US20060175046A1 - Heat dispensing device - Google Patents
Heat dispensing device Download PDFInfo
- Publication number
- US20060175046A1 US20060175046A1 US11/053,255 US5325505A US2006175046A1 US 20060175046 A1 US20060175046 A1 US 20060175046A1 US 5325505 A US5325505 A US 5325505A US 2006175046 A1 US2006175046 A1 US 2006175046A1
- Authority
- US
- United States
- Prior art keywords
- heat
- dispensing
- fins
- dispensing device
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat dispensing device, and more particularly, to a heat dispensing device for cooling a heat source such as a CPU of a computer.
- a central processing unit (CPU) generates a heat due to high speed operation to thus cause high temperature which could damage the CPU so that a heat dispensing device cooperated with a fan is equipped to remove the heat from the CPU. Except for increasing length of a heat dispensing device, to have multiple fins “c” on the surface of a tubular body “a” of a dispensing device is a common way to increase the efficiency for dispensing heat as shown in FIG. 6 .
- the fins “c” are attached with the tubular body “a” by an adhesive “d” or a soldering agent so that the heat of a heat source “b” is dispensed outward by the fins “c”.
- Using the adhesive “d” or the soldering agent to connect the fins “c” to the tubular body “a” is a main stream for the conventional heat dispensing devices.
- the dispensing device has less efficiency for dispensing heat. Even efforts are made to improve the contents or formula of the adhesive “d” or the soldering agent; the heat cannot completely or satisfactorily be removed from the heat source “b” by the fins “c”.
- the heat dispensing device of the present invention includes a tubular body which has a contact end and a dispensing end which includes a plurality of fins so that a heat from the contact end is passed quickly to the dispensing end to obtain a satisfactory efficiency of dispensing heat.
- FIG. 1 is a perspective view to show a first embodiment of a heat dispensing device of the present invention
- FIG. 2 is another perspective view of the first embodiment for a first end of the heat dispensing device contacting with a heat source in use;
- FIG. 3 is a further sectional view of the first embodiment taken along the line A-A′ of FIG. 2 , showing a heat being brought into air from fins on the heat dispensing device in use;
- FIG. 4 is a perspective view of a second embodiment for a first end of a heat dispensing device being a flat board;
- FIG. 5 is a perspective view of a third embodiment for a first end of a heat dispensing device being bent into an S-shaped end;
- FIG. 6 is a cross-sectional view of a conventional heat dispensing device.
- a heat dispensing device of the present invention comprises a tubular body 1 which has a contact end 11 and a dispensing end 12 .
- a plurality of curve fins 2 is integrally connected to the outside of the dispensing end 12 .
- the contact end 11 When the contact end 11 is in contact with a heat source 3 (or die), the high temperature of the heat source 3 is passed through the contact end 11 of the body tubular 1 and conducted to the dispensing end 12 .
- the tubular body 1 made of a material with highly heat conductivity, such as silver, is prepared, and a plurality of curve fins 2 is made on the outside surface of the dispensing end 12 of the tubular body 1 with one step of machining, such as by the way of chip formation or molding process.
- the fins 2 are made to have the same curvature and located at equal distance from each other.
- the heat source 3 such as a CPU
- the heat of the heat source 3 is transferred and conducted toward the dispending end 12 via the area of the contact end 11 of the tubular body 1 .
- the heat is dispensed out from the fins 2 on the dispensing end 12 .
- the heat could dispense out from the tubular body 1 so that the temperature of the heat source 3 will not increase.
- the contact end 11 of the tubular body 1 can be a flat board which can be put on the heat source 3 and has larger contact area with the heat source 3 so that the heat can be conducted at higher rate.
- the contact end 11 of the tubular body 1 may also be bent into an S-shaped end, which includes larger contact area when being put on the heat source 3 to quickly remove the high temperature.
- tubular body 1 can use a vacuum pipe except having working fluid therein that better heat dissipating is obtained.
- the main character of the present invention is that the fins 2 are made directly on the outside of the dispensing end 12 by the way of chip formation, molding process, or any known one-step machining method to increase the area for dispensing heat.
- the fins 2 need no adhesive or soldering agent which has lower efficiency for conducting heat to attach with the tubular body.
- the heat dispensing device of the present invention thus has simple structure and is easily manufactured. The heat can be quickly and directly conducted to the dispensing end 12 without any obstructions such as the adhesive or soldering agent, so that the heat dispensing efficiency is improved.
Abstract
A heat dispensing device includes a tubular body with a contact end and a dispensing end. A plurality of fins is integrally connected on outside of the dispensing end so as to increase the area for dispensing heat. The heat is absorbed from the contact end and quickly and directly conducted to the dispensing end to have an optimal efficiency for removing heat from a heat source.
Description
- The present invention relates to a heat dispensing device, and more particularly, to a heat dispensing device for cooling a heat source such as a CPU of a computer.
- A central processing unit (CPU) generates a heat due to high speed operation to thus cause high temperature which could damage the CPU so that a heat dispensing device cooperated with a fan is equipped to remove the heat from the CPU. Except for increasing length of a heat dispensing device, to have multiple fins “c” on the surface of a tubular body “a” of a dispensing device is a common way to increase the efficiency for dispensing heat as shown in
FIG. 6 . - The fins “c” are attached with the tubular body “a” by an adhesive “d” or a soldering agent so that the heat of a heat source “b” is dispensed outward by the fins “c”. Using the adhesive “d” or the soldering agent to connect the fins “c” to the tubular body “a” is a main stream for the conventional heat dispensing devices. However, due to the limited heat dispensing effect of the adhesive “d” or the soldering agent, the dispensing device has less efficiency for dispensing heat. Even efforts are made to improve the contents or formula of the adhesive “d” or the soldering agent; the heat cannot completely or satisfactorily be removed from the heat source “b” by the fins “c”.
- It is a main objective of the present invention to provide a heat dispensing device which includes integral fins on the body of the dispensing device without using any adhesive or soldering agent so as to increase the area for dispensing heat from a heat source and obtain the optimal efficiency of heat removal.
- In order to achieve the objective mentioned above, the heat dispensing device of the present invention includes a tubular body which has a contact end and a dispensing end which includes a plurality of fins so that a heat from the contact end is passed quickly to the dispensing end to obtain a satisfactory efficiency of dispensing heat.
- The present invention will become more obvious from the following description when taken in connection with the accompanying drawings, which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
-
FIG. 1 is a perspective view to show a first embodiment of a heat dispensing device of the present invention; -
FIG. 2 is another perspective view of the first embodiment for a first end of the heat dispensing device contacting with a heat source in use; -
FIG. 3 is a further sectional view of the first embodiment taken along the line A-A′ ofFIG. 2 , showing a heat being brought into air from fins on the heat dispensing device in use; -
FIG. 4 is a perspective view of a second embodiment for a first end of a heat dispensing device being a flat board; -
FIG. 5 is a perspective view of a third embodiment for a first end of a heat dispensing device being bent into an S-shaped end; and -
FIG. 6 is a cross-sectional view of a conventional heat dispensing device. - Referring to FIGS. 1 to 3, a heat dispensing device of the present invention comprises a
tubular body 1 which has acontact end 11 and a dispensingend 12. A plurality ofcurve fins 2 is integrally connected to the outside of the dispensingend 12. - When the
contact end 11 is in contact with a heat source 3 (or die), the high temperature of theheat source 3 is passed through thecontact end 11 of the body tubular 1 and conducted to the dispensingend 12. - In practice, the
tubular body 1 made of a material with highly heat conductivity, such as silver, is prepared, and a plurality ofcurve fins 2 is made on the outside surface of the dispensingend 12 of thetubular body 1 with one step of machining, such as by the way of chip formation or molding process. Thefins 2 are made to have the same curvature and located at equal distance from each other. When the dispensingend 12 is put on theheat source 3 such as a CPU, the heat of theheat source 3 is transferred and conducted toward the dispendingend 12 via the area of thecontact end 11 of thetubular body 1. The heat is dispensed out from thefins 2 on the dispensingend 12. Furthermore, due to a certain distance between the dispensingend 12 and theheat source 3, the heat could dispense out from thetubular body 1 so that the temperature of theheat source 3 will not increase. - As shown in
FIG. 4 , thecontact end 11 of thetubular body 1 can be a flat board which can be put on theheat source 3 and has larger contact area with theheat source 3 so that the heat can be conducted at higher rate. - As shown in
FIG. 5 , thecontact end 11 of thetubular body 1 may also be bent into an S-shaped end, which includes larger contact area when being put on theheat source 3 to quickly remove the high temperature. - Furthermore, although the drawings do not disclose, the
tubular body 1 can use a vacuum pipe except having working fluid therein that better heat dissipating is obtained. - Accordingly, the main character of the present invention is that the
fins 2 are made directly on the outside of the dispensingend 12 by the way of chip formation, molding process, or any known one-step machining method to increase the area for dispensing heat. Thefins 2 need no adhesive or soldering agent which has lower efficiency for conducting heat to attach with the tubular body. The heat dispensing device of the present invention thus has simple structure and is easily manufactured. The heat can be quickly and directly conducted to the dispensingend 12 without any obstructions such as the adhesive or soldering agent, so that the heat dispensing efficiency is improved. - While we have shown and described the embodiments in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
Claims (6)
1. A heat dispensing device for using on an electronic device comprising:
a tubular body made of a material with high heat conductivity, said body having a contact end in contact with a high temperature portion of the electronic device and a dispensing end having an outside surface including a plurality of curved fins extending from said outside surface and each curved fin formed integrally on the dispensing end of the body, so that heat generated by the electronic device is transferred to the dispensing end via the contact end of the body and wherein the curved fins have the same curvature and are located at equal distances from one another.
2. The device as claimed in claim 1 , wherein the contact end of the body is a flat board.
3. The device as claimed in claim 1 , wherein the contact end of the body is bent into an S-shaped end.
4. The device as claimed in claim 1 , wherein the fins are made within one-step of machining process.
5. The device as claimed in claim 1 , wherein the fins are made by the way of chip formation, or formed directly by cutting the surface of the body.
6. The device as claimed in claim 1 , wherein the body is a vacuum pipe having working fluid therein.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/053,255 US20060175046A1 (en) | 2005-02-09 | 2005-02-09 | Heat dispensing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/053,255 US20060175046A1 (en) | 2005-02-09 | 2005-02-09 | Heat dispensing device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060175046A1 true US20060175046A1 (en) | 2006-08-10 |
Family
ID=36778757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/053,255 Abandoned US20060175046A1 (en) | 2005-02-09 | 2005-02-09 | Heat dispensing device |
Country Status (1)
Country | Link |
---|---|
US (1) | US20060175046A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202008006125U1 (en) * | 2008-05-05 | 2009-11-12 | Ledon Lighting Gmbh | Heatpipe |
US20170336073A1 (en) * | 2014-11-28 | 2017-11-23 | Frostfree Venting Inc. | Method and apparatus for avoiding frost or ice build-up on exhaust vents and air intakes of condensing appliances |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1578254A (en) * | 1924-06-26 | 1926-03-30 | Thomas E Murray | Protection of metals against corrosion |
US4093755A (en) * | 1975-01-31 | 1978-06-06 | The Gates Rubber Company | Method for making a liquid heat exchanger coating |
US4195688A (en) * | 1975-01-13 | 1980-04-01 | Hitachi, Ltd. | Heat-transfer wall for condensation and method of manufacturing the same |
US4420035A (en) * | 1982-10-15 | 1983-12-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Thermal control system |
US4838346A (en) * | 1988-08-29 | 1989-06-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Reusable high-temperature heat pipes and heat pipe panels |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US5549155A (en) * | 1995-04-18 | 1996-08-27 | Thermacore, Inc. | Integrated circuit cooling apparatus |
US5651414A (en) * | 1993-12-28 | 1997-07-29 | Hitachi, Ltd. | Heat-pipe type cooling apparatus |
US5946190A (en) * | 1997-08-29 | 1999-08-31 | Hewlett-Packard Company | Ducted high aspect ratio heatsink assembly |
US6026890A (en) * | 1995-06-29 | 2000-02-22 | Actronics Kabushiki Kaisha | Heat transfer device having metal band formed with longitudinal holes |
US6070654A (en) * | 1998-04-03 | 2000-06-06 | Nissho Iwai Corporation | Heat pipe method for making the same and radiating structure |
US20030111212A1 (en) * | 2001-12-19 | 2003-06-19 | Ts Heatronics Co., Ltd. | Capillary tube heat pipe and temperature controlling apparatus |
-
2005
- 2005-02-09 US US11/053,255 patent/US20060175046A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1578254A (en) * | 1924-06-26 | 1926-03-30 | Thomas E Murray | Protection of metals against corrosion |
US4195688A (en) * | 1975-01-13 | 1980-04-01 | Hitachi, Ltd. | Heat-transfer wall for condensation and method of manufacturing the same |
US4093755A (en) * | 1975-01-31 | 1978-06-06 | The Gates Rubber Company | Method for making a liquid heat exchanger coating |
US4420035A (en) * | 1982-10-15 | 1983-12-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Thermal control system |
US4921041A (en) * | 1987-06-23 | 1990-05-01 | Actronics Kabushiki Kaisha | Structure of a heat pipe |
US4838346A (en) * | 1988-08-29 | 1989-06-13 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Reusable high-temperature heat pipes and heat pipe panels |
US5651414A (en) * | 1993-12-28 | 1997-07-29 | Hitachi, Ltd. | Heat-pipe type cooling apparatus |
US5549155A (en) * | 1995-04-18 | 1996-08-27 | Thermacore, Inc. | Integrated circuit cooling apparatus |
US6026890A (en) * | 1995-06-29 | 2000-02-22 | Actronics Kabushiki Kaisha | Heat transfer device having metal band formed with longitudinal holes |
US5946190A (en) * | 1997-08-29 | 1999-08-31 | Hewlett-Packard Company | Ducted high aspect ratio heatsink assembly |
US6070654A (en) * | 1998-04-03 | 2000-06-06 | Nissho Iwai Corporation | Heat pipe method for making the same and radiating structure |
US20030111212A1 (en) * | 2001-12-19 | 2003-06-19 | Ts Heatronics Co., Ltd. | Capillary tube heat pipe and temperature controlling apparatus |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202008006125U1 (en) * | 2008-05-05 | 2009-11-12 | Ledon Lighting Gmbh | Heatpipe |
US20170336073A1 (en) * | 2014-11-28 | 2017-11-23 | Frostfree Venting Inc. | Method and apparatus for avoiding frost or ice build-up on exhaust vents and air intakes of condensing appliances |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: EGBON ELECTRONICS LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, WAN-TIEN;REEL/FRAME:016264/0676 Effective date: 20050115 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |