US20070254484A1 - Substantially spherical composite ceria/titania particles - Google Patents
Substantially spherical composite ceria/titania particles Download PDFInfo
- Publication number
- US20070254484A1 US20070254484A1 US11/380,980 US38098006A US2007254484A1 US 20070254484 A1 US20070254484 A1 US 20070254484A1 US 38098006 A US38098006 A US 38098006A US 2007254484 A1 US2007254484 A1 US 2007254484A1
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- particles
- substantially spherical
- core portion
- agglomerates
- crystalline core
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- 239000002245 particle Substances 0.000 title claims abstract description 82
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 title claims abstract description 78
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000005498 polishing Methods 0.000 claims abstract description 28
- 239000010936 titanium Substances 0.000 claims abstract description 24
- 238000005253 cladding Methods 0.000 claims abstract description 22
- 238000002485 combustion reaction Methods 0.000 claims abstract description 19
- 239000000126 substance Substances 0.000 claims abstract description 17
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000013522 chelant Substances 0.000 claims abstract description 11
- 239000012798 spherical particle Substances 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 150000000703 Cerium Chemical class 0.000 claims abstract 3
- 239000002002 slurry Substances 0.000 claims description 29
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 13
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- 150000001785 cerium compounds Chemical class 0.000 claims description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 6
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- OGHBATFHNDZKSO-UHFFFAOYSA-N propan-2-olate Chemical compound CC(C)[O-] OGHBATFHNDZKSO-UHFFFAOYSA-N 0.000 claims description 5
- MRWDOMBCUHOHAE-UHFFFAOYSA-K cerium(3+);propanoate Chemical compound [Ce+3].CCC([O-])=O.CCC([O-])=O.CCC([O-])=O MRWDOMBCUHOHAE-UHFFFAOYSA-K 0.000 claims description 4
- FECDACOUYKFOOP-UHFFFAOYSA-N 2-ethylhexyl 2-hydroxypropanoate Chemical compound CCCCC(CC)COC(=O)C(C)O FECDACOUYKFOOP-UHFFFAOYSA-N 0.000 claims description 3
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 claims description 3
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 claims description 3
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 claims description 3
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 claims description 3
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 claims description 3
- 229940116333 ethyl lactate Drugs 0.000 claims description 3
- 229940057867 methyl lactate Drugs 0.000 claims description 3
- ILVGAIQLOCKNQA-UHFFFAOYSA-N propyl 2-hydroxypropanoate Chemical compound CCCOC(=O)C(C)O ILVGAIQLOCKNQA-UHFFFAOYSA-N 0.000 claims description 3
- GYUPBLLGIHQRGT-UHFFFAOYSA-N pentane-2,4-dione;titanium Chemical class [Ti].CC(=O)CC(C)=O GYUPBLLGIHQRGT-UHFFFAOYSA-N 0.000 claims description 2
- IHEDBVUTTQXGSJ-UHFFFAOYSA-M 2-[bis(2-oxidoethyl)amino]ethanolate;titanium(4+);hydroxide Chemical compound [OH-].[Ti+4].[O-]CCN(CC[O-])CC[O-] IHEDBVUTTQXGSJ-UHFFFAOYSA-M 0.000 claims 1
- 239000003082 abrasive agent Substances 0.000 abstract description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 2
- 239000002243 precursor Substances 0.000 description 28
- 239000000243 solution Substances 0.000 description 25
- -1 cerium carboxylate Chemical class 0.000 description 13
- 239000011164 primary particle Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 10
- 229910052684 Cerium Inorganic materials 0.000 description 9
- 238000003917 TEM image Methods 0.000 description 8
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical group [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 238000005118 spray pyrolysis Methods 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000011163 secondary particle Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XAVMMNWPOYCFPU-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanolate;propan-2-olate;titanium(4+) Chemical compound [Ti+4].CC(C)[O-].CC(C)[O-].OCCN(CCO)CC[O-].OCCN(CCO)CC[O-] XAVMMNWPOYCFPU-UHFFFAOYSA-N 0.000 description 2
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- GHLITDDQOMIBFS-UHFFFAOYSA-H cerium(3+);tricarbonate Chemical compound [Ce+3].[Ce+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O GHLITDDQOMIBFS-UHFFFAOYSA-H 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000005367 electrostatic precipitation Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000004627 transmission electron microscopy Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000003139 biocide Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002173 high-resolution transmission electron microscopy Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012702 metal oxide precursor Substances 0.000 description 1
- 229910003455 mixed metal oxide Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical group [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011020 pilot scale process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
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- C09G1/00—Polishing compositions
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- B82—NANOTECHNOLOGY
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
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- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
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- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/449—Organic acids, e.g. EDTA, citrate, acetate, oxalate
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- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/52—Constituents or additives characterised by their shapes
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- C04B2235/54—Particle size related information
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5454—Particle size related information expressed by the size of the particles or aggregates thereof nanometer sized, i.e. below 100 nm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Definitions
- the present invention relates to composite ceria/titania particles and, more particularly, to substantially spherical composite ceria/titania particles, a method of forming the same via flame spray pyrolysis and use of the same in chemical-mechanical polishing applications.
- Ceria (CeO 2 ) is an increasingly important inorganic oxide that is used as an abrasive material in chemical mechanical polishing compositions for planarizing surfaces during the fabrication of integrated circuits.
- ceria When produced via conventional flame spray pyrolysis processes, ceria tends to exhibit a substantially cubic, crystalline shape. It is believed that the relatively sharp edges of the cubic shaped ceria particles may gouge and/or scratch surfaces being planarized, which is particularly problematic as the size of integrated circuit architecture decreases.
- the present invention provides substantially spherical composite ceria/titania particles, a method of forming the same, and chemical mechanical polishing compositions comprised of such particles.
- the substantially spherical composite ceria/titania particles comprise a substantially crystalline core portion comprising Ce (1-x) Ti (x) O 2 , where x is ⁇ 0.25, and a substantially amorphous cladding covering at least a portion of the substantially crystalline core portion, the substantially amorphous cladding comprising Ti (1-y) Ce (y) O 2 , where y is ⁇ 0.50.
- the method of forming substantially spherical ceria/titania composite particles according to the invention comprises combusting a mixture comprising a cerium compound and a titanium (IV) chelate dissolved in an organic solvent in a combustion supporting gas in the presence of oxygen, and collecting the substantially spherical composite ceria/titania particles in the form of agglomerates.
- Agglomerates of the substantially spherical ceria/titania particles according to the invention can be used as an abrasive material in chemical mechanical polishing compositions to remove film layers such as silicon dioxide, for example, during the fabrication of integrated circuit devices.
- the agglomerates of spherical ceria/titania particles according to the invention remove silicon dioxide at a greater rate and produce a smoother surface than ceria particles of similar size produced via conventional flame spray pyrolysis.
- FIGS. 1, 2 , 3 and 4 are scanning electron micrographs of particles formed in Example 3 from Precursor Solutions A, B, C and D, respectively, taken at 20,000 ⁇ magnification.
- FIGS. 5 and 6 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution A at 25,000 ⁇ and 300,000 ⁇ magnification, respectively.
- FIGS. 7 and 8 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution C at 25,000 ⁇ and 300,000 ⁇ magnification, respectively.
- FIGS. 9 and 10 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution D at 60,000 ⁇ and 300,000 ⁇ magnification, respectively.
- FIG. 11 shows transmission electron micrographs of the particles formed in Example 3 from Precursor Solution C.
- the precursors for substantially spherical composite ceria/titania particles comprise: (1) a first precursor comprising an organic solvent soluble cerium compound such as a salt of a carboxylic acid (i.e., a cerium carboxylate) or a cerium alkoxide; and (2) a second precursor comprising a titanium (IV) chelate.
- Both the first and second precursors are present in an organic solvent, which is preferably a volatile, low viscosity solvent such as, for example, methanol.
- the first and second precursors and the organic solvent form an atomizable liquid feed that is substantially free of solid material.
- Combustion of the liquid feed produces particles that are substantially spherical in shape and comprise a substantially crystalline core portion comprising Ce (1-x) Ti (x) O 2 , where x is ⁇ 0.25, and a substantially amorphous cladding covering at least a portion of the substantially crystalline core portion, the substantially amorphous cladding comprising Ti (1-y) Ce (y) O 2 , where y is ⁇ 0.50.
- Individual substantially spherical particles are sometimes referred to herein as “primary” particles, whereas agglomerates of two or more primary particles are sometimes referred to herein as “secondary” particles.
- titanium ions (Ti +4 ) are substituted for cerium ions (Ce +4 ) in the lattice structure of the crystal, thus preserving the ratio of metal cations to oxygen ions in such crystal and the predominant cerium oxide lattice structure of the crystal.
- the mole ratio of metal ions (Ce +4 +Ti +4 ) to oxygen ions in the lattice structure of the crystalline core portion is generally 1:2, although slight mathematical variation in the mole ratios of metal ions to oxygen ions is possible.
- the ratio of metal ions (Ce +4 +Ti +4 ) to oxygen ions in the crystalline core portion is sufficient to preserve overall statistical electroneutrality.
- the difference in the electronegativity and size of the titanium ions versus the cerium ions is believed to catalyze redox reactions on the surface of the crystal and cause lattice strain energy, which can further enhance the polishing effectiveness of the particles in chemical-mechanical polishing (“CMP”) applications.
- CMP chemical-mechanical polishing
- the substantially crystalline core portion is covered, at least in part, by a substantially amorphous cladding comprising Ti (1-y) Ce (y) O 2 , where y is ⁇ 0.50.
- the cladding is substantially non-crystalline, and thus there is no crystalline matrix or lattice structure for substitution of the metal ions (Ce +4 +Ti +4 ).
- the cladding is predominantly amorphous TiO 2 , but some (less than or equal to 50 mole percent, and most typically less than 20 mole percent) amorphous CeO 2 can also be present, separately or mixed within the amorphous TiO 2 .
- the cladding is believed to help the particles attain their substantially spherical shape.
- Particularly useful organic solvent soluble cerium compounds include cerium carboxylates having from about 2 to about 5 carbon atoms. Cerium propionate is particularly preferred for use in the invention.
- the cerium compound serves as precursor material for the formation of ceria (cerium dioxide) having a substantially cubic crystalline lattice structure. Most of the primary particles formed by the process are single crystalline, meaning that the crystalline core comprises a single crystal as opposed to an agglomeration of individual crystallites.
- the titanium (IV) chelate must be soluble in the organic solvent and compatible with the cerium compound.
- the preferred titanium (IV) chelate is titanium (IV) triethanolaminato isopropoxide, which is available from DuPont under the TYZOR TE trade designation. Titanium acetyl acetone complexes can also be used.
- the titanium (IV) chelate serves as a titanium dopant in the sense that a few titanium atoms become substituted for cerium atoms in the crystal lattice core structure of the resulting particles.
- the titanium (IV) chelate also serves as an amorphous titanium dioxide precursor, with the amorphous titanium dioxide being disposed on the core structure as a cladding, which may or may not cover the core structure entirely. Small amounts of amorphous ceria may also be present and dispersed in the amorphous titania cladding structure.
- the organic solvent used in the process is preferably a linear or branched alcohol comprising from 1 to 12 carbon atoms, or a linear or branched chain ester comprising from 2 to 16 carbon atoms.
- Suitable alcohols include, for example, methanol and ethanol.
- Suitable esters include ethyl lactate, ethyl propionate, methyl lactate, n-propyl lactate, butyl lactate and 2-ethyl hexyl lactate.
- Polyalcohols such as ethylene glycol can also be used.
- the organic solvent used in the invention contains at least one oxygen atom. More preferably, no solvents are present in the liquid feed that do not contain an oxygen atom.
- the first and second precursors should generally be present in the organic solvent in amounts between 0.1 weight percent to about 25 weight percent. At the lower end of the concentration range, ceramic yield relative to total solution weight will be low. The solubility of the precursors in the organic solvent defines the upper end of the concentration range. Consideration must also be given to the viscosity of the resulting solution, which must be atomizable. Solutions of lower concentration tend to form composite ceria/titania particles of smaller primary particle size, which is typically referred to herein by average mean diameter (D mean ).
- D mean average mean diameter
- Combustion is effected by atomizing the liquid feed into a stream of oxygen-containing combustion supporting gas, such as air, and igniting the mixture in a closed chamber.
- oxygen-containing combustion supporting gas such as air
- the term “closed” as it is used in this sense means that the combustion zone is not directly open to the surroundings.
- the combustion supporting gas is preferably oxygen, which may be supplemented with a separate flow of pure oxygen or dry air. The use of oxygen-enriched air is not problematic.
- hydrogen gas may be added as a fuel to control the flame temperature.
- the combustible mixture may be ignited by any convenient method, for example spark discharge, glow plug, pilot flame, etc. It is preferred that a pilot flame, i.e. of H 2 /O 2 or methane/O 2 be used.
- a pilot flame i.e. of H 2 /O 2 or methane/O 2 be used.
- temperatures approaching 2500° C. are generally produced.
- the peak combustion temperature is above the melting temperature of TiO 2 (i.e., greater than about 1800° C.), but less than the melting point of CeO 2 (i.e., less than about 2600° C.).
- the first precursor results in the formation of CeO 2 , which crystallizes into single crystals at the core of the primary particles.
- titanium atoms become substituted for cerium atoms in the crystal lattice structure, creating lattice strain energy.
- the majority of the titanium dioxide by-product from the combustion of the second precursor is in a molten state. Rapid cooling of the particles as they leave the combustion chamber does not give the titanium dioxide sufficient time to crystallize, and thus a thin, several molecular layers thick cladding of amorphous titanium dioxide forms on some or all of the surfaces of the doped cerium oxide crystalline core structure, enhancing the formation of a substantially spherical primary particle morphology.
- the substantially spherical ceria/titania particles may be collected by conventional methods, including bag filtration, electrostatic precipitation, etc. Flow of particles may be assisted by the introduction of filtered air or other gas downstream from the combustion zone where the constituents of the added gas will not react with the particles.
- the collected particles tend to be agglomerates of two or more primary particles.
- Atomization of the liquid feed can be accomplished by any suitable technique, including Bernoulli misters, cross-flow atomizers, fog misters, high-pressure spray nozzles, ultrasonic misters etc. So-called two-fluid atomizers are preferred. Such atomizers are readily available.
- the liquid feed flame spray device may be constructed in any suitable manner, mindful of the operating pressures involved. Reference may be had to U.S. Pat. No. 5,958,367, FIGS. 3-5, for example, which shows a spray head feeding a liquid feed to a quartz combustion chamber.
- the combustion chamber section is reduced and terminates in a quartz tube.
- a graded quartz/PYREX tube may be used to connect the high temperature front end to the lower temperature collection unit, in this case, an electrostatic precipitation unit with central wire electrodes and a foil or plated liner.
- An exit from the device may be treated to scrub gases and fine particles not collected by the precipitation unit, or may be attached to bag filters, etc. Ignition torches are located in the combustion chamber to ignite the liquid feed.
- the core structures are typically single crystalline, but some crystallite particle agglomeration may occur.
- the outer surface of the crystalline core is at least partially, and often completely, covered by a layer of amorphous titania, which may include small amounts of amorphous ceria.
- the substantially spherical composite ceria/titania primary particles produced in accordance with the invention tend to agglomerate together to form secondary particles that are useful for polishing.
- the D mean of the secondary particles tends to be from about two to about six times, or about four times, the D mean of the primary particles.
- the D max of the secondary particles tends to be from about five to about fifteen times, or about ten times, the D max of the primary particles.
- the agglomerates of substantially spherical composite ceria/titania particles produced in accordance with the invention are particularly useful as abrasive particles in chemical mechanical polishing slurries used to fabricate integrated circuit devices.
- the agglomerates are dispersed in a liquid medium such as, for example, deionized water.
- Chemical agents may also be present including, for example, proline. It will be appreciated that the composition of the chemical mechanical polishing slurry will be dependent upon the surface to be planarized.
- the present invention also provides a method of planarizing a film surface during the fabrication of an integrated circuit device.
- a chemical mechanical polishing slurry comprising the agglomerates of the substantially spherical composite ceria/titania particles is disposed between a film surface and a polishing pad, and the polishing pad is moved relative to the film surface until a desired amount of the film surface has been removed.
- the average primary particle diameter of the substantially spherical composite ceria/titania particles is preferably from about 20 nm to about 1 ⁇ m, and more preferably from about 50 nm to about 200 nm
- Chemical mechanical polishing slurries comprising agglomerates of the substantially spherical composite ceria/titania particles according to the invention can be used to remove a variety of film layers including, but not limited to, silicon dioxide.
- Integrated circuits having surfaces polished (i.e., planarized) using the slurry composition and method of the invention exhibit substantially smoother surfaces (i.e., less surface roughness) than is achievable using conventional abrasives, which tend to be crystalline in nature.
- FIGS. 1, 2 , 3 and 4 are scanning electron micrographs of particles formed from Precursor Solutions A, B, C and D, respectively, taken at 20,000 ⁇ magnification.
- FIGS. 5 and 6 are transmission electron micrographs of the particles formed from Precursor Solution A at 25,000 ⁇ and 300,000 ⁇ magnification, respectively.
- FIGS. 7 and 8 are transmission electron micrographs of the particles formed from Precursor Solution C at 25,000 ⁇ and 300,000 ⁇ magnification, respectively.
- FIGS. 9 and 10 are transmission electron micrographs of the particles formed from Precursor Solution D at 60,000 ⁇ and 300,000 ⁇ magnification, respectively.
- the transmission electron micrographs show that particles formed from Precursor Solutions B, C, and D, which contained titanium (IV) triethanolaminato isopropoxide, were substantially spherical in shape whereas the particles formed from Precursor Solution A, which did not contain any titanium (IV) triethanolaminato isopropoxide, were faceted.
- Example 3 The particles produced in Example 3 from Precursor solutions A, B, C and D were separately mixed with the components in the amounts shown in Table 2 to form CMP Slurries 4-A, 4-B, 4-C and 4-D, respectively. After mixing, the CMP Slurries were sonicated for 10 minutes. All of the slurries had a pH of 4.0 (adjusted with HNO 3 ).
- CMP Slurry Compositions 4-A through 4-D were separately used to polish SiO 2 and Si 3 N 4 film layers on silicon wafers.
- the SiO 2 film layer was a 10,000 ⁇ thermal oxide film on a silicon wafer.
- the Si 3 N 4 film layer was 1,500 ⁇ film formed by low-pressure chemical vapor deposition on a 1,000 ⁇ SiO 2 thermal oxide film on a silicon wafer.
- the wafers were polished using a Strasbaugh 6EC polisher, with a Rodel IC-1000/SubaIV k-groove polishing pad at 4.5 psi down force and 1 psi back pressure, 135 rpm platen speed and 131 rpm head speed, 60% in-situ conditioning at 6 pounds down force with a Marshall Labs 80 grit diamond conditioner, and a slurry flow rate of 150 ml/min.
- Polishing results are reported in Table 3 below: TABLE 3 CMP CMP CMP CMP Slurry 4-A Slurry 4-B Slurry 4-C Slurry 4-D SiO 2 Removal 1950 ⁇ /min 2242 ⁇ /min 3005 ⁇ /min 2954 ⁇ /min Rate Si 3 N 4 Removal 12.6 ⁇ /min >1500 ⁇ /min >1500 ⁇ /min >1500 ⁇ /min Rate
- Example 5 show that a slurry comprising 1% by weight of substantially spherical composite 87.5% ceria/12.5% titania particles (CMP Slurry 4-C) removed thermal oxide at a greater rate than a slurry comprising 1% by weight of conventional ceria particles (CMP Slurry 4-A).
- Composite FIG. 11A shows that such particles do not have a uniform size distribution, but tend to exhibit a substantially spherical shape.
- the smaller box in Composite FIG. 11A shows the tip of an x-ray probe pointing to a single particle.
- the concentric rings radiating therefrom indicate that the particles are single-crystal in nature.
- Composite FIG. 11B is a high resolution TEM of a portion of a relatively large substantially spherical particle.
- the portion of the particle shown in Composite FIG. 11B appears to have a 1-2 nm layer on its surface that is different in composition from the core of the particle.
- the smaller box in Composite FIG. 11B shows the x-ray diffraction pattern for the particle, indicating again that it is a single crystal.
- Composite FIG. 11 C shows a smaller particle than shown in Composite FIG. 11 B at the same resolution. The same core-shell structure appears on the smaller particle.
- Composite FIG. 11D is a TEM of the particles.
- Composite FIG. 11E shows the same particles as in Composite FIG. 11D mapped for the element cerium.
- Composite FIG. 11F shows the same particles as in Composite FIG. 11D mapped for the element titanium.
- Composite FIGS. 11E and 11F show that cerium occupies predominantly the core of the particles whereas titanium predominantly occupies the shell structure of the particles. However, some small amounts of titanium appear in the core of the particles and some small amounts of cerium appear in the shell.
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Abstract
Description
- The present invention relates to composite ceria/titania particles and, more particularly, to substantially spherical composite ceria/titania particles, a method of forming the same via flame spray pyrolysis and use of the same in chemical-mechanical polishing applications.
- Ceria (CeO2) is an increasingly important inorganic oxide that is used as an abrasive material in chemical mechanical polishing compositions for planarizing surfaces during the fabrication of integrated circuits. When produced via conventional flame spray pyrolysis processes, ceria tends to exhibit a substantially cubic, crystalline shape. It is believed that the relatively sharp edges of the cubic shaped ceria particles may gouge and/or scratch surfaces being planarized, which is particularly problematic as the size of integrated circuit architecture decreases.
- The present invention provides substantially spherical composite ceria/titania particles, a method of forming the same, and chemical mechanical polishing compositions comprised of such particles. The substantially spherical composite ceria/titania particles comprise a substantially crystalline core portion comprising Ce(1-x)Ti(x)O2, where x is <0.25, and a substantially amorphous cladding covering at least a portion of the substantially crystalline core portion, the substantially amorphous cladding comprising Ti(1-y)Ce(y)O2, where y is ≦0.50. The method of forming substantially spherical ceria/titania composite particles according to the invention comprises combusting a mixture comprising a cerium compound and a titanium (IV) chelate dissolved in an organic solvent in a combustion supporting gas in the presence of oxygen, and collecting the substantially spherical composite ceria/titania particles in the form of agglomerates.
- Agglomerates of the substantially spherical ceria/titania particles according to the invention can be used as an abrasive material in chemical mechanical polishing compositions to remove film layers such as silicon dioxide, for example, during the fabrication of integrated circuit devices. When used in identical polishing conditions, the agglomerates of spherical ceria/titania particles according to the invention remove silicon dioxide at a greater rate and produce a smoother surface than ceria particles of similar size produced via conventional flame spray pyrolysis.
- The foregoing and other features of the invention are hereinafter more fully described and particularly pointed out in the claims, the following description setting forth in detail certain illustrative embodiments of the invention, these being indicative, however, of but a few of the various ways in which the principles of the present invention may be employed.
-
FIGS. 1, 2 , 3 and 4 are scanning electron micrographs of particles formed in Example 3 from Precursor Solutions A, B, C and D, respectively, taken at 20,000× magnification. -
FIGS. 5 and 6 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution A at 25,000× and 300,000× magnification, respectively. -
FIGS. 7 and 8 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution C at 25,000× and 300,000× magnification, respectively. -
FIGS. 9 and 10 are transmission electron micrographs of the particles formed in Example 3 from Precursor Solution D at 60,000× and 300,000× magnification, respectively. - Composite
FIG. 11 shows transmission electron micrographs of the particles formed in Example 3 from Precursor Solution C. - Sutorik et al., WO 03/070640, which is hereby incorporated by reference in its entirety, discloses a process for the preparation of certain mixed-metal oxide particles by liquid feed flame spray pyrolysis of mixtures of metal oxide precursors in oxygenated solvents. Substantially spherical composite ceria/titania particles are not disclosed in that prior art reference, but such particles and methods of forming the same are disclosed in the present application.
- In accordance with the present invention, the precursors for substantially spherical composite ceria/titania particles comprise: (1) a first precursor comprising an organic solvent soluble cerium compound such as a salt of a carboxylic acid (i.e., a cerium carboxylate) or a cerium alkoxide; and (2) a second precursor comprising a titanium (IV) chelate. Both the first and second precursors are present in an organic solvent, which is preferably a volatile, low viscosity solvent such as, for example, methanol. The first and second precursors and the organic solvent form an atomizable liquid feed that is substantially free of solid material. Combustion of the liquid feed produces particles that are substantially spherical in shape and comprise a substantially crystalline core portion comprising Ce(1-x)Ti(x)O2, where x is <0.25, and a substantially amorphous cladding covering at least a portion of the substantially crystalline core portion, the substantially amorphous cladding comprising Ti(1-y)Ce(y)O2, where y is ≦0.50. Individual substantially spherical particles are sometimes referred to herein as “primary” particles, whereas agglomerates of two or more primary particles are sometimes referred to herein as “secondary” particles.
- In the substantially crystalline core portion, titanium ions (Ti+4) are substituted for cerium ions (Ce+4) in the lattice structure of the crystal, thus preserving the ratio of metal cations to oxygen ions in such crystal and the predominant cerium oxide lattice structure of the crystal. Thus, the mole ratio of metal ions (Ce+4+Ti+4) to oxygen ions in the lattice structure of the crystalline core portion is generally 1:2, although slight mathematical variation in the mole ratios of metal ions to oxygen ions is possible. The ratio of metal ions (Ce+4+Ti+4) to oxygen ions in the crystalline core portion is sufficient to preserve overall statistical electroneutrality. The difference in the electronegativity and size of the titanium ions versus the cerium ions is believed to catalyze redox reactions on the surface of the crystal and cause lattice strain energy, which can further enhance the polishing effectiveness of the particles in chemical-mechanical polishing (“CMP”) applications.
- As noted above, the substantially crystalline core portion is covered, at least in part, by a substantially amorphous cladding comprising Ti(1-y)Ce(y)O2, where y is ≦0.50. The cladding is substantially non-crystalline, and thus there is no crystalline matrix or lattice structure for substitution of the metal ions (Ce+4+Ti+4). The cladding is predominantly amorphous TiO2, but some (less than or equal to 50 mole percent, and most typically less than 20 mole percent) amorphous CeO2 can also be present, separately or mixed within the amorphous TiO2. The cladding is believed to help the particles attain their substantially spherical shape.
- Particularly useful organic solvent soluble cerium compounds include cerium carboxylates having from about 2 to about 5 carbon atoms. Cerium propionate is particularly preferred for use in the invention. The cerium compound serves as precursor material for the formation of ceria (cerium dioxide) having a substantially cubic crystalline lattice structure. Most of the primary particles formed by the process are single crystalline, meaning that the crystalline core comprises a single crystal as opposed to an agglomeration of individual crystallites.
- The titanium (IV) chelate must be soluble in the organic solvent and compatible with the cerium compound. The preferred titanium (IV) chelate is titanium (IV) triethanolaminato isopropoxide, which is available from DuPont under the TYZOR TE trade designation. Titanium acetyl acetone complexes can also be used. The titanium (IV) chelate serves as a titanium dopant in the sense that a few titanium atoms become substituted for cerium atoms in the crystal lattice core structure of the resulting particles. The titanium (IV) chelate also serves as an amorphous titanium dioxide precursor, with the amorphous titanium dioxide being disposed on the core structure as a cladding, which may or may not cover the core structure entirely. Small amounts of amorphous ceria may also be present and dispersed in the amorphous titania cladding structure.
- The organic solvent used in the process is preferably a linear or branched alcohol comprising from 1 to 12 carbon atoms, or a linear or branched chain ester comprising from 2 to 16 carbon atoms. Suitable alcohols include, for example, methanol and ethanol. Suitable esters include ethyl lactate, ethyl propionate, methyl lactate, n-propyl lactate, butyl lactate and 2-ethyl hexyl lactate. Polyalcohols such as ethylene glycol can also be used. Preferably, the organic solvent used in the invention contains at least one oxygen atom. More preferably, no solvents are present in the liquid feed that do not contain an oxygen atom.
- The first and second precursors should generally be present in the organic solvent in amounts between 0.1 weight percent to about 25 weight percent. At the lower end of the concentration range, ceramic yield relative to total solution weight will be low. The solubility of the precursors in the organic solvent defines the upper end of the concentration range. Consideration must also be given to the viscosity of the resulting solution, which must be atomizable. Solutions of lower concentration tend to form composite ceria/titania particles of smaller primary particle size, which is typically referred to herein by average mean diameter (Dmean).
- Combustion is effected by atomizing the liquid feed into a stream of oxygen-containing combustion supporting gas, such as air, and igniting the mixture in a closed chamber. The term “closed” as it is used in this sense means that the combustion zone is not directly open to the surroundings. The combustion supporting gas is preferably oxygen, which may be supplemented with a separate flow of pure oxygen or dry air. The use of oxygen-enriched air is not problematic. In some instances, hydrogen gas may be added as a fuel to control the flame temperature.
- The combustible mixture may be ignited by any convenient method, for example spark discharge, glow plug, pilot flame, etc. It is preferred that a pilot flame, i.e. of H2/O2 or methane/O2 be used. As a result of the combustion, temperatures approaching 2500° C. are generally produced. Preferably, the peak combustion temperature is above the melting temperature of TiO2 (i.e., greater than about 1800° C.), but less than the melting point of CeO2 (i.e., less than about 2600° C.). At such temperatures, the first precursor results in the formation of CeO2, which crystallizes into single crystals at the core of the primary particles. Without being bound to a particular theory, applicants believe that some of the titanium atoms become substituted for cerium atoms in the crystal lattice structure, creating lattice strain energy. The majority of the titanium dioxide by-product from the combustion of the second precursor is in a molten state. Rapid cooling of the particles as they leave the combustion chamber does not give the titanium dioxide sufficient time to crystallize, and thus a thin, several molecular layers thick cladding of amorphous titanium dioxide forms on some or all of the surfaces of the doped cerium oxide crystalline core structure, enhancing the formation of a substantially spherical primary particle morphology.
- Following combustion, the substantially spherical ceria/titania particles may be collected by conventional methods, including bag filtration, electrostatic precipitation, etc. Flow of particles may be assisted by the introduction of filtered air or other gas downstream from the combustion zone where the constituents of the added gas will not react with the particles. The collected particles tend to be agglomerates of two or more primary particles.
- Atomization of the liquid feed can be accomplished by any suitable technique, including Bernoulli misters, cross-flow atomizers, fog misters, high-pressure spray nozzles, ultrasonic misters etc. So-called two-fluid atomizers are preferred. Such atomizers are readily available.
- The liquid feed flame spray device may be constructed in any suitable manner, mindful of the operating pressures involved. Reference may be had to U.S. Pat. No. 5,958,367, FIGS. 3-5, for example, which shows a spray head feeding a liquid feed to a quartz combustion chamber. The combustion chamber section is reduced and terminates in a quartz tube. A graded quartz/PYREX tube may be used to connect the high temperature front end to the lower temperature collection unit, in this case, an electrostatic precipitation unit with central wire electrodes and a foil or plated liner. An exit from the device may be treated to scrub gases and fine particles not collected by the precipitation unit, or may be attached to bag filters, etc. Ignition torches are located in the combustion chamber to ignite the liquid feed.
- The substantially spherical composite ceria/titania primary particles produced in accordance with the invention tend to be very small in size, typically having a Dmean of from about 20 nm to about 1.0 μm. In most instances, the particles tend to be ultrafine (i.e., Dmean=˜100-500 nm) or nanosize (i.e., Dmean=˜20-100 nm). The core structures are typically single crystalline, but some crystallite particle agglomeration may occur. The outer surface of the crystalline core is at least partially, and often completely, covered by a layer of amorphous titania, which may include small amounts of amorphous ceria. The substantially spherical composite ceria/titania primary particles produced in accordance with the invention tend to agglomerate together to form secondary particles that are useful for polishing. The Dmean of the secondary particles tends to be from about two to about six times, or about four times, the Dmean of the primary particles. The Dmax of the secondary particles tends to be from about five to about fifteen times, or about ten times, the Dmax of the primary particles.
- The agglomerates of substantially spherical composite ceria/titania particles produced in accordance with the invention are particularly useful as abrasive particles in chemical mechanical polishing slurries used to fabricate integrated circuit devices. In such applications, the agglomerates are dispersed in a liquid medium such as, for example, deionized water. Chemical agents may also be present including, for example, proline. It will be appreciated that the composition of the chemical mechanical polishing slurry will be dependent upon the surface to be planarized.
- Thus, the present invention also provides a method of planarizing a film surface during the fabrication of an integrated circuit device. In accordance with the method of the invention, a chemical mechanical polishing slurry comprising the agglomerates of the substantially spherical composite ceria/titania particles is disposed between a film surface and a polishing pad, and the polishing pad is moved relative to the film surface until a desired amount of the film surface has been removed. In chemical mechanical polishing applications, the average primary particle diameter of the substantially spherical composite ceria/titania particles is preferably from about 20 nm to about 1 μm, and more preferably from about 50 nm to about 200 nm
- Chemical mechanical polishing slurries comprising agglomerates of the substantially spherical composite ceria/titania particles according to the invention can be used to remove a variety of film layers including, but not limited to, silicon dioxide. Integrated circuits having surfaces polished (i.e., planarized) using the slurry composition and method of the invention exhibit substantially smoother surfaces (i.e., less surface roughness) than is achievable using conventional abrasives, which tend to be crystalline in nature.
- The following examples are intended only to illustrate the invention and should not be construed as imposing limitations upon the claims.
- 3100 grams of propionic acid was heated in a 12-liter round bottom flask until reflux conditions were obtained. 740 grams of cerium carbonate was then added to the reflux. The solution appeared turbid due to the presence of minor amounts of insoluble cerium sources and impurities in the cerium carbonate. The solution was refluxed at the boiling temperature of the solvent for about 120 minutes, and then allowed to cool to room temperature (˜22.5° C.). 620 grams of deionized water was added, and the solution was then filtered through a 0.2 μm filter to obtain a clear solution. The final ceramic yield of the solution (as wt % ceria) was determined by gravimetric weight loss on heating samples to 1150° C. for 30 min. Typical stock solution concentrations were ˜10 wt % CeO2.
- Four precursor solutions (A, B, C and D) were prepared by adding an amount of titanium (IV) triethanolaminato isopropoxide (DuPont TYZOR TE) to the cerium propionate stock formed in Example 1 sufficient to provide the cerium/titanium atom percentages shown in Table 1 below:
TABLE 1 Precursor Solution Ce (atom %) Ti (atom %) A 100 0 B 93.75 6.25 C 87.5 12.5 D 75 25 - Final concentrations were adjusted between 7.5 and 2.5 wt % ceramic yield by dilution with a solution of deionized water and methanol in a 1:5.2 weight ratio.
- Precursor Solutions A, B, C and D from Example 2 were separately pumped at 120 grams per minute with a precursor concentration at 5% by weight. The atomizing oxygen (“AO”) flow was at 2.0 cubic feet per minute (“CFM”), and the supplemental oxygen (“SO”) flow at 4.1 CFM using methanol as the solvent in a pilot scale reactor that can produce kilogram quantities of powders.
FIGS. 1, 2 , 3 and 4 are scanning electron micrographs of particles formed from Precursor Solutions A, B, C and D, respectively, taken at 20,000× magnification.FIGS. 5 and 6 are transmission electron micrographs of the particles formed from Precursor Solution A at 25,000× and 300,000× magnification, respectively.FIGS. 7 and 8 are transmission electron micrographs of the particles formed from Precursor Solution C at 25,000× and 300,000× magnification, respectively. And,FIGS. 9 and 10 are transmission electron micrographs of the particles formed from Precursor Solution D at 60,000× and 300,000× magnification, respectively. - The transmission electron micrographs show that particles formed from Precursor Solutions B, C, and D, which contained titanium (IV) triethanolaminato isopropoxide, were substantially spherical in shape whereas the particles formed from Precursor Solution A, which did not contain any titanium (IV) triethanolaminato isopropoxide, were faceted.
- The particles produced in Example 3 from Precursor solutions A, B, C and D were separately mixed with the components in the amounts shown in Table 2 to form CMP Slurries 4-A, 4-B, 4-C and 4-D, respectively. After mixing, the CMP Slurries were sonicated for 10 minutes. All of the slurries had a pH of 4.0 (adjusted with HNO3).
TABLE 3 CMP CMP CMP CMP Slurry 4-A Slurry 4-B Slurry 4-C Slurry 4-D Particles A 1.0 wt % — — — Particles B — 1.0 wt % — — Particles C — — 1.0 wt % — Particles D — — — 1.0 wt % Proline 1.0 wt % 1.0 wt % 1.0 wt % 1.0 wt % Water Soluble 0.1 wt % 0.1 wt % 0.1 wt % 0.1 wt % Nonionic Block Copolymer Biocide 0.05 wt % 0.05 wt % 0.05 wt % 0.05 wt % Water balance balance balance balance - CMP Slurry Compositions 4-A through 4-D were separately used to polish SiO2 and Si3N4 film layers on silicon wafers. The SiO2 film layer was a 10,000 Å thermal oxide film on a silicon wafer. The Si3N4 film layer was 1,500 Å film formed by low-pressure chemical vapor deposition on a 1,000 Å SiO2 thermal oxide film on a silicon wafer. In each case, the wafers were polished using a Strasbaugh 6EC polisher, with a Rodel IC-1000/SubaIV k-groove polishing pad at 4.5 psi down force and 1 psi back pressure, 135 rpm platen speed and 131 rpm head speed, 60% in-situ conditioning at 6 pounds down force with a Marshall Labs 80 grit diamond conditioner, and a slurry flow rate of 150 ml/min. Polishing results are reported in Table 3 below:
TABLE 3 CMP CMP CMP CMP Slurry 4-A Slurry 4-B Slurry 4-C Slurry 4-D SiO2 Removal 1950 Å/min 2242 Å/min 3005 Å/min 2954 Å/min Rate Si3N4 Removal 12.6 Å/min >1500 Å/min >1500 Å/min >1500 Å/min Rate - The results shown in Example 5 show that a slurry comprising 1% by weight of substantially spherical composite 87.5% ceria/12.5% titania particles (CMP Slurry 4-C) removed thermal oxide at a greater rate than a slurry comprising 1% by weight of conventional ceria particles (CMP Slurry 4-A).
- Particles produced in Example 3 from Precursor solution C (87.5% ceria/12.5% titania) were examined using transmission electron microscopy (TEM). Composite
FIG. 11A shows that such particles do not have a uniform size distribution, but tend to exhibit a substantially spherical shape. The smaller box in CompositeFIG. 11A shows the tip of an x-ray probe pointing to a single particle. The concentric rings radiating therefrom indicate that the particles are single-crystal in nature. - Composite
FIG. 11B is a high resolution TEM of a portion of a relatively large substantially spherical particle. The portion of the particle shown in CompositeFIG. 11B appears to have a 1-2 nm layer on its surface that is different in composition from the core of the particle. The smaller box in CompositeFIG. 11B shows the x-ray diffraction pattern for the particle, indicating again that it is a single crystal. - Composite
FIG. 11 C shows a smaller particle than shown in CompositeFIG. 11 B at the same resolution. The same core-shell structure appears on the smaller particle. - Composite
FIG. 11D is a TEM of the particles. CompositeFIG. 11E shows the same particles as in CompositeFIG. 11D mapped for the element cerium. CompositeFIG. 11F shows the same particles as in CompositeFIG. 11D mapped for the element titanium. CompositeFIGS. 11E and 11F show that cerium occupies predominantly the core of the particles whereas titanium predominantly occupies the shell structure of the particles. However, some small amounts of titanium appear in the core of the particles and some small amounts of cerium appear in the shell. - Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and illustrative examples shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
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