US20050172430A1 - Wafer edge cleaning - Google Patents
Wafer edge cleaning Download PDFInfo
- Publication number
- US20050172430A1 US20050172430A1 US10/976,011 US97601104A US2005172430A1 US 20050172430 A1 US20050172430 A1 US 20050172430A1 US 97601104 A US97601104 A US 97601104A US 2005172430 A1 US2005172430 A1 US 2005172430A1
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- edge
- wafer
- roller
- cleaning
- plane
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- 238000004140 cleaning Methods 0.000 title claims abstract description 186
- 238000000034 method Methods 0.000 claims description 11
- 239000002783 friction material Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 6
- 239000003082 abrasive agent Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 190
- 239000000463 material Substances 0.000 description 9
- 239000002002 slurry Substances 0.000 description 8
- 239000011118 polyvinyl acetate Substances 0.000 description 6
- 229920002689 polyvinyl acetate Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000005201 scrubbing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Definitions
- the present invention relates generally to cleaning thin disks, such as semiconductor wafers, compact disks, glass substrates and the like. More particularly, the invention relates to scrubbing devices for simultaneously scrubbing the entire surface of a thin disk, including the edges thereof.
- a thin disk such as a semiconductor wafer
- an elongated billet of semiconductor material is cut into very thin slices or disks, about 1 ⁇ 2 mm in thickness.
- the slices or wafers of semiconductor material are then lapped and polished by a process that applies an abrasive slurry to the wafer's surfaces.
- slurry residue conventionally is cleaned or scrubbed from wafer surfaces via a mechanical scrubbing device, such as a device which employs polyvinyl acetate (PVA) brushes, brushes made from other porous or sponge-like material, or brushes having bristles made from nylon or similar materials.
- PVA polyvinyl acetate
- a conventional PVA brush scrubber is shown in the side elevational view of FIG. 1 .
- the conventional scrubber 11 shown in FIG. 1 , comprises a pair of PVA brushes 13 a , 13 b , a platform 15 for supporting a wafer W, and a mechanism (not shown) for rotating the pair of PVA brushes 13 a , 13 b .
- the platform 15 comprises a plurality of rollers 17 a - c for both supporting and rotating the wafer W.
- the pair of PVA brushes 13 a , 13 b are positioned to extend beyond the edge of the wafer W, so as to facilitate cleaning the wafer's edge.
- slurry induced defects still occur, and are caused by slurry residue remaining along the edges of the wafer despite cleaning with apparatuses such as that described above.
- subsequent processing has been found to redistribute slurry residue from the wafer edges to the front of the wafer, causing defects.
- the edge-cleaning scrubber 19 shown in FIG. 2 , includes a pair of rollers 17 b , 17 c adapted to support and rotate the wafer W, and further includes an edge-cleaning roller 21 that fits over the edge of the wafer W for cleaning the edge as the wafer rotates.
- the edge-cleaning roller 21 addresses the need to clean slurry residue from wafer edges, it can be subject to quick wear, such wear typically being concentrated at locations where it contacts the wafer W.
- FIGS. 3A-3C illustrate details related to how the edge-cleaning roller 21 of the edge-cleaning scrubber 19 of FIG. 2 cleans the edge of the wafer W.
- FIG. 3A which shows the wafer W above the edge-cleaning roller 21
- the edge-cleaning roller 21 of FIG. 2 is shown in contact with the wafer W.
- opposing first and second inclined surfaces 23 , 25 of the edge-cleaning roller 21 are in contact with respective opposite first and second edge corners 27 , 29 of the edge of the wafer W.
- first and second edge corners 27 , 29 may comprise a bevel so as to form, e.g., a truncated frustoconical edge surface (not separately shown) which may be placed in surface-to-surface contact with the first and second inclined surfaces 23 , 25 of the edge cleaning roller 21 .
- nominal rotation plane is meant that plane within which the wafer W is expected to rotate based on the specific arrangement of rollers (e.g., the rollers 17 b , 17 c ) used to support, drive and guide the wafer W within the edge-cleaning scrubber 19 of FIG. 2 .
- contact between inclined surfaces 23 , 25 of the edge-cleaning roller 21 and the first and second edge corners 27 , 29 of the wafer W takes place along respective first and second contact areas 33 , 35 on the inclined surfaces 23 , 25 .
- the first contact area 33 on the first inclined surface 23 translates to a ring-shaped wear sector 37 on the first inclined surface 23 , typically relatively narrow, which performs the edge-cleaning function and is subject to friction-induced wear over time.
- the remaining portions of the first inclined surface 23 may not typically contact the wafer W during edge cleaning, and therefore may not be subject to such friction-induced wear.
- rollers that may rotate in a common plane with a wafer W while contacting a portion of the wafer edge, but that perform additional or separate functions such as rotating the wafer W (e.g., drive rollers, such as the spinning mechanism 17 a - c of FIG. 1 ) or guiding the rotating wafer W so as to limit or prevent tilting of the same (e.g., idling guide rollers (not separately shown)), are typically also subject to rapid wear where contact is made with the wafer W. The cost of maintaining proper operation of such parts and/or conducting frequent replacement of the same can mount quickly.
- the field of wafer cleaning requires methods and apparatus for effectively performing one or more of the functions of cleaning, supporting, driving and guiding both the flat surfaces and the edge surfaces of a semiconductor wafer, preferably so as to reduce the cost and/or frequency of replacement due to frictional wear from wafer contact.
- the present invention addresses the need for a more effective edge cleaner by providing a number of different roller embodiments that are adapted for wafer edge cleaning. Specifically:
- an apparatus for cleaning a thin disk includes (1) a plurality of support rollers adapted to support an edge of the thin disk as the thin disk rotates within a first plane; and (2) an edge-cleaning roller adapted to rotate within a second plane oriented at a first non-zero angle to the first plane, so as to contact an edge bevel of the thin disk while so rotating.
- a support roller for supporting a vertically rotating wafer.
- the support roller includes (1) a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and (2) an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst.
- a side-contact roller for contacting one or more major surfaces of a rotating wafer.
- the side-contacting roller includes (1) a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and (2) an edge-trap portion for retaining the edge of the wafer and having a planar surface comprising a high-friction material and adapted, when in communication with a major surface of the wafer, to resist sliding thereagainst.
- FIG. 1 is a side elevational view of a conventional PVA brush scrubber.
- FIG. 2 is a side elevational view of a conventional scrubber comprising a conventional edge-cleaning roller for improving wafer edge cleaning.
- FIG. 3A is a side elevational view of the edge-cleaning roller of FIG. 2 , shown cleaning the edge corners of the wafer W.
- FIG. 3B is another side elevational view of the edge-cleaning roller of FIG. 2 , shown contacting the wafer W along contact areas on respective inclined surfaces of the edge-cleaning roller.
- FIG. 3C is a cross-sectional view, corresponding to view 3 C- 3 C of FIG. 2 , of the edge-cleaning roller of FIG. 2 showing a relatively narrow wear sector on an inclined surface of the edge-cleaning roller where contact is made with an edge corner of the wafer W.
- FIG. 4 is a side elevational view of an inventive edge-cleaning roller, shown contacting edge corners of the wafer W and in an inventive angled orientation to a plane of rotation of the wafer W.
- FIG. 5A is a view, corresponding to view 5 A- 5 A of FIG. 4 , of a major surface of the wafer W showing separate radial locations at which the inventive edge-cleaning roller of FIG. 4 contacts respective edge corners of the wafer W.
- FIG. 5B is a cross-sectional view, corresponding to view 5 B- 5 B of FIG. 4 , of the inventive edge-cleaning roller of FIG. 4 showing a relatively wide wear sector on an inclined surface of the edge-cleaning roller where contact is made with an edge corner of the wafer W.
- FIG. 6A is a side elevational view of an inventive edge-cleaning support roller, shown in contact with a cylindrical edge surface of the wafer W.
- FIG. 6B is an exploded assembly perspective view of an edge-cleaning support roller that is a particular embodiment of the inventive edge-cleaning support roller of FIG. 6A .
- FIG. 7A is a side elevational view of an inventive edge-cleaning side-contact roller, shown engaging the edge of the wafer W.
- FIG. 7B is a cross-sectional view of an edge-cleaning side-contact roller that is a particular embodiment of the inventive edge-cleaning side-contact roller of FIG. 7A .
- FIG. 8 is a side elevational view of an inventive edge-cleaning roller, shown contacting edge corners of the wafer W and in another inventive angled orientation to a plane of rotation of the wafer W.
- FIG. 9 is a side elevational view of two inventive edge-cleaning rollers of FIG. 8 , shown contacting edge corners of the wafer W and in opposite inventive angled orientations to a plane of rotation of the wafer W.
- FIG. 4 is an side elevational view of an inventive edge-cleaning roller 101 in which the wafer W is shown in phantom across the edge-cleaning roller 101 , the edge-cleaning roller 101 being adapted to contact edge surfaces (e.g., edge bevels as described above with reference to FIG. 3A ) of the wafer W for cleaning.
- edge surfaces e.g., edge bevels as described above with reference to FIG. 3A
- the edge-cleaning roller 101 may be inventively oriented relative to the wafer W so as to form a first angle 103 , the first angle 103 being that angle which is described between the nominal rotation plane 31 of the wafer W and a rotation plane 105 within which the edge-cleaning roller 101 is disposed and is adapted to rotate.
- the rotation plane 105 of the edge-cleaning roller 101 may be oriented relative to the nominal rotation plane 31 of the wafer W such that, in forming the first angle 103 , the rotation planes intersect along a line (not separately shown) generally extending radially outward from the center of rotation of the wafer W.
- a relative orientation between the rotation planes whereby the planes intersect along a line generally extending tangentially to the wafer W as is illustrated in FIGS. 8 and 9 and as will be described later.
- the edge-cleaning roller 101 may comprise opposing first and second inclined surfaces 107 , 109 which contact the respective opposite first and second edge corners 27 , 29 ( FIG. 3A ) of the edge of the wafer W.
- the inventive angled orientation of the edge-cleaning roller 101 relative to the wafer W shown in FIG. 4 may result in divergent radial contact locations along the perimeter of the wafer W.
- contact between the first inclined surface 107 ( FIG. 4 ) of the edge-cleaning roller 101 and the first edge corner 27 of the wafer W may occur at a first radial location 111 along the perimeter of the wafer W
- contact between the second inclined surface 109 ( FIG. 4 ) of the edge-cleaning roller 101 and the second edge corner 29 of the wafer W may occur at a second radial location 113 along the perimeter of the wafer W
- a second angle 115 separates the first radial location 111 and the second radial location 113 .
- the inventive angled orientation of the edge-cleaning roller 101 relative to the wafer W may result in a longer useful life for the edge-cleaning roller 101 .
- the inventive angled orientation of FIG. 4 may increase wear sector width, thus distributing the edge-cleaning function over larger contact areas (see 121 , FIG. 5B ) on the inclined surfaces of the edge-cleaning roller 101 .
- the inventive angled orientation of FIG. 4 therefore may increase the wafer's edge cleaning duty cycle and may extend the useful life of the roller 101 .
- FIG. 5B which is a cross-sectional view of the edge-cleaning roller 101 taken along a section 5 B- 5 B of FIG. 4 , illustrates the above-described feature.
- contact between the first inclined surface 107 of the edge-cleaning roller 101 and the edge of the wafer W (shown in phantom) at the first edge corner 27 ( FIG. 3A ) of the wafer W takes place along a first contact area 117 on the first inclined surface 107 , and a ring-shaped wear sector 119 on the second inclined surface 109 may be produced thereby (e.g., by virtue of the rotation of the edge-cleaning roller 101 ) having a characteristic width 121 .
- the first contact area 117 tends to extend not only laterally across the slope of the first inclined surface 107 , e.g., similarly to the first contact area 33 of FIG. 3C , but also up the slope of the first inclined surface 107 , e.g., in contrast to the first contact area 33 of FIG. 3C .
- the width 121 of the ring-shaped wear sector 119 on the first inclined surface 109 of the edge-cleaning roller 101 may be proportionately greater than a corresponding dimension (not separately shown) of the wear sector 37 on the first inclined surface 23 of the edge-cleaning roller 21 of FIGS. 3A-3C . Given a greater wear sector width, it follows that the area of the first inclined surface 107 subjected to friction-induced wear during wafer edge cleaning (i.e., the wear sector area) will be proportionately greater.
- edge cleaning may be more efficient, thus allowing, e.g., the length of time that the first inclined surface 107 is applied to the first edge corner 27 of the wafer W to be decreased, or the contact pressure between the same to be reduced, while still producing the required degree of wafer edge cleanliness.
- edge-cleaning contact between the edge-cleaning roller 101 and the wafer W may be divided between radially spaced-apart locations on the edge of the wafer W, e.g., as shown in FIG. 5A .
- a third angle 123 (see FIG. 4 ) described between the first inclined surface 107 and the second inclined surface 109 may be provided that is wider than is typical for edge-cleaning rollers, e.g., so as to more readily facilitate rotation of the rotation plane 105 of the edge-cleaning roller 101 relative to the nominal rotation plane 31 of the wafer W.
- the respective effective angles of contact (not shown) between the first inclined surface 107 and the second inclined surface 109 relative to the nominal rotation plane 31 of the wafer may be controlled so as to be equivalent to those of typical edge-cleaning rollers.
- the same angles of contact may be reduced below that which is typical, in effect narrowing the angular gap between the inclined surfaces 107 , 109 of the edge-cleaning roller 101 and the major surfaces of the wafer W.
- angles may be specified for the third angle 123 .
- the edge-cleaning roller 101 may further include a normal surface 125 ( FIG. 4 ), e.g., cylindrical in shape, and occupying a space between the inclined surfaces of the edge-cleaning roller 101 .
- a normal surface 125 FIG. 4
- Such a space may be introduced so as to facilitate the rotation of the edge-cleaning roller 101 relative to the nominal rotation plane 31 of the wafer W.
- many different widths may be specified for such a space, including widths of up to 10 mm or more, applicants observe that a dimension of 2 mm, ⁇ 1 mm produces a good result.
- the normal surface 125 in that space may or may not be disposed directly adjacent to the inclined surfaces.
- the normal surface 125 may comprise a bottom surface of a channel disposed in a space between the inclined surfaces (see, e.g., FIG. 4 ).
- the normal surface 125 is spaced apart from a cylindrical edge surface 39 ( FIG. 3A ) of the wafer W while the first inclined surface 107 and the second inclined surface 109 of the edge-cleaning roller 101 clean the edge corners 27 , 29 of the wafer W. In other modes of use of the edge-cleaning roller 101 , the normal surface 125 may be caused to contact and/or support and/or clean the cylindrical edge surface 39 of the wafer W.
- first angle 103 described between the rotation plane 105 , within which the edge-cleaning roller 101 is disposed, and the nominal rotation plane 31 ( FIG. 3B ) of the wafer W ranges from 10-30 degrees.
- the first angle 103 may be set at 15 degrees, which applicants observe produces a good result.
- Values of (1) a width of the space between the first inclined surface 107 and the second inclined surface 109 , (2) the third angle 123 , and (3) the first angle 103 may be established/selected via an iterative, coordinated design process, so as to produce the desired interaction between the edge-cleaning roller 101 and the wafer W. Alternatively, selection of such values may be performed automatically based on the desired result. Respective values of 3 mm, 50 degrees, and 20 degrees for those three values provide a good result.
- a slight torque may be introduced, e.g., to increase a frictional cleaning pressure between the inclined surfaces 107 , 109 of the edge-cleaning roller 101 and the edge corners 27 , 29 ( FIG. 3A ) of the wafer W.
- a torque serves to increase an area of the edge of the wafer W to be cleaned by the edge-cleaning roller 101 , without undue risk of the wafer's edge being pinched between the inclined surfaces of the edge-cleaning roller 101 and thus without wafer rotation tending to be inhibited thereby.
- the wafer W may be inserted between the first inclined surface 107 and the second inclined surface 109 of the edge-cleaning roller 101 , placed in contact with same, e.g., according to the pattern of FIG. 5A , and rotated in the nominal rotation plane 31 ( FIG. 3B ).
- the wafer may be inserted between the first inclined surface 107 and the second inclined surface 109 of the edge-cleaning roller 101 with the rotation plane 105 of the edge-cleaning roller 101 preliminarily in a coplanar relationship with the nominal rotation plane 31 of the wafer W, and the edge-cleaning roller 101 may thereafter be rotated to achieve the desired first angle 103 .
- the first angle 103 may be established prior to the wafer W being introduced to the edge-cleaning roller 101 .
- the edge-cleaning roller 101 may be utilized in a mode in which contact with the wafer W is restricted to the first inclined surface 107 and the second inclined surface 109 .
- the cylindrical edge surface 39 of the wafer W may also be made to contact a normal surface 125 ( FIG. 4 ) of the edge-cleaning roller 101 at one or more times, e.g., either before or during wafer edge cleaning, or before or during rotation of the edge-cleaning roller 101 .
- the surfaces of the edge-cleaning roller 101 involved may be adapted so as to further improve cleaning through greater friction.
- such surfaces may comprise polyurethane, or some other suitable frictional material.
- edge surfaces of the wafer W and frictional surfaces of the edge-cleaning roller 101 may be caused to rotate at different velocities so as to enhance sliding contact.
- the speed of rotation of the edge-cleaning roller 101 may be controlled via a separate motor, e.g., so as to cause the normal surface 125 to rotate at a different velocity than the cylindrical edge surface of the wafer W it contacts.
- the speed of the edge-cleaning roller 101 may be selectively retarded (e.g., with a brake) if the wafer W itself is used to drive the edge-cleaning roller 101 .
- the first and second inclined surfaces 107 , 109 of the edge-cleaning roller 101 may be angled and disposed so as to increase an area of the edge bevels of the wafer W contacted/cleaned by the inclined surfaces.
- the effective angles described between the inclined surfaces along the areas of contact described above and the nominal rotation plane 31 of the wafer W can be controlled so as to maximize contact with the edge bevels.
- FIGS. 6A, 6B , 7 A and 7 B illustrate additional rollers adapted to achieve frictional contact with the edge of the wafer W, e.g., for purposes of driving or supporting the wafer W, and/or for preventing tilting thereof during rotation. It will be understood, also, that where the rollers of FIGS. 6 A-B and 7 A-B achieve frictional contact with the edge of the wafer W, edge cleaning of the wafer may also take place, such that the rollers may also be denominated edge-cleaning rollers, e.g., either by design, or by virtue of how they are used in conjunction with a wafer edge.
- the rollers of FIGS. 6 A-B and 7 B are adapted to achieve frictional contact with edge surfaces of the wafer W that may be adjacent to the edge corners 27 , 29 .
- the roller of FIGS. 6 A-B is adapted to achieve frictional contact with the cylindrical edge surface 39 ( FIG. 3A ) between the edge corners 27 , 29
- the roller of FIGS. 7 A-B is adapted to achieve frictional contact with one or both of a first edge-adjacent region 41 ( FIG.
- the rollers of FIGS. 6 A-B and 7 A-B may comprise easily replaceable frictional components adapted to bear the greater portion of friction-induced wear where such frictional contact between the rollers and the wafer W is intended to occur.
- Such frictional components may be of low cost relative to other components of the rollers, and may assist in reducing and/or minimizing the cost of maintaining the rollers at a proper performance level, given that a certain level of wear may be anticipated and planned for.
- FIG. 6A is a side elevational view of an inventive support roller 601 , shown adjacent to a wafer W and in contact with the cylindrical edge surface 39 of the wafer W.
- the support roller 601 comprises a cylindrical frictional surface 603 , e.g., comprising polyurethane or some other suitable frictional material, adapted to achieve frictional contact with the cylindrical edge surface 39 ( FIG. 3A ) of the wafer W, as shown in FIG. 6A .
- the support roller 601 is adapted, via such frictional contact, to support and/or rotate the wafer W.
- the edge of the wafer W may be introduced between first and second guide surfaces 605 , 607 of the support roller 601 , which may comprise low-friction, low-wear material such as virgin PTFE to encourage sliding communication with the edge of the wafer W down the slopes of the guide surfaces 605 , 607 toward the cylindrical frictional surface 603 .
- the support roller 601 may be used to rotatably support and/or drive the wafer W.
- the cylindrical frictional surface 603 of the support roller 601 may also be used to clean the wafer W's cylindrical edge surface 39 , e.g., via rubbing contact caused by unmatched speeds of rotation.
- FIG. 6B illustrates a particular embodiment of the support roller 601 of FIG. 6A (support roller 601 a ), shown in an exploded assembly perspective view.
- the cylindrical frictional surface 603 of the support roller 601 a may comprise a portion of a friction disk 609 , which may be of a simple, low-cost design adapted to minimize cost of replacement.
- the support roller 601 a may further comprise a main body 611 , of which the second guide surface 607 may comprise a part, and an end portion 613 , of which the first guide surface 605 may comprise a part.
- the friction disk 609 may be adapted to fit between the main body 611 and the end portion 613 , and the assembly may be adapted to be secured such that the friction disk 609 rotates along with the main body 611 and the end portion 613 .
- the support roller 601 a may still further comprise a channel 615 ( FIG. 6A ) comprising first and second sides 617 , 619 ( FIG. 6A ) for retaining the edge of the wafer during rotational support thereof (e.g., by forming an “edge-trap” for retaining the edge of the wafer that includes the frictional surface 603 ( FIG. 6B )).
- the frictional surface 603 may form a transverse frictional surface that is adapted to contact the edge of the wafer and resist sliding thereagainst.
- the channel 615 may be straight, i.e., the first side 617 and the second side 619 of the channel 615 may be arranged so as not to form a V, unlike the first inclined surface 23 and the second inclined surface 25 of the edge-cleaning roller 21 of FIG. 3A . Additionally, an offset may be established between the first side 617 and the second side 619 of the channel 615 that is sufficiently large to permit insertion of the edge of the wafer W, which may have, for example, a nominal thickness of 0.030 inches, and yet is sufficiently small so as to prevent tilt in the wafer W during rotation of the same, e.g., via low-friction contact between the first side 617 of the channel 615 and the first edge-adjacent region 41 ( FIG. 3A ) of the wafer W and/or between the second side 619 of the channel 615 and the second edge-adjacent region 45 ( FIG. 3A ) of the wafer W.
- FIG. 7A is a side elevational view of an inventive side-contact roller 701 , shown adjacent to a wafer W.
- the side-contact roller 701 comprises a first frictional planar surface 703 , e.g., comprising polyurethane or some other suitable frictional material, adapted to achieve frictional contact with the first edge-adjacent region 41 ( FIG. 3A ) of the wafer W.
- the side-contact roller 701 may additionally comprise a second frictional planar surface 705 , similar to the first frictional planar surface 703 , and adapted to achieve frictional contact with the second edge-adjacent region 45 ( FIG. 3A ) of the wafer W.
- the first frictional planar surface 703 and the second frictional planar surface 705 may comprise sides of a straight channel 707 , e.g., similar to that described above with reference to FIG. 6B , such that the edge of the wafer W may be accommodated between the channel sides, and tilt in the wafer W may be prevented.
- the side-contact roller 701 is adapted to rotate the wafer W via frictional contact between the frictional planar surfaces of the side-contact roller 701 and the edge-adjacent regions of the major surfaces of the wafers.
- the edge of the wafer W may be introduced between first and second guide surfaces 709 , 711 of the side-contact roller 701 , which may comprise a low-friction, low-wear material such as virgin PTFE to encourage sliding communication with the edge of the wafer W down the slopes of the guide surfaces 709 , 711 toward the channel 707 of the side-contact roller 701 .
- a vertical gap 713 may be maintained between the cylindrical edge surface 39 ( FIG.
- the wafer W may be vertically supported by other rollers (not shown) that prevent the wafer W from fully descending into the channel 707 .
- the first frictional planar surface 703 and the second frictional planar surface 705 of the side-contact roller 701 may also be used to clean the edge-adjacent regions of the wafer's major surfaces, e.g., via rubbing contact.
- FIG. 7B illustrates a particular embodiment of the side-contact roller 701 of FIG. 7A (side-contact roller 701 a ), shown in a cross-sectional view.
- the first frictional planar surface 703 of the side-contact roller 701 a may comprise a portion of a first friction ring 715 , which may be of a simple low-cost design adapted to minimize cost of replacement.
- the second frictional planar surface 705 may comprise a portion of a similar second friction ring 717 .
- the side-contact roller 701 a may further comprise a hub 719 , a first guide ring 721 mounted on the hub 719 of which the first guide surface 709 may comprise a part, and a second guide ring 723 mounted on the hub 719 of which the second guide surface 711 may comprise a part.
- the first friction ring 715 and the second friction ring 717 may also be mounted on the hub 719 , e.g., between the first guide ring 721 and the second guide ring 723 as shown.
- An assembly may be formed thereby in which all components rotate in unison.
- One or more edge-cleaning rollers of FIGS. 4 and 5 A-B, and one or more of the frictional rollers of FIGS. 6 A-B and 7 A-B may be incorporated within a wafer cleaning apparatus (not separately shown) utilizing scrubber brushes to clean major surfaces of a wafer in a manner similar to that of the scrubber mechanism of FIG. 2 .
- a wafer cleaning apparatus not separately shown
- Such a mechanism can take many forms and/or perform many functions, including:
- an edge cleaning roller 801 may be provided having a plane of rotation 803 at an inventive angled orientation to the plane of rotation 805 of the wafer W, e.g., as described by an angle 807 , such that the plane of rotation 803 of the roller 801 intersects the plane of rotation 805 of the wafer W along a line (not separately shown) extending generally tangentially to the wafer W (e.g., as opposed to extending generally radially from the center of the wafer W as in the embodiment of FIG. 4 ).
- Such an arrangement permits the creation of multiple wear sectors on a single inclined surface of the roller 801 by permitting removal, inversion, and reinstallation of the same roller 801 midway through a useful life that may be twice that of a conventionally oriented roller. This may be possible, for example and as is apparent from FIG. 8 , since each edge corner tends to produce a wear sector at a unique location along the slope of a given inclined surface of the roller 801 , such that inversion and reinstallation of the roller exposes unworn or “fresh” friction surfaces to each of the edge corners. In other embodiments, such as shown in FIG.
- multiple edge-cleaning rollers 801 may be inventively oriented at one of two preferably equal and opposite angles to the plane of rotation of the wafer W, e.g., for balancing of out-of-plane forces imparted to the wafer W by the angled rollers.
- inventive edge cleaning rollers described herein are each independently inventive, and may be employed in apparatuses other than those adapted to scrub a wafer's major surface. Further, as will be apparent to those of ordinary skill in the art, the inventive rollers may be employed to clean the edge of a wafer supported in any orientation (e.g., horizontal, vertical, etc.). Thus the inventive edge cleaning rollers may be advantageously employed in a vertically-oriented scrubber such as that disclosed in U.S. Pat. No. 6,575,177, the entire disclosure of which is incorporated herein by this reference.
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Abstract
In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes (1) a plurality of support rollers adapted to support an edge of the thin disk as the thin disk rotates within a first plane; and (2) an edge-cleaning roller adapted to rotate within a second plane oriented at a first non-zero angle to the first plane, so as to contact an edge bevel of the thin disk while so rotating. Numerous other aspects are provided.
Description
- This application claims priority to U.S. Provisional Application Ser. No. 60/514,938, filed Oct. 28, 2003 and entitled “Wafer Edge Cleaning,” which is hereby incorporated by reference herein in its entirety for all purposes.
- The present invention relates generally to cleaning thin disks, such as semiconductor wafers, compact disks, glass substrates and the like. More particularly, the invention relates to scrubbing devices for simultaneously scrubbing the entire surface of a thin disk, including the edges thereof.
- To manufacture a thin disk such as a semiconductor wafer, an elongated billet of semiconductor material is cut into very thin slices or disks, about ½ mm in thickness. The slices or wafers of semiconductor material are then lapped and polished by a process that applies an abrasive slurry to the wafer's surfaces. After polishing, slurry residue conventionally is cleaned or scrubbed from wafer surfaces via a mechanical scrubbing device, such as a device which employs polyvinyl acetate (PVA) brushes, brushes made from other porous or sponge-like material, or brushes having bristles made from nylon or similar materials. Although these conventional cleaning devices remove a substantial portion of the slurry residue which adheres to wafer edges, slurry particles nonetheless may remain and produce defects during subsequent processing.
- A conventional PVA brush scrubber is shown in the side elevational view of
FIG. 1 . Theconventional scrubber 11, shown inFIG. 1 , comprises a pair ofPVA brushes platform 15 for supporting a wafer W, and a mechanism (not shown) for rotating the pair ofPVA brushes platform 15 comprises a plurality of rollers 17 a-c for both supporting and rotating the wafer W. - Preferably, the pair of
PVA brushes - A number of devices have been developed to improve wafer edge cleaning. One such device is shown in the side elevational view of
FIG. 2 . The edge-cleaning scrubber 19, shown inFIG. 2 , includes a pair ofrollers cleaning roller 21 that fits over the edge of the wafer W for cleaning the edge as the wafer rotates. Although the edge-cleaning roller 21 addresses the need to clean slurry residue from wafer edges, it can be subject to quick wear, such wear typically being concentrated at locations where it contacts the wafer W. -
FIGS. 3A-3C illustrate details related to how the edge-cleaning roller 21 of the edge-cleaning scrubber 19 ofFIG. 2 cleans the edge of the wafer W. Referring to the side elevational view ofFIG. 3A , which shows the wafer W above the edge-cleaning roller 21, the edge-cleaning roller 21 ofFIG. 2 is shown in contact with the wafer W. Specifically, opposing first and secondinclined surfaces cleaning roller 21 are in contact with respective opposite first andsecond edge corners second edge corners inclined surfaces edge cleaning roller 21. - Referring to the side elevational view of
FIG. 3B , in which the wafer W is shown in phantom across the edge-cleaning roller 21, the wafer W rotates in anominal rotation plane 31, as does the edge-cleaning roller 21. By “nominal rotation plane” is meant that plane within which the wafer W is expected to rotate based on the specific arrangement of rollers (e.g., therollers scrubber 19 ofFIG. 2 . Further, it may be seen that contact betweeninclined surfaces cleaning roller 21 and the first andsecond edge corners second contact areas inclined surfaces - Referring to the cross-sectional view of the edge-
cleaning roller 21 shown inFIG. 3C , corresponding tosection 3C-3C as shown onFIG. 3B , thefirst contact area 33 on the firstinclined surface 23 translates to a ring-shaped wear sector 37 on the firstinclined surface 23, typically relatively narrow, which performs the edge-cleaning function and is subject to friction-induced wear over time. Conversely, the remaining portions of the firstinclined surface 23 may not typically contact the wafer W during edge cleaning, and therefore may not be subject to such friction-induced wear. - Other rollers that may rotate in a common plane with a wafer W while contacting a portion of the wafer edge, but that perform additional or separate functions such as rotating the wafer W (e.g., drive rollers, such as the spinning mechanism 17 a-c of
FIG. 1 ) or guiding the rotating wafer W so as to limit or prevent tilting of the same (e.g., idling guide rollers (not separately shown)), are typically also subject to rapid wear where contact is made with the wafer W. The cost of maintaining proper operation of such parts and/or conducting frequent replacement of the same can mount quickly. - Accordingly the field of wafer cleaning requires methods and apparatus for effectively performing one or more of the functions of cleaning, supporting, driving and guiding both the flat surfaces and the edge surfaces of a semiconductor wafer, preferably so as to reduce the cost and/or frequency of replacement due to frictional wear from wafer contact.
- The present invention addresses the need for a more effective edge cleaner by providing a number of different roller embodiments that are adapted for wafer edge cleaning. Specifically:
-
- (1) for cleaning the edge bevel of a wafer, an edge cleaning roller is adapted to rotate within a plane that is at an angle to a first plane in which the wafer is supported and rotated;
- (2) for cleaning the circumferential edge of a wafer, an edge cleaning roller is provided with a flat-bottomed channel having a frictional surface along the channel's bottom; and/or
- (3) for cleaning an edge region of a major surface of a wafer, an edge cleaning roller is provided with a straight-walled channel having a frictional surface along at least one of the straight walls thereof.
- In a first aspect of the invention, an apparatus for cleaning a thin disk is provided. The apparatus includes (1) a plurality of support rollers adapted to support an edge of the thin disk as the thin disk rotates within a first plane; and (2) an edge-cleaning roller adapted to rotate within a second plane oriented at a first non-zero angle to the first plane, so as to contact an edge bevel of the thin disk while so rotating.
- In a second aspect of the invention, a support roller is provided for supporting a vertically rotating wafer. The support roller includes (1) a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and (2) an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst.
- In a third aspect of the invention, a side-contact roller is provided for contacting one or more major surfaces of a rotating wafer. The side-contacting roller includes (1) a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and (2) an edge-trap portion for retaining the edge of the wafer and having a planar surface comprising a high-friction material and adapted, when in communication with a major surface of the wafer, to resist sliding thereagainst. Numerous other aspects, as are methods in accordance with these and other aspects of the invention.
- Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
-
FIG. 1 is a side elevational view of a conventional PVA brush scrubber. -
FIG. 2 is a side elevational view of a conventional scrubber comprising a conventional edge-cleaning roller for improving wafer edge cleaning. -
FIG. 3A is a side elevational view of the edge-cleaning roller ofFIG. 2 , shown cleaning the edge corners of the wafer W. -
FIG. 3B is another side elevational view of the edge-cleaning roller ofFIG. 2 , shown contacting the wafer W along contact areas on respective inclined surfaces of the edge-cleaning roller. -
FIG. 3C is a cross-sectional view, corresponding to view 3C-3C ofFIG. 2 , of the edge-cleaning roller ofFIG. 2 showing a relatively narrow wear sector on an inclined surface of the edge-cleaning roller where contact is made with an edge corner of the wafer W. -
FIG. 4 is a side elevational view of an inventive edge-cleaning roller, shown contacting edge corners of the wafer W and in an inventive angled orientation to a plane of rotation of the wafer W. -
FIG. 5A is a view, corresponding to view 5A-5A ofFIG. 4 , of a major surface of the wafer W showing separate radial locations at which the inventive edge-cleaning roller ofFIG. 4 contacts respective edge corners of the wafer W. -
FIG. 5B is a cross-sectional view, corresponding to view 5B-5B ofFIG. 4 , of the inventive edge-cleaning roller ofFIG. 4 showing a relatively wide wear sector on an inclined surface of the edge-cleaning roller where contact is made with an edge corner of the wafer W. -
FIG. 6A is a side elevational view of an inventive edge-cleaning support roller, shown in contact with a cylindrical edge surface of the wafer W. -
FIG. 6B is an exploded assembly perspective view of an edge-cleaning support roller that is a particular embodiment of the inventive edge-cleaning support roller ofFIG. 6A . -
FIG. 7A is a side elevational view of an inventive edge-cleaning side-contact roller, shown engaging the edge of the wafer W. -
FIG. 7B is a cross-sectional view of an edge-cleaning side-contact roller that is a particular embodiment of the inventive edge-cleaning side-contact roller ofFIG. 7A . -
FIG. 8 is a side elevational view of an inventive edge-cleaning roller, shown contacting edge corners of the wafer W and in another inventive angled orientation to a plane of rotation of the wafer W. -
FIG. 9 is a side elevational view of two inventive edge-cleaning rollers ofFIG. 8 , shown contacting edge corners of the wafer W and in opposite inventive angled orientations to a plane of rotation of the wafer W. -
FIG. 4 is an side elevational view of an inventive edge-cleaningroller 101 in which the wafer W is shown in phantom across the edge-cleaningroller 101, the edge-cleaningroller 101 being adapted to contact edge surfaces (e.g., edge bevels as described above with reference toFIG. 3A ) of the wafer W for cleaning. Where, as described above, the wafer W is supported and driven so as to rotate and remain within thenominal rotation plane 31 of the wafer W (rotation and support means for the same not being shown), the edge-cleaningroller 101 may be inventively oriented relative to the wafer W so as to form afirst angle 103, thefirst angle 103 being that angle which is described between thenominal rotation plane 31 of the wafer W and arotation plane 105 within which the edge-cleaningroller 101 is disposed and is adapted to rotate. - As shown in
FIG. 4 , therotation plane 105 of the edge-cleaningroller 101 may be oriented relative to thenominal rotation plane 31 of the wafer W such that, in forming thefirst angle 103, the rotation planes intersect along a line (not separately shown) generally extending radially outward from the center of rotation of the wafer W. Other relative orientations are possible, such as a relative orientation between the rotation planes whereby the planes intersect along a line generally extending tangentially to the wafer W, as is illustrated inFIGS. 8 and 9 and as will be described later. - Referring again to
FIG. 4 , the edge-cleaningroller 101 may comprise opposing first and secondinclined surfaces second edge corners 27, 29 (FIG. 3A ) of the edge of the wafer W. By contrast to the pattern of contact between the wafer W and the edge-cleaningroller 21 as shown above inFIGS. 3A and 3B , e.g., in which both the first and thesecond edge corners roller 21 at substantially the same radial location along the perimeter of the wafer W, the inventive angled orientation of the edge-cleaningroller 101 relative to the wafer W shown inFIG. 4 may result in divergent radial contact locations along the perimeter of the wafer W. For example, as shown in the planar view of a major surface of the wafer W shown inFIG. 5A (corresponding to theview 5A-5A ofFIG. 4 ), contact between the first inclined surface 107 (FIG. 4 ) of the edge-cleaningroller 101 and thefirst edge corner 27 of the wafer W may occur at a firstradial location 111 along the perimeter of the wafer W, contact between the second inclined surface 109 (FIG. 4 ) of the edge-cleaningroller 101 and thesecond edge corner 29 of the wafer W may occur at a secondradial location 113 along the perimeter of the wafer W, and asecond angle 115 separates the firstradial location 111 and the secondradial location 113. - Referring again to
FIG. 4 , the inventive angled orientation of the edge-cleaningroller 101 relative to the wafer W may result in a longer useful life for the edge-cleaningroller 101. For example, where inFIGS. 3A and 3C it is shown that coplanar orientation between the respective rotation planes of the edge-cleaningroller 21 and the wafer W may result, as mentioned above, in a relatively narrow ring-shapedwear sector 37 on the firstinclined surface 23 of the edge-cleaningroller 21, the inventive angled orientation ofFIG. 4 may increase wear sector width, thus distributing the edge-cleaning function over larger contact areas (see 121,FIG. 5B ) on the inclined surfaces of the edge-cleaningroller 101. The inventive angled orientation ofFIG. 4 therefore may increase the wafer's edge cleaning duty cycle and may extend the useful life of theroller 101. -
FIG. 5B , which is a cross-sectional view of the edge-cleaningroller 101 taken along asection 5B-5B ofFIG. 4 , illustrates the above-described feature. Referring toFIG. 5B , contact between the firstinclined surface 107 of the edge-cleaningroller 101 and the edge of the wafer W (shown in phantom) at the first edge corner 27 (FIG. 3A ) of the wafer W takes place along afirst contact area 117 on the firstinclined surface 107, and a ring-shapedwear sector 119 on the secondinclined surface 109 may be produced thereby (e.g., by virtue of the rotation of the edge-cleaning roller 101) having acharacteristic width 121. - As shown in
FIG. 5B , thefirst contact area 117 tends to extend not only laterally across the slope of the firstinclined surface 107, e.g., similarly to thefirst contact area 33 ofFIG. 3C , but also up the slope of the firstinclined surface 107, e.g., in contrast to thefirst contact area 33 ofFIG. 3C . It may readily be seen, therefore, that thewidth 121 of the ring-shapedwear sector 119 on the firstinclined surface 109 of the edge-cleaningroller 101 may be proportionately greater than a corresponding dimension (not separately shown) of thewear sector 37 on the firstinclined surface 23 of the edge-cleaningroller 21 ofFIGS. 3A-3C . Given a greater wear sector width, it follows that the area of the firstinclined surface 107 subjected to friction-induced wear during wafer edge cleaning (i.e., the wear sector area) will be proportionately greater. - Assuming the degree of edge cleanliness required by the process remains the same, providing a greater area for the ring-shaped
wear sector 119 as described above can reduce the edge-cleaning burden per unit area of the wear sector, which may result in a longer useful life for the edge-cleaningroller 101. For example, given a larger portion of the firstinclined surface 107 of the edge-cleaningroller 101 is being used to clean thefirst edge corner 27 of the wafer W, edge cleaning may be more efficient, thus allowing, e.g., the length of time that the firstinclined surface 107 is applied to thefirst edge corner 27 of the wafer W to be decreased, or the contact pressure between the same to be reduced, while still producing the required degree of wafer edge cleanliness. Those possessing skill in the art will recognize that the same dynamic exists between the second edge corner 29 (FIG. 3A ) of the wafer W and the second inclined surface 109 (FIG. 4 ) of the edge-cleaningroller 101, resulting in a similar beneficial broadening of a corresponding wear sector (not separately shown), and the same benefits as to part life. - Those possessing skill in the art will also recognize that additional flexibilities may be obtained by dividing edge-cleaning contact between the edge-cleaning
roller 101 and the wafer W between radially spaced-apart locations on the edge of the wafer W, e.g., as shown inFIG. 5A . For example, in some embodiments of the edge-cleaningroller 101, a third angle 123 (seeFIG. 4 ) described between the firstinclined surface 107 and the secondinclined surface 109 may be provided that is wider than is typical for edge-cleaning rollers, e.g., so as to more readily facilitate rotation of therotation plane 105 of the edge-cleaningroller 101 relative to thenominal rotation plane 31 of the wafer W. Nevertheless, despite the widerthird angle 123, the respective effective angles of contact (not shown) between the firstinclined surface 107 and the secondinclined surface 109 relative to thenominal rotation plane 31 of the wafer (e.g., as measured along the slope of the firstinclined surface 107 normal to the direction along which thescrubber 117 extends, and along the slope of the secondinclined surface 109 in a corresponding direction) may be controlled so as to be equivalent to those of typical edge-cleaning rollers. - Alternatively, if it is desired to increase the wafer's edge cleaning “duty cycle”, e.g., that angular fraction of the wafer's perimeter which is in contact with the
inclined surfaces roller 101 at any given time, or if it is desired to increase the size of an area of edge-cleaning contact on one or more edge surfaces of the wafer W, the same angles of contact may be reduced below that which is typical, in effect narrowing the angular gap between theinclined surfaces roller 101 and the major surfaces of the wafer W. This may be accomplished without undue risk of causing the edge of the wafer to become wedged between the inclined surfaces of the edge-cleaningroller 101 and the rotation of the wafer W to become impeded thereby, e.g., since an angular space exists in the form of thesecond angle 115 between the first and secondradial locations 111, 113 (FIG. 5A ) along the perimeter of the wafer W at which contact with theinclined surfaces roller 101 takes place. - Many different angles may be specified for the
third angle 123. For example, applicants observe that an angle of 70 degrees, ±10 degrees, produces a good result. - The edge-cleaning
roller 101 may further include a normal surface 125 (FIG. 4 ), e.g., cylindrical in shape, and occupying a space between the inclined surfaces of the edge-cleaningroller 101. Such a space may be introduced so as to facilitate the rotation of the edge-cleaningroller 101 relative to thenominal rotation plane 31 of the wafer W. Although many different widths may be specified for such a space, including widths of up to 10 mm or more, applicants observe that a dimension of 2 mm, ±1 mm produces a good result. In addition, thenormal surface 125 in that space may or may not be disposed directly adjacent to the inclined surfaces. For example, thenormal surface 125 may comprise a bottom surface of a channel disposed in a space between the inclined surfaces (see, e.g.,FIG. 4 ). - In some modes of use of the edge-cleaning
roller 101, thenormal surface 125 is spaced apart from a cylindrical edge surface 39 (FIG. 3A ) of the wafer W while the firstinclined surface 107 and the secondinclined surface 109 of the edge-cleaningroller 101 clean theedge corners roller 101, thenormal surface 125 may be caused to contact and/or support and/or clean thecylindrical edge surface 39 of the wafer W. - In addition, applicants observe that beneficial edge cleaning may be provided where the
first angle 103 described between therotation plane 105, within which the edge-cleaningroller 101 is disposed, and the nominal rotation plane 31 (FIG. 3B ) of the wafer W, ranges from 10-30 degrees. Optionally, therefore, thefirst angle 103 may be set at 15 degrees, which applicants observe produces a good result. - Values of (1) a width of the space between the first
inclined surface 107 and the secondinclined surface 109, (2) thethird angle 123, and (3) thefirst angle 103 may be established/selected via an iterative, coordinated design process, so as to produce the desired interaction between the edge-cleaningroller 101 and the wafer W. Alternatively, selection of such values may be performed automatically based on the desired result. Respective values of 3 mm, 50 degrees, and 20 degrees for those three values provide a good result. - Furthermore, if desired, a slight torque may be introduced, e.g., to increase a frictional cleaning pressure between the
inclined surfaces roller 101 and theedge corners 27, 29 (FIG. 3A ) of the wafer W. In some embodiments, such a torque serves to increase an area of the edge of the wafer W to be cleaned by the edge-cleaningroller 101, without undue risk of the wafer's edge being pinched between the inclined surfaces of the edge-cleaningroller 101 and thus without wafer rotation tending to be inhibited thereby. - In operation, the wafer W may be inserted between the first
inclined surface 107 and the secondinclined surface 109 of the edge-cleaningroller 101, placed in contact with same, e.g., according to the pattern ofFIG. 5A , and rotated in the nominal rotation plane 31 (FIG. 3B ). For example, the wafer may be inserted between the firstinclined surface 107 and the secondinclined surface 109 of the edge-cleaningroller 101 with therotation plane 105 of the edge-cleaningroller 101 preliminarily in a coplanar relationship with thenominal rotation plane 31 of the wafer W, and the edge-cleaningroller 101 may thereafter be rotated to achieve the desiredfirst angle 103. Alternatively, thefirst angle 103 may be established prior to the wafer W being introduced to the edge-cleaningroller 101. - As mentioned above, the edge-cleaning
roller 101 may be utilized in a mode in which contact with the wafer W is restricted to the firstinclined surface 107 and the secondinclined surface 109. Alternatively, and as also mentioned above, thecylindrical edge surface 39 of the wafer W may also be made to contact a normal surface 125 (FIG. 4 ) of the edge-cleaningroller 101 at one or more times, e.g., either before or during wafer edge cleaning, or before or during rotation of the edge-cleaningroller 101. - Where sliding contact is intended between the edge-cleaning
roller 101 and the wafer W, the surfaces of the edge-cleaningroller 101 involved may be adapted so as to further improve cleaning through greater friction. For example, such surfaces may comprise polyurethane, or some other suitable frictional material. - Additionally, edge surfaces of the wafer W and frictional surfaces of the edge-cleaning
roller 101 may be caused to rotate at different velocities so as to enhance sliding contact. For example, the speed of rotation of the edge-cleaningroller 101 may be controlled via a separate motor, e.g., so as to cause thenormal surface 125 to rotate at a different velocity than the cylindrical edge surface of the wafer W it contacts. Also for example, the speed of the edge-cleaningroller 101 may be selectively retarded (e.g., with a brake) if the wafer W itself is used to drive the edge-cleaningroller 101. - Where the
edge corners 27, 29 (FIG. 3A ) of the wafer W comprise edge bevels, the first and secondinclined surfaces roller 101 may be angled and disposed so as to increase an area of the edge bevels of the wafer W contacted/cleaned by the inclined surfaces. For example, the effective angles described between the inclined surfaces along the areas of contact described above and thenominal rotation plane 31 of the wafer W can be controlled so as to maximize contact with the edge bevels. -
FIGS. 6A, 6B , 7A and 7B illustrate additional rollers adapted to achieve frictional contact with the edge of the wafer W, e.g., for purposes of driving or supporting the wafer W, and/or for preventing tilting thereof during rotation. It will be understood, also, that where the rollers of FIGS. 6A-B and 7A-B achieve frictional contact with the edge of the wafer W, edge cleaning of the wafer may also take place, such that the rollers may also be denominated edge-cleaning rollers, e.g., either by design, or by virtue of how they are used in conjunction with a wafer edge. - Unlike the edge-cleaning
roller 101 ofFIGS. 4 and 5 A-B, which is adapted to achieve frictional contact with edge corners (or edge bevels) 27, 29 (FIG. 3A ) of the wafer W, the rollers of FIGS. 6A-B and 7B are adapted to achieve frictional contact with edge surfaces of the wafer W that may be adjacent to theedge corners FIG. 3A ) between theedge corners FIG. 3A ) of a first major surface 43 (FIG. 3A ) of the wafer W, and a second edge-adjacent region 45 (FIG. 3A ) of a secondmajor surface 47 of the wafer W (FIG. 3A ). Additionally, the rollers of FIGS. 6A-B and 7A-B may comprise easily replaceable frictional components adapted to bear the greater portion of friction-induced wear where such frictional contact between the rollers and the wafer W is intended to occur. Such frictional components may be of low cost relative to other components of the rollers, and may assist in reducing and/or minimizing the cost of maintaining the rollers at a proper performance level, given that a certain level of wear may be anticipated and planned for. -
FIG. 6A is a side elevational view of aninventive support roller 601, shown adjacent to a wafer W and in contact with thecylindrical edge surface 39 of the wafer W. Thesupport roller 601 comprises a cylindricalfrictional surface 603, e.g., comprising polyurethane or some other suitable frictional material, adapted to achieve frictional contact with the cylindrical edge surface 39 (FIG. 3A ) of the wafer W, as shown inFIG. 6A . Thesupport roller 601 is adapted, via such frictional contact, to support and/or rotate the wafer W. - In operation, the edge of the wafer W may be introduced between first and second guide surfaces 605, 607 of the
support roller 601, which may comprise low-friction, low-wear material such as virgin PTFE to encourage sliding communication with the edge of the wafer W down the slopes of the guide surfaces 605, 607 toward the cylindricalfrictional surface 603. Once frictional contact is established between the cylindricalfrictional surface 603 of thesupport roller 601 and thecylindrical edge surface 39 of the wafer W, thesupport roller 601 may be used to rotatably support and/or drive the wafer W. As described above, the cylindricalfrictional surface 603 of thesupport roller 601 may also be used to clean the wafer W'scylindrical edge surface 39, e.g., via rubbing contact caused by unmatched speeds of rotation. -
FIG. 6B illustrates a particular embodiment of thesupport roller 601 ofFIG. 6A (support roller 601 a), shown in an exploded assembly perspective view. As shown inFIG. 6B , the cylindricalfrictional surface 603 of thesupport roller 601 a may comprise a portion of afriction disk 609, which may be of a simple, low-cost design adapted to minimize cost of replacement. - The
support roller 601 a may further comprise amain body 611, of which thesecond guide surface 607 may comprise a part, and anend portion 613, of which thefirst guide surface 605 may comprise a part. Thefriction disk 609 may be adapted to fit between themain body 611 and theend portion 613, and the assembly may be adapted to be secured such that thefriction disk 609 rotates along with themain body 611 and theend portion 613. - The
support roller 601 a may still further comprise a channel 615 (FIG. 6A ) comprising first andsecond sides 617, 619 (FIG. 6A ) for retaining the edge of the wafer during rotational support thereof (e.g., by forming an “edge-trap” for retaining the edge of the wafer that includes the frictional surface 603 (FIG. 6B )). In the embodiment ofFIG. 6A , thefrictional surface 603 may form a transverse frictional surface that is adapted to contact the edge of the wafer and resist sliding thereagainst. Thechannel 615 may be straight, i.e., thefirst side 617 and thesecond side 619 of thechannel 615 may be arranged so as not to form a V, unlike the firstinclined surface 23 and the secondinclined surface 25 of the edge-cleaningroller 21 ofFIG. 3A . Additionally, an offset may be established between thefirst side 617 and thesecond side 619 of thechannel 615 that is sufficiently large to permit insertion of the edge of the wafer W, which may have, for example, a nominal thickness of 0.030 inches, and yet is sufficiently small so as to prevent tilt in the wafer W during rotation of the same, e.g., via low-friction contact between thefirst side 617 of thechannel 615 and the first edge-adjacent region 41 (FIG. 3A ) of the wafer W and/or between thesecond side 619 of thechannel 615 and the second edge-adjacent region 45 (FIG. 3A ) of the wafer W. -
FIG. 7A is a side elevational view of an inventive side-contact roller 701, shown adjacent to a wafer W. The side-contact roller 701 comprises a first frictionalplanar surface 703, e.g., comprising polyurethane or some other suitable frictional material, adapted to achieve frictional contact with the first edge-adjacent region 41 (FIG. 3A ) of the wafer W. The side-contact roller 701 may additionally comprise a second frictionalplanar surface 705, similar to the first frictionalplanar surface 703, and adapted to achieve frictional contact with the second edge-adjacent region 45 (FIG. 3A ) of the wafer W. The first frictionalplanar surface 703 and the second frictionalplanar surface 705 may comprise sides of astraight channel 707, e.g., similar to that described above with reference toFIG. 6B , such that the edge of the wafer W may be accommodated between the channel sides, and tilt in the wafer W may be prevented. The side-contact roller 701 is adapted to rotate the wafer W via frictional contact between the frictional planar surfaces of the side-contact roller 701 and the edge-adjacent regions of the major surfaces of the wafers. - In operation, the edge of the wafer W may be introduced between first and second guide surfaces 709, 711 of the side-
contact roller 701, which may comprise a low-friction, low-wear material such as virgin PTFE to encourage sliding communication with the edge of the wafer W down the slopes of the guide surfaces 709, 711 toward thechannel 707 of the side-contact roller 701. Once the edge of the wafer W has been inserted into thechannel 707, e.g., between the first frictionalplanar surface 703 and the second frictionalplanar surface 705, avertical gap 713 may be maintained between the cylindrical edge surface 39 (FIG. 3A ) of the wafer W and a corresponding portion of the side-contact roller 701 to restrict contact between the side-contact roller 701 and the wafer W to the frictional “side” contact described above (i.e., at the edge-adjacent regions of the wafer's major surfaces), which frictional contact may be employed to drive the wafer W. Specifically, the wafer W may be vertically supported by other rollers (not shown) that prevent the wafer W from fully descending into thechannel 707. As described above, the first frictionalplanar surface 703 and the second frictionalplanar surface 705 of the side-contact roller 701 may also be used to clean the edge-adjacent regions of the wafer's major surfaces, e.g., via rubbing contact. -
FIG. 7B illustrates a particular embodiment of the side-contact roller 701 ofFIG. 7A (side-contact roller 701 a), shown in a cross-sectional view. As shown inFIG. 7B , the first frictionalplanar surface 703 of the side-contact roller 701 a may comprise a portion of afirst friction ring 715, which may be of a simple low-cost design adapted to minimize cost of replacement. Also, as shown inFIG. 7B , if the side-contact roller 701 a includes a second frictionalplanar surface 705, the second frictionalplanar surface 705 may comprise a portion of a similarsecond friction ring 717. - The side-
contact roller 701 a may further comprise ahub 719, afirst guide ring 721 mounted on thehub 719 of which thefirst guide surface 709 may comprise a part, and asecond guide ring 723 mounted on thehub 719 of which thesecond guide surface 711 may comprise a part. Thefirst friction ring 715 and thesecond friction ring 717 may also be mounted on thehub 719, e.g., between thefirst guide ring 721 and thesecond guide ring 723 as shown. An assembly may be formed thereby in which all components rotate in unison. - One or more edge-cleaning rollers of
FIGS. 4 and 5 A-B, and one or more of the frictional rollers of FIGS. 6A-B and 7A-B may be incorporated within a wafer cleaning apparatus (not separately shown) utilizing scrubber brushes to clean major surfaces of a wafer in a manner similar to that of the scrubber mechanism ofFIG. 2 . Such a mechanism can take many forms and/or perform many functions, including: -
- 1) comprising separate drive motors for the edge cleaning roller and the other frictional rollers, e.g., so as to facilitate an angled plane of rotation for the edge-cleaning roller;
- 2) comprising a toggle enabling the edge-cleaning roller to switch between a mode in which it either lags behind or exceeds the speed of rotation of the wafer edge so as to slide against the wafer edge when in contact with it, and a mode in which it matches the wafer edge speed and therefore does not slide thereagainst when contacting the same;
- 3) allowing the angle between the plane of rotation of the edge-cleaning roller and the plane of rotation of the wafer to be selectively varied;
- 4) permitting the edge cleaning roller to toggle between speed-matching and speed-lagging or speed-exceeding modes while other frictional rollers remain in a speed-matching mode;
- 5) the toggle of (2) above comprising a clutch that engages for speed-exceeding or speed-lagging and disengages for speed matching; and/or
- 6) the toggle of (2) above comprising a friction brake that engages for speed-lagging and disengages for speed matching.
Other Configurations are also Permissible.
- The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, according to one or more embodiments, such as shown in
FIG. 8 , anedge cleaning roller 801 may be provided having a plane ofrotation 803 at an inventive angled orientation to the plane ofrotation 805 of the wafer W, e.g., as described by anangle 807, such that the plane ofrotation 803 of theroller 801 intersects the plane ofrotation 805 of the wafer W along a line (not separately shown) extending generally tangentially to the wafer W (e.g., as opposed to extending generally radially from the center of the wafer W as in the embodiment ofFIG. 4 ). Such an arrangement permits the creation of multiple wear sectors on a single inclined surface of theroller 801 by permitting removal, inversion, and reinstallation of thesame roller 801 midway through a useful life that may be twice that of a conventionally oriented roller. This may be possible, for example and as is apparent fromFIG. 8 , since each edge corner tends to produce a wear sector at a unique location along the slope of a given inclined surface of theroller 801, such that inversion and reinstallation of the roller exposes unworn or “fresh” friction surfaces to each of the edge corners. In other embodiments, such as shown inFIG. 9 , multiple edge-cleaningrollers 801 may be inventively oriented at one of two preferably equal and opposite angles to the plane of rotation of the wafer W, e.g., for balancing of out-of-plane forces imparted to the wafer W by the angled rollers. - Finally, it should be understood that the inventive edge cleaning rollers described herein are each independently inventive, and may be employed in apparatuses other than those adapted to scrub a wafer's major surface. Further, as will be apparent to those of ordinary skill in the art, the inventive rollers may be employed to clean the edge of a wafer supported in any orientation (e.g., horizontal, vertical, etc.). Thus the inventive edge cleaning rollers may be advantageously employed in a vertically-oriented scrubber such as that disclosed in U.S. Pat. No. 6,575,177, the entire disclosure of which is incorporated herein by this reference.
- Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.
Claims (27)
1. An apparatus for cleaning a thin disk comprising:
a plurality of support rollers adapted to support an edge of the thin disk as the thin disk rotates within a first plane; and
an edge-cleaning roller adapted to rotate within a second plane oriented at a first non-zero angle to the first plane, so as to contact an edge bevel of the thin disk while so rotating.
2. The disk cleaning apparatus of claim 1 , wherein the edge-cleaning roller comprises an abrasive material adapted to contact the edge bevel of the thin disk.
3. The disk cleaning apparatus of claim 2 , wherein the first non-zero angle is sufficiently large such that an area on the edge cleaning roller of contact between an abrasive material of the edge cleaning roller and the beveled edge of the thin disk is greater than would be the case if the second plane were oriented at an angle of zero relative to the first plane.
4. The disk cleaning apparatus of claim 1 , wherein the first non-zero angle is at least ten degrees.
5. The disk cleaning apparatus of claim 4 , wherein the first non-zero angle is thirty degrees or less.
6. The disk cleaning apparatus of claim 1 , wherein each of the plurality of support rollers rotates within the first plane while supporting the edge of the thin disk.
7. The disk cleaning apparatus of claim 1 , further comprising a scrubber brush for contacting a major surface of a thin disk supported by the plurality of support rollers.
8. The disk cleaning apparatus of claim 1 , wherein a portion of the edge cleaning roller that contacts the edge bevel of the thin disk is adapted to rotate at a different speed relative to the edge bevel of the thin disk so as to both contact the edge bevel and slide thereagainst during cleaning of the thin disk.
9. The disk cleaning apparatus of claim 8 , wherein the portion of the edge-cleaning roller that contacts the edge bevel of the thin disk is adapted to rotate at a different speed relative to the edge bevel of the thin disk while at least one of the plurality of support rollers matches a speed of rotation of the edge bevel where the one support roller contacts the edge bevel.
10. The disk cleaning apparatus of claim 8 , further comprising a roller drive apparatus adapted to drive the edge-cleaning roller and at least one of the plurality of support rollers at different rates of rotation.
11. The disk cleaning apparatus of claim 1 , further comprising a first motor for driving the edge-cleaning roller and a second motor for driving at least one of the plurality of support rollers.
12. The disk cleaning apparatus of claim 10 , wherein the roller drive apparatus comprises a first motor for driving the edge-cleaning roller and a second motor for driving the at least one of the plurality of support rollers.
13. The disk cleaning apparatus of claim 8 , wherein the edge-cleaning roller is further adapted to selectively match a speed of rotation of the edge bevel where the edge-cleaning roller contacts the edge bevel during cleaning of the thin disk.
14. The disk cleaning apparatus of claim 13 , wherein the edge-cleaning roller is adapted to toggle between a unmatched speed mode and a speed matching mode relative to a speed of rotation of the edge bevel while at least one of the support rollers remains in a speed matching mode relative to the speed of rotation of the edge bevel.
15. A support roller for supporting a rotating wafer within a wafer cleaner, comprising:
a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and
an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst.
16. The support roller of claim 15 , wherein the edge-trap portion comprises a slot having a bottom comprising the transverse surface.
17. The support roller of claim 16 , wherein the slot comprises slot walls located at opposite sides of the transverse surface, each slot wall having a substantially straight portion.
18. The support roller of claim 17 , wherein the substantially straight portions are parallel to each other.
19. The support roller of claim 15 , wherein the transverse surface is cylindrical.
20. The support roller of claim 15 , wherein the transverse surface comprises a frictional insert adapted to be incorporated within the roller.
21. A side-contact roller for contacting one or more major surfaces of a wafer rotating within a wafer cleaner, comprising:
a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and
an edge-trap portion for retaining the edge of the wafer and having a planar surface comprising a high-friction material and adapted, when in communication with a major surface of the wafer, to resist sliding thereagainst.
22. The side contact roller of claim 21 , wherein the edge-trap portion comprises a slot, and wherein the planar surface comprises a side wall of the slot.
23. The support roller of claim 21 , wherein the planar surface comprises a frictional insert adapted to be incorporated within the roller.
24. A method of cleaning an edge of a wafer, the method comprising:
providing an edge cleaning roller having a first inclined frictional surface for cleaning an edge corner of a wafer rotating within a first plane; and
causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner.
25. The method of claim 24 , wherein causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner comprises:
orienting the second plane at an angle to the first plane such that a line formed by an intersection between the first and the second planes is disposed perpendicular to a line drawn tangent to the edge of the wafer.
26. The method of claim 24 , wherein causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner comprises:
orienting the second plane at an angle to the first plane such that a line formed by an intersection between the first and the second planes is disposed parallel to a line drawn tangent to the edge of the wafer.
27. A method of cleaning an edge of a wafer, the method comprising:
providing a roller for cleaning an edge of a wafer rotating within a first plane; and
causing the roller to rotate within a second plane at an angle to the first plane such that the roller cleans the edge of the wafer.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/976,011 US20050172430A1 (en) | 2003-10-28 | 2004-10-28 | Wafer edge cleaning |
US12/245,745 US20090044831A1 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US12/245,744 US7900311B2 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US13/042,085 US8099817B2 (en) | 2003-10-28 | 2011-03-07 | Wafer edge cleaning |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51493803P | 2003-10-28 | 2003-10-28 | |
US10/976,011 US20050172430A1 (en) | 2003-10-28 | 2004-10-28 | Wafer edge cleaning |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/245,744 Division US7900311B2 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US12/245,745 Division US20090044831A1 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050172430A1 true US20050172430A1 (en) | 2005-08-11 |
Family
ID=34830371
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/976,011 Abandoned US20050172430A1 (en) | 2003-10-28 | 2004-10-28 | Wafer edge cleaning |
US12/245,745 Abandoned US20090044831A1 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US12/245,744 Expired - Fee Related US7900311B2 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US13/042,085 Active US8099817B2 (en) | 2003-10-28 | 2011-03-07 | Wafer edge cleaning |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/245,745 Abandoned US20090044831A1 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US12/245,744 Expired - Fee Related US7900311B2 (en) | 2003-10-28 | 2008-10-04 | Wafer edge cleaning |
US13/042,085 Active US8099817B2 (en) | 2003-10-28 | 2011-03-07 | Wafer edge cleaning |
Country Status (1)
Country | Link |
---|---|
US (4) | US20050172430A1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060243304A1 (en) * | 2005-04-25 | 2006-11-02 | Applied Materials, Inc. | Methods and apparatus for cleaning an edge of a substrate |
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---|---|---|---|---|
US8658937B2 (en) | 2010-01-08 | 2014-02-25 | Uvtech Systems, Inc. | Method and apparatus for processing substrate edges |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US6230753B1 (en) * | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
US6550091B1 (en) * | 2000-10-04 | 2003-04-22 | Lam Research Corporation | Double-sided wafer edge scrubbing apparatus and method for using the same |
US20040049870A1 (en) * | 2002-06-21 | 2004-03-18 | Applied Materials, Inc. | Substrate scrubbing apparatus having stationary brush member in contact with edge bevel of rotating substrate |
US6910240B1 (en) * | 2002-12-16 | 2005-06-28 | Lam Research Corporation | Wafer bevel edge cleaning system and apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5862560A (en) * | 1996-08-29 | 1999-01-26 | Ontrak Systems, Inc. | Roller with treading and system including the same |
JP3610426B2 (en) * | 1998-06-04 | 2005-01-12 | 東京エレクトロン株式会社 | Substrate attitude control device |
US6269510B1 (en) * | 1999-01-04 | 2001-08-07 | International Business Machines Corporation | Post CMP clean brush with torque monitor |
US6272712B1 (en) * | 1999-04-02 | 2001-08-14 | Lam Research Corporation | Brush box containment apparatus |
EP1058296A2 (en) * | 1999-06-01 | 2000-12-06 | Applied Materials, Inc. | A roller for rotating a substrate |
US6594847B1 (en) * | 2000-03-28 | 2003-07-22 | Lam Research Corporation | Single wafer residue, thin film removal and clean |
US6622334B1 (en) * | 2000-03-29 | 2003-09-23 | International Business Machines Corporation | Wafer edge cleaning utilizing polish pad material |
KR100364601B1 (en) * | 2000-09-19 | 2002-12-16 | 삼성전자 주식회사 | Wafer flat zone aligner |
US7743449B2 (en) * | 2002-06-28 | 2010-06-29 | Lam Research Corporation | System and method for a combined contact and non-contact wafer cleaning module |
US20050172430A1 (en) * | 2003-10-28 | 2005-08-11 | Joseph Yudovsky | Wafer edge cleaning |
-
2004
- 2004-10-28 US US10/976,011 patent/US20050172430A1/en not_active Abandoned
-
2008
- 2008-10-04 US US12/245,745 patent/US20090044831A1/en not_active Abandoned
- 2008-10-04 US US12/245,744 patent/US7900311B2/en not_active Expired - Fee Related
-
2011
- 2011-03-07 US US13/042,085 patent/US8099817B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5861066A (en) * | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
US6230753B1 (en) * | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US6092253A (en) * | 1996-12-30 | 2000-07-25 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US6550091B1 (en) * | 2000-10-04 | 2003-04-22 | Lam Research Corporation | Double-sided wafer edge scrubbing apparatus and method for using the same |
US20040049870A1 (en) * | 2002-06-21 | 2004-03-18 | Applied Materials, Inc. | Substrate scrubbing apparatus having stationary brush member in contact with edge bevel of rotating substrate |
US6910240B1 (en) * | 2002-12-16 | 2005-06-28 | Lam Research Corporation | Wafer bevel edge cleaning system and apparatus |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090031511A1 (en) * | 2003-10-28 | 2009-02-05 | Applied Materials, Inc. | Wafer edge cleaning |
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US20110154590A1 (en) * | 2003-10-28 | 2011-06-30 | Applied Materials, Inc. | Wafer edge cleaning |
US7900311B2 (en) | 2003-10-28 | 2011-03-08 | Applied Materials, Inc. | Wafer edge cleaning |
US20090044831A1 (en) * | 2003-10-28 | 2009-02-19 | Applied Materials, Inc. | Wafer edge cleaning |
US20090038642A1 (en) * | 2005-04-25 | 2009-02-12 | Applied Materials, Inc. | Methods and apparatus for cleaning an edge of a substrate |
US20080216867A1 (en) * | 2005-04-25 | 2008-09-11 | Applied Materials, Inc. | Methods and apparatus for cleaning an edge of a substrate |
US20060243304A1 (en) * | 2005-04-25 | 2006-11-02 | Applied Materials, Inc. | Methods and apparatus for cleaning an edge of a substrate |
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JP4486003B2 (en) * | 2005-07-07 | 2010-06-23 | 大日本スクリーン製造株式会社 | Substrate cleaning brush, and substrate processing apparatus and substrate processing method using the same |
US8127391B2 (en) | 2007-07-26 | 2012-03-06 | Dainippon Screen Mfg. Co., Ltd. | Subtrate treatment apparatus |
KR101014507B1 (en) * | 2007-07-26 | 2011-02-14 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Substrate treatment apparatus |
KR101001061B1 (en) * | 2007-07-26 | 2010-12-14 | 가부시키가이샤 소쿠도 | Substrate cleaning device and substrate processing apparatus including the same |
US20090025763A1 (en) * | 2007-07-26 | 2009-01-29 | Masahiro Nonomura | Subtrate treatment apparatus |
US20090025155A1 (en) * | 2007-07-26 | 2009-01-29 | Sokudo Co., Ltd. | Substrate Cleaning Device And Substrate Processing Apparatus Including The Same |
US8286293B2 (en) * | 2007-07-26 | 2012-10-16 | Sokudo Co., Ltd. | Substrate cleaning device and substrate processing apparatus including the same |
US20100105290A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for indicating a polishing tape end |
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Also Published As
Publication number | Publication date |
---|---|
US8099817B2 (en) | 2012-01-24 |
US20090031511A1 (en) | 2009-02-05 |
US7900311B2 (en) | 2011-03-08 |
US20090044831A1 (en) | 2009-02-19 |
US20110154590A1 (en) | 2011-06-30 |
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Owner name: APPLIED MATERIALS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YUDOVSKY, JOSEPH;COULIN, ANNE-DOUCE;VOLFOVSKI, LEON;REEL/FRAME:016070/0523;SIGNING DATES FROM 20041206 TO 20041207 |
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