement station 696 to monitor status ofinformation handling system 600, to control the operations of the resources of the information handling system, and to update the resources. In a particular embodiment,MC 690 is powered by a separate power plane ininformation handling system 600, so that the MC can be operated while other portions of the information handling system are powered off. In another embodiment,MC 690 is operated during boot of information handling system 600). - Although only a few exemplary embodiments have been described in detail herein, those skilled in the art will readily appreciate that many modifications are possible in the exemplary embodiments without materially departing from the novel teachings and advantages of the embodiments of the present disclosure. Accordingly, all such modifications are intended to be included within the scope of the embodiments of the present disclosure as defined in the following claims. In the claims, means-plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents, but also equivalent structures.
- The above-disclosed subject matter is to be considered illustrative, and not restrictive, and the appended claims are intended to cover any and all such modifications, enhancements, and other embodiments that fall within the scope of the present invention. Thus, to the maximum extent allowed by law, the scope of the present invention is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing detailed description.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/739,574 US20140198437A1 (en) | 2013-01-11 | 2013-01-11 | Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/739,574 US20140198437A1 (en) | 2013-01-11 | 2013-01-11 | Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140198437A1 true US20140198437A1 (en) | 2014-07-17 |
Family
ID=51164950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/739,574 Abandoned US20140198437A1 (en) | 2013-01-11 | 2013-01-11 | Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis |
Country Status (1)
Country | Link |
---|---|
US (1) | US20140198437A1 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105856359A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production technology for producing calligraphy and painting packaging boxes by utilizing agricultural bamboo shells |
CN105856356A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production system for food package box |
CN105856364A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Agricultural wastes recycling system |
CN105856355A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production equipment of tea leaf packaging box |
CN105904545A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | System for achieving recycling of agricultural production waste |
CN105904530A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Method for producing food outer packing boxes by using fallen bamboo barks and leaves |
CN105904536A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Production equipment for calligraphy and painting packaging boxes |
CN105904546A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Technology for recycling agricultural waste |
CN105922390A (en) * | 2016-06-23 | 2016-09-07 | 安徽兰兮工程技术开发有限公司 | System for recycling stalk sheaths |
CN105936073A (en) * | 2016-06-23 | 2016-09-14 | 安徽兰兮工程技术开发有限公司 | Production equipment of paper fan packaging box |
CN105946070A (en) * | 2016-06-23 | 2016-09-21 | 安徽兰兮工程技术开发有限公司 | System used for recycling agricultural wastes |
CN106078966A (en) * | 2016-06-23 | 2016-11-09 | 安徽兰兮工程技术开发有限公司 | A kind of reclaim the technique that bamboo shell carries out utilizing |
CN106113175A (en) * | 2016-06-23 | 2016-11-16 | 安徽兰兮工程技术开发有限公司 | A kind of production technology of tea packaging box |
US20170217056A1 (en) * | 2016-01-29 | 2017-08-03 | Dell Products L.P. | Carbon Fiber Information Handling System Housing and Process for Manufacture |
US20230082334A1 (en) * | 2021-09-10 | 2023-03-16 | Dell Products L.P. | Keyboard with recycled and biodegradable composite material for an information handling system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070257398A1 (en) * | 2006-05-04 | 2007-11-08 | Moncrieff Scott E | Laminated electronic components for insert molding |
US20130052417A1 (en) * | 2011-08-31 | 2013-02-28 | Sheng-Yu Tsai | Rigid reinforced composite material and manufacturing method thereof |
-
2013
- 2013-01-11 US US13/739,574 patent/US20140198437A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070257398A1 (en) * | 2006-05-04 | 2007-11-08 | Moncrieff Scott E | Laminated electronic components for insert molding |
US20130052417A1 (en) * | 2011-08-31 | 2013-02-28 | Sheng-Yu Tsai | Rigid reinforced composite material and manufacturing method thereof |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170217056A1 (en) * | 2016-01-29 | 2017-08-03 | Dell Products L.P. | Carbon Fiber Information Handling System Housing and Process for Manufacture |
CN105922390A (en) * | 2016-06-23 | 2016-09-07 | 安徽兰兮工程技术开发有限公司 | System for recycling stalk sheaths |
CN105936073A (en) * | 2016-06-23 | 2016-09-14 | 安徽兰兮工程技术开发有限公司 | Production equipment of paper fan packaging box |
CN105856355A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production equipment of tea leaf packaging box |
CN105904545A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | System for achieving recycling of agricultural production waste |
CN105904530A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Method for producing food outer packing boxes by using fallen bamboo barks and leaves |
CN105904536A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Production equipment for calligraphy and painting packaging boxes |
CN105856364A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Agricultural wastes recycling system |
CN105856359A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production technology for producing calligraphy and painting packaging boxes by utilizing agricultural bamboo shells |
CN105904546A (en) * | 2016-06-23 | 2016-08-31 | 安徽兰兮工程技术开发有限公司 | Technology for recycling agricultural waste |
CN105946070A (en) * | 2016-06-23 | 2016-09-21 | 安徽兰兮工程技术开发有限公司 | System used for recycling agricultural wastes |
CN106078966A (en) * | 2016-06-23 | 2016-11-09 | 安徽兰兮工程技术开发有限公司 | A kind of reclaim the technique that bamboo shell carries out utilizing |
CN106113175A (en) * | 2016-06-23 | 2016-11-16 | 安徽兰兮工程技术开发有限公司 | A kind of production technology of tea packaging box |
CN105856356A (en) * | 2016-06-23 | 2016-08-17 | 安徽兰兮工程技术开发有限公司 | Production system for food package box |
US20230082334A1 (en) * | 2021-09-10 | 2023-03-16 | Dell Products L.P. | Keyboard with recycled and biodegradable composite material for an information handling system |
US11845294B2 (en) * | 2021-09-10 | 2023-12-19 | Dell Products L.P. | Keyboard with recycled and biodegradable composite material for an information handling system |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20140198437A1 (en) | Method for Use of Continuous Biocomposite Fiber Reinforced Polymer in an Information Handling System Chassis | |
US10426041B2 (en) | Method of manufacturing printed-circuit board assembly | |
US11504889B2 (en) | Thermoplastic composite materials for portable information handling system enclosures | |
US20090319808A1 (en) | System and Method for Smoothing Power Reclamation of Blade Servers | |
US9940275B2 (en) | System and method to avoid SMBus address conflicts via a baseboard management controller | |
US11318685B2 (en) | Systems and methods for manufacturing structural materials | |
US20150095631A1 (en) | Systems and methods for binding a removable cryptoprocessor to an information handling system | |
US20160357230A1 (en) | Carbon Fiber Laminate Piezoelectric Cooler and Method Therefor | |
US10042395B2 (en) | Method of forming composite fiber laminate with variable elasticity and device thereof | |
US10562441B2 (en) | Wireless cab marker lights for truck | |
US20180235084A1 (en) | Electrically functional structure integration in ultrathin foldable device | |
US10782994B2 (en) | Systems and methods for adaptive access of memory namespaces | |
US10095282B2 (en) | Cover for heat sink | |
US10466804B2 (en) | Composite unibody keyboard | |
US20230085487A1 (en) | Recycled aluminum with glass fiber reinforced polylactic acid (pla) bioplastic for an information handling system | |
US11758674B2 (en) | Latch with movable handle for electronic equipment | |
US11650887B2 (en) | Systems and methods for retrieving optimal firmware recovery image in an information handling system | |
US10936329B2 (en) | Systems and methods for dynamically electrically margining devices in an information handling system | |
US10613583B2 (en) | Battery installation system and method therefor | |
US20160007497A1 (en) | Apparatus and method for conductive cooling of an information handling system | |
US10908650B1 (en) | Universal elastic joint for portable computer | |
US20240066772A1 (en) | Hidden runner injection mold structure | |
US20230254646A1 (en) | Damping structure to increase speaker rated power | |
US20230297945A1 (en) | Capture of emmc card identification for component traceability of pcie daughter card | |
US10981494B2 (en) | Wireless cab marker lights for truck |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: DELL PRODUCTS, LP, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BUSBY, B. BRYCE;AURONGZEB, DEEDER N.;REEL/FRAME:029737/0339 Effective date: 20130104 |
|
AS | Assignment |
Owner name: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT, TE Free format text: PATENT SECURITY AGREEMENT (ABL);ASSIGNORS:DELL INC.;APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;AND OTHERS;REEL/FRAME:031898/0001 Effective date: 20131029 Owner name: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT, TEXAS Free format text: PATENT SECURITY AGREEMENT (NOTES);ASSIGNORS:APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;BOOMI, INC.;AND OTHERS;REEL/FRAME:031897/0348 Effective date: 20131029 Owner name: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT, TEXAS Free format text: PATENT SECURITY AGREEMENT (ABL);ASSIGNORS:DELL INC.;APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;AND OTHERS;REEL/FRAME:031898/0001 Effective date: 20131029 Owner name: BANK OF AMERICA, N.A., AS COLLATERAL AGENT, NORTH CAROLINA Free format text: PATENT SECURITY AGREEMENT (TERM LOAN);ASSIGNORS:DELL INC.;APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;AND OTHERS;REEL/FRAME:031899/0261 Effective date: 20131029 Owner name: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FI Free format text: PATENT SECURITY AGREEMENT (NOTES);ASSIGNORS:APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;BOOMI, INC.;AND OTHERS;REEL/FRAME:031897/0348 Effective date: 20131029 Owner name: BANK OF AMERICA, N.A., AS COLLATERAL AGENT, NORTH Free format text: PATENT SECURITY AGREEMENT (TERM LOAN);ASSIGNORS:DELL INC.;APPASSURE SOFTWARE, INC.;ASAP SOFTWARE EXPRESS, INC.;AND OTHERS;REEL/FRAME:031899/0261 Effective date: 20131029 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
AS | Assignment |
Owner name: COMPELLANT TECHNOLOGIES, INC., MINNESOTA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: DELL PRODUCTS L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: DELL SOFTWARE INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: ASAP SOFTWARE EXPRESS, INC., ILLINOIS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: CREDANT TECHNOLOGIES, INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: DELL USA L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: DELL MARKETING L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: FORCE10 NETWORKS, INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: APPASSURE SOFTWARE, INC., VIRGINIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: PEROT SYSTEMS CORPORATION, TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: SECUREWORKS, INC., GEORGIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: WYSE TECHNOLOGY L.L.C., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 Owner name: DELL INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:040065/0216 Effective date: 20160907 |
|
AS | Assignment |
Owner name: COMPELLENT TECHNOLOGIES, INC., MINNESOTA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL SOFTWARE INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: WYSE TECHNOLOGY L.L.C., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL MARKETING L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: FORCE10 NETWORKS, INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: CREDANT TECHNOLOGIES, INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: ASAP SOFTWARE EXPRESS, INC., ILLINOIS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: SECUREWORKS, INC., GEORGIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: APPASSURE SOFTWARE, INC., VIRGINIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: PEROT SYSTEMS CORPORATION, TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL USA L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL PRODUCTS L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF AMERICA, N.A., AS COLLATERAL AGENT;REEL/FRAME:040040/0001 Effective date: 20160907 Owner name: DELL INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: DELL SOFTWARE INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: DELL MARKETING L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: ASAP SOFTWARE EXPRESS, INC., ILLINOIS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: DELL PRODUCTS L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: APPASSURE SOFTWARE, INC., VIRGINIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: DELL USA L.P., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: SECUREWORKS, INC., GEORGIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: FORCE10 NETWORKS, INC., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: WYSE TECHNOLOGY L.L.C., CALIFORNIA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: COMPELLENT TECHNOLOGIES, INC., MINNESOTA Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: PEROT SYSTEMS CORPORATION, TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 Owner name: CREDANT TECHNOLOGIES, INC., TEXAS Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT;REEL/FRAME:040065/0618 Effective date: 20160907 |