US20140138062A1 - Electronic device with spray type heat dissipation device - Google Patents

Electronic device with spray type heat dissipation device Download PDF

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Publication number
US20140138062A1
US20140138062A1 US13/948,109 US201313948109A US2014138062A1 US 20140138062 A1 US20140138062 A1 US 20140138062A1 US 201313948109 A US201313948109 A US 201313948109A US 2014138062 A1 US2014138062 A1 US 2014138062A1
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US
United States
Prior art keywords
spray
pipe
electronic device
pump member
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/948,109
Inventor
Xiang-Kun Zeng
Er-Wei Lu
Rong Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LU, ER-WEI, YANG, RONG, ZENG, Xiang-kun
Publication of US20140138062A1 publication Critical patent/US20140138062A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28C—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C3/00—Other direct-contact heat-exchange apparatus
    • F28C3/04—Other direct-contact heat-exchange apparatus the heat-exchange media both being liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the disclosure generally relates to electronic devices, and particularly to an electronic device with a spray type heat dissipation.
  • Heat dissipation devices such as a fan and a heat sink are located in an enclosure of an electronic device for dissipating heat. Power consumption and heat from the electronic device increase with the enhancement of performance For satisfying increased heat dissipation demand, a fan with better heat dissipation effect, such as higher rotation speed, or larger blades is required. Fan with higher rotation speed may generate greater noise, and the enclosure of the electronic device has to be enlarged if larger fan is used. Thus, there is a room for improvement within the art.
  • FIG. 1 is an assembled, isometric view of an electronic device in one embodiment.
  • FIG. 2 is a partial exploded, isometric view of the electronic device of FIG. 1 .
  • FIG. 3 is an exploded, isometric view of a spray device of the electronic device of FIG. 2 .
  • FIG. 4 is an assembled view of the spray device of FIG. 3 .
  • FIG. 5 is a partial assembled view of the electronic device of FIG. 2 .
  • FIG. 1 and FIG. 2 illustrate one embodiment of an electronic device 100 with a spray device 50 .
  • the electronic device 100 may be a laptop computer, plane computer, or handhold computer.
  • the electronic device 100 includes an enclosure 10 , a motherboard 20 , a heat sink 30 and a spray device 50 .
  • the enclosure 10 includes a bottom cover 12 and a keyboard module 18 .
  • An outlet 124 is defined in one side of the bottom cover 12 .
  • the motherboard 20 is located between the bottom cover 12 and the keyboard module 18 .
  • a plurality of heat generation elements, such as CPU, and memory is located on the motherboard 20 .
  • An opening 22 is defined in the enclosure 10 .
  • the heat sink 30 includes a fan 31 , a heat pipe 35 and a plurality of fins 34 .
  • a first end of the heat pipe 35 contacts the plurality of elements 23
  • a second end of the heat pipe 35 contacts the plurality of fins 34 .
  • FIG. 3 and FIG. 4 illustrate an exploded view and an assembled view of the spray device 50 .
  • the spray device 50 includes a water box 51 , a pump member 53 , a spray member 55 and a baffle 58 .
  • the water box 51 is substantially cylinder.
  • the water box 51 can contain water, such as pure water, or alcohol.
  • the pump member 53 includes a press cylinder 532 , an inlet pipe 531 , an outlet pipe 533 , a press pole 535 , and a cap 537 , and a coil spring 539 .
  • the pump member 53 can draw the water to the spray member 55 by pressing down the cap 537 .
  • the cap 537 is located on a top portion of the press pole 535 .
  • a bottom portion of the press pole 535 extends into the press cylinder 532 .
  • the coil spring 539 surrounds the press pole 535 , and is located between the cap 537 and the press cylinder 532 .
  • a through hole 582 is defined in the baffle 58 for receiving the cap 537 .
  • the cap 537 can move through the through hole 582 .
  • the spray member 55 includes a buffering pipe 551 , a spray pipe 555 , and a connecting pipe 553 connecting the buffering pipe 551 and the spray pipe 555 .
  • the buffering pipe 551 connects the outlet pipe 533 of the pump member 53 .
  • the outlet pipe 533 engages with the buffering pipe 551 by an interference fit.
  • the buffering pipe 551 is substantially U-shaped for preventing water backflow.
  • the spray pipe 555 and the connecting pipe 553 are substantially straight.
  • the spray pipe 555 is substantially perpendicular to the connecting pipe 553 .
  • the spray pipe 555 and the connecting pipe 553 are located in a first plane.
  • the buffering pipe 551 is located in a second plane.
  • the first plane is substantially perpendicular to the second plane.
  • a plurality of nozzles 556 is defined in the spray pipe 555 .
  • the plurality of nozzles 556 is evenly spaced.
  • FIG. 5 illustrates a partially assembled view of the electronic device 100 .
  • the heat sink 30 is located on the motherboard 20 .
  • the first end of the heat pipe 35 contacts the plurality of elements 23 , and the second end of the heat pipe 35 contacts the plurality of fins 34 .
  • the plurality of fins 34 is located between the fan 31 and the outlet 124 of the enclosure 10 .
  • the press cylinder 532 is mounted to the water box 51 .
  • the inlet pipe 531 extends into the water box 51 .
  • the cap 537 is attached to the press pole 535 .
  • the baffle 58 is mounted to the opening 22 of the enclosure 10 .
  • the outlet pipe 533 , the buffering pipe 551 , the connecting pipe 553 , and the spray pipe 555 are connected.
  • the spray pipe 555 is located on a lateral side of the plurality of the fins 34 adjacent to the outlet 124 of the enclosure 10 .
  • the cap 537 protrudes from the baffle 58 .
  • heat In use, heat generates from the plurality of the heat generation elements. Airflow extends through the plurality of fins 34 generated from the fan 31 . For further dissipating heat from the heat sink 30 , the cap 537 is pressed down. The pump member 53 draws water from the water box 51 and outputs the water to the spray member 55 . The water extends through the spray member 55 and sprays out through the plurality of nozzles 556 . The sprayed water falling onto the plurality of fins 34 can speed up cooling the plurality of heat generation elements. The sprayed water can quickly be blown out of the enclosure 10 through the output 124 by the airflow.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mechanical Engineering (AREA)
  • Special Spraying Apparatus (AREA)

Abstract

An electronic device includes an enclosure, a heat sink, and a spray device. The spray device includes a water box, a pump member, and a spray member. The spray member connects to the pump member. A plurality of nozzles is defined in the spray member facing the heat sink. The pump member draws water from the water box and sprays the water to the heat sink through the spray member.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure generally relates to electronic devices, and particularly to an electronic device with a spray type heat dissipation.
  • 2. Description of Related Art
  • Heat dissipation devices, such as a fan and a heat sink are located in an enclosure of an electronic device for dissipating heat. Power consumption and heat from the electronic device increase with the enhancement of performance For satisfying increased heat dissipation demand, a fan with better heat dissipation effect, such as higher rotation speed, or larger blades is required. Fan with higher rotation speed may generate greater noise, and the enclosure of the electronic device has to be enlarged if larger fan is used. Thus, there is a room for improvement within the art.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of an electronic device in one embodiment.
  • FIG. 2 is a partial exploded, isometric view of the electronic device of FIG. 1.
  • FIG. 3 is an exploded, isometric view of a spray device of the electronic device of FIG. 2.
  • FIG. 4 is an assembled view of the spray device of FIG. 3.
  • FIG. 5 is a partial assembled view of the electronic device of FIG. 2.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
  • FIG. 1 and FIG. 2 illustrate one embodiment of an electronic device 100 with a spray device 50. The electronic device 100 may be a laptop computer, plane computer, or handhold computer.
  • The electronic device 100 includes an enclosure 10, a motherboard 20, a heat sink 30 and a spray device 50. The enclosure 10 includes a bottom cover 12 and a keyboard module 18. An outlet 124 is defined in one side of the bottom cover 12. The motherboard 20 is located between the bottom cover 12 and the keyboard module 18. A plurality of heat generation elements, such as CPU, and memory is located on the motherboard 20. An opening 22 is defined in the enclosure 10.
  • The heat sink 30 includes a fan 31, a heat pipe 35 and a plurality of fins 34. A first end of the heat pipe 35 contacts the plurality of elements 23, and a second end of the heat pipe 35 contacts the plurality of fins 34.
  • FIG. 3 and FIG. 4 illustrate an exploded view and an assembled view of the spray device 50. The spray device 50 includes a water box 51, a pump member 53, a spray member 55 and a baffle 58.
  • The water box 51 is substantially cylinder. The water box 51 can contain water, such as pure water, or alcohol.
  • The pump member 53 includes a press cylinder 532, an inlet pipe 531, an outlet pipe 533, a press pole 535, and a cap 537, and a coil spring 539. The pump member 53 can draw the water to the spray member 55 by pressing down the cap 537. The cap 537 is located on a top portion of the press pole 535. A bottom portion of the press pole 535 extends into the press cylinder 532. The coil spring 539 surrounds the press pole 535, and is located between the cap 537 and the press cylinder 532. A through hole 582 is defined in the baffle 58 for receiving the cap 537. The cap 537 can move through the through hole 582.
  • The spray member 55 includes a buffering pipe 551, a spray pipe 555, and a connecting pipe 553 connecting the buffering pipe 551 and the spray pipe 555. The buffering pipe 551 connects the outlet pipe 533 of the pump member 53. The outlet pipe 533 engages with the buffering pipe 551 by an interference fit. The buffering pipe 551 is substantially U-shaped for preventing water backflow. The spray pipe 555 and the connecting pipe 553 are substantially straight. The spray pipe 555 is substantially perpendicular to the connecting pipe 553. The spray pipe 555 and the connecting pipe 553 are located in a first plane. The buffering pipe 551 is located in a second plane. The first plane is substantially perpendicular to the second plane. A plurality of nozzles 556 is defined in the spray pipe 555. The plurality of nozzles 556 is evenly spaced.
  • FIG. 5 illustrates a partially assembled view of the electronic device 100. The heat sink 30 is located on the motherboard 20. The first end of the heat pipe 35 contacts the plurality of elements 23, and the second end of the heat pipe 35 contacts the plurality of fins 34. The plurality of fins 34 is located between the fan 31 and the outlet 124 of the enclosure 10. The press cylinder 532 is mounted to the water box 51. The inlet pipe 531 extends into the water box 51. The cap 537 is attached to the press pole 535. The baffle 58 is mounted to the opening 22 of the enclosure 10. The outlet pipe 533, the buffering pipe 551, the connecting pipe 553, and the spray pipe 555 are connected. The spray pipe 555 is located on a lateral side of the plurality of the fins 34 adjacent to the outlet 124 of the enclosure 10. The cap 537 protrudes from the baffle 58.
  • In use, heat generates from the plurality of the heat generation elements. Airflow extends through the plurality of fins 34 generated from the fan 31. For further dissipating heat from the heat sink 30, the cap 537 is pressed down. The pump member 53 draws water from the water box 51 and outputs the water to the spray member 55. The water extends through the spray member 55 and sprays out through the plurality of nozzles 556. The sprayed water falling onto the plurality of fins 34 can speed up cooling the plurality of heat generation elements. The sprayed water can quickly be blown out of the enclosure 10 through the output 124 by the airflow.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (18)

What is claimed is:
1. An electronic device comprising:
an enclosure;
a heat sink; and
a spray device, comprising a water box, a pump member, and a spray member, the spray member connecting to the pump member, a plurality of nozzles defined in the spray member and directed towards the heat sink,
wherein the pump member is configured to draw water from the water box and spray the water to the heat sink through the spray member.
2. The electronic device of claim 1, wherein the pump member comprises a press cylinder, a press pole, and a cap located on the press pole; and the pump member is configured to draw the water to the spray member by pressing down the cap.
3. The electronic device of claim 2, wherein the pump member further comprises a baffle, the baffle is located on the enclosure, a through hole is defined in the baffle, and the cap is configured to move through the through hole.
4. The electronic device of claim 2, wherein the pump member further comprises a coil spring located between the cap and the press cylinder.
5. The electronic device of claim 1, wherein the spray member comprises a buffering pipe, and the buffering pipe is substantially U-shaped.
6. The electronic device of claim 5, wherein the pump member comprises an outlet pipe, and the outlet pipe engages with the buffering pipe by an interference fit.
7. The electronic device of claim 5, wherein the spray member further comprises a spray pipe and a connecting pipe connecting the spray pipe and the buffering pipe, the spray pipe and the connecting pipe are substantially straight, and the spray pipe is substantially perpendicular to the connecting pipe.
8. The electronic device of claim 7, wherein the spray pipe and the connecting pipe are located in a first plane, the buffering pipe is located in a second plane, and the first plane is substantially perpendicular to the second plane.
9. The electronic device of claim 1, wherein an outlet is defined in the enclosure, the heat sink is located adjacent to the outlet, the heat sink comprises a fan and a plurality of fins, the plurality of fins is located between the fan and the outlet, and the plurality of nozzles is directed towards the plurality of fins.
10. The electronic device of claim 9, wherein the spray member is located adjacent the outlet.
11. A spray device located in an enclosure of an electronic device for spray water to a heat sink, the spray device comprising:
a water box;
a pump member; and
a spray member, the spray member connecting to the pump member, a plurality of nozzles defined in the spray member and directed towards the heat sink,
wherein the pump member is configured to draw water from the water box and spray the water to the heat sink through the spray member.
12. The spray device of claim 11, wherein the pump member comprises a press cylinder, a press pole, and a cap located on the press pole; and the pump member is configured to draw the water to the spray member by pressing down the cap.
13. The spray device of claim 12, wherein the pump member further comprises a baffle, the baffle is located on the enclosure, a through hole is defined in the baffle, and the cap is configured to move through the through hole.
14. The spray device of claim 12, wherein the pump member further comprises a coil spring located between the cap and the press cylinder.
15. The spray device of claim 11, wherein the spray member comprises a buffering pipe, and the buffering pipe is substantially U-shaped.
16. The spray device of claim 15, wherein the pump member comprises an outlet pipe, the outlet pipe engages with the buffering pipe by an interference fit.
17. The spray device of claim 15, wherein the spray member further comprises a spray pipe and a connecting pipe connecting the spray pipe and the buffering pipe, the spray pipe and the connecting pipe are substantially straight, and the spray pipe is substantially perpendicular to the connecting pipe.
18. The spray device of claim 17, wherein the spray pipe and the connecting pipe are located in a first plane, the buffering pipe is located in a second plane, and the first plane is substantially perpendicular to the second plane.
US13/948,109 2012-11-19 2013-07-22 Electronic device with spray type heat dissipation device Abandoned US20140138062A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210467389.1A CN103826413A (en) 2012-11-19 2012-11-19 Spray-type heat-radiating structure
CN2012104673891 2012-11-19

Publications (1)

Publication Number Publication Date
US20140138062A1 true US20140138062A1 (en) 2014-05-22

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US13/948,109 Abandoned US20140138062A1 (en) 2012-11-19 2013-07-22 Electronic device with spray type heat dissipation device

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US (1) US20140138062A1 (en)
CN (1) CN103826413A (en)
TW (1) TW201421214A (en)

Cited By (1)

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US20140144608A1 (en) * 2012-11-23 2014-05-29 Hon Hai Precision Industry Co., Ltd. Evaporation-assisted heat dissipation apparatus

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CN105828575B (en) * 2016-03-28 2020-03-17 中车株洲电力机车研究所有限公司 Jet flow two-phase heat exchange cold plate and cooling system for rail transit
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CN105958950B (en) * 2016-05-20 2018-09-11 四川汇英光电科技有限公司 A kind of strong heat dissipation type solid-state power amplifier
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CN109974504B (en) * 2019-03-27 2020-10-20 中国电子科技集团公司第三十八研究所 Spray cooling plate of integrated atomization mechanism
CN110001548B (en) * 2019-04-15 2020-10-27 哈尔滨理工大学 Pure electric vehicles vehicle control unit
CN113253820A (en) * 2021-05-25 2021-08-13 刘春英 Computer heat radiation structure

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US20140144608A1 (en) * 2012-11-23 2014-05-29 Hon Hai Precision Industry Co., Ltd. Evaporation-assisted heat dissipation apparatus
US9171775B2 (en) * 2012-11-23 2015-10-27 Shenzhen Treasure City Technology Co., Ltd. Evaporation-assisted heat dissipation apparatus

Also Published As

Publication number Publication date
CN103826413A (en) 2014-05-28
TW201421214A (en) 2014-06-01

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AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZENG, XIANG-KUN;LU, ER-WEI;YANG, RONG;REEL/FRAME:030861/0921

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