US20100300662A1 - Heat dissipating device and fixing bracket thereof - Google Patents
Heat dissipating device and fixing bracket thereof Download PDFInfo
- Publication number
- US20100300662A1 US20100300662A1 US12/494,284 US49428409A US2010300662A1 US 20100300662 A1 US20100300662 A1 US 20100300662A1 US 49428409 A US49428409 A US 49428409A US 2010300662 A1 US2010300662 A1 US 2010300662A1
- Authority
- US
- United States
- Prior art keywords
- base
- fixing
- fan
- fixing element
- airflow opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipating devices, and particularly to a heat dissipating device having a fixing bracket.
- a heat dissipation device includes a heat sink and a fan to cool heat-generating components such as central processing units (CPUs).
- a fan is generally fixed on the heat sink via a fixing bracket.
- the fixing bracket can only accommodate the fan at a single position, which does not allow fixing the fan at other positions if needed to improve heat dissipation.
- FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipating device, the heat dissipating device including a fixing bracket.
- FIG. 2 is an enlarged view of a circled portion II of FIG. 1 .
- FIG. 3 is an enlarged view of a circled portion III of FIG. 1 .
- FIG. 4 is an assembled, isometric view of the fixing bracket of FIG. 1 .
- FIG. 5 is an assembled, isometric view of the heat dissipating device of FIG. 1 .
- an exemplary embodiment of a heat dissipating device 1 for an electronic element such as a central processing unit (CPU)
- a heat sink 2 to be mounted on the CPU to absorb heat from the CPU
- a fan 3 to absorb heat from the CPU
- a fixing bracket 4 to fix the fan 3 to the heat sink 2 .
- the fixing bracket 4 includes a first fixing element 10 and two second fixing elements 20 engaged with opposite sides of the first fixing element 10 .
- the first fixing element 10 includes a first base 12 and two panels 14 perpendicularly mounted on the first base 12 near two ends of the first base 12 .
- a first accommodating space 16 is bounded by the first base 12 and the panels 14 , for receiving the fan 3 .
- Two bars 121 perpendicularly extend down from opposite sides of a bottom of the first base 12 .
- a T-shaped sliding slot 1211 is horizontally defined in each bar 121 .
- An airflow opening 122 is defined in a center of the first base 12 , corresponding to the heat sink 2 .
- a locking portion 142 projects inward from an upper portion of each panel 14 .
- Two first ribs are mounted between each panel 14 and the first base 12 , to reinforce the corresponding panel 14 .
- Each second fixing element 20 includes a second base 22 and three resilient latching elements 21 .
- the second base 22 includes a first surface 222 , a second surface 224 opposite to the first surface 222 , and two lateral surfaces 226 connected between corresponding sides of the first and second surfaces 222 , 224 .
- An airflow opening 223 is defined in a center of the second base 22 , extending through the first and second surfaces 222 , 224 .
- Two opposite horizontal sliding paths 227 are defined in upper portions of the first and second surfaces 222 , 224 , respectively; therefore, a T-shaped sliding portion 228 corresponding to the sliding slot 1211 of the first base 12 is formed on the second base 22 , between the sliding paths 227 .
- Three pairs of locking holes 225 are defined in the second base 22 . Two of the three pairs of locking holes 225 are located at opposite sides of the airflow opening 223 , the remaining pair is located below the airflow opening 223 .
- a locking portion 2242 perpendicularly extends from a bottom of the second surface 224 of the second base 22 .
- Each latching element 21 is L-shaped, and includes a fixing portion 211 and a locating portion 212 perpendicularly extending from a first end of the fixing portion 211 .
- a second rib 2112 is positioned between the fixing portion 211 and the locating portion 212 to reinforce the locating portion 211 .
- a latching block 2114 perpendicularly extends from a second end opposite to the first end of the fixing portion 211 , away from the locating portion 212 .
- a pair of through holes 2121 corresponding to a corresponding pair of locking holes 225 of the second base is defined in the locating portion 212 , located at opposite sides of the second rib 2112 .
- each latching element 21 is mounted to the second base 22 , via a pair of screws 50 extending through the pair of through holes 2121 of the latching element 21 to be engaged in the corresponding pair of locking holes 225 of the second base 22 . Therefore, the latching elements 21 are fixed to the first surface 222 of the second base 22 , with two latching elements 21 located at opposite sides of the airflow opening 223 , and a latching element 21 located below the airflow opening 223 .
- a second accommodating space 26 is bounded by the latching elements 21 and the second base 22 , for receiving the fan 3 .
- the second bases 22 are engaged in the corresponding sliding slots 1211 of the first base 12 , via the sliding portions 228 of the second bases 22 sliding into the sliding slots 1211 of the first base 12 . Therefore, the second fixing elements 20 are mounted to the first fixing element 10 .
- a receiving space 40 is bounded by the first base 12 of the first fixing element 10 and the two second bases 22 of the two fixing elements 20 .
- the locking portions 2242 of the two fixing elements 20 are oppositely set to fix the heat sink 2 .
- the second bases 22 are deformed away from each other, the heat sink 2 is placed in the receiving space 40 of the fixing bracket 4 .
- the second bases 22 are released to restore towards each other, to sandwich the heat sink 2 therebetween.
- the locking portion 2242 of the two second bases 22 respectively resiliently resist against two sides of a bottom of the heat sink 2 . Therefore, the heat sink 2 can be fixed to the fixing bracket 4 conveniently.
- the fan 3 can be fixed to the first fixing element 10 or each of the second fixing elements 20 . Fixing modes of the first fixing element 10 and each of the second fixing elements 20 are the same.
- the fan 3 fixed to a second fixing element 20 is described as an example.
- the latching elements 21 at opposite sides of the airflow opening 223 are deformed away from each other, the fan 3 is placed in the second accommodating space 26 , and supported on the latching element 21 below the airflow opening 223 .
- the latching elements 21 are released to restore towards each other.
- the latching blocks 2114 of the latching elements 21 respectively resiliently resist against edges of a surface of the fan 3 opposite to the airflow opening 223 . Therefore, the fan 3 is fixed to the second fixing element 20 .
- heat absorbed by the heat sink 2 can be removed by the fan 40 through the airflow openings 223 of the second bases 22 .
- the fan 3 can bring air flow to the heat sink 10 through the airflow openings 223 of the second bases 22 of the second fixing element 20 .
- the latching elements 21 of the fixing bracket 4 are deformed away from each other, with the latching blocks 2114 of the latching elements 21 respectively departing from the side surfaces of the fan 3 . Therefore, the fan 3 can be conveniently removed from the second accommodating space 26 of the fixing bracket 4 .
- the two second bases 22 of the fixing bracket 4 are deformed away from each other, with the locking portions 2242 of the two second bases 22 respectively disengaging from the bottom of the heat sink 2 . Therefore, the heat sink 2 can be conveniently removed from the receiving space 40 of the fixing bracket 4 .
- the second fixing elements 20 can be moved relative to the first fixing element 10 . Therefore, the fan 3 can be fixed to other positions of the fixing bracket 4 .
- the sliding slot 1211 of the first fixing element 10 can be omitted, therefore, the two second fixing elements 20 are fixedly mounted to the opposite sides of the first base 12 .
- the latching elements 21 can be other shapes, where the fixing mode for fixing the latching elements 21 to the second bases 22 can be changed according to shapes of the latching elements 21 .
- the latching elements 21 can be shaped to fix on the second bases 22 to fix the fan 3 on the second bases 22 .
- the number of the latching elements 21 can be changed.
- the latching elements 21 can also be omitted, and the fan 3 fixed to the second bases 22 or the first base 12 indirectly via fasteners.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat dissipating devices, and particularly to a heat dissipating device having a fixing bracket.
- 2. Description of Related Art
- Generally speaking, a heat dissipation device includes a heat sink and a fan to cool heat-generating components such as central processing units (CPUs). A fan is generally fixed on the heat sink via a fixing bracket. However, the fixing bracket can only accommodate the fan at a single position, which does not allow fixing the fan at other positions if needed to improve heat dissipation.
-
FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat dissipating device, the heat dissipating device including a fixing bracket. -
FIG. 2 is an enlarged view of a circled portion II ofFIG. 1 . -
FIG. 3 is an enlarged view of a circled portion III ofFIG. 1 . -
FIG. 4 is an assembled, isometric view of the fixing bracket ofFIG. 1 . -
FIG. 5 is an assembled, isometric view of the heat dissipating device ofFIG. 1 . - Referring to
FIGS. 1 to 4 , an exemplary embodiment of aheat dissipating device 1 for an electronic element, such as a central processing unit (CPU), includes aheat sink 2 to be mounted on the CPU to absorb heat from the CPU, afan 3, and afixing bracket 4 to fix thefan 3 to theheat sink 2. - The
fixing bracket 4 includes afirst fixing element 10 and twosecond fixing elements 20 engaged with opposite sides of thefirst fixing element 10. - The
first fixing element 10 includes afirst base 12 and twopanels 14 perpendicularly mounted on thefirst base 12 near two ends of thefirst base 12. A firstaccommodating space 16 is bounded by thefirst base 12 and thepanels 14, for receiving thefan 3. Twobars 121 perpendicularly extend down from opposite sides of a bottom of thefirst base 12. A T-shapedsliding slot 1211 is horizontally defined in eachbar 121. Anairflow opening 122 is defined in a center of thefirst base 12, corresponding to theheat sink 2. Alocking portion 142 projects inward from an upper portion of eachpanel 14. Two first ribs are mounted between eachpanel 14 and thefirst base 12, to reinforce thecorresponding panel 14. - Each
second fixing element 20 includes asecond base 22 and threeresilient latching elements 21. Thesecond base 22 includes afirst surface 222, a second surface 224 opposite to thefirst surface 222, and twolateral surfaces 226 connected between corresponding sides of the first andsecond surfaces 222, 224. Anairflow opening 223 is defined in a center of thesecond base 22, extending through the first andsecond surfaces 222, 224. Two opposite horizontalsliding paths 227 are defined in upper portions of the first andsecond surfaces 222, 224, respectively; therefore, a T-shaped slidingportion 228 corresponding to thesliding slot 1211 of thefirst base 12 is formed on thesecond base 22, between thesliding paths 227. Three pairs oflocking holes 225 are defined in thesecond base 22. Two of the three pairs oflocking holes 225 are located at opposite sides of the airflow opening 223, the remaining pair is located below the airflow opening 223. Alocking portion 2242 perpendicularly extends from a bottom of the second surface 224 of thesecond base 22. - Each
latching element 21 is L-shaped, and includes afixing portion 211 and a locatingportion 212 perpendicularly extending from a first end of thefixing portion 211. Asecond rib 2112 is positioned between thefixing portion 211 and the locatingportion 212 to reinforce the locatingportion 211. Alatching block 2114 perpendicularly extends from a second end opposite to the first end of thefixing portion 211, away from the locatingportion 212. A pair of throughholes 2121 corresponding to a corresponding pair oflocking holes 225 of the second base is defined in the locatingportion 212, located at opposite sides of thesecond rib 2112. - Referring to
FIG. 4 , in assembling thefixing bracket 4, eachlatching element 21 is mounted to thesecond base 22, via a pair ofscrews 50 extending through the pair of throughholes 2121 of thelatching element 21 to be engaged in the corresponding pair oflocking holes 225 of thesecond base 22. Therefore, thelatching elements 21 are fixed to thefirst surface 222 of thesecond base 22, with twolatching elements 21 located at opposite sides of the airflow opening 223, and alatching element 21 located below theairflow opening 223. A secondaccommodating space 26 is bounded by thelatching elements 21 and thesecond base 22, for receiving thefan 3. Thesecond bases 22 are engaged in the correspondingsliding slots 1211 of thefirst base 12, via thesliding portions 228 of thesecond bases 22 sliding into thesliding slots 1211 of thefirst base 12. Therefore, thesecond fixing elements 20 are mounted to thefirst fixing element 10. Areceiving space 40 is bounded by thefirst base 12 of thefirst fixing element 10 and the twosecond bases 22 of the twofixing elements 20. Thelocking portions 2242 of the twofixing elements 20 are oppositely set to fix theheat sink 2. - Referring to
FIG. 5 , in assembling theheat sink 2, thesecond bases 22 are deformed away from each other, theheat sink 2 is placed in thereceiving space 40 of thefixing bracket 4. Thesecond bases 22 are released to restore towards each other, to sandwich theheat sink 2 therebetween. Thelocking portion 2242 of the twosecond bases 22 respectively resiliently resist against two sides of a bottom of theheat sink 2. Therefore, theheat sink 2 can be fixed to thefixing bracket 4 conveniently. - The
fan 3 can be fixed to thefirst fixing element 10 or each of thesecond fixing elements 20. Fixing modes of thefirst fixing element 10 and each of thesecond fixing elements 20 are the same. Thefan 3 fixed to asecond fixing element 20 is described as an example. Thelatching elements 21 at opposite sides of theairflow opening 223 are deformed away from each other, thefan 3 is placed in the secondaccommodating space 26, and supported on thelatching element 21 below the airflow opening 223. Thelatching elements 21 are released to restore towards each other. Thelatching blocks 2114 of thelatching elements 21 respectively resiliently resist against edges of a surface of thefan 3 opposite to the airflow opening 223. Therefore, thefan 3 is fixed to thesecond fixing element 20. - In use, heat absorbed by the
heat sink 2 can be removed by thefan 40 through theairflow openings 223 of thesecond bases 22. In other embodiments, thefan 3 can bring air flow to theheat sink 10 through theairflow openings 223 of thesecond bases 22 of thesecond fixing element 20. - In disassembling the
fan 3 from thefixing bracket 4, thelatching elements 21 of thefixing bracket 4 are deformed away from each other, with thelatching blocks 2114 of thelatching elements 21 respectively departing from the side surfaces of thefan 3. Therefore, thefan 3 can be conveniently removed from the secondaccommodating space 26 of thefixing bracket 4. - In disassembling the
heat sink 2 from thefixing bracket 4, the twosecond bases 22 of thefixing bracket 4 are deformed away from each other, with thelocking portions 2242 of the twosecond bases 22 respectively disengaging from the bottom of theheat sink 2. Therefore, theheat sink 2 can be conveniently removed from thereceiving space 40 of thefixing bracket 4. - In one embodiment, the
second fixing elements 20 can be moved relative to thefirst fixing element 10. Therefore, thefan 3 can be fixed to other positions of thefixing bracket 4. - In other embodiments, the
sliding slot 1211 of thefirst fixing element 10 can be omitted, therefore, the twosecond fixing elements 20 are fixedly mounted to the opposite sides of thefirst base 12. Thelatching elements 21 can be other shapes, where the fixing mode for fixing thelatching elements 21 to thesecond bases 22 can be changed according to shapes of thelatching elements 21. Thelatching elements 21 can be shaped to fix on thesecond bases 22 to fix thefan 3 on thesecond bases 22. The number of the latchingelements 21 can be changed. The latchingelements 21 can also be omitted, and thefan 3 fixed to thesecond bases 22 or thefirst base 12 indirectly via fasteners. - It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910302840.2 | 2009-06-02 | ||
CN200910302840.2A CN101909415A (en) | 2009-06-02 | 2009-06-02 | Heat dissipation device and fixing frame thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100300662A1 true US20100300662A1 (en) | 2010-12-02 |
Family
ID=43218892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/494,284 Abandoned US20100300662A1 (en) | 2009-06-02 | 2009-06-30 | Heat dissipating device and fixing bracket thereof |
Country Status (2)
Country | Link |
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US (1) | US20100300662A1 (en) |
CN (1) | CN101909415A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5995015B2 (en) * | 2012-05-22 | 2016-09-21 | 株式会社村田製作所 | Compound module |
CN107864594A (en) * | 2017-11-09 | 2018-03-30 | 昆山普克特金属制品有限公司 | The aluminium section bar that a kind of radiator slides |
DE102019117864A1 (en) * | 2019-07-02 | 2021-01-07 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Fastening device for two housing parts, in particular fan housing parts |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4565075A (en) * | 1984-06-08 | 1986-01-21 | Carrier Corporation | Polygon fan coil cabinet and method of assembly |
US20020167798A1 (en) * | 2001-05-14 | 2002-11-14 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US6708757B2 (en) * | 2000-02-28 | 2004-03-23 | Epcos Ag | Heat sink module and an arrangment of heat sink modules |
US6917522B1 (en) * | 2003-12-29 | 2005-07-12 | Intel Corporation | Apparatus and method for cooling integrated circuit devices |
US20060076128A1 (en) * | 2004-10-12 | 2006-04-13 | Veritas Ag | Fuel cooler, automotive vehicle comprising such a fuel cooler and method for producing such a fuel cooler |
US20070284081A1 (en) * | 2006-05-24 | 2007-12-13 | Han-Ming Lee | Heatsink device having fiber-like fins |
US7443669B2 (en) * | 2006-12-26 | 2008-10-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating device for data storage device |
US20090151900A1 (en) * | 2007-12-12 | 2009-06-18 | Tsung-Hsien Huang | Heat sink |
US7606028B2 (en) * | 2007-12-20 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a fan holder for attachment of a fan |
US20100132918A1 (en) * | 2008-12-01 | 2010-06-03 | Asia Vital Components Co., Ltd. | Cooling fan housing assembly |
-
2009
- 2009-06-02 CN CN200910302840.2A patent/CN101909415A/en active Pending
- 2009-06-30 US US12/494,284 patent/US20100300662A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4565075A (en) * | 1984-06-08 | 1986-01-21 | Carrier Corporation | Polygon fan coil cabinet and method of assembly |
US6708757B2 (en) * | 2000-02-28 | 2004-03-23 | Epcos Ag | Heat sink module and an arrangment of heat sink modules |
US20020167798A1 (en) * | 2001-05-14 | 2002-11-14 | Delta Electronics, Inc. | Heat-dissipating assembly having heat sink and dual hot-swapped fans |
US6917522B1 (en) * | 2003-12-29 | 2005-07-12 | Intel Corporation | Apparatus and method for cooling integrated circuit devices |
US20060076128A1 (en) * | 2004-10-12 | 2006-04-13 | Veritas Ag | Fuel cooler, automotive vehicle comprising such a fuel cooler and method for producing such a fuel cooler |
US20070284081A1 (en) * | 2006-05-24 | 2007-12-13 | Han-Ming Lee | Heatsink device having fiber-like fins |
US7443669B2 (en) * | 2006-12-26 | 2008-10-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating device for data storage device |
US20090151900A1 (en) * | 2007-12-12 | 2009-06-18 | Tsung-Hsien Huang | Heat sink |
US7606028B2 (en) * | 2007-12-20 | 2009-10-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a fan holder for attachment of a fan |
US20100132918A1 (en) * | 2008-12-01 | 2010-06-03 | Asia Vital Components Co., Ltd. | Cooling fan housing assembly |
Also Published As
Publication number | Publication date |
---|---|
CN101909415A (en) | 2010-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, CHIA-SHIN;CHEN, XIAO-ZHU;YE, ZHEN-XING;REEL/FRAME:022889/0838 Effective date: 20090625 Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, CHIA-SHIN;CHEN, XIAO-ZHU;YE, ZHEN-XING;REEL/FRAME:022889/0838 Effective date: 20090625 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |