US20120080167A1 - Heat dissipating apparatus - Google Patents

Heat dissipating apparatus Download PDF

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Publication number
US20120080167A1
US20120080167A1 US13/155,540 US201113155540A US2012080167A1 US 20120080167 A1 US20120080167 A1 US 20120080167A1 US 201113155540 A US201113155540 A US 201113155540A US 2012080167 A1 US2012080167 A1 US 2012080167A1
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US
United States
Prior art keywords
base
side plate
heat dissipating
fins
dissipating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/155,540
Inventor
Wen-Chang Gao
Jian Fu
Zhi-Jiang Yao
Li-Fu Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FU, JIAN, GAO, WEN-CHANG, XU, LI-FU, YAO, ZHI-JIANG
Publication of US20120080167A1 publication Critical patent/US20120080167A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to heat dissipating apparatuses.
  • a heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated by electronic components in the electronic device.
  • the heat dissipating module comprises a cooler and a fan.
  • the cooler is secured to an electronic component and comprises a plurality of fins. An airflow path is defined between each two adjacent fins, and the fan is located in the path of the airflow, to remove heat from the electronic device.
  • the cooler fixed directly and entirely on the one electronic component, the cooler itself will block airflow to cool the other electronic components behind the cooler, which is inefficient.
  • FIG. 1 is an assembled, isometric view of a heat dissipation apparatus and a computer in accordance with one embodiment.
  • FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the computer of FIG. 1 .
  • FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1 .
  • FIG. 4 is an exploded, isometric view of FIG. 3 .
  • FIG. 5 is a cross section view of the heat dissipation apparatus of FIG. 3 .
  • a heat dissipation apparatus 100 in accordance with an embodiment is secured to a computer 30 .
  • the computer 30 includes a bottom plate 31 and a main board 50 .
  • the main board 50 is secured to the bottom plate 31 and defines a plurality of positioning holes 53 .
  • An electronic component 51 is secured to the main board 50 .
  • the main board 50 may be a motherboard, and the electronic component 51 may be a CPU.
  • the heat dissipating apparatus 100 includes a cooler 10 , two heat pipes 19 , a fan 20 , and a base 40 .
  • the cooler 10 includes a shell 60 and a plurality of fins 16 .
  • the shell 60 includes a top plate 13 , a first side plate 15 , and a second side plate 17 .
  • the top plate 13 is substantially perpendicular to the first side plate 15 and the second side plate 17
  • the first side plate 15 is substantially parallel to the second side plate 17 .
  • the first side plate 15 defines two openings 151 and a notch 153 .
  • the notch 153 extends from a bottom edge of the first side plate 15 .
  • a plurality of mounting pieces 18 extends from a side edge of each of the first side plate 15 and the second side plate 17 . Each mounting piece 18 defines a mounting hole 181 .
  • the fins 16 are received in the shell 60 and enclosed by the top plate 13 , the first side plate 15 , and the second side plate 17 .
  • Each fin 16 defines two receiving holes 161 , and the receiving holes 161 correspond to the openings 151 .
  • Each fin 16 defines two first receiving slots 163 .
  • the two first receiving slots 163 correspond to the notch 153 .
  • the cross-section of each first receiving slot 163 is semicircular.
  • Each heat pipe 19 includes a first body 191 , a second body 193 , and a third body 195 .
  • the heat pipes 19 are generally substantially “U” shaped.
  • the second body 193 is connected between the first body 191 and the third body 195 .
  • a length of the first body 191 is longer than a distance between the first side plate 15 and the second side plate 17
  • a length of the third body 195 is substantially equal to the distance between the first side plate 15 and the second side plate 17 .
  • a first angle is defined between the first body 191 and the second body 193 . In one embodiment, the first angle is acute. In one embodiment, a cross-section of each heat pipe is round.
  • the cooling fan 20 defines a plurality of through holes 21 .
  • the base 40 defines two second receiving slots 43 and a plurality of locking holes 41 .
  • the locking holes 41 correspond to the positioning holes 53 .
  • a cross-section of each second receiving slot 43 is semicircular.
  • the cooler 10 is secured to the base 40 , and the first receiving slots 163 are aligned with the second receiving slots 43 .
  • the first side plate 15 is secured to the base 40 and located between a first edge of the base 40 and a second edge of the base 40 .
  • the second end of the base 40 is substantially parallel to the first edge of the base 40 and located between the second side plate 17 and the first side plate 15 .
  • the fins 16 are partially overlapping the base 40 .
  • the first body 191 is received in the first receiving slot 163 and the second receiving slot 43 and sandwiched between the base 40 and the fins 16 .
  • the third body 195 is inserted through the opening 151 and the receiving holes 161 .
  • the second body 193 is located in a corner between the base 40 and the first side plate 15 .
  • a second angle is defined between the second body 193 and the third body 195 .
  • the second angle is obtuse.
  • a plurality of locking members (not labeled), such as screws, is inserted into the locking holes 41 and the corresponding positioning holes 53 , so that the base 40 is secured to the main board 50 on the electronic component 51 .
  • heat generated by the electronic component 51 is transferred to the first body 191 by the base 40 .
  • the first body 191 transfers the heat along a first direction, which is towards the cooler 10 , and to the second body 193 along a second direction.
  • the second body 193 transfers the heat to the fins 16 via the third body 195 .
  • the cooling fan 20 removes the heat from the cooler 10 , and the electronic component 51 is cooled thereby.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating apparatus includes a base and a heat pipe. A plurality of fins partially overlaps the base; the heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body; the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins.

Description

    REARGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipating apparatuses.
  • 2. Description of Related Art
  • A heat dissipating module is mounted on a motherboard of an electronic device, such as a computer or a server, for dissipating heat generated by electronic components in the electronic device. Generally, the heat dissipating module comprises a cooler and a fan. The cooler is secured to an electronic component and comprises a plurality of fins. An airflow path is defined between each two adjacent fins, and the fan is located in the path of the airflow, to remove heat from the electronic device. However, with the cooler fixed directly and entirely on the one electronic component, the cooler itself will block airflow to cool the other electronic components behind the cooler, which is inefficient.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a heat dissipation apparatus and a computer in accordance with one embodiment.
  • FIG. 2 is an exploded, isometric view of the heat dissipation apparatus and the computer of FIG. 1.
  • FIG. 3 is an assembled, isometric view of the heat dissipation apparatus of FIG. 1.
  • FIG. 4 is an exploded, isometric view of FIG. 3.
  • FIG. 5 is a cross section view of the heat dissipation apparatus of FIG. 3.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIG. 1 and FIG. 2, a heat dissipation apparatus 100 in accordance with an embodiment is secured to a computer 30.
  • The computer 30 includes a bottom plate 31 and a main board 50. The main board 50 is secured to the bottom plate 31 and defines a plurality of positioning holes 53. An electronic component 51 is secured to the main board 50. In one embodiment, the main board 50 may be a motherboard, and the electronic component 51 may be a CPU.
  • Referring to FIG. 3 and FIG. 4, the heat dissipating apparatus 100 includes a cooler 10, two heat pipes 19, a fan 20, and a base 40.
  • The cooler 10 includes a shell 60 and a plurality of fins 16. The shell 60 includes a top plate 13, a first side plate 15, and a second side plate 17. In one embodiment, the top plate 13 is substantially perpendicular to the first side plate 15 and the second side plate 17, and the first side plate 15 is substantially parallel to the second side plate 17. The first side plate 15 defines two openings 151 and a notch 153. The notch 153 extends from a bottom edge of the first side plate 15. A plurality of mounting pieces 18 extends from a side edge of each of the first side plate 15 and the second side plate 17. Each mounting piece 18 defines a mounting hole 181. The fins 16 are received in the shell 60 and enclosed by the top plate 13, the first side plate 15, and the second side plate 17. Each fin 16 defines two receiving holes 161, and the receiving holes 161 correspond to the openings 151. Each fin 16 defines two first receiving slots 163. The two first receiving slots 163 correspond to the notch 153. In one embodiment, the cross-section of each first receiving slot 163 is semicircular.
  • Each heat pipe 19 includes a first body 191, a second body 193, and a third body 195. In one embodiment, the heat pipes 19 are generally substantially “U” shaped. The second body 193 is connected between the first body 191 and the third body 195. A length of the first body 191 is longer than a distance between the first side plate 15 and the second side plate 17, and a length of the third body 195 is substantially equal to the distance between the first side plate 15 and the second side plate 17. A first angle is defined between the first body 191 and the second body 193. In one embodiment, the first angle is acute. In one embodiment, a cross-section of each heat pipe is round. The cooling fan 20 defines a plurality of through holes 21.
  • The base 40 defines two second receiving slots 43 and a plurality of locking holes 41. The locking holes 41 correspond to the positioning holes 53. In one embodiment, a cross-section of each second receiving slot 43 is semicircular.
  • In assembly, the cooler 10 is secured to the base 40, and the first receiving slots 163 are aligned with the second receiving slots 43. The first side plate 15 is secured to the base 40 and located between a first edge of the base 40 and a second edge of the base 40. The second end of the base 40 is substantially parallel to the first edge of the base 40 and located between the second side plate 17 and the first side plate 15. The fins 16 are partially overlapping the base 40. The first body 191 is received in the first receiving slot 163 and the second receiving slot 43 and sandwiched between the base 40 and the fins 16. The third body 195 is inserted through the opening 151 and the receiving holes 161. The second body 193 is located in a corner between the base 40 and the first side plate 15. A second angle is defined between the second body 193 and the third body 195. In one embodiment, the second angle is obtuse. A plurality of locking members (not labeled), such as screws, is inserted into the locking holes 41 and the corresponding positioning holes 53, so that the base 40 is secured to the main board 50 on the electronic component 51.
  • In use, heat generated by the electronic component 51 is transferred to the first body 191 by the base 40. The first body 191 transfers the heat along a first direction, which is towards the cooler 10, and to the second body 193 along a second direction. The second body 193 transfers the heat to the fins 16 via the third body 195. The cooling fan 20 removes the heat from the cooler 10, and the electronic component 51 is cooled thereby.
  • It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A heat dissipating apparatus comprising:
a base;
a cooler, secured to the base, comprising a first side plate, a second side plate and a plurality of fins secured between the first side plate and the second side plate; and
a heat pipe comprising a first body, a second body and a third body, the first body and the third body are secured to the cooler, and the second body is connected between the first body and the third body;
wherein the first side plate is secured to the base and located between a first edge of the base and a second edge of the base, the second end of the base is located between the second side plate and the first side plate, and the second body is located in a corner between the base and the first side plate.
2. The heat dissipating apparatus of claim 1, wherein a first angle is defined between the first body and the second body, and the first angle is acute.
3. The heat dissipating apparatus of claim 1, wherein a second angle is defined between the second body and the third body, and the second angle is obtuse.
4. The heat dissipating apparatus of claim 1, wherein the first side plate and the second side plate are substantially perpendicular to the base.
5. The heat dissipating apparatus of claim 1, wherein a length of the first body is greater than a distance between the first side plate and the second side plate.
6. The heat dissipating apparatus of claim 1, wherein the first edge of the base is substantially parallel to the second edge of the base.
7. The heat dissipating apparatus of claim 1, wherein the first body is substantially parallel to the third body.
8. The heat dissipating apparatus of claim 1, wherein each of the plurality of fins defines a receiving hole, and the third body is located in the receiving holes of the plurality of fins.
9. The heat dissipating apparatus of claim 8, wherein the first side plate defines an opening, the opening is aligned with the receiving holes of the plurality of fins, and the first body is engaged in the opening.
10. The heat dissipating apparatus of claim 1, wherein the base defines a first receiving slot, each of the plurality of fins defines a second receiving slot, and the first body is located in the first receiving slot and the second receiving slot.
11. A heat dissipating apparatus comprising:
a base;
a plurality of fins partially overlapping the base; and
a heat pipe comprising a first body, a second body and a third body, the second body connected between the first body and the third body;
wherein the first body is secured between the plurality of fins and the base, the third body is secured to the plurality of fins, and the second body is located in a first corner between the base and the plurality of fins.
12. The heat dissipating apparatus of claim 11, wherein a first angle is defined between the first body and the second body, and the first angle is acute.
13. The heat dissipating apparatus of claim 11, wherein a second angle is defined between the second body and the third body, and the second angle is obtuse.
14. The heat dissipating apparatus of claim 11, wherein the first body is substantially parallel to the third body.
15. The heat dissipating apparatus of claim 11, wherein the plurality of fins is located in a shell, and the shell comprises a first side plate and a second side plate, the first side plate is secured to the base and located between a first edge of the base and a second edge of the base, the second end of the base is located between the second side plate and the first side plate, and the second body is located in a second corner between the first side plate and the base.
16. The heat dissipating apparatus of claim 15, wherein each of the plurality of fins defines a receiving hole, and the third body is located in the receiving holes of the plurality of fins.
17. The heat dissipating apparatus of claim 16, wherein the first side plate defines an opening, and the opening is aligned with the receiving holes of the plurality of fins, and the first body is engaged in the opening.
18. The heat dissipating apparatus of claim 15, wherein the first edge of the base is substantially parallel to the second edge of the base.
19. The heat dissipating apparatus of claim 15, wherein a length of the first body is greater than a distance between the first side plate and the second side plate.
20. The heat dissipating apparatus of claim 11, wherein the base defines a first receiving slot, each of the plurality of fins defines a second receiving slot, and the first body is located in the first receiving slot and the second receiving slot.
US13/155,540 2010-09-30 2011-06-08 Heat dissipating apparatus Abandoned US20120080167A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2010102981687A CN102446871A (en) 2010-09-30 2010-09-30 Heat radiating device
CN201010298168.7 2010-09-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021071760A1 (en) * 2019-10-07 2021-04-15 Nvidia Corporation Shroud for an integrated circuit heat exchanger

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5978219A (en) * 1998-03-09 1999-11-02 Lin; Liken Heat dissipating device
US20060028798A1 (en) * 2004-08-06 2006-02-09 Jun-Qian Wang Heat-radiating device assembly
US7100681B1 (en) * 2005-10-31 2006-09-05 Foxconn Technology Co., Ltd. Heat dissipation device having heat pipe
US7286353B2 (en) * 2004-12-04 2007-10-23 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US7363963B2 (en) * 2004-12-24 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5978219A (en) * 1998-03-09 1999-11-02 Lin; Liken Heat dissipating device
US20060028798A1 (en) * 2004-08-06 2006-02-09 Jun-Qian Wang Heat-radiating device assembly
US7286353B2 (en) * 2004-12-04 2007-10-23 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US7363963B2 (en) * 2004-12-24 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device
US7100681B1 (en) * 2005-10-31 2006-09-05 Foxconn Technology Co., Ltd. Heat dissipation device having heat pipe
US20080105409A1 (en) * 2006-11-03 2008-05-08 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021071760A1 (en) * 2019-10-07 2021-04-15 Nvidia Corporation Shroud for an integrated circuit heat exchanger
CN114556040A (en) * 2019-10-07 2022-05-27 辉达公司 Shroud for integrated circuit heat exchanger
US11523539B2 (en) * 2019-10-07 2022-12-06 Nvidia Corporation Shroud for an integrated circuit heat exchanger

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Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GAO, WEN-CHANG;FU, JIAN;YAO, ZHI-JIANG;AND OTHERS;REEL/FRAME:026407/0870

Effective date: 20110607

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

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Effective date: 20110607

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