US20090223036A1 - Electrochemical cell and fabrication method of the same - Google Patents

Electrochemical cell and fabrication method of the same Download PDF

Info

Publication number
US20090223036A1
US20090223036A1 US12/387,939 US38793909A US2009223036A1 US 20090223036 A1 US20090223036 A1 US 20090223036A1 US 38793909 A US38793909 A US 38793909A US 2009223036 A1 US2009223036 A1 US 2009223036A1
Authority
US
United States
Prior art keywords
frame member
base member
electrochemical cell
conductive terminal
hoop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/387,939
Inventor
Hironobu Itoh
Yutaka Mikishima
Hideharu Onodera
Kazutaka Yuzurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/387,939 priority Critical patent/US20090223036A1/en
Publication of US20090223036A1 publication Critical patent/US20090223036A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85444—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85455—Nickel (Ni) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/8547—Zirconium (Zr) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49108—Electric battery cell making

Definitions

  • the present invention relates to an electrochemical cell such as a non-aqueous electrolyte cell and an electric double layer capacitor utilizing electric double layer theory, and to a fabrication method of the same.
  • the electrochemical cell such as the non-aqueous electrolyte cell and the electric double layer capacitor is used for a backup power source of clock functions, a backup power source of semiconductor memories, an auxiliary power source of electronic devices such as a microcomputer and an IC memory, a battery of solar-powered clocks, and a power source for driving motors.
  • the electrochemical cell is not required for large capacity and large current so much. Instead, for the needs of the electrochemical cell, an increasing demand is that components are placed on a mounting board applied with solder cream and are mounted in a reflow furnace controlled at a solder melting point (200 to 260° C.), as similar to ICs, and quartz and SAW devices. Furthermore, it is required for high-density mounting and the reduction in size and thickness as well as the ICs, and quartz and SAW devices
  • the electrochemical cell such as the non-aqueous electrolyte cell and the electric double layer capacitor is packaged in a metal case shaped in a coin or button (for example, see Patent Reference 1).
  • FIG. 12 depicts a cross-sectional view for describing a traditional electrochemical cell. It is configured of a positive electrode case 61 of stainless steel having the upper end surface side opened in a circular shape for housing a positive electrode active material 601 and a negative electrode active material 603 as electrodes and a separator 602 , and of a circular negative electrode case 63 fit into the positive electrode case 61 through a circular gasket 62 of insulating resin. Moreover, when surface mounting is required, the cell has a positive electrode terminal 65 a welded with the positive electrode case 61 and a negative electrode terminal 65 b welded with the negative electrode case 63 .
  • a sealing structure is conducted for securing heat resistant properties in solder reflow in which the gasket 62 in an annular shape is pressed by the positive electrode case 61 circularly opened and the circular negative electrode case 63 for crimping.
  • the cell is shaped in a coin or button.
  • the packages of ICs, and quartz and SAW devices placed on the mounting substrate are formed in a rectangular shape, space is created when the electrochemical cell is arranged. When this space is used effectively, a little over 20 percent increase is expected in the storage capacity of the electrochemical cell.
  • the positive electrode case 61 is formed of a metallic material, but it is short-circuited when the positive electrode case 61 is contacted with the negative electrode terminal 65 b . Therefore, space needs to be secured. More specifically, as shown in FIG. 12 , the negative electrode terminal 65 b needs to extend outside over the outer diameter of the positive electrode case 61 , causing the space occupied on the mounting substrate to be further increased. Thus, dead space is created to increase the occupied area when the cell is arranged on the mounting substrate, and it is difficult to increase the capacity per unit area on the mounting substrate.
  • the positive electrode terminal 65 a and the negative electrode terminal 65 b are mounted on the positive electrode case 61 and the negative electrode case 63 , the individual components are overlaid and welded with each other as shown in FIG. 12 . Therefore, the total thickness of the electrochemical cell is increased to hinder the reduction in thickness while the number of process steps of mounting the positive and negative electrode terminals is increased, causing high price.
  • An object of the invention is to enhance the flexibility of the shapes of the electrochemical cell to facilitate the reduction in size and thickness, to realize large capacity, to provide resistance against solder reflow temperatures, and to reduce the number of components and the number of process steps for low price.
  • the invention is an electrochemical cell characterized by including:
  • the container includes:
  • a base member having a bottom part and a side part disposed on a top surface of the bottom part along an outer rim of the bottom part, the bottom part and the side part formed in one piece;
  • a conductive terminal made of a metallic material disposed on the top surface of the bottom part, penetrating from an inner side of the base member to an outer side thereof, and having a surface contacted with one of the pair of the electrodes, the surface opposite to a surface contacting with the bottom part;
  • a frame member made of a metallic material joined to an entire rim of a top surface of the side part
  • a cover member made of a metallic material joined to an entire rim of a surface opposite to a surface of the frame member contacting with the base member.
  • the invention is characterized by having a cover connecting terminal, wherein one end thereof is extended to a side surface of the cover member.
  • the invention is characterized in that a part of the other end of the cover terminal and a part of one end of the conductive terminal extended from the base member have surfaces on a same plane.
  • the invention is characterized by having a frame connecting terminal, wherein one end thereof is extended to a side surface of the frame member.
  • the invention is characterized in that a part of the other end of the frame connecting terminal and a part of one end of the conductive terminal extended from the base member have surfaces on a same plane.
  • the invention is characterized in that one end is extended from the side surface of the frame member, and penetrated from the upper end part of the side part to a bottom surface of the bottom part through the surface where the side part is contacted with the bottom part.
  • the invention is characterized in that the other end or one end of the conductive terminal is contacted with an under surface of the bottom part, and is not protruded outside over the thickness of the terminal from the side part.
  • the invention is characterized in that the conductive terminal is formed of a material of stainless steel or aluminium.
  • the invention is characterized in that the frame member and the cover member are formed of a material of any one of stainless steel, aluminium and FeNi alloy.
  • the invention is characterized in that the conductive terminal is formed of stainless steel, and the frame member and the cover member are formed of FeNi alloy.
  • the invention is characterized in that the cover member is welded with the frame member.
  • the invention is characterized in that a brazing material of nickel or silver alloy is plated over the frame member and the cover member.
  • the invention is characterized in that a part having a narrow joint width is disposed on at least a part of a joint part of the frame member overlaid and welded with the cover member, and an opening is formed for discharging the electrolyte when an internal pressure of the electrochemical cell rises.
  • the invention is characterized in that the base member is formed of a material of any one of epoxies, polyimides, polystyrenes, polyphenylene sulfides, polyesters, polyamides, and polyethers.
  • the invention is characterized in that a thin part in thickness is disposed on at least one part of the base member or the cover member, and an opening is formed for discharging the electrolyte when an internal pressure of the electrochemical cell rises.
  • a second means for solving the problem is a fabrication method of an electrochemical cell characterized by having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
  • the invention has the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
  • the invention has the step of continuously forming a plurality of the frame members in a hoop of metal foil formed with guide holes in which a part of the frame member has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
  • the invention is characterized in that in separating the frame member formed in the hoop, at least one part connecting the hoop to the frame member is left to form a frame connecting terminal extended from the frame member.
  • the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape in heating at a temperature of 200° C. or higher for one minute or longer.
  • a third means for solving the problem is a fabrication method of an electrochemical cell characterized by having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
  • the invention has the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
  • the invention has the step of continuously forming a plurality of the conductive terminals in a hoop of metal foil formed with guide holes in which a part of the conductive terminals has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
  • the invention is characterized in that in separating the conductive terminals formed in the hoop, at least one part connecting the hoop to the conductive terminals is left to form a frame connecting terminal extended from the frame member.
  • the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape in heating at a temperature of 200° C. or higher for one minute or longer.
  • a fourth means for solving the problem is an electrochemical cell characterized by including:
  • the electrochemical cell further comprising:
  • a base member made of a resin material in a box shape for housing the pair of the electrodes, the separator and the electrolyte
  • the invention is characterized in that the conductive terminal and the connecting terminal are extended from a lower end surface of the base member, and connected to the mounting substrate.
  • the invention is characterized in that the conductive terminal and the connecting terminal are not protruded outside over the thickness of the terminals from a side wall of the base member.
  • the invention is characterized in that joint parts of the conductive terminal and the connecting terminal connected to the mounting substrate have a plating film of tin, nickel or silver.
  • the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape at a temperature of 200° C. or higher for one minute or longer.
  • the pair of the electrodes, the separator and the electrolyte are housed in the recessed part of the base member, and the cover member is overlaid and wielded with the frame member for joining each other.
  • the electrochemical cell in any shapes and the sealing structure resistant against solder reflow temperatures can be realized.
  • the positive and negative electrodes are connected to the conductive terminal and the cover connecting terminal, or the frame connecting terminal to the mounting substrate.
  • the base member insulates the conductive terminal from the cover connecting terminal or the frame connecting terminal. Therefore, the conductive terminal and the cover connecting terminal, or the frame connecting terminal can be placed on the lower end surface of the base member, and the dead space of the mounting substrate can be reduced as much as possible to allow large capacity.
  • the frame connecting terminal is formed to extend from the frame member or the cover member, the cell is reduced in thickness with no increase in the total thickness of the electrochemical cell. The process steps of mounting the positive and negative electrode terminals are eliminated.
  • the invention exerts the advantages that enhance the flexibility of the shapes of the electrochemical cell to facilitate the reduction in size and thickness, realize large capacity, provide resistance against solder reflow temperatures, and reduce the number of components and the number of process steps for low price.
  • FIG. 1 is a schematic diagram illustrating an electrochemical cell according to the invention
  • FIG. 2 is an outside diagram illustrating the electrochemical cell according to the invention.
  • FIG. 3 is a cross-sectional view illustrating the electrochemical cell according to the invention.
  • FIG. 4 is an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 5 is a cross-sectional view illustrating the electrochemical cell according to the invention.
  • FIG. 6 is an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 7 is a cross-sectional view illustrating the electrochemical cell according to the invention.
  • FIG. 8 is a flowchart for describing a fabrication method of the electrochemical cell according to the invention.
  • FIG. 9 is an outside diagram for describing the fabrication method of the electrochemical cell according to the invention.
  • FIG. 10 is an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 11 is a cross-sectional view illustrating the electrochemical cell according to the invention.
  • FIG. 12 is a cross-sectional view illustrating the traditional electrochemical cell.
  • FIGS. 1 to 12 An embodiment according to the invention will be described with reference to FIGS. 1 to 12 .
  • 11 depicts a base member made of a resin material formed in a box shape having a recessed part 11 a for configuring a container with a conductive terminal 15 penetrating through the wall surfaces of the base member 11 from the inner side of the recessed part 11 a to the outer side thereof and a frame member 12 joined to the base member 11 . Furthermore, a positive electrode active material 101 is attached to the conductive terminal 15 with a conductive adhesive, and a separator 102 and an electrolyte not shown in the drawing are housed in the recessed part 11 a .
  • a negative electrode active material 102 is attached to a cover member 13 with the conductive adhesive, and the frame member 12 is overlaid and welded with the cover member 13 .
  • stainless steel or aluminium is used for the conductive terminal 15
  • stainless steel, aluminium or FeNi alloy is used for the frame member 12 and the cover member 13 .
  • metals having suitable pressing, cutting and welding properties are used from stainless steel such as 19 Cr-9Ni steel and 18 Cr-12 Ni—Mo—Cu steel, and aluminium and aluminium alloys.
  • the material for the frame member and the cover member includes stainless steel such as 19 Cr-9 Ni steel and 18 Cr-12 Ni—Mo—Cu steel, aluminium and aluminium alloys, FeNi alloys such as 42 alloy and FeNiCo alloy.
  • these methods are used: a method of using optical absorption such as YAG laser, semiconductor laser, and lamp heating; a method of using frictional heat in which an ultrasonic transducer is pressed against the cover member to rub between it and the frame member; and a method of using resistance heating in which current is carried through the cover member or between the cover member and the frame member for heating.
  • a brazing material for a joint material of the cover member to the frame member is also included.
  • the brazing material Ni plating, Sn plating, or AgCu alloy is used.
  • the application of flash plating such as Au or Pt to the surface of the brazing materials is included.
  • insulating resins can be applied as the material for the base member.
  • These resins are suitable in the aspects of stiffness and heat resistant properties: thermosetting resins with heat resistance such as epoxies and polyimides, and thermoplastic resins such as polystyrenes, polyphenylene sulfides, polyesters, polyamides and polyethers.
  • syndiotactic polystyrene is selected as polystyrenes
  • linear or cross-linked polyphenylene sulfide is selected as polyphenylene sulfides
  • all aromatic polyesters called liquid crystal polymers are selected as polyesters
  • nylon is selected as polyamides
  • polyether ether ketone, polyether sulfone and polyetherimide are selected as polyethers.
  • products that glass fiber, mica, and ceramics fine powder are added to these resins are also used.
  • the non-aqueous electrolyte cell lithium containing manganese oxides, lithium containing cobalt oxides and lithium containing titanium oxides for the positive electrode active material, and carbon, lithium alloys, transition metal oxides and silicon oxides for the negative electrode active material.
  • activated carbon can be used for the positive and negative electrode active materials.
  • an insulating film having a great ion permeability and a given mechanical strength is used as the separator.
  • glass fiber can be used stably, but resins such as polyphenylene sulfide, polyethylene terephthalate, polyamide and polyimide can be used as well.
  • the pore diameter and thickness of the separator are not defined particularly, which are design items determined based on current values for devices for use and the internal resistance of the electrochemical cell.
  • ceramics porous products can be used as well.
  • a traditional non-aqueous solvent is used when the electric double layer capacitor and the non-aqueous secondary battery are taken as examples.
  • This non-aqueous solvent includes cyclic esters, chain esters, cyclic esters and chain esters.
  • a single or a complex product selected from ⁇ -butyrolactone ( ⁇ BL), propylene carbonate (PC) and ethylene carbonate (EC) can be used alone.
  • one kind or more of salts can be used, including (C 2 H 5 ) 4 PBF 4 , (C 3 H 7 ) 4 PBF 41 (CH 3 ) (C 2 H 5 ) 3 NBF 4 , (C 2 H 5 ) 4 NBF 4 , (C 2 H 5 ) 4 PPF 6 , (C 2 H 5 ) 4 PCF 3 SO 41 (C 2 H 5 ) 4 NPF 6 , lithium salt such as lithium perchlorate (LiClO 4 ), lithium phosphate hexafluoride (LiPF 6 ), lithium borofluoride (LiBF 4 ), lithium phosphate hexafluoride (LiAsF 6 ), lithium trifluoromethane sulfonate (LiCF 3 SO 3 ), and bis(trifuluoromethylsulfonylimide lithium [LiN(CF 3 SO 2 ) 2 ], thiocyanogen salt, and aluminium fluoride salt.
  • lithium salt such as lithium perchlorate
  • the electrolyte can be used in a gel form or solid form in combination with a non-aqueous solvent, a supporting salt, and polymers including polyethylene oxide derivatives or polyethylene oxide derivatives, polymers including polypropylene oxide derivatives or polypropylene oxide derivatives, phosphate ester polymer, and PVDF. Furthermore, the use of an inorganic solid electrolyte of LiS/SiS 2 /Li 4 SiO 4 is included. Moreover, ionic liquids such as pyridines, alicyclic amines, and aliphatic amines and cold molten salts such as amidines are acceptable. The use thereof exerts the advantage that suppresses the generation of steam in welding the cover member with the frame member.
  • the safety valve function of the base member includes partially reducing the thickness of the base member.
  • the safety valve function provided for the joint part of the frame member to the cover member includes locally forming a weak joining part.
  • the safety valve function serves as a role to release the gas of internal pressure increase when an abnormal event is generated such as overcurrent or external heating, and thus avoids accidents such as a rupture.
  • the safety valve function can be added to the electrochemical cell with no cost increase.
  • the joint part of the base member 11 to the conductive terminal 15 and the joint part of the base member 11 to the frame member 12 are closely contacted with each other regardless of the shape, and the sealing property by metal contact can also be obtained in welding the frame member 12 with the cover member 13 . Therefore, there are no limitations on the shapes. More specifically, even though the base member 11 is a rectangular container, it prevents humidity from entering externally, and the characteristics of the electrochemical cell can be maintained even after it is passed through the reflow furnace set at a solder melting point (200 to 260° C.).
  • FIG. 1 shows a schematic diagram illustrating an electrochemical cell according to the invention.
  • FIG. 2 shows an outside diagram illustrating the electrochemical cell according to the invention.
  • FIG. 3 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • an epoxy was used for a base member 11
  • 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for a conductive terminal 15 .
  • Tin was plated over the portions where the conductive terminal 15 was extended to the outer wall of the base member 11 for facilitating solder joint to a mounting substrate.
  • 42 Ni—Fe alloy was used for a frame member 12 and a cover member 13 .
  • An active material was prepared by kneading carbon black as a conductive material and PTFE as a binder with activated carbon commercially available. The kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 101 and a negative electrode active material 103 .
  • (C 2 H 5 ) 4 NBF 4 was dissolved in PC for use.
  • the conductive terminal 15 and the frame member 12 were placed in a base member forming mold, and an epoxy resin was injected thereinto to form the base member 11 in a box shape having a recessed part 11 a .
  • the conductive terminal 15 was attached to the positive electrode active material 101 , and then a separator 102 was housed in the recessed part 11 a .
  • the cover member 13 attached with the negative electrode active material 103 was overlaid with the frame member 12 for seam welding of the resistance heating method.
  • the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • FIG. 4 shows an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 5 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • a cover terminal In a cover terminal, one end thereof is connected to the side surface of a cover member and extended therefrom. It is bent in parallel with the side surface of the base member, and extended along the side surface of the base member to the bottom part. The other end thereof is bent on a surface contacting with a land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • One end of a conductive terminal is placed on the bottom surface inside a container, and the other end thereof is extended through outside the container. This other end is also bent on a surface contacting with the land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • An epoxy was used for the base member 31 , and 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for the conductive terminal 35 .
  • a cover connecting terminal 33 a was extended from the cover member 33 .
  • Tin was plated over the portion where the conductive terminal 35 was extended from the outer wall of the base member 11 and over the cover connecting terminals 33 a , for facilitating solder joint to a mounting substrate.
  • 42 Ni—Fe alloy was used for a frame member 32 and the cover member 33 .
  • An active material was prepared by kneading carbon black as a conductive material and PTFE a binder with activated carbon commercially available.
  • the kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 301 and a negative electrode active material 303 .
  • (C 2 H 5 ) 4 NBF 4 was dissolved in PC for use.
  • the cover member 33 was plated with nickel 2 ⁇ m in thickness and gold 0.5 ⁇ m in thickness, and the frame member 32 was plated with nickel 2 ⁇ m in thickness for seam welding of the resistance heating method.
  • nickel was plated over the cover member 33 and the frame member 32 functioned as a brazing material for hermetic sealing.
  • the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • the base member 11 was formed of polyphenylene sulfide of a thermoplastic resin.
  • Aluminium was used for a conductive terminal 15 .
  • Nickel was plated over a portion where the conductive terminal 15 was extended from the outer wall of the base member 11 , for facilitating solder joint to a mounting substrate.
  • 42 Ni—Fe alloy was used for a frame member 12 and a cover member 13 .
  • An active material was prepared by kneading carbon black as a conductive material and PTFE as a binder with activated carbon commercially available. The kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 101 and a negative electrode active material 103 .
  • For an electrolyte, (C 2 H 5 ) 4 NBF 4 was dissolved in PC for use.
  • the cover member 33 was plated with nickel 2 ⁇ m in thickness and gold 0.5 ⁇ m in thickness, and the frame member 12 was plated with nickel 2 ⁇ m in thickness for seam welding of the resistance heating method.
  • nickel was plated over the cover member 13 and the frame member 12 functioned as a brazing material for hermetic sealing.
  • the cell was immersed in a fluorine liquid for a leak test. It was revealed that a cell had the sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • FIG. 6 shows an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 7 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • a frame connecting terminal In a frame connecting terminal, one end thereof is connected to the side surface of a frame member and extended therefrom. It is bent in parallel with the side surface of the base member, and extended along the side surface of the base member to the bottom part. The other end thereof is bent on the surface contacting with a land, and has a surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • One end of a conductive terminal is placed on the bottom surface inside a container, and the other end thereof is extended through outside the container. This other end is also bent on a surface contacting with the land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • the portion where the frame connecting terminal 52 a was extended from the frame member 52 and the portion where the conductive terminal 55 was extended from the outer wall of the base member 51 were placed on the same plane.
  • the conductive terminal 55 and the frame member 52 were placed in a forming mold of the base member, and an epoxy resin was injected to form the base member 51 in a box shape having a recessed part 51 a .
  • the conductive terminal 55 was attached to a positive electrode active material 501 with a conductive adhesive, and then a separator 502 was housed in the recessed part 51 a .
  • the cover member 53 attached to a negative electrode active material 503 with the conductive adhesive was overlaid with the frame member 52 for seam welding of the resistance heating method. Since an amount of heat for welding is released near the frame connecting terminal 52 a extended from the frame member 52 , a scheme was done to increase the amount of current for control to form a sealing structure.
  • the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • FIG. 8 shows a flow chart for describing a fabrication method of the electrochemical cell according to the invention.
  • FIG. 9 shows an outside diagram for describing the fabrication method of the electrochemical cell according to the invention.
  • the frame member 52 formed in a hoop is placed in the forming mold of the base member (step 801 ).
  • the conductive terminal 55 is placed in the forming mold of the base member (step 802 ).
  • a resin material is injected into the forming mold of the base member to form the base member 51 in a box shape having the recessed part 51 a , and the conductive terminal 55 and the frame member 52 are assembled into the container (step 803 ).
  • current is carried through the hoop to plate a brazing material over the frame member 52 (step 804 ).
  • a pair of the electrodes, the separator and the electrolyte are housed in the recessed part 51 a of the base member (step 805 ).
  • the frame member 52 is overlaid and welded with the cover member, not shown, by a heating unit (step 806 ).
  • 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for the conductive terminal 55 .
  • a thin plate of 42 Ni—Fe alloy was used for the frame member 52 for press working to prepare the hoop. In press working, the plate was punched to form perforations 59 also used for positioning a work in each step and bridges 58 for holding the frame member 53 .
  • An epoxy was used for the resin material of the base member 51 .
  • the epoxy of thermosetting resin was cured by heating the forming mold of the base member. At this time, the conductive terminal 55 and the frame member 52 placed in the forming mold of the base member are closely contacted with the epoxy of the base member 51 , and can be shaped in a desired form.
  • Nickel was used for the brazing material plated over the frame member 52 , and was plated 2 ⁇ m in thickness. 42 Ni—Fe alloy was used for the cover member, and nickel was plated 2 ⁇ m in thickness. Here, resistance heating was used as the heating unit. More specifically, two roller electrodes were prepared, and pressed against the both ends of the cover member in good balance, and current was carried between the electrodes. The parts of the electrodes contacted with the cover member were heated to melt the nickel plating on the cover member and on the frame member 52 . The nickel plating was solidified to join the cover member to the frame member 52 . This process was repeated by rolling the electrodes in a roll.
  • the bridges 58 connected to the frame member 52 were cut from the hoop to fabricate the electrochemical cell.
  • the electrochemical cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • FIG. 10 shows an outside diagram illustrating an electrochemical cell according to the invention.
  • FIG. 11 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • the electrochemical cell according to the invention was joined to a positive electrode wiring pattern 77 a and a negative electrode wiring pattern 77 b formed on a mounting substrate 77 .
  • a frame connecting terminal 72 a extended from a frame member 72 and the portion where a conductive terminal 75 extended from the outer wall of a base member 71 were placed on the same plane.
  • the conductive terminal 75 and the frame member 72 were placed in a forming mold of the base member, and an epoxy resin was injected to form the base member 71 in a box shape having a recessed part 71 a .
  • the conductive terminal 75 was attached to a positive electrode active material 701 with a conductive adhesive, and then a separator 702 was housed in the recessed part 71 a . Subsequently, the cover member 73 attached to a negative electrode active material 703 with the conductive adhesive was overlaid with the frame member 72 for seam welding of the resistance heating method.
  • the conductive terminal 75 and the frame connecting terminal 72 a extended over the lower end surface of the base member 71 were bent inside as facing each other. After this, the cell was placed on lands of the positive electrode wiring pattern 72 a and the negative electrode wiring pattern 72 b for soldering through a reflow furnace where preheating was at a temperature of 180° C. for ten minutes, and heating was at a temperature of 240° C. for one minute.
  • the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10 ⁇ 5 atom ⁇ cc/sec or greater.
  • the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
  • the cell was fabricated where the outer shape of the base member 51 was 3 mm in width and 5 mm in thickness, and the thickness of the base member 51 was 1 mm from the bottom surface to the top surface of the cover member.
  • the guide holes 59 of +1 mm were formed in the frame of the hoop, and guide pins were inserted for positioning by fitting to the guide holes 59 at a space of 10 ⁇ m.
  • the electrodes, the separator and the electrolytes were incorporated, and then the frame member 52 was overlaid and welded with the cover member. The displacement was within 20 ⁇ g/m in assembling and welding these components.
  • the fabrication method was advantageous for the reduction in the size of the electrochemical cell.
  • the fabricated electrochemical cell was evaluated as similar to the examples 1 to 6. As the evaluation method, the cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C.
  • FIG. 12 shows a traditional coin type electrochemical cell having the outer diameter of +3 mm and the thickness of 0.8 mm.
  • the coin type cell does not have positive and negative electrodes on the same plane.
  • the coin type electrochemical cell with terminals of surface mounting type was fabricated in which a positive electrode terminal 65 a formed of a metal plate 0.1 mm in thickness was welded to a positive electrode case 61 , and a negative electrode terminal 65 b formed of a metal plate 0.1 mm in thickness was welded to a negative electrode case 63 , where the width was 3 mm, the length was 5 mm, and the thickness was 1 mm.
  • the electrochemical cell was evaluated as similar to the examples 1 to 7.
  • the cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that no leakage was found before and after soldered, and that the capacity was not varied.
  • the measurement conditions for capacity were that the cell was charged at 2.5 V for 30 minutes and then it was discharged at a current of 20 ⁇ A.

Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Gas Exhaust Devices For Batteries (AREA)
  • Secondary Cells (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

An electrochemical cell is provided which facilitates the reduction in size and thickness. An electrochemical cell is configured of a base member made of a resin material and formed in a box shape, a conductive terminal made of a metallic material and fixed and penetrated from the inside to the outside of the base member, a frame member made of a metallic material and fixed to the base member, and a cover member welded with the frame member.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to an electrochemical cell such as a non-aqueous electrolyte cell and an electric double layer capacitor utilizing electric double layer theory, and to a fabrication method of the same.
  • 2. Description of the Related Art
  • The electrochemical cell such as the non-aqueous electrolyte cell and the electric double layer capacitor is used for a backup power source of clock functions, a backup power source of semiconductor memories, an auxiliary power source of electronic devices such as a microcomputer and an IC memory, a battery of solar-powered clocks, and a power source for driving motors. With the realization of non-volatile semiconductor memories and reduced power consumption of clock function devices, the electrochemical cell is not required for large capacity and large current so much. Instead, for the needs of the electrochemical cell, an increasing demand is that components are placed on a mounting board applied with solder cream and are mounted in a reflow furnace controlled at a solder melting point (200 to 260° C.), as similar to ICs, and quartz and SAW devices. Furthermore, it is required for high-density mounting and the reduction in size and thickness as well as the ICs, and quartz and SAW devices
  • Traditionally, the electrochemical cell such as the non-aqueous electrolyte cell and the electric double layer capacitor is packaged in a metal case shaped in a coin or button (for example, see Patent Reference 1).
  • FIG. 12 depicts a cross-sectional view for describing a traditional electrochemical cell. It is configured of a positive electrode case 61 of stainless steel having the upper end surface side opened in a circular shape for housing a positive electrode active material 601 and a negative electrode active material 603 as electrodes and a separator 602, and of a circular negative electrode case 63 fit into the positive electrode case 61 through a circular gasket 62 of insulating resin. Moreover, when surface mounting is required, the cell has a positive electrode terminal 65 a welded with the positive electrode case 61 and a negative electrode terminal 65 b welded with the negative electrode case 63.
  • Patent Reference 1 JP-A-2002-190427
    • SUMMARY OF THE INVENTION
  • For the electrochemical cell such as the traditional non-aqueous electrolyte cell and the electric double layer capacitor described above, a sealing structure is conducted for securing heat resistant properties in solder reflow in which the gasket 62 in an annular shape is pressed by the positive electrode case 61 circularly opened and the circular negative electrode case 63 for crimping. For securing the heat resistant properties and sealing properties of the electrochemical cell, the cell is shaped in a coin or button. However, since the packages of ICs, and quartz and SAW devices placed on the mounting substrate are formed in a rectangular shape, space is created when the electrochemical cell is arranged. When this space is used effectively, a little over 20 percent increase is expected in the storage capacity of the electrochemical cell. Furthermore, the positive electrode case 61 is formed of a metallic material, but it is short-circuited when the positive electrode case 61 is contacted with the negative electrode terminal 65 b. Therefore, space needs to be secured. More specifically, as shown in FIG. 12, the negative electrode terminal 65 b needs to extend outside over the outer diameter of the positive electrode case 61, causing the space occupied on the mounting substrate to be further increased. Thus, dead space is created to increase the occupied area when the cell is arranged on the mounting substrate, and it is difficult to increase the capacity per unit area on the mounting substrate. Moreover, when the positive electrode terminal 65 a and the negative electrode terminal 65 b are mounted on the positive electrode case 61 and the negative electrode case 63, the individual components are overlaid and welded with each other as shown in FIG. 12. Therefore, the total thickness of the electrochemical cell is increased to hinder the reduction in thickness while the number of process steps of mounting the positive and negative electrode terminals is increased, causing high price.
  • An object of the invention is to enhance the flexibility of the shapes of the electrochemical cell to facilitate the reduction in size and thickness, to realize large capacity, to provide resistance against solder reflow temperatures, and to reduce the number of components and the number of process steps for low price.
  • To achieve the object, the invention is an electrochemical cell characterized by including:
  • a separator;
  • a pair of electrodes placed on top and bottom surfaces of the separator; and
  • a container for housing the separator and an electrolyte impregnated in the pair of the electrodes,
  • wherein the container includes:
  • a base member having a bottom part and a side part disposed on a top surface of the bottom part along an outer rim of the bottom part, the bottom part and the side part formed in one piece;
  • a conductive terminal made of a metallic material disposed on the top surface of the bottom part, penetrating from an inner side of the base member to an outer side thereof, and having a surface contacted with one of the pair of the electrodes, the surface opposite to a surface contacting with the bottom part;
  • a frame member made of a metallic material joined to an entire rim of a top surface of the side part; and
  • a cover member made of a metallic material joined to an entire rim of a surface opposite to a surface of the frame member contacting with the base member.
  • Furthermore, the invention is characterized by having a cover connecting terminal, wherein one end thereof is extended to a side surface of the cover member.
  • Moreover, the invention is characterized in that a part of the other end of the cover terminal and a part of one end of the conductive terminal extended from the base member have surfaces on a same plane.
  • Besides, the invention is characterized by having a frame connecting terminal, wherein one end thereof is extended to a side surface of the frame member.
  • Additionally, the invention is characterized in that a part of the other end of the frame connecting terminal and a part of one end of the conductive terminal extended from the base member have surfaces on a same plane.
  • Furthermore, the invention is characterized in that one end is extended from the side surface of the frame member, and penetrated from the upper end part of the side part to a bottom surface of the bottom part through the surface where the side part is contacted with the bottom part.
  • Moreover, the invention is characterized in that the other end or one end of the conductive terminal is contacted with an under surface of the bottom part, and is not protruded outside over the thickness of the terminal from the side part.
  • Besides, the invention is characterized in that the conductive terminal is formed of a material of stainless steel or aluminium.
  • Additionally, the invention is characterized in that the frame member and the cover member are formed of a material of any one of stainless steel, aluminium and FeNi alloy.
  • Furthermore, the invention is characterized in that the conductive terminal is formed of stainless steel, and the frame member and the cover member are formed of FeNi alloy.
  • Moreover, the invention is characterized in that the cover member is welded with the frame member.
  • Additionally, the invention is characterized in that a brazing material of nickel or silver alloy is plated over the frame member and the cover member.
  • Besides, the invention is characterized in that a part having a narrow joint width is disposed on at least a part of a joint part of the frame member overlaid and welded with the cover member, and an opening is formed for discharging the electrolyte when an internal pressure of the electrochemical cell rises.
  • Additionally, the invention is characterized in that the base member is formed of a material of any one of epoxies, polyimides, polystyrenes, polyphenylene sulfides, polyesters, polyamides, and polyethers.
  • Furthermore, the invention is characterized in that a thin part in thickness is disposed on at least one part of the base member or the cover member, and an opening is formed for discharging the electrolyte when an internal pressure of the electrochemical cell rises.
  • Moreover, a second means for solving the problem is a fabrication method of an electrochemical cell characterized by having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
  • placing the frame member formed in a hoop in a forming mold of the base member;
  • placing the conductive terminal in the forming mold of the base member;
  • injecting a resin material into the forming mold to form the base member in a box shape;
  • assembling the base member where the conductive terminal and the frame member are joined thereto into a container;
  • attaching one electrode of the pair of the electrodes to the conductive terminal;
  • placing the separator and the other electrode of the pair of the electrodes on a surface opposite to a surface contacting with the conductive terminal of the one electrode; and
  • overlaying and welding the frame member with the cover member by a heating unit.
  • Besides, the invention has the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
  • Additionally, the invention has the step of continuously forming a plurality of the frame members in a hoop of metal foil formed with guide holes in which a part of the frame member has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
  • Furthermore, the invention is characterized in that in separating the frame member formed in the hoop, at least one part connecting the hoop to the frame member is left to form a frame connecting terminal extended from the frame member.
  • Moreover, the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape in heating at a temperature of 200° C. or higher for one minute or longer.
  • Besides, a third means for solving the problem is a fabrication method of an electrochemical cell characterized by having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
  • placing the conductive terminal formed in a hoop in a forming mold of the base member;
  • placing the frame member in the forming mold of the base member;
  • injecting a resin material into the forming mold to form the base member in a box shape;
  • assembling the base member where the frame member and the conductive terminal are joined thereto into a container;
  • attaching one electrode of the pair of the electrodes to the conductive terminal;
  • placing the separator and the other electrode of the pair of the electrodes on a surface opposite to a surface of contacting with the conductive terminal of the one electrode; and
  • overlaying and welding the frame member with the cover member by a heating unit.
  • Additionally, the invention has the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
  • Furthermore, the invention has the step of continuously forming a plurality of the conductive terminals in a hoop of metal foil formed with guide holes in which a part of the conductive terminals has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
  • Moreover, the invention is characterized in that in separating the conductive terminals formed in the hoop, at least one part connecting the hoop to the conductive terminals is left to form a frame connecting terminal extended from the frame member.
  • Besides, the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape in heating at a temperature of 200° C. or higher for one minute or longer.
  • Additionally, a fourth means for solving the problem is an electrochemical cell characterized by including:
  • a separator;
  • a pair of electrodes facing each other through the separator; and
  • a container for housing the separator and an electrolyte impregnated in the pair of the electrodes, the electrochemical cell further comprising:
  • a base member made of a resin material in a box shape for housing the pair of the electrodes, the separator and the electrolyte; and
  • a conductive terminal and a connecting terminal surface-mounted on a land disposed on a mounting substrate,
      • wherein positive and negative electrodes are distinguished from each other by length or shapes of the conductive terminal and the connecting terminal.
  • Furthermore, the invention is characterized in that the conductive terminal and the connecting terminal are extended from a lower end surface of the base member, and connected to the mounting substrate.
  • Moreover, the invention is characterized in that the conductive terminal and the connecting terminal are not protruded outside over the thickness of the terminals from a side wall of the base member.
  • Besides, the invention is characterized in that joint parts of the conductive terminal and the connecting terminal connected to the mounting substrate have a plating film of tin, nickel or silver.
  • Additionally, the invention is characterized in that the base member is a resin component having a heat resistant property for holding its shape at a temperature of 200° C. or higher for one minute or longer.
  • The advantages of the means for solving the problem are as follows. More specifically, the pair of the electrodes, the separator and the electrolyte are housed in the recessed part of the base member, and the cover member is overlaid and wielded with the frame member for joining each other. Thus, the electrochemical cell in any shapes and the sealing structure resistant against solder reflow temperatures can be realized.
  • Furthermore, the positive and negative electrodes are connected to the conductive terminal and the cover connecting terminal, or the frame connecting terminal to the mounting substrate. As the configuration of the electrochemical cell, the base member insulates the conductive terminal from the cover connecting terminal or the frame connecting terminal. Therefore, the conductive terminal and the cover connecting terminal, or the frame connecting terminal can be placed on the lower end surface of the base member, and the dead space of the mounting substrate can be reduced as much as possible to allow large capacity.
  • Moreover, since the frame connecting terminal is formed to extend from the frame member or the cover member, the cell is reduced in thickness with no increase in the total thickness of the electrochemical cell. The process steps of mounting the positive and negative electrode terminals are eliminated.
  • As described above, the invention exerts the advantages that enhance the flexibility of the shapes of the electrochemical cell to facilitate the reduction in size and thickness, realize large capacity, provide resistance against solder reflow temperatures, and reduce the number of components and the number of process steps for low price.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The teachings of the invention can be readily understood by considering the following detailed description in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a schematic diagram illustrating an electrochemical cell according to the invention;
  • FIG. 2 is an outside diagram illustrating the electrochemical cell according to the invention;
  • FIG. 3 is a cross-sectional view illustrating the electrochemical cell according to the invention;
  • FIG. 4 is an outside diagram illustrating an electrochemical cell according to the invention;
  • FIG. 5 is a cross-sectional view illustrating the electrochemical cell according to the invention;
  • FIG. 6 is an outside diagram illustrating an electrochemical cell according to the invention;
  • FIG. 7 is a cross-sectional view illustrating the electrochemical cell according to the invention;
  • FIG. 8 is a flowchart for describing a fabrication method of the electrochemical cell according to the invention;
  • FIG. 9 is an outside diagram for describing the fabrication method of the electrochemical cell according to the invention;
  • FIG. 10 is an outside diagram illustrating an electrochemical cell according to the invention;
  • FIG. 11 is a cross-sectional view illustrating the electrochemical cell according to the invention; and
  • FIG. 12 is a cross-sectional view illustrating the traditional electrochemical cell.
    •  DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Hereinafter, an embodiment according to the invention will be described with reference to FIGS. 1 to 12.
  • In FIGS. 1 to 3, 11 depicts a base member made of a resin material formed in a box shape having a recessed part 11 a for configuring a container with a conductive terminal 15 penetrating through the wall surfaces of the base member 11 from the inner side of the recessed part 11 a to the outer side thereof and a frame member 12 joined to the base member 11. Furthermore, a positive electrode active material 101 is attached to the conductive terminal 15 with a conductive adhesive, and a separator 102 and an electrolyte not shown in the drawing are housed in the recessed part 11 a. Moreover, a negative electrode active material 102 is attached to a cover member 13 with the conductive adhesive, and the frame member 12 is overlaid and welded with the cover member 13. Besides, stainless steel or aluminium is used for the conductive terminal 15, and stainless steel, aluminium or FeNi alloy is used for the frame member 12 and the cover member 13.
  • Here, as the material for the conductive terminal, metals having suitable pressing, cutting and welding properties are used from stainless steel such as 19 Cr-9Ni steel and 18 Cr-12 Ni—Mo—Cu steel, and aluminium and aluminium alloys. The material for the frame member and the cover member includes stainless steel such as 19 Cr-9 Ni steel and 18 Cr-12 Ni—Mo—Cu steel, aluminium and aluminium alloys, FeNi alloys such as 42 alloy and FeNiCo alloy. Furthermore, as the method for welding the cover member with the frame member, these methods are used: a method of using optical absorption such as YAG laser, semiconductor laser, and lamp heating; a method of using frictional heat in which an ultrasonic transducer is pressed against the cover member to rub between it and the frame member; and a method of using resistance heating in which current is carried through the cover member or between the cover member and the frame member for heating. Moreover, the use of a brazing material for a joint material of the cover member to the frame member is also included. As the brazing material, Ni plating, Sn plating, or AgCu alloy is used. Here, in order to easily join the brazing materials for the cover member and the frame member each other, the application of flash plating such as Au or Pt to the surface of the brazing materials is included.
  • Besides, insulating resins can be applied as the material for the base member. These resins are suitable in the aspects of stiffness and heat resistant properties: thermosetting resins with heat resistance such as epoxies and polyimides, and thermoplastic resins such as polystyrenes, polyphenylene sulfides, polyesters, polyamides and polyethers. Here, syndiotactic polystyrene is selected as polystyrenes, linear or cross-linked polyphenylene sulfide is selected as polyphenylene sulfides, all aromatic polyesters called liquid crystal polymers are selected as polyesters, nylon is selected as polyamides, and polyether ether ketone, polyether sulfone and polyetherimide are selected as polyethers. Furthermore, products that glass fiber, mica, and ceramics fine powder are added to these resins are also used.
  • Moreover, as an electrical power generation element for the electrochemical cell, which is housed in the container configured of the base member, the conductive terminal and the frame member, traditionally known products can be used for the non-aqueous electrolyte cell: lithium containing manganese oxides, lithium containing cobalt oxides and lithium containing titanium oxides for the positive electrode active material, and carbon, lithium alloys, transition metal oxides and silicon oxides for the negative electrode active material. For the electric double layer capacitor, activated carbon can be used for the positive and negative electrode active materials.
  • Besides, as the separator, an insulating film having a great ion permeability and a given mechanical strength is used. In consideration of mounting in the reflow furnace, glass fiber can be used stably, but resins such as polyphenylene sulfide, polyethylene terephthalate, polyamide and polyimide can be used as well. The pore diameter and thickness of the separator are not defined particularly, which are design items determined based on current values for devices for use and the internal resistance of the electrochemical cell. In addition, ceramics porous products can be used as well.
  • As the solvent for the electrolyte solution, a traditional non-aqueous solvent is used when the electric double layer capacitor and the non-aqueous secondary battery are taken as examples. This non-aqueous solvent includes cyclic esters, chain esters, cyclic esters and chain esters. In consideration of reflow mounting, a single or a complex product selected from γ-butyrolactone (γBL), propylene carbonate (PC) and ethylene carbonate (EC) can be used alone.
  • As the electrolyte, one kind or more of salts can be used, including (C2H5)4PBF4, (C3H7)4PBF41 (CH3) (C2H5)3NBF4, (C2H5)4NBF4, (C2H5)4PPF6, (C2H5)4PCF3SO41 (C2H5)4NPF6, lithium salt such as lithium perchlorate (LiClO4), lithium phosphate hexafluoride (LiPF6), lithium borofluoride (LiBF4), lithium phosphate hexafluoride (LiAsF6), lithium trifluoromethane sulfonate (LiCF3SO3), and bis(trifuluoromethylsulfonylimide lithium [LiN(CF3SO2)2], thiocyanogen salt, and aluminium fluoride salt. The electrolyte can be used in a gel form or solid form in combination with a non-aqueous solvent, a supporting salt, and polymers including polyethylene oxide derivatives or polyethylene oxide derivatives, polymers including polypropylene oxide derivatives or polypropylene oxide derivatives, phosphate ester polymer, and PVDF. Furthermore, the use of an inorganic solid electrolyte of LiS/SiS2/Li4SiO4 is included. Moreover, ionic liquids such as pyridines, alicyclic amines, and aliphatic amines and cold molten salts such as amidines are acceptable. The use thereof exerts the advantage that suppresses the generation of steam in welding the cover member with the frame member.
  • Besides, the safety valve function of the base member includes partially reducing the thickness of the base member. Additionally, the safety valve function provided for the joint part of the frame member to the cover member includes locally forming a weak joining part. The safety valve function serves as a role to release the gas of internal pressure increase when an abnormal event is generated such as overcurrent or external heating, and thus avoids accidents such as a rupture. In the invention, the safety valve function can be added to the electrochemical cell with no cost increase.
  • In the embodiment according to the invention, the joint part of the base member 11 to the conductive terminal 15 and the joint part of the base member 11 to the frame member 12 are closely contacted with each other regardless of the shape, and the sealing property by metal contact can also be obtained in welding the frame member 12 with the cover member 13. Therefore, there are no limitations on the shapes. More specifically, even though the base member 11 is a rectangular container, it prevents humidity from entering externally, and the characteristics of the electrochemical cell can be maintained even after it is passed through the reflow furnace set at a solder melting point (200 to 260° C.).
    • Example 1
  • FIG. 1 shows a schematic diagram illustrating an electrochemical cell according to the invention. FIG. 2 shows an outside diagram illustrating the electrochemical cell according to the invention. FIG. 3 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • In this example, an epoxy was used for a base member 11, and 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for a conductive terminal 15. Tin was plated over the portions where the conductive terminal 15 was extended to the outer wall of the base member 11 for facilitating solder joint to a mounting substrate. 42 Ni—Fe alloy was used for a frame member 12 and a cover member 13. An active material was prepared by kneading carbon black as a conductive material and PTFE as a binder with activated carbon commercially available. The kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 101 and a negative electrode active material 103. For an electrolyte, (C2H5)4NBF4 was dissolved in PC for use. Here, as an assembly method of the electrochemical cell, the conductive terminal 15 and the frame member 12 were placed in a base member forming mold, and an epoxy resin was injected thereinto to form the base member 11 in a box shape having a recessed part 11 a. The conductive terminal 15 was attached to the positive electrode active material 101, and then a separator 102 was housed in the recessed part 11 a. Subsequently, the cover member 13 attached with the negative electrode active material 103 was overlaid with the frame member 12 for seam welding of the resistance heating method.
  • In order to evaluate the sealing property of the electrochemical cell, the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 2
  • FIG. 4 shows an outside diagram illustrating an electrochemical cell according to the invention. FIG. 5 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • In a cover terminal, one end thereof is connected to the side surface of a cover member and extended therefrom. It is bent in parallel with the side surface of the base member, and extended along the side surface of the base member to the bottom part. The other end thereof is bent on a surface contacting with a land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member. One end of a conductive terminal is placed on the bottom surface inside a container, and the other end thereof is extended through outside the container. This other end is also bent on a surface contacting with the land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • An epoxy was used for the base member 31, and 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for the conductive terminal 35. A cover connecting terminal 33 a was extended from the cover member 33. Tin was plated over the portion where the conductive terminal 35 was extended from the outer wall of the base member 11 and over the cover connecting terminals 33 a, for facilitating solder joint to a mounting substrate. 42 Ni—Fe alloy was used for a frame member 32 and the cover member 33. An active material was prepared by kneading carbon black as a conductive material and PTFE a binder with activated carbon commercially available. The kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 301 and a negative electrode active material 303. For an electrolyte, (C2H5)4NBF4 was dissolved in PC for use.
  • The cover member 33 was plated with nickel 2 μm in thickness and gold 0.5 μm in thickness, and the frame member 32 was plated with nickel 2 μm in thickness for seam welding of the resistance heating method. Here, nickel was plated over the cover member 33 and the frame member 32 functioned as a brazing material for hermetic sealing. In order to evaluate the sealing property of the electrochemical cell thus fabricated, the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 3
  • For a base member 11, the base member 11 was formed of polyphenylene sulfide of a thermoplastic resin.
  • Aluminium was used for a conductive terminal 15. Nickel was plated over a portion where the conductive terminal 15 was extended from the outer wall of the base member 11, for facilitating solder joint to a mounting substrate. 42 Ni—Fe alloy was used for a frame member 12 and a cover member 13. An active material was prepared by kneading carbon black as a conductive material and PTFE as a binder with activated carbon commercially available. The kneaded product was rolled by roll press to form into a sheet, and it was cut to form a positive electrode active material 101 and a negative electrode active material 103. For an electrolyte, (C2H5)4NBF4 was dissolved in PC for use. The cover member 33 was plated with nickel 2 μm in thickness and gold 0.5 μm in thickness, and the frame member 12 was plated with nickel 2 μm in thickness for seam welding of the resistance heating method. Here, nickel was plated over the cover member 13 and the frame member 12 functioned as a brazing material for hermetic sealing.
  • In order to evaluate the sealing property of the electrochemical cell thus fabricated, the cell was immersed in a fluorine liquid for a leak test. It was revealed that a cell had the sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 4
  • FIG. 6 shows an outside diagram illustrating an electrochemical cell according to the invention. FIG. 7 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • In a frame connecting terminal, one end thereof is connected to the side surface of a frame member and extended therefrom. It is bent in parallel with the side surface of the base member, and extended along the side surface of the base member to the bottom part. The other end thereof is bent on the surface contacting with a land, and has a surface contacting with the land on almost the same plane as the bottom surface of the base member. One end of a conductive terminal is placed on the bottom surface inside a container, and the other end thereof is extended through outside the container. This other end is also bent on a surface contacting with the land, and has the surface contacting with the land on almost the same plane as the bottom surface of the base member.
  • In this example, the portion where the frame connecting terminal 52 a was extended from the frame member 52 and the portion where the conductive terminal 55 was extended from the outer wall of the base member 51 were placed on the same plane. Here, as an assembly method of the electrochemical cell, the conductive terminal 55 and the frame member 52 were placed in a forming mold of the base member, and an epoxy resin was injected to form the base member 51 in a box shape having a recessed part 51 a. The conductive terminal 55 was attached to a positive electrode active material 501 with a conductive adhesive, and then a separator 502 was housed in the recessed part 51 a. Subsequently, the cover member 53 attached to a negative electrode active material 503 with the conductive adhesive was overlaid with the frame member 52 for seam welding of the resistance heating method. Since an amount of heat for welding is released near the frame connecting terminal 52 a extended from the frame member 52, a scheme was done to increase the amount of current for control to form a sealing structure.
  • In order to evaluate the sealing property of the electrochemical cell thus fabricated, the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 5
  • FIG. 8 shows a flow chart for describing a fabrication method of the electrochemical cell according to the invention.
  • FIG. 9 shows an outside diagram for describing the fabrication method of the electrochemical cell according to the invention.
  • The frame member 52 formed in a hoop is placed in the forming mold of the base member (step 801). The conductive terminal 55 is placed in the forming mold of the base member (step 802). Subsequently, a resin material is injected into the forming mold of the base member to form the base member 51 in a box shape having the recessed part 51 a, and the conductive terminal 55 and the frame member 52 are assembled into the container (step 803). Then, current is carried through the hoop to plate a brazing material over the frame member 52 (step 804). A pair of the electrodes, the separator and the electrolyte are housed in the recessed part 51 a of the base member (step 805). The frame member 52 is overlaid and welded with the cover member, not shown, by a heating unit (step 806).
  • Here, 18 Cr-12 Ni—Mo—Cu steel of stainless steel was used for the conductive terminal 55. A thin plate of 42 Ni—Fe alloy was used for the frame member 52 for press working to prepare the hoop. In press working, the plate was punched to form perforations 59 also used for positioning a work in each step and bridges 58 for holding the frame member 53. An epoxy was used for the resin material of the base member 51. The epoxy of thermosetting resin was cured by heating the forming mold of the base member. At this time, the conductive terminal 55 and the frame member 52 placed in the forming mold of the base member are closely contacted with the epoxy of the base member 51, and can be shaped in a desired form. Nickel was used for the brazing material plated over the frame member 52, and was plated 2 μm in thickness. 42 Ni—Fe alloy was used for the cover member, and nickel was plated 2 μm in thickness. Here, resistance heating was used as the heating unit. More specifically, two roller electrodes were prepared, and pressed against the both ends of the cover member in good balance, and current was carried between the electrodes. The parts of the electrodes contacted with the cover member were heated to melt the nickel plating on the cover member and on the frame member 52. The nickel plating was solidified to join the cover member to the frame member 52. This process was repeated by rolling the electrodes in a roll. After this welding, the bridges 58 connected to the frame member 52 were cut from the hoop to fabricate the electrochemical cell. The electrochemical cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 6
  • FIG. 10 shows an outside diagram illustrating an electrochemical cell according to the invention. FIG. 11 shows a cross-sectional view illustrating the electrochemical cell according to the invention.
  • In this example, the electrochemical cell according to the invention was joined to a positive electrode wiring pattern 77 a and a negative electrode wiring pattern 77 b formed on a mounting substrate 77. As the configuration of the electrochemical cell, a frame connecting terminal 72 a extended from a frame member 72 and the portion where a conductive terminal 75 extended from the outer wall of a base member 71 were placed on the same plane. Here, as an assembly method of the electrochemical cell, the conductive terminal 75 and the frame member 72 were placed in a forming mold of the base member, and an epoxy resin was injected to form the base member 71 in a box shape having a recessed part 71 a. The conductive terminal 75 was attached to a positive electrode active material 701 with a conductive adhesive, and then a separator 702 was housed in the recessed part 71 a. Subsequently, the cover member 73 attached to a negative electrode active material 703 with the conductive adhesive was overlaid with the frame member 72 for seam welding of the resistance heating method. The conductive terminal 75 and the frame connecting terminal 72 a extended over the lower end surface of the base member 71 were bent inside as facing each other. After this, the cell was placed on lands of the positive electrode wiring pattern 72 a and the negative electrode wiring pattern 72 b for soldering through a reflow furnace where preheating was at a temperature of 180° C. for ten minutes, and heating was at a temperature of 240° C. for one minute.
  • In order to evaluate the sealing property of the electrochemical cell, the cell was immersed in a fluorine liquid for a leak test. It was revealed that the cell had a sealing property of 10−5 atom·cc/sec or greater. In addition, the electrochemical cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that the characteristics were not varied before and after soldered.
    • Example 7
  • In order to confirm that it is advantageous for the reduction in the size of the electrochemical cell, the cell was fabricated where the outer shape of the base member 51 was 3 mm in width and 5 mm in thickness, and the thickness of the base member 51 was 1 mm from the bottom surface to the top surface of the cover member. The guide holes 59 of +1 mm were formed in the frame of the hoop, and guide pins were inserted for positioning by fitting to the guide holes 59 at a space of 10 μm. The electrodes, the separator and the electrolytes were incorporated, and then the frame member 52 was overlaid and welded with the cover member. The displacement was within 20 μg/m in assembling and welding these components. Consequently, even though variations are creased in the outer shape of the base member 51, the positions of the guide holes 59 formed in the frame of the hoop connected to the frame member 52 by the bridges 58 are formed highly accurately. Therefore, the electrodes, the separator and the electrolyte can be incorporated easily, and the cover member can be welded easily. More specifically, it was confirmed that the fabrication method was advantageous for the reduction in the size of the electrochemical cell. The fabricated electrochemical cell was evaluated as similar to the examples 1 to 6. As the evaluation method, the cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that no leakage was found before and after soldered, and that the capacity was not varied. The measurement conditions for capacity were that the cell was charged at 2.5 V for 30 minutes and then it was discharged at a current of 20 μA. The result is shown in Table 1.
  • FIG. 12 shows a traditional coin type electrochemical cell having the outer diameter of +3 mm and the thickness of 0.8 mm. The coin type cell does not have positive and negative electrodes on the same plane. Thus, the coin type electrochemical cell with terminals of surface mounting type was fabricated in which a positive electrode terminal 65 a formed of a metal plate 0.1 mm in thickness was welded to a positive electrode case 61, and a negative electrode terminal 65 b formed of a metal plate 0.1 mm in thickness was welded to a negative electrode case 63, where the width was 3 mm, the length was 5 mm, and the thickness was 1 mm. The electrochemical cell was evaluated as similar to the examples 1 to 7. As the evaluation method, the cell was soldered through a reflow furnace where a first zone was at a temperature of 160° C. for two minutes, a second zone was at a temperature of 200° C. or higher for one minute, and a peak temperature was 260° C. It was confirmed that no leakage was found before and after soldered, and that the capacity was not varied. The measurement conditions for capacity were that the cell was charged at 2.5 V for 30 minutes and then it was discharged at a current of 20 μA.
  • TABLE 1
    Before Reflow Soldering After Reflow
    Mounting Capacity Per Soldering
    Area Capacity Mounting Area Capacity
    (mm2) (mF) (mF/mm2) (mF)
    Example 7 15 40 2.7 40
    Comparative 15 10 0.7 10
    Example

Claims (11)

1.-15. (canceled)
16. A fabrication method of an electrochemical cell having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
placing the frame member formed in a hoop in a forming mold of the base member;
placing the conductive terminal in the forming mold of the base member;
injecting a resin material into the forming mold to form the base member in a box shape;
assembling the base member where the conductive terminal and the frame member are joined thereto into a container;
attaching one electrode of the pair of the electrodes to the conductive terminal;
placing the separator and the other electrode of the pair of the electrodes on a surface opposite to a surface contacting with the conductive terminal of the one electrode; and
overlaying and welding the frame member with the cover member by a heating unit.
17. The fabrication method of the electrochemical cell according to claim 16, further comprising the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
18. The fabrication method of the electrochemical cell according to claim 17, further comprising the step of continuously forming a plurality of the frame members in a hoop of metal foil formed with guide holes in which a part of the frame member has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
19. The fabrication method of the electrochemical cell according to claim 18, wherein in separating the frame member formed in the hoop, at least one part connecting the hoop to the frame member is left to form a frame connecting terminal extended from the frame member.
20. (canceled)
21. A fabrication method of an electrochemical cell having: a separator; a base member for housing a pair of electrodes facing each other through the separator; a conductive terminal penetrating through the base member; a frame member joined to the base member; and a cover member joined to the frame member, the fabrication method of the electrochemical cell comprising the steps of:
placing the conductive terminal formed in a hoop in a forming mold of the base member;
placing the frame member in the forming mold of the base member;
injecting a resin material into the forming mold to form the base member in a box shape;
assembling the base member where the frame member and the conductive terminal are joined thereto into a container;
attaching one electrode of the pair of the electrodes to the conductive terminal;
placing the separator and the other electrode of the pair of the electrodes on a surface opposite to a surface contacting with the conductive terminal of the one electrode; and
overlaying and welding the frame member with the cover member by a heating unit.
22. The fabrication method of the electrochemical cell according to claim 21, further comprising the step of carrying current through the hoop to plate a brazing material over the frame member, after the step of assembling the base member where the conductive terminal and the frame member are joined thereto into the container.
23. The fabrication method of the electrochemical cell according to claim 22, further comprising the step of continuously forming a plurality of the conductive terminals in a hoop of metal foil formed with guide holes in which a part of the frame member has bridges, and separating the bridges from the hoop of the metal foil, before or after the step of overlaying and welding the frame member with the cover member by the heating unit.
24. The fabrication method of the electrochemical cell according to claim 23, wherein in separating the conductive terminals formed in the hoop, at least one part connecting the hoop to the conductive terminals is left to form a frame connecting terminal extended from the frame member.
25.-30. (canceled)
US12/387,939 2003-06-29 2009-05-07 Electrochemical cell and fabrication method of the same Abandoned US20090223036A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/387,939 US20090223036A1 (en) 2003-06-29 2009-05-07 Electrochemical cell and fabrication method of the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003187805 2003-06-30
JP2003-187805 2003-06-30
US10/880,400 US7541111B2 (en) 2003-06-30 2004-06-29 Electrochemical cell and fabrication method of the same
JP2004-191069 2004-06-29
JP2004191069A JP4520778B2 (en) 2003-06-30 2004-06-29 Surface-mount type electrochemical cell and manufacturing method thereof
US12/387,939 US20090223036A1 (en) 2003-06-29 2009-05-07 Electrochemical cell and fabrication method of the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/880,400 Division US7541111B2 (en) 2003-06-29 2004-06-29 Electrochemical cell and fabrication method of the same

Publications (1)

Publication Number Publication Date
US20090223036A1 true US20090223036A1 (en) 2009-09-10

Family

ID=34197094

Family Applications (3)

Application Number Title Priority Date Filing Date
US10/834,636 Expired - Fee Related US7023078B2 (en) 2003-05-06 2004-04-29 Packages for communication devices
US10/880,400 Expired - Fee Related US7541111B2 (en) 2003-06-29 2004-06-29 Electrochemical cell and fabrication method of the same
US12/387,939 Abandoned US20090223036A1 (en) 2003-06-29 2009-05-07 Electrochemical cell and fabrication method of the same

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US10/834,636 Expired - Fee Related US7023078B2 (en) 2003-05-06 2004-04-29 Packages for communication devices
US10/880,400 Expired - Fee Related US7541111B2 (en) 2003-06-29 2004-06-29 Electrochemical cell and fabrication method of the same

Country Status (2)

Country Link
US (3) US7023078B2 (en)
JP (1) JP4520778B2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005114730A1 (en) * 2004-05-20 2005-12-01 Spansion Llc Process for producing semiconductor device and semiconductor device
JP4903421B2 (en) * 2005-02-23 2012-03-28 京セラ株式会社 Ceramic container and battery or electric double layer capacitor using the same
US8029927B2 (en) * 2005-03-22 2011-10-04 Blue Spark Technologies, Inc. Thin printable electrochemical cell utilizing a “picture frame” and methods of making the same
JP2006269946A (en) * 2005-03-25 2006-10-05 Sii Micro Parts Ltd Capacitor and manufacturing method thereof
WO2007013223A1 (en) 2005-07-29 2007-02-01 Sii Micro Parts Ltd. Electrochemical cell
JP5082220B2 (en) * 2005-10-05 2012-11-28 トヨタ自動車株式会社 Fuel cell system
US20090061309A1 (en) * 2006-01-30 2009-03-05 Kyocera Corporation Container for Electric Energy Storage Device, and Battery and Electric Double Layer Capacitor Using the Same
US8018042B2 (en) * 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads
US8058719B2 (en) * 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
JP5254347B2 (en) * 2007-10-24 2013-08-07 メルク パテント ゲーエムベーハー Optoelectronic device
DE102008017454B4 (en) * 2008-04-05 2010-02-04 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with hermetically sealed circuit arrangement and manufacturing method for this purpose
KR101067168B1 (en) * 2009-10-13 2011-09-22 삼성전기주식회사 Chip-type electric double layer capacitor and method for manufacturing the same
JP5325820B2 (en) * 2010-03-17 2013-10-23 太陽誘電株式会社 Electrochemical devices
CN103119746B (en) * 2010-06-04 2016-01-06 A123***有限责任公司 Curling prismatic battery structure
KR101108855B1 (en) * 2010-06-23 2012-01-31 삼성전기주식회사 Electrochemical capacitor
JP5905731B2 (en) * 2011-02-15 2016-04-20 セイコーインスツル株式会社 Electrochemical element and manufacturing method thereof
WO2012141231A1 (en) * 2011-04-15 2012-10-18 株式会社 村田製作所 Solid state battery
WO2012153761A1 (en) * 2011-05-12 2012-11-15 セイコーインスツル株式会社 Electrochemical cell
KR20130006934A (en) * 2011-06-27 2013-01-18 삼성전기주식회사 Energy storage device and manufacturing method thereof and unit cell for energy storage device
KR101222872B1 (en) 2011-08-08 2013-01-25 비나텍주식회사 Super capacitor having case terminal and manufacturing method thereof
WO2013044224A2 (en) 2011-09-22 2013-03-28 Blue Spark Technologies, Inc. Cell attachment method
CN103875120B (en) 2011-09-30 2016-05-25 株式会社村田制作所 Battery outer structure
US9782082B2 (en) 2012-11-01 2017-10-10 Blue Spark Technologies, Inc. Body temperature logging patch
JP6178428B2 (en) 2012-11-27 2017-08-09 ブルー スパーク テクノロジーズ，インク． Battery cell configuration
CN102984905B (en) * 2012-12-04 2016-08-03 茂硕电源科技股份有限公司 A kind of LED seals power supply and encapsulating method thereof
JP6400301B2 (en) * 2013-02-28 2018-10-03 セイコーインスツル株式会社 Electrochemical cell and method for producing the same
JP6341685B2 (en) * 2013-02-28 2018-06-13 セイコーインスツル株式会社 Electrochemical cell
JP6341686B2 (en) * 2013-02-28 2018-06-13 セイコーインスツル株式会社 Electrochemical cell and method for producing the same
US9693689B2 (en) 2014-12-31 2017-07-04 Blue Spark Technologies, Inc. Body temperature logging patch
JP6450612B2 (en) * 2015-03-11 2019-01-09 日本特殊陶業株式会社 Electronic component device and manufacturing method thereof
US11830672B2 (en) 2016-11-23 2023-11-28 KYOCERA AVX Components Corporation Ultracapacitor for use in a solder reflow process
JP6906242B2 (en) * 2017-02-03 2021-07-21 日本蓄電器工業株式会社 Solid electrolytic capacitors and their manufacturing methods
US10849501B2 (en) 2017-08-09 2020-12-01 Blue Spark Technologies, Inc. Body temperature logging patch

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030008208A1 (en) * 2001-06-19 2003-01-09 Masato Yamazaki Battery
US6733544B2 (en) * 2000-10-11 2004-05-11 Sii Micro Parts Ltd. Method of producing electrical double layer capacitor and method of mounting electrical double layer capacitor on a circuit substrate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52112729A (en) * 1976-03-12 1977-09-21 Furukawa Battery Co Ltd Method of airrtightly bonding ceramic member of ceramic sealing cover of battery to metallic member
JPS6232623A (en) * 1985-08-05 1987-02-12 Mitsubishi Electric Corp Semiconductor device
JPH05315189A (en) * 1992-04-01 1993-11-26 Nec Corp Molded-armor type electric double layer capacitor and manufacture thereof
JPH09283387A (en) * 1996-04-12 1997-10-31 Fuji Elelctrochem Co Ltd Electric double-layered capacitor
JPH10144279A (en) * 1996-11-07 1998-05-29 Fuji Elelctrochem Co Ltd Explosion-proof structure for rectangular electrochemical element
JPH1154387A (en) * 1997-07-30 1999-02-26 Tdk Corp Chip-type electric double-layer capacitor
JPH11191520A (en) * 1997-12-26 1999-07-13 Tdk Corp Chip-type electric double-layered capacitor
US6025087A (en) * 1998-02-19 2000-02-15 Micron Technology, Inc. Battery mounting and testing apparatuses, methods of forming battery mounting and testing apparatuses, battery-powered test configured electronic devices, and methods of forming battery-powered test configured electronic devices
DE19837909C2 (en) * 1998-08-20 2001-05-17 Implex Hear Tech Ag Protection device for a multi-rechargeable electrochemical battery
JP3684305B2 (en) * 1998-09-17 2005-08-17 日本オプネクスト株式会社 Semiconductor laser coupling device and semiconductor light receiving device
JP3959220B2 (en) * 2000-02-04 2007-08-15 株式会社エスアイアイ・マイクロパーツ Non-aqueous electrolytic battery for surface mounting and electric double layer capacitor for surface mounting
JP4020296B2 (en) * 2000-12-21 2007-12-12 キヤノン株式会社 Ionic conduction structure, secondary battery and method for producing them

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6733544B2 (en) * 2000-10-11 2004-05-11 Sii Micro Parts Ltd. Method of producing electrical double layer capacitor and method of mounting electrical double layer capacitor on a circuit substrate
US20030008208A1 (en) * 2001-06-19 2003-01-09 Masato Yamazaki Battery

Also Published As

Publication number Publication date
US7023078B2 (en) 2006-04-04
JP4520778B2 (en) 2010-08-11
US7541111B2 (en) 2009-06-02
US20050037258A1 (en) 2005-02-17
US20040257779A1 (en) 2004-12-23
JP2005039256A (en) 2005-02-10

Similar Documents

Publication Publication Date Title
US7541111B2 (en) Electrochemical cell and fabrication method of the same
JP3959220B2 (en) Non-aqueous electrolytic battery for surface mounting and electric double layer capacitor for surface mounting
JP4550519B2 (en) Electrochemical cell and method for producing the same
JP5382891B2 (en) Electrochemical cell
JP5013772B2 (en) Electric double layer capacitor
US20060040177A1 (en) Electrochemical cell
US8976508B2 (en) Electrochemical cell
KR100897638B1 (en) Method of producing coin-shaped electrochemical element and coin-shaped electrochemical element
KR101254840B1 (en) Battery with leads
KR101490026B1 (en) Battery Pack And Production Method For The Same
JP5268488B2 (en) Electrochemical cell with terminal
JP5788272B2 (en) Electrochemical devices
US20050207095A1 (en) Electric double layer capacitor, electrolytic cell and process for fabricating same
JP2016092344A (en) Electrochemical cell
JP4845388B2 (en) Electrochemical cell
US20230076491A1 (en) Battery pack and electronic device
JP4361319B2 (en) Electrochemical cell and method for producing the same
JP4865219B2 (en) Electrochemical cell and method for producing the same
JP6362063B2 (en) Electrochemical cell
JP4950417B2 (en) Electrochemical cell
KR101312428B1 (en) Connecting structure for PCB and secondary battery utilizing the same
JP7327664B2 (en) Battery packs and electronic devices
JP2012109250A (en) Electrochemical cell and manufacturing method thereof
KR100869378B1 (en) Battery Pack with Embossed Portion for Electrical Connection Formed at Bottom of Battery Cell
JP2006100199A (en) Coin type electrochemical element for mounting

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION