US20120081300A1 - Touch panel and repairing method thereof - Google Patents
Touch panel and repairing method thereof Download PDFInfo
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- US20120081300A1 US20120081300A1 US12/970,969 US97096910A US2012081300A1 US 20120081300 A1 US20120081300 A1 US 20120081300A1 US 97096910 A US97096910 A US 97096910A US 2012081300 A1 US2012081300 A1 US 2012081300A1
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- Prior art keywords
- sensing
- sensing pads
- adjacent
- touch panel
- repairing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- the invention relates to a panel and a repairing method thereof, and more particularly to a touch panel and a repairing method thereof.
- touch panels are generally categorized into resistant touch panels, capacitive touch panels, optical touch panels, sonic wave touch panels, and electromagnetic touch panels.
- the capacitive touch panels having advantages of fast response speed, favorable reliability, and durability have been used extensively in electronic devices.
- capacitive touch display panels can be further classified into an additive type and an integrated/in-cell type.
- sensing series are first formed on a substrate, and the substrate having the sensing series thereon is then adhered to an outer surface of a display panel. Consequently, the additive-type touch display panel inevitably has a certain thickness.
- an integrated/in-cell type touch display panel is more conducive to the slimness and lightness of the display.
- the integrated/in-cell type touch display panel and the additive-type touch display panel both encounter the problem of a low yield rate resulting from electrostatic discharge, and the above problem is especially serious in the integrated/in-cell type touch display panel.
- most of the current integrated/in-cell type touch display panels are fabricated by forming a touch-control circuit on one surface of the substrate and then forming a color filter thin film on the other surface of the substrate. While the color filter thin film is formed, the touch-control circuit is often damaged due to electrostatic discharge.
- electrostatic discharge may also occur, resulting in the damage of the touch-control circuit.
- metal bridge lines configured on a crossover region, where an X sensing series intersect a Y sensing series, are used to couple the adjacent sensing pads to each other to avoid the short circuit happening on the X sensing series and the Y sensing series around the crossover region.
- the two adjacent sensing pads of the X sensing series or the Y sensing series are electrically connected through a metal bridge line.
- the metal bridge line in the crossover region of the X sensing series and the Y sensing series could be burned, causing a short defect or an open defect.
- the X sensing series or the Y sensing series will be unable to operate normally. Since electrostatic discharge is inevitable during fabrication and use, how to swiftly repair the sensing series when a short defect or an open defect occurs, is one of the important issues that all designers seek to overcome.
- the invention provides a touch panel having a favorable yield.
- the invention still further provides a repairing method of a touch panel.
- the method repairs the sensing series of the touch panel.
- the invention provides a touch panel, including a substrate, a plurality of first sensing series, a plurality of second sensing series, and a plurality of conductive repairing pattern layers.
- the first sensing series are disposed on the substrate and extended along a first direction.
- Each of the first sensing series includes a plurality of first sensing pads and a plurality of first bridge lines.
- the first bridge lines serially connect two adjacent first sensing pads.
- the second sensing series are disposed on the substrate and extended along a second direction.
- Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines.
- the second bridge lines serially connect two adjacent second sensing pads.
- the first direction is different from the second direction, and the first sensing series and the second sensing series are electrically insulated from each other.
- Each of the conductive repairing pattern layers is overlapped with two adjacent first sensing pads in the same first sensing series, and each conductive repairing pattern layer locates around the crossover region of the first sensing series and the second sensing series.
- the conductive repairing pattern layers are electrically floating, and can connect the two adjacent sensing pads after the repair procedure is finished.
- An embodiment of the invention further comprises a first dielectric layer, disposed on the substrate to cover the conductive repairing pattern layers, wherein the first dielectric layer includes a plurality of contact windows.
- the first sensing pads and the second sensing pads are disposed on the first dielectric layer.
- the first dielectric layer further covers the first bridge lines.
- the first sensing pads connect to the first bridge lines through the contact windows, and the second bridge lines are disposed on the first dielectric layer.
- the first dielectric layer further covers the second bridge lines.
- the second sensing pads connect to the second bridge lines through the contact windows, and the first bridge lines are disposed on the first dielectric layer.
- An embodiment of the invention further comprises a second dielectric layer disposed on the first dielectric layer, so as to cover the first sensing series and the second sensing series.
- An embodiment of the invention further comprises a first dielectric layer, disposed on the substrate to cover the first sensing pads and the second sensing pads, wherein the first dielectric layer includes a plurality of contact windows.
- the conductive repairing pattern layers are disposed on the first dielectric layer.
- the first dielectric layer further covers the first bridge lines.
- the second bridge lines are disposed on the first dielectric layer.
- the second sensing pads connect to the second bridge lines through the contact windows.
- the first dielectric layer further covers the second bridge lines.
- the first bridge lines are disposed on the first dielectric layer.
- the first sensing pads connect to the first bridge lines through the contact windows.
- a material of the conductive repairing pattern layers is a transparent conductive material.
- a material of the conductive repairing pattern layers is a metallic conductive material.
- the first bridge lines and the conductive repairing pattern layers are made up of the same layer.
- the second bridge lines and the conductive repairing pattern layers are made up of the same layer.
- a material of the first sensing pads, a material of the first bridge lines and a material of the second sensing pads are the same.
- the conductive repairing pattern layer comprises a mesh repairing pattern layer.
- the mesh repairing pattern layer is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- the conductive repairing pattern layer comprises a plurality of first repairing lines electrically connected, and each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads.
- the conductive repairing pattern layer is further overlapped with two adjacent second sensing pads in the same second sensing series.
- each of the conductive repairing pattern layers comprises a plurality of first repairing lines electrically connected and a plurality of second repairing lines electrically connected.
- Each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads
- each of the second repairing lines is overlapped with the corresponding two adjacent second sensing pads.
- An embodiment of the invention further comprises a plurality of dummy electrodes, disposed between the first sensing pads and the second sensing pads.
- An embodiment of the invention further comprises a plurality of peripheral connecting lines, electrically connected to each corresponding first sensing series and each corresponding second sensing series respectively.
- the invention further provides a repairing method for repairing a touch panel.
- the repairing method is suitable to repair the previously mentioned touch panel when a short defect or an open defect occurs in a crossover region of a first bridge line and a second bridge line of the touch panel.
- the first bridge line with the defect is cut, therefore two adjacent first sensing pads originally connected through the first bridge line are electrically insulated.
- the two adjacent first sensing pads electrically insulated are then electrically connected through a conductive repairing pattern layer overlapped with the two adjacent first sensing pads.
- a method of cutting the first bridge line with the defect includes a laser cutting process.
- the method of electrically connecting the two adjacent first sensing pads electrically insulated through the conductive repairing pattern layer overlapped with the two adjacent first sensing pads includes welding the conductive repairing pattern layer with the two adjacent first sensing pads.
- the method of welding includes a laser welding process.
- the invention further provides a touch panel, including a substrate, a plurality of first bridge lines, a plurality of conductive repairing pattern layers, a first dielectric layer, a plurality of first sensing pads, and a plurality of second sensing series.
- the first bridge lines are disposed on the substrate, and extended along a first direction.
- the conductive repairing pattern layers are disposed on the substrate, and the conductive repairing pattern layers are electrically floating.
- the first dielectric layer is disposed on the substrate to cover the conductive repairing pattern layers and the first bridge lines.
- the first dielectric layer includes a plurality of contact windows, and each of the first bridge lines corresponds to two or more contact windows.
- the first sensing pads are disposed on the first dielectric layer.
- the first bridge lines serially connect the two adjacent first sensing pads through the contact windows, wherein the first sensing pads and the first bridge lines forms a plurality of first sensing series arranged in parallel.
- the second sensing series are arranged in parallel and disposed on the dielectric layer, extended along a second direction.
- Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines.
- the second bridge lines serially connect two adjacent second sensing pads, and the first direction is different from the second direction, wherein the first sensing series and the second sensing series are electrically insulated from each other.
- Each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- the invention further provides a touch panel, including a substrate, a plurality of first sensing pads, a plurality of second sensing series, a first dielectric layer, a plurality of first bridge lines, and a plurality of conductive repairing pattern layers.
- the first sensing pads are disposed on the substrate and extended along a first direction.
- the second sensing series are arranged in parallel and disposed on the substrate, extended along a second direction.
- Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines.
- the second bridge lines serially connect two adjacent second sensing pads.
- the first direction is different from the second direction, wherein the first sensing pads and the second sensing series are electrically insulated from each other.
- the first dielectric layer is disposed on the substrate to cover the first sensing pads and the second sensing series.
- the first dielectric layer includes a plurality of contact windows, and each of the first sensing pads corresponds to two or more contact windows.
- the first bridge lines are disposed on the first dielectric layer along a first direction. The first bridge lines serially connect the two adjacent first sensing pads through the contact windows, forming a plurality of first sensing series arranged in parallel.
- the conductive repairing patterns are disposed on the first dielectric layer, and the conductive repairing patterns are electrically floating. Each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- each of the conductive repairing pattern layers is overlapped with two adjacent sensing pads in the same sensing series.
- the conductive repairing pattern layers can be used to repair the defects, so the two sensing series can provide a normal sensing operation.
- the touch panel has a favorable yield and simple repair method.
- FIG. 1A is a schematic top view of a touch panel according to a first embodiment of the invention.
- FIG. 1B is a partially enlarged schematic diagram of FIG. 1A .
- FIG. 1C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 1B .
- FIG. 2A to FIG. 2D are schematic top views illustrating the manufacturing process of a touch panel in FIG. 1A .
- FIG. 3A to FIG. 3D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 2A to FIG. 2D .
- FIG. 4A and FIG. 4B depicts a repairing method of a touch panel according to an embodiment of the invention.
- FIG. 5A and FIG. 5B depicts a repairing method of a touch panel according to an embodiment of the invention.
- FIG. 6A is a schematic top view of a touch panel according to a second embodiment of the invention.
- FIG. 6B is a partially enlarged schematic diagram of FIG. 6A .
- FIG. 6C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 6B .
- FIG. 7A to FIG. 7D are schematic top views illustrating the manufacturing process of a touch panel in FIG. 6A .
- FIG. 8A to FIG. 8D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 7A to FIG. 7D .
- FIG. 9A and FIG. 9B depicts a repairing method of a touch panel according to an embodiment of the invention.
- FIG. 1A is a schematic top view of a touch panel according to a first embodiment of the invention.
- FIG. 1B is a partially enlarged schematic diagram of FIG. 1A .
- FIG. 1C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 1B .
- the touch panel 100 includes a substrate 102 , a plurality of first sensing series 110 , a plurality of the second sensing series 120 , a plurality of conductive repairing pattern layers 130 , and a first dielectric layer 140 .
- the substrate 102 is, for example, a glass substrate, a plastic substrate, a flexible substrate, or other substrates.
- the substrate 102 can also be a printed circuit board or a display panel, such as a liquid crystal display panel, an organic display panel, an electrophoresis display panel, a plasma display panel, or other type display panels, and can directly assembly on the display panel or in the display panel.
- a liquid crystal display panel as an example, the liquid crystal display panel can be manufactured as an additive touch liquid crystal display panel, an integrated type touch liquid crystal display panel, or an in-cell type touch liquid crystal display panel.
- the first dielectric layer 140 is, for example, disposed on the substrate 102 to cover the conductive repairing pattern layers 130 , wherein the first dielectric layer 140 has a plurality of contact windows 142 .
- the contact windows 142 can be dielectric through holes, dielectric openings, or dielectric vias, exposing part of the conductive repairing pattern layers 130 .
- the first sensing series 110 are disposed on the substrate 102 and extended along a first direction D 1 .
- the first sensing series 110 includes a plurality of first sensing pads 112 and a plurality of first bridge lines 114 .
- the first bridge lines 114 serially connect two adjacent first sensing pads 112 .
- the first sensing series 110 are, for example, disposed parallel to each other.
- the first direction D 1 is, for example, an x-axis direction.
- the first bridge lines 114 are, for example, disposed on the substrate 102 and covered by the first dielectric layer 140 , wherein the first bridge lines 114 correspond to two contact windows 142 .
- the first sensing pads 112 are, for example, disposed on the first dielectric layer 140 , wherein the first bridge lines 114 , for example, serially connect two adjacent first sensing pads 112 through the contact windows 142 .
- a material of the first sensing pads 112 is, for example, a transparent conductive material, including indium tin oxide (ITO), indium zinc oxide (IZO), or other transparent conductive metallic oxides.
- a material of the first bridge lines 114 is, for example, a metallic conductive material, including aluminum, copper, molybdenum, titanium, silver, gold, platinum and other alloys or metals.
- the second sensing series 120 are disposed on the substrate 102 and extended along a second direction D 2 .
- Each of the second sensing series 120 includes a plurality of second sensing pads 122 and a plurality of second bridge lines 124 .
- the second bridge lines 124 serially connect two adjacent second sensing pads 122 .
- the first direction D 1 is different from the second direction D 2 .
- the second sensing series 120 are, for example, disposed parallel to each other.
- the second direction D 2 is, for example, a y-axis direction, wherein the first direction D 1 is, for example, perpendicular to the second direction D 2 .
- the second sensing pads 122 and the second bridge lines 124 are, for example, disposed on the first dielectric layer 140 .
- the second sensing pad 122 and the second bridge line 124 are, for example, made up of the same conductive layer, wherein the material is, for example, a transparent conductive material, including indium tin oxide (ITO), indium zinc oxide (IZO), or other transparent conductive metallic oxides.
- the first sensing pads 112 and the second sensing pads 122 can be also formed by a mesh metallic material.
- the touch panel 100 further comprises a plurality of dummy electrodes 126 , disposed between the first sensing pads 112 and the second sensing pads 122 .
- a material of the dummy electrodes 126 is, for example, a transparent conductive material or a mesh metallic material.
- the first sensing series 110 and the second sensing series 120 are electrically insulated from each other.
- a crossover region of the first sensing series 110 and the second sensing series 120 is, for example, at the first bridge lines 114 and the second bridge lines 124 .
- the first dielectric layer 140 is disposed between the first bridge lines 114 and the second bridge lines 124 .
- the first sensing series 110 and the second sensing series 120 are electrically insulated from each other.
- the conductive repairing pattern layer 130 is overlapped with the two adjacent first sensing pads 112 disposed in the same first sensing series 110 , overlapped with the two adjacent second sensing pads 122 disposed in the same second sensing series 120 , or overlapped with both of the above, and the conductive repairing pattern layers 130 are electrically floating.
- the conductive repairing pattern layers 130 are, for example, disposed on the substrate 102 and covered by the first dielectric layer 140 .
- the conductive repairing pattern layer 130 is, for example, overlapped with two adjacent first sensing pads 112 in the same first sensing series 110 , and is overlapped with two adjacent second sensing pads 122 in the same second sensing series 120 .
- the conductive repairing pattern layer 130 is, for example, simultaneously overlapped with two adjacent first sensing pads 112 and two adjacent second sensing pads 122 .
- the conductive repairing pattern layer 130 is disposed around the crossover region of the first sensing series 110 and the second sensing series 120 , and accordingly around the crossover region of the first bridge line 114 and the second bridge line 124 .
- the conductive repairing pattern layers 130 include a plurality of first repairing lines 132 and a plurality of second repairing lines 134 .
- the first repairing line 132 is overlapped with the corresponding two adjacent first sensing pads 112
- the second repairing line 134 is overlapped with the corresponding two adjacent second sensing pads 122 .
- the first repairing line 132 and the second repairing line 134 of the conductive repairing pattern layer 130 are, for example, substantially integrated as a whole, and made up of a mesh repairing pattern layer.
- the mesh repairing pattern layer is overlapped with the corresponding two adjacent first sensing pads 112 , and is overlapped with the corresponding two adjacent second sensing pads 122 .
- a material of the conductive repairing pattern layers 130 includes, for example, a transparent conductive material or a mesh metallic material.
- a material of the conductive repairing pattern layers 130 is, for example, a transparent conductive material
- a material of the first bridge lines 114 includes, for example, a mesh metallic material.
- the conductive repairing pattern layers 130 and the first bridge lines 114 are, for example, made up of the same layer.
- the line width of the conductive repairing pattern layers 130 is preferably smaller than 20 micrometers, so as to avoid the conductive repairing pattern layers 130 being a visual structure.
- the conductive repairing pattern layer 130 is simultaneously overlapped with two adjacent first sensing pads 112 and two adjacent second sensing pads 122 , and has a mesh structure
- the conductive repairing pattern layer 130 can also be overlapped with two adjacent first sensing pads 112 or two adjacent second sensing pads 122 .
- the conductive repairing pattern layer 130 can comprise a first repairing line 132 or a plurality of first repairing lines 132 , and the first repairing line 132 is overlapped with the corresponding two adjacent first sensing pads 112 .
- the conductive repairing pattern layer 130 can also have other structures; the invention is not limited thereto.
- the touch panel 100 further comprises a plurality of peripheral connecting lines 150 and a plurality of peripheral connecting pads 152 .
- the peripheral connecting lines 150 respectively connect the first sensing series 110 and the second sensing series 120 to the corresponding peripheral connecting pad 152 .
- a material of the peripheral connecting line 150 and the peripheral connecting pad 152 is, for example, a metallic conductive material, and the peripheral connecting pad 152 is further covered by a transparent conductive pattern 154 .
- a material of the transparent conductive patterns 154 is, for example, a transparent conductive metallic oxide.
- the touch panel 100 further includes a second dielectric layer 160 disposed on the first dielectric layer 140 to cover the first sensing series 110 and the second sensing series 120 . The first dielectric layer 140 and the second dielectric layer 160 exposes the peripheral connecting pads 152 through the contact windows 144 , 162 .
- FIG. 2A to FIG. 2D are schematic partial top views illustrating the manufacturing process of a touch panel in FIG. 1A .
- FIG. 3A to FIG. 3D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ FIG. 2A to FIG. 2D .
- a plurality of first bridge lines 114 , a plurality of conductive repairing pattern layers 130 , a plurality of peripheral connecting lines 150 , and a plurality of peripheral connecting pads 152 are formed on a substrate 102 .
- a material of the first bridge lines 114 , the peripheral connecting lines 150 , and the peripheral connecting pads 152 is, for example, a metallic conductive material
- a material of the conductive repairing pattern layers 130 is, for example, a transparent conductive material.
- the step includes the following.
- a metallic material layer (not shown) is formed on the substrate 102 , and the metallic material layer is then patterned to form the plurality of first bridge lines 114 , the plurality of peripheral connecting lines 150 , and the plurality of peripheral connecting pads 152 .
- a transparent conductive material layer (not shown) is formed on the substrate 102 , and the transparent conductive material layer is then patterned to foam the plurality of conductive repairing pattern layers 130 .
- the conductive repairing pattern layers 130 and the first bridge lines 114 can also be made up of the same layer, that is, all of them are formed from a metallic material layer.
- the conductive repairing pattern layers 130 , the first bridge lines 114 , the peripheral connecting lines 150 and the peripheral connecting pads 152 can be formed in one patterning process, to simplify the manufacturing steps of the touch panel 100 .
- a first dielectric layer 140 is formed on the substrate 102 to cover the first bridge lines 114 and the conductive repairing pattern layers 130 , wherein the first dielectric layer 140 has a plurality of contact windows 142 .
- the first bridge line 114 for example, corresponds to two contact windows 142 .
- the first dielectric layer 140 further covers the peripheral connecting lines 150 , and exposes the peripheral connecting pads 152 through the contact window 144 .
- a plurality of first sensing pads 112 , a plurality of second sensing pads 122 , a plurality of second bridge lines 124 , and transparent conductive patterns 154 are formed on the first dielectric layer 140 , wherein the first sensing pads 112 are formed in the contact windows 142 of the first dielectric layer 140 to contact the first bridge lines 114 .
- the step further comprises forming a plurality of dummy electrodes 126 between the first sensing pads 112 and the second sensing pads 122 .
- the step includes the following, for example.
- a transparent conductive material layer (not shown) is foamed on the first dielectric layer 140 and patterned, to simultaneously form the first sensing pads 112 , the second sensing pads 122 , the second bridge lines 124 , the transparent conductive patterns 154 , and the dummy electrodes 126 .
- the second sensing pad 122 and the second bridge line 124 electrically connected thereto form the second sensing series 120 .
- the conductive repairing pattern layer 130 is, for example, simultaneously overlapped with two adjacent first sensing pads 112 and two adjacent second sensing pads 122 .
- the second dielectric layer 160 is formed on the substrate 102 , to cover the first sensing series 110 and the second sensing series 120 , and the manufacture of the touch panel 100 is completed.
- the second dielectric layer 160 exposes the transparent conductive patterns 154 on the peripheral connecting pads 152 through the contact windows 162 .
- FIG. 4A and FIG. 4B are schematic top views depicting a repairing method of the touch panel 100 in FIG. 1A when crossover region of the first bridge line 114 and the second bridge line 124 has a short defect or an open defect. Please refer to FIG. 4A .
- the first bridge line 114 with the defect is cut, therefore two adjacent first sensing pads 112 originally connected through the first bridge line 114 are electrically insulated.
- the method of cutting the first bridge line 114 with the defect is, for example, using a laser cutting process, and the method of cutting the first bridge line 114 is, for example, cutting the connecting part between the first bridge line 114 and the first sensing pad 112 .
- the two adjacent first sensing pads 112 are electrically insulated.
- the two adjacent first sensing pads 112 electrically insulated are electrically connected through the conductive repairing pattern layer 130 overlapped with the two adjacent first sensing pads 112 .
- a laser welding method for instance, is used to weld the conductive repairing pattern layer 130 and the two adjacent first sensing pads 112 , so a welding point 170 is formed where the conductive repairing pattern layer 130 is overlapped with two adjacent first sensing pads 112 .
- the first repairing line 132 of the conductive repairing pattern layer 130 is welded with the two adjacent first sensing pads 112 , so that the welding point 170 is formed where the first repairing line 132 is overlapped with the two adjacent first sensing pads 112 .
- the two adjacent first sensing pads 112 use the electrical connection between the welding point 170 and the conductive repairing pattern layers 130 , so that the two adjacent first sensing pads 112 use the path in FIG. 4B to connect electrically. Therefore, the first sensing series 110 can provide a normal sensing operation.
- the first bridge line 114 with the defect is electrically insulated from the first sensing series 110 after repairing, thus the first sensing series 110 and the second sensing series 120 are again electrically insulated. Therefore, the first sensing series 110 and the second sensing series 120 can provide a normal sensing operation. In other words, the touch panel 100 can provide a normal sensing operation.
- FIG. 5A and FIG. 5B are schematic top views depicting a repairing method of the touch panel 100 in FIG. 1A when the crossover region of the first bridge line 114 and the second bridge line 124 has a short defect or an open defect. Please refer to FIG. 5A .
- the second bridge line 124 with the defect is cut, therefore two adjacent second sensing pads 122 originally connected through the second bridge line 124 are electrically insulated.
- the method of cutting the second bridge line 124 with the defect is, for example, using a laser cutting process, and the method of cutting the second bridge line 124 is, for example, cutting the connecting part between the second bridge line 124 and the second sensing pad 122 .
- the two adjacent second sensing pads 122 are electrically insulated.
- the two adjacent second sensing pads 122 electrically insulated are electrically connected through the conductive repairing pattern layer 130 overlapped with the two adjacent second sensing pads 122 .
- a laser welding method for instance, is used to weld the conductive repairing pattern layer 130 and the two adjacent second sensing pads 122 , so a welding point 170 is formed where the conductive repairing pattern layer 130 is overlapped with two adjacent second sensing pads 122 .
- the second repairing line 134 of the conductive repairing pattern layer 130 is welded with the two adjacent second sensing pads 122 , so that the welding point 170 is formed where the second repairing line 134 is overlapped with the two adjacent second sensing pads 122 .
- the two adjacent second sensing pads 122 use the electrical connection between the welding point 170 and the conductive repairing pattern layers 130 , so that the two adjacent second sensing pads 122 use the path in FIG. 5B to connect electrically. Therefore, the second sensing series 120 can provide a normal sensing operation.
- the second bridge line 124 with the defect is electrically insulated from the second sensing series 120 after repairing, thus the first sensing series 110 and the second sensing series 120 are again electrically insulated. Therefore, the first sensing series 110 and the second sensing series 120 can provide a normal sensing operation. In other words, the touch panel 100 can provide a normal sensing operation.
- the conductive repairing pattern layer 130 is, for example, overlapped with two adjacent first sensing pads 112 in the same first sensing series 110 , and is overlapped with at least one of the two adjacent second sensing pads 122 in the same second sensing series 120 .
- the conductive repairing pattern layer 130 can be used as a substitute for the first bridge line 114 to connect the two adjacent first sensing pads 112 , or be used as a substitute for the second bridge line 124 to connect the two adjacent second sensing pads 122 .
- the touch panel of the embodiment has a favorable yield and simple repairing method, so the waste of discarding touch panels is avoided, and further reduces the touch panel production cost.
- the touch panel of the embodiment since the touch panel of the embodiment has a favorable yield and simple repairing method, thus the touch panel of the embodiment is suitable for manufacturing an additive touch display panels and an integrated/in cell type touch display panels. Particularly, for an integrated/in-cell type touch display panel, the invention can resolve a short defect or an open defect in the crossover region of the sensing series resulting from electrostatic discharge. In other words, the manufacturing method of the touch panel of the embodiment can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield of the touch panel.
- FIG. 6A is a schematic top view of a touch panel according to a second embodiment of the invention.
- FIG. 6B is a partially enlarged schematic diagram of FIG. 6A .
- FIG. 6C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 6B . Please simultaneously refer to FIG. 6A to FIG. 6C .
- the touch panel 100 includes a substrate 102 , a plurality of first sensing series 110 , a plurality of the second sensing series 120 , a plurality of conductive repairing pattern layers 130 , a first dielectric layer 140 , a second dielectric layer 160 , a plurality of peripheral connecting lines 150 , and a plurality of peripheral connecting pads 152 .
- the first dielectric layer 140 is, for example, disposed on the substrate 102 , and includes a plurality of contact windows 142 .
- the first sensing series 110 are disposed on the substrate 102 and extended along a first direction D 1 .
- the first sensing series 110 includes a plurality of first sensing pads 112 and a plurality of first bridge lines 114 .
- the first bridge lines 114 serially connect two adjacent first sensing pads 112 .
- the first sensing series 110 are, for example, disposed parallel to each other.
- the first direction D 1 is, for example, an x-axis direction.
- the first sensing pads 112 are, for example, disposed on the substrate 102 and covered by the first dielectric layer 140 , wherein the first sensing pads 112 , for example, correspond to two contact windows 142 .
- the first bridge lines 114 are, for example, disposed on the first dielectric layer 140 , and the first bridge line 114 fills in the contact window 142 , so that the first bridge lines 114 serially connect two adjacent first sensing pads 112 through the contact windows 142 .
- the first sensing pads 112 are, for example, made of a transparent conductive material
- the first bridge lines 114 are, for example, made of a metallic material.
- the plurality of second sensing series 120 are disposed on the substrate 102 and extended along a second direction D 2 .
- Each of the second sensing series 120 includes a plurality of second sensing pads 122 and a plurality of second bridge lines 124 .
- the second bridge lines 124 serially connect two adjacent second sensing pads 122 .
- the first direction D 1 is different from the second direction D 2 .
- the second sensing series 120 are, for example, disposed parallel to each other.
- the second direction D 2 is, for example, a y-axis direction, wherein the first direction D 1 is, for example, perpendicular to the second direction D 2 .
- the second sensing pads 122 and the second bridge lines 124 are, for example, disposed on the substrate 102 and covered by the first dielectric layer 140 .
- the second sensing pads 122 and the second bridge lines 124 are, for example, made of the same conductive layer, wherein the material is, for example, a transparent conductive material.
- a crossover region of the first sensing series 110 and the second sensing series 120 is, for example, at the first bridge lines 114 and the second bridge lines 124 .
- the first dielectric layer 140 is disposed between the first bridge lines 114 and the second bridge lines 124 .
- the first sensing series 110 and the second sensing series 120 are electrically insulated from each other.
- the touch panel 100 further comprises a plurality of dummy electrodes 126 , disposed between the first sensing pads 112 and the second sensing pads 122 .
- the conductive repairing pattern layer 130 is overlapped with the two adjacent first sensing pads 112 disposed in the same first sensing series 110 , is overlapped with the two adjacent second sensing pads 122 disposed in the same second sensing series 120 , or is overlapped with both of the above, and the conductive repairing pattern layers 130 are electrically floating.
- the conductive repairing pattern layers 130 are, for example, disposed on the first dielectric layer 140 .
- the conductive repairing pattern layer 130 is, for example, overlapped with two adjacent first sensing pads 112 in the same first sensing series 110 , and is overlapped with two adjacent second sensing pads 122 in the same second sensing series 120 .
- the conductive repairing pattern layer 130 is, for example, simultaneously overlapped with two adjacent first sensing pads 112 and two adjacent second sensing pads 122 .
- the conductive repairing pattern layers 130 include a plurality of first repairing lines 132 and a plurality of second repairing lines 134 .
- the first repairing line 132 is overlapped with the corresponding two adjacent first sensing pads 112
- the second repairing line 134 is overlapped with the corresponding two adjacent second sensing pads 122 .
- the first repairing line 132 and the second repairing line 134 of the conductive repairing pattern layer 130 are, for example, substantially integrated as a whole, and made up of a mesh repairing pattern layer.
- the mesh repairing pattern layer is overlapped with the corresponding two adjacent first sensing pads 112 , and is overlapped with the corresponding two adjacent second sensing pads 122 .
- the conductive repairing pattern layers 130 and the first bridge lines 114 are, for example, made up of the same layer, with a material such as a transparent conductive material or a mesh metallic material.
- the conductive repairing pattern layers 130 can also overlap with two adjacent first sensing pads 112 or two adjacent second sensing pads 122 .
- the conductive repairing pattern layer 130 can comprise a first repairing line 132 or a plurality of first repairing lines 132 , and the first repairing line 132 is overlapped with the corresponding two adjacent first sensing pads 112 .
- the conductive repairing pattern layer 130 can also have other structures; the invention is not limited thereto.
- the touch panel 100 further includes a second dielectric layer 160 disposed on the first dielectric layer 140 to cover the first sensing series 110 and the second sensing series 120 .
- the first dielectric layer 140 and the second dielectric layer 160 exposes the peripheral connecting pads 152 through the contact windows 144 , 162 .
- the peripheral connecting lines 150 and the peripheral connecting pads 152 represent similar descriptions that can be referred to in the first embodiment, and thus are not reiterated herein.
- FIG. 7A to FIG. 7D are schematic partial top views illustrating the manufacturing process of a touch panel in FIG. 6A .
- FIG. 8A to FIG. 8D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ in FIG. 7A to FIG. 7D .
- a plurality of first sensing pads 112 , a plurality of second sensing pads 122 , and a plurality of second bridge lines 124 are formed on a substrate 102 .
- the step further comprises forming a plurality of dummy electrodes 126 between the first sensing pads 112 and the second sensing pads 122 .
- the step for example, includes the following.
- a transparent conductive material layer (not shown) is formed on the substrate 102 , and the transparent conductive material layer is then patterned to form the first sensing pads 112 , the second sensing pads 122 , the second bridge lines 124 , and the dummy electrodes 126 .
- a metallic material layer (not shown) is formed on the substrate 102 , and the metallic material layer is then patterned to form the peripheral connecting lines 150 and the peripheral connecting pads 152 .
- the second sensing pads 122 and the second bridge lines 124 electrically connected thereto form the second sensing series 120 .
- a first dielectric layer 140 is formed on the substrate 102 to cover the first sensing pads 112 and the second sensing series 120 , wherein the first dielectric layer 140 has a plurality of contact windows 142 .
- the first dielectric layer 140 further covers the peripheral connecting lines 150 , and exposes the peripheral connecting pads 152 through the contact window 144 .
- a plurality of first bridge lines 114 , a plurality of conductive repairing pattern layers 130 , a plurality of peripheral connecting lines 150 , and a plurality of peripheral connecting pads 152 are formed on the first dielectric layer 140 , wherein the first bridge line 114 fills in the corresponding two contact windows 142 , to connect the two adjacent first sensing pads 112 .
- the step is, for example, first forming a metallic material layer (not shown) on the first dielectric layer 140 and patterning the metallic material layer, so as to form the plurality of first bridge lines 114 , the plurality of peripheral connecting lines 150 , and the plurality of peripheral connecting pads 152 shown in FIG. 7C and FIG. 8C .
- a transparent conductive material layer (not shown) is formed on the first dielectric layer 140 and patterned, to form the plurality of conductive repairing pattern layers 130 and the plurality of transparent conductive patterns 154 shown in FIG. 7D and FIG. 8D .
- the second dielectric layer 160 is formed on the substrate 102 , to cover the first sensing series 110 and the second sensing series 120 , and the manufacture of the touch panel 100 is completed.
- the second dielectric layer 160 exposes the transparent conductive pattern 154 on the peripheral connecting pads 152 through the contact windows 162 .
- FIG. 9A and FIG. 9B are schematic top views depicting a repairing method of the touch panel 100 in FIG. 6A when the crossover region of the first bridge line 114 and the second bridge line 124 has a short defect or an open defect. Please refer to FIG. 9A .
- the first bridge line 114 with the defect is cut, therefore two adjacent first sensing pads 112 originally connected through the first bridge line 114 are electrically insulated.
- the method of cutting the first bridge line 114 with the defect is, for example, using a laser cutting process, and the method of cutting the first bridge line 114 is, for example, cutting the connecting part between the first bridge line 114 and the first sensing pad 112 .
- the two adjacent first sensing pads 112 are electrically insulated.
- the two adjacent first sensing pads 112 electrically insulated are electrically connected through the conductive repairing pattern layer 130 overlapped with the two adjacent first sensing pads 112 .
- a laser welding method for instance, is used to weld the conductive repairing pattern layer 130 and the two adjacent first sensing pads 112 , so a welding point 170 is formed where the conductive repairing pattern layer 130 is overlapped with two adjacent first sensing pads 112 .
- the first repairing line 132 of the conductive repairing pattern layer 130 is welded with the two adjacent first sensing pads 112 , so that the welding point 170 is formed where the first repairing line 132 is overlapped with the two adjacent first sensing pads 112 .
- the two adjacent first sensing pads 112 use the electrical connection between the welding point 170 and the conductive repairing pattern layers 130 , so that the two adjacent first sensing pads 112 use the path in FIG. 9B to connect electrically. Therefore, the first sensing series 110 can provide a normal sensing operation.
- the first bridge line 114 with the defect is electrically insulated from the first sensing series 110 after repairing, thus the first sensing series 110 and the second sensing series 120 are again electrically insulated. Therefore, the first sensing series 110 and the second sensing series 120 can provide a normal sensing operation. In other words, the touch panel 100 can provide a normal sensing operation.
- the repairing method may also have second bridge line 124 cut and may weld the conductive repairing pattern layers 130 with the two adjacent second sensing pads 122 . Since this repairing method and the repairing method of cutting the first bridge line 114 is the same, the description is not reiterated herein.
- the conductive repairing pattern layer 130 is, for example, overlapped with two adjacent first sensing pads 112 in the same first sensing series 110 , and is overlapped with at least one of the two adjacent second sensing pads 122 in the same second sensing series 120 .
- the conductive repairing pattern layer 130 can be used as a substitute for the first bridge line 114 to connect the two adjacent first sensing pads 112 , or be used as a substitute for the second bridge line 124 to connect the two adjacent second sensing pads 122 .
- the touch panel of the embodiment has a favorable yield and simple repairing method, so the waste of discarding touch panels is avoided, and further reduces the touch panel production cost.
- the touch panel of the embodiment since the touch panel of the embodiment has a favorable yield and simple repairing method, thus the touch panel of the embodiment is suitable for manufacturing an additive touch display panels and an integrated/in cell type touch display panels. Particularly, for an integrated/in-cell type touch display panel, the invention can resolve a short defect or an open defect in the crossover region of the sensing series resulting from electrostatic discharge. In other words, the manufacturing method of the touch panel of the embodiment can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield rate of the touch panel.
- each of the conductive repairing pattern layers is overlapped with two adjacent sensing pads in the same sensing series.
- the conductive repairing pattern layers can be used to repair the defects, so the two sensing series can provide a normal sensing operation.
- the touch panel has a favorable yield and simple repair method. More particularly, since the touch panel of the invention is easily repaired, thus, it is especially suitable for manufactured integrated/in-cell type touch display panels, so as to solve the short defect or the open defect in the crossover region of the touch sensing series caused by the manufacture of color filter thin films.
- the manufacturing method of the touch panel of the invention can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield of the touch panel.
Abstract
A touch panel including a substrate, a plurality of first and second sensing series, and a plurality of conductive repairing pattern layers is provided. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and second bridge lines, and the second bridge lines serially connect two adjacent second sensing pads. Each conductive repairing pattern layer electrically floating locates around the crossover region of the first and second sensing series. Two adjacent sensing pads are connected by the conductive repairing pattern layer after a repair procedure is finished.
Description
- This application claims the priority benefit of Taiwan application serial no. 99133743, filed on Oct. 4, 2010. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
- 1. Field of the Invention
- The invention relates to a panel and a repairing method thereof, and more particularly to a touch panel and a repairing method thereof.
- 2. Description of Related Art
- Based on different ways of sensing, touch panels are generally categorized into resistant touch panels, capacitive touch panels, optical touch panels, sonic wave touch panels, and electromagnetic touch panels. The capacitive touch panels having advantages of fast response speed, favorable reliability, and durability have been used extensively in electronic devices. In view of structures and manufacturing methods, capacitive touch display panels can be further classified into an additive type and an integrated/in-cell type. In an additive-type capacitive touch display panel, sensing series are first formed on a substrate, and the substrate having the sensing series thereon is then adhered to an outer surface of a display panel. Consequently, the additive-type touch display panel inevitably has a certain thickness. Compared with the additive-type touch panel, an integrated/in-cell type touch display panel is more conducive to the slimness and lightness of the display.
- However, in terms of fabrication, the integrated/in-cell type touch display panel and the additive-type touch display panel both encounter the problem of a low yield rate resulting from electrostatic discharge, and the above problem is especially serious in the integrated/in-cell type touch display panel. For instance, most of the current integrated/in-cell type touch display panels are fabricated by forming a touch-control circuit on one surface of the substrate and then forming a color filter thin film on the other surface of the substrate. While the color filter thin film is formed, the touch-control circuit is often damaged due to electrostatic discharge. Moreover, when an user touches the integrated/in-cell type touch display panel or the additive-type touch display panel with the fingers of the user, electrostatic discharge may also occur, resulting in the damage of the touch-control circuit.
- Generally speaking, in the conventional capacitive touch panel, metal bridge lines configured on a crossover region, where an X sensing series intersect a Y sensing series, are used to couple the adjacent sensing pads to each other to avoid the short circuit happening on the X sensing series and the Y sensing series around the crossover region. For example, the two adjacent sensing pads of the X sensing series or the Y sensing series are electrically connected through a metal bridge line. However, when electrostatic discharge occurs, the metal bridge line in the crossover region of the X sensing series and the Y sensing series could be burned, causing a short defect or an open defect. As a result, the X sensing series or the Y sensing series will be unable to operate normally. Since electrostatic discharge is inevitable during fabrication and use, how to swiftly repair the sensing series when a short defect or an open defect occurs, is one of the important issues that all designers seek to overcome.
- The invention provides a touch panel having a favorable yield.
- The invention still further provides a repairing method of a touch panel. The method repairs the sensing series of the touch panel.
- The invention provides a touch panel, including a substrate, a plurality of first sensing series, a plurality of second sensing series, and a plurality of conductive repairing pattern layers. The first sensing series are disposed on the substrate and extended along a first direction. Each of the first sensing series includes a plurality of first sensing pads and a plurality of first bridge lines. The first bridge lines serially connect two adjacent first sensing pads. The second sensing series are disposed on the substrate and extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines. The second bridge lines serially connect two adjacent second sensing pads. The first direction is different from the second direction, and the first sensing series and the second sensing series are electrically insulated from each other. Each of the conductive repairing pattern layers is overlapped with two adjacent first sensing pads in the same first sensing series, and each conductive repairing pattern layer locates around the crossover region of the first sensing series and the second sensing series. The conductive repairing pattern layers are electrically floating, and can connect the two adjacent sensing pads after the repair procedure is finished.
- An embodiment of the invention further comprises a first dielectric layer, disposed on the substrate to cover the conductive repairing pattern layers, wherein the first dielectric layer includes a plurality of contact windows. The first sensing pads and the second sensing pads are disposed on the first dielectric layer.
- In an embedment of the invention, the first dielectric layer further covers the first bridge lines. The first sensing pads connect to the first bridge lines through the contact windows, and the second bridge lines are disposed on the first dielectric layer.
- In an embodiment of the invention, the first dielectric layer further covers the second bridge lines. The second sensing pads connect to the second bridge lines through the contact windows, and the first bridge lines are disposed on the first dielectric layer.
- An embodiment of the invention further comprises a second dielectric layer disposed on the first dielectric layer, so as to cover the first sensing series and the second sensing series.
- An embodiment of the invention further comprises a first dielectric layer, disposed on the substrate to cover the first sensing pads and the second sensing pads, wherein the first dielectric layer includes a plurality of contact windows. The conductive repairing pattern layers are disposed on the first dielectric layer.
- In an embodiment of the invention, the first dielectric layer further covers the first bridge lines. The second bridge lines are disposed on the first dielectric layer. The second sensing pads connect to the second bridge lines through the contact windows.
- In an embodiment of the invention, the first dielectric layer further covers the second bridge lines. The first bridge lines are disposed on the first dielectric layer. The first sensing pads connect to the first bridge lines through the contact windows.
- In an embodiment of the invention, a material of the conductive repairing pattern layers is a transparent conductive material.
- In an embodiment of the invention, a material of the conductive repairing pattern layers is a metallic conductive material.
- In an embodiment of the invention, the first bridge lines and the conductive repairing pattern layers are made up of the same layer.
- In an embodiment of the invention, the second bridge lines and the conductive repairing pattern layers are made up of the same layer.
- In an embodiment of the invention, a material of the first sensing pads, a material of the first bridge lines and a material of the second sensing pads are the same.
- In an embodiment of the invention, the conductive repairing pattern layer comprises a mesh repairing pattern layer. The mesh repairing pattern layer is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- In an embodiment of the invention, the conductive repairing pattern layer comprises a plurality of first repairing lines electrically connected, and each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads.
- In an embodiment of the invention, the conductive repairing pattern layer is further overlapped with two adjacent second sensing pads in the same second sensing series.
- In an embodiment of the invention, each of the conductive repairing pattern layers comprises a plurality of first repairing lines electrically connected and a plurality of second repairing lines electrically connected. Each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads, and each of the second repairing lines is overlapped with the corresponding two adjacent second sensing pads.
- An embodiment of the invention further comprises a plurality of dummy electrodes, disposed between the first sensing pads and the second sensing pads.
- An embodiment of the invention further comprises a plurality of peripheral connecting lines, electrically connected to each corresponding first sensing series and each corresponding second sensing series respectively.
- The invention further provides a repairing method for repairing a touch panel. The repairing method is suitable to repair the previously mentioned touch panel when a short defect or an open defect occurs in a crossover region of a first bridge line and a second bridge line of the touch panel. The first bridge line with the defect is cut, therefore two adjacent first sensing pads originally connected through the first bridge line are electrically insulated. The two adjacent first sensing pads electrically insulated are then electrically connected through a conductive repairing pattern layer overlapped with the two adjacent first sensing pads.
- In an embodiment of the invention, a method of cutting the first bridge line with the defect includes a laser cutting process.
- In an embodiment of the invention, the method of electrically connecting the two adjacent first sensing pads electrically insulated through the conductive repairing pattern layer overlapped with the two adjacent first sensing pads includes welding the conductive repairing pattern layer with the two adjacent first sensing pads.
- In an embodiment of the invention, the method of welding includes a laser welding process.
- The invention further provides a touch panel, including a substrate, a plurality of first bridge lines, a plurality of conductive repairing pattern layers, a first dielectric layer, a plurality of first sensing pads, and a plurality of second sensing series. The first bridge lines are disposed on the substrate, and extended along a first direction. The conductive repairing pattern layers are disposed on the substrate, and the conductive repairing pattern layers are electrically floating. The first dielectric layer is disposed on the substrate to cover the conductive repairing pattern layers and the first bridge lines. The first dielectric layer includes a plurality of contact windows, and each of the first bridge lines corresponds to two or more contact windows. The first sensing pads are disposed on the first dielectric layer. The first bridge lines serially connect the two adjacent first sensing pads through the contact windows, wherein the first sensing pads and the first bridge lines forms a plurality of first sensing series arranged in parallel. The second sensing series are arranged in parallel and disposed on the dielectric layer, extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines. The second bridge lines serially connect two adjacent second sensing pads, and the first direction is different from the second direction, wherein the first sensing series and the second sensing series are electrically insulated from each other. Each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- The invention further provides a touch panel, including a substrate, a plurality of first sensing pads, a plurality of second sensing series, a first dielectric layer, a plurality of first bridge lines, and a plurality of conductive repairing pattern layers. The first sensing pads are disposed on the substrate and extended along a first direction. The second sensing series are arranged in parallel and disposed on the substrate, extended along a second direction. Each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines. The second bridge lines serially connect two adjacent second sensing pads. The first direction is different from the second direction, wherein the first sensing pads and the second sensing series are electrically insulated from each other. The first dielectric layer is disposed on the substrate to cover the first sensing pads and the second sensing series. The first dielectric layer includes a plurality of contact windows, and each of the first sensing pads corresponds to two or more contact windows. The first bridge lines are disposed on the first dielectric layer along a first direction. The first bridge lines serially connect the two adjacent first sensing pads through the contact windows, forming a plurality of first sensing series arranged in parallel. The conductive repairing patterns are disposed on the first dielectric layer, and the conductive repairing patterns are electrically floating. Each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
- Based on the above, in the touch panel and repairing method of the invention, each of the conductive repairing pattern layers is overlapped with two adjacent sensing pads in the same sensing series. As such, when the crossover region of the two sensing series has a short defect or an open defect, the conductive repairing pattern layers can be used to repair the defects, so the two sensing series can provide a normal sensing operation. As a result, the touch panel has a favorable yield and simple repair method.
- In order to make the aforementioned and other features and advantages of the invention more comprehensible, several embodiments accompanied with figures are described in detail below.
- The accompanying drawings are included to provide further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments and, together with the description, serve to explain the principles of the disclosure.
-
FIG. 1A is a schematic top view of a touch panel according to a first embodiment of the invention. -
FIG. 1B is a partially enlarged schematic diagram ofFIG. 1A . -
FIG. 1C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 1B . -
FIG. 2A toFIG. 2D are schematic top views illustrating the manufacturing process of a touch panel inFIG. 1A . -
FIG. 3A toFIG. 3D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 2A toFIG. 2D . -
FIG. 4A andFIG. 4B depicts a repairing method of a touch panel according to an embodiment of the invention. -
FIG. 5A andFIG. 5B depicts a repairing method of a touch panel according to an embodiment of the invention. -
FIG. 6A is a schematic top view of a touch panel according to a second embodiment of the invention. -
FIG. 6B is a partially enlarged schematic diagram ofFIG. 6A . -
FIG. 6C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 6B . -
FIG. 7A toFIG. 7D are schematic top views illustrating the manufacturing process of a touch panel inFIG. 6A . -
FIG. 8A toFIG. 8D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 7A toFIG. 7D . -
FIG. 9A andFIG. 9B depicts a repairing method of a touch panel according to an embodiment of the invention. -
FIG. 1A is a schematic top view of a touch panel according to a first embodiment of the invention.FIG. 1B is a partially enlarged schematic diagram ofFIG. 1A .FIG. 1C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 1B . Referring toFIG. 1A toFIG. 1C , in the embodiment, thetouch panel 100 includes asubstrate 102, a plurality offirst sensing series 110, a plurality of thesecond sensing series 120, a plurality of conductive repairing pattern layers 130, and a firstdielectric layer 140. Thesubstrate 102 is, for example, a glass substrate, a plastic substrate, a flexible substrate, or other substrates. Thesubstrate 102 can also be a printed circuit board or a display panel, such as a liquid crystal display panel, an organic display panel, an electrophoresis display panel, a plasma display panel, or other type display panels, and can directly assembly on the display panel or in the display panel. Taking a liquid crystal display panel as an example, the liquid crystal display panel can be manufactured as an additive touch liquid crystal display panel, an integrated type touch liquid crystal display panel, or an in-cell type touch liquid crystal display panel. The above details are well-known to persons skilled in the art, and so no further descriptions are provided herein. In the embodiment, thefirst dielectric layer 140 is, for example, disposed on thesubstrate 102 to cover the conductive repairing pattern layers 130, wherein thefirst dielectric layer 140 has a plurality ofcontact windows 142. Thecontact windows 142 can be dielectric through holes, dielectric openings, or dielectric vias, exposing part of the conductive repairing pattern layers 130. - The
first sensing series 110 are disposed on thesubstrate 102 and extended along a first direction D1. Thefirst sensing series 110 includes a plurality offirst sensing pads 112 and a plurality of first bridge lines 114. Thefirst bridge lines 114 serially connect two adjacentfirst sensing pads 112. In the embodiment, thefirst sensing series 110 are, for example, disposed parallel to each other. The first direction D1 is, for example, an x-axis direction. Thefirst bridge lines 114 are, for example, disposed on thesubstrate 102 and covered by thefirst dielectric layer 140, wherein thefirst bridge lines 114 correspond to twocontact windows 142. Thefirst sensing pads 112 are, for example, disposed on thefirst dielectric layer 140, wherein thefirst bridge lines 114, for example, serially connect two adjacentfirst sensing pads 112 through thecontact windows 142. A material of thefirst sensing pads 112 is, for example, a transparent conductive material, including indium tin oxide (ITO), indium zinc oxide (IZO), or other transparent conductive metallic oxides. A material of thefirst bridge lines 114 is, for example, a metallic conductive material, including aluminum, copper, molybdenum, titanium, silver, gold, platinum and other alloys or metals. - The
second sensing series 120 are disposed on thesubstrate 102 and extended along a second direction D2. Each of thesecond sensing series 120 includes a plurality ofsecond sensing pads 122 and a plurality of second bridge lines 124. Thesecond bridge lines 124 serially connect two adjacentsecond sensing pads 122. The first direction D1 is different from the second direction D2. In the embodiment, thesecond sensing series 120 are, for example, disposed parallel to each other. The second direction D2 is, for example, a y-axis direction, wherein the first direction D1 is, for example, perpendicular to the second direction D2. Thesecond sensing pads 122 and thesecond bridge lines 124 are, for example, disposed on thefirst dielectric layer 140. In the embodiment, thesecond sensing pad 122 and thesecond bridge line 124 are, for example, made up of the same conductive layer, wherein the material is, for example, a transparent conductive material, including indium tin oxide (ITO), indium zinc oxide (IZO), or other transparent conductive metallic oxides. In an alternative embodiment, thefirst sensing pads 112 and thesecond sensing pads 122 can be also formed by a mesh metallic material. The above details are well-known to persons skilled in the art, and so no further descriptions are provided herein. - In the embodiment, the
touch panel 100 further comprises a plurality ofdummy electrodes 126, disposed between thefirst sensing pads 112 and thesecond sensing pads 122. A material of thedummy electrodes 126 is, for example, a transparent conductive material or a mesh metallic material. - The
first sensing series 110 and thesecond sensing series 120 are electrically insulated from each other. In detail, in the embodiment, a crossover region of thefirst sensing series 110 and thesecond sensing series 120 is, for example, at thefirst bridge lines 114 and the second bridge lines 124. Thefirst dielectric layer 140 is disposed between thefirst bridge lines 114 and the second bridge lines 124. Thus, thefirst sensing series 110 and thesecond sensing series 120 are electrically insulated from each other. - Please simultaneously refer to
FIG. 1B andFIG. 1C . The conductive repairingpattern layer 130 is overlapped with the two adjacentfirst sensing pads 112 disposed in the samefirst sensing series 110, overlapped with the two adjacentsecond sensing pads 122 disposed in the samesecond sensing series 120, or overlapped with both of the above, and the conductive repairing pattern layers 130 are electrically floating. In the embodiment, the conductive repairing pattern layers 130 are, for example, disposed on thesubstrate 102 and covered by thefirst dielectric layer 140. - In the embodiment, the conductive repairing
pattern layer 130 is, for example, overlapped with two adjacentfirst sensing pads 112 in the samefirst sensing series 110, and is overlapped with two adjacentsecond sensing pads 122 in the samesecond sensing series 120. In other words, the conductive repairingpattern layer 130 is, for example, simultaneously overlapped with two adjacentfirst sensing pads 112 and two adjacentsecond sensing pads 122. For example, as shown inFIG. 1B , the conductive repairingpattern layer 130 is disposed around the crossover region of thefirst sensing series 110 and thesecond sensing series 120, and accordingly around the crossover region of thefirst bridge line 114 and thesecond bridge line 124. The conductive repairing pattern layers 130, for example, include a plurality of first repairinglines 132 and a plurality of second repairinglines 134. The first repairingline 132 is overlapped with the corresponding two adjacentfirst sensing pads 112, and the second repairingline 134 is overlapped with the corresponding two adjacentsecond sensing pads 122. In the embodiment, the first repairingline 132 and the second repairingline 134 of the conductive repairingpattern layer 130 are, for example, substantially integrated as a whole, and made up of a mesh repairing pattern layer. In this case, the mesh repairing pattern layer is overlapped with the corresponding two adjacentfirst sensing pads 112, and is overlapped with the corresponding two adjacentsecond sensing pads 122. A material of the conductive repairing pattern layers 130 includes, for example, a transparent conductive material or a mesh metallic material. In the embodiment, a material of the conductive repairing pattern layers 130 is, for example, a transparent conductive material, and a material of thefirst bridge lines 114 includes, for example, a mesh metallic material. However, in other embodiments, the conductive repairing pattern layers 130 and thefirst bridge lines 114 are, for example, made up of the same layer. When the conductive repairing pattern layers 130 uses a metallic conductive material and is directly integrated in the display panel, the line width of the conductive repairing pattern layers 130 is preferably smaller than 20 micrometers, so as to avoid the conductive repairing pattern layers 130 being a visual structure. - It should be noted that although in the embodiment the conductive repairing
pattern layer 130 is simultaneously overlapped with two adjacentfirst sensing pads 112 and two adjacentsecond sensing pads 122, and has a mesh structure, in an embodiment, the conductive repairingpattern layer 130 can also be overlapped with two adjacentfirst sensing pads 112 or two adjacentsecond sensing pads 122. For example, in an embodiment, the conductive repairingpattern layer 130 can comprise a first repairingline 132 or a plurality of first repairinglines 132, and the first repairingline 132 is overlapped with the corresponding two adjacentfirst sensing pads 112. In addition, even though the embodiment uses the conductive repairingpattern layer 130 shown inFIG. 1B , the conductive repairingpattern layer 130 can also have other structures; the invention is not limited thereto. - In the embodiment, the
touch panel 100 further comprises a plurality of peripheral connectinglines 150 and a plurality of peripheral connectingpads 152. The peripheral connectinglines 150 respectively connect thefirst sensing series 110 and thesecond sensing series 120 to the corresponding peripheral connectingpad 152. A material of the peripheral connectingline 150 and the peripheral connectingpad 152 is, for example, a metallic conductive material, and the peripheral connectingpad 152 is further covered by a transparentconductive pattern 154. A material of the transparentconductive patterns 154 is, for example, a transparent conductive metallic oxide. In addition, in the embodiment, thetouch panel 100 further includes asecond dielectric layer 160 disposed on thefirst dielectric layer 140 to cover thefirst sensing series 110 and thesecond sensing series 120. Thefirst dielectric layer 140 and thesecond dielectric layer 160 exposes the peripheral connectingpads 152 through thecontact windows - Further provided is a manufacturing process of the touch panel of the invention, and
FIG. 2A toFIG. 2D are schematic partial top views illustrating the manufacturing process of a touch panel inFIG. 1A .FIG. 3A toFIG. 3D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′FIG. 2A toFIG. 2D . Please simultaneously refer toFIG. 2A andFIG. 3A . First, a plurality offirst bridge lines 114, a plurality of conductive repairing pattern layers 130, a plurality of peripheral connectinglines 150, and a plurality of peripheral connectingpads 152 are formed on asubstrate 102. In the embodiment, a material of thefirst bridge lines 114, the peripheral connectinglines 150, and the peripheral connectingpads 152 is, for example, a metallic conductive material, and a material of the conductive repairing pattern layers 130 is, for example, a transparent conductive material. Thus, the step, for example, includes the following. A metallic material layer (not shown) is formed on thesubstrate 102, and the metallic material layer is then patterned to form the plurality offirst bridge lines 114, the plurality of peripheral connectinglines 150, and the plurality of peripheral connectingpads 152. A transparent conductive material layer (not shown) is formed on thesubstrate 102, and the transparent conductive material layer is then patterned to foam the plurality of conductive repairing pattern layers 130. Alternatively, in an embodiment, the conductive repairing pattern layers 130 and thefirst bridge lines 114 can also be made up of the same layer, that is, all of them are formed from a metallic material layer. As such, the conductive repairing pattern layers 130, thefirst bridge lines 114, the peripheral connectinglines 150 and the peripheral connectingpads 152 can be formed in one patterning process, to simplify the manufacturing steps of thetouch panel 100. - Please simultaneously refer to both
FIG. 2B andFIG. 3B . Next, a firstdielectric layer 140 is formed on thesubstrate 102 to cover thefirst bridge lines 114 and the conductive repairing pattern layers 130, wherein thefirst dielectric layer 140 has a plurality ofcontact windows 142. Thefirst bridge line 114, for example, corresponds to twocontact windows 142. In the embodiment, thefirst dielectric layer 140 further covers the peripheral connectinglines 150, and exposes the peripheral connectingpads 152 through thecontact window 144. - Please simultaneously refer to
FIG. 2C andFIG. 3C . Next, a plurality offirst sensing pads 112, a plurality ofsecond sensing pads 122, a plurality ofsecond bridge lines 124, and transparentconductive patterns 154 are formed on thefirst dielectric layer 140, wherein thefirst sensing pads 112 are formed in thecontact windows 142 of thefirst dielectric layer 140 to contact the first bridge lines 114. In the embodiment, the step further comprises forming a plurality ofdummy electrodes 126 between thefirst sensing pads 112 and thesecond sensing pads 122. In detail, in the embodiment, the step includes the following, for example. A transparent conductive material layer (not shown) is foamed on thefirst dielectric layer 140 and patterned, to simultaneously form thefirst sensing pads 112, thesecond sensing pads 122, thesecond bridge lines 124, the transparentconductive patterns 154, and thedummy electrodes 126. Thefirst sensing pads 112 and thefirst bridge lines 114 electrically connected thereto form thefirst sensing series 110, and thesecond sensing pad 122 and thesecond bridge line 124 electrically connected thereto form thesecond sensing series 120. In the embodiment, the conductive repairingpattern layer 130 is, for example, simultaneously overlapped with two adjacentfirst sensing pads 112 and two adjacentsecond sensing pads 122. - Please simultaneously refer to
FIG. 2D andFIG. 3D . Subsequently, thesecond dielectric layer 160 is formed on thesubstrate 102, to cover thefirst sensing series 110 and thesecond sensing series 120, and the manufacture of thetouch panel 100 is completed. In the embodiment, thesecond dielectric layer 160 exposes the transparentconductive patterns 154 on the peripheral connectingpads 152 through thecontact windows 162. - The invention provides a repairing method for repairing the
aforementioned touch panel 100 when the crossover region of thefirst bridge line 114 of thefirst sensing series 110 and the second bridge line of thesecond sensing series 120 has a short defect or an open defect.FIG. 4A andFIG. 4B are schematic top views depicting a repairing method of thetouch panel 100 inFIG. 1A when crossover region of thefirst bridge line 114 and thesecond bridge line 124 has a short defect or an open defect. Please refer toFIG. 4A . First, thefirst bridge line 114 with the defect is cut, therefore two adjacentfirst sensing pads 112 originally connected through thefirst bridge line 114 are electrically insulated. The method of cutting thefirst bridge line 114 with the defect is, for example, using a laser cutting process, and the method of cutting thefirst bridge line 114 is, for example, cutting the connecting part between thefirst bridge line 114 and thefirst sensing pad 112. As such, the two adjacentfirst sensing pads 112 are electrically insulated. - Please refer to
FIG. 4B . Next, the two adjacentfirst sensing pads 112 electrically insulated are electrically connected through the conductive repairingpattern layer 130 overlapped with the two adjacentfirst sensing pads 112. In the embodiment, a laser welding method, for instance, is used to weld the conductive repairingpattern layer 130 and the two adjacentfirst sensing pads 112, so awelding point 170 is formed where the conductive repairingpattern layer 130 is overlapped with two adjacentfirst sensing pads 112. In detail, for instance, the first repairingline 132 of the conductive repairingpattern layer 130 is welded with the two adjacentfirst sensing pads 112, so that thewelding point 170 is formed where the first repairingline 132 is overlapped with the two adjacentfirst sensing pads 112. As such, the two adjacentfirst sensing pads 112 use the electrical connection between thewelding point 170 and the conductive repairing pattern layers 130, so that the two adjacentfirst sensing pads 112 use the path inFIG. 4B to connect electrically. Therefore, thefirst sensing series 110 can provide a normal sensing operation. In addition, since thefirst bridge line 114 with the defect is electrically insulated from thefirst sensing series 110 after repairing, thus thefirst sensing series 110 and thesecond sensing series 120 are again electrically insulated. Therefore, thefirst sensing series 110 and thesecond sensing series 120 can provide a normal sensing operation. In other words, thetouch panel 100 can provide a normal sensing operation. - On the other hand, when the crossover region of the
first bridge line 114 of thefirst sensing series 110 and thesecond bridge line 124 of thesecond sensing series 120 has a short defect or an open defect, the repairing method may also cut thesecond bridge line 124.FIG. 5A andFIG. 5B are schematic top views depicting a repairing method of thetouch panel 100 inFIG. 1A when the crossover region of thefirst bridge line 114 and thesecond bridge line 124 has a short defect or an open defect. Please refer toFIG. 5A . In the embodiment, first, thesecond bridge line 124 with the defect is cut, therefore two adjacentsecond sensing pads 122 originally connected through thesecond bridge line 124 are electrically insulated. The method of cutting thesecond bridge line 124 with the defect is, for example, using a laser cutting process, and the method of cutting thesecond bridge line 124 is, for example, cutting the connecting part between thesecond bridge line 124 and thesecond sensing pad 122. As such, the two adjacentsecond sensing pads 122 are electrically insulated. - Please refer to
FIG. 5B . Next, the two adjacentsecond sensing pads 122 electrically insulated are electrically connected through the conductive repairingpattern layer 130 overlapped with the two adjacentsecond sensing pads 122. In the embodiment, a laser welding method, for instance, is used to weld the conductive repairingpattern layer 130 and the two adjacentsecond sensing pads 122, so awelding point 170 is formed where the conductive repairingpattern layer 130 is overlapped with two adjacentsecond sensing pads 122. In detail, for instance, the second repairingline 134 of the conductive repairingpattern layer 130 is welded with the two adjacentsecond sensing pads 122, so that thewelding point 170 is formed where the second repairingline 134 is overlapped with the two adjacentsecond sensing pads 122. As such, the two adjacentsecond sensing pads 122 use the electrical connection between thewelding point 170 and the conductive repairing pattern layers 130, so that the two adjacentsecond sensing pads 122 use the path inFIG. 5B to connect electrically. Therefore, thesecond sensing series 120 can provide a normal sensing operation. In addition, since thesecond bridge line 124 with the defect is electrically insulated from thesecond sensing series 120 after repairing, thus thefirst sensing series 110 and thesecond sensing series 120 are again electrically insulated. Therefore, thefirst sensing series 110 and thesecond sensing series 120 can provide a normal sensing operation. In other words, thetouch panel 100 can provide a normal sensing operation. - In the
touch panel 100 of the embodiment, the conductive repairingpattern layer 130 is, for example, overlapped with two adjacentfirst sensing pads 112 in the samefirst sensing series 110, and is overlapped with at least one of the two adjacentsecond sensing pads 122 in the samesecond sensing series 120. Thus, when thefirst bridge line 114 used to connect the two adjacentfirst sensing pads 112 and thesecond bridge line 124 used to connect the two adjacentsecond sensing pads 122 has a short defect or an open defect, the conductive repairingpattern layer 130 can be used as a substitute for thefirst bridge line 114 to connect the two adjacentfirst sensing pads 112, or be used as a substitute for thesecond bridge line 124 to connect the two adjacentsecond sensing pads 122. As such, after using the conductive repairing pattern layers 130 for repairing, thefirst sensing series 110 and thesecond sensing series 120 are again electrically insulated. Therefore, thefirst sensing series 110 and thesecond sensing series 120 can provide a normal sensing operation. Thus, the touch panel of the embodiment has a favorable yield and simple repairing method, so the waste of discarding touch panels is avoided, and further reduces the touch panel production cost. - On the other hand, since the touch panel of the embodiment has a favorable yield and simple repairing method, thus the touch panel of the embodiment is suitable for manufacturing an additive touch display panels and an integrated/in cell type touch display panels. Particularly, for an integrated/in-cell type touch display panel, the invention can resolve a short defect or an open defect in the crossover region of the sensing series resulting from electrostatic discharge. In other words, the manufacturing method of the touch panel of the embodiment can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield of the touch panel.
-
FIG. 6A is a schematic top view of a touch panel according to a second embodiment of the invention.FIG. 6B is a partially enlarged schematic diagram ofFIG. 6A .FIG. 6C is schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 6B . Please simultaneously refer toFIG. 6A toFIG. 6C . In the embodiment, thetouch panel 100 includes asubstrate 102, a plurality offirst sensing series 110, a plurality of thesecond sensing series 120, a plurality of conductive repairing pattern layers 130, a firstdielectric layer 140, asecond dielectric layer 160, a plurality of peripheral connectinglines 150, and a plurality of peripheral connectingpads 152. In the embodiment, thefirst dielectric layer 140 is, for example, disposed on thesubstrate 102, and includes a plurality ofcontact windows 142. - In the embodiment, the
first sensing series 110 are disposed on thesubstrate 102 and extended along a first direction D1. Thefirst sensing series 110 includes a plurality offirst sensing pads 112 and a plurality of first bridge lines 114. Thefirst bridge lines 114 serially connect two adjacentfirst sensing pads 112. In the embodiment, thefirst sensing series 110 are, for example, disposed parallel to each other. The first direction D1 is, for example, an x-axis direction. Thefirst sensing pads 112 are, for example, disposed on thesubstrate 102 and covered by thefirst dielectric layer 140, wherein thefirst sensing pads 112, for example, correspond to twocontact windows 142. Thefirst bridge lines 114 are, for example, disposed on thefirst dielectric layer 140, and thefirst bridge line 114 fills in thecontact window 142, so that thefirst bridge lines 114 serially connect two adjacentfirst sensing pads 112 through thecontact windows 142. In the embodiment, thefirst sensing pads 112 are, for example, made of a transparent conductive material, and thefirst bridge lines 114 are, for example, made of a metallic material. - The plurality of
second sensing series 120 are disposed on thesubstrate 102 and extended along a second direction D2. Each of thesecond sensing series 120 includes a plurality ofsecond sensing pads 122 and a plurality of second bridge lines 124. Thesecond bridge lines 124 serially connect two adjacentsecond sensing pads 122. The first direction D1 is different from the second direction D2. In the embodiment, thesecond sensing series 120 are, for example, disposed parallel to each other. The second direction D2 is, for example, a y-axis direction, wherein the first direction D1 is, for example, perpendicular to the second direction D2. Thesecond sensing pads 122 and thesecond bridge lines 124 are, for example, disposed on thesubstrate 102 and covered by thefirst dielectric layer 140. In the embodiment, thesecond sensing pads 122 and thesecond bridge lines 124 are, for example, made of the same conductive layer, wherein the material is, for example, a transparent conductive material. - In the embodiment, a crossover region of the
first sensing series 110 and thesecond sensing series 120 is, for example, at thefirst bridge lines 114 and the second bridge lines 124. Thefirst dielectric layer 140 is disposed between thefirst bridge lines 114 and the second bridge lines 124. Thus, thefirst sensing series 110 and thesecond sensing series 120 are electrically insulated from each other. In addition, thetouch panel 100 further comprises a plurality ofdummy electrodes 126, disposed between thefirst sensing pads 112 and thesecond sensing pads 122. - Please simultaneously refer to
FIG. 6B andFIG. 6C . The conductive repairingpattern layer 130 is overlapped with the two adjacentfirst sensing pads 112 disposed in the samefirst sensing series 110, is overlapped with the two adjacentsecond sensing pads 122 disposed in the samesecond sensing series 120, or is overlapped with both of the above, and the conductive repairing pattern layers 130 are electrically floating. In the embodiment, the conductive repairing pattern layers 130 are, for example, disposed on thefirst dielectric layer 140. - In the embodiment, the conductive repairing
pattern layer 130 is, for example, overlapped with two adjacentfirst sensing pads 112 in the samefirst sensing series 110, and is overlapped with two adjacentsecond sensing pads 122 in the samesecond sensing series 120. In other words, the conductive repairingpattern layer 130 is, for example, simultaneously overlapped with two adjacentfirst sensing pads 112 and two adjacentsecond sensing pads 122. The conductive repairing pattern layers 130, for example, include a plurality of first repairinglines 132 and a plurality of second repairinglines 134. The first repairingline 132 is overlapped with the corresponding two adjacentfirst sensing pads 112, and the second repairingline 134 is overlapped with the corresponding two adjacentsecond sensing pads 122. In the embodiment, the first repairingline 132 and the second repairingline 134 of the conductive repairingpattern layer 130 are, for example, substantially integrated as a whole, and made up of a mesh repairing pattern layer. The mesh repairing pattern layer is overlapped with the corresponding two adjacentfirst sensing pads 112, and is overlapped with the corresponding two adjacentsecond sensing pads 122. The conductive repairing pattern layers 130 and thefirst bridge lines 114 are, for example, made up of the same layer, with a material such as a transparent conductive material or a mesh metallic material. - It should be noted that although in the embodiment the conductive repairing pattern layers 130 simultaneously overlap with two adjacent
first sensing pads 112 and two adjacentsecond sensing pads 122, and has a mesh structure, in an embodiment, the conductive repairing pattern layers 130 can also overlap with two adjacentfirst sensing pads 112 or two adjacentsecond sensing pads 122. For example, in an embodiment, the conductive repairingpattern layer 130 can comprise a first repairingline 132 or a plurality of first repairinglines 132, and the first repairingline 132 is overlapped with the corresponding two adjacentfirst sensing pads 112. In addition, even though the embodiment uses the conductive repairingpattern layer 130 shown inFIG. 6B , the conductive repairingpattern layer 130 can also have other structures; the invention is not limited thereto. - In the embodiment, the
touch panel 100 further includes asecond dielectric layer 160 disposed on thefirst dielectric layer 140 to cover thefirst sensing series 110 and thesecond sensing series 120. Thefirst dielectric layer 140 and thesecond dielectric layer 160 exposes the peripheral connectingpads 152 through thecontact windows lines 150 and the peripheral connectingpads 152 represent similar descriptions that can be referred to in the first embodiment, and thus are not reiterated herein. - Further provided is a manufacturing process of the touch panel of the invention, and
FIG. 7A toFIG. 7D are schematic partial top views illustrating the manufacturing process of a touch panel inFIG. 6A .FIG. 8A toFIG. 8D are respectively schematic cross-sectional views taken along a line I-I′, a line II-II′, and a line III-III′ inFIG. 7A toFIG. 7D . Please simultaneously refer toFIG. 7A andFIG. 8A . First, a plurality offirst sensing pads 112, a plurality ofsecond sensing pads 122, and a plurality ofsecond bridge lines 124 are formed on asubstrate 102. In the embodiment, the step further comprises forming a plurality ofdummy electrodes 126 between thefirst sensing pads 112 and thesecond sensing pads 122. In the embodiment, the step, for example, includes the following. A transparent conductive material layer (not shown) is formed on thesubstrate 102, and the transparent conductive material layer is then patterned to form thefirst sensing pads 112, thesecond sensing pads 122, thesecond bridge lines 124, and thedummy electrodes 126. Next, a metallic material layer (not shown) is formed on thesubstrate 102, and the metallic material layer is then patterned to form the peripheral connectinglines 150 and the peripheral connectingpads 152. Thesecond sensing pads 122 and thesecond bridge lines 124 electrically connected thereto form thesecond sensing series 120. - Please simultaneously refer to both
FIG. 7B andFIG. 8B . Next, a firstdielectric layer 140 is formed on thesubstrate 102 to cover thefirst sensing pads 112 and thesecond sensing series 120, wherein thefirst dielectric layer 140 has a plurality ofcontact windows 142. In the embodiment, thefirst dielectric layer 140 further covers the peripheral connectinglines 150, and exposes the peripheral connectingpads 152 through thecontact window 144. - Please simultaneously refer to
FIG. 7C andFIG. 7D ,FIG. 8C andFIG. 8D . Next, a plurality offirst bridge lines 114, a plurality of conductive repairing pattern layers 130, a plurality of peripheral connectinglines 150, and a plurality of peripheral connectingpads 152 are formed on thefirst dielectric layer 140, wherein thefirst bridge line 114 fills in the corresponding twocontact windows 142, to connect the two adjacentfirst sensing pads 112. In the embodiment, the step is, for example, first forming a metallic material layer (not shown) on thefirst dielectric layer 140 and patterning the metallic material layer, so as to form the plurality offirst bridge lines 114, the plurality of peripheral connectinglines 150, and the plurality of peripheral connectingpads 152 shown inFIG. 7C andFIG. 8C . Next, a transparent conductive material layer (not shown) is formed on thefirst dielectric layer 140 and patterned, to form the plurality of conductive repairing pattern layers 130 and the plurality of transparentconductive patterns 154 shown inFIG. 7D andFIG. 8D . - Please simultaneously refer to
FIG. 7D andFIG. 8D . Subsequently, thesecond dielectric layer 160 is formed on thesubstrate 102, to cover thefirst sensing series 110 and thesecond sensing series 120, and the manufacture of thetouch panel 100 is completed. In the embodiment, thesecond dielectric layer 160 exposes the transparentconductive pattern 154 on the peripheral connectingpads 152 through thecontact windows 162. - The invention provides a repairing method for repairing the
aforementioned touch panel 100 when the crossover region of thefirst bridge line 114 of thefirst sensing series 110 and the second bridge line of thesecond sensing series 120 has a short defect or an open defect.FIG. 9A andFIG. 9B are schematic top views depicting a repairing method of thetouch panel 100 inFIG. 6A when the crossover region of thefirst bridge line 114 and thesecond bridge line 124 has a short defect or an open defect. Please refer toFIG. 9A . First, thefirst bridge line 114 with the defect is cut, therefore two adjacentfirst sensing pads 112 originally connected through thefirst bridge line 114 are electrically insulated. The method of cutting thefirst bridge line 114 with the defect is, for example, using a laser cutting process, and the method of cutting thefirst bridge line 114 is, for example, cutting the connecting part between thefirst bridge line 114 and thefirst sensing pad 112. As such, the two adjacentfirst sensing pads 112 are electrically insulated. - Please refer to
FIG. 9B . Next, the two adjacentfirst sensing pads 112 electrically insulated are electrically connected through the conductive repairingpattern layer 130 overlapped with the two adjacentfirst sensing pads 112. In the embodiment, a laser welding method, for instance, is used to weld the conductive repairingpattern layer 130 and the two adjacentfirst sensing pads 112, so awelding point 170 is formed where the conductive repairingpattern layer 130 is overlapped with two adjacentfirst sensing pads 112. In detail, for instance, the first repairingline 132 of the conductive repairingpattern layer 130 is welded with the two adjacentfirst sensing pads 112, so that thewelding point 170 is formed where the first repairingline 132 is overlapped with the two adjacentfirst sensing pads 112. As such, the two adjacentfirst sensing pads 112 use the electrical connection between thewelding point 170 and the conductive repairing pattern layers 130, so that the two adjacentfirst sensing pads 112 use the path inFIG. 9B to connect electrically. Therefore, thefirst sensing series 110 can provide a normal sensing operation. In addition, since thefirst bridge line 114 with the defect is electrically insulated from thefirst sensing series 110 after repairing, thus thefirst sensing series 110 and thesecond sensing series 120 are again electrically insulated. Therefore, thefirst sensing series 110 and thesecond sensing series 120 can provide a normal sensing operation. In other words, thetouch panel 100 can provide a normal sensing operation. - On the other hand, when the crossover region of the
first bridge line 114 of thefirst sensing series 110 and thesecond bridge line 124 of thesecond sensing series 120 has a short defect or an open defect, the repairing method may also havesecond bridge line 124 cut and may weld the conductive repairing pattern layers 130 with the two adjacentsecond sensing pads 122. Since this repairing method and the repairing method of cutting thefirst bridge line 114 is the same, the description is not reiterated herein. - In the
touch panel 100 of the embodiment, the conductive repairingpattern layer 130 is, for example, overlapped with two adjacentfirst sensing pads 112 in the samefirst sensing series 110, and is overlapped with at least one of the two adjacentsecond sensing pads 122 in the samesecond sensing series 120. Thus, when thefirst bridge line 114 used to connect the two adjacentfirst sensing pads 112 and thesecond bridge line 124 used to connect the two adjacentsecond sensing pads 122 has a short defect or an open defect, the conductive repairingpattern layer 130 can be used as a substitute for thefirst bridge line 114 to connect the two adjacentfirst sensing pads 112, or be used as a substitute for thesecond bridge line 124 to connect the two adjacentsecond sensing pads 122. As such, after using the conductive repairing pattern layers 130 for repairing, thefirst sensing series 110 and thesecond sensing series 120 are again electrically insulated. Therefore, thefirst sensing series 110 and thesecond sensing series 120 can provide a normal sensing operation. Thus, the touch panel of the embodiment has a favorable yield and simple repairing method, so the waste of discarding touch panels is avoided, and further reduces the touch panel production cost. - On the other hand, since the touch panel of the embodiment has a favorable yield and simple repairing method, thus the touch panel of the embodiment is suitable for manufacturing an additive touch display panels and an integrated/in cell type touch display panels. Particularly, for an integrated/in-cell type touch display panel, the invention can resolve a short defect or an open defect in the crossover region of the sensing series resulting from electrostatic discharge. In other words, the manufacturing method of the touch panel of the embodiment can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield rate of the touch panel.
- Generally, in the touch panel and repairing method of the invention, each of the conductive repairing pattern layers is overlapped with two adjacent sensing pads in the same sensing series. As such, when the crossover region of the two sensing series has a short defect or an open defect, the conductive repairing pattern layers can be used to repair the defects, so the two sensing series can provide a normal sensing operation. As a result, the touch panel has a favorable yield and simple repair method. More particularly, since the touch panel of the invention is easily repaired, thus, it is especially suitable for manufactured integrated/in-cell type touch display panels, so as to solve the short defect or the open defect in the crossover region of the touch sensing series caused by the manufacture of color filter thin films. Thus, the manufacturing method of the touch panel of the invention can pair with current color filter substrate manufacturing processes, and at the same time substantially raise the yield of the touch panel.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (25)
1. A touch panel, comprising:
a substrate;
a plurality of first sensing series, disposed on the substrate and extended along a first direction, wherein each of the first sensing series includes a plurality of first sensing pads and a plurality of first bridge lines, and the first bridge lines serially connect two adjacent first sensing pads;
a plurality of second sensing series, disposed on the substrate and extended along a second direction, wherein each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines, the second bridge lines serially connect two adjacent second sensing pads, the first direction is different from the second direction, and the plurality of first sensing series and the plurality of second sensing series are electrically insulated from each other; and
a plurality of conductive repairing pattern layers, wherein each of the conductive repairing pattern layers is overlapped with two adjacent first sensing pads in the same first sensing series, and the conductive repairing pattern layers are electrically floating.
2. The touch panel as claimed in claim 1 , further comprising a first dielectric layer, disposed on the substrate to cover the conductive repairing pattern layers, wherein the first dielectric layer includes a plurality of contact windows, and the first sensing pads and the second sensing pads are disposed on the first dielectric layer.
3. The touch panel as claimed in claim 2 , wherein the first dielectric layer further covers the first bridge lines, the first sensing pads connect to the first bridge lines through the contact windows, and the second bridge lines are disposed on the first dielectric layer.
4. The touch panel as claimed in claim 2 , wherein the first dielectric layer further covers the second bridge lines, the second sensing pads connect to the second bridge lines through the contact windows, and the first bridge lines are disposed on the first dielectric layer.
5. The touch panel as claimed in claim 2 , further comprising a second dielectric layer, disposed on the first dielectric layer to cover the first sensing series and the second sensing series.
6. The touch panel as claimed in claim 1 , further comprising a first dielectric layer, disposed on the substrate to cover the first sensing pads and the second sensing pads, wherein the first dielectric layer includes a plurality of contact windows, and the conductive repairing pattern layers are disposed on the first dielectric layer.
7. The touch panel as claimed in claim 6 , wherein the first dielectric layer further covers the first bridge lines, the second bridge lines are disposed on the first dielectric layer, and the second sensing pads connect to the second bridge lines through the contact windows.
8. The touch panel as claimed in claim 6 , wherein the first dielectric layer further covers the second bridge lines, the first bridge lines are disposed on the first dielectric layer, and the first sensing pads connect to the first bridge lines through the contact windows.
9. The touch panel as claimed in claim 1 , wherein a material of the conductive repairing pattern layers comprises a transparent conductive material.
10. The touch panel as claimed in claim 1 , wherein a material of the conductive repairing pattern layers comprises a metallic conductive material.
11. The touch panel as claimed in claim 1 , wherein the first bridge lines and the conductive repairing pattern layers are made up of the same layer.
12. The touch panel as claimed in claim 1 , wherein the second bridge lines and the conductive repairing pattern layers are made up of the same layer.
13. The touch panel as claimed in claim 1 , wherein a material of the first sensing pads, a material of the first bridge lines and a material of the second sensing pads are the same.
14. The touch panel as claimed in claim 1 , wherein each of the conductive repairing pattern layers comprises a mesh repairing pattern layer, the mesh repairing pattern layer is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
15. The touch panel as claimed in claim 1 , wherein each of the conductive repairing pattern layers comprises a plurality of first repairing lines electrically connected, and each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads.
16. The touch panel as claimed in claim 1 , wherein each of the conductive repairing pattern layers is further overlapped with two adjacent second sensing pads in the same second sensing series.
17. The touch panel as claimed in claim 16 , wherein each of the conductive repairing pattern layers comprises a plurality of first repairing lines electrically connected and a plurality of second repairing lines electrically connected, each of the first repairing lines is overlapped with the corresponding two adjacent first sensing pads, each of the second repairing lines is overlapped with the corresponding two adjacent second sensing pads, and the first repairing lines are electrically connected to the second repairing lines.
18. The touch panel as claimed in claim 1 , further comprising a plurality of dummy electrodes, disposed between the first sensing pads and the second sensing pads.
19. The touch panel as claimed in claim 1 , further comprising a plurality of peripheral connecting lines, electrically connected to corresponding first sensing series and corresponding second sensing series respectively.
20. A repairing method for repairing a touch panel, suitable to repair the touch panel as claimed in claim 1 when a short defect or an open defect occurs in a crossover region of a first bridge line and a second bridge line of the touch panel, the repairing method comprising:
cutting the first bridge line with the defect, therefore two adjacent first sensing pads originally connected through the first bridge line to be electrically insulated; and
electrically connecting the two adjacent first sensing pads electrically insulated through a conductive repairing pattern layer overlapped with the two adjacent first sensing pads.
21. The touch panel repair method as claimed in claim 20 , wherein a method of cutting the first bridge line with the defect includes a laser cutting process.
22. The touch panel repair method as claimed in claim 20 , wherein a method of electrically connecting the two adjacent first sensing pads electrically insulated through the conductive repairing pattern layer overlapped with the two adjacent first sensing pads includes welding the conductive repairing pattern layer with the two adjacent first sensing pads.
23. The touch panel repair method as claimed in claim 22 , wherein a method of welding includes a laser welding process.
24. A touch panel, comprising:
a substrate;
a plurality of first bridge lines, disposed on the substrate, and extended along a first direction;
a plurality of conductive repairing pattern layers, disposed on the substrate, wherein the conductive repairing pattern layers are electrically floating;
a first dielectric layer, disposed on the substrate to cover the conductive repairing pattern layers and the first bridge lines, wherein the first dielectric layer includes a plurality of contact windows, and each of the first bridge lines corresponds to two or more contact windows;
a plurality of first sensing pads, disposed on the first dielectric layer, wherein the first bridge lines serially connect the two adjacent first sensing pads through the contact windows, and the first sensing pads and the first bridge lines form a plurality of first sensing series arranged in parallel; and
a plurality of second sensing series, arranged in parallel and disposed on the dielectric layer, and extended along a second direction, wherein each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines, the second bridge lines serially connect two adjacent second sensing pads, and the first direction is different from the second direction, wherein the first sensing series and the second sensing series are electrically insulated from each other,
wherein each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
25. A touch panel, comprising:
a substrate;
a plurality of first sensing pads, disposed on the substrate and extended along a first direction;
a plurality of second sensing series, arranged in parallel and disposed on the substrate, and extended along a second direction, wherein each of the second sensing series includes a plurality of second sensing pads and a plurality of second bridge lines, the second bridge lines serially connect two adjacent second sensing pads, the first direction is different from the second direction, and the first sensing pads and the second sensing series are electrically insulated from each other;
a first dielectric layer, disposed on the substrate to cover the first sensing pads and the second sensing series, wherein the first dielectric layer includes a plurality of contact windows, and each of the first sensing pads corresponds to two contact windows;
a plurality of first bridge lines, disposed on the first dielectric layer along a first direction, wherein the first bridge lines serially connect the two adjacent first sensing pads through the contact windows to form a plurality of first sensing series arranged in parallel; and
a plurality of conductive repairing patterns, disposed on the first dielectric layer, wherein the conductive repairing patterns are electrically floating, each of the conductive repairing pattern layers is overlapped with the corresponding two adjacent first sensing pads, and is overlapped with the corresponding two adjacent second sensing pads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW099133743A TWI423092B (en) | 2010-10-04 | 2010-10-04 | Touch panel and repairing method thereof |
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Also Published As
Publication number | Publication date |
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US20160370900A1 (en) | 2016-12-22 |
TWI423092B (en) | 2014-01-11 |
US9823801B2 (en) | 2017-11-21 |
TW201216128A (en) | 2012-04-16 |
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