US20130092358A1 - Ceramic radiation heat dissipation structure - Google Patents

Ceramic radiation heat dissipation structure Download PDF

Info

Publication number
US20130092358A1
US20130092358A1 US13/806,724 US201113806724A US2013092358A1 US 20130092358 A1 US20130092358 A1 US 20130092358A1 US 201113806724 A US201113806724 A US 201113806724A US 2013092358 A1 US2013092358 A1 US 2013092358A1
Authority
US
United States
Prior art keywords
heat dissipation
radiation
ceramic
radiation heat
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/806,724
Inventor
Jeong-Shiun Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINGDEZHEN FARED Tech CO Ltd
Original Assignee
JINGDEZHEN FARED Tech CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINGDEZHEN FARED Tech CO Ltd filed Critical JINGDEZHEN FARED Tech CO Ltd
Assigned to JINGDEZHEN FARED TECHNOLOGY CO., LTD. reassignment JINGDEZHEN FARED TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, JEONG-SHIUN
Publication of US20130092358A1 publication Critical patent/US20130092358A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention generally relates to a heat dissipation structure, and more specifically to a heat dissipation structure having a ceramic substrate and radiation heat dissipation films.
  • the solution to heat dissipation in the prior arts is utilizing heat dissipation plates with considerably large surface area, such as a fin shape of the aluminum heat sink, in order to increase heat dissipation by enhancing heat convention with surrounding air.
  • the heat generated by the heat source is thermally conducted to the heat sink and it is not easy to effectively improve the efficiency of heat dissipation due to limited cross sectional area for thermal conduction.
  • the traditional aluminum heat sink is usually large in size and not convenient to use in actual applications as well as the cost is increased. Therefore, it is desired to provide a new ceramic radiation heat dissipation structure to overcome the above problems in the prior arts.
  • the present invention has been made in view of the above problems, and it is an objective of the present invention to provide a ceramic radiation heat dissipation structure for heat dissipation from a heat source.
  • the ceramic radiation heat dissipation structure includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate.
  • One surface of the ceramic substrate is attached to the heat source such that the heat generated by the heat source is thermally conducted to the ceramic substrate.
  • the other surface of the ceramic substrate is provided with a first radiation heat dissipation film, and the porous heat dissipation plate is attached to the first radiation heat dissipation film.
  • the porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the heat dissipation hole is provided with a second radiation heat dissipation film. Because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films, the heat is fastly propagated outwards.
  • Another objective of the present invention is to provide a ceramic radiation heat dissipation structure for heat dissipation from a heat source, includes a ceramic substrate, a first radiation heat dissipation film and a multicolumn heat dissipation plate.
  • the ceramic substrate is attached to the heat source and a first radiation heat dissipation film is provided on the ceramic substrate.
  • the multicolumn heat dissipation plate is attached to the first radiation heat dissipation film.
  • the multicolumn heat dissipation plate has at least one heat dissipation column, and an outer surface of the heat dissipation column is provided with a third radiation heat dissipation film, which propagates the heat by thermal radiation.
  • the ceramic radiation heat dissipation structure of the present invention can fastly propagate the heat generated by the heat source outwards, and particular, the second radiation heat dissipation film on the heat dissipation hole or the third radiation heat dissipation film on the heat dissipation column provide further thermal radiation so as to enhance the efficiency of whole heat dissipation.
  • FIG. 1 is a schematic view showing one embodiment of a ceramic radiation heat dissipation structure according to the present invention.
  • FIG. 2 is a schematic view showing another embodiment of the ceramic radiation heat dissipation structure according to the present invention.
  • FIG. 1 is a schematic view showing one embodiment of a ceramic radiation heat dissipation structure according to the present invention.
  • the ceramic radiation heat dissipation structure of the present invention is used for heat dissipation from a heat source 10 , including a CPU (central processing unit), graphic processing unit, power supply, transformer or power management IC (integrated circuit).
  • a CPU central processing unit
  • graphic processing unit graphic processing unit
  • power supply transformer
  • power management IC integrated circuit
  • the ceramic radiation heat dissipation structure of the present invention generally includes a ceramic substrate 20 , a first radiation heat dissipation film 30 and a porous heat dissipation plate 40 .
  • the ceramic substrate 20 has a first surface (as a lower surface shown in FIG. 1 ) and a second surface (as an upper surface shown in FIG. 1 ).
  • the first surface is attached to the heat source 10 such that the heat generated by the heat source 10 is propagated to the ceramic substrate 20 by thermal conduction and the second surface is provided with the first radiation heat dissipation film 30 .
  • the porous heat dissipation plate 40 is attached to the first radiation heat dissipation film 30 . That is, the ceramic substrate 20 and the porous heat dissipation plate 40 are on the two opposite surfaces of the first radiation heat dissipation film 30 , respectively.
  • the first radiation heat dissipation film 30 has a specific function of propagating the heat primarily by thermal radiation to conduct heat dissipation.
  • the first radiation heat dissipation film 30 is made from a mixture of metal and nonmetal compounds.
  • the mixture of metal and nonmetal compounds generally consists of a metal compound and a nonmetal compound. More specifically, the metal compound consists of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony.
  • the nonmetal compound includes at least one of oxide or nitride or inorganic acid consisting of at least one of boron and carbon.
  • the porous heat dissipation plate 40 has at least one heat dissipation hole 42 .
  • a second radiation heat dissipation film (not visible) is provided on the upper surface of the porous heat dissipation plate 40 and the inner sidewall of the heat dissipation hole 42 .
  • the second radiation heat dissipation film is made from the same material as that of the first radiation heat dissipation film 30 and also has the function of enhancing heat dissipation by thermal radiation.
  • the whole efficiency of heat dissipation for the ceramic radiation heat dissipation structure of the present invention is further improved by appropriately increasing the number of the heat dissipation hole 42 , which provides added thermal radiation.
  • heat dissipation hole 42 shown in FIG. 1 is a round through hole as an illustrative example, and apparently not intended to limit the scope of the present invention. That is, the heat dissipation hole 42 can be implemented by other shapes, like triangular, rectangular or polygonal through hole or recess.
  • the present invention may further include a fan (not visible) to enhance thermal convection for heat dissipation by air convention or turbulence.
  • the fan is disposed on an outer side of the porous heat dissipation plate 40 , or preferably above the porous heat dissipation plate 40 .
  • One aspect of the present invention is that the heat transferred to the ceramic substrate is propagated through the first radiation heat dissipation film to the porous heat dissipation plate by thermal radiation, and then the second radiation heat dissipation film on the porous heat dissipation plate propagates the heat outwards by thermal radiation.
  • FIG. 2 is a schematic view showing another embodiment of the ceramic radiation heat dissipation structure according to the present invention.
  • the ceramic radiation heat dissipation structure of this embodiment includes a ceramic substrate 20 , a first radiation heat dissipation film 30 and a multicolumn heat dissipation plate 50 .
  • the ceramic radiation heat dissipation structure in FIG. 2 is similar to the ceramic radiation heat dissipation structure in FIG. 1 .
  • the primary difference is that the multicolumn heat dissipation plate 50 is used to replace the porous heat dissipation plate 40 .
  • the detailed description for other elements is omitted hereinafter.
  • the multicolumn heat dissipation plate 50 has at least one heat dissipation column 52 , and the outer surface of each heat dissipation column 52 and the upper surface of the multicolumn heat dissipation plate 50 are provided with a third radiation heat dissipation film (not visible), which is made from the same material as that of the first radiation heat dissipation film 30 and also has the function of enhancing heat dissipation by thermal radiation.
  • the third radiation heat dissipation film can propagate the heat outwards by thermal radiation.
  • the whole efficiency of heat dissipation for the ceramic radiation heat dissipation structure of this embodiment is further improved by appropriately increasing the number of the heat dissipation column 52 , which provides added thermal radiation.
  • heat dissipation column 52 shown in FIG. 2 is a round column as an illustrative example, and apparently not intended to limit the scope of the present invention. That is, the heat dissipation column 52 can be implemented by other shapes, like triangular, rectangular or polygonal column.
  • the heat source 10 shown in FIGS. 1 and 2 is mounted onto the ceramic substrate 20 by a heat dissipation paste (not shown), which can further enhance thermal conduction.
  • the present invention may further include a fan (not visible) to enhance thermal convection by air convention or turbulence.
  • the fan is disposed on an outer side of the multicolumn heat dissipation plate 50 , or preferably above the multicolumn heat dissipation plate 50 .
  • Another aspect of the present invention is that the heat transferred to the ceramic substrate is propagated through the first radiation heat dissipation film to the multicolumn heat dissipation plate by thermal radiation, and then the second radiation heat dissipation film on the porous heat dissipation plate propagates the heat outwards by thermal radiation.

Abstract

A ceramic radiation heat dissipation structure for heat dissipation from a heat source includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate. One surface of the ceramic substrate is attached to the heat source and the other surface of the ceramic substrate is provided with a first radiation heat dissipation film. The porous heat dissipation plate is attached to the first radiation heat dissipation film. The porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the at least one heat dissipation hole is provided with a second radiation heat dissipation film. The heat generated by the heat source is fast propagated outwards because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to a heat dissipation structure, and more specifically to a heat dissipation structure having a ceramic substrate and radiation heat dissipation films.
  • 2. The Prior Arts
  • In general, many machines and electric equipments generate plenty amount of heat during normal operation, such as an electric motor, engine, combustion chamber, central processing unit (CPU), graphic processing unit, power supply, transformer or power management integrated circuit (IC), or exothermic chemical reaction tank, like fermentation container for fermentation reaction or centralization container for acid-base centralization reaction. Additionally, huge outdoor storage tanks for oil, gas and chemicals need to carefully keep at an appropriate temperature by cooling down in order to maintain the normal operation or avoid any strong reaction, explosion or combustion due to overheat.
  • The solution to heat dissipation in the prior arts is utilizing heat dissipation plates with considerably large surface area, such as a fin shape of the aluminum heat sink, in order to increase heat dissipation by enhancing heat convention with surrounding air. However, the heat generated by the heat source is thermally conducted to the heat sink and it is not easy to effectively improve the efficiency of heat dissipation due to limited cross sectional area for thermal conduction. Furthermore, the traditional aluminum heat sink is usually large in size and not convenient to use in actual applications as well as the cost is increased. Therefore, it is desired to provide a new ceramic radiation heat dissipation structure to overcome the above problems in the prior arts.
    • SUMMARY OF THE INVENTION
  • Therefore, the present invention has been made in view of the above problems, and it is an objective of the present invention to provide a ceramic radiation heat dissipation structure for heat dissipation from a heat source. The ceramic radiation heat dissipation structure includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate. One surface of the ceramic substrate is attached to the heat source such that the heat generated by the heat source is thermally conducted to the ceramic substrate. The other surface of the ceramic substrate is provided with a first radiation heat dissipation film, and the porous heat dissipation plate is attached to the first radiation heat dissipation film. The porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the heat dissipation hole is provided with a second radiation heat dissipation film. Because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films, the heat is fastly propagated outwards.
  • Another objective of the present invention is to provide a ceramic radiation heat dissipation structure for heat dissipation from a heat source, includes a ceramic substrate, a first radiation heat dissipation film and a multicolumn heat dissipation plate. The ceramic substrate is attached to the heat source and a first radiation heat dissipation film is provided on the ceramic substrate. The multicolumn heat dissipation plate is attached to the first radiation heat dissipation film. The multicolumn heat dissipation plate has at least one heat dissipation column, and an outer surface of the heat dissipation column is provided with a third radiation heat dissipation film, which propagates the heat by thermal radiation.
  • Therefore, the ceramic radiation heat dissipation structure of the present invention can fastly propagate the heat generated by the heat source outwards, and particular, the second radiation heat dissipation film on the heat dissipation hole or the third radiation heat dissipation film on the heat dissipation column provide further thermal radiation so as to enhance the efficiency of whole heat dissipation.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention can be understood in more detail by reading the subsequent detailed description in conjunction with the examples and references made to the accompanying drawings, wherein:
  • FIG. 1 is a schematic view showing one embodiment of a ceramic radiation heat dissipation structure according to the present invention; and
  • FIG. 2 is a schematic view showing another embodiment of the ceramic radiation heat dissipation structure according to the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention may be embodied in various forms and the details of the preferred embodiments of the present invention will be described in the subsequent content with reference to the accompanying drawings. The drawings (not to scale) show and depict only the preferred embodiments of the invention and shall not be considered as limitations to the scope of the present invention. Modifications of the shape of the present invention shall too be considered to be within the spirit of the present invention.
  • FIG. 1 is a schematic view showing one embodiment of a ceramic radiation heat dissipation structure according to the present invention. As shown in FIG. 1, the ceramic radiation heat dissipation structure of the present invention is used for heat dissipation from a heat source 10, including a CPU (central processing unit), graphic processing unit, power supply, transformer or power management IC (integrated circuit).
  • Specifically, the ceramic radiation heat dissipation structure of the present invention generally includes a ceramic substrate 20, a first radiation heat dissipation film 30 and a porous heat dissipation plate 40. The ceramic substrate 20 has a first surface (as a lower surface shown in FIG. 1) and a second surface (as an upper surface shown in FIG. 1). The first surface is attached to the heat source 10 such that the heat generated by the heat source 10 is propagated to the ceramic substrate 20 by thermal conduction and the second surface is provided with the first radiation heat dissipation film 30. Besides, the porous heat dissipation plate 40 is attached to the first radiation heat dissipation film 30. That is, the ceramic substrate 20 and the porous heat dissipation plate 40 are on the two opposite surfaces of the first radiation heat dissipation film 30, respectively.
  • The first radiation heat dissipation film 30 has a specific function of propagating the heat primarily by thermal radiation to conduct heat dissipation. The first radiation heat dissipation film 30 is made from a mixture of metal and nonmetal compounds. The mixture of metal and nonmetal compounds generally consists of a metal compound and a nonmetal compound. More specifically, the metal compound consists of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony. The nonmetal compound includes at least one of oxide or nitride or inorganic acid consisting of at least one of boron and carbon.
  • The porous heat dissipation plate 40 has at least one heat dissipation hole 42. A second radiation heat dissipation film (not visible) is provided on the upper surface of the porous heat dissipation plate 40 and the inner sidewall of the heat dissipation hole 42. The second radiation heat dissipation film is made from the same material as that of the first radiation heat dissipation film 30 and also has the function of enhancing heat dissipation by thermal radiation. Preferably, the whole efficiency of heat dissipation for the ceramic radiation heat dissipation structure of the present invention is further improved by appropriately increasing the number of the heat dissipation hole 42, which provides added thermal radiation.
  • It should be noted that the heat dissipation hole 42 shown in FIG. 1 is a round through hole as an illustrative example, and apparently not intended to limit the scope of the present invention. That is, the heat dissipation hole 42 can be implemented by other shapes, like triangular, rectangular or polygonal through hole or recess.
  • Additionally, the present invention may further include a fan (not visible) to enhance thermal convection for heat dissipation by air convention or turbulence. The fan is disposed on an outer side of the porous heat dissipation plate 40, or preferably above the porous heat dissipation plate 40.
  • One aspect of the present invention is that the heat transferred to the ceramic substrate is propagated through the first radiation heat dissipation film to the porous heat dissipation plate by thermal radiation, and then the second radiation heat dissipation film on the porous heat dissipation plate propagates the heat outwards by thermal radiation.
  • FIG. 2 is a schematic view showing another embodiment of the ceramic radiation heat dissipation structure according to the present invention. As shown in FIG. 2, the ceramic radiation heat dissipation structure of this embodiment includes a ceramic substrate 20, a first radiation heat dissipation film 30 and a multicolumn heat dissipation plate 50. Generally, the ceramic radiation heat dissipation structure in FIG. 2 is similar to the ceramic radiation heat dissipation structure in FIG. 1. The primary difference is that the multicolumn heat dissipation plate 50 is used to replace the porous heat dissipation plate 40. Thus, the detailed description for other elements is omitted hereinafter.
  • The multicolumn heat dissipation plate 50 has at least one heat dissipation column 52, and the outer surface of each heat dissipation column 52 and the upper surface of the multicolumn heat dissipation plate 50 are provided with a third radiation heat dissipation film (not visible), which is made from the same material as that of the first radiation heat dissipation film 30 and also has the function of enhancing heat dissipation by thermal radiation. Thus, the third radiation heat dissipation film can propagate the heat outwards by thermal radiation. Preferably, the whole efficiency of heat dissipation for the ceramic radiation heat dissipation structure of this embodiment is further improved by appropriately increasing the number of the heat dissipation column 52, which provides added thermal radiation.
  • It should be noted that the heat dissipation column 52 shown in FIG. 2 is a round column as an illustrative example, and apparently not intended to limit the scope of the present invention. That is, the heat dissipation column 52 can be implemented by other shapes, like triangular, rectangular or polygonal column.
  • Moreover, the heat source 10 shown in FIGS. 1 and 2 is mounted onto the ceramic substrate 20 by a heat dissipation paste (not shown), which can further enhance thermal conduction.
  • Also, the present invention may further include a fan (not visible) to enhance thermal convection by air convention or turbulence. The fan is disposed on an outer side of the multicolumn heat dissipation plate 50, or preferably above the multicolumn heat dissipation plate 50.
  • Another aspect of the present invention is that the heat transferred to the ceramic substrate is propagated through the first radiation heat dissipation film to the multicolumn heat dissipation plate by thermal radiation, and then the second radiation heat dissipation film on the porous heat dissipation plate propagates the heat outwards by thermal radiation.
  • Although the present invention has been described with reference to the preferred embodiments, it will be understood that the invention is not limited to the details described thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims (8)

What is claimed is:
1. A ceramic radiation heat dissipation structure for heat dissipation from a heat source, comprising:
a ceramic substrate having a first surface and a second surface, wherein the first surface of the ceramic substrate is attached to the heat source;
a first radiation heat dissipation film provided on the second surface of the ceramic substrate; and
a porous heat dissipation plate attached to the first radiation heat dissipation film and having at least one heat dissipation hole, wherein a second radiation heat dissipation film is provided on an upper surface of the porous heat dissipation plate and an inner sidewall of the heat dissipation hole;
wherein, the first and second radiation heat dissipation films are made from a mixture of metal and nonmetal compound, wherein the first and second radiation heat dissipation films dissipate heat generated from the heat source outwards by thermal radiation.
2. The ceramic radiation heat dissipation structure as claimed in claim 1, further comprising a fan disposed on an outer side of the porous heat dissipation plate.
3. The ceramic radiation heat dissipation structure as claimed in claim 1, wherein the mixture of metal and nonmetal compound consist of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony, and one oxide or nitride or inorganic acid consisting at least one of boron and carbon.
4. The ceramic radiation heat dissipation structure as claimed in claim 1, further comprising a heat dissipation paste for mounting the heat source onto the ceramic substrate.
5. A ceramic radiation heat dissipation structure for heat dissipation from a heat source, comprising:
a ceramic substrate having a first surface and a second surface, wherein the first surface of the ceramic substrate is attached to the heat source;
a first radiation heat dissipation film provided on the second surface of the ceramic substrate; and
a multicolumn heat dissipation plate attached to the first radiation heat dissipation film and having at least one heat dissipation column, wherein a third radiation heat dissipation film is provided on an upper surface of the multicolumn heat dissipation plate or on an outer surface of the heat dissipation column,
wherein, the first and third radiation heat dissipation films are made from a mixture of metal and nonmetal compound, and wherein the first and third radiation heat dissipation films dissipate heat generated from the heat source outwards by thermal radiation.
6. The ceramic radiation heat dissipation structure as claimed in claim 5, further comprising a fan disposed on an outer side of the porous heat dissipation plate.
7. The ceramic radiation heat dissipation structure as claimed in claim 5, wherein the mixture of metal and nonmetal compound consist of at least one of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one alloy of silver, copper, tin, aluminum, titanium, iron and antimony, or at least one oxide or halide of silver, copper, tin, aluminum, titanium, iron and antimony, and one oxide or nitride or inorganic acid consisting at least one of boron and carbon.
8. The ceramic radiation heat dissipation structure as claimed in claim 5, further comprising a heat dissipation paste for mounting the heat source onto the ceramic substrate.
US13/806,724 2010-06-24 2011-05-21 Ceramic radiation heat dissipation structure Abandoned US20130092358A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201020235811.7U CN201854534U (en) 2010-06-24 2010-06-24 Ceramic radiation heat dissipating structure
CN201020235811.7 2010-06-24
PCT/CN2011/074478 WO2011160520A1 (en) 2010-06-24 2011-05-21 Ceramic radiation heat dissipation structure

Publications (1)

Publication Number Publication Date
US20130092358A1 true US20130092358A1 (en) 2013-04-18

Family

ID=44096910

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/806,724 Abandoned US20130092358A1 (en) 2010-06-24 2011-05-21 Ceramic radiation heat dissipation structure

Country Status (4)

Country Link
US (1) US20130092358A1 (en)
EP (1) EP2587535A1 (en)
CN (1) CN201854534U (en)
WO (1) WO2011160520A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104007797A (en) * 2014-06-04 2014-08-27 吉首大学 Computer cooling device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102564199A (en) * 2010-12-28 2012-07-11 常州碳元科技发展有限公司 Wing-shaped high-cooling-efficiency structure and manufacturing method thereof
CN107170723B (en) * 2016-03-07 2020-04-07 中芯国际集成电路制造(上海)有限公司 Semiconductor device, preparation method thereof and electronic device
TWI671002B (en) * 2017-05-04 2019-09-01 志寶富生物科技有限公司 heat sink

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4682269A (en) * 1984-10-11 1987-07-21 Teradyne, Inc. Heat dissipation for electronic components on a ceramic substrate
US5012387A (en) * 1988-04-21 1991-04-30 Bodenseewerk Geratetechnik Gmbh Printed circuit board with heat dissipating device
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US6958912B2 (en) * 2003-11-18 2005-10-25 Intel Corporation Enhanced heat exchanger
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement
US20060096750A1 (en) * 2002-05-29 2006-05-11 Andries Meuzelaar Heat exchanger
US7059130B2 (en) * 2002-02-13 2006-06-13 Ship & Ocean Foundation Heat exchanger applicable to fuel-reforming system and turbo-generator system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0927570A (en) * 1995-07-11 1997-01-28 Nec Eng Ltd Hybrid semiconductor integrated circuit device
US20070179232A1 (en) * 2006-01-30 2007-08-02 National Starch And Chemical Investment Holding Corporation Thermal Interface Material
CN1944698A (en) * 2006-10-24 2007-04-11 北京科技大学 Super high heat conduction, low heat expansion coefficient composite material and its preparing method
EP2109138B1 (en) * 2006-12-26 2015-12-23 Kyocera Corporation Heat dissipating substrate and electronic device using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
US4682269A (en) * 1984-10-11 1987-07-21 Teradyne, Inc. Heat dissipation for electronic components on a ceramic substrate
US5012387A (en) * 1988-04-21 1991-04-30 Bodenseewerk Geratetechnik Gmbh Printed circuit board with heat dissipating device
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US7059130B2 (en) * 2002-02-13 2006-06-13 Ship & Ocean Foundation Heat exchanger applicable to fuel-reforming system and turbo-generator system
US20060096750A1 (en) * 2002-05-29 2006-05-11 Andries Meuzelaar Heat exchanger
US6958912B2 (en) * 2003-11-18 2005-10-25 Intel Corporation Enhanced heat exchanger
US20060011336A1 (en) * 2004-04-07 2006-01-19 Viktor Frul Thermal management system and computer arrangement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104007797A (en) * 2014-06-04 2014-08-27 吉首大学 Computer cooling device

Also Published As

Publication number Publication date
WO2011160520A1 (en) 2011-12-29
CN201854534U (en) 2011-06-01
EP2587535A1 (en) 2013-05-01

Similar Documents

Publication Publication Date Title
US8671570B2 (en) Vapor chamber and method for manufacturing the same
US9924588B2 (en) Thermal energy storage with a phase-change material in a non-metal container
US8120917B2 (en) Heat dissipation device
CN202443965U (en) Metal-graphite composite heat-sink device
JP5472955B2 (en) Heat dissipation module
JP2003188321A (en) Heat sink
US20130092358A1 (en) Ceramic radiation heat dissipation structure
US10424709B2 (en) Apparatus for thermoelectric recovery of electronic waste heat
JP2009169752A (en) Electronic equipment
US20120073794A1 (en) Heat dissipation device with multiple heat conducting pipes
JP6557112B2 (en) Heat dissipation device for portable information equipment
JP4438526B2 (en) Power component cooling system
JP2012044049A (en) Heat sink
CN110536586A (en) A kind of immersion cooling device
TW201306726A (en) Heat sink assembly
CN105228416A (en) A kind of electronic devices and components radiator structure
JP2006013217A (en) Heatsink using carbon graphite
CN208141275U (en) Sealed computer cabinet
JP7328213B2 (en) heat sink
CN102480899A (en) Cooling device
KR20160023517A (en) Heat sink having thermoconductive core and light source apparatus comprising the same
TWI828976B (en) Heat dissipation element for semiconductor power devices and circuit board having the same
JP2012172866A (en) Ebullient cooling apparatus
WO2015198770A1 (en) Electronic device
TWI413889B (en) Heat dissipation device

Legal Events

Date Code Title Description
AS Assignment

Owner name: JINGDEZHEN FARED TECHNOLOGY CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, JEONG-SHIUN;REEL/FRAME:029716/0180

Effective date: 20121207

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION