US20090071868A1 - Carrier Tape Segment Including Mechanical Interlocking Features Thereon - Google Patents
Carrier Tape Segment Including Mechanical Interlocking Features Thereon Download PDFInfo
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- US20090071868A1 US20090071868A1 US11/856,370 US85637007A US2009071868A1 US 20090071868 A1 US20090071868 A1 US 20090071868A1 US 85637007 A US85637007 A US 85637007A US 2009071868 A1 US2009071868 A1 US 2009071868A1
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- Prior art keywords
- carrier tape
- interlocking feature
- mechanical interlocking
- tape segment
- segment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Definitions
- the present invention relates to carrier tapes for temporarily carrying microelectronic components for storage or transportation.
- carrier tape packaging systems to facilitate automatic handling of microelectronic components, such as IC chips or surface mount devices (SMD's), in a manner to protect those components and to avoid damage to the same while simultaneously minimizing electro-static charge buildup during automatic handling.
- Existing carrier tape packaging systems typically include an elongated double sided and flexible carrier tape which is made of paper or plastic.
- the flexible carrier tape has a multiplicity of either punched or embossed cavities or pockets which are utilized for retaining microelectronic components therein
- heat sealed cover tapes one on each side of a punched carrier tape, or one on the open side of an embossed carrier tape, are used to retain components within the pockets.
- the current manufacturing process sends a singulated IC chip or other SMD to a Tape and Reel Die Sort (TRDS) module.
- TRDS Tape and Reel Die Sort
- the die is picked from a mounting Mylar, flipped over so that it is placed bump-side in a pocket of the carrier tape, then covered with the tape to hold the die in the carrier tape pocket.
- the carrier tape is then wound onto an output reel. When the correct amount of die are processed, the carrier tape is cut and the output reel is removed from the TRDS tool and transported to the chip attach module (CAM module).
- CAM module chip attach module
- a tape splicer is typically used at the output of the TRDS.
- a tape splicer is a machine that welds one reel of carrier tape to the next.
- the tape splicer has performed poorly with carrier tapes, and especially with 24 mm carrier tapes, because index holes exist on only one side of 24 mm carrier tapes.
- the splicer was originally designed to utilize index holes on both sides of the carrier tape during the splicing process. Where index holes exist on only one side of the pocket, this could cause poor splicing and/or indexer jams within the splicer. Furthermore, the poor splicing could cause problems at the CAM module if the transition of a pocket to the CAM module is not smooth.
- the prior art fails to provide an effective arrangement to standardize output reel sizes and to avoid wasting remnant carrier tape.
- FIG. 1 a is a top plan view of a carrier tape segment according to a first embodiment
- FIG. 1 b is a cross-sectional view through the segment of FIG. 1 a through lines Ib-Ib;
- FIG. 2 is a top plan view of two carrier tape segments similar to the segment of FIG. 1 a chain linked together;
- FIG. 3 is a top plan view of a carrier tape segment according to a second embodiment.
- first element disposed on, above, or below a second element may be directly in contact with the second element or it may include one or more intervening elements.
- first element disposed next to or adjacent a second element may be directly in contact with the second element or it may include one or more intervening elements.
- FIGS. 1 a - 1 b , 2 and 3 The figures, however, should not be taken to be limiting, as they are intended for the purpose of explanation and understanding.
- an embodiment includes a segment of a carrier tape, or carrier tape segment, such as carrier tape segment 100 , an individual segment having been shown in FIGS. 1 a , 1 b and 3 , it being noted that FIG. 1 b is a cross-sectional view of the carrier tape segment of FIG. 1 b along lines Ib-Ib.
- carrier tape segment what is meant in the context of embodiments is a segment of carrier tape material which, when assembled with other such segments, yields a carrier tape chain for microelectronic components.
- Carrier tape segment 100 as shown includes a tape segment body 102 having a head portion 104 and a tail portion 106 .
- the “head portion” of the tape segment body is meant to refer to that portion of a tape segment body which is adapted to advance in a feed direction of the tape segment body, such as in a TRDS module, ahead of the “tail portion” of the tape segment body, and, in contrast, the “tail portion” of the tape segment body is meant to refer to that portion of a tape segment body which is adapted to advance in a feed direction of the tape segment body, such as in a TRDS module behind the “head portion” of the tape segment body.
- the tape segment body 102 further includes a component carrying portion 108 between the head portion 104 and the tail portion 106 .
- the “component carrying portion” is that portion of the tape segment body 102 which is configured to carry one or more microelectronic components thereon.
- the component carrying portion 108 may include one or a plurality of pockets, such as pockets 110 shown in the figures, either embossed or punched, and adapted to receive a microelectronic component therein, or an adhesive backed tape portion (not shown) such as an adhesive portion adapted to hold the microelectronic component thereon.
- the embodiment of the tape carrier segment 100 of FIGS. 1 a , 1 b and 2 includes a single component carrying portion (pocket 110 )
- the embodiment of the tape carrier segment 100 of FIG. 2 includes a plurality of component carrying portions (pockets 110 ).
- the component carrying portion according to embodiments is not limited to pockets or adhesive backed tape portions, but includes within its scope any configuration of the tape segment body that would allow the carrying of a microelectronic component of a carrier tape including the carrier tape segment.
- the head portion 104 may include a first mechanical interlocking feature 112 thereon, and the tail portion 106 may include a second mechanical interlocking feature 114 thereon. As shown, the first and second mechanical interlocking features 112 and 114 may be complementary.
- the first mechanical interlocking feature may be configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature
- the second mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature, the carrier tape segment being thereby configured to be linked to other carrier tape segments to form a carrier tape therewith.
- mechanical interlocking feature what is meant in the context of the instant description is a structural feature that allows a mechanical linking or locking, by virtue of its geometric configuration, with another complementarily shaped mechanical interlocking feature, without necessitating the use of chemical linking (including for example, adhesives, chemical bonding, etc).
- FIG. 2 An example of the complementary nature of the first mechanical interlocking feature 112 and the second mechanical interlocking feature 114 is best seen in FIG. 2 .
- two carrier tape segments 100 similar to the carrier tape segment 100 of FIGS.
- 1 a and 1 b may be linked to one another using the first mechanical interlocking feature 112 on one of the carrier tape segments 100 , which may be interlocked with the second mechanical interlocking feature 114 on the other one of the carrier tape segments 100 as shown, the carrier tape segments 100 thereby being configured to be linked to one another, and to other carrier tape segments to form a carrier tape chain therewith.
- one of the mechanical interlocking features on a given carrier tape segment may comprise a male interlocking feature
- another one of the mechanical interlocking features that is, the remaining mechanical interlocking feature on the given carrier tape segment, may comprise a female interlocking feature.
- the first mechanical interlocking feature 112 is a male interlocking feature, which may include a rectangular projection 116 of the head portion 104 .
- FIGS. 1 a , 1 b , 2 and 3 the first mechanical interlocking feature 112 is a male interlocking feature, which may include a rectangular projection 116 of the head portion 104 .
- the second mechanical interlocking feature 114 is a female interlocking feature, which may include parts of the tape segment body 102 defining a hole 118 configured to receive a rectangular projection of a separate carrier tape segment, which projection is shaped similarly to projection 116 .
- the first and second mechanical interlocking features are adapted to snap into a complementary mechanical interlocking feature of a separate, or neighboring, carrier tape segment. According to an embodiment, such snapping of a male mechanical interlocking feature into a female mechanical interlocking feature may take place either by way of external force, such as by using additional tooling to effect such snapping, or automatically.
- mechanical interlocking features may “snap into” one another when such features overcome initial mechanical resistance, such as, for example, by a slight deformation of portions of the carrier tape segment, before engaging one another.
- the mechanical interlocking features 112 and 114 of neighboring carrier tape segments 100 are configured to automatically snap into one another as a result of a predetermined alignment and spacing of the adjacent carrier tape segments. For example, two individual carrier tape segments such as segment 100 of FIGS.
- Alignment may be performed for example by using indexing holes on one or more sides of the carrier tape segments.
- a sprocket in the feed system of the TRDS tool could introduce its spikes into those indexing holes in order to move carrier tape segments forward toward one another.
- the indexing may, for example, be controlled by the number of index holes between neighboring carrier tape segments.
- a final adjustment may be made by the operator in the carrier tape segment setup prior to processing.
- carrier tape segments snapped into one another may then yield a carrier tape chain.
- the carrier tape segments may include any number of features thereon to facilitate processing of the same, such as, for example, index holes at one or more sides thereof, such as index holes 120 .
- the index holes are generally provided to facilitate handling the carrier tape segments and/or the chain resulting therefrom through the TRDS module and CAM.
- embodiments provide an effective system to standardize output reel sizes and to avoid wasting remnant carrier tape, in this way overcoming the problems of the prior art noted above and obviating the necessity for splice tools.
- embodiments as described above allow uniform indexing quality, increase cost savings and decrease consumables by avoiding carrier tape waste and allowing the carrier tape segment to be reused and/or recycled.
- embodiments as described above may advantageously be implemented within the TRDS machine and even integrated into the pick setup of the TRDS machine, although to do so would require machine changes on the pick and place mechanisms as well as on the feed system. While such modifications are possible, a path of least difficulty would be to link the carrier tape chain within the feed system of the TRDS tool.
- the segments of carrier tape may come pre packed in a dispensing cartridge by the supplier, which dispensing cartridge may be recyclable.
- the input of the TRDS module may include a section adapted to receive a set of carrier tape segments as described above.
- the sets may, for example, be in stacked format.
- the TRDS module may then provide an adhesive tape on top of the carrier tape chain moving therethrough, the adhesive tape being, for example, similar to adhesive tapes used on top of carrier tapes of the prior art.
- the adhesive tape may advantageously strengthen the mechanical chain linked connection between individual carrier tape segments.
- the thus strengthened carrier tape chain may then be wound onto an output reel in a conventional manner.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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Abstract
A carrier tape segment to carry a microelectronic component thereon. The carrier tape segment includes a tape segment body having a head portion and a tail portion, and a component carrying portion between the head portion and the tail portion. The head portion includes a first mechanical interlocking feature thereon. The tail portion includes a second mechanical interlocking feature thereon. The first mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature is configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature. The carrier tape segment is thereby configured to be linked to other carrier tape segments to form a carrier tape chain therewith.
Description
- The present invention relates to carrier tapes for temporarily carrying microelectronic components for storage or transportation.
- The prior art uses carrier tape packaging systems to facilitate automatic handling of microelectronic components, such as IC chips or surface mount devices (SMD's), in a manner to protect those components and to avoid damage to the same while simultaneously minimizing electro-static charge buildup during automatic handling. Existing carrier tape packaging systems typically include an elongated double sided and flexible carrier tape which is made of paper or plastic. The flexible carrier tape has a multiplicity of either punched or embossed cavities or pockets which are utilized for retaining microelectronic components therein
- Generally, heat sealed cover tapes, one on each side of a punched carrier tape, or one on the open side of an embossed carrier tape, are used to retain components within the pockets. The current manufacturing process sends a singulated IC chip or other SMD to a Tape and Reel Die Sort (TRDS) module. At the TRDS module, the die is picked from a mounting Mylar, flipped over so that it is placed bump-side in a pocket of the carrier tape, then covered with the tape to hold the die in the carrier tape pocket. The carrier tape is then wound onto an output reel. When the correct amount of die are processed, the carrier tape is cut and the output reel is removed from the TRDS tool and transported to the chip attach module (CAM module). At the CAM module the cover tape is peeled back, and the die is then removed from the carrier tape and placed on a substrate. In order to standardize output reel sizes from the TRDS and to avoid wasting remnant carrier tape, a tape splicer is typically used at the output of the TRDS. A tape splicer is a machine that welds one reel of carrier tape to the next.
- Disadvantageously, the tape splicer has performed poorly with carrier tapes, and especially with 24 mm carrier tapes, because index holes exist on only one side of 24 mm carrier tapes. The splicer was originally designed to utilize index holes on both sides of the carrier tape during the splicing process. Where index holes exist on only one side of the pocket, this could cause poor splicing and/or indexer jams within the splicer. Furthermore, the poor splicing could cause problems at the CAM module if the transition of a pocket to the CAM module is not smooth.
- The prior art fails to provide an effective arrangement to standardize output reel sizes and to avoid wasting remnant carrier tape.
-
FIG. 1 a is a top plan view of a carrier tape segment according to a first embodiment; -
FIG. 1 b is a cross-sectional view through the segment ofFIG. 1 a through lines Ib-Ib; -
FIG. 2 is a top plan view of two carrier tape segments similar to the segment ofFIG. 1 a chain linked together; and -
FIG. 3 is a top plan view of a carrier tape segment according to a second embodiment. - For simplicity and clarity of illustration, elements in the drawings have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Where considered appropriate, reference numerals have been repeated among the drawings to indicate corresponding or analogous elements.
- In the following detailed description, a carrier tape segment and a set including a plurality of such segments are disclosed. Reference is made to the accompanying drawings within which are shown, by way of illustration, specific embodiments by which the present invention may be practiced. It is to be understood that other embodiments may exist and that other structural changes may be made without departing from the scope and spirit of the present invention.
- The terms on, above, below, and adjacent as used herein refer to the position of one element relative to other elements. As such, a first element disposed on, above, or below a second element may be directly in contact with the second element or it may include one or more intervening elements. In addition, a first element disposed next to or adjacent a second element may be directly in contact with the second element or it may include one or more intervening elements.
- Aspects of this and other embodiments will be discussed herein with respect to
FIGS. 1 a-1 b, 2 and 3 below. The figures, however, should not be taken to be limiting, as they are intended for the purpose of explanation and understanding. - Referring to
FIGS. 1 a, 1 b, 2 and 3, an embodiment includes a segment of a carrier tape, or carrier tape segment, such ascarrier tape segment 100, an individual segment having been shown inFIGS. 1 a, 1 b and 3, it being noted thatFIG. 1 b is a cross-sectional view of the carrier tape segment ofFIG. 1 b along lines Ib-Ib. By “carrier tape segment,” what is meant in the context of embodiments is a segment of carrier tape material which, when assembled with other such segments, yields a carrier tape chain for microelectronic components.Carrier tape segment 100 as shown includes atape segment body 102 having ahead portion 104 and atail portion 106. The “head portion” of the tape segment body is meant to refer to that portion of a tape segment body which is adapted to advance in a feed direction of the tape segment body, such as in a TRDS module, ahead of the “tail portion” of the tape segment body, and, in contrast, the “tail portion” of the tape segment body is meant to refer to that portion of a tape segment body which is adapted to advance in a feed direction of the tape segment body, such as in a TRDS module behind the “head portion” of the tape segment body. Thetape segment body 102 further includes a component carrying portion 108 between thehead portion 104 and thetail portion 106. The “component carrying portion” is that portion of thetape segment body 102 which is configured to carry one or more microelectronic components thereon. For example, the component carrying portion 108 may include one or a plurality of pockets, such as pockets 110 shown in the figures, either embossed or punched, and adapted to receive a microelectronic component therein, or an adhesive backed tape portion (not shown) such as an adhesive portion adapted to hold the microelectronic component thereon. While the embodiment of thetape carrier segment 100 ofFIGS. 1 a, 1 b and 2 includes a single component carrying portion (pocket 110), the embodiment of thetape carrier segment 100 ofFIG. 2 includes a plurality of component carrying portions (pockets 110). The component carrying portion according to embodiments is not limited to pockets or adhesive backed tape portions, but includes within its scope any configuration of the tape segment body that would allow the carrying of a microelectronic component of a carrier tape including the carrier tape segment. - Referring still to
FIGS. 1 a, 1 b, 2 and 3, thehead portion 104 may include a first mechanical interlocking feature 112 thereon, and thetail portion 106 may include a second mechanical interlocking feature 114 thereon. As shown, the first and second mechanical interlocking features 112 and 114 may be complementary. In other words, the first mechanical interlocking feature may be configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature, the carrier tape segment being thereby configured to be linked to other carrier tape segments to form a carrier tape therewith. By “mechanical interlocking feature,” what is meant in the context of the instant description is a structural feature that allows a mechanical linking or locking, by virtue of its geometric configuration, with another complementarily shaped mechanical interlocking feature, without necessitating the use of chemical linking (including for example, adhesives, chemical bonding, etc). An example of the complementary nature of the first mechanical interlocking feature 112 and the second mechanical interlocking feature 114 is best seen inFIG. 2 . As shown in the example ofFIG. 2 , twocarrier tape segments 100 similar to thecarrier tape segment 100 ofFIGS. 1 a and 1 b may be linked to one another using the first mechanical interlocking feature 112 on one of thecarrier tape segments 100, which may be interlocked with the second mechanical interlocking feature 114 on the other one of thecarrier tape segments 100 as shown, thecarrier tape segments 100 thereby being configured to be linked to one another, and to other carrier tape segments to form a carrier tape chain therewith. - According to an embodiment, one of the mechanical interlocking features on a given carrier tape segment, either the first or the second, may comprise a male interlocking feature, and another one of the mechanical interlocking features, that is, the remaining mechanical interlocking feature on the given carrier tape segment, may comprise a female interlocking feature. In the shown embodiments of
FIGS. 1 a, 1 b, 2 and 3, the first mechanical interlocking feature 112 is a male interlocking feature, which may include a rectangular projection 116 of thehead portion 104. In addition, in the shown embodiments ofFIGS. 1 a, 1 b, 2 and 3, the second mechanical interlocking feature 114 is a female interlocking feature, which may include parts of thetape segment body 102 defining a hole 118 configured to receive a rectangular projection of a separate carrier tape segment, which projection is shaped similarly to projection 116. In the shown embodiment, the first and second mechanical interlocking features are adapted to snap into a complementary mechanical interlocking feature of a separate, or neighboring, carrier tape segment. According to an embodiment, such snapping of a male mechanical interlocking feature into a female mechanical interlocking feature may take place either by way of external force, such as by using additional tooling to effect such snapping, or automatically. As used herein, mechanical interlocking features may “snap into” one another when such features overcome initial mechanical resistance, such as, for example, by a slight deformation of portions of the carrier tape segment, before engaging one another. In the shown embodiments ofFIGS. 1 a, 1 b, 2 and 3, the mechanical interlocking features 112 and 114 of neighboringcarrier tape segments 100, such as those shown inFIG. 2 , for example, are configured to automatically snap into one another as a result of a predetermined alignment and spacing of the adjacent carrier tape segments. For example, two individual carrier tape segments such assegment 100 ofFIGS. 1 a, 1 b, 2 or 3, may be aligned and spaced with respect to one another such that the male mechanical interlocking element of one of the carrier tape segments slides under a tail portion of an adjacent carrier tape segment to first temporarily deform such tail portion before automatically snapping into the female mechanical interlocking element of the adjacent carrier tape segment. Alignment may be performed for example by using indexing holes on one or more sides of the carrier tape segments. A sprocket in the feed system of the TRDS tool, for example, could introduce its spikes into those indexing holes in order to move carrier tape segments forward toward one another. The indexing may, for example, be controlled by the number of index holes between neighboring carrier tape segments. A final adjustment may be made by the operator in the carrier tape segment setup prior to processing. A plurality of such carrier tape segments snapped into one another may then yield a carrier tape chain. In addition, the carrier tape segments may include any number of features thereon to facilitate processing of the same, such as, for example, index holes at one or more sides thereof, such as index holes 120. The index holes are generally provided to facilitate handling the carrier tape segments and/or the chain resulting therefrom through the TRDS module and CAM. - Advantageously, embodiments provide an effective system to standardize output reel sizes and to avoid wasting remnant carrier tape, in this way overcoming the problems of the prior art noted above and obviating the necessity for splice tools. Specifically, embodiments as described above allow uniform indexing quality, increase cost savings and decrease consumables by avoiding carrier tape waste and allowing the carrier tape segment to be reused and/or recycled. In addition, embodiments as described above may advantageously be implemented within the TRDS machine and even integrated into the pick setup of the TRDS machine, although to do so would require machine changes on the pick and place mechanisms as well as on the feed system. While such modifications are possible, a path of least difficulty would be to link the carrier tape chain within the feed system of the TRDS tool. Doing so would also require a machine modification to allow the feed system to feed and link the carrier tape segments to one another. Additionally, advantageously, using a chain link geometry as a proposed linking mechanism as described above requires no external heat or sonic welding processes, and allows for a reloading the carrier tape segments into the TRDS module during a functioning of the module without stopping the same. The segments of carrier tape may come pre packed in a dispensing cartridge by the supplier, which dispensing cartridge may be recyclable. The input of the TRDS module may include a section adapted to receive a set of carrier tape segments as described above. The sets may, for example, be in stacked format. The TRDS module may then provide an adhesive tape on top of the carrier tape chain moving therethrough, the adhesive tape being, for example, similar to adhesive tapes used on top of carrier tapes of the prior art. The adhesive tape may advantageously strengthen the mechanical chain linked connection between individual carrier tape segments. The thus strengthened carrier tape chain may then be wound onto an output reel in a conventional manner.
- The various embodiments described above have been presented by way of example and not by way of limitation. Having thus described in detail embodiments of the present invention, it is understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description, as many variations thereof are possible without departing from the spirit or scope thereof.
Claims (15)
1. A carrier tape segment to carry a microelectronic component thereon, the carrier tape segment including a tape segment body having a head portion and a tail portion, and a component carrying portion between the head portion and the tail portion, wherein:
the head portion includes a first mechanical interlocking feature thereon;
the tail portion includes a second mechanical interlocking feature thereon; the first mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature, the carrier tape segment being thereby configured to be linked to other carrier tape segments to form a carrier tape chain therewith.
2. The carrier tape segment of claim 1 , wherein the component carrying portion is configured to carry a single component thereon.
3. The carrier tape segment of claim 1 , wherein the component carrying portion is configured to carry multiple components thereon.
4. The carrier tape segment of claim 1 , wherein one of the first mechanical interlocking feature and the second mechanical interlocking feature comprises a male interlocking feature, and another one of the first mechanical interlocking feature and the second mechanical interlocking feature comprises a female interlocking feature.
5. The carrier tape segment of claim 4 , wherein the first mechanical interlocking feature is configured to snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature is configured to snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature.
6. The carrier tape segment of claim 5 , wherein the first mechanical interlocking feature is configured to automatically snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature as a result of a predetermined alignment and spacing of the carrier tape segment with the separate carrier tape segment, and the second mechanical interlocking feature is configured to automatically snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature as a result of a predetermined alignment and spacing of the carrier tape segment with the separate carrier tape segment.
7. The carrier tape segment of claim 1 , wherein the tape body defines index holes on at least one side thereof.
8. The carrier tape segment of claim 1 , wherein the component carrying portion includes one or a plurality of pockets, or an adhesive portion adapted to hold the component thereon.
9. A set of carrier tape segments, each of the carrier tape segments including a tape segment body having a head portion and a tail portion, and a component carrying portion between the head portion and the tail portion, wherein:
the head portion includes a first mechanical interlocking feature thereon; and
the tail portion includes a second mechanical interlocking feature thereon; the first mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature being configured to mechanically interlock with a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature, the carrier tape segment being thereby configured to be linked to other carrier tape segments to form a carrier tape chain therewith.
10. The set of claim 9 , wherein the component carrying portion is configured to carry a single component thereon.
11. The set of claim 9 , wherein the component carrying portion is configured to carry multiple components thereon.
12. The set of claim 9 , wherein one of the first mechanical interlocking feature and the second mechanical interlocking feature comprises a male interlocking feature, and another one of the first mechanical interlocking feature and the second mechanical interlocking feature comprises a female interlocking feature.
13. The carrier tape segment of claim 12 , wherein the first mechanical interlocking feature is configured to snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature, and the second mechanical interlocking feature is configured to snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature.
14. The carrier tape segment of claim 13 , wherein the first mechanical interlocking feature is configured to automatically snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the second mechanical interlocking feature as a result of a predetermined alignment and spacing of the carrier tape segment with the separate carrier tape segment, and the second mechanical interlocking feature is configured to automatically snap into a mechanical interlocking feature belonging to a separate carrier tape segment and shaped similarly to the first mechanical interlocking feature as a result of a predetermined alignment and spacing of the carrier tape segment with the separate carrier tape segment.
15. The set of claim 9 , wherein the set comprises one of a stack and a carrier tape chain including the carrier tape segments chain linked to one another via the mechanical linking mechanisms.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/856,370 US20090071868A1 (en) | 2007-09-17 | 2007-09-17 | Carrier Tape Segment Including Mechanical Interlocking Features Thereon |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/856,370 US20090071868A1 (en) | 2007-09-17 | 2007-09-17 | Carrier Tape Segment Including Mechanical Interlocking Features Thereon |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090071868A1 true US20090071868A1 (en) | 2009-03-19 |
Family
ID=40453316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/856,370 Abandoned US20090071868A1 (en) | 2007-09-17 | 2007-09-17 | Carrier Tape Segment Including Mechanical Interlocking Features Thereon |
Country Status (1)
Country | Link |
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US (1) | US20090071868A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5333733A (en) * | 1992-05-13 | 1994-08-02 | Gold Industries Co., Ltd. | Linked container for transporting precision devices |
US20050016897A1 (en) * | 2003-07-22 | 2005-01-27 | Samsung Electronics Co., Ltd. | Connection structure of circuit substrate |
US20070074996A1 (en) * | 2005-10-05 | 2007-04-05 | Nice Travis S | Carrier tape and heat shrinking cover tape for integrated circuit devices |
-
2007
- 2007-09-17 US US11/856,370 patent/US20090071868A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5333733A (en) * | 1992-05-13 | 1994-08-02 | Gold Industries Co., Ltd. | Linked container for transporting precision devices |
US20050016897A1 (en) * | 2003-07-22 | 2005-01-27 | Samsung Electronics Co., Ltd. | Connection structure of circuit substrate |
US20070074996A1 (en) * | 2005-10-05 | 2007-04-05 | Nice Travis S | Carrier tape and heat shrinking cover tape for integrated circuit devices |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: INTEL CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CONTES, ANDREW N;REEL/FRAME:021986/0803 Effective date: 20070911 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |