US20130312938A1 - Heat pipe with vaporized working fluid flow accelerator - Google Patents
Heat pipe with vaporized working fluid flow accelerator Download PDFInfo
- Publication number
- US20130312938A1 US20130312938A1 US13/532,809 US201213532809A US2013312938A1 US 20130312938 A1 US20130312938 A1 US 20130312938A1 US 201213532809 A US201213532809 A US 201213532809A US 2013312938 A1 US2013312938 A1 US 2013312938A1
- Authority
- US
- United States
- Prior art keywords
- heat pipe
- section
- condenser
- heat
- wick structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure generally relates to heat transfer apparatuses such as those used in electronic equipment, and more particularly to a heat pipe with high heat transfer efficiency.
- Heat pipes are widely used in various fields for heat dissipation purposes due to their excellent heat transfer performance.
- One commonly used heat pipe includes a sealed tube made of thermally conductive material with a working fluid contained therein.
- the working fluid conveys heat from one end of the tube, typically referred to as an evaporator section, to the other end of the tube, typically referred to as a condenser section.
- a wick structure is provided inside the heat pipe, lining an inner wall of the tube, and drawing the working fluid back to the evaporator section after it condenses at the condenser section.
- the evaporator section of the heat pipe maintains thermal contact with a heat-generating electronic component.
- the working fluid at the evaporator section absorbs heat generated by the electronic component, and thereby turns to vapor.
- the generated vapor moves, carrying the heat with it, toward the condenser section.
- the vapor condenses after the heat is dissipated.
- the condensate is then drawn back by the wick structure to the evaporator section where it is again available for evaporation.
- the condensate and the vapor move toward opposite directions.
- the vapor is prone to obstruct the movement of the condensate back to the evaporator section.
- a speed of the working fluid flowing back to the evaporator section decreases.
- the evaporator section is then prone to becoming dry.
- FIG. 1 is a lateral side, cross-sectional view of a heat pipe according to a first embodiment of the present disclosure.
- FIG. 2 is a lateral side, cross-sectional view of a heat pipe according to a second embodiment of the present disclosure.
- FIG. 3 is a lateral side, cross-sectional view of a heat pipe according to a third embodiment of the present disclosure.
- FIG. 4 is a schematic, enlarged, isometric view of part of an accelerator of the heat pipe of FIG. 1 .
- the heat pipe 10 includes a sealed, flat tube 100 , a wick structure 200 lining an inner surface of the tube 100 , working fluid (not shown) contained in the wick structure 200 , and an accelerator 300 received in the tube 100 .
- the tube 100 is made of metal or metal alloy with a high heat conductivity coefficient, such as copper, copper-alloy, or other suitable material.
- the tube 100 is elongated and has an evaporator section 110 , an adiabatic section 130 , and a condenser section 120 defined in that order along a longitudinal direction thereof.
- the wick structure 200 is formed by weaving a plurality of metal wires such as copper or stainless steel wires, or by sintering metal powder.
- the wick structure 200 extends longitudinally from the evaporator section 110 to the condenser section 120 .
- An inner space 140 is longitudinally defined between inner surfaces of the wick structure 200 .
- the wick structure 200 draws the working fluid back to the evaporator section 110 from the condenser section 120 .
- the accelerator 300 is located at a junction of the evaporator section 110 and the adiabatic section 130 . Peripheral edges of the accelerator 300 abut against the inner surfaces of the wick structure 200 to divide the inner space 140 to two parts.
- the accelerator 300 includes an elongated main body 310 .
- the main body 310 includes a first surface 311 and a second surface 312 at opposite sides thereof.
- the first surface 311 and the second surface 312 are parallel to each other, and respectively face the evaporator section 110 and the condenser section 120 .
- a plurality of through holes 320 is defined in the main body 310 .
- Each through hole 320 is tapered, and extends through the first surface 311 and the second surface 312 along a thickness direction of the main body 310 .
- the through holes 320 resemble a plurality of nozzles in the main body 310 .
- a diameter of each through hole 320 decreases from an inlet thereof near the evaporator section 110 to an outlet thereof facing toward the condenser section 120 .
- a transverse cross-sectional view of each through hole 320 defines a circle.
- An inner surface of each through hole 320 is a smooth, frustoconical surface.
- the accelerator 300 is made of a metal or metal alloy with a high heat conductivity coefficient.
- the evaporator section 110 of the heat pipe 10 is positioned in intimate thermal contact with a heat-generating component 400 such as an electronic component.
- a heat-generating component 400 such as an electronic component.
- the working fluid in the wick structure 200 of the evaporator section 110 absorbs heat from the heat-generating component 400 and is vaporized.
- the vapor generates a vapor pressure which propels the vapor to flow through the through holes 320 and move towards the condenser section 120 .
- the value of ⁇ inlet is typically approximately equal to the value of ⁇ outlet . Because the diameter of the through hole 320 decreases from the inlet to the outlet, the value of A inlet is larger than the value of A outlet . Therefore, the value of V inlet is less than the value of V outlet .
- a flow velocity of the vapor increases along a flowing direction of the vapor.
- the vapor can accordingly rapidly transmit to the condenser section 120 for dissipation of the heat of the vapor.
- a heat dissipation efficiency of the heat pipe 10 can thus be improved.
- each through hole 320 reduces along the flowing direction of the vapor from the evaporator section 110 to the condenser section 120 , the vapor in the through hole 320 is compressed towards a center axis of the through hole 320 .
- a ratio of the vapor obstructing the condensate of the wick structure 200 in the adiabatic section 130 and the condenser section 120 is decreased, and the condensate in the adiabatic and condenser sections 130 , 120 can flow back to the evaporator section 110 rapidly.
- the value of V inlet is less than the value of V outlet .
- the kinetic energy of the vapor at the outlet is larger than that of the vapor at the inlet of the through hole 320 , and the thermal energy of the vapor at the outlet is less than that of the vapor at the inlet of the through hole 320 .
- a condensing efficiency of the vapor can be improved.
- the heat pipe 20 is similar to the heat pipe 10 of the first embodiment.
- the heat pipe 20 includes an evaporator section 510 and a condenser section 520 defined in turn along a longitudinal direction thereof.
- the accelerator 300 is located at a junction of the evaporator section 510 and the condenser section 520 .
- the first surface 311 and the second surface 312 respectively face the evaporator section 510 and the condenser section 520 .
- a plurality of parallel fins 530 is formed on an outer periphery of the condenser section 520 of the heat pipe 20 .
- the heat pipe 30 includes an evaporator section 610 and two condenser sections 620 located at opposite sides of the evaporator section 610 , with the three sections 620 , 610 , 620 defined in that order along a longitudinal direction of the heat pipe 30 .
- a plurality of parallel fins 630 is formed on an outer periphery of each condenser section 620 .
- Two accelerators 300 are respectively located at a junction of the evaporator section 610 and one of the condenser sections 620 , and at a junction of the evaporator section 610 and the other condenser section 620 .
- the first surface 311 and the second surface 312 of each accelerator 300 respectively face the evaporator section 610 and the corresponding condenser section 620 .
Abstract
An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section.
Description
- 1. Technical Field
- The disclosure generally relates to heat transfer apparatuses such as those used in electronic equipment, and more particularly to a heat pipe with high heat transfer efficiency.
- 2. Description of Related Art
- Heat pipes are widely used in various fields for heat dissipation purposes due to their excellent heat transfer performance. One commonly used heat pipe includes a sealed tube made of thermally conductive material with a working fluid contained therein. The working fluid conveys heat from one end of the tube, typically referred to as an evaporator section, to the other end of the tube, typically referred to as a condenser section. Preferably, a wick structure is provided inside the heat pipe, lining an inner wall of the tube, and drawing the working fluid back to the evaporator section after it condenses at the condenser section.
- During operation of the heat pipe in a typical application, the evaporator section of the heat pipe maintains thermal contact with a heat-generating electronic component. The working fluid at the evaporator section absorbs heat generated by the electronic component, and thereby turns to vapor. The generated vapor moves, carrying the heat with it, toward the condenser section. At the condenser section, the vapor condenses after the heat is dissipated. The condensate is then drawn back by the wick structure to the evaporator section where it is again available for evaporation. The condensate and the vapor move toward opposite directions. The vapor is prone to obstruct the movement of the condensate back to the evaporator section. Thus, a speed of the working fluid flowing back to the evaporator section decreases. Moreover, the evaporator section is then prone to becoming dry.
- What is needed, therefore, is a heat pipe to overcome the above described shortcomings.
-
FIG. 1 is a lateral side, cross-sectional view of a heat pipe according to a first embodiment of the present disclosure. -
FIG. 2 is a lateral side, cross-sectional view of a heat pipe according to a second embodiment of the present disclosure. -
FIG. 3 is a lateral side, cross-sectional view of a heat pipe according to a third embodiment of the present disclosure. -
FIG. 4 is a schematic, enlarged, isometric view of part of an accelerator of the heat pipe ofFIG. 1 . - Embodiments of the present heat pipe will now be described in detail below and with reference to the drawings.
- Referring to
FIG. 1 , aheat pipe 10 in accordance with a first embodiment of the present disclosure is shown. Theheat pipe 10 includes a sealed,flat tube 100, awick structure 200 lining an inner surface of thetube 100, working fluid (not shown) contained in thewick structure 200, and anaccelerator 300 received in thetube 100. - The
tube 100 is made of metal or metal alloy with a high heat conductivity coefficient, such as copper, copper-alloy, or other suitable material. Thetube 100 is elongated and has anevaporator section 110, anadiabatic section 130, and acondenser section 120 defined in that order along a longitudinal direction thereof. - The
wick structure 200 is formed by weaving a plurality of metal wires such as copper or stainless steel wires, or by sintering metal powder. Thewick structure 200 extends longitudinally from theevaporator section 110 to thecondenser section 120. Aninner space 140 is longitudinally defined between inner surfaces of thewick structure 200. Thewick structure 200 draws the working fluid back to theevaporator section 110 from thecondenser section 120. - Referring to
FIG. 4 , theaccelerator 300 is located at a junction of theevaporator section 110 and theadiabatic section 130. Peripheral edges of theaccelerator 300 abut against the inner surfaces of thewick structure 200 to divide theinner space 140 to two parts. Theaccelerator 300 includes an elongatedmain body 310. Themain body 310 includes afirst surface 311 and asecond surface 312 at opposite sides thereof. Thefirst surface 311 and thesecond surface 312 are parallel to each other, and respectively face theevaporator section 110 and thecondenser section 120. A plurality of throughholes 320 is defined in themain body 310. Each throughhole 320 is tapered, and extends through thefirst surface 311 and thesecond surface 312 along a thickness direction of themain body 310. The throughholes 320 resemble a plurality of nozzles in themain body 310. A diameter of each throughhole 320 decreases from an inlet thereof near theevaporator section 110 to an outlet thereof facing toward thecondenser section 120. A transverse cross-sectional view of each throughhole 320 defines a circle. An inner surface of each throughhole 320 is a smooth, frustoconical surface. Theaccelerator 300 is made of a metal or metal alloy with a high heat conductivity coefficient. - In the illustrated embodiment, the
evaporator section 110 of theheat pipe 10 is positioned in intimate thermal contact with a heat-generating component 400 such as an electronic component. During operation of the heat-generating component 400, the working fluid in thewick structure 200 of theevaporator section 110 absorbs heat from the heat-generating component 400 and is vaporized. Thus, the vapor generates a vapor pressure which propels the vapor to flow through the throughholes 320 and move towards thecondenser section 120. According to the law of conservation of mass, a mass of the vapor satisfies the condition: ρinletVinletAinlet=ρoutletVoutletAoutlet, wherein ρ represents a density of the vapor, A represents a cross-sectional area of each throughhole 320, and V represents a flow velocity of the vapor. The value of ρinlet is typically approximately equal to the value of ρoutlet. Because the diameter of the throughhole 320 decreases from the inlet to the outlet, the value of Ainlet is larger than the value of Aoutlet. Therefore, the value of Vinlet is less than the value of Voutlet. Thus, a flow velocity of the vapor increases along a flowing direction of the vapor. The vapor can accordingly rapidly transmit to thecondenser section 120 for dissipation of the heat of the vapor. A heat dissipation efficiency of theheat pipe 10 can thus be improved. - On the other hand, because the diameter of each through
hole 320 reduces along the flowing direction of the vapor from theevaporator section 110 to thecondenser section 120, the vapor in thethrough hole 320 is compressed towards a center axis of thethrough hole 320. Thus a ratio of the vapor obstructing the condensate of thewick structure 200 in theadiabatic section 130 and thecondenser section 120 is decreased, and the condensate in the adiabatic andcondenser sections evaporator section 110 rapidly. According to the law of conservation of energy, the value of Vinlet is less than the value of Voutlet. Therefore, the kinetic energy of the vapor at the outlet is larger than that of the vapor at the inlet of thethrough hole 320, and the thermal energy of the vapor at the outlet is less than that of the vapor at the inlet of thethrough hole 320. Thus, a condensing efficiency of the vapor can be improved. - Referring to
FIG. 2 , aheat pipe 20 of a second embodiment is shown. Theheat pipe 20 is similar to theheat pipe 10 of the first embodiment. Theheat pipe 20 includes anevaporator section 510 and acondenser section 520 defined in turn along a longitudinal direction thereof. Theaccelerator 300 is located at a junction of theevaporator section 510 and thecondenser section 520. Thefirst surface 311 and thesecond surface 312 respectively face theevaporator section 510 and thecondenser section 520. A plurality ofparallel fins 530 is formed on an outer periphery of thecondenser section 520 of theheat pipe 20. - Referring to
FIG. 3 , aheat pipe 30 of a third embodiment is shown. Theheat pipe 30 includes anevaporator section 610 and twocondenser sections 620 located at opposite sides of theevaporator section 610, with the threesections heat pipe 30. A plurality ofparallel fins 630 is formed on an outer periphery of eachcondenser section 620. Twoaccelerators 300 are respectively located at a junction of theevaporator section 610 and one of thecondenser sections 620, and at a junction of theevaporator section 610 and theother condenser section 620. Thefirst surface 311 and thesecond surface 312 of eachaccelerator 300 respectively face theevaporator section 610 and thecorresponding condenser section 620. - It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (18)
1. A heat pipe for removing heat from a heat-generating component in thermal contact therewith, the heat pipe comprising:
a hollow tube comprising an evaporator section and a condenser section defined in turn along a longitudinal direction thereof;
a wick structure lining inner surfaces of the tube, inner surfaces of the wick structure defining an inner space therebetween;
working fluid contained in the wick structure; and
an accelerator received in the tube, edges of the accelerator abutting against the inner surfaces of the wick structure to divide the inner space into two parts;
wherein the working fluid in the wick structure of the evaporator section absorbs heat from the heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster through the accelerator towards the condenser section.
2. The heat pipe of claim 1 , wherein the accelerator is an elongated plate and comprises a first surface and a second surface opposite to the first surface, the first and second surfaces respectively face the evaporator section and the condenser section, a plurality of through holes is defined in the accelerator and extends through the first surface and the second surface, and the vapor flows through the through holes and moves towards the condenser section.
3. The heat pipe of claim 1 , wherein a diameter of each through hole decreases from an inlet near to the evaporator section to an outlet near to the condenser section.
4. The heat pipe of claim 3 , wherein a cross-sectional view of each through hole is circular.
5. The heat pipe of claim 1 , wherein the accelerator is made of a metal or metal alloy with a high heat conductivity coefficient.
6. The heat pipe of claim 1 , wherein the accelerator is located at a joint of the evaporator section and the condenser section.
7. The heat pipe of claim 1 , wherein a plurality of fins is formed on an outer periphery of the condenser section.
8. The heat pipe of claim 1 , wherein the tube further comprises an adiabatic section between the evaporator section and the condenser section along the longitudinal direction of the tube, and the accelerator is located at a joint of the evaporator section and the adiabatic section.
9. The heat pipe of claim 1 , wherein the tube comprises two condenser sections, the two condenser sections are located at opposite sides of the evaporator section, and two accelerators are respectively located at a joint of the evaporator section and the condenser section.
10. The heat pipe of claim 9 , wherein a plurality of fins is formed on an outer periphery of each condenser sections.
11. The heat pipe of claim 1 , wherein the tube is made of metal or metal alloy with a high heat conductivity coefficient.
12. The heat pipe of claim 1 , wherein the wick structure extends longitudinally from the evaporator section to the condenser section.
13. A heat pipe for removing heat from a heat-generating component in thermal contact therewith, the heat pipe comprising:
a hollow tube comprising an evaporator section and a condenser section defined in turn along a longitudinal direction thereof;
a wick structure lining inner surfaces of the tube, inner surfaces of the wick structure defining an inner space therebetween;
working fluid contained in the wick structure; and
an elongated plate received in the tube, edges of the elongated plate abutting against the inner surfaces of the wick structure to divide the inner space into two parts, and a plurality of through holes defined in the elongated plate;
wherein the working fluid in the wick structure of the evaporator section absorbs heat from the heat-generating component and is vaporized to vapor, and the vapor flows through the through holes and moves faster and faster in the through holes towards the condenser section.
14. The heat pipe of claim 13 , wherein a diameter of each through hole decreases from an inlet near to the evaporator section to an outlet near to the condenser section.
15. The heat pipe of claim 13 , wherein the elongated plate is made of a metal or metal alloy with a high heat conductivity coefficient.
16. The heat pipe of claim 13 , wherein an inner surface of each through hole is a smooth, annular surface.
17. The heat pipe of claim 13 , wherein a plurality of fins is formed on an outer periphery of the condenser section.
18. The heat pipe of claim 13 , wherein the tube comprises two condenser sections, the two condenser sections are located at opposite sides of the evaporator section, and two accelerators are respectively located at a joint of the evaporator section and the condenser section.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101118099 | 2012-05-22 | ||
TW101118099A TW201348671A (en) | 2012-05-22 | 2012-05-22 | Heat pipe |
Publications (1)
Publication Number | Publication Date |
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US20130312938A1 true US20130312938A1 (en) | 2013-11-28 |
Family
ID=49620680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/532,809 Abandoned US20130312938A1 (en) | 2012-05-22 | 2012-06-26 | Heat pipe with vaporized working fluid flow accelerator |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130312938A1 (en) |
JP (1) | JP5642836B2 (en) |
TW (1) | TW201348671A (en) |
Cited By (4)
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CN106568342A (en) * | 2015-10-13 | 2017-04-19 | 超众科技股份有限公司 | Combined type structure of plate heat pipe and heat conducting device |
US20170131036A1 (en) * | 2015-11-05 | 2017-05-11 | Chaun-Choung Technology Corp. | Composite structure of flat heat pipe and heat conduction device thereof |
US20210129995A1 (en) * | 2016-12-20 | 2021-05-06 | Qualcomm Incorporated | Systems, methods, and apparatus for passive cooling of uavs |
KR20210110249A (en) * | 2021-08-18 | 2021-09-07 | 한국이미지시스템(주) | Heat pipe and motor cooled thereby |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN105737652A (en) * | 2016-04-12 | 2016-07-06 | 张洪延 | Heat transmission device |
KR102005339B1 (en) * | 2017-06-16 | 2019-07-30 | 에스디(주) | Thermosyphon with curved perforated plate |
TWI699506B (en) * | 2019-04-10 | 2020-07-21 | 嘉龍國際股份有限公司 | Three-dimensional phase change remote cooling module |
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2012
- 2012-05-22 TW TW101118099A patent/TW201348671A/en unknown
- 2012-06-26 US US13/532,809 patent/US20130312938A1/en not_active Abandoned
-
2013
- 2013-05-17 JP JP2013104842A patent/JP5642836B2/en not_active Expired - Fee Related
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US6571863B1 (en) * | 2002-08-27 | 2003-06-03 | Compal Electronics, Inc. | Turbulence inducing heat pipe for improved heat transfer rates |
US8221674B2 (en) * | 2005-12-23 | 2012-07-17 | Siemens Vai Metals Technologies Gmbh | Distributor base |
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US8584740B2 (en) * | 2007-08-08 | 2013-11-19 | Astrium Sas | Passive device with micro capillary pumped fluid loop |
US20120118537A1 (en) * | 2009-07-21 | 2012-05-17 | Furukawa Electric Co., Ltd. | Flattened heat pipe and manufacturing method thereof |
US20130048250A1 (en) * | 2011-08-26 | 2013-02-28 | Himanshu Pokharna | Heat pipe made of composite material and method of manufacturing the same |
US20130299136A1 (en) * | 2012-05-11 | 2013-11-14 | Walter John Bilski | Variable-conductance heat transfer device |
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CN106568342A (en) * | 2015-10-13 | 2017-04-19 | 超众科技股份有限公司 | Combined type structure of plate heat pipe and heat conducting device |
US20170131036A1 (en) * | 2015-11-05 | 2017-05-11 | Chaun-Choung Technology Corp. | Composite structure of flat heat pipe and heat conduction device thereof |
US9689623B2 (en) * | 2015-11-05 | 2017-06-27 | Chaun-Choung Technology Corp. | Composite structure of flat heat pipe and heat conduction device thereof |
US20210129995A1 (en) * | 2016-12-20 | 2021-05-06 | Qualcomm Incorporated | Systems, methods, and apparatus for passive cooling of uavs |
US11975846B2 (en) * | 2016-12-20 | 2024-05-07 | Qualcomm Incorporated | Systems, methods, and apparatus for passive cooling of UAVs |
KR20210110249A (en) * | 2021-08-18 | 2021-09-07 | 한국이미지시스템(주) | Heat pipe and motor cooled thereby |
KR102634868B1 (en) * | 2021-08-18 | 2024-02-07 | 한국이미지시스템(주) | Heat pipe and motor cooled thereby |
Also Published As
Publication number | Publication date |
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TW201348671A (en) | 2013-12-01 |
JP2013242135A (en) | 2013-12-05 |
JP5642836B2 (en) | 2014-12-17 |
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