US20130048255A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20130048255A1 US20130048255A1 US13/220,722 US201113220722A US2013048255A1 US 20130048255 A1 US20130048255 A1 US 20130048255A1 US 201113220722 A US201113220722 A US 201113220722A US 2013048255 A1 US2013048255 A1 US 2013048255A1
- Authority
- US
- United States
- Prior art keywords
- section
- fin
- heat dissipation
- dissipation device
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device having a fan.
- a typical heat dissipation deice includes a plurality of fins connected to each other.
- a fan is generally mounted aside the fins. The fan forces airflow to flow through air passages between the fins to accelerate heat exchange between the fins and the surrounding air.
- FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure.
- FIG. 2 is an enlarged view of a fin assembly of the heat dissipation device of FIG. 1 .
- FIG. 3 is an exploded view of the fin assembly of FIG. 2 , wherein a first fin and a second fin are separated from the fin assembly.
- FIG. 4 is an enlarged view of the first fin of FIG. 3
- FIG. 5 is an enlarged view of the second fin of FIG. 3 .
- the heat dissipation device 10 includes a housing 50 , a fan 40 mounted within the housing 50 , a fin assembly 20 fixed to the housing 50 and a plurality of heat pipes 30 attached to the fin assembly 20 .
- the housing 50 is integrally made of a single piece of metal such as aluminum or copper.
- the housing 50 includes a panel 501 and a sidewall 502 extending upwardly and perpendicularly from a periphery of the panel 501 .
- the sidewall 502 partially surrounds the panel 501 .
- the sidewall 502 has a curved section and two ends extending from the curved section towards a rear side of the panel 501 .
- the fan 40 is fixed on the panel 501 and surrounded by the curved section of the sidewall 502 .
- the two ends of the sidewall 502 are spaced from each other to receive the fin assembly 20 .
- the sidewall 502 can guide an airflow generated by the fan 40 towards the rear side of the panel 501 .
- a plurality of posts 51 , tabs 52 , and brackets 53 , 54 are formed on an outer circumferential face of the sidewall 502 for connection with the other structures such as a printed circuit board, a clip or a fastener
- the fin assembly 20 is fixed on the rear side of the panel 501 and sandwiched between the two ends of the sidewall 502 .
- the fin assembly 20 includes a plurality of first fins 21 and a plurality of second fins 22 alternately connected to each other.
- Each first fin 21 includes a plate 210 , an upper flange 212 extending from a top side of the plate 210 and a lower flange 211 extending from a bottom side of the plate 210 .
- the plate 210 is arranged perpendicularly to the panel 501 of the housing 50 .
- the plate 210 has a vertical front side and an inclined rear side opposite to the front side.
- the top side of the plate 210 has a portion depressed downwardly towards the bottom side of the plate 210 .
- the upper flange 212 includes a first section 2121 located adjacent to the rear side of the plate 210 , a third section 2123 located adjacent to the front side of the plate 210 , i.e., adjacent to the fan 40 , and a second section 2122 located between the first section 2121 and the third section 2123 .
- the first section 2121 is parallel to the lower flange 211 and spaced from the second section 2122 via a gap.
- the second section 2122 is located on the depressed portion of the top side of the plate 210 .
- the second section 2122 is mainly parallel to the lower flange 211 with an end thereof bended upwardly towards the first section 2121 .
- the third section 2123 is extended from another end of the second section 2122 firstly horizontally and then inclinedly.
- the third section 2123 joints the another end of the second section 2122 .
- the first section 2121 and the second section 2122 have the same width which is smaller than that of the third section 2123 .
- the width of the first section 2121 and the second section 2122 is a half of that of the third section 2123 .
- each second fin 22 has a lower flange 221 and an upper flange 222 extending from a plate 220 .
- the lower flange 221 and the second flange 222 with a first section 2221 and a second section 2222 have the same configuration as that of the lower flange 211 and the upper flange 212 of the first fin 21 .
- the plate 220 has the same configuration as that of the plate 210 of the first fin 21 except a slot 2200 defined in the plate 220 .
- the slot 2200 includes a first part 2201 adjacent to the fan 40 , a third part 2203 remote from the fan 40 and a second part 2202 communicating the first part 2201 with the third part 2203 .
- the first part 2201 is gradually expanded from the second part 2202 towards the fan 40 such that the upper flange 222 does not have a third section.
- An upper edge of the first part 2201 is terminated at the second section 2222 of the upper flange 222 , and a lower edge of the first part 2201 is terminated at the lower flange 221 .
- the second part 2202 is straight and parallel to the lower flange 221 .
- the third part 2203 is extended downwardly from the second part 2202 towards the lower flange 221 .
- the lower flange 221 of the second fin 22 has the same length as that of the first fin 21 , and the first section 2221 and the second section 2222 of the upper flange 222 of the second fin 22 have the lengths same as that of the first fin 21 .
- the second fins 22 are assembled to the first fins 21 in a manner that the first section 2121 and the second section 2122 of the upper flange 212 and the lower flange 211 of each first fin 21 abut against that of an adjacent second fin 22 , and the third section 2123 of the upper flange 212 of each first fin 21 abuts against the second section 2222 of the upper flange 222 of the adjacent second fin 22 and the third section 2123 of the upper flange 212 of a next first fin 21 .
- the second sections 2122 , 2222 of the upper flanges 212 , 222 of the first fins 21 and the second fins 22 cooperatively form a groove 202 in a top of the fin assembly 20 to receive the heat pipes 30 (shown in FIG. 2 ).
- a plurality of air channels 201 are defined between neighboring first and second fins 21 , 22 .
- Each channel 201 has an air inlet 2011 adjacent to the fan 40 and an air outlet 2012 away from the fan 40 .
- Two adjacent channels 201 between two adjacent first fins 21 and a second fin 22 sandwiched between the two adjacent first fins 21 communicates with each other at the inlets 2011 thereof via the slot 2200 exposed to the fan 40 , and spaced from each other at the outlets 2012 thereof via the second fin 22 . Therefore, the dusts brought by the airflow would not be blocked at the inlets 2011 of the channels 201 and can easily enter the channels 201 .
- the dusts Once the dusts enter the channels 201 , they would be readily blown by the airflow rapidly flowing through the channels 201 to an outside environment via the outlets 2012 . Thus, the dusts are not accumulated at the inlets 2011 of the channels 201 . Furthermore, the gradually expanded first part 2201 of the slot 2200 can facilitate entrance of the dusts into the channels 201 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipation device includes a housing, a fan mounted within the housing, a fin assembly fixed to the housing and heat pipes attached on the fin assembly. The housing includes a panel and a sidewall extending upwardly from a periphery of the panel. The fin assembly includes first fins and second fins alternately arranged on the panel. The first fins and the second fins each include a plate, an upper flange and a lower flange extending from a top side and a bottom side of the plate, respectively. Each second fin defines a slot in a lateral side of the plate thereof adjacent to the fan. Every two adjacent first fin and second fin define a channel therebetween. Two adjacent channels communicate with each other at inlets thereof via the slot, and separated from each other at outlets thereof via a second fin.
Description
- 1. Technical Field
- The present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device having a fan.
- 2. Description of Related Art
- Electronic components generate a large amount of heat in operation thereof. Therefore, heat dissipation, often in the form of device, is required for the electronic components. A typical heat dissipation deice includes a plurality of fins connected to each other. In order to facilitate heat dissipation of the fins, a fan is generally mounted aside the fins. The fan forces airflow to flow through air passages between the fins to accelerate heat exchange between the fins and the surrounding air.
- However, since the air passages between the fins are narrow, a large amount of dusts may be accumulated on the inlets of the air passages after the fan works for a long period. Such accumulated dusts would block the airflow to flow into the air passages, thereby affecting the heat dissipation of the fins.
- What is needed, therefore, is a heat dissipation device which can overcome the limitations described above.
- Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
-
FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure. -
FIG. 2 is an enlarged view of a fin assembly of the heat dissipation device ofFIG. 1 . -
FIG. 3 is an exploded view of the fin assembly ofFIG. 2 , wherein a first fin and a second fin are separated from the fin assembly. -
FIG. 4 is an enlarged view of the first fin ofFIG. 3 -
FIG. 5 is an enlarged view of the second fin ofFIG. 3 . - Referring to
FIG. 1 , aheat dissipation device 10 in accordance with an embodiment of the present disclosure is shown. Theheat dissipation device 10 includes ahousing 50, afan 40 mounted within thehousing 50, afin assembly 20 fixed to thehousing 50 and a plurality ofheat pipes 30 attached to thefin assembly 20. - The
housing 50 is integrally made of a single piece of metal such as aluminum or copper. Thehousing 50 includes apanel 501 and asidewall 502 extending upwardly and perpendicularly from a periphery of thepanel 501. Thesidewall 502 partially surrounds thepanel 501. Thesidewall 502 has a curved section and two ends extending from the curved section towards a rear side of thepanel 501. Thefan 40 is fixed on thepanel 501 and surrounded by the curved section of thesidewall 502. The two ends of thesidewall 502 are spaced from each other to receive thefin assembly 20. Thesidewall 502 can guide an airflow generated by thefan 40 towards the rear side of thepanel 501. A plurality ofposts 51,tabs 52, andbrackets sidewall 502 for connection with the other structures such as a printed circuit board, a clip or a fastener. - Also referring to
FIGS. 2-4 , thefin assembly 20 is fixed on the rear side of thepanel 501 and sandwiched between the two ends of thesidewall 502. Thefin assembly 20 includes a plurality offirst fins 21 and a plurality ofsecond fins 22 alternately connected to each other. Eachfirst fin 21 includes aplate 210, anupper flange 212 extending from a top side of theplate 210 and alower flange 211 extending from a bottom side of theplate 210. Theplate 210 is arranged perpendicularly to thepanel 501 of thehousing 50. Theplate 210 has a vertical front side and an inclined rear side opposite to the front side. The top side of theplate 210 has a portion depressed downwardly towards the bottom side of theplate 210. Theupper flange 212 includes afirst section 2121 located adjacent to the rear side of theplate 210, athird section 2123 located adjacent to the front side of theplate 210, i.e., adjacent to thefan 40, and asecond section 2122 located between thefirst section 2121 and thethird section 2123. Thefirst section 2121 is parallel to thelower flange 211 and spaced from thesecond section 2122 via a gap. Thesecond section 2122 is located on the depressed portion of the top side of theplate 210. Thesecond section 2122 is mainly parallel to thelower flange 211 with an end thereof bended upwardly towards thefirst section 2121. Thethird section 2123 is extended from another end of thesecond section 2122 firstly horizontally and then inclinedly. Thethird section 2123 joints the another end of thesecond section 2122. Thefirst section 2121 and thesecond section 2122 have the same width which is smaller than that of thethird section 2123. Preferably, the width of thefirst section 2121 and thesecond section 2122 is a half of that of thethird section 2123. - Also referring to
FIG. 5 , eachsecond fin 22 has alower flange 221 and anupper flange 222 extending from aplate 220. Thelower flange 221 and thesecond flange 222 with afirst section 2221 and asecond section 2222 have the same configuration as that of thelower flange 211 and theupper flange 212 of thefirst fin 21. Theplate 220 has the same configuration as that of theplate 210 of thefirst fin 21 except aslot 2200 defined in theplate 220. Theslot 2200 includes afirst part 2201 adjacent to thefan 40, athird part 2203 remote from thefan 40 and asecond part 2202 communicating thefirst part 2201 with thethird part 2203. Thefirst part 2201 is gradually expanded from thesecond part 2202 towards thefan 40 such that theupper flange 222 does not have a third section. An upper edge of thefirst part 2201 is terminated at thesecond section 2222 of theupper flange 222, and a lower edge of thefirst part 2201 is terminated at thelower flange 221. Thesecond part 2202 is straight and parallel to thelower flange 221. Thethird part 2203 is extended downwardly from thesecond part 2202 towards thelower flange 221. Thelower flange 221 of thesecond fin 22 has the same length as that of thefirst fin 21, and thefirst section 2221 and thesecond section 2222 of theupper flange 222 of thesecond fin 22 have the lengths same as that of thefirst fin 21. Thesecond fins 22 are assembled to thefirst fins 21 in a manner that thefirst section 2121 and thesecond section 2122 of theupper flange 212 and thelower flange 211 of eachfirst fin 21 abut against that of an adjacentsecond fin 22, and thethird section 2123 of theupper flange 212 of eachfirst fin 21 abuts against thesecond section 2222 of theupper flange 222 of the adjacentsecond fin 22 and thethird section 2123 of theupper flange 212 of a nextfirst fin 21. Thesecond sections upper flanges first fins 21 and thesecond fins 22 cooperatively form agroove 202 in a top of thefin assembly 20 to receive the heat pipes 30 (shown inFIG. 2 ). - After the
first fins 21 and thesecond fins 22 are alternately assembled between the two ends of thesidewall 502, a plurality ofair channels 201 are defined between neighboring first andsecond fins channel 201 has anair inlet 2011 adjacent to thefan 40 and anair outlet 2012 away from thefan 40. Twoadjacent channels 201 between two adjacentfirst fins 21 and asecond fin 22 sandwiched between the two adjacentfirst fins 21 communicates with each other at theinlets 2011 thereof via theslot 2200 exposed to thefan 40, and spaced from each other at theoutlets 2012 thereof via thesecond fin 22. Therefore, the dusts brought by the airflow would not be blocked at theinlets 2011 of thechannels 201 and can easily enter thechannels 201. Once the dusts enter thechannels 201, they would be readily blown by the airflow rapidly flowing through thechannels 201 to an outside environment via theoutlets 2012. Thus, the dusts are not accumulated at theinlets 2011 of thechannels 201. Furthermore, the gradually expandedfirst part 2201 of theslot 2200 can facilitate entrance of the dusts into thechannels 201. - It is believed that the present embodiments will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the present disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.
Claims (19)
1. A heat dissipation device comprising:
a fan for generating an airflow, the fan defining an air outtake for exhausting the airflow; and
a fin assembly coupled to the air outtake of the fan, the fin assembly comprising a plurality of first fins and second fins each alternating with the first fins, each second fin defining a slot in a lateral side thereof adjacent to the fan;
wherein two adjacent first fin and second fin define an airflow channel therebetween, each channel has an inlet adjacent to the fan and an outlet away from the fan, and two adjacent channels are communicated with each other at the inlets thereof through a corresponding slot.
2. The heat dissipation device of claim 1 , wherein the two adjacent channels are separated at the outlets thereof by the corresponding second fin defining the slot.
3. The heat dissipation device of claim 2 , wherein each of the first fin and the second fin comprises a plate, and the plates of the first fins and the second fins are parallel to each other.
4. The heat dissipation device of claim 3 , wherein the slot is defined in the plate of each second fin.
5. The heat dissipation device of claim 4 , wherein the slot has a first section gradually expanding towards the fan.
6. The heat dissipation device of claim 5 , wherein the slot has a second section extending in a direction away from the first section and a third section extending downwardly towards a bottom side of the plate.
7. The heat dissipation device of claim 6 , wherein the second section communicates the first section with the third section.
8. The heat dissipation device of claim 5 , wherein each of the first fin and the second comprises an upper flange and a lower flange extending from a top side and a bottom side of the plate thereof, respectively.
9. The heat dissipation device of claim 8 , wherein the upper flange of each of the first fin and the second fin comprises a first section and a second section spaced from the first section.
10. The heat dissipation device of claim 9 , wherein the first section of the upper flange is parallel to the lower flange.
11. The heat dissipation device of claim 9 , wherein the second section is located lower than the first section and has an end bended upwardly towards the first section.
12. The heat dissipation device of claim 9 , wherein the slot of each second fin has a top edge terminated at the second section of the upper flange of the second fin, and a bottom edge terminated at the lower flange of the second fin.
13. The heat dissipation device of claim 9 , wherein the upper flange of each first fin further comprises a third section extending inclinedly from the second section thereof.
14. The heat dissipation device of claim 13 , wherein the third section has a width twice than that of the second section and the first section.
15. The heat dissipation device of claim 1 further comprising a housing, wherein the housing comprises a panel supporting the fan and a sidewall extending upwardly from a periphery of the panel.
16. The heat dissipation device of claim 15 , wherein the fan is surrounded by the sidewall.
17. The heat dissipation device of claim 16 , wherein the sidewall has two ends spaced from each other, the fin assembly being sandwiched between the two ends of the sidewall.
18. The heat dissipation device of claim 9 further comprising a heat pipe, wherein the second sections of the upper flanges of the first fins and the second fins cooperatively form a groove to receive the heat pipe.
19. The heat dissipation device of claim 1 , wherein the slot defined in each of the second fins is exposed to the fan.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110241379.1A CN102958320B (en) | 2011-08-22 | 2011-08-22 | Heat abstractor |
CN201110241379.1 | 2011-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130048255A1 true US20130048255A1 (en) | 2013-02-28 |
Family
ID=47741947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/220,722 Abandoned US20130048255A1 (en) | 2011-08-22 | 2011-08-30 | Heat dissipation device |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130048255A1 (en) |
CN (1) | CN102958320B (en) |
TW (1) | TWI508650B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140311725A1 (en) * | 2011-11-02 | 2014-10-23 | National University Of Singapore | Heat sink assembly apparatus |
CN105090102A (en) * | 2014-04-28 | 2015-11-25 | 富瑞精密组件(昆山)有限公司 | Fan |
US20160123637A1 (en) * | 2014-10-29 | 2016-05-05 | Alliance For Sustainable Energy, Llc | Two-phase heat exchanger for cooling electrical components |
US20230235968A1 (en) * | 2022-01-21 | 2023-07-27 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI643547B (en) * | 2017-11-17 | 2018-12-01 | 神基科技股份有限公司 | Heat dissipation device |
CN109874264A (en) * | 2017-12-01 | 2019-06-11 | 神讯电脑(昆山)有限公司 | Radiator |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461956A (en) * | 1967-11-28 | 1969-08-19 | United Aircraft Prod | Heat exchange assembly |
US4756358A (en) * | 1986-09-29 | 1988-07-12 | Ardco, Inc. | Defrost heater support |
US4928756A (en) * | 1988-08-04 | 1990-05-29 | Spectra-Physics | Heat dissipating fin and method for making fin assembly |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6901993B2 (en) * | 2003-03-05 | 2005-06-07 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly having combined fins |
US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
US20060113062A1 (en) * | 2004-12-01 | 2006-06-01 | Johnson Yang | Radiating fin assembly |
US20070246190A1 (en) * | 2006-04-19 | 2007-10-25 | Wen-Chen Wei | Heat dissipating structure having different compactness |
US7385820B1 (en) * | 2006-11-30 | 2008-06-10 | Foxconn Technology Co., Ltd. | Heat dissipation module |
US7461686B2 (en) * | 2006-03-14 | 2008-12-09 | Li Yo Precision Industrial Co., Ltd. | Heat dissipating device |
US20090034196A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
US20090044927A1 (en) * | 2007-08-17 | 2009-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin unit thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100446648C (en) * | 2004-06-15 | 2008-12-24 | 华硕电脑股份有限公司 | Radiator with dust filtering funtion and electronic apparatus |
CN2741097Y (en) * | 2004-09-30 | 2005-11-16 | 仁宝电脑工业股份有限公司 | Radiator with dust-collecting mechanism |
CN1842265B (en) * | 2005-04-03 | 2010-05-12 | 富准精密工业(深圳)有限公司 | Heat pipe radiator |
CN100530616C (en) * | 2005-09-23 | 2009-08-19 | 富准精密工业(深圳)有限公司 | Radiating module |
CN101090620B (en) * | 2006-06-16 | 2010-10-06 | 富准精密工业(深圳)有限公司 | Heat sink module |
TWM308624U (en) * | 2006-10-05 | 2007-03-21 | Molex Taiwan Ltd | Heat dissipation device |
CN101420837A (en) * | 2007-10-24 | 2009-04-29 | 英业达股份有限公司 | Heat radiating module having fin group construction corresponding to heat pipes |
CN102006762B (en) * | 2009-08-31 | 2014-12-24 | 富瑞精密组件(昆山)有限公司 | Heat-radiating device |
CN102045983B (en) * | 2009-10-09 | 2013-07-24 | 马小康 | Radiating module and manufacturing method thereof |
CN102053655A (en) * | 2009-11-03 | 2011-05-11 | 技嘉科技股份有限公司 | Electronic device |
CN201629936U (en) * | 2010-03-02 | 2010-11-10 | 纬创资通股份有限公司 | Radiating device with improved radiating efficiency |
CN201725789U (en) * | 2010-06-01 | 2011-01-26 | 奇鋐科技股份有限公司 | Fin air guide radiating structure and radiating module thereof |
-
2011
- 2011-08-22 CN CN201110241379.1A patent/CN102958320B/en not_active Expired - Fee Related
- 2011-08-25 TW TW100130413A patent/TWI508650B/en not_active IP Right Cessation
- 2011-08-30 US US13/220,722 patent/US20130048255A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3461956A (en) * | 1967-11-28 | 1969-08-19 | United Aircraft Prod | Heat exchange assembly |
US4756358A (en) * | 1986-09-29 | 1988-07-12 | Ardco, Inc. | Defrost heater support |
US4928756A (en) * | 1988-08-04 | 1990-05-29 | Spectra-Physics | Heat dissipating fin and method for making fin assembly |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6901993B2 (en) * | 2003-03-05 | 2005-06-07 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly having combined fins |
US20060039113A1 (en) * | 2004-08-19 | 2006-02-23 | Compal Electronics, Inc. | Heat dissipating device with dust-collecting mechanism |
US20060113062A1 (en) * | 2004-12-01 | 2006-06-01 | Johnson Yang | Radiating fin assembly |
US7461686B2 (en) * | 2006-03-14 | 2008-12-09 | Li Yo Precision Industrial Co., Ltd. | Heat dissipating device |
US20070246190A1 (en) * | 2006-04-19 | 2007-10-25 | Wen-Chen Wei | Heat dissipating structure having different compactness |
US7385820B1 (en) * | 2006-11-30 | 2008-06-10 | Foxconn Technology Co., Ltd. | Heat dissipation module |
US20090034196A1 (en) * | 2007-07-30 | 2009-02-05 | Inventec Corporation | Heat-dissipating module |
US20090044927A1 (en) * | 2007-08-17 | 2009-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin unit thereof |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140311725A1 (en) * | 2011-11-02 | 2014-10-23 | National University Of Singapore | Heat sink assembly apparatus |
US10420254B2 (en) * | 2011-11-02 | 2019-09-17 | National University Of Singapore | Heat sink assembly apparatus |
CN105090102A (en) * | 2014-04-28 | 2015-11-25 | 富瑞精密组件(昆山)有限公司 | Fan |
US20160123637A1 (en) * | 2014-10-29 | 2016-05-05 | Alliance For Sustainable Energy, Llc | Two-phase heat exchanger for cooling electrical components |
US20230235968A1 (en) * | 2022-01-21 | 2023-07-27 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method |
US11953268B2 (en) * | 2022-01-21 | 2024-04-09 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | Tight-fit riveting structure for clustered radiation fin set and heat pipe and riveting method |
Also Published As
Publication number | Publication date |
---|---|
CN102958320B (en) | 2017-09-08 |
CN102958320A (en) | 2013-03-06 |
TW201311125A (en) | 2013-03-01 |
TWI508650B (en) | 2015-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20130048255A1 (en) | Heat dissipation device | |
US5947192A (en) | Stack-fin radiator | |
US20120145363A1 (en) | Fan duct and heat dissipation device using the same | |
US7403389B2 (en) | Heat dissipation device | |
US7140423B2 (en) | Finned heat dissipation module having flow guide | |
US7986521B2 (en) | Heat dissipation device and computer using same | |
US7637311B2 (en) | Heat dissipation device | |
US7891411B2 (en) | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components | |
US7273092B2 (en) | Modularized cooler | |
US7409983B2 (en) | Heat dissipating apparatus | |
US8517674B2 (en) | Fan and fan assembly | |
US20090268463A1 (en) | Led lamp with heat sink | |
US7729123B2 (en) | Heat dissipating assembly and electronic device having same | |
US7663882B2 (en) | Heat dissipating assembly having a fan duct | |
US20060181851A1 (en) | Heatsink structure with an air duct | |
US20130083483A1 (en) | Heat dissipation device and electronic device using same | |
TW201311129A (en) | Electronic device | |
US20110127012A1 (en) | Heat dissipation device | |
TW201311128A (en) | Heat dissipation device | |
CN102045987A (en) | Wind scooper | |
JP2009099740A (en) | Cooling device for housing | |
US20090277615A1 (en) | Heat dissipation device | |
TW201350683A (en) | Heat dissipation structure with double wind directions | |
US8142149B2 (en) | Fan device and fan device assembly | |
US6614657B2 (en) | Heat sink for cooling an electronic component of a computer |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XIA, BEN-FAN;WANG, ZHEN-YU;REEL/FRAME:026825/0035 Effective date: 20110829 Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XIA, BEN-FAN;WANG, ZHEN-YU;REEL/FRAME:026825/0035 Effective date: 20110829 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |