US20050212113A1 - Hybrid integrated circuit device and method of manufacturing the same - Google Patents
Hybrid integrated circuit device and method of manufacturing the same Download PDFInfo
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- US20050212113A1 US20050212113A1 US10/907,338 US90733805A US2005212113A1 US 20050212113 A1 US20050212113 A1 US 20050212113A1 US 90733805 A US90733805 A US 90733805A US 2005212113 A1 US2005212113 A1 US 2005212113A1
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- 239000000758 substrate Substances 0.000 claims abstract description 191
- 238000000034 method Methods 0.000 claims description 13
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H05K3/3405—Edge mounted components, e.g. terminals
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- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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Definitions
- the present invention relates to a hybrid integrated circuit device and a method of manufacturing the same, more particularly to a hybrid integrated circuit device having leads functioning as external terminals and a method of manufacturing the same.
- FIGS. 12A to 14 A known method of manufacturing a hybrid integrated circuit device is described with reference to FIGS. 12A to 14 .
- FIG. 12A is a plan view of a large size metal substrate 116 A and FIG. 12B is a cross-sectional view of the large size metal substrate 116 A.
- the large size metal substrate 1116 A is cut into narrow strips along dicing lines D 10 shown in FIG. 12A . This cutting is performed by shearing with a shear force. Each narrow-cut metal substrate may be further cut into two or more sections considering workability in a later step such as a bonding step. Here in this case, the narrow-cut metal substrate is to be cut into two metal substrates 1116 B having different lengths.
- the substrate 116 A is a substrate made of aluminum. The both sides thereof are anodized. Moreover, on one side of the metal substrate 116 A on which hybrid integrated circuits will be formed, an insulating layer 107 is disposed to provide insulation between the metal substrate 116 A and conductive patterns. Thereafter, on an upper side of the insulating layer 107 , copper foil 118 is provided which is to be formed in conductive patterns.
- FIG. 13A is a plan view of the narrow-cut metal substrate 1116 B on which the plurality of hybrid integrated circuits 117 are formed
- FIG. 13B is a cross-sectional view thereof.
- conductive patterns 108 are formed by etching the copper foil which is attached by pressure to the surface of the insulating layer 107 .
- the patterning of the conductive patterns 108 is performed such that a plurality of hybrid integrated circuits are formed on the narrow metal substrate 1116 B.
- pads 108 A on which leads are fixed in a later step are formed to align in order.
- circuit elements 104 are fixed on predetermined locations on the conductive pattern 108 .
- the circuit elements 104 passive elements and active elements can generally be adopted. Further, in the case of mounting a power element, the element is mounted on a heatsink which is fixed on the conductive pattern.
- each circuit substrate 106 on the surface of which the hybrid integrated circuit 117 is formed, is cut separately from the metal substrate 116 B by punching out a portion of the circuit substrate 106 using a press machine.
- the press machine punches the metal substrate 116 B from the surface on the side on which the hybrid integrated circuits 117 are formed. Because of this, the periphery of the circuit substrate 106 has been left over as a margin on which no conductive patterns and circuit elements are formed.
- the circuit substrate 106 which is separately cut through the process described above, is finished as a product after passing through the steps of sealing the hybrid integrated circuit 117 and the like.
- This technology is described for instance in Japanese Patent Application Publication No. Hei 6(1994)- 177295 (page 4, FIG. 1 ).
- the hybrid integrated circuit device manufactured by the known manufacturing method described above has the problem of reduced reliability in connections between pads 108 A arranged in the periphery and leads which are to be connected to the pads 108 A.
- the reason behind this is that there is a case that a pad 108 A arranged at an end edge of the substrate 106 is arranged far apart from other pads 108 A. Under this condition, when a hybrid integrated circuit device is mounted using leads fixed to the pad 108 A, a large stress is exerted on the joint portion of the leads and the pads 108 A arranged at the end edge of the substrate 106 .
- the punching process causes the individual circuit substrates 106 to be separated in various scattered positions.
- the handling of the individual circuit substrates becomes complicated in later steps. Specifically, it is necessary to place each circuit substrate in a molding die separately in a sealing step, and thus there is a problem of handling in setting a position of each circuit substrate every time.
- the present invention provides a method of manufacturing a hybrid integrated circuit device, in which it is possible to perform sealing after fixing a plurality of circuit substrates on a lead frame.
- a hybrid integrated circuit device of the present invention includes: a circuit substrate; a plurality of pads arranged along a side surface of the circuit substrate; and leads fixed to the pads, wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
- the pads and the leads are fixed to each other with soft solder.
- any one of the first and second pads is a dummy pad.
- a method of manufacturing a hybrid integrated circuit of the present invention includes: the steps of: preparing a lead frame which is constituted by units each having a plurality of leads; and fixing a circuit substrate on each unit of the lead frame by fixing pads formed on a surface of the circuit substrate to the leads, wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
- the pads are arranged along a side edge of the circuit substrate.
- the pads are arranged along opposite side edges of the circuit substrate.
- any one of the first and second pads is a dummy pad.
- the fixing of the leads and the pads to each other is performed with brazing material.
- the circuit substrate is fixed on the lead frame after forming an electric circuit constituted by a conductive pattern and a circuit element on the surface of the circuit substrate.
- an electric circuit formed on the surface of the circuit substrate is sealed after fixing the circuit substrate on the lead frame.
- a space between a first pad located at an end edge and a second pad which is adjacent to the first pad is made narrower than the space between other pads themselves. Therefore, thermal stress, in a course of the manufacturing process and under the state of usage, acting on the first pad which is located at the end edge can be reduced, and thus reliability in connections between pads and leads can be improved.
- the subsequent steps can be performed under the circumstances that a plurality of circuit substrates are fixed to a lead frame. Therefore, it is possible to perform the steps of sealing with resin and the like, under the physically constricted states of the circuit substrates on the lead frame. With this constitution, time necessitated for handling for physical transportation of the circuit substrates and positioning thereof can be reduced.
- FIGS. 1A and 1B are a perspective view and a cross-sectional view of a hybrid integrated circuit device according to a preferred embodiment of the present invention, respectively.
- FIGS. 2A to 2 C are a plan view, a perspective view, and an enlarged view showing a method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIGS. 3A and 3B are a perspective view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIGS. 4A and 4B are a cross-sectional view and also a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIG. 5 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment.
- FIGS. 6A to 6 C are a perspective view, a cross-sectional view, and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIGS. 7A and 7B are a perspective view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIG. 8 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment.
- FIGS. 9A to 9 C are a plan view, a plan view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively.
- FIG. 10 is a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment.
- FIG. 11 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment.
- FIGS. 12A and 12B are a plan view and a cross-sectional view showing a known method of manufacturing a hybrid integrated circuit device, respectively.
- FIGS. 13A and 13B are a plan view and a cross-sectional view showing the known method of manufacturing the hybrid integrated circuit device, respectively.
- FIG. 14 is a plan view showing the known method of manufacturing the hybrid integrated circuit device.
- FIG. 1A is a perspective view of the hybrid integrated circuit device 10
- FIG. 1B is a cross-sectional view taken along the X-X′ line of FIG. 1A .
- the hybrid integrated circuit device 10 of the preferred embodiment includes a circuit substrate 16 on which an electric circuit having a conductive pattern 18 and circuit elements 14 is formed, and sealing resin 12 which seals this electric circuit and covers at least the surface of the circuit substrate 16 .
- a circuit substrate 16 on which an electric circuit having a conductive pattern 18 and circuit elements 14 is formed
- sealing resin 12 which seals this electric circuit and covers at least the surface of the circuit substrate 16 .
- the circuit substrate 16 is a substrate made of metal such as aluminum or copper.
- a substrate made of aluminum is adopted as the circuit substrate 16
- One method is to anodize the surface of the aluminum substrate.
- the other is to form an insulating layer 17 on the surface of the aluminum substrate and then to form the conductive patterns 18 on the top surface of the insulating layer 17 .
- the back side of the circuit substrate 16 may be exposed from the sealing resin 12 to the outside.
- the sealing resin 12 including the back side surface of the circuit substrate 16 .
- the side surfaces of the circuit substrate 16 have shapes having inclined portions protruding toward the outside. Having provided with the inclined portions on the side surfaces of the circuit substrate 16 as described above, adhesion strength between the side surface of the circuit substrate 16 and the sealing resin 12 can be improved.
- the circuit elements 14 are fixed on the conductive patterns 18 , and a predetermined electric circuit is constituted by the circuit elements 14 and the conductive patterns 18 .
- the circuit elements 14 active elements such as transistors and diodes, and passive elements such capacitors and resistors are to be adopted.
- the elements may be fixed to the circuit substrate 16 with a metal heatsink interposed therebetween.
- active elements and the like which are mounted with their faces upward are electrically connected to the conductive patterns 18 through thin metal wires 15 .
- the conductive pattern 18 is made of metal such as copper and is formed in insulation with the circuit substrate 16 .
- pads 13 are formed as part of the conductive patterns 18 at sides from which leads 111 protrude. In this configuration, a plurality of pads 13 aligned are provided in the vicinities of two opposite sides of the circuit substrate 16 . Further, the conductive pattern 18 adheres to the surface of the circuit substrate 16 by using the insulating layer 17 as an adhesive.
- a space between a first pad located at an end edge and a second pad adjacent to the first pad is made narrower than the space between two of the other pads.
- the leads 11 are fixed to the pads 13 which are provided in the periphery of the circuit substrate 16 , and provide functionality of input/output with the outside, for example.
- a plural number of leads 11 are provided in two opposite edge portions using soft solder 21 .
- Adhesion of the leads 111 and the pads 13 is performed using a conductive type adhesive material such as soft solder (brazing material). It is also possible to allow the leads 111 to protrude from only one side edge. Furthermore, it is also possible to allow the leads 111 to protrude from four side edges.
- the sealing resin 12 is formed by transfer molding using thermosetting resin or by injection molding using thermoplastic resin.
- the sealing resin 12 is formed so that the circuit substrate 16 and the electric circuit formed on the surface thereof are sealed, and the whole entity including the back side surface of the circuit substrate 16 is sealed with the sealing resin 12 .
- the back side of the circuit substrate 16 is exposed to the outside from the sealing resin 12 in order to improve heat dissipation.
- the manufacturing method includes the steps of preparing a lead frame 50 constituted by units 51 having a plurality of leads 11 , and fixing circuit substrate 16 on each unit 51 of the lead frame 50 by firmly fixing the leads 111 to the pads 13 which are formed on the surface of the circuit substrate 16 .
- a space between a first pad 13 A formed at an end edge of the circuit substrate 16 and a second pad 13 B adjacent to the first pad 13 A is set narrower than the space between the other pads, thus manufacturing the hybrid integrated circuit device.
- FIGS. 2A to 2 C are a plan view of the metal substrate 19 B, a perspective view indicating a state of forming the grooves in the metal substrate 19 B by using a V-cut saw 35 , and an enlarged view of a blade edge 35 A, respectively.
- the metal substrate 19 B of an intended size is prepared.
- conductive foil is attached by pressure with an insulating layer interposed therebetween.
- the plurality of conductive patterns 18 are formed by patterning this conductive foil in intended shapes.
- the number of conductive patterns 18 formed may depend on the size of the metal substrate 19 B and that of the hybrid integrated circuit, but conductive patterns which form about several tens to several hundreds of hybrid integrated circuits can be formed on one sheet of the metal substrate 19 B.
- first grooves 20 A and second grooves 20 B are formed in a lattice shape.
- FIG. 2B by rotating a V-cut saw 35 at a high speed, the first grooves 20 A and the second grooves 20 B are formed in the front and rear surfaces of the metal substrate along dicing lines D 2 .
- the dicing lines D 2 are arranged in a lattice shape.
- a shape of the V-cut saw 35 is described.
- the multiple number of blade edges 35 A having a shape as shown in FIG. 2C are disposed on the V-cut saw 35 .
- the shape of the blade edge 35 A corresponds to the shape of the grooves formed in the metal substrate 19 B.
- grooves having a V-shape in the cross-section are formed in both sides of the metal substrate. Accordingly, the shape of the blade edge 35 A is also V-shaped. Note that diamond is embedded in the blade edge 35 A.
- FIG. 3A is a perspective view of the metal substrate 19 B in which the grooves 20 are formed by the cut saw 35
- FIG. 3B is a cross-sectional view of the metal substrate 19 B.
- the first grooves 20 A and the second grooves 20 B are formed in a lattice shape.
- the two dimensional positions of the first grooves 20 A and the second grooves 20 B correspond to each other.
- the grooves 20 have a V-shaped cross section, since the grooves are formed with a V-cut saw 35 having the V-shaped blade edges 35 A.
- the center lines of the grooves 20 correspond to the boundaries of each of the conductive patterns 18 which is formed on an insulating layer 17 .
- the first grooves 20 A are formed in the surface on which a resin layer 17 is deposited, and on the other side the second grooves 20 B are formed.
- the grooves 20 are formed roughly in a V-shape cross-section.
- the depths of the first and second grooves 20 A and 20 B are shallower than a half thickness of the metal substrate 19 B. Accordingly, the individual circuit substrates 16 are not separated in this step. In other words, the circuit substrates 16 are connected to each other with the remaining-thickness portions of the metal substrate 19 B which correspond to the portions of the grooves 20 . Therefore, until the metal substrate 19 B is cut and separated into the individual circuit substrates 16 , the metal substrate 19 B can be treated as a sheet.
- the depth and width of the first and second grooves 20 A and 20 B can be adjusted. Specifically, by narrowing the aperture angle of the first grooves 20 A, it is possible to widen the effective area on which the conductive patterns 18 can be formed. In addition the same effect can be achieved by forming the depth of the first grooves 20 A shallower.
- the size of the first grooves 20 A and that of the second grooves 20 B can also be set equal to each other. This makes it possible to prevent warping from occurring in the metal substrate 16 B in which the grooves 20 are formed in a lattice shape.
- the circuit elements 14 are mounted on the conductive patterns 18 , and electrical connections between the circuit elements 14 and the conductive patterns 18 are performed.
- the circuit elements 14 are mounted on predetermined positions of the conductive patterns 18 using brazing material such as soft solder.
- brazing material such as soft solder.
- active elements such as transistors and diodes, and passive elements such as capacitors and resistors can be adopted.
- the elements may be fixed on the circuit substrate 16 with a metal heatsink interposed therebetween.
- active elements and the like which are mounted with their faces upward are electrically connected to the several tens to several hundreds of conductive patterns 18 formed on one metal substrate 19 B, through the thin metal wires 15 by simultaneous wire-bonding.
- the circuit elements 14 and the conductive patterns 18 are electronically connected.
- wire-bonding to the several tens to several hundreds of conductive patterns 18 formed on one metal substrate 19 B is simultaneously performed.
- FIG. 5 is a plan view of a part of the hybrid integrated circuit 17 formed on the metal substrate 19 B. As a matter of fact, a larger number of hybrid integrated circuits 17 are formed.
- dicing lines D 3 along which the metal substrate 19 B is cut into the individual circuit substrates 16 are shown as dotted lines.
- the conductive patterns 18 forming an individual hybrid integrated circuit and the dicing line D 3 are located extremely close to each other. This is to say that almost all the surface of the metal substrate 19 B is used to form the conductive patterns 18 .
- a plurality of hybrid integrated circuits are formed simultaneously on a surface of substrate 10 B having a long and thin shape.
- the metal substrate 19 B can also be cut into pieces of an appropriate size in a previous step prior to this step.
- the individual circuit substrates 16 are separated by cutting the metal substrate 16 B at the portions where the grooves 20 are formed. There may be found numerous ways to separate each circuit substrate 16 , but here, ways to separate by bending and by using a cutter are described.
- FIGS. 6A to 6 C described is a way to separate the individual circuit substrates 16 by bending the metal substrate 19 B.
- FIG. 6A is a perspective view of the metal substrate 19 B prior to the separation.
- FIG. 6B is a cross-sectional view taken along the X-X′ line of FIG. 6A .
- FIG. 6C is a cross-sectional view taken along the Y-Y′ line of FIG. 6A .
- the metal substrate 19 B is partially bended so that the bending occurs at the portions where the first grooves 20 A and the second grooves 20 B are formed.
- the portions where the first grooves 20 A and the second grooves 20 B are formed are connected with the remaining-thickness portions where the grooves 20 are not formed, and thus, by bending at these portions, separation can be easily performed at the connecting portions.
- the metal substrate 19 B is a substrate made of aluminum, bending is performed several times until separation is completed since aluminum is a viscous metal.
- each circuit substrate 16 in a matrix configuration. Formed at boundaries of each electric circuit are the first and second grooves 20 A and 20 B.
- the metal substrate 19 B on which a plurality of hybrid integrated circuits are connected in a matrix configuration is divided in one direction, thus obtaining strip metal substrates, in each of which a plurality of circuit substrates 16 are connected in one direction. Thereafter, each strip metal substrate is divided in other direction, thus obtaining the individual circuit substrates 16 .
- the cross-sectional view taken along the line X-X′ is described under the state that the separation is performed along the cutting line D 3 .
- the bending is performed at the boundary between the leftmost positioned circuit substrates 16 and the circuit substrates 16 adjacent to it. This bending is performed continuously in the bending direction BI shown in FIG. 6A . Since aluminum which is a material used for the metal substrate 19 B is a viscous material, separation is completed by performing bending several times.
- the bending of the metal substrate 19 B is performed after the side portions of the metal substrate 19 B are firmly supported with fixing portions 36 .
- the side surfaces of the circuit substrates 16 are slanted in a convex shape toward the outside.
- the metal substrate 19 B can be supported by pressing the convex shaped side surfaces in the lateral direction at the fixing portions 36 . Therefore, the fixing portions 36 will not come into contact with the surface of the metal substrate 19 B, and the conductive patterns and the circuit elements 14 can be formed on all the area of the surface of the metal substrate 19 B.
- FIGS. 7A and 7B a way to cut the metal substrate 19 B by using a round cutter 41 is described.
- the metal substrate 19 B is pressed to cut along the first grooves 20 A by using the round cutter 41 .
- the metal substrate 19 B is separated into the individual circuit substrates 16 .
- the remaining-thickness portions of the metal substrate 19 B in which the grooves 20 are not formed and which are center lines of the grooves 20 are pressed to cut by the round cutter 41 .
- the round cutter 41 has a round disk shape and the circumference thereof is formed in an acute angle.
- the center portion of the round cutter 41 is supported by a support member 42 such that the round cutter can rotate freely.
- the round cutter 41 does not have any driving force. In other words, the round cutter 41 rotates by moving it along the dicing line D 3 with a portion of the round cutter 41 pressed to the metal substrate 19 B.
- the circuit substrate 16 which has been separated in the previous step, is fixed on the lead frame 50 .
- the lead frame 50 presents a shape of a strip in its contour and is obtained by processing a metal sheet of about 1 mm to 0.5 mm thickness.
- the processing of this metal sheet can be performed either by etching or by stamping.
- the unit 51 can be defined as a group of leads 11 to be connected to the circuit substrate 16 . Therefore, in a condition that the leads are to be connected to two opposite edge portions of the circuit substrate 16 , a plurality of leads 111 are formed extending toward the center portion from the opposite edge portions of the unit 51 . In the case that the leads 111 are fixed at only one side of the circuit substrate, each unit 51 constituted by leads 11 which extend from one side toward the inside.
- each unit 51 The leads 111 of each unit 51 are connected to each other at a first connecting portion 53 and a second connecting portion 54 and the position is fixedly maintained. Further, end portions of the leads 111 extend to an area A 1 where the circuit substrate 16 is planed to be allocated.
- the slit 56 is formed almost as long as the width of the unit 51 or even longer than that, and it possesses a shape such as a continuous opening.
- Guide holes 52 are holes provided in longitudinal edge portions of the lead frame 50 , and are used in positioning of the lead frame 50 in each step. Therefore, the fixing of the position of the lead frame 50 using the guide holes 52 can also indirectly facilitate positioning of the circuit substrate 16 which is to be fixed on the unit 51 .
- FIG. 9A is a plan view showing a state of the hybrid integrated circuit device formed on the surface of the circuit substrate 16 .
- FIG. 9B is a plan view showing a state of the circuit substrate 16 fixed on the leads 11 of the unit 51 .
- FIG. 9C is a cross-sectional view taken along the X-X′ line in FIG. 9B .
- pads 13 formed on the surface of the circuit substrate 16 is described.
- the conductive pattern 18 is formed which is patterned to form an intended electric circuit. Thereafter, by electrically connecting the circuit elements 14 to intended portions in the conductive pattern 18 , a predetermined hybrid integrated circuit is formed. Further, the pads 13 which are constituted by portions of the conductive patterns 18 are formed in the vicinities of edge portions of the circuit substrate 16 .
- the pads 13 are formed which are aligned in the vicinities of longitudinal edge portions of the circuit substrate 16 which is formed in a narrow shape.
- a space between adjacent pads 13 can be as narrow as about 1.5 mm, it is possible to form a plural number of pads 13 along the longitudinal direction of the circuit substrate 16 .
- the number of necessary input/output terminals varies depending on the kind of an electrical circuit formed on the surface of the circuit substrate 16 .
- vacant positions are provided in the arrangement of the pads 13 as shown in FIG. 9A .
- the space between the pads 13 located apart from each other as described above is represented by D 2 .
- first pads 13 A which are the pads 13 located at the end edge portion.
- Second pads 13 B are adjacent to the first pads 13 A.
- the space D 1 between the first pad 13 A and the second pad 13 B is set almost as the same as or smaller than of the space D 2 between other pads 13 . Due to this arrangement, reliability in connection between the first pad 13 A and the lead 11 can be improved. The details thereof are described later.
- the pad 13 In a condition that the pad 13 is not necessitated as a connection terminal in the proximity of the first pad 13 A, it may be allowed to place a dummy pad 13 D.
- the dummy pad 13 D means a pad 13 which is not a constituent of the electric circuit. Accordingly, the dummy pad 13 D and the lead 11 are connected only mechanically.
- the pads 13 and the leads 11 are connected each other with conductive adhesive such as brazing material and the circuit substrate 16 is fixed on the lead frame 50 .
- the number count and physical locations of the leads 11 for each unit 51 correspond to the pads 13 which are formed on the surface of the circuit substrate 16 .
- the circuit substrate 16 is made of metal mostly aluminum
- the lead frame 50 is made of metal mostly copper. Since copper and aluminum have different thermal expansion coefficients, thermal stress is generated at the joint between the lead frame 50 and the circuit substrate 16 under the condition that heat is applied while both of them are mechanically connected. In this embodiment, the thermal stress is exerted at the joint portion of the lead 11 and the circuit substrate 16 . The magnitude of the thermal stress becomes greater as the space between the pads 13 increases. The thermal stress acts stronger for the pads 13 located in the periphery than for the pads 13 around the center portion of the circuit substrate 16 . Therefore, in a condition that the space between the first pad 13 A located at the outmost periphery and the adjacent second pad 13 B becomes greater, a large amount of thermal stress will act on the joint of the first pad 13 A and the lead 11 .
- the space between the first pad 13 A and the second pad 13 B is set smaller than spaces between other pads 13 .
- the length of the distance D 1 is set equal to or smaller than that of the distance D 2 .
- FIG. 10 is a cross-sectional view showing for the step of sealing the circuit substrate 16 with the sealing resin 12 by using a molding die 50 .
- the circuit substrate 16 is placed on a lower molding die 60 B.
- the circuit substrate 16 is contained in a cavity formed by contacting an upper molding die 60 A and a lower molding die 60 B.
- the sealing resin 12 is injected to the cavity through a gate 57 .
- the transfer molding using thermosetting resin or injection molding using thermoplastic resin can be adopted.
- the amount of gas inside the cavity which corresponds to the amount of the sealing resin 12 to be injected from the gate 57 is exhausted to the outside through an air vent 54 .
- the location of the gate and the air vent in FIG. 10 is an example and can be set arbitrarily depending on the shape and structure of the product.
- a plurality of circuit substrates 16 which are fixed to the lead frame can be sealed simultaneously.
- pads which locate at the end edges of the circuit substrate 16 are not isolated.
- thermal stresses that act on the pads located at the end edges can be reduced.
- slanted portions are provided at the side surfaces of the circuit substrate 16 . Therefore, by sealing with insulating resin, the sealing resin 12 flows, wrapping around the slanted portions. Because of this, an anchor effect is created between the sealing resin 12 and the slanted portions, and the bonding between the sealing resin 12 and the circuit substrate 16 is enhanced.
- FIG. 111 shows a state of the lead frame 50 after sealing with the sealing resin 12 .
- the circuit substrates 16 which are fixed on the respective units 51 have been sealed with the sealing resin 12 .
- the circuit substrate 16 sealed with the resin in this step is completed as a product after passing through a lead cut step, a testing step, and the like. Furthermore, the separation of each sealed circuit substrate 16 is performed after cutting the leads 11 .
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Abstract
A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves.
Description
- Priority is claimed to Japanese Patent Application Number JP2004-094685 filed on Mar. 29, 2004, the disclosure of which is incorporated herein by reference in its entirety.
- The present invention relates to a hybrid integrated circuit device and a method of manufacturing the same, more particularly to a hybrid integrated circuit device having leads functioning as external terminals and a method of manufacturing the same.
- A known method of manufacturing a hybrid integrated circuit device is described with reference to
FIGS. 12A to 14. - First, with reference to
FIGS. 12A and 12B , described is the step of cutting a largesize metal substrate 116A into narrow strips.FIG. 12A is a plan view of a largesize metal substrate 116A andFIG. 12B is a cross-sectional view of the largesize metal substrate 116A. - The large size metal substrate 1116A is cut into narrow strips along dicing lines D10 shown in
FIG. 12A . This cutting is performed by shearing with a shear force. Each narrow-cut metal substrate may be further cut into two or more sections considering workability in a later step such as a bonding step. Here in this case, the narrow-cut metal substrate is to be cut into two metal substrates 1116B having different lengths. - With reference to
FIG. 12B , a constitution of themetal substrate 116A is described. In this case, thesubstrate 116A is a substrate made of aluminum. The both sides thereof are anodized. Moreover, on one side of themetal substrate 116A on which hybrid integrated circuits will be formed, aninsulating layer 107 is disposed to provide insulation between themetal substrate 116A and conductive patterns. Thereafter, on an upper side of theinsulating layer 107,copper foil 118 is provided which is to be formed in conductive patterns. - With reference to
FIGS. 13A and 13B , description will be given on the step of forming hybrid integratedcircuits 117 on the surface of the narrow-cut metal substrate 1116B.FIG. 13A is a plan view of the narrow-cut metal substrate 1116B on which the plurality of hybrid integratedcircuits 117 are formed, andFIG. 13B is a cross-sectional view thereof. - First,
conductive patterns 108 are formed by etching the copper foil which is attached by pressure to the surface of theinsulating layer 107. Here, the patterning of theconductive patterns 108 is performed such that a plurality of hybrid integrated circuits are formed on the narrow metal substrate 1116B. Furthermore,pads 108A on which leads are fixed in a later step are formed to align in order. - Next, by use of brazing material such as soft solder,
circuit elements 104 are fixed on predetermined locations on theconductive pattern 108. As for thecircuit elements 104, passive elements and active elements can generally be adopted. Further, in the case of mounting a power element, the element is mounted on a heatsink which is fixed on the conductive pattern. - With reference to
FIG. 14 a method of separately cutting themetal substrate 116B, on which the plurality of hybrid integratedcircuits 117, intoindividual circuit substrates 106 is described. Eachcircuit substrate 106, on the surface of which the hybridintegrated circuit 117 is formed, is cut separately from themetal substrate 116B by punching out a portion of thecircuit substrate 106 using a press machine. Here, the press machine punches themetal substrate 116B from the surface on the side on which the hybrid integratedcircuits 117 are formed. Because of this, the periphery of thecircuit substrate 106 has been left over as a margin on which no conductive patterns and circuit elements are formed. - The
circuit substrate 106, which is separately cut through the process described above, is finished as a product after passing through the steps of sealing the hybrid integratedcircuit 117 and the like. This technology is described for instance in Japanese Patent Application Publication No. Hei 6(1994)-177295 (page 4,FIG. 1 ). - However, the hybrid integrated circuit device manufactured by the known manufacturing method described above has the problem of reduced reliability in connections between
pads 108A arranged in the periphery and leads which are to be connected to thepads 108A. The reason behind this is that there is a case that apad 108A arranged at an end edge of thesubstrate 106 is arranged far apart fromother pads 108A. Under this condition, when a hybrid integrated circuit device is mounted using leads fixed to thepad 108A, a large stress is exerted on the joint portion of the leads and thepads 108A arranged at the end edge of thesubstrate 106. - Furthermore, in the manufacturing method described above the punching process causes the
individual circuit substrates 106 to be separated in various scattered positions. Thus the handling of the individual circuit substrates becomes complicated in later steps. Specifically, it is necessary to place each circuit substrate in a molding die separately in a sealing step, and thus there is a problem of handling in setting a position of each circuit substrate every time. - The present invention provides a method of manufacturing a hybrid integrated circuit device, in which it is possible to perform sealing after fixing a plurality of circuit substrates on a lead frame.
- A hybrid integrated circuit device of the present invention includes: a circuit substrate; a plurality of pads arranged along a side surface of the circuit substrate; and leads fixed to the pads, wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
- Further, in the hybrid integrated circuit device of the present invention, the pads and the leads are fixed to each other with soft solder.
- Still further, in the hybrid integrated circuit device of the present invention, any one of the first and second pads is a dummy pad.
- A method of manufacturing a hybrid integrated circuit of the present invention includes: the steps of: preparing a lead frame which is constituted by units each having a plurality of leads; and fixing a circuit substrate on each unit of the lead frame by fixing pads formed on a surface of the circuit substrate to the leads, wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, the pads are arranged along a side edge of the circuit substrate.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, the pads are arranged along opposite side edges of the circuit substrate.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, any one of the first and second pads is a dummy pad.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, the fixing of the leads and the pads to each other is performed with brazing material.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, the circuit substrate is fixed on the lead frame after forming an electric circuit constituted by a conductive pattern and a circuit element on the surface of the circuit substrate.
- Further, in the method of manufacturing the hybrid integrated circuit of the present invention, an electric circuit formed on the surface of the circuit substrate is sealed after fixing the circuit substrate on the lead frame.
- In the hybrid integrated circuit device of the present invention and the method of manufacturing the same, a space between a first pad located at an end edge and a second pad which is adjacent to the first pad is made narrower than the space between other pads themselves. Therefore, thermal stress, in a course of the manufacturing process and under the state of usage, acting on the first pad which is located at the end edge can be reduced, and thus reliability in connections between pads and leads can be improved.
- Further, in the method of manufacturing the hybrid integrated circuit device of the present invention, after circuit substrates having electric circuits formed on the surfaces thereof are separated, the subsequent steps can be performed under the circumstances that a plurality of circuit substrates are fixed to a lead frame. Therefore, it is possible to perform the steps of sealing with resin and the like, under the physically constricted states of the circuit substrates on the lead frame. With this constitution, time necessitated for handling for physical transportation of the circuit substrates and positioning thereof can be reduced.
-
FIGS. 1A and 1B are a perspective view and a cross-sectional view of a hybrid integrated circuit device according to a preferred embodiment of the present invention, respectively. -
FIGS. 2A to 2C are a plan view, a perspective view, and an enlarged view showing a method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIGS. 3A and 3B are a perspective view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIGS. 4A and 4B are a cross-sectional view and also a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIG. 5 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment. -
FIGS. 6A to 6C are a perspective view, a cross-sectional view, and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIGS. 7A and 7B are a perspective view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIG. 8 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment. -
FIGS. 9A to 9C are a plan view, a plan view and a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment, respectively. -
FIG. 10 is a cross-sectional view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment. -
FIG. 11 is a plan view showing the method of manufacturing the hybrid integrated circuit device of the preferred embodiment. -
FIGS. 12A and 12B are a plan view and a cross-sectional view showing a known method of manufacturing a hybrid integrated circuit device, respectively. -
FIGS. 13A and 13B are a plan view and a cross-sectional view showing the known method of manufacturing the hybrid integrated circuit device, respectively. -
FIG. 14 is a plan view showing the known method of manufacturing the hybrid integrated circuit device. - With reference to
FIGS. 1A and 1B , a configuration of a hybridintegrated circuit device 10 according to a preferred embodiment of the present invention is described.FIG. 1A is a perspective view of the hybridintegrated circuit device 10, andFIG. 1B is a cross-sectional view taken along the X-X′ line ofFIG. 1A . - The hybrid
integrated circuit device 10 of the preferred embodiment includes acircuit substrate 16 on which an electric circuit having aconductive pattern 18 andcircuit elements 14 is formed, and sealingresin 12 which seals this electric circuit and covers at least the surface of thecircuit substrate 16. Each configuration element shown above is hereafter described. - The
circuit substrate 16 is a substrate made of metal such as aluminum or copper. As an example, when a substrate made of aluminum is adopted as thecircuit substrate 16, there are two methods for providing insulation between thecircuit substrate 16 and theconductive pattern 18 formed thereon. One method is to anodize the surface of the aluminum substrate. The other is to form an insulatinglayer 17 on the surface of the aluminum substrate and then to form theconductive patterns 18 on the top surface of the insulatinglayer 17. In order to efficiently dissipate heat generated by thecircuit elements 14 disposed on the surface of thecircuit substrate 16 to the outside, the back side of thecircuit substrate 16 may be exposed from the sealingresin 12 to the outside. Furthermore, in order to improve moisture resistance of the entire device it is also possible to seal the entity as a whole with the sealingresin 12 including the back side surface of thecircuit substrate 16. - Further, the side surfaces of the
circuit substrate 16 have shapes having inclined portions protruding toward the outside. Having provided with the inclined portions on the side surfaces of thecircuit substrate 16 as described above, adhesion strength between the side surface of thecircuit substrate 16 and the sealingresin 12 can be improved. - The
circuit elements 14 are fixed on theconductive patterns 18, and a predetermined electric circuit is constituted by thecircuit elements 14 and theconductive patterns 18. As for thecircuit elements 14, active elements such as transistors and diodes, and passive elements such capacitors and resistors are to be adopted. Moreover, as for power semiconductor elements and the like which generate large amounts of heat, the elements may be fixed to thecircuit substrate 16 with a metal heatsink interposed therebetween. Here, active elements and the like which are mounted with their faces upward are electrically connected to theconductive patterns 18 throughthin metal wires 15. - The
conductive pattern 18 is made of metal such as copper and is formed in insulation with thecircuit substrate 16. In addition,pads 13 are formed as part of theconductive patterns 18 at sides from which leads 111 protrude. In this configuration, a plurality ofpads 13 aligned are provided in the vicinities of two opposite sides of thecircuit substrate 16. Further, theconductive pattern 18 adheres to the surface of thecircuit substrate 16 by using the insulatinglayer 17 as an adhesive. - In this embodiment, a space between a first pad located at an end edge and a second pad adjacent to the first pad is made narrower than the space between two of the other pads. By doing so, stress acting on the joint of a lead 11 and a pad located at the end edge has been reduced. The details of the first pad and the like are described later with reference to
FIG. 9 . - The leads 11 are fixed to the
pads 13 which are provided in the periphery of thecircuit substrate 16, and provide functionality of input/output with the outside, for example. In this embodiment, a plural number ofleads 11 are provided in two opposite edge portions usingsoft solder 21. Adhesion of the leads 111 and thepads 13 is performed using a conductive type adhesive material such as soft solder (brazing material). It is also possible to allow the leads 111 to protrude from only one side edge. Furthermore, it is also possible to allow the leads 111 to protrude from four side edges. - The sealing
resin 12 is formed by transfer molding using thermosetting resin or by injection molding using thermoplastic resin. Here, in this embodiment, the sealingresin 12 is formed so that thecircuit substrate 16 and the electric circuit formed on the surface thereof are sealed, and the whole entity including the back side surface of thecircuit substrate 16 is sealed with the sealingresin 12. Meantime, there are also cases where the back side of thecircuit substrate 16 is exposed to the outside from the sealingresin 12 in order to improve heat dissipation. - With reference to
FIGS. 2A to 2C and the rest of the figures, a method of manufacturing the hybrid integrated circuit device is described. The manufacturing method according to an embodiment of the present invention includes the steps of preparing alead frame 50 constituted byunits 51 having a plurality ofleads 11, and fixingcircuit substrate 16 on eachunit 51 of thelead frame 50 by firmly fixing the leads 111 to thepads 13 which are formed on the surface of thecircuit substrate 16. In this manufacturing method, a space between afirst pad 13A formed at an end edge of thecircuit substrate 16 and asecond pad 13B adjacent to thefirst pad 13A is set narrower than the space between the other pads, thus manufacturing the hybrid integrated circuit device. The details of each step described above will be described hereinafter. - <First Step>: Refer to
FIGS. 2A to 3B - In this step,
conductive patterns 18 are formed on the surface of a largesize metal substrate 19B, and grooves 20 are formed at the boundaries of theconductive patterns 18.FIGS. 2A to 2C are a plan view of themetal substrate 19B, a perspective view indicating a state of forming the grooves in themetal substrate 19B by using a V-cut saw 35, and an enlarged view of ablade edge 35A, respectively. - First by referring to
FIG. 2A themetal substrate 19B of an intended size is prepared. To the surface of thismetal substrate 19B, conductive foil is attached by pressure with an insulating layer interposed therebetween. The plurality ofconductive patterns 18 are formed by patterning this conductive foil in intended shapes. The number ofconductive patterns 18 formed may depend on the size of themetal substrate 19B and that of the hybrid integrated circuit, but conductive patterns which form about several tens to several hundreds of hybrid integrated circuits can be formed on one sheet of themetal substrate 19B. - Next, in both of front and rear surfaces of the
metal substrate 19Bfirst grooves 20A andsecond grooves 20B are formed in a lattice shape. As shown inFIG. 2B , by rotating a V-cut saw 35 at a high speed, thefirst grooves 20A and thesecond grooves 20B are formed in the front and rear surfaces of the metal substrate along dicing lines D2. The dicing lines D2 are arranged in a lattice shape. - With reference to
FIG. 2C , a shape of the V-cut saw 35 is described. The multiple number ofblade edges 35A having a shape as shown inFIG. 2C are disposed on the V-cut saw 35. Here, the shape of theblade edge 35A corresponds to the shape of the grooves formed in themetal substrate 19B. In this case grooves having a V-shape in the cross-section are formed in both sides of the metal substrate. Accordingly, the shape of theblade edge 35A is also V-shaped. Note that diamond is embedded in theblade edge 35A. - Next, with reference to
FIGS. 3A and 3B , a shape of themetal substrate 19B in which the grooves 20 are formed is described.FIG. 3A is a perspective view of themetal substrate 19B in which the grooves 20 are formed by the cut saw 35, andFIG. 3B is a cross-sectional view of themetal substrate 19B. - As shown in
FIG. 3A , in both front and rear surfaces of themetal substrate 19B, thefirst grooves 20A and thesecond grooves 20B are formed in a lattice shape. Here, the two dimensional positions of thefirst grooves 20A and thesecond grooves 20B correspond to each other. In this embodiment, the grooves 20 have a V-shaped cross section, since the grooves are formed with a V-cut saw 35 having the V-shaped blade edges 35A. The center lines of the grooves 20 correspond to the boundaries of each of theconductive patterns 18 which is formed on an insulatinglayer 17. Here, thefirst grooves 20A are formed in the surface on which aresin layer 17 is deposited, and on the other side thesecond grooves 20B are formed. - With reference to
FIG. 3B , the shape and the like of the grooves 20 are described. Here, the grooves 20 are formed roughly in a V-shape cross-section. The depths of the first andsecond grooves metal substrate 19B. Accordingly, theindividual circuit substrates 16 are not separated in this step. In other words, thecircuit substrates 16 are connected to each other with the remaining-thickness portions of themetal substrate 19B which correspond to the portions of the grooves 20. Therefore, until themetal substrate 19B is cut and separated into theindividual circuit substrates 16, themetal substrate 19B can be treated as a sheet. - In this process, the depth and width of the first and
second grooves first grooves 20A, it is possible to widen the effective area on which theconductive patterns 18 can be formed. In addition the same effect can be achieved by forming the depth of thefirst grooves 20A shallower. - The size of the
first grooves 20A and that of thesecond grooves 20B can also be set equal to each other. This makes it possible to prevent warping from occurring in the metal substrate 16B in which the grooves 20 are formed in a lattice shape. - <Second Step>: Refer to
FIGS. 4A to 5 - In this step, the
circuit elements 14 are mounted on theconductive patterns 18, and electrical connections between thecircuit elements 14 and theconductive patterns 18 are performed. - First, as shown in
FIG. 4A , thecircuit elements 14 are mounted on predetermined positions of theconductive patterns 18 using brazing material such as soft solder. As for thecircuit elements 14, active elements such as transistors and diodes, and passive elements such as capacitors and resistors can be adopted. Moreover, as for power semiconductor elements which generate large amounts of heat, the elements may be fixed on thecircuit substrate 16 with a metal heatsink interposed therebetween. With reference toFIG. 4B , active elements and the like which are mounted with their faces upward are electrically connected to the several tens to several hundreds ofconductive patterns 18 formed on onemetal substrate 19B, through thethin metal wires 15 by simultaneous wire-bonding. - Next, as shown in
FIG. 4B , thecircuit elements 14 and theconductive patterns 18 are electronically connected. Here, wire-bonding to the several tens to several hundreds ofconductive patterns 18 formed on onemetal substrate 19B is simultaneously performed. - As shown in
FIG. 5 , each hybrid integrated circuit formed on themetal substrate 19B is described.FIG. 5 is a plan view of a part of the hybridintegrated circuit 17 formed on themetal substrate 19B. As a matter of fact, a larger number of hybridintegrated circuits 17 are formed. InFIG. 5 , dicing lines D3 along which themetal substrate 19B is cut into theindividual circuit substrates 16 are shown as dotted lines. As it can be seen inFIG. 5 , theconductive patterns 18 forming an individual hybrid integrated circuit and the dicing line D3 are located extremely close to each other. This is to say that almost all the surface of themetal substrate 19B is used to form theconductive patterns 18. - In the description above, a plurality of hybrid integrated circuits are formed simultaneously on a surface of substrate 10B having a long and thin shape. When there are some restrictions on a manufacturing apparatus for die bonding and wire bonding, the
metal substrate 19B can also be cut into pieces of an appropriate size in a previous step prior to this step. - <Third Step>Refer to
FIGS. 6A to 7B - In this step, the
individual circuit substrates 16 are separated by cutting the metal substrate 16B at the portions where the grooves 20 are formed. There may be found numerous ways to separate eachcircuit substrate 16, but here, ways to separate by bending and by using a cutter are described. - As shown in
FIGS. 6A to 6C, described is a way to separate theindividual circuit substrates 16 by bending themetal substrate 19B.FIG. 6A is a perspective view of themetal substrate 19B prior to the separation.FIG. 6B is a cross-sectional view taken along the X-X′ line ofFIG. 6A .FIG. 6C is a cross-sectional view taken along the Y-Y′ line ofFIG. 6A . In this way of separation, themetal substrate 19B is partially bended so that the bending occurs at the portions where thefirst grooves 20A and thesecond grooves 20B are formed. The portions where thefirst grooves 20A and thesecond grooves 20B are formed are connected with the remaining-thickness portions where the grooves 20 are not formed, and thus, by bending at these portions, separation can be easily performed at the connecting portions. When themetal substrate 19B is a substrate made of aluminum, bending is performed several times until separation is completed since aluminum is a viscous metal. - As shown in
FIG. 6A , on the surface of themetal substrate 19B a plural number of electric circuits are formed in eachcircuit substrate 16 in a matrix configuration. Formed at boundaries of each electric circuit are the first andsecond grooves metal substrate 19B on which a plurality of hybrid integrated circuits are connected in a matrix configuration is divided in one direction, thus obtaining strip metal substrates, in each of which a plurality ofcircuit substrates 16 are connected in one direction. Thereafter, each strip metal substrate is divided in other direction, thus obtaining theindividual circuit substrates 16. Here in this case, by performing all the divisions along the cutting lines D3, three strip metal substrates are separated. In the actual process, a larger number ofcircuit substrates 16 are formed. The bending of themetal substrate 19B is performed by fixedly supporting it in the direction of a fixing direction F1 shown inFIG. 6A . - With reference to
FIG. 6B , the cross-sectional view taken along the line X-X′ is described under the state that the separation is performed along the cutting line D3. In this separation step, the bending is performed at the boundary between the leftmost positionedcircuit substrates 16 and thecircuit substrates 16 adjacent to it. This bending is performed continuously in the bending direction BI shown inFIG. 6A . Since aluminum which is a material used for themetal substrate 19B is a viscous material, separation is completed by performing bending several times. - As shown in
FIG. 6C , the bending of themetal substrate 19B is performed after the side portions of themetal substrate 19B are firmly supported with fixing portions 36. In this step, the side surfaces of thecircuit substrates 16 are slanted in a convex shape toward the outside. Thus, themetal substrate 19B can be supported by pressing the convex shaped side surfaces in the lateral direction at the fixing portions 36. Therefore, the fixing portions 36 will not come into contact with the surface of themetal substrate 19B, and the conductive patterns and thecircuit elements 14 can be formed on all the area of the surface of themetal substrate 19B. - With reference to
FIGS. 7A and 7B , a way to cut themetal substrate 19B by using around cutter 41 is described. As shown inFIG. 7A , themetal substrate 19B is pressed to cut along thefirst grooves 20A by using theround cutter 41. Thus, themetal substrate 19B is separated into theindividual circuit substrates 16. The remaining-thickness portions of themetal substrate 19B in which the grooves 20 are not formed and which are center lines of the grooves 20, are pressed to cut by theround cutter 41. - With reference to
FIG. 7B , details of theround cutter 41 is described. Theround cutter 41 has a round disk shape and the circumference thereof is formed in an acute angle. The center portion of theround cutter 41 is supported by asupport member 42 such that the round cutter can rotate freely. Theround cutter 41 does not have any driving force. In other words, theround cutter 41 rotates by moving it along the dicing line D3 with a portion of theround cutter 41 pressed to themetal substrate 19B. - Moreover, besides the ways described hereinbefore, it is also possible to consider a way to separate individual circuit substrates using a laser by removing the remaining-thickness portions of the substrate at the positions where the first and
second grooves circuit substrate 16 by punching. - <Fourth Step>: Refer to FIGS. 8 to 9C
- In this step, the
circuit substrate 16, which has been separated in the previous step, is fixed on thelead frame 50. - First, with reference to a plan view in
FIG. 8 , a configuration of thelead frame 50 is described. Thelead frame 50 presents a shape of a strip in its contour and is obtained by processing a metal sheet of about 1 mm to 0.5 mm thickness. The processing of this metal sheet can be performed either by etching or by stamping. - In the
lead frame 50, a plural number ofunits 51 are arranged at predetermined intervals. Here, theunit 51 can be defined as a group ofleads 11 to be connected to thecircuit substrate 16. Therefore, in a condition that the leads are to be connected to two opposite edge portions of thecircuit substrate 16, a plurality of leads 111 are formed extending toward the center portion from the opposite edge portions of theunit 51. In the case that the leads 111 are fixed at only one side of the circuit substrate, eachunit 51 constituted byleads 11 which extend from one side toward the inside. - The leads 111 of each
unit 51 are connected to each other at a first connectingportion 53 and a second connectingportion 54 and the position is fixedly maintained. Further, end portions of the leads 111 extend to an area A1 where thecircuit substrate 16 is planed to be allocated. - There is provided a
slit 56 between eachunit 51 acting as an absorber of heat stress in a heating process. Theslit 56 is formed almost as long as the width of theunit 51 or even longer than that, and it possesses a shape such as a continuous opening. - Guide holes 52 are holes provided in longitudinal edge portions of the
lead frame 50, and are used in positioning of thelead frame 50 in each step. Therefore, the fixing of the position of thelead frame 50 using the guide holes 52 can also indirectly facilitate positioning of thecircuit substrate 16 which is to be fixed on theunit 51. - With reference to
FIGS. 9A to 9C, the step of fixing thecircuit substrate 16 on eachunit 51 of thelead frame 50 is described in detail.FIG. 9A is a plan view showing a state of the hybrid integrated circuit device formed on the surface of thecircuit substrate 16.FIG. 9B is a plan view showing a state of thecircuit substrate 16 fixed on theleads 11 of theunit 51.FIG. 9C is a cross-sectional view taken along the X-X′ line inFIG. 9B . - With reference to
FIG. 9A , a configuration ofpads 13 formed on the surface of thecircuit substrate 16 is described. On the surface of thecircuit substrate 16, theconductive pattern 18 is formed which is patterned to form an intended electric circuit. Thereafter, by electrically connecting thecircuit elements 14 to intended portions in theconductive pattern 18, a predetermined hybrid integrated circuit is formed. Further, thepads 13 which are constituted by portions of theconductive patterns 18 are formed in the vicinities of edge portions of thecircuit substrate 16. Here, thepads 13 are formed which are aligned in the vicinities of longitudinal edge portions of thecircuit substrate 16 which is formed in a narrow shape. - Furthermore, since a space between
adjacent pads 13 can be as narrow as about 1.5 mm, it is possible to form a plural number ofpads 13 along the longitudinal direction of thecircuit substrate 16. On the other hand, depending on the kind of an electrical circuit formed on the surface of thecircuit substrate 16, the number of necessary input/output terminals varies. In this embodiment, if the number of the necessary input/output terminals is smaller than that of thepads 13, vacant positions are provided in the arrangement of thepads 13 as shown inFIG. 9A . In other words, basically the space betweenpads 13 is kept constant, and spaces betweenpads 13 are made wider locally. The space between thepads 13 located apart from each other as described above is represented by D2. - At the corners of the
circuit substrate 16, there are providedfirst pads 13A which are thepads 13 located at the end edge portion.Second pads 13B are adjacent to thefirst pads 13A. In this embodiment, the space D1 between thefirst pad 13A and thesecond pad 13B is set almost as the same as or smaller than of the space D2 betweenother pads 13. Due to this arrangement, reliability in connection between thefirst pad 13A and thelead 11 can be improved. The details thereof are described later. - In a condition that the
pad 13 is not necessitated as a connection terminal in the proximity of thefirst pad 13A, it may be allowed to place adummy pad 13D. The situation is the same for the case in which there is not apad 13 which can be a connection terminal in the proximity of thesecond pad 13B. Here, thedummy pad 13D means apad 13 which is not a constituent of the electric circuit. Accordingly, thedummy pad 13D and thelead 11 are connected only mechanically. By placing adummy pad 13D in the proximity of thefirst pad 13A or thesecond pad 13B, it is possible to make a space betweenpads 13 smaller. Thus, a thermal stress which is generated at a connection portion between thepad 13 and thelead 11 can be reduced. - As shown in
FIGS. 9B and 9C , thepads 13 and theleads 11 are connected each other with conductive adhesive such as brazing material and thecircuit substrate 16 is fixed on thelead frame 50. The number count and physical locations of theleads 11 for eachunit 51 correspond to thepads 13 which are formed on the surface of thecircuit substrate 16. - As described above, the merits for a smaller space allocation between the
first pad 13A and thesecond pad 13B is described. In this embodiment, thecircuit substrate 16 is made of metal mostly aluminum, and thelead frame 50 is made of metal mostly copper. Since copper and aluminum have different thermal expansion coefficients, thermal stress is generated at the joint between thelead frame 50 and thecircuit substrate 16 under the condition that heat is applied while both of them are mechanically connected. In this embodiment, the thermal stress is exerted at the joint portion of thelead 11 and thecircuit substrate 16. The magnitude of the thermal stress becomes greater as the space between thepads 13 increases. The thermal stress acts stronger for thepads 13 located in the periphery than for thepads 13 around the center portion of thecircuit substrate 16. Therefore, in a condition that the space between thefirst pad 13A located at the outmost periphery and the adjacentsecond pad 13B becomes greater, a large amount of thermal stress will act on the joint of thefirst pad 13A and thelead 11. - Because of the reason described above, in this embodiment, the space between the
first pad 13A and thesecond pad 13B is set smaller than spaces betweenother pads 13. As shown inFIG. 9A , the length of the distance D1 is set equal to or smaller than that of the distance D2. By doing so, it is possible to prevent that an excess stress will act on the joint of thefirst pad 13A and thelead 11. - <Fifth Step>: Refer to
FIGS. 10 and 11 - With reference to
FIG. 10 , for the step of sealing thecircuit substrate 16 with the sealingresin 12 is described.FIG. 10 is a cross-sectional view showing for the step of sealing thecircuit substrate 16 with the sealingresin 12 by using amolding die 50. - First, the
circuit substrate 16 is placed on a lower molding die 60B. Next, thecircuit substrate 16 is contained in a cavity formed by contacting an upper molding die 60A and a lower molding die 60B. Next, the sealingresin 12 is injected to the cavity through agate 57. As to ways to perform sealing, the transfer molding using thermosetting resin or injection molding using thermoplastic resin can be adopted. The amount of gas inside the cavity which corresponds to the amount of the sealingresin 12 to be injected from thegate 57 is exhausted to the outside through anair vent 54. Note that the location of the gate and the air vent inFIG. 10 is an example and can be set arbitrarily depending on the shape and structure of the product. - In this embodiment, a plurality of
circuit substrates 16 which are fixed to the lead frame can be sealed simultaneously. Thus, it is possible to simplify the step of sealing with resin. Further, as it has been described before, pads which locate at the end edges of thecircuit substrate 16 are not isolated. Thus, in the step of resin sealing accompanying heating, thermal stresses that act on the pads located at the end edges can be reduced. - As has been described above, slanted portions are provided at the side surfaces of the
circuit substrate 16. Therefore, by sealing with insulating resin, the sealingresin 12 flows, wrapping around the slanted portions. Because of this, an anchor effect is created between the sealingresin 12 and the slanted portions, and the bonding between the sealingresin 12 and thecircuit substrate 16 is enhanced. - A plan view in
FIG. 111 shows a state of thelead frame 50 after sealing with the sealingresin 12. The circuit substrates 16 which are fixed on therespective units 51 have been sealed with the sealingresin 12. Thecircuit substrate 16 sealed with the resin in this step is completed as a product after passing through a lead cut step, a testing step, and the like. Furthermore, the separation of each sealedcircuit substrate 16 is performed after cutting the leads 11.
Claims (10)
1. A hybrid integrated circuit device comprising:
a circuit substrate;
a plurality of pads arranged along a side surface of the circuit substrate; and
leads fixed to the pads,
wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
2. The hybrid integrated circuit device according to claim 1 , wherein the pads and the leads are fixed to each other with soft solder.
3. The hybrid integrated circuit device according to claim 1 , wherein any one of the first and second pads is a dummy pad.
4. A method of manufacturing a hybrid integrated circuit device comprising:
preparing a lead frame which is constituted by units each having a plurality of leads; and
fixing a circuit substrate on each unit of the lead frame by fixing pads formed on a surface of the circuit substrate to the leads,
wherein a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the other pads themselves.
5. The method according to claim 4 , wherein the pads are arranged along a side edge of the circuit substrate.
6. The method according to claim 4 , wherein the pads are arranged along opposite side edges of the circuit substrate.
7. The method according to claim 4 , wherein any one of the first and second pads is a dummy pad.
8. The method according to claim 4 , wherein the fixing of the leads and the pads to each other is performed with brazing material.
9. The method according to claim 4 , wherein the circuit substrate is fixed on the lead frame after forming an electric circuit constituted by a conductive pattern and a circuit element on the surface of the circuit substrate.
10. The method according to claim 4 , wherein an electric circuit formed on the surface of the circuit substrate is sealed after fixing the circuit substrate on the lead frame.
Priority Applications (1)
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US12/182,519 US8338234B2 (en) | 2004-03-29 | 2008-07-30 | Hybrid integrated circuit device and manufacturing method thereof |
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JP2004-094685 | 2004-03-29 | ||
JP2004094685A JP4413054B2 (en) | 2004-03-29 | 2004-03-29 | Method for manufacturing hybrid integrated circuit device |
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US12/182,519 Division US8338234B2 (en) | 2004-03-29 | 2008-07-30 | Hybrid integrated circuit device and manufacturing method thereof |
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US12/182,519 Active 2026-02-27 US8338234B2 (en) | 2004-03-29 | 2008-07-30 | Hybrid integrated circuit device and manufacturing method thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151562A1 (en) * | 2005-11-02 | 2008-06-26 | Hwa Su | Fabrication structure for light emitting diode component |
WO2009087035A1 (en) | 2008-01-10 | 2009-07-16 | Robert Bosch Gmbh | Electronic component and method for producing such an electronic component |
US20120075816A1 (en) * | 2010-09-24 | 2012-03-29 | On Semiconductor Trading, Ltd. | Circuit device and method of manufacturing the same |
US20140118981A1 (en) * | 2011-06-09 | 2014-05-01 | Otto Bock Healthcare Products Gmbh | Method for producing circuit boards and complete circuit board panels |
US20150319852A1 (en) * | 2014-05-02 | 2015-11-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, printed circuit board strip and manufacturing method thereof |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5035356B2 (en) * | 2010-01-26 | 2012-09-26 | 株式会社デンソー | Resin-sealed electronic device and method for manufacturing the same |
KR102245134B1 (en) * | 2014-04-18 | 2021-04-28 | 삼성전자 주식회사 | Semiconductor package comprising the semiconductor chip |
US10090259B2 (en) * | 2015-12-26 | 2018-10-02 | Intel Corporation | Non-rectangular electronic device components |
CN108321151A (en) * | 2018-01-24 | 2018-07-24 | 矽力杰半导体技术(杭州)有限公司 | Chip encapsulation assembly and its manufacturing method |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4501154A (en) * | 1982-04-16 | 1985-02-26 | Daido Metal Company Ltd. | Method for measuring an adhesive strength of a multi-layer material |
US5825081A (en) * | 1995-11-06 | 1998-10-20 | Kabushiki Kaisha Toshiba | Tape carrier and assembly structure thereof |
US6462427B2 (en) * | 2000-12-22 | 2002-10-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip, set of semiconductor chips and multichip module |
US20020163068A1 (en) * | 1999-12-24 | 2002-11-07 | Junichi Asada | Semiconductor device |
US20030001255A1 (en) * | 2001-06-28 | 2003-01-02 | Junichi Iimura | Hybrid integrated circuit device and manufacturing method thereof |
US6593169B2 (en) * | 2001-06-28 | 2003-07-15 | Sanyo Electric Co., Ltd. | Method of making hybrid integrated circuit device |
US6713850B1 (en) * | 2000-11-10 | 2004-03-30 | Siliconware Precision Industries Co., Ltd. | Tape carrier package structure with dummy pads and dummy leads for package reinforcement |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2698278B2 (en) | 1992-01-31 | 1998-01-19 | 三洋電機株式会社 | Hybrid integrated circuit device |
KR0177744B1 (en) * | 1995-08-14 | 1999-03-20 | 김광호 | Semiconductor device having enhanced electrical quality |
JP3779789B2 (en) * | 1997-01-31 | 2006-05-31 | 株式会社ルネサステクノロジ | Semiconductor device and manufacturing method thereof |
KR19980078348A (en) * | 1997-04-28 | 1998-11-16 | 이대원 | Semiconductor Package of Multi-Plated Plating Layer and Manufacturing Method Thereof |
US6224392B1 (en) * | 1998-12-04 | 2001-05-01 | International Business Machines Corporation | Compliant high-density land grid array (LGA) connector and method of manufacture |
KR100646474B1 (en) * | 2000-03-25 | 2006-11-14 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package and its manufacturing method |
TW585015B (en) | 2001-06-28 | 2004-04-21 | Sanyo Electric Co | Hybrid integrated circuit device and method for manufacturing same |
JP4007798B2 (en) * | 2001-11-15 | 2007-11-14 | 三洋電機株式会社 | Method for manufacturing plate-like body and method for manufacturing circuit device using the same |
-
2004
- 2004-03-29 JP JP2004094685A patent/JP4413054B2/en not_active Expired - Fee Related
-
2005
- 2005-02-14 TW TW094104162A patent/TWI288584B/en not_active IP Right Cessation
- 2005-03-22 CN CNA2005100548981A patent/CN1677667A/en active Pending
- 2005-03-22 KR KR1020050023541A patent/KR100705516B1/en not_active IP Right Cessation
- 2005-03-29 US US10/907,338 patent/US20050212113A1/en not_active Abandoned
-
2008
- 2008-07-30 US US12/182,519 patent/US8338234B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4501154A (en) * | 1982-04-16 | 1985-02-26 | Daido Metal Company Ltd. | Method for measuring an adhesive strength of a multi-layer material |
US5825081A (en) * | 1995-11-06 | 1998-10-20 | Kabushiki Kaisha Toshiba | Tape carrier and assembly structure thereof |
US20020163068A1 (en) * | 1999-12-24 | 2002-11-07 | Junichi Asada | Semiconductor device |
US6713850B1 (en) * | 2000-11-10 | 2004-03-30 | Siliconware Precision Industries Co., Ltd. | Tape carrier package structure with dummy pads and dummy leads for package reinforcement |
US6462427B2 (en) * | 2000-12-22 | 2002-10-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip, set of semiconductor chips and multichip module |
US20030001255A1 (en) * | 2001-06-28 | 2003-01-02 | Junichi Iimura | Hybrid integrated circuit device and manufacturing method thereof |
US6593169B2 (en) * | 2001-06-28 | 2003-07-15 | Sanyo Electric Co., Ltd. | Method of making hybrid integrated circuit device |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080151562A1 (en) * | 2005-11-02 | 2008-06-26 | Hwa Su | Fabrication structure for light emitting diode component |
WO2009087035A1 (en) | 2008-01-10 | 2009-07-16 | Robert Bosch Gmbh | Electronic component and method for producing such an electronic component |
US20120075816A1 (en) * | 2010-09-24 | 2012-03-29 | On Semiconductor Trading, Ltd. | Circuit device and method of manufacturing the same |
US9275930B2 (en) * | 2010-09-24 | 2016-03-01 | Semiconductor Components Industries, Llc | Circuit device and method of manufacturing the same |
US20160248344A1 (en) * | 2010-09-24 | 2016-08-25 | Semiconductor Components Industries, Llc | Hybrid circuit device |
US9722509B2 (en) * | 2010-09-24 | 2017-08-01 | Semiconductor Components Industries, Llc | Hybrid circuit device |
US9793826B2 (en) | 2010-09-24 | 2017-10-17 | Semiconductor Components Industries, Llc | Method of manufacturing a circuit device |
US20180006578A1 (en) * | 2010-09-24 | 2018-01-04 | Semiconductor Components Industries, Llc | Method of manufacturing a circuit device |
US9998032B2 (en) * | 2010-09-24 | 2018-06-12 | Semiconductor Components Industries, Llc | Method of manufacturing a circuit device |
US20140118981A1 (en) * | 2011-06-09 | 2014-05-01 | Otto Bock Healthcare Products Gmbh | Method for producing circuit boards and complete circuit board panels |
US9386710B2 (en) * | 2011-06-09 | 2016-07-05 | Otto Bock Healthcare Products Gmbh | Method for producing circuit boards and complete circuit board panels |
US20150319852A1 (en) * | 2014-05-02 | 2015-11-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board, printed circuit board strip and manufacturing method thereof |
Also Published As
Publication number | Publication date |
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KR20060044533A (en) | 2006-05-16 |
JP4413054B2 (en) | 2010-02-10 |
US20090011548A1 (en) | 2009-01-08 |
JP2005285909A (en) | 2005-10-13 |
KR100705516B1 (en) | 2007-04-10 |
CN1677667A (en) | 2005-10-05 |
US8338234B2 (en) | 2012-12-25 |
TW200534753A (en) | 2005-10-16 |
TWI288584B (en) | 2007-10-11 |
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