US20100051239A1 - Dissipation module,flat heat column thereof and manufacturing method for flat heat column - Google Patents

Dissipation module,flat heat column thereof and manufacturing method for flat heat column Download PDF

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Publication number
US20100051239A1
US20100051239A1 US12/348,511 US34851109A US2010051239A1 US 20100051239 A1 US20100051239 A1 US 20100051239A1 US 34851109 A US34851109 A US 34851109A US 2010051239 A1 US2010051239 A1 US 2010051239A1
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US
United States
Prior art keywords
flat
wick structure
hollow tube
flat hollow
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/348,511
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English (en)
Inventor
Chi-Feng Lin
Ming-Te Chuang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Electronics Inc
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Assigned to DELTA ELECTRONICS, INC. reassignment DELTA ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHUANG, MING-TE, LIN, CHI-FENG
Publication of US20100051239A1 publication Critical patent/US20100051239A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Definitions

  • the present invention relates to a heat dissipation module and in particular to a heat dissipation module having a guiding device disposed in a hollow tube and the guiding device has a wick structure.
  • the heat pipe is a simple but very effective heat dissipation device, and it has been widely applied on various electronic heat dissipation products.
  • the heat pipe is used to transfer the energy by the latent heat produced as the working fluid is changing between the gas phase and the liquid phase.
  • the working fluid takes away a great amount of heat energy from the heat source by the latent heat of vaporization; while in the condensation section, the working fluid condenses into the liquid and releases the heat energy.
  • the working fluid reflows back to the vaporization section with capillary force provided by the wick structure and then the phase change would be performed again; hence continuously dissipate the heat from the heat source to a distant place.
  • the flat heat plate is a type of heat pipe. Since the flat heat plate is conventionally formed by welding an upper plate and a lower plate together, not only that the welding path is long and the welding reliability is low, but also that the wick structures on the upper and lower plates are not able to be continuously connected but merely connected by contacting. This would cause a decrease in capillary force as the working fluid passes, so as to slow down the reflow rate, hence affect the thermal conductivity.
  • the cost of the conventional method is relatively higher. Because of the limitation of their geometric shapes, the wick structure on the upper plate and the wick structure on the lower plate have to be sintered separately instead of being formed over a single step at the same time. Furthermore, different molds and fixtures have to be used for the flat heat plates with different lengths, so the cost of equipment is largely increased.
  • the present invention is to provide a flat heat column, which has high reliability, low cost and high thermal conductive efficiency, and a manufacturing method thereof.
  • the present invention is to provide a method for manufacturing a flat heat column, including the steps of providing a flat hollow tube having a continuous first wick structure disposed on an inner surface of the flat hollow tube; providing at least one guiding device disposed in the flat hollow tube and having a second wick structure disposed on a surface of the guiding device; connecting the first wick structure and the second wick structure to form a continuous wick structure; and filling a working fluid and sealing two ends of the flat hollow tube.
  • the present invention is to provide a flat heat column, including a flat hollow tube, at least one guiding device and a working fluid.
  • the flat hollow tube has a continuous first wick structure disposed on its inner surface.
  • the guiding device is disposed in the flat hollow tube and has a second wick structure disposed on a surface of the guiding device.
  • the working fluid is disposed in the sealed flat hollow tube.
  • the first wick structure and the second wick structure form a continuous wick structure.
  • the present invention is to provide a heat dissipation module according to a method for manufacturing a flat heat column of the present invention, rather than being conventionally formed by an upper plate and a lower plate.
  • a guiding device can be disposed at any position in the flat hollow column, and a continuous wick structure can be formed by a wick structure on a condensation end and a wick structure on a vaporization end. This helps prevent a capillary force for a working fluid from being interrupted, in which the working fluid flows from the condensation end to the vaporization end through the guiding device, so as to increase the circulating flow rate of the working fluid, hence effectively enhance the heat dissipation efficiency.
  • the structure and the method for manufacturing the flat heat column according to the present invention can provide a more preferable wick structure that makes the working fluid circulate quickly and enhances thermal conductivity.
  • a method for manufacturing the flat heat column of the present invention allows an outer surface of the flat heat column formed by stamping instead of the flat heat plate that is formed in a complicated way such as welding or at high cost, the length of the flat heat column can be adjusted according to the requirements of different users, and the mold is cheap and can be shared.
  • the manufacturing process of the present invention can be simplified.
  • the method for manufacturing the flat heat column of the present invention has the advantages of low cost and that the flat heat column can be easily changed to different shapes.
  • FIGS. 1A and 1B are schematic illustrations of manufacturing processes of two flat heat columns according to the preferred embodiment of the present invention.
  • FIG. 2A is a cross-sectional view of the flat heat column in FIG. 1A turned up-side-down along a line A-A′, wherein the guiding device is a solid pillar;
  • FIG. 2B is a cross-sectional view of the flat heat column in FIG. 1A turned up-side-down along a line A-A′, wherein the guiding device and the second wick structure are integrally formed with the same material;
  • FIG. 3 is a cross-sectional view of the flat heat column in FIG. 1B turned up-side-down along a line B-B′;
  • FIG. 4 is a cross-sectional view of the flat heat column in FIG. 1B turned up-side-down along a line C-C′;
  • FIG. 5A is an exploded view of a heat dissipation module according to the preferred embodiment of the present invention.
  • FIG. 5B is a schematic illustration of a heat dissipation module according to a first embodiment of the present invention.
  • FIG. 5C is a schematic illustration of a heat dissipation module according to a second embodiment of the present invention.
  • FIG. 6 is a schematic illustration of a heat dissipation module according to a third embodiment of the present invention.
  • FIGS. 1A and 1B are schematic illustrations of manufacturing processes of two flat heat columns according to the present invention.
  • a method for manufacturing a flat heat column is illustrated as follows.
  • a flat hollow tube 2 that is provided is, for example, a circular tube 1 formed by stamping, and its cross-sectional shape is rectangular.
  • the cross-sectional shape of the circular tube 1 can also be polygon, oblong, or long arc.
  • the material of the tube is, for example, aluminum (Al), copper (Cu), titanium (Ti), molybdenum (Mo), or other metal with high thermal conductivity.
  • the flat hollow tube 2 can be not only formed by applying a stamping process to a circular tube 1 but also directly formed by stamping.
  • a continuous first wick structure 4 is formed by sintering in the flat hollow tube 2 and is disposed on the inner surface of the flat hollow tube 2 .
  • the first wick structure 4 is a porous structure and can be a metal spring shape, a groove shape, a pillar shape, a meshed shape, or formed with a metal powder.
  • a convex plate 3 (as shown in FIG. 1B ) can be formed on a surface of the flat hollow tube 2 by stamping according to actual product requirements, and the surface having the convex plate 3 is the bottom surface of the flat heat column for contacting the heat source.
  • the flat hollow tube does not need to have a convex plate 3 disposed thereon but directly contacts the heat source, as shown in FIG. 1A .
  • At least one guiding device 5 is provided and a second wick structure 6 is formed on the surface of the guiding device 5 by sintering.
  • the sintered guiding device 5 is then disposed in the flat hollow tube 2 and a second sintering is performed to connect the first wick structure 4 and the second wick structure 6 on the guiding device 5 to form a continuous wick structure, and a filling tube 7 is inserted into the side surface of the flat tube.
  • the two ends of the flat hollow tube 2 are sealed and the junction between the filling tube 7 and the flat hollow tube 2 are sealed, both by welding, melting, or mechanical-manufacturing-like method.
  • a working fluid is filled into the flat hollow tube 2 through the filling tube 7 ;
  • the working fluid is, for example, inorganic compound, water, alkane, alcohol, liquid metal, ketone, freon, or organic compound.
  • NCG non-condensable gas
  • FIG. 2A is a cross-sectional view of the flat heat column in FIG. 1A turned up-side-down along a line A-A′.
  • the guiding device 5 can be a solid pillar and the second wick structure is disposed on the surface of the solid pillar.
  • the guiding device 5 and the second wick structure 6 can be formed integrally with the same material, e.g. a porous structure in a metal spring shape, in a meshed shape, or formed with a metal powder.
  • the identical or equivalent elements in each embodiment are denoted by the same reference numerals. Please refer to FIGS.
  • the flat heat column 11 A includes a flat hollow tube 2 , at least one guiding device 5 , and a working fluid W.
  • the dot distributing in the flat hollow tube 2 means the working fluid W is in gas phase.
  • the flat hollow tube 2 is an integrally-formed tube having a continuous first wick structure 4 disposed on its inner surface.
  • the guiding device 5 is disposed in the flat hollow tube 2 and a second wick structure 6 is disposed on the surface of the guiding device 5 .
  • the working fluid W is disposed in the sealed flat hollow tube 2 .
  • the first wick structure 4 and the second wick structure 6 together form a continuous wick structure.
  • the guiding device 5 can further increase the reflow rate of the working fluid W so as to enhance the heat dissipation efficiency.
  • the guiding device 5 is disposed in the flat hollow tube 2 and has a second wick structure 6 on its surface.
  • the working fluid W is disposed in the sealed flat hollow tube 2 , in which the first wick structure 4 and the second wick structure 6 together form a continuous wick structure.
  • the guiding device 5 can further increase the reflow rate of the working fluid W so as to enhance the heat dissipation efficiency.
  • the guiding device 5 can be a solid pillar and the second wick structure is disposed on the surface of the solid pillar.
  • the guiding device 5 and the second wick structure 6 can be integrally formed with the same material, e.g. a porous structure in a metal spring shape, in a meshed shape, or formed with a metal powder.
  • at least one supporting part 24 e.g. a high thermal conductive stick or a supporting part sintered with copper powder
  • the heat dissipation module 10 includes a fin 40 , a flat heat column 11 , and a fixing plate 50 .
  • the flat heat column 11 works just like the flat heat column 11 B in FIG. 1B .
  • the fixing plate 50 includes a bottom portion 51 , at least two side portions 52 , and at least two connecting portions 53 .
  • the bottom portion 51 and the side portions 52 form a accommodating space 55 for accommodating the flat heat column 11
  • the fixing plate 50 has an opening 54 for accommodating the convex plate 3 .
  • FIG. 5A the heat dissipation module 10 includes a fin 40 , a flat heat column 11 , and a fixing plate 50 .
  • the flat heat column 11 works just like the flat heat column 11 B in FIG. 1B .
  • the fixing plate 50 includes a bottom portion 51 , at least two side portions 52 , and at least two connecting portions 53 .
  • the bottom portion 51 and the side portions 52 form a accommodating space 55 for accommodating the flat heat column 11
  • the fixing plate 50 has an
  • the opening 54 ′ can accommodate a part of the flat heat column 11 and the convex plate 3 .
  • the fin 40 is connected to a side of the flat heat column 11 opposite to the convex plate 3 and fixedly connected to the connecting portion 53 , such that the flat heat column 11 is held fixedly between the fin 40 and the fixing plate 50 .
  • the heat dissipation module 10 includes a fin 40 , a flat heat column 11 , and a fixing plate 60 .
  • the flat heat column 11 is the sealed flat hollow tube filled with the working fluid.
  • at least one guiding device is formed and connected to the two opposite inner surfaces of the flat hollow tube, such that the working fluid can reflow and circulate through the guiding device.
  • At least two fixing plates 60 include a bottom portion 61 and a side portion 62 . Two fixing plates 60 are disposed on the two opposite sides of the flat heat column 11 , and lean against and press the flat heat column 11 .
  • a fin 40 is connected to a side of the flat heat column 11 opposite to the convex plate 3 and is fixedly connected to the bottom portion 61 .
  • the flat heat column can be formed integrally from a circular tube, rather than being conventionally formed by an upper plate and a lower plate.
  • a guiding device can be disposed at any position in the flat heat column, and a continuous wick structure can be formed with the wick structure on a condensation end and the wick structure on a vaporization end. This helps prevent a capillary force for a working fluid from being interrupted, in which the working fluid flows from the condensation end to the vaporization end through the guiding device, so as to increase the circulating flow rate of the working fluid, hence effectively enhance the heat dissipation efficiency.
  • the structure and the method for manufacturing the flat heat column according to the present invention can provide a more preferable wick structure that makes the working fluid circulate quickly and enhances thermal conductivity.
  • the method for manufacturing the flat heat column of the present invention allows an outer surface of the flat heat column formed from a circular tube material by stamping instead of the flat heat plate that is formed in a complicated way or at high cost, the length of the flat heat column can be adjusted according to the requirements of different users, and the mold is cheap and can be shared.
  • the manufacturing process of the present invention can be simplified.
  • the method for manufacturing the flat heat column of the present invention has the advantages of low cost and that the flat heat column can be easily changed to different shapes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/348,511 2008-08-28 2009-01-05 Dissipation module,flat heat column thereof and manufacturing method for flat heat column Abandoned US20100051239A1 (en)

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TW097132974A TWI426859B (zh) 2008-08-28 2008-08-28 散熱模組、均溫元件及均溫元件之製造方法
TW097132974 2008-08-28

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110240264A1 (en) * 2010-03-31 2011-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Plate-type heat pipe and method for manufacturing the same
US20130118012A1 (en) * 2010-04-26 2013-05-16 Asia Vital Components Co., Ltd. Flat Plate Heat Pipe and Method for Manufacturing the Same
US20130233518A1 (en) * 2012-03-12 2013-09-12 Cooler Master Co., Ltd. Flat heap pipe structure
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
WO2022230296A1 (ja) * 2021-04-28 2022-11-03 株式会社村田製作所 熱拡散デバイス
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11933543B2 (en) * 2021-03-09 2024-03-19 Furukawa Electric Co., Ltd. Heat sink

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573521B (zh) * 2014-06-17 2017-03-01 奇鋐科技股份有限公司 手持電子裝置散熱結構
TWI650523B (zh) * 2017-12-22 2019-02-11 大陸商深圳興奇宏科技有限公司 散熱裝置及其製造方法
CN108917439B (zh) * 2018-08-30 2024-04-19 无锡格林沃科技有限公司 相变散热器

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US3680189A (en) * 1970-12-09 1972-08-01 Noren Products Inc Method of forming a heat pipe
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6901994B1 (en) * 2004-01-05 2005-06-07 Industrial Technology Research Institute Flat heat pipe provided with means to enhance heat transfer thereof
US7159647B2 (en) * 2005-01-27 2007-01-09 Hul-Chun Hsu Heat pipe assembly
US20070012421A1 (en) * 2005-07-15 2007-01-18 Yeu-Lih Lin Grease protecting apparatus for heat sink
US20070068657A1 (en) * 2005-09-27 2007-03-29 Kenichi Yamamoto Sheet -shaped heat pipe and method of manufacturing the same
US20070107875A1 (en) * 2003-11-27 2007-05-17 Young-Duck Lee Flat plate heat transfer device
US20070240860A1 (en) * 2006-04-18 2007-10-18 Celsia Technologies Korea, Inc. Support structure for a planar cooling device
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe
US20070295494A1 (en) * 2006-06-26 2007-12-27 Celsia Technologies Korea Inc. Flat Type Heat Transferring Device and Manufacturing Method of the Same
US20080173429A1 (en) * 2002-05-08 2008-07-24 The Furukawa Electric Co., Ltd. Thin sheet type heat pipe
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same

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TW200722701A (en) * 2005-12-06 2007-06-16 Ind Tech Res Inst A permeable supporting structure of flat plate heat spreader

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3680189A (en) * 1970-12-09 1972-08-01 Noren Products Inc Method of forming a heat pipe
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US20080173429A1 (en) * 2002-05-08 2008-07-24 The Furukawa Electric Co., Ltd. Thin sheet type heat pipe
US20070107875A1 (en) * 2003-11-27 2007-05-17 Young-Duck Lee Flat plate heat transfer device
US6901994B1 (en) * 2004-01-05 2005-06-07 Industrial Technology Research Institute Flat heat pipe provided with means to enhance heat transfer thereof
US7159647B2 (en) * 2005-01-27 2007-01-09 Hul-Chun Hsu Heat pipe assembly
US20070012421A1 (en) * 2005-07-15 2007-01-18 Yeu-Lih Lin Grease protecting apparatus for heat sink
US20070068657A1 (en) * 2005-09-27 2007-03-29 Kenichi Yamamoto Sheet -shaped heat pipe and method of manufacturing the same
US20070240860A1 (en) * 2006-04-18 2007-10-18 Celsia Technologies Korea, Inc. Support structure for a planar cooling device
US20070267178A1 (en) * 2006-05-19 2007-11-22 Foxconn Technology Co., Ltd. Heat pipe
US20070295494A1 (en) * 2006-06-26 2007-12-27 Celsia Technologies Korea Inc. Flat Type Heat Transferring Device and Manufacturing Method of the Same
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20090025910A1 (en) * 2007-07-27 2009-01-29 Paul Hoffman Vapor chamber structure with improved wick and method for manufacturing the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110240264A1 (en) * 2010-03-31 2011-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Plate-type heat pipe and method for manufacturing the same
US20130118012A1 (en) * 2010-04-26 2013-05-16 Asia Vital Components Co., Ltd. Flat Plate Heat Pipe and Method for Manufacturing the Same
US9021698B2 (en) * 2010-04-26 2015-05-05 Asia Vital Components Co., Ltd. Flat plate heat pipe and method for manufacturing the same
US20130233518A1 (en) * 2012-03-12 2013-09-12 Cooler Master Co., Ltd. Flat heap pipe structure
US10598442B2 (en) * 2012-03-12 2020-03-24 Cooler Master Development Corporation Flat heat pipe structure
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
US11448470B2 (en) 2018-05-29 2022-09-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11680752B2 (en) 2018-05-29 2023-06-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11933543B2 (en) * 2021-03-09 2024-03-19 Furukawa Electric Co., Ltd. Heat sink
WO2022230296A1 (ja) * 2021-04-28 2022-11-03 株式会社村田製作所 熱拡散デバイス
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe
US11892240B2 (en) * 2022-04-28 2024-02-06 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe

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Publication number Publication date
TWI426859B (zh) 2014-02-11
TW201010590A (en) 2010-03-01

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