US20070044310A1 - Heat sink made from a singly extruded heatpipe - Google Patents
Heat sink made from a singly extruded heatpipe Download PDFInfo
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- US20070044310A1 US20070044310A1 US11/553,491 US55349106A US2007044310A1 US 20070044310 A1 US20070044310 A1 US 20070044310A1 US 55349106 A US55349106 A US 55349106A US 2007044310 A1 US2007044310 A1 US 2007044310A1
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- United States
- Prior art keywords
- pipe
- heatpipe
- fins
- heat
- interior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
- Y10T29/49378—Finned tube
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
- Y10T29/49378—Finned tube
- Y10T29/49384—Internally finned
Definitions
- the present invention relates in general to the field of electronics, and in particular to the removal of extraneous heat from electronic chips. More particularly, the present invention relates to a functional design and method of manufacture of a heat sink having a heatpipe.
- the main heat-generating component among the logic circuits is the processor, also referred to as the Central Processing Unit (CPU) or microprocessor (MP).
- CPU Central Processing Unit
- MP microprocessor
- FIG. 1 a a processor 102 is mounted in a socket 104 , which is mounted on a (printed) circuit board 106 , by mating pins 108 from the processor 102 into the socket 104 .
- processors continue to grow in performance, so does the heat generated by the processors. This heat, if excessive, can cause the processor 102 , or any other similar Integrated Circuit (IC) package, to malfunction or fail entirely.
- IC Integrated Circuit
- a heat sink (HS) 110 having a HS base 112 and a plurality of fins 114 , is secured to processor 102 by a strap 116 or other attachment means. Heat is conducted from the processor 102 to the HS base 112 and the fins 114 , which dissipate heat by conduction and convection to ambient air surrounding fins 114 .
- a thermal grease 118 typically a thermally conductive silicon or filled hydrocarbon grease doped with fillings such as metals, is used.
- heat sink 110 A major problem with the heat sink 110 shown in FIG. 1 a is that it relies on conduction to the ambient air, which may or may not be moving enough to significantly convey away heat, depending on movement of air about the heat sink caused by fan(s) in a computer case that houses the processor 102 .
- the prior art provided the improvement of a heat sink fan 122 , as shown in FIG. 1 b .
- heat sink fan 122 includes fan blades 124 that rotate about a hub 126 .
- FIGS. 1 a - b As IC's became even denser with more and more transistors and other electronic components, the heat sink configurations shown in FIGS. 1 a - b became insufficient to remove damaging heat from IC packages such as that shown for processor 102 .
- the next step-up in prior art heat removal technology was the development of a heat sink that incorporated a pipe filled with a heat-transferring fluid. This type of heat sink is known as a “heatpipe.”
- FIG. 2 a a prior art heatpipe 200 is depicted. Heatpipe 200 is composed of a heatpipe base 202 , which is adjacent to processor 102 , with or without intermediary thermal grease 118 . As shown in FIGS.
- heatpipe 200 attached to heatpipe base 202 is a pipe 204 , from which a plurality of horizontal fins 206 extends. Horizontal fins 206 convectively remove heat away from pipe 204 , in a manner similar to that described for fins 114 described in FIGS. 1 a - b .
- heatpipe 200 utilizes fluid heat transfer as well.
- pipe 204 is filled with a fluid 208 , which is retained inside of pipe 204 by a pipe cap 210 .
- fluid 208 circulates in a vertical manner within pipe 204 . That is, as fluid 208 is heated at the bottom of pipe 204 , which is adjacent heatpipe base 202 and thus the heat producing processor 102 , fluid 208 rises upwards towards a pipe cap 210 at the top of pipe 204 .
- fluid 208 flows back down the interior sides of pipe 204 .
- the sides of pipe 204 are able to conduct away heat from fluid 208 , since the horizontal fins 206 provide additional conduction/convection cooling from the sides of pipe 204 to the ambient air.
- heatpipe 200 depicted in FIGS. 2 a - c was a great improvement over prior art heat sinks, the construction of heatpipe 200 is cumbersome. Each component of heatpipe 200 must be individually fabricated, and the entire heatpipe 200 then assembled. That is, heatpipe base 202 , pipe 204 , horizontal fins 206 and pipe cap 210 must each be separately fabricated, and then the pieces are bonded together to form the final heatpipe 200 .
- One of the most onerous steps in the fabrication/assembly process for heatpipe 200 is the attachment of horizontal fins 206 to pipe 204 . After aligning each of the horizontal fins 206 with pipe 204 , the horizontal fins 206 are bonded (usually with heat welding or a similar process) to pipe 204 . This process is expensive, time consuming, and difficult to meet quality control parameters.
- the present invention is therefore directed to a heatpipe for cooling an integrated circuit.
- the heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal.
- Each of the radial fins extends away from the pipe and (preferably) runs the length of the pipe.
- Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins.
- Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.
- FIGS. 1 a - b depict a prior art heat sink
- FIGS. 2 a - c depict a prior art heatpipe
- FIGS. 3 a - b illustrate the inventive heatpipe
- FIG. 3 c depicts a single extrusion used to fabricate the inventive heatpipe.
- FIG. 4 illustrates an exemplary computer system in which the inventive heatpipe may be incorporated.
- Heatpipe 300 is made up of a pipe 302 , from which multiple external fins 304 extend.
- the external fins 304 are oriented longitudinally along the sides of pipe 302 as shown in FIG. 3 a.
- Each external fin 304 has a plurality of subfins 306 , which are preferably extended away from the external fins 304 in a generally normal orientation, such that the external fins 304 and subfins 306 form a pinwheel shape around pipe 302 as depicted.
- interior fins 308 which run along the entire interior length of pipe 302 just as external fins 304 run longitudinally along the entire exterior length of pipe 302 .
- a vapor chamber 310 In the middle of pipe 302 is a vapor chamber 310 , through which a cooling fluid can travel upwards away from a heat source, such as an Integrated Circuit (IC) package 312 that is within a system such as a computer system shown below in FIG. 4 .
- IC Integrated Circuit
- the cooling fluid is contained within pipe 302 by fusing (or otherwise attaching) a base 316 at a first end of pipe 302 and a pipe cap 318 at a second end of pipe 302 .
- the cooling fluid circulates within pipe 302 in a manner similar to that shown in pipe 204 in FIG. 2 c , except that the wicking material 314 provides an additional cooling aid from the drawing of the cooling material towards the cooled interior sides of pipe 302 .
- a fan 320 is mounted above heatpipe 300 , to facilitate in the movement of air past external fins 304 and subfins 306 .
- a base spacer ring 324 is optionally attached between the lower end of pipe 302 and base 316 . Note that base spacer ring 324 attaches to an opened end (not shown) of pipe 302 to permit movement of the cooling fluid to reach base 316 .
- pipe 302 attaches directly to base 316 , without an intervening base spacer ring 324 , in order to make fabrication of heatpipe 300 easier.
- base spacer ring 324 is not included, then care should be taken to ensure that adequate airflow reaches subfins 306 , such as through passages 326 shown in FIG. 3 b .
- the lower portions of extruded external fins 304 can be machined (preferably milled) down, to create air gap 322 without the need for a base spacer ring 324 .
- base spacer ring 324 is not needed.
- a single extrusion 328 is depicted, which includes pipe 302 , external fins 304 , subfins 306 , and internal fins 308 .
- single extrusion 328 is formed by extruding a single piece of material, preferably metal, resulting in the cross-sectional shape shown in FIG. 3 c .
- the extrusion process is any material extrusion process known to those skilled in the art of material extrusion.
- the single extrusion 328 is then cut and mounted (preferably using heat fusion) to base 316 .
- Wicking material 314 is inserted into the interior of pipe 302 , which is then evacuated and filled with a cooling fluid.
- Pipe 302 is then capped by fusing pipe cap 318 to the top end of pipe 302 .
- FIG. 4 there is depicted a block diagram of an exemplary data processing system that may incorporate heatpipe 300 for cooling purposes, including the cooling of a central processing unit such as a depicted central processing unit 402 .
- Data processing system 400 may be, for example, one of the models of personal or server computers available from International Business Machines Corporation of Armonk, N.Y.
- Data processing system 400 includes a central processing unit (CPU) 402 , which is connected to a system bus 408 .
- CPU central processing unit
- data processing system 400 includes a graphics adapter 404 also connected to system bus 408 , for providing user interface information to a display 406 .
- I/O bus bridge 412 couples an I/O bus 414 to system bus 408 , relaying and/or transforming data transactions from one bus to the other.
- Peripheral devices such as nonvolatile storage 416 , which may be a hard disk drive, and input device 418 , which may include a conventional mouse, a trackball, or the like, is connected to I/O bus 414 .
- data processing system 400 might also include a compact disk read-only memory (CD-ROM) or digital versatile disk (DVD) drive, a sound card and audio speakers, and numerous other optional components. All such variations are believed to be within the spirit and scope of the present invention.
- CD-ROM compact disk read-only memory
- DVD digital versatile disk
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- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and runs (preferably) the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.
Description
- The present divisional application claims priority of U.S. patent application Ser. No. 11/000,583, filed Dec. 1, 2004.
- 1. Technical Field
- The present invention relates in general to the field of electronics, and in particular to the removal of extraneous heat from electronic chips. More particularly, the present invention relates to a functional design and method of manufacture of a heat sink having a heatpipe.
- 2. Description of the Related Art
- In a typical personal computer (PC), the main heat-generating component among the logic circuits is the processor, also referred to as the Central Processing Unit (CPU) or microprocessor (MP). As illustrated in
FIG. 1 a, aprocessor 102 is mounted in asocket 104, which is mounted on a (printed)circuit board 106, bymating pins 108 from theprocessor 102 into thesocket 104. As processors continue to grow in performance, so does the heat generated by the processors. This heat, if excessive, can cause theprocessor 102, or any other similar Integrated Circuit (IC) package, to malfunction or fail entirely. - To remove heat from
processor 102, a heat sink (HS) 110, having aHS base 112 and a plurality offins 114, is secured toprocessor 102 by astrap 116 or other attachment means. Heat is conducted from theprocessor 102 to theHS base 112 and thefins 114, which dissipate heat by conduction and convection to ambientair surrounding fins 114. To provide thermal conduction between atop surface 120 ofprocessor 102 and theHS base 112, athermal grease 118, typically a thermally conductive silicon or filled hydrocarbon grease doped with fillings such as metals, is used. - A major problem with the
heat sink 110 shown inFIG. 1 a is that it relies on conduction to the ambient air, which may or may not be moving enough to significantly convey away heat, depending on movement of air about the heat sink caused by fan(s) in a computer case that houses theprocessor 102. To aid in this air movement, the prior art provided the improvement of a heat sink fan 122, as shown inFIG. 1 b. As shown, heat sink fan 122 includesfan blades 124 that rotate about ahub 126. - As IC's became even denser with more and more transistors and other electronic components, the heat sink configurations shown in
FIGS. 1 a-b became insufficient to remove damaging heat from IC packages such as that shown forprocessor 102. The next step-up in prior art heat removal technology was the development of a heat sink that incorporated a pipe filled with a heat-transferring fluid. This type of heat sink is known as a “heatpipe.” With reference now toFIG. 2 a, a prior art heatpipe 200 is depicted. Heatpipe 200 is composed of aheatpipe base 202, which is adjacent toprocessor 102, with or without intermediarythermal grease 118. As shown inFIGS. 2 a-c, attached toheatpipe base 202 is apipe 204, from which a plurality ofhorizontal fins 206 extends.Horizontal fins 206 convectively remove heat away frompipe 204, in a manner similar to that described forfins 114 described inFIGS. 1 a-b. However, heatpipe 200 utilizes fluid heat transfer as well. - As shown in
FIG. 2 c,pipe 204 is filled with afluid 208, which is retained inside ofpipe 204 by a pipe cap 210. As depicted by the flow arrows inFIG. 2 c,fluid 208 circulates in a vertical manner withinpipe 204. That is, asfluid 208 is heated at the bottom ofpipe 204, which isadjacent heatpipe base 202 and thus theheat producing processor 102,fluid 208 rises upwards towards a pipe cap 210 at the top ofpipe 204. Whenfluid 208 reaches pipe cap 210,fluid 208 flows back down the interior sides ofpipe 204. The sides ofpipe 204 are able to conduct away heat fromfluid 208, since thehorizontal fins 206 provide additional conduction/convection cooling from the sides ofpipe 204 to the ambient air. - While the heatpipe 200 depicted in
FIGS. 2 a-c was a great improvement over prior art heat sinks, the construction of heatpipe 200 is cumbersome. Each component of heatpipe 200 must be individually fabricated, and the entire heatpipe 200 then assembled. That is,heatpipe base 202,pipe 204,horizontal fins 206 and pipe cap 210 must each be separately fabricated, and then the pieces are bonded together to form the final heatpipe 200. One of the most onerous steps in the fabrication/assembly process for heatpipe 200 is the attachment ofhorizontal fins 206 topipe 204. After aligning each of thehorizontal fins 206 withpipe 204, thehorizontal fins 206 are bonded (usually with heat welding or a similar process) to pipe 204. This process is expensive, time consuming, and difficult to meet quality control parameters. - What is needed therefore is a device and method of manufacture for a heatpipe that is cheaper, faster, and easier to meet quality control standards.
- The present invention is therefore directed to a heatpipe for cooling an integrated circuit. The heatpipe includes a pipe and radial fins that are formed by extruding a single piece of material, such as heat conducting metal. Each of the radial fins extends away from the pipe and (preferably) runs the length of the pipe. Each radial fin has normally oriented subfins that provide additional heat convection surface areas to the radial fins. Within the pipe are interior fins, also formed during the material extrusion process. The interior fins provide additional conduction cooling to a heat transferring fluid circulating within the pipe.
- The above, as well as additional objectives, features, and advantages of the present invention will become apparent in the following detailed written description.
- The novel features believed characteristic of the invention are set forth in the appended claims. The invention itself, however, as well as a preferred mode of use, further purposes and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, where:
-
FIGS. 1 a-b depict a prior art heat sink; -
FIGS. 2 a-c depict a prior art heatpipe; -
FIGS. 3 a-b illustrate the inventive heatpipe; -
FIG. 3 c depicts a single extrusion used to fabricate the inventive heatpipe; and -
FIG. 4 illustrates an exemplary computer system in which the inventive heatpipe may be incorporated. - With reference now to
FIGS. 3 a-b, there is depicted anovel heatpipe 300. Heatpipe 300 is made up of apipe 302, from which multipleexternal fins 304 extend. Theexternal fins 304 are oriented longitudinally along the sides ofpipe 302 as shown inFIG. 3 a. - Each
external fin 304 has a plurality ofsubfins 306, which are preferably extended away from theexternal fins 304 in a generally normal orientation, such that theexternal fins 304 andsubfins 306 form a pinwheel shape aroundpipe 302 as depicted. - Within the interior of
pipe 302 areinterior fins 308, which run along the entire interior length ofpipe 302 just asexternal fins 304 run longitudinally along the entire exterior length ofpipe 302. In the middle ofpipe 302 is avapor chamber 310, through which a cooling fluid can travel upwards away from a heat source, such as an Integrated Circuit (IC)package 312 that is within a system such as a computer system shown below inFIG. 4 . As the cooling fluid travels upwards through thevapor chamber 310, the cooling fluid is drawn towards the space aboutinterior fins 308 by awicking material 314. The cooling fluid is contained withinpipe 302 by fusing (or otherwise attaching) abase 316 at a first end ofpipe 302 and apipe cap 318 at a second end ofpipe 302. Thus, the cooling fluid circulates withinpipe 302 in a manner similar to that shown inpipe 204 inFIG. 2 c, except that thewicking material 314 provides an additional cooling aid from the drawing of the cooling material towards the cooled interior sides ofpipe 302. - Optionally, a
fan 320 is mounted aboveheatpipe 300, to facilitate in the movement of air pastexternal fins 304 andsubfins 306. To provide anair gap 322 for an additional amount of air inlet space, abase spacer ring 324 is optionally attached between the lower end ofpipe 302 andbase 316. Note thatbase spacer ring 324 attaches to an opened end (not shown) ofpipe 302 to permit movement of the cooling fluid to reachbase 316. - Alternatively,
pipe 302 attaches directly tobase 316, without an interveningbase spacer ring 324, in order to make fabrication ofheatpipe 300 easier. However, ifbase spacer ring 324 is not included, then care should be taken to ensure that adequate airflow reaches subfins 306, such as throughpassages 326 shown inFIG. 3 b. Alternatively, the lower portions of extrudedexternal fins 304 can be machined (preferably milled) down, to createair gap 322 without the need for abase spacer ring 324. Thus, by simply milling down the lower portions of the extrudedexternal fins 304, either before or after being mounted tobase 316, fewer parts need to be welded together (sincebase spacer ring 324 is not needed). - With reference now to
FIG. 3 c, asingle extrusion 328 is depicted, which includespipe 302,external fins 304,subfins 306, andinternal fins 308. During the fabrication ofheatpipe 300,single extrusion 328 is formed by extruding a single piece of material, preferably metal, resulting in the cross-sectional shape shown inFIG. 3 c. The extrusion process is any material extrusion process known to those skilled in the art of material extrusion. - The
single extrusion 328 is then cut and mounted (preferably using heat fusion) tobase 316.Wicking material 314 is inserted into the interior ofpipe 302, which is then evacuated and filled with a cooling fluid.Pipe 302 is then capped by fusingpipe cap 318 to the top end ofpipe 302. - With reference now to the
FIG. 4 , there is depicted a block diagram of an exemplary data processing system that may incorporateheatpipe 300 for cooling purposes, including the cooling of a central processing unit such as a depictedcentral processing unit 402. -
Data processing system 400 may be, for example, one of the models of personal or server computers available from International Business Machines Corporation of Armonk, N.Y.Data processing system 400 includes a central processing unit (CPU) 402, which is connected to asystem bus 408. In the exemplary embodiment,data processing system 400 includes agraphics adapter 404 also connected tosystem bus 408, for providing user interface information to adisplay 406. - Also connected to
system bus 408 are asystem memory 410 and an input/output (I/O)bus bridge 412. I/O bus bridge 412 couples an I/O bus 414 tosystem bus 408, relaying and/or transforming data transactions from one bus to the other. Peripheral devices such as nonvolatile storage 416, which may be a hard disk drive, andinput device 418, which may include a conventional mouse, a trackball, or the like, is connected to I/O bus 414. - The exemplary embodiment shown in
FIG. 4 is provided solely for the purposes of explaining the invention and those skilled in the art will recognize that numerous variations are possible, both in form and function. For instance,data processing system 400 might also include a compact disk read-only memory (CD-ROM) or digital versatile disk (DVD) drive, a sound card and audio speakers, and numerous other optional components. All such variations are believed to be within the spirit and scope of the present invention. - By using a single piece of extruded material to form the pipe and fins of a heatpipe, fabrication time is greatly reduced while quality is increased, since individual fins do not have to be fused to the pipe. Likewise, without extruding the pipe and fins as a single unit, it is difficult, if not infeasible, to have interior fins mounted to the interior of the pipe as described by the present invention.
- While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention. For example, the present invention may be useful with any heat generating device, besides the IC package described above.
- Finally, note that while terms such as “bottom” and “top” have been used to describe the spatial orientation and movement of different components, such terms are used generically, and the present invention as described and claimed is to include orientations so generally described, but not limited to such “up/down” definitions.
Claims (6)
1. A method for forming a heatpipe, the method comprising:
extruding a single piece of material to form:
a pipe, and
a plurality of external fins oriented longitudinally along the exterior sides of the pipe;
coupling a first end of the pipe to a base;
filling an interior of the pipe with a heat-transferring fluid; and
attaching a pipe cap to a second end of the pipe.
2. The method of claim 1 , wherein the extruded single piece of material includes a plurality of interior fins running longitudinally along an interior wall of the pipe.
3. The method of claim 1 , wherein the extruded single piece of material includes at least one subfin extending away from one or more of the extruded external fins.
4. The method of claim 1 , further comprising placing a wicking material between the fluid and an interior wall of the pipe before sealing the second end of the pipe with the pipe cap.
5. The method of claim 1 , further comprising placing a wicking material between the fluid and the interior fins before sealing the second end of the pipe with the pipe cap.
6. The method of claim 1 , wherein the extruded material is a metal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/553,491 US20070044310A1 (en) | 2004-12-01 | 2006-10-27 | Heat sink made from a singly extruded heatpipe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/000,583 US7195058B2 (en) | 2004-12-01 | 2004-12-01 | Heat sink made from a singly extruded heatpipe |
US11/553,491 US20070044310A1 (en) | 2004-12-01 | 2006-10-27 | Heat sink made from a singly extruded heatpipe |
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US11/000,583 Division US7195058B2 (en) | 2004-12-01 | 2004-12-01 | Heat sink made from a singly extruded heatpipe |
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US20070044310A1 true US20070044310A1 (en) | 2007-03-01 |
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US11/000,583 Active 2025-02-17 US7195058B2 (en) | 2004-12-01 | 2004-12-01 | Heat sink made from a singly extruded heatpipe |
US11/553,491 Abandoned US20070044310A1 (en) | 2004-12-01 | 2006-10-27 | Heat sink made from a singly extruded heatpipe |
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US11/000,583 Active 2025-02-17 US7195058B2 (en) | 2004-12-01 | 2004-12-01 | Heat sink made from a singly extruded heatpipe |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8462508B2 (en) | 2007-04-30 | 2013-06-11 | Hewlett-Packard Development Company, L.P. | Heat sink with surface-formed vapor chamber base |
US20140182132A1 (en) * | 2013-01-01 | 2014-07-03 | Asia Vital Components Co., Ltd. | Method of manufacturing a vapor chamber structure |
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CN107708887A (en) * | 2015-07-08 | 2018-02-16 | 日高精机株式会社 | Heat exchanger inserts the device of flat tube with fin |
Also Published As
Publication number | Publication date |
---|---|
CN100578767C (en) | 2010-01-06 |
CN1783462A (en) | 2006-06-07 |
US7195058B2 (en) | 2007-03-27 |
US20060113065A1 (en) | 2006-06-01 |
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