US20070269680A1 - Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate - Google Patents
Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate Download PDFInfo
- Publication number
- US20070269680A1 US20070269680A1 US11/662,046 US66204605A US2007269680A1 US 20070269680 A1 US20070269680 A1 US 20070269680A1 US 66204605 A US66204605 A US 66204605A US 2007269680 A1 US2007269680 A1 US 2007269680A1
- Authority
- US
- United States
- Prior art keywords
- copper
- electroless plating
- clad laminate
- flexible substrate
- pretreatment agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000007772 electroless plating Methods 0.000 title claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 14
- 239000004634 thermosetting polymer Substances 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 abstract description 12
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 238000012360 testing method Methods 0.000 abstract description 9
- 230000032683 aging Effects 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000012298 atmosphere Substances 0.000 abstract description 3
- -1 azole compound Chemical class 0.000 description 17
- 229910000510 noble metal Inorganic materials 0.000 description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 16
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 229920001721 polyimide Polymers 0.000 description 11
- 239000000344 soap Substances 0.000 description 11
- 229910052763 palladium Inorganic materials 0.000 description 10
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- 235000014113 dietary fatty acids Nutrition 0.000 description 8
- 239000000194 fatty acid Substances 0.000 description 8
- 229930195729 fatty acid Natural products 0.000 description 8
- 150000004665 fatty acids Chemical class 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 150000002736 metal compounds Chemical class 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- JYZJYKOZGGEXSX-UHFFFAOYSA-N 2-hydroxymyristic acid Chemical compound CCCCCCCCCCCCC(O)C(O)=O JYZJYKOZGGEXSX-UHFFFAOYSA-N 0.000 description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- YAQXGBBDJYBXKL-UHFFFAOYSA-N iron(2+);1,10-phenanthroline;dicyanide Chemical compound [Fe+2].N#[C-].N#[C-].C1=CN=C2C3=NC=CC=C3C=CC2=C1.C1=CN=C2C3=NC=CC=C3C=CC2=C1 YAQXGBBDJYBXKL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000002941 palladium compounds Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- ODIRBFFBCSTPTO-UHFFFAOYSA-N 1,3-selenazole Chemical compound C1=C[se]C=N1 ODIRBFFBCSTPTO-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 1
- QJGNSTCICFBACB-UHFFFAOYSA-N 2-octylpropanedioic acid Chemical compound CCCCCCCCC(C(O)=O)C(O)=O QJGNSTCICFBACB-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- HWXODROYZJBJSX-UHFFFAOYSA-N CC1CCCC1.[Pd] Chemical compound CC1CCCC1.[Pd] HWXODROYZJBJSX-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N CC1CO1 Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- YTLQFZVCLXFFRK-UHFFFAOYSA-N bendazol Chemical compound N=1C2=CC=CC=C2NC=1CC1=CC=CC=C1 YTLQFZVCLXFFRK-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- XSHCSXZEWYUIDM-UHFFFAOYSA-N chloroform;dioxane Chemical compound ClC(Cl)Cl.C1CCOOC1 XSHCSXZEWYUIDM-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- ZLTPDFXIESTBQG-UHFFFAOYSA-N isothiazole Chemical compound C=1C=NSC=1 ZLTPDFXIESTBQG-UHFFFAOYSA-N 0.000 description 1
- CTAPFRYPJLPFDF-UHFFFAOYSA-N isoxazole Chemical compound C=1C=NOC=1 CTAPFRYPJLPFDF-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229960004232 linoleic acid Drugs 0.000 description 1
- 125000005608 naphthenic acid group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- CQDAMYNQINDRQC-UHFFFAOYSA-N oxatriazole Chemical compound C1=NN=NO1 CQDAMYNQINDRQC-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 229920005989 resin Chemical class 0.000 description 1
- 239000011347 resin Chemical class 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- YGNGABUJMXJPIJ-UHFFFAOYSA-N thiatriazole Chemical compound C1=NN=NS1 YGNGABUJMXJPIJ-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Definitions
- Polyimide substrates are often used as a material of insulating substrates for electronic components. With the recent trend toward smaller, thinner electronics, two-layer copper polyimide substrates in which a metal layer is directly formed on a polyimide film have attracted attention for their greater flexibility. Although the initial adhesive force of these substrates between polyimide films and metal layers in the ordinary state is on a practical level, the characteristics such as adhesive force in an environment requiring heat resistance, or in that of high temperature and high humidity are considered unstable.
- Patent Document 1 A method for producing a metal layer in a flexible copper-clad laminate board of polyimide film by sputtering is disclosed in Patent Document 1, for example.
- Patent Document 1 A method for producing a metal layer in a flexible copper-clad laminate board of polyimide film by sputtering is disclosed in Patent Document 1, for example.
- that method costs high, and the adhesive force is not adequate in an environment requiring heat resistance, or an environment of high temperature and high humidity.
- Methods to improve the adhesion of the polyimide film and metal layer include plasma, UV, and other dry processes as well as alkaline and other wet processes, but in addition to safety and operability issues of the liquid used, these methods can lead to unevenness in the metal layer surface if excessively applied, damaging fine wire formation.
- an electroless plating pretreatment agent comprising a thermoset resin and a silane coupling agent having a metal capturing capability is used as an electroless plating pretreatment agent for the copper-clad laminate for a flexible substrate.
- a detailed description of the invention is as follows.
- An electroless plating pretreatment agent applied to a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability.
- thermoset resin is an epoxy resin
- a copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent according to (1) or (2), a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
- the copper-clad laminate for a flexible substrate which is obtained by treating a substrate material with an electroless plating pretreatment agent of the present invention and then laminating an electroless copper plating layer and an electroplated copper layer, is a copper-clad laminate for a flexible substrate having two copper layers excellent in adhesion such that the initial adhesive force between the substrate material and copper plating layer in an ordinary state, and the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm. An adhesive force is provided to the surface of the substrate material without any wet or dry pretreatment whatsoever.
- the electroless plating pretreatment agent of the present invention comprises a thermoset resin and a silane coupling agent having a metal capturing capability.
- a noble metal catalyst can be adhered to the surface to be plated more uniformly and reliably via the silane coupling agent.
- a preferred silane coupling agent is obtained by reacting an azole compound or an amine compound with an epoxy compound.
- amine compound examples include saturated hydrocarbon amines such as propylamine, unsaturated hydrocarbon amines such as vinylamine, and aromatic amines such as phenylamine.
- the silane coupling agent is a compound having an —SiX 1 X 2 X 3 group in addition to having a noble metal capturing group derived from the above-mentioned azole compound or amine compound, where X 1 , X 2 , and X 3 represent an alkyl, halogen, alkoxide group or the like and may be a functional group capable of being attached to an article to be plated.
- X 1 , X 2 , and X 3 may be identical or different.
- the above-mentioned silane coupling agent may be obtained by reacting the above-mentioned azole or amine compound with the epoxy silane compound.
- Such an epoxy silane compound is preferably an epoxy coupling agent expressed as (In the formula, R 1 and R 2 are hydrogen or alkyl groups having 1 to 3 carbons, and n is a number from 0 to 3).
- a reaction between the above-mentioned azole compound and the above-mentioned epoxy group-containing silane compound is carried out under the conditions described in Japanese Patent Publication No. H6-256358, for example.
- ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltriethoxysilane, and ⁇ -mercaptopropyltrimethoxysilane are other examples of silane coupling agents having a functional group with a metal capturing capability used in the present invention.
- thermoset resin used in the electroless plating pretreatment agent of the present invention epoxy resin, urea resin, phenol resin, melamine resin, and urethane resin are exemplified.
- the adhesive force is improved.
- an epoxy resin as the thermoset resin is preferable because it has a particularly remarkable effect in improving the adhesive force.
- the electroless plating pretreatment agent contains a noble metal compound.
- Plating activity can be obtained by immersion in the plating pretreatment agent of the present invention and then in a palladium chloride aqueous solution.
- the plating pretreatment agent contains a catalyst such as a noble metal compound.
- the catalyst include a compound of a noble metal such as palladium, silver, platinum, or gold, for example a halide, a hydroxide, a sulfate and a carbonate thereof, and a noble metal soap thereof, of which a palladium compound is particularly preferable.
- a conventional catalyst such as tin chloride may be contained in the plating pretreatment agent within the scope of the object of the present invention.
- the noble metal soap can be obtained through a reaction of a fatty acid, a resin acid, or a naphthenic acid with a noble metal compound, and is preferably used in the present invention.
- fatty acid examples include octylic acid, neodecanoic acid, dodecanoic acid, pentadecanoic acid, octadecanoic acid, and other saturated fatty acids; oleic acid, linolic acid, and other unsaturated fatty acids; hydroxytetradecanoic acid, carboxydecanoic acid, and other oxygen-containing fatty acids; and mixtures thereof.
- fatty acids, resin acids, and naphthenic acids include naphthenic acid, octylic acid, neodecanoic acid, and pentadecanoic acid.
- examples of the above-mentioned noble metal compound include compounds that can form a soap with a fatty acid or the like, and that can be halides, hydroxides, sulfates, and carbonates of palladium, silver, platinum, and gold showing a catalytic effect when precipitating copper, nickel or the like on a surface of the material to be plated from an electroless plating solution, and palladium compounds are particularly preferable among those compounds.
- the noble metal soap used in the present invention can be obtained by ordinary metal soap manufacturing method such as a direct method or double decomposition method with the above-mentioned fatty acid or the like and the above-mentioned noble metal compound.
- the palladium naphthenate preferred as the noble metal soap used in the present invention is shown below.
- the above-mentioned noble metal soap used in the present invention is soluble in organic solvents and stable as solution.
- Butanol, 2-ethylhexanol, octyl alcohol, and other alcohols; xylene and other aromatic hydrocarbons; hexane and other aliphatic hydrocarbons; chloroform; dioxane; and the like are examples of such an organic solvent.
- the electroless plating pretreatment agent of the present invention is used by dissolving the silane coupling agent having a metal capturing capability, thermoset resin, noble metal soap and the like in an organic solvent such as butanol, 2-ethylhexanol, octyl alcohol, or another such alcohol; xylene or another such aromatic hydrocarbon; hexane or another such aliphatic hydrocarbon; chloroform; or dioxane; for example.
- an organic solvent such as butanol, 2-ethylhexanol, octyl alcohol, or another such alcohol; xylene or another such aromatic hydrocarbon; hexane or another such aliphatic hydrocarbon; chloroform; or dioxane; for example.
- the concentration of the silane coupling agent having a metal capturing capability in the electroless plating pretreatment agent is preferably 0.001 to 10 wt % and more preferably 0.05 to 3 wt %, it is not limited thereto. If the concentration is less than 0.001 wt %, the quantity of the compound that attaches to the surface of the substrate material is too low, and the effects are difficult to achieve. If it exceeds 10 wt %, too much compound attaches, thereby drying is difficult and powder readily aggregates.
- the concentration of thermoset resin in the electroless plating pretreatment agent is preferably 0.001 to 30 wt %, and more preferably 0.05 to 10 wt %. If it is less than 0.001 wt %, there is little effect, and if it exceeds 30 wt %, the liquid viscosity is too high, resulting in unevenness in the plating.
- the noble metal soap may be used in the solution of the electroless plating pretreatment agent at a noble metal concentration of 1 to 30,000 mg/L or preferably 50 to 10,000 mg/L.
- polyimide films Various types are preferably used as the substrate material of the copper-clad laminate for a flexible substrate of the present invention.
- Kapton manufactured by Toray-DuPont
- UPILEX manufactured by Ube Industries
- Lumirror manufactured by Toray Industries
- the treatment method is not limited thereto, and any method resulting in a pretreatment agent applying to the surface is fine.
- heating the solvent to at least the volatilization temperature thereof and then drying the surface are enough, but it is preferable to further heat for 3 to 60 minutes at 60 to 120° C.
- the thickness of an electroless plating pretreatment agent layer of the present invention is preferably 1 to 200 nm.
- the copper-clad laminate for a flexible substrate of the present invention is made by forming a copper plating layer by ordinary electroless plating on a substrate material pretreated as described above, and then further forming a copper plating layer by ordinary electroplating. In this manner, a copper-clad laminate for a flexible substrate that is uniform and is excellent in adhesion is obtained.
- a copper plating layer having a thickness of 0.5 ⁇ m was formed by electroless copper plating (plating solution: NKM554, manufactured by Nikko Metal Plating), and electric copper plating (plating solution: copper sulfate base, manufactured by Nikko Metal Plating) was carried out with a current density of 2 A/dm 2 to form a copper plating layer having a thickness of 35 ⁇ m.
- the peeling strengths were measured in an ordinary state and then after aging for 168 hours at 150° C. in the air. The peeling strengths were measured by a 90-degree peeling test according to JIS C-6481. The same testing method was used in the below examples and comparative examples. The results showed a high post-aging strength of 0.7 kgf/cm as in Table 1.
- An electroless plating pretreatment agent with an organic solvent including 1 g/L of imidazole silane (an equimolar reaction product of imidazole and 3-glycidoxypropyltrimethoxysilane), 0.5 g/L (100 mg/L of palladium) of palladium soap (palladium naphthenate, manufactured by Nikko Materials), and 2 g/L of phenol resin (XLC-4L, manufactured by Mitsui Chemicals) was applied to the surface of the commercially available polyimide film Kapton (200H, manufactured by Toray-DuPont). After removing the solvent at 150° C.
- organic solvent butanol
- imidazole silane an equimolar reaction product of imidazole and 3-glycidoxypropyltrimethoxysilane
- 0.5 g/L (100 mg/L of palladium) of palladium soap palladium naphthenate, manufactured by Nikko Materials
- 2 g/L of phenol resin X
- a copper plating layer having a thickness of 0.5 ⁇ m was formed by electroless copper plating (plating solution: NKM554, manufactured by Nikko Metal Plating), and electric copper plating (plating solution: copper sulfate base, manufactured by Nikko Metal Plating) was carried out to form a copper plating layer having a thickness of 35 ⁇ m.
- the peeling strengths in an ordinary state and after aging for 168 hours at 150° C. in the air were measured.
- Example 1 Treatment and testing were carried out in the same manner as in Example 1 except that aminosilane ( ⁇ -aminopropyltriethoxysilane, manufactured by Shin-Etsu Chemical) was used in place of the imidazole silane in Example 1.
- the results showed a high post-aging strength of 0.4 kgf/cm as in Table 1.
Abstract
Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
Description
- The present invention relates to an electroless plating pretreatment agent used in materials of a copper-clad laminate used as a base material or the like of flexible substrates for printed wiring and to a copper-clad laminate for a flexible substrate produced using same.
- Polyimide substrates are often used as a material of insulating substrates for electronic components. With the recent trend toward smaller, thinner electronics, two-layer copper polyimide substrates in which a metal layer is directly formed on a polyimide film have attracted attention for their greater flexibility. Although the initial adhesive force of these substrates between polyimide films and metal layers in the ordinary state is on a practical level, the characteristics such as adhesive force in an environment requiring heat resistance, or in that of high temperature and high humidity are considered unstable.
- A method for producing a metal layer in a flexible copper-clad laminate board of polyimide film by sputtering is disclosed in Patent Document 1, for example. However, that method costs high, and the adhesive force is not adequate in an environment requiring heat resistance, or an environment of high temperature and high humidity.
- Methods to improve the adhesion of the polyimide film and metal layer include plasma, UV, and other dry processes as well as alkaline and other wet processes, but in addition to safety and operability issues of the liquid used, these methods can lead to unevenness in the metal layer surface if excessively applied, damaging fine wire formation.
- Patent Document 2 describes a method of performing electrolytic copper plating after electroless copper plating comprising the five processes of forming a resin composite coating on a polyimide film, activating the coating, applying a catalyst, activating the catalyst, and electroless metal plating. The main object of this method is to form a resin composite layer as an adhesion imparting layer, but the processes are complex and results in a resin composite layer having a thickness of 1 to 20 μm.
- Patent Document 1: Japanese Patent Publication No. H9-136378
- Patent Document 2: Japanese Patent Publication No. 2001-168496
- It is an object of the present invention to provide an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state, and the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same.
- As a result of diligent investigations, the inventors have discovered a solution to the problems described above, that is, an electroless plating pretreatment agent comprising a thermoset resin and a silane coupling agent having a metal capturing capability is used as an electroless plating pretreatment agent for the copper-clad laminate for a flexible substrate. A detailed description of the invention is as follows.
- (1) An electroless plating pretreatment agent applied to a substrate material of a copper-clad laminate for a flexible substrate, comprising a thermoset resin and a silane coupling agent having a metal capturing capability.
- (2) The electroless plating pretreatment agent according to (1), wherein said thermoset resin is an epoxy resin.
- (3) A copper-clad laminate for a flexible substrate, wherein a substrate material is treated with the electroless plating pretreatment agent according to (1) or (2), a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
- The copper-clad laminate for a flexible substrate, which is obtained by treating a substrate material with an electroless plating pretreatment agent of the present invention and then laminating an electroless copper plating layer and an electroplated copper layer, is a copper-clad laminate for a flexible substrate having two copper layers excellent in adhesion such that the initial adhesive force between the substrate material and copper plating layer in an ordinary state, and the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm. An adhesive force is provided to the surface of the substrate material without any wet or dry pretreatment whatsoever.
- The electroless plating pretreatment agent of the present invention comprises a thermoset resin and a silane coupling agent having a metal capturing capability.
- By adding the silane coupling agent having a metal capturing capability, a noble metal catalyst can be adhered to the surface to be plated more uniformly and reliably via the silane coupling agent.
- A preferred silane coupling agent is obtained by reacting an azole compound or an amine compound with an epoxy compound.
- Examples of the azole compound include imidazole, oxazole, thiazole, selenazole, pyrazol, isoxazole, isothiazole, triazole, oxadiazole, thiadiazole, tetrazole, oxatriazole, thiatriazole, bendazole, indazole, benzimidazole, and benzotriazole. While the azole compound is not limited thereto, imidazole is especially preferred.
- Examples of the amine compound include saturated hydrocarbon amines such as propylamine, unsaturated hydrocarbon amines such as vinylamine, and aromatic amines such as phenylamine.
- The silane coupling agent is a compound having an —SiX1X2X3 group in addition to having a noble metal capturing group derived from the above-mentioned azole compound or amine compound, where X1, X2, and X3 represent an alkyl, halogen, alkoxide group or the like and may be a functional group capable of being attached to an article to be plated. X1, X2, and X3 may be identical or different.
- The above-mentioned silane coupling agent may be obtained by reacting the above-mentioned azole or amine compound with the epoxy silane compound.
-
- A reaction between the above-mentioned azole compound and the above-mentioned epoxy group-containing silane compound is carried out under the conditions described in Japanese Patent Publication No. H6-256358, for example.
- For example, the above-mentioned silane coupling agent is obtained by dripping 0.1 to 10 mol of an epoxy group-containing silane compound in 1 mol of an azole compound at 80 to 200° C. for between 5 minutes and 2 hours. In that process, a solvent is not particularly needed, though chloroform, dioxane, methanol, ethanol, or some other organic solvent may be used.
- An example of a particularly favorable reaction of an imidazole compound with an epoxy silane compound is shown below.
(In the formula, R1 and R2 indicate hydrogen or alkyl groups having 1 to 3 carbons, R3 indicates hydrogen or an alkyl group having 1 to 20 carbons, R4 indicates either an alkyl group having 1 to 5 carbons or a vinyl group, and n indicates a number from 0 to 3.) - γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane are other examples of silane coupling agents having a functional group with a metal capturing capability used in the present invention.
- As the thermoset resin used in the electroless plating pretreatment agent of the present invention, epoxy resin, urea resin, phenol resin, melamine resin, and urethane resin are exemplified. By adding the thermoset resin, the adhesive force is improved. Using an epoxy resin as the thermoset resin is preferable because it has a particularly remarkable effect in improving the adhesive force.
- It is not essential for the present invention that the electroless plating pretreatment agent contains a noble metal compound. Plating activity can be obtained by immersion in the plating pretreatment agent of the present invention and then in a palladium chloride aqueous solution. Nevertheless, it is more preferable that the plating pretreatment agent contains a catalyst such as a noble metal compound. Examples of the catalyst include a compound of a noble metal such as palladium, silver, platinum, or gold, for example a halide, a hydroxide, a sulfate and a carbonate thereof, and a noble metal soap thereof, of which a palladium compound is particularly preferable. A conventional catalyst such as tin chloride may be contained in the plating pretreatment agent within the scope of the object of the present invention.
- The noble metal soap can be obtained through a reaction of a fatty acid, a resin acid, or a naphthenic acid with a noble metal compound, and is preferably used in the present invention.
- For the fatty acid, the number of carbon atoms is preferably 5 to 25 and even more preferably 8 to 16. If the number of carbons is 4 or less, the fatty acid does not dissolve readily in the organic solvent, causing instability. With 26 or more carbon atoms, the portion soluble in the organic solvent is limited and the noble metal content decreases, thereby the amount added is required to increase, which is not practical.
- Examples of the fatty acid include octylic acid, neodecanoic acid, dodecanoic acid, pentadecanoic acid, octadecanoic acid, and other saturated fatty acids; oleic acid, linolic acid, and other unsaturated fatty acids; hydroxytetradecanoic acid, carboxydecanoic acid, and other oxygen-containing fatty acids; and mixtures thereof.
- Preferable exemplifications of the fatty acids, resin acids, and naphthenic acids include naphthenic acid, octylic acid, neodecanoic acid, and pentadecanoic acid.
- Also, examples of the above-mentioned noble metal compound include compounds that can form a soap with a fatty acid or the like, and that can be halides, hydroxides, sulfates, and carbonates of palladium, silver, platinum, and gold showing a catalytic effect when precipitating copper, nickel or the like on a surface of the material to be plated from an electroless plating solution, and palladium compounds are particularly preferable among those compounds.
- The noble metal soap used in the present invention can be obtained by ordinary metal soap manufacturing method such as a direct method or double decomposition method with the above-mentioned fatty acid or the like and the above-mentioned noble metal compound.
-
- Mixture where n is from 9 to 13
- The above-mentioned noble metal soap used in the present invention is soluble in organic solvents and stable as solution. Butanol, 2-ethylhexanol, octyl alcohol, and other alcohols; xylene and other aromatic hydrocarbons; hexane and other aliphatic hydrocarbons; chloroform; dioxane; and the like are examples of such an organic solvent.
- The electroless plating pretreatment agent of the present invention is used by dissolving the silane coupling agent having a metal capturing capability, thermoset resin, noble metal soap and the like in an organic solvent such as butanol, 2-ethylhexanol, octyl alcohol, or another such alcohol; xylene or another such aromatic hydrocarbon; hexane or another such aliphatic hydrocarbon; chloroform; or dioxane; for example.
- Although the concentration of the silane coupling agent having a metal capturing capability in the electroless plating pretreatment agent is preferably 0.001 to 10 wt % and more preferably 0.05 to 3 wt %, it is not limited thereto. If the concentration is less than 0.001 wt %, the quantity of the compound that attaches to the surface of the substrate material is too low, and the effects are difficult to achieve. If it exceeds 10 wt %, too much compound attaches, thereby drying is difficult and powder readily aggregates.
- The concentration of thermoset resin in the electroless plating pretreatment agent is preferably 0.001 to 30 wt %, and more preferably 0.05 to 10 wt %. If it is less than 0.001 wt %, there is little effect, and if it exceeds 30 wt %, the liquid viscosity is too high, resulting in unevenness in the plating.
- The noble metal soap may be used in the solution of the electroless plating pretreatment agent at a noble metal concentration of 1 to 30,000 mg/L or preferably 50 to 10,000 mg/L.
- Various types of polyimide films, PET, and the like are preferably used as the substrate material of the copper-clad laminate for a flexible substrate of the present invention. Kapton (manufactured by Toray-DuPont) and UPILEX (manufactured by Ube Industries) are examples of the polyimide film, and Lumirror (manufactured by Toray Industries) is an example of the PET.
- Although a method such as immersion, brushing, or spin coating is typically used to treat the substrate material with the electroless plating pretreatment agent, the treatment method is not limited thereto, and any method resulting in a pretreatment agent applying to the surface is fine.
- In order to volatize the used solvent after surface treatment, heating the solvent to at least the volatilization temperature thereof and then drying the surface are enough, but it is preferable to further heat for 3 to 60 minutes at 60 to 120° C.
- The thickness of an electroless plating pretreatment agent layer of the present invention is preferably 1 to 200 nm.
- The copper-clad laminate for a flexible substrate of the present invention is made by forming a copper plating layer by ordinary electroless plating on a substrate material pretreated as described above, and then further forming a copper plating layer by ordinary electroplating. In this manner, a copper-clad laminate for a flexible substrate that is uniform and is excellent in adhesion is obtained.
- The present invention is described in detail with reference to examples.
- An electroless plating pretreatment agent with an organic solvent (butanol) including 1 g/L of imidazole silane (an equimolar reaction product of imidazole and 3-glycidoxypropyltrimethoxysilane), 0.5 g/L (100 mg/L of palladium) of palladium soap (palladium naphthenate, manufactured by Nikko Materials), and 1 g/L of epoxy resin (Epicoat EP828, manufactured by Japan Epoxy Resins) was applied to the surface of the commercially available polyimide film Kapton (200H, manufactured by Toray-DuPont). After removing the solvent at 150° C. and forming a pretreatment agent layer having a thickness of 70 nm, a copper plating layer having a thickness of 0.5 μm was formed by electroless copper plating (plating solution: NKM554, manufactured by Nikko Metal Plating), and electric copper plating (plating solution: copper sulfate base, manufactured by Nikko Metal Plating) was carried out with a current density of 2 A/dm2 to form a copper plating layer having a thickness of 35 μm. The peeling strengths were measured in an ordinary state and then after aging for 168 hours at 150° C. in the air. The peeling strengths were measured by a 90-degree peeling test according to JIS C-6481. The same testing method was used in the below examples and comparative examples. The results showed a high post-aging strength of 0.7 kgf/cm as in Table 1.
- An electroless plating pretreatment agent with an organic solvent (butanol) including 1 g/L of imidazole silane (an equimolar reaction product of imidazole and 3-glycidoxypropyltrimethoxysilane), 0.5 g/L (100 mg/L of palladium) of palladium soap (palladium naphthenate, manufactured by Nikko Materials), and 2 g/L of phenol resin (XLC-4L, manufactured by Mitsui Chemicals) was applied to the surface of the commercially available polyimide film Kapton (200H, manufactured by Toray-DuPont). After removing the solvent at 150° C. and forming a pretreatment agent layer having a thickness of 70 nm, a copper plating layer having a thickness of 0.5 μm was formed by electroless copper plating (plating solution: NKM554, manufactured by Nikko Metal Plating), and electric copper plating (plating solution: copper sulfate base, manufactured by Nikko Metal Plating) was carried out to form a copper plating layer having a thickness of 35 μm. The peeling strengths in an ordinary state and after aging for 168 hours at 150° C. in the air were measured.
- Treatment and testing were carried out in the same manner as in Example 1 except that aminosilane (γ-aminopropyltriethoxysilane, manufactured by Shin-Etsu Chemical) was used in place of the imidazole silane in Example 1. The results showed a high post-aging strength of 0.4 kgf/cm as in Table 1.
- Treatment and testing were carried out in the same manner as in Example 1 except that no epoxy resin was used. As shown in Table 1, the results showed a high initial peeling strength of 0.9 kgf/cm, but a low post-aging peeling strength of 0.1 kgf/cm.
- After forming a copper seed layer having a thickness of 0.5 μm by sputtering, 35 μm of copper plating layer was formed by electric copper plating in the same manner as Example 1, and testing was carried out as in Example 1. The results are shown in Table 1, with the initial peeling strength high at 0.9 kgf/cm, though low after aging.
TABLE 1 Peeling strength in Initial peeling peel test after strength (kgf/cm) aging (kgf/cm) Example 1 0.9 0.7 Example 2 0.8 0.6 Example 3 0.6 0.4 Comparative 0.9 0.1 Example 1 Comparative 0.9 0.1 Example 2
Claims (3)
1. An electroless plating pretreatment agent applied to a substrate material of a copper-clad laminate for a flexible substrate, comprising a thermoset resin and a silane coupling agent having a metal capturing capability.
2. An electroless plating pretreatment agent according to claim 1 , wherein said thermoset resin is an epoxy resin.
3. A copper-clad laminate for a flexible substrate, wherein a substrate material is treated with the electroless plating pretreatment agent according to claim 1 , a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2004-263861 | 2004-09-10 | ||
JP2004263861 | 2004-09-10 | ||
PCT/JP2005/015228 WO2006027947A1 (en) | 2004-09-10 | 2005-08-22 | Electroless gold plating pretreatment agent and copper clad laminate for flexible board |
Publications (1)
Publication Number | Publication Date |
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US20070269680A1 true US20070269680A1 (en) | 2007-11-22 |
Family
ID=36036235
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/662,046 Abandoned US20070269680A1 (en) | 2004-09-10 | 2005-08-22 | Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate |
Country Status (5)
Country | Link |
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US (1) | US20070269680A1 (en) |
JP (2) | JP4859232B2 (en) |
KR (1) | KR20070088611A (en) |
TW (1) | TWI305237B (en) |
WO (1) | WO2006027947A1 (en) |
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US20070120880A1 (en) * | 2003-11-05 | 2007-05-31 | Toshifumi Kawamura | Inkjet ink composition |
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US20100189974A1 (en) * | 2007-07-02 | 2010-07-29 | Shinya Ochi | Metal-laminated polyimide substrate, and method for production thereof |
US20120192758A1 (en) * | 2010-03-23 | 2012-08-02 | Toru Imori | Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object |
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Also Published As
Publication number | Publication date |
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JP2012007244A (en) | 2012-01-12 |
WO2006027947A1 (en) | 2006-03-16 |
JPWO2006027947A1 (en) | 2008-07-31 |
TW200619418A (en) | 2006-06-16 |
TWI305237B (en) | 2009-01-11 |
KR20070088611A (en) | 2007-08-29 |
JP4859232B2 (en) | 2012-01-25 |
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