US20130043012A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20130043012A1
US20130043012A1 US13/572,758 US201213572758A US2013043012A1 US 20130043012 A1 US20130043012 A1 US 20130043012A1 US 201213572758 A US201213572758 A US 201213572758A US 2013043012 A1 US2013043012 A1 US 2013043012A1
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United States
Prior art keywords
heat sink
walls
bridge
grooves
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/572,758
Inventor
Shyh-Ming Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20130043012A1 publication Critical patent/US20130043012A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/002—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for interchangeability, i.e. component parts being especially adapted to be replaced by another part with the same or a different function
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to heat sinks, particularly to radial heat sinks.
  • Heat sinks are an essential element for many kinds of electric devices, particularly for LED lamps which are progressively popular around the world. High temperature of heat sinks easily cause scalds to users, especially to children.
  • Korean patent No. 10-0994603 discloses a radial heat sink. As shown in FIG. 7 of KR '603, all fins are formed by folding a single sheet of metal. In other words, all fins are continuous. Such a structure requires a forming process and a folding process with very high accuracy. An allowable error is very narrow. This will increase manufacturing costs.
  • An object of the invention is to provide a heat sink which uses separate fins and a tube to combine together so as to reduce manufacturing accuracy and costs.
  • the heat sink of the invention includes a tube and a plurality of fins.
  • the tube has slots and grooves. Each the groove is located between two adjacent ones of the grooves.
  • the fins are separately fastened to the slots.
  • Each the fin has two walls separately fastened to two of the grooves and a bridge connected between the two walls. An airflow passage is formed among the bridge and the walls.
  • FIG. 1 is a perspective view of the fin of the invention
  • FIG. 2 is an exploded view of the invention
  • FIG. 3 is a top plan view of the invention
  • FIG. 4 shows the invention is combined with a heat source
  • FIG. 5 is a cross-sectional view of FIG. 4 ;
  • FIG. 6 is a perspective view of the fin of another embodiment
  • FIG. 7 is a perspective view of the fin of still another embodiment.
  • FIG. 8 is a perspective view of the fin of yet another embodiment.
  • the heat sink of the invention includes a tube 11 and a plurality of fins 20 .
  • the outside of the tube 11 is formed with slots 12 for being fastened by the fins 20 and grooves 13 .
  • Each of the grooves 13 is located between two adjacent ones of the slots 12 for being inserted by a mold (not shown).
  • a hollow 14 of the tube 11 is used for receiving a heat source.
  • Each of the fins 20 has two walls 21 , 22 and a bridge 23 therebetween.
  • the bridge can be planar or non-planar such as an arcked surface or a bent surface. Internal sides of the walls 21 , 22 are separately inserted into the slots 12 so that the fins 20 are radially arranged around the tube 11 .
  • Each of the walls 21 , 22 of the fins 20 is disposed with three through holes 24 and the bridge 23 is disposed with five through holes 25 .
  • An airflow passage 26 is formed by the walls 21 , 22 and the bridge 23 . This can improve efficiency of convection.
  • the tops of the walls 21 , 22 are separately formed with two engagement portions 211 , 221 for connecting a base 30 and the bottoms of the walls 21 , 22 are separately formed with two recesses 212 , 222 for connecting a frame 40 to form an LED lamp 1 .
  • the heat source 15 may be cloaked by a cover 50 .
  • the cover 50 is made of metal or plastic and fastened in the frame 40 .
  • FIGS. 6 and 7 show another embodiment of the invention.
  • the bridge 23 a is provided with an open area 23 b to improve effect of convection.
  • FIG. 8 shows still another embodiment of the invention.
  • the fins 20 are four in number.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The heat sink includes a tube and a plurality of fins. The tube has slots and grooves. Each the groove is located between two adjacent ones of the grooves. The fins are separately fastened to the slots. Each the fin has two walls separately fastened to two of the grooves and a bridge connected between the two walls. An airflow passage is formed among the bridge and the walls.

Description

    BACKGROUND OF THE INVENTION
  • 1. Technical Field
  • The invention relates to heat sinks, particularly to radial heat sinks.
  • 2. Related Art
  • Heat sinks are an essential element for many kinds of electric devices, particularly for LED lamps which are progressively popular around the world. High temperature of heat sinks easily cause scalds to users, especially to children.
  • Korean patent No. 10-0994603 (hereinafter “KR '603”) discloses a radial heat sink. As shown in FIG. 7 of KR '603, all fins are formed by folding a single sheet of metal. In other words, all fins are continuous. Such a structure requires a forming process and a folding process with very high accuracy. An allowable error is very narrow. This will increase manufacturing costs.
    • SUMMARY OF THE INVENTION
  • An object of the invention is to provide a heat sink which uses separate fins and a tube to combine together so as to reduce manufacturing accuracy and costs.
  • To achieve the above object, the heat sink of the invention includes a tube and a plurality of fins. The tube has slots and grooves. Each the groove is located between two adjacent ones of the grooves. The fins are separately fastened to the slots. Each the fin has two walls separately fastened to two of the grooves and a bridge connected between the two walls. An airflow passage is formed among the bridge and the walls.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of the fin of the invention;
  • FIG. 2 is an exploded view of the invention;
  • FIG. 3 is a top plan view of the invention;
  • FIG. 4 shows the invention is combined with a heat source;
  • FIG. 5 is a cross-sectional view of FIG. 4;
  • FIG. 6 is a perspective view of the fin of another embodiment;
  • FIG. 7 is a perspective view of the fin of still another embodiment; and
  • FIG. 8 is a perspective view of the fin of yet another embodiment.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Please refer to FIGS. 1-3. The heat sink of the invention includes a tube 11 and a plurality of fins 20. The outside of the tube 11 is formed with slots 12 for being fastened by the fins 20 and grooves 13. Each of the grooves 13 is located between two adjacent ones of the slots 12 for being inserted by a mold (not shown). A hollow 14 of the tube 11 is used for receiving a heat source. Each of the fins 20 has two walls 21, 22 and a bridge 23 therebetween. The bridge can be planar or non-planar such as an arcked surface or a bent surface. Internal sides of the walls 21, 22 are separately inserted into the slots 12 so that the fins 20 are radially arranged around the tube 11. When the grooves 13 are pressed by the mold, the grooves 13 will be deformed to make the slots 12 tightly nip the fins 20.
  • Each of the walls 21, 22 of the fins 20 is disposed with three through holes 24 and the bridge 23 is disposed with five through holes 25. An airflow passage 26 is formed by the walls 21, 22 and the bridge 23. This can improve efficiency of convection.
  • Please refer to FIGS. 1 and 4. The tops of the walls 21, 22 are separately formed with two engagement portions 211, 221 for connecting a base 30 and the bottoms of the walls 21, 22 are separately formed with two recesses 212, 222 for connecting a frame 40 to form an LED lamp 1. Further, the heat source 15 may be cloaked by a cover 50. The cover 50 is made of metal or plastic and fastened in the frame 40.
  • Please refer to FIGS. 6 and 7, which show another embodiment of the invention. In this embodiment, the bridge 23 a is provided with an open area 23 b to improve effect of convection.
  • FIG. 8 shows still another embodiment of the invention. In this embodiment, the fins 20 are four in number.
  • It will be appreciated by persons skilled in the art that the above embodiments have been described by way of example only and not in any limitative sense, and that various alterations and modifications are possible without departure from the scope of the invention as defined by the appended claims.

Claims (8)

1. A heat sink comprising:
a tube, having slots and grooves, wherein each the groove is located between two adjacent ones of the grooves; and
a plurality of fins, separately fastened to the slots, wherein each the fin has two walls separately fastened to two of the grooves and a bridge connected between the two walls, and an airflow passage is formed among the bridge and the walls.
2. The heat sink of claim 1, further comprising a bridge disposed between the two walls.
3. The heat sink of claim 2, wherein the bridge has at least one through hole.
4. The heat sink of claim 1, wherein each of the walls is provided with at least one through hole.
5. The heat sink of claim 1, wherein a top of each the fin has an engagement portion.
6. The heat sink of claim 1, wherein a bottom of each the fin has a recess.
7. The heat sink of claim 1, wherein the bridge has an open area.
8. The heat sink of claim 1, wherein the bridge is planar.
US13/572,758 2011-08-16 2012-08-13 Heat sink Abandoned US20130043012A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100215239U TWM422766U (en) 2011-08-16 2011-08-16 Air heat sink and cooling fin with protection and improved performance
TW100215239 2011-08-16

Publications (1)

Publication Number Publication Date
US20130043012A1 true US20130043012A1 (en) 2013-02-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
US13/572,758 Abandoned US20130043012A1 (en) 2011-08-16 2012-08-13 Heat sink

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US (1) US20130043012A1 (en)
EP (1) EP2559938A3 (en)
JP (1) JP3179389U (en)
TW (1) TWM422766U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150136363A1 (en) * 2013-11-18 2015-05-21 Tsung-Hsien Huang Combination heat sink assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103511873A (en) * 2012-06-29 2014-01-15 陈世明 Light-emitting diode lamp
CN105793647A (en) * 2013-12-11 2016-07-20 Nec照明株式会社 Lighting equipment
CN104565943A (en) * 2015-01-16 2015-04-29 浙江兰普防爆照明有限公司 Large-power LED lamp
KR102128221B1 (en) * 2020-05-15 2020-06-29 주식회사 레젠 Disciform heat sink

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1890625A (en) * 1930-07-07 1932-12-13 Harold N Shaw Radiator
US7284596B2 (en) * 2001-06-05 2007-10-23 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US20100126697A1 (en) * 2008-11-27 2010-05-27 Tsung-Hsien Huang Heat sink module
US20120195043A1 (en) * 2009-10-09 2012-08-02 Hiroyuki Watanabe Lighting device

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Publication number Priority date Publication date Assignee Title
JP3552047B2 (en) * 2000-10-25 2004-08-11 古河電気工業株式会社 Heat sink, manufacturing method thereof, and pressing jig
US20050211416A1 (en) * 2003-10-17 2005-09-29 Kenya Kawabata Heat sink with fins and a method for manufacturing the same
US7806564B2 (en) * 2008-03-12 2010-10-05 Aeon Lighting Technology Inc. Connection device of an LED lamp and cooling fins
CN101652052A (en) * 2008-08-12 2010-02-17 绿明科技股份有限公司 Heat dissipating device
CN101403492B (en) * 2008-11-07 2011-08-17 黄崇贤 Radiating module with fins embedded in ring shape
US20110051430A1 (en) * 2009-08-25 2011-03-03 Shih-Ming Chen Assembly structure for led fixture
KR100994603B1 (en) * 2010-03-16 2010-11-15 윤석주 Radiating member and manufacturing apparatus of the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1890625A (en) * 1930-07-07 1932-12-13 Harold N Shaw Radiator
US7284596B2 (en) * 2001-06-05 2007-10-23 Heat Technology, Inc. Heatsink assembly and method of manufacturing the same
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
US20100126697A1 (en) * 2008-11-27 2010-05-27 Tsung-Hsien Huang Heat sink module
US20120195043A1 (en) * 2009-10-09 2012-08-02 Hiroyuki Watanabe Lighting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150136363A1 (en) * 2013-11-18 2015-05-21 Tsung-Hsien Huang Combination heat sink assembly
US9297597B2 (en) * 2013-11-18 2016-03-29 Tsung-Hsien Huang Combination heat sink assembly

Also Published As

Publication number Publication date
EP2559938A3 (en) 2014-06-11
EP2559938A2 (en) 2013-02-20
TWM422766U (en) 2012-02-11
JP3179389U (en) 2012-11-01

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