US20100079941A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100079941A1 US20100079941A1 US12/238,441 US23844108A US2010079941A1 US 20100079941 A1 US20100079941 A1 US 20100079941A1 US 23844108 A US23844108 A US 23844108A US 2010079941 A1 US2010079941 A1 US 2010079941A1
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- United States
- Prior art keywords
- heat
- heat sink
- spreader
- dissipation device
- fin unit
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to heat dissipation devices, and more particularly to a heat dissipation device having excellent heat dissipating efficiency.
- Computer electronic components such as central processing units (CPUs)
- CPUs central processing units
- Computer electronic components generate great amounts of heat during normal operation thereof. If the heat is not properly dissipated, it can deteriorate an operational stability of the electronic components and damage associated electronic devices. Thus the heat must be removed quickly to ensure normal operation of these electronic components.
- a heat dissipation device is often attached to a top surface of a CPU to remove heat therefrom.
- a heat dissipation device attached to a CPU includes a solid base, a plurality of fins arranged on the base, and a plurality of heat pipes extending in the base and the fins.
- a plurality of grooves is defined in the base, and a plurality of holes is defined in the fins.
- Each heat pipe has a bent configuration and includes an evaporating section received in a corresponding groove of the base and a condensing section extending from the evaporating section. The condensing section is inserted in a corresponding hole of the fins.
- the heat originating from the CPU is directly absorbed by a middle part of the base and cannot quickly spread to other parts of the base.
- a heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink, and a pair of heat pipes thermally connecting the first and second heat sinks.
- the first and second heat sinks are for attaching to first and second CPUs, respectively.
- the first heat sink includes a plate-shaped spreader thermally attached to the first CPU and a honeycomb-like first fin unit thermally attached on the spreader.
- the heat pipes each include an evaporating section received in the first fin unit and tightly sandwiched between the spreader and the first fin unit and a condensing section extending in the second heat sink.
- the spreader is a flat heat pipe. Due to a provision of the honeycomb-like first fin unit, the heat-dissipation area of the first heat sink is greatly increased and the heat dissipating efficiency of the heat dissipation device is accordingly enhanced.
- FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention.
- FIG. 2 is an exploded, isometric view of the heat dissipation device in FIG. 1 .
- FIG. 3 is a front view of a first fin unit of the heat dissipation device in FIG. 1 .
- a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a first heat sink 10 , a second heat sink 20 juxtaposed with the first heat sink 10 and a pair of heat pipes 30 thermally connecting the first and second heat sinks 10 , 20 together.
- the first and second heat sinks 10 , 20 are adapted for removing heat from first and second heat-generating electronic components such as a first and second CPUs 52 , 54 mounted on a print circuit board 50 and spaced from each other.
- the first heat sink 10 comprises a rectangular frame 12 , a plate-shaped spreader 14 thermally attached on the frame 12 by soldering and a first fin unit 16 soldered on a top surface of the spreader 14 .
- the frame 12 defines four through holes 120 in alignment with four fixing holes 510 defined in the print circuit board 50 surrounding the first CPU 52 , for extension of fasteners 80 therethrough to secure the frame 12 to the print circuit board 50 .
- a cutout 122 is defined through a middle portion of a short side of the frame 12 .
- the spreader 14 is substantially a rectangular flattened heat pipe, having a lighter weight and better heat transferring capability than a solid metallic plate such as a copper plate with an equal volume.
- the spreader 14 defines a cavity (not shown) therein and contains working fluid in the cavity.
- the working fluid has phase change when it works.
- a sealed tube 140 extends outwardly and horizontally from a short lateral side of the spreader 14 through the cutout 122 of the frame 12 , when the spreader 14 is mounted on the frame 12 .
- the first fin unit 16 is a honeycomb-like structure and formed by stacking formed metal sheets with high heat conductivity such as formed aluminum or copper sheets, wherein each formed metal sheet has a hexagonal cross section.
- An air passage 160 is defined in each formed metal sheet, extending from a front side to a rear side of the first fin unit 16 . Understandably, the shape of the cross sections of the air passages 160 can be other shapes in an alternative embodiment.
- a receiving groove 162 with a rectangular cross-section is defined in a bottom of the first fin unit 16 and parallel to the short lateral sides of the first fin unit 16 .
- the receiving groove 160 is constructed for receiving the heat pipes 30 therein.
- the second heat sink 20 comprises a rectangular base 22 and a second fin unit 24 thermally attached on a top surface of the base 22 by soldering.
- the base 22 can be a vapor chamber with work fluid filled therein in an alternative embodiment.
- the base 22 is a thin plate made of copper or copper alloy.
- the base 22 defines four mounting holes 220 in four corners thereof, for extension of the fasteners 80 therethrough to mount the base 22 on the second CPU 54 mounted on the print circuit board 50 .
- the second fin unit 24 is also a honeycomb-like structure and formed by stacking formed aluminum or copper sheets each with a hexagonal cross section.
- the second fin unit 24 also defines a plurality of air passages (not labeled) in the second fin unit 24 and parallel to the air passages 160 of the first fin unit 16 of the first heat sink 10 .
- the second fin unit 24 has a height much larger than that of the first fin unit 16 of the first heat sink 10 .
- a pair of receiving holes 240 with circular cross sections are defined in a top portion of the second fin unit 24 and spaced from each other, for accommodating the heat pipes 30 therein.
- Each of the heat pipes 30 has a flat-shaped evaporating section 32 , a round condensing section 34 and a connecting section 36 formed between the evaporating section 32 and the condensing section 34 .
- the evaporating section 32 has a flat top surface (not labeled) and a flat bottom surface (not labeled) opposite to the flat top surface, for providing a larger contacting area, when the evaporating sections 32 of the heat pipes 30 are received in the receiving groove 162 and thermally attached to the bottom surface of the first fin unit 16 and the top surface of the spreader 14 .
- the flat bottom surfaces of the evaporating sections 32 of the heat pipes 30 are attached and soldered on the top surface of a middle of the spreader 14 of the first heat sink 10 .
- the condensing sections 34 are engagingly received in the receiving holes 240 of the second fin unit 24 of the second heat sink 20 .
- the connecting sections 36 each comprises a first portion 360 located adjacent to the evaporating sections 32 and a second portion 362 located adjacent to the condensing sections 34 .
- the first portions 360 of the connecting sections 36 are juxtaposed to each other and parallel to a front side of the first and second heat sinks 10 , 20 .
- the first portions 360 are vertical to the evaporating sections 32 and located in a different plane from the second portions 362 .
- the heat dissipating device is mounted on the print circuit board 50 by the fasteners 80 received in the through holes 120 , the mounting holes 220 and the fixing holes 510 .
- the spreader 14 of the first heat sink 10 is kept in intimate contact with the first CPU 52 and absorbs heat generated by the first CPU 52 . Due to the excellent heat conductivity of the spreader 14 , the heat from the first CPU 52 is quickly transferred to all parts of the spreader 14 , and then evenly and effectively distributed to the whole first fin unit 16 and finally brought into ambient air.
- the heat pipes 30 are thermally connected with the first and second heat sinks 10 , 20 , part of the heat from first CPU 52 is transferred to the top portion of the second fin unit 24 of the second heat sink 20 by the heat pipes 30 .
- the base 22 of the second heat sink 20 is thermally attached to the second CPU 54 and absorbs heat generated by the first CPU 52 .
- the heat from the second CPU 54 is transferred upwardly from the bottom portion to the top portion of the second fin unit 24 of the second heat sink 20 .
- the heat from the part of the first CPU 52 and the second CPU 54 can be evenly distributed in the second fin unit 24 to sufficiently use every part of the second fin unit 24 .
- each of the first and second fin units 16 , 24 has a honeycomb-like structure, a heat-dissipation area of each of the first and second heat sinks 10 , 20 is larger than that of a conventional heat sink in a equal volume. Moreover, due to an existence of the spreader 14 , the heat from the first CPU 52 is transferred to the spreader 14 and evenly distributed in the first fin unit 16 via the spreader 14 , thereby enabling the first fin unit 16 to be effectively utilized.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to heat dissipation devices, and more particularly to a heat dissipation device having excellent heat dissipating efficiency.
- 2. Description of Related Art
- Computer electronic components, such as central processing units (CPUs), generate great amounts of heat during normal operation thereof. If the heat is not properly dissipated, it can deteriorate an operational stability of the electronic components and damage associated electronic devices. Thus the heat must be removed quickly to ensure normal operation of these electronic components. A heat dissipation device is often attached to a top surface of a CPU to remove heat therefrom.
- Conventionally, a heat dissipation device attached to a CPU includes a solid base, a plurality of fins arranged on the base, and a plurality of heat pipes extending in the base and the fins. A plurality of grooves is defined in the base, and a plurality of holes is defined in the fins. Each heat pipe has a bent configuration and includes an evaporating section received in a corresponding groove of the base and a condensing section extending from the evaporating section. The condensing section is inserted in a corresponding hole of the fins. However, the heat originating from the CPU is directly absorbed by a middle part of the base and cannot quickly spread to other parts of the base. This results in an overheating of the middle part of the base, while the other parts of the base have a lower temperature relative to the middle part. The fins on the other parts of the base away from the middle part are not efficiently used. The heat dissipating efficiency of the heat sink needs to be improved through sufficient use of all of the fins on the base. Additionally, the fins of a conventional heat sink which have the fins extending upwardly and perpendicularly from the base thereof, do not have a sufficiently large heat-dissipation area to remove heat from the CPU; thus, the heat dissipating efficiency of the heat dissipation device is poor.
- What is needed, therefore, is a heat dissipation device with an enhanced heat dissipation performance.
- According to a preferred embodiment of the present invention, a heat dissipation device includes a first heat sink, a second heat sink juxtaposed with the first heat sink, and a pair of heat pipes thermally connecting the first and second heat sinks. The first and second heat sinks are for attaching to first and second CPUs, respectively. The first heat sink includes a plate-shaped spreader thermally attached to the first CPU and a honeycomb-like first fin unit thermally attached on the spreader. The heat pipes each include an evaporating section received in the first fin unit and tightly sandwiched between the spreader and the first fin unit and a condensing section extending in the second heat sink. The spreader is a flat heat pipe. Due to a provision of the honeycomb-like first fin unit, the heat-dissipation area of the first heat sink is greatly increased and the heat dissipating efficiency of the heat dissipation device is accordingly enhanced.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a preferred embodiment of the present invention. -
FIG. 2 is an exploded, isometric view of the heat dissipation device inFIG. 1 . -
FIG. 3 is a front view of a first fin unit of the heat dissipation device inFIG. 1 . - Referring to
FIGS. 1-3 , a heat dissipation device in accordance with a preferred embodiment of the present invention comprises afirst heat sink 10, asecond heat sink 20 juxtaposed with thefirst heat sink 10 and a pair ofheat pipes 30 thermally connecting the first andsecond heat sinks second heat sinks second CPUs print circuit board 50 and spaced from each other. - The
first heat sink 10 comprises arectangular frame 12, a plate-shaped spreader 14 thermally attached on theframe 12 by soldering and afirst fin unit 16 soldered on a top surface of thespreader 14. Theframe 12 defines four throughholes 120 in alignment with fourfixing holes 510 defined in theprint circuit board 50 surrounding thefirst CPU 52, for extension offasteners 80 therethrough to secure theframe 12 to theprint circuit board 50. Acutout 122 is defined through a middle portion of a short side of theframe 12. Thespreader 14 is substantially a rectangular flattened heat pipe, having a lighter weight and better heat transferring capability than a solid metallic plate such as a copper plate with an equal volume. Thespreader 14 defines a cavity (not shown) therein and contains working fluid in the cavity. The working fluid has phase change when it works. A sealedtube 140 extends outwardly and horizontally from a short lateral side of thespreader 14 through thecutout 122 of theframe 12, when thespreader 14 is mounted on theframe 12. Thefirst fin unit 16 is a honeycomb-like structure and formed by stacking formed metal sheets with high heat conductivity such as formed aluminum or copper sheets, wherein each formed metal sheet has a hexagonal cross section. Anair passage 160 is defined in each formed metal sheet, extending from a front side to a rear side of thefirst fin unit 16. Understandably, the shape of the cross sections of theair passages 160 can be other shapes in an alternative embodiment. Areceiving groove 162 with a rectangular cross-section is defined in a bottom of thefirst fin unit 16 and parallel to the short lateral sides of thefirst fin unit 16. Thereceiving groove 160 is constructed for receiving theheat pipes 30 therein. - The
second heat sink 20 comprises arectangular base 22 and asecond fin unit 24 thermally attached on a top surface of thebase 22 by soldering. Understandably, thebase 22 can be a vapor chamber with work fluid filled therein in an alternative embodiment. In the present embodiment, thebase 22 is a thin plate made of copper or copper alloy. Thebase 22 defines fourmounting holes 220 in four corners thereof, for extension of thefasteners 80 therethrough to mount thebase 22 on thesecond CPU 54 mounted on theprint circuit board 50. Thesecond fin unit 24 is also a honeycomb-like structure and formed by stacking formed aluminum or copper sheets each with a hexagonal cross section. Thesecond fin unit 24 also defines a plurality of air passages (not labeled) in thesecond fin unit 24 and parallel to theair passages 160 of thefirst fin unit 16 of thefirst heat sink 10. Thesecond fin unit 24 has a height much larger than that of thefirst fin unit 16 of thefirst heat sink 10. A pair of receivingholes 240 with circular cross sections are defined in a top portion of thesecond fin unit 24 and spaced from each other, for accommodating theheat pipes 30 therein. - Each of the
heat pipes 30 has a flat-shaped evaporating section 32, around condensing section 34 and a connectingsection 36 formed between theevaporating section 32 and thecondensing section 34. Theevaporating section 32 has a flat top surface (not labeled) and a flat bottom surface (not labeled) opposite to the flat top surface, for providing a larger contacting area, when theevaporating sections 32 of theheat pipes 30 are received in thereceiving groove 162 and thermally attached to the bottom surface of thefirst fin unit 16 and the top surface of thespreader 14. The flat bottom surfaces of theevaporating sections 32 of theheat pipes 30 are attached and soldered on the top surface of a middle of thespreader 14 of thefirst heat sink 10. Thecondensing sections 34 are engagingly received in the receivingholes 240 of thesecond fin unit 24 of thesecond heat sink 20. The connectingsections 36 each comprises afirst portion 360 located adjacent to theevaporating sections 32 and asecond portion 362 located adjacent to thecondensing sections 34. Thefirst portions 360 of the connectingsections 36 are juxtaposed to each other and parallel to a front side of the first and second heat sinks 10, 20. Thefirst portions 360 are vertical to the evaporatingsections 32 and located in a different plane from thesecond portions 362. - In operation, the heat dissipating device is mounted on the
print circuit board 50 by thefasteners 80 received in the throughholes 120, the mountingholes 220 and the fixing holes 510. Thespreader 14 of thefirst heat sink 10 is kept in intimate contact with thefirst CPU 52 and absorbs heat generated by thefirst CPU 52. Due to the excellent heat conductivity of thespreader 14, the heat from thefirst CPU 52 is quickly transferred to all parts of thespreader 14, and then evenly and effectively distributed to the wholefirst fin unit 16 and finally brought into ambient air. As theheat pipes 30 are thermally connected with the first and second heat sinks 10, 20, part of the heat fromfirst CPU 52 is transferred to the top portion of thesecond fin unit 24 of thesecond heat sink 20 by theheat pipes 30. Thebase 22 of thesecond heat sink 20 is thermally attached to thesecond CPU 54 and absorbs heat generated by thefirst CPU 52. The heat from thesecond CPU 54 is transferred upwardly from the bottom portion to the top portion of thesecond fin unit 24 of thesecond heat sink 20. Thus, the heat from the part of thefirst CPU 52 and thesecond CPU 54 can be evenly distributed in thesecond fin unit 24 to sufficiently use every part of thesecond fin unit 24. - As each of the first and
second fin units spreader 14, the heat from thefirst CPU 52 is transferred to thespreader 14 and evenly distributed in thefirst fin unit 16 via thespreader 14, thereby enabling thefirst fin unit 16 to be effectively utilized. - It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (9)
Priority Applications (1)
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US12/238,441 US7697293B1 (en) | 2008-09-26 | 2008-09-26 | Heat dissipation device |
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US12/238,441 US7697293B1 (en) | 2008-09-26 | 2008-09-26 | Heat dissipation device |
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US20100079941A1 true US20100079941A1 (en) | 2010-04-01 |
US7697293B1 US7697293B1 (en) | 2010-04-13 |
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Cited By (5)
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CN102931325A (en) * | 2012-11-26 | 2013-02-13 | 殷逢宝 | High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof |
US20150043167A1 (en) * | 2013-08-07 | 2015-02-12 | Oracle International Corporation | Heat sinks with interdigitated heat pipes |
US20170080554A1 (en) * | 2016-11-30 | 2017-03-23 | Caterpillar Inc. | Hydraulic hammer assembly |
US11243032B2 (en) * | 2019-06-18 | 2022-02-08 | Purdue Research Foundation | Heat sink devices and methods of using such devices for thermal management |
CN114543572A (en) * | 2022-03-10 | 2022-05-27 | 山东大学 | Soaking plate with honeycomb-like structure composite liquid absorption core, radiator and electronic equipment |
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CN101873786A (en) * | 2009-04-23 | 2010-10-27 | 富准精密工业(深圳)有限公司 | Heat sink |
CN201601889U (en) * | 2009-10-21 | 2010-10-06 | 鸿富锦精密工业(深圳)有限公司 | Circuit board combination |
TW201143590A (en) * | 2010-05-31 | 2011-12-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
US9417015B2 (en) | 2012-02-22 | 2016-08-16 | Thermal Corp. | Heat exchanger backing plate and method of assembling same |
CN105474766A (en) * | 2013-07-22 | 2016-04-06 | 惠普发展公司,有限责任合伙企业 | Heat sink |
CN104519718A (en) * | 2013-10-08 | 2015-04-15 | 英业达科技有限公司 | Radiating module |
JP7113504B2 (en) * | 2018-09-05 | 2022-08-05 | 株式会社ロータス・サーマル・ソリューション | heatsink with fan |
US10721838B1 (en) * | 2018-11-21 | 2020-07-21 | Cisco Technology, Inc. | Stacked base heat sink with heat pipes in-line with airflow |
US11930616B2 (en) * | 2019-10-18 | 2024-03-12 | Microsoft Technology Licensing, Llc | Combined heat exchanger and RF shield |
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Cited By (6)
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CN102931325A (en) * | 2012-11-26 | 2013-02-13 | 殷逢宝 | High-thermal-conductivity and high-heat-dissipation LED lamp and manufacture method thereof |
US20150043167A1 (en) * | 2013-08-07 | 2015-02-12 | Oracle International Corporation | Heat sinks with interdigitated heat pipes |
US9390994B2 (en) * | 2013-08-07 | 2016-07-12 | Oracle International Corporation | Heat sinks with interdigitated heat pipes |
US20170080554A1 (en) * | 2016-11-30 | 2017-03-23 | Caterpillar Inc. | Hydraulic hammer assembly |
US11243032B2 (en) * | 2019-06-18 | 2022-02-08 | Purdue Research Foundation | Heat sink devices and methods of using such devices for thermal management |
CN114543572A (en) * | 2022-03-10 | 2022-05-27 | 山东大学 | Soaking plate with honeycomb-like structure composite liquid absorption core, radiator and electronic equipment |
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AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PENG, XUE-WEN;CHEN, RUI-HUA;REEL/FRAME:021588/0854 Effective date: 20080919 Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PENG, XUE-WEN;CHEN, RUI-HUA;REEL/FRAME:021588/0854 Effective date: 20080919 |
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Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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Effective date: 20140413 |