US20070134126A1 - Method of inhibiting metal corrosion - Google Patents

Method of inhibiting metal corrosion Download PDF

Info

Publication number
US20070134126A1
US20070134126A1 US11/636,637 US63663706A US2007134126A1 US 20070134126 A1 US20070134126 A1 US 20070134126A1 US 63663706 A US63663706 A US 63663706A US 2007134126 A1 US2007134126 A1 US 2007134126A1
Authority
US
United States
Prior art keywords
reaction solution
metal corrosion
metal
acid
inhibiting metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/636,637
Inventor
Kon-Tsu Kin
Chiou-Mei Chen
Yueh-Ting Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Industrial Technology Research Institute ITRI
Original Assignee
Industrial Technology Research Institute ITRI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrial Technology Research Institute ITRI filed Critical Industrial Technology Research Institute ITRI
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE reassignment INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIN, KON-TSU, CHEN, CHIOU-MEI, LIN, YUEH-TING
Publication of US20070134126A1 publication Critical patent/US20070134126A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F15/00Other methods of preventing corrosion or incrustation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/56Treatment of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/08Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
    • C23C8/10Oxidising
    • C23C8/12Oxidising using elemental oxygen or ozone
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/40Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions

Definitions

  • the present invention relates to a method of inhibiting metal corrosion, and more particularly to a method applicable to precision electronic devices to inhibit metal corrosion thereof.
  • Metal materials are widely applied in different industrial fields. Precision devices, such as semiconductor electronic elements and photoelectric displays, all have lead wires made of metal materials, including aluminum (Al), copper (Cu), molybdenum (Mo), chromium (Cr), titanium (Ti), etc. In the process of manufacturing the devices, these metal materials are corroded due to contacting with chemical agents and water of different temperatures and pH values being used in relevant processes, such as photolithographing, stripping, etching, washing, etc. The corroded metal materials would adversely affect the product quality.
  • a metal material is corroded because a cell reaction, or electrically polarized oxidation-reduction reaction, occurs between the metal and the substances existed in the environment in which the metal is processed, and the metal loses electrons and is corroded in an anodic oxidation reaction.
  • There are different ways of protecting metal material against corrosion including coating the metal material to isolate the same from a corrosive environment, and adding a corrosion inhibitor to change the corrosivity of the environment in which the metal material exists.
  • coating means to form a layer of appropriate organic compound, such as a cyclic polymer, or a metal protective layer on the metal material, so as to isolate the metal material from a corrosive environment or minimize the area of the metal material exposed to the corrosive environment, and thereby reduce the possibility of corrosion of the metal material.
  • the metal protective layer is normally used as a sacrificial anode, so that the relatively active metal protective layer instead of the metal lead wire is consumed in the reaction.
  • a corrosion inhibitor is added into an environment in which the metal material is processed, so as to change the corrosivity of the processing environment and reduce the metal corrosion.
  • Some examples of this way include reducing the dissolved oxygen in water, and adjusting the pH value of the water, so as to lower the oxidation and accordingly, the corrosion of metal material.
  • a primary object of the present invention is to provide a method of inhibiting metal corrosion, in which the corrosivity of a reaction solution is adjusted and controlled by adding ozone into chemical agents or water that would contact with metal lead wires in the manufacturing process.
  • the method of inhibiting metal corrosion according to the present invention is applicable to a metal-containing substrate, which has a surface in contact with a reaction solution.
  • the method includes the steps of mixing ozone (O 3 ) with the reaction solution and forming a passive metal oxide layer on the surface of the metal-containing substrate.
  • the reaction solution added with ozone has an increased oxidizability. Since molecular ozone or free radical ozone is a very strong oxidizer, appropriate adjustment of ozone concentration in the reaction solution enables formation of a passive metal oxide layer on the metal surface to protect the metal beneath the passive layer against continuous oxidation or corrosion by the reaction solution.
  • the method of the present invention may further include the step of mixing the reaction solution with an additive, such as a suitable inorganic acid or any salt thereof, so as to adjust the oxidation-reduction property and the pH value of the reaction solution, in which the metal-containing substrate is disposed, and accordingly, change the corrosivity of the reaction solution and mitigate the metal corrosion tendency.
  • an additive such as a suitable inorganic acid or any salt thereof
  • FIG. 1 is a flow chart showing the steps included in the method of inhibiting metal corrosion according to a preferred embodiment of the present invention.
  • FIG. 2 is a potential-current polarization curve diagram.
  • the method of inhibiting metal corrosion of the present invention is applicable to metal-containing substrate having a surface in contact with a reaction solution.
  • the metal-containing substrate surface may be caused to contact with the reaction solution in different ways, such as immersing the metal-containing substrate in the reaction solution, or spraying the reaction solution on the metal-containing substrate.
  • FIG. 1 is a flowchart showing the steps included in the method of inhibiting metal corrosion according to a preferred embodiment of the present invention. As shown, in a first step ( 110 ), ozone is mixed with the reaction solution. In a second step ( 120 ), a passive metal oxide layer is formed on the surface of the metal-containing substrate. And, in a third step ( 130 ), an adequate amount of additive is mixed with the reaction solution.
  • reaction solution In the step of mixing ozone with the reaction solution, either a solution containing ozone is added into the reaction solution, or gas-state ozone is directly added to dissolve in the reaction solution.
  • the reaction solution may be ultrapure water for cleaning, deionized water, water solution containing acid/alkali additives, or etching liquid and photoresist remover being used in other related process. It is preferable the concentration of ozone in the reaction solution is within the range from 0.1 to 30 ppm.
  • the additive used in the preferred embodiment of the present invention may be an inorganic acid or any salt thereof, such as carbonic acid, phosphoric acid, nitric acid, boric acid, silicic acid, etc.
  • a solution of the inorganic acid or any salt thereof is added into the reaction solution, or the inorganic acid or any salt thereof is directly added to dissolve in the reaction solution.
  • the additive may be mixed with a solution and the mixture is then added into the reaction solution.
  • the additive may be added independently or in any combination with other additives. It is preferable a total concentration of the additive in the reaction solution is between 10 ⁇ 5 and 10 ⁇ 1 mole (M).
  • an experiment is conducted. Five groups are included in the experiment. In the first group, only the deionized water is used as the reaction solution. In the second group, the deionized water is used as the reaction solution, into which ozone is added to reach an ozone concentration of 5 ppm and a pH value of 5.8. In the third group, the deionized water is used as the reaction solution, into which ozone and carbonic acid are added to reach an ozone concentration of 5 ppm and a pH value of 4.2.
  • the deionized water is used as the reaction solution, into which ozone and nitric acid are added to reach an ozone concentration of 5 ppm and a pH value of 3.5.
  • the deionized water is used as the reaction solution, into which ozone and phosphoric acid are added to reach an ozone concentration of 5 ppm and a pH value of 3.6.
  • Values of corrosion potential (E corr ) and corrosion current (I corr ) of aluminum metal in the solution of the five groups are electrochemically measured.
  • FIG. 2 is a potential-current polarization curve diagram showing the results from the above experiment. The values of corrosion potential and corrosion current of the aluminum metal in the solution of the five groups are derived based on FIG.
  • a low corrosion potential represents the aluminum metal tends to be easily corroded in the reaction solution; and a high corrosion current represents the aluminum metal is more quickly corroded in the reaction solution.
  • the aluminum metal has the highest corrosion tendency in the first group.
  • the corrosion tendency of the aluminum metal is obviously decreased.
  • inorganic acid such as carbonic acid, nitric acid, or phosphoric acid
  • the corrosion potential of the aluminum metal is effectively increased. From the above results, it is found the reaction solution added with ozone shows significant corrosion inhibition effect in terms of metal, as compared with the reaction solution without adding ozone.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A method of inhibiting metal corrosion is applicable to a metal-containing substrate, which has a surface in contact with a reaction solution. The method includes the steps of mixing ozone with the reaction solution and forming a metal oxide protective layer on the surface of the metal-containing substrate, so as to prevent metal beneath the protective layer from being continuously oxidized and corroded. In the method, the reaction solution contacting with metal is further adjusted in its oxidation-reduction property and pH value to change the corrosivity of the reaction solution and mitigate the corrosion tendency of metal.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a method of inhibiting metal corrosion, and more particularly to a method applicable to precision electronic devices to inhibit metal corrosion thereof.
  • BACKGROUND OF THE INVENTION
  • Metal materials are widely applied in different industrial fields. Precision devices, such as semiconductor electronic elements and photoelectric displays, all have lead wires made of metal materials, including aluminum (Al), copper (Cu), molybdenum (Mo), chromium (Cr), titanium (Ti), etc. In the process of manufacturing the devices, these metal materials are corroded due to contacting with chemical agents and water of different temperatures and pH values being used in relevant processes, such as photolithographing, stripping, etching, washing, etc. The corroded metal materials would adversely affect the product quality.
  • A metal material is corroded because a cell reaction, or electrically polarized oxidation-reduction reaction, occurs between the metal and the substances existed in the environment in which the metal is processed, and the metal loses electrons and is corroded in an anodic oxidation reaction. There are different ways of protecting metal material against corrosion, including coating the metal material to isolate the same from a corrosive environment, and adding a corrosion inhibitor to change the corrosivity of the environment in which the metal material exists.
  • By “coating”, it means to form a layer of appropriate organic compound, such as a cyclic polymer, or a metal protective layer on the metal material, so as to isolate the metal material from a corrosive environment or minimize the area of the metal material exposed to the corrosive environment, and thereby reduce the possibility of corrosion of the metal material. The metal protective layer is normally used as a sacrificial anode, so that the relatively active metal protective layer instead of the metal lead wire is consumed in the reaction.
  • In another way of protecting metal material, a corrosion inhibitor is added into an environment in which the metal material is processed, so as to change the corrosivity of the processing environment and reduce the metal corrosion. Some examples of this way include reducing the dissolved oxygen in water, and adjusting the pH value of the water, so as to lower the oxidation and accordingly, the corrosion of metal material.
  • However, most of the chemical agents used to inhibit corrosion are toxic or non-biodegradable to have adverse influences on the environment. Therefore, it is an important issue among different industrial fields to develop a method of inhibiting metal corrosion to maintain good electrical performance for metal lead wire and protect the environment at the same time.
  • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a method of inhibiting metal corrosion, in which the corrosivity of a reaction solution is adjusted and controlled by adding ozone into chemical agents or water that would contact with metal lead wires in the manufacturing process.
  • The method of inhibiting metal corrosion according to the present invention is applicable to a metal-containing substrate, which has a surface in contact with a reaction solution. The method includes the steps of mixing ozone (O3) with the reaction solution and forming a passive metal oxide layer on the surface of the metal-containing substrate. The reaction solution added with ozone has an increased oxidizability. Since molecular ozone or free radical ozone is a very strong oxidizer, appropriate adjustment of ozone concentration in the reaction solution enables formation of a passive metal oxide layer on the metal surface to protect the metal beneath the passive layer against continuous oxidation or corrosion by the reaction solution.
  • The method of the present invention may further include the step of mixing the reaction solution with an additive, such as a suitable inorganic acid or any salt thereof, so as to adjust the oxidation-reduction property and the pH value of the reaction solution, in which the metal-containing substrate is disposed, and accordingly, change the corrosivity of the reaction solution and mitigate the metal corrosion tendency.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1 is a flow chart showing the steps included in the method of inhibiting metal corrosion according to a preferred embodiment of the present invention; and
  • FIG. 2 is a potential-current polarization curve diagram.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The method of inhibiting metal corrosion of the present invention is applicable to metal-containing substrate having a surface in contact with a reaction solution. The metal-containing substrate surface may be caused to contact with the reaction solution in different ways, such as immersing the metal-containing substrate in the reaction solution, or spraying the reaction solution on the metal-containing substrate. Please refer to FIG. 1 that is a flowchart showing the steps included in the method of inhibiting metal corrosion according to a preferred embodiment of the present invention. As shown, in a first step (110), ozone is mixed with the reaction solution. In a second step (120), a passive metal oxide layer is formed on the surface of the metal-containing substrate. And, in a third step (130), an adequate amount of additive is mixed with the reaction solution. In the step of mixing ozone with the reaction solution, either a solution containing ozone is added into the reaction solution, or gas-state ozone is directly added to dissolve in the reaction solution. The reaction solution may be ultrapure water for cleaning, deionized water, water solution containing acid/alkali additives, or etching liquid and photoresist remover being used in other related process. It is preferable the concentration of ozone in the reaction solution is within the range from 0.1 to 30 ppm.
  • The additive used in the preferred embodiment of the present invention may be an inorganic acid or any salt thereof, such as carbonic acid, phosphoric acid, nitric acid, boric acid, silicic acid, etc. To add the additive, either a solution of the inorganic acid or any salt thereof is added into the reaction solution, or the inorganic acid or any salt thereof is directly added to dissolve in the reaction solution. Alternatively, the additive may be mixed with a solution and the mixture is then added into the reaction solution. The additive may be added independently or in any combination with other additives. It is preferable a total concentration of the additive in the reaction solution is between 10−5 and 10−1 mole (M).
  • For the purpose of more clearly describing the method of the present invention, an experiment is conducted. Five groups are included in the experiment. In the first group, only the deionized water is used as the reaction solution. In the second group, the deionized water is used as the reaction solution, into which ozone is added to reach an ozone concentration of 5 ppm and a pH value of 5.8. In the third group, the deionized water is used as the reaction solution, into which ozone and carbonic acid are added to reach an ozone concentration of 5 ppm and a pH value of 4.2. In the fourth group, the deionized water is used as the reaction solution, into which ozone and nitric acid are added to reach an ozone concentration of 5 ppm and a pH value of 3.5. In the fifth group, the deionized water is used as the reaction solution, into which ozone and phosphoric acid are added to reach an ozone concentration of 5 ppm and a pH value of 3.6. Values of corrosion potential (Ecorr) and corrosion current (Icorr) of aluminum metal in the solution of the five groups are electrochemically measured. FIG. 2 is a potential-current polarization curve diagram showing the results from the above experiment. The values of corrosion potential and corrosion current of the aluminum metal in the solution of the five groups are derived based on FIG. 2, and indicated in the following Table 1.
    TABLE 1
    Icorr. (A/cm2) Ecorr. (V)
    1st group 3.611 × 10−8 −0.5739
    2nd group 5.135 × 10−8 −0.4798
    3rd group 1.652 × 10−8 0.0236
    4th group 8.393 × 10−9 −0.2659
    5th group 1.745 × 10−8 −0.2478
  • A low corrosion potential represents the aluminum metal tends to be easily corroded in the reaction solution; and a high corrosion current represents the aluminum metal is more quickly corroded in the reaction solution. As can be seen from Table 1, the aluminum metal has the highest corrosion tendency in the first group. In the second to the fifth group, in which ozone is added into the reaction solution, the corrosion tendency of the aluminum metal is obviously decreased. In the third to the fifth group, in which inorganic acid, such as carbonic acid, nitric acid, or phosphoric acid, is added into the reaction solution, the corrosion potential of the aluminum metal is effectively increased. From the above results, it is found the reaction solution added with ozone shows significant corrosion inhibition effect in terms of metal, as compared with the reaction solution without adding ozone.
  • The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (17)

1. A method of inhibiting metal corrosion, said method being applicable to a metal-containing substrate that has a surface in contact with a reaction solution; said method comprising the steps of:
mixing ozone with the reaction solution; and
forming a passive metal oxide layer on the surface of the metal-containing substrate.
2. The method of inhibiting metal corrosion as claimed in claim 1, wherein a concentration of the ozone in the reaction solution is preferably within the range from 0.1 to 30 ppm.
3. The method of inhibiting metal corrosion as claimed in claim 1, wherein the ozone is dissolved in a solution before being added into the reaction solution.
4. The method of inhibiting metal corrosion as claimed in claim 3, wherein the solution includes an additive.
5. The method of inhibiting metal corrosion as claimed in claim 4, wherein the additive includes an inorganic acid or any salt thereof, or any combinations of the inorganic acid and any salt thereof.
6. The method of inhibiting metal corrosion as claimed in claim 5, wherein the inorganic acid is selected from the group consisting of carbonic acid, phosphoric acid, nitric acid, boric acid, and silicic acid.
7. The method of inhibiting metal corrosion as claimed in claim 5, wherein the additive in the reaction solution has a concentration preferably within the range from 10−5 to 10−1M.
8. The method of inhibiting metal corrosion as claimed in claim 1, wherein the ozone is in gas state and directly dissolved in the reaction solution.
9. The method of inhibiting metal corrosion as claimed in claim 1, further comprising the step of mixing an additive with the reaction solution.
10. The method of inhibiting metal corrosion as claimed in claim 9, wherein the additive includes an inorganic acid or any salt thereof, or any combinations of the inorganic acid and any salt thereof.
11. The method of inhibiting metal corrosion as claimed in claim 10, wherein the inorganic acid is selected from the group consisting of carbonic acid, phosphoric acid, nitric acid, boric acid, and silicic acid.
12. The method of inhibiting metal corrosion as claimed in claim 10, wherein the additive in the reaction solution has a concentration preferably within the range from 105 to 10−1M.
13. The method of inhibiting metal corrosion as claimed in claim 1, wherein the reaction solution is selected from the group consisting of ultrapure water, deionized water, and water solution containing acid/alkali agent.
14. The method of inhibiting metal corrosion as claimed in claim 1, wherein the reaction solution is selected from the group consisting of etching liquid and photoresist remover.
15. The method of inhibiting metal corrosion as claimed in claim 1, wherein the metal-containing substrate is immersed in the reaction solution.
16. The method of inhibiting metal corrosion as claimed in claim 1, wherein the reaction solution is sprayed on the metal-containing substrate.
17. The method of inhibiting metal corrosion as claimed in claim 1, wherein the reaction solution is immersed the metal-containing substrate.
US11/636,637 2005-12-13 2006-12-11 Method of inhibiting metal corrosion Abandoned US20070134126A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW94144136 2005-12-13
TW094144136A TW200722554A (en) 2005-12-13 2005-12-13 Method of inhibiting metal corrosion

Publications (1)

Publication Number Publication Date
US20070134126A1 true US20070134126A1 (en) 2007-06-14

Family

ID=38139572

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/636,637 Abandoned US20070134126A1 (en) 2005-12-13 2006-12-11 Method of inhibiting metal corrosion

Country Status (2)

Country Link
US (1) US20070134126A1 (en)
TW (1) TW200722554A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113138159B (en) * 2021-05-21 2024-03-08 中国石油化工股份有限公司 Corrosion evaluation method and corrosion evaluation device in ozone environment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252300A (en) * 1989-11-01 1993-10-12 Aquazon Pty. Ltd. Corrosion inhibition process
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5983909A (en) * 1996-03-27 1999-11-16 Frontec Incorporated Cleaning method and apparatus for the same
US20050178401A1 (en) * 2002-04-26 2005-08-18 Boyers David G. Method and apparatus for treating a substrate with an ozone-solvent solution III

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252300A (en) * 1989-11-01 1993-10-12 Aquazon Pty. Ltd. Corrosion inhibition process
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
US5983909A (en) * 1996-03-27 1999-11-16 Frontec Incorporated Cleaning method and apparatus for the same
US20050178401A1 (en) * 2002-04-26 2005-08-18 Boyers David G. Method and apparatus for treating a substrate with an ozone-solvent solution III

Also Published As

Publication number Publication date
TW200722554A (en) 2007-06-16

Similar Documents

Publication Publication Date Title
KR101901721B1 (en) Etchant for copper/molybdenum-based multilayer thin film
US7329365B2 (en) Etchant composition for indium oxide layer and etching method using the same
US20120256122A1 (en) Composition for etching of ruthenium-based metal, and process for preparation of the same
US8105998B2 (en) Liquid composition for removing photoresist residue and polymer residue
US20120319033A1 (en) Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein
KR101404511B1 (en) Etchant composition, and method for etching a multi-layered metal film
WO2015162934A1 (en) Etching solution for multi-layer film containing molybdenum and copper, etching concentrate, and etching method
CN111155091A (en) Etching solution, additive and method for manufacturing metal wiring
KR101243847B1 (en) Method for etching cu/mo alloy film with etching capacity of etching solution improved
CN105960700B (en) Liquid composition for etching oxide containing indium, zinc, tin and oxygen, and etching method
KR20070077113A (en) Etching solution for laminated film of aluminum-based metal film and molybdenum-based metal film
CN105803459A (en) Micro-electronic multilayer metal film etching liquid and application thereof
KR20100107399A (en) Gold and nickel selective etching liquid
KR102293675B1 (en) Etching solution composition for copper-based metal layer and method for etching copper-based metal layer using the same
US20070134126A1 (en) Method of inhibiting metal corrosion
KR101394469B1 (en) Etchant composition, and method for etching a multi-layered metal film
CN111902569B (en) Etching solution
KR20160107761A (en) Etchant composition for etching an indium oxide layer and method of manufacturing a display substrate using the etchant composition
TWI758342B (en) Etching composition
TW201945520A (en) Etchant capable of suppressing damage to IGZO
KR101059487B1 (en) Tin whisker inhibitor and manufacturing method of whisker-resistant tin plating material using the same
KR101614879B1 (en) Etchant composition, and method for etching a multi-layered metal film
JP2006339509A (en) Composition for etching metal titanium and etching method using it
CN101100744A (en) Method for inhibiting metallic corrosion
KR102513169B1 (en) Etchant composition for etching an indium oxide layer and method of manufacturing a display substrate using the etchant composition

Legal Events

Date Code Title Description
AS Assignment

Owner name: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KIN, KON-TSU;CHEN, CHIOU-MEI;LIN, YUEH-TING;REEL/FRAME:018699/0014;SIGNING DATES FROM 20061012 TO 20061017

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION