US20050168906A1 - Contact sensor package - Google Patents

Contact sensor package Download PDF

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Publication number
US20050168906A1
US20050168906A1 US11/044,027 US4402705A US2005168906A1 US 20050168906 A1 US20050168906 A1 US 20050168906A1 US 4402705 A US4402705 A US 4402705A US 2005168906 A1 US2005168906 A1 US 2005168906A1
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United States
Prior art keywords
contact sensor
sensor chip
ground member
ground
chip package
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Granted
Application number
US11/044,027
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US7193282B2 (en
Inventor
Gwo-Liang Weng
Che-Ya Chou
Shih-Chang Lee
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Advanced Semiconductor Engineering Inc
Original Assignee
Advanced Semiconductor Engineering Inc
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Filing date
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Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC. reassignment ADVANCED SEMICONDUCTOR ENGINEERING, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOU, CHE-YA, LEE, SHIH-CHANG, WENG, GWO--LIANG
Publication of US20050168906A1 publication Critical patent/US20050168906A1/en
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Publication of US7193282B2 publication Critical patent/US7193282B2/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Definitions

  • This invention relates to a contact sensor chip package. More particularly, the present invention is related to a contact sensor chip package with a ground member to eliminate static electricity remaining on the chip.
  • the contact sensor chip packages are applied to many electrical devices, such as displays and fingerprint sensors. Due to the requirement of marketing, the circuits of the chips are designed to be very fine in order to process complex electrical signals.
  • an objective of this invention is to provide a contact sensor chip package with ground member to eliminate the static electricity on the chip.
  • a contact sensor chip package wherein the contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation.
  • the contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area.
  • the ground member is disposed on the ground pad of the substrate and electrically connected to the ground pad.
  • the encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.
  • FIG. 1 is a perspective view of a contact sensor chip package according to the first embodiment
  • FIG. 2 is a cross-sectional view along line 2 - 2 of the contact sensor chip package according to the first embodiment of FIG. 1 ;
  • FIG. 3 is a cross-sectional view along line 3 - 3 of the contact sensor chip package according to the first embodiment of FIG. 1 ;
  • FIG. 4 is a cross-sectional view along line 4 - 4 of the contact sensor chip package according to the first embodiment of FIG. 1 ;
  • FIG. 5 is a cross-sectional view of a contact sensor chip package according to the second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a contact sensor chip package according to the third embodiment of the present invention.
  • a contact sensor chip package 100 mainly comprises a substrate 102 , a contact sensor chip 104 , a plurality of ground members 106 and an encapsulation 108 .
  • the contact sensor chip 104 is disposed on the substrate 102 .
  • the ground members are disposed close to the contact sensor chip 104 .
  • the encapsulation 108 covers the contact sensor chip 104 and the ground member 106 , wherein the sensor area 104 a of the contact sensor chip 104 and a portion of the ground members 106 are exposed out of the encapsulation 108 .
  • the substrate 102 can be a ceramic substrate, a glass substrate or an organic substrate. As shown in FIG. 3 , the substrate 102 comprises a plurality of pads 102 a and 102 b . The pads 102 a and 102 b are respectively disposed on the upper and bottom surfaces. At least one of the pads 102 a is ground pad, which is connected to the pad 102 b through the electrical traces formed in the substrate 102 .
  • the contact sensor chip package 100 can be a fingerprint sensor chip package which is used for the personal identification and verification.
  • the contact sensor chip is a fingerprint sensor chip or other sliding contact senor chip.
  • the contact sensor chip 104 has a plurality of sensor electrodes (not show in the figures), which are disposed on the sensor area 104 a of the chip surface.
  • FIG. 2 is a cross-sectional view along line 2 - 2 of the contact sensor chip package according to the FIG. 1 . As shown in FIG. 2 , the contact sensor chip 104 is electrically connected to the substrate 102 through the bonding wires 105 . When the users' fingers or other objects contact the sensor area 104 exposed out of the encapsulation, the static electricity will be produced. The static electricity will cause the circuit of the chip being damaged.
  • FIG. 3 is a cross-sectional view along line 3 - 3 of the contact sensor chip package according to the FIG. 1 .
  • the present invention provides ground members 106 disposed close to the contact sensor chip 104 , wherein the ground members 106 are electrically connected to the ground pad of the substrate 102 .
  • the substrate has a plurality of ground pad 102 b .
  • Each of the ground members 106 is physically and electrically connected to each ground pad 102 b . Therefore, when the static electricity is formed on the chip due to friction, the static electricity will be removed through the ground member 106 .
  • the ground member 106 is a solder ball.
  • FIG. 4 is a cross-sectional view along line 4 - 4 of the contact sensor chip package according to the FIG. 1 .
  • the ground member 106 is higher than the contact sensor chip 104 , or the elevation of the ground member 106 and the contact sensor chip 104 are the same. Therefore, when the users' fingers contact the ground member 106 , the static electricity will be removed effectively.
  • the encapsulation 108 covers the contact sensor chip 104 and the ground member 106 , which is used for protecting the contact sensor chip 104 and the bonding wires 105 . Besides, The encapsulation 108 can prevent the moisture from entering into the contact sensor chip package 100 . The sensor area 104 a of the contact sensor chip 104 and the top of the ground members 106 are exposed out of the encapsulation.
  • a contact sensor chip package 500 there is provided a contact sensor chip package 500 .
  • the ground member is a metal lump 502 disposed onto the ground pad 102 b .
  • the upper surface of the metal lump 502 is exposed out of the encapsulation 108 and the upper surface is flush with the encapsulation.
  • the metal lump 502 is disposed on the ground pad 102 a through the conductive adhesive (not shown in the figures).
  • a contact sensor chip package 600 there is provided a contact sensor chip package 600 .
  • the ground member is a concave-convex metal plate 602 disposed on the ground pad 102 b . A portion of the upper surface of the concave-convex metal plate 602 is exposed out of the encapsulation 108 .
  • the concave-convex metal plate 602 is disposed on the ground pad 102 b through the conductive adhesive (not shown in the figures).
  • the ground member is made of metal or high thermal conductive material, so the ground member can increase the reliability of heat dissipation.

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

A contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate, and the ground member is electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of Invention
  • This invention relates to a contact sensor chip package. More particularly, the present invention is related to a contact sensor chip package with a ground member to eliminate static electricity remaining on the chip.
  • 2. Related Art
  • The contact sensor chip packages are applied to many electrical devices, such as displays and fingerprint sensors. Due to the requirement of marketing, the circuits of the chips are designed to be very fine in order to process complex electrical signals.
  • However, when the users' fingers or other objects contact the sensor area exposed out of the encapsulation, the static electricity will be produced. The static electricity will cause the internal circuits of the chip being damaged. In the present technology, one of the methods for eliminating the static electricity remaining on the chip is to design special circuits in the chip. However, such design will increase the cost.
  • Consequently, providing a contact sensor chip package to solve the mentioned-above disadvantages is the most important task in this invention.
    • SUMMARY OF THE INVENTION
  • In view of the above-mentioned problems, an objective of this invention is to provide a contact sensor chip package with ground member to eliminate the static electricity on the chip.
  • To achieve the above-mentioned objective, a contact sensor chip package is provided, wherein the contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate and electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.
  • When the users contact the sensor area exposed out of the encapsulation, the static electricity due to friction will be eliminated through the ground member disposed on the ground pad of the substrate. Accordingly, the contact sensor chip will not be damaged by the static electricity remaining on the chip.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The invention will become more fully understood from the detailed description given herein below illustrations only, and thus are not limitative of the present invention, and wherein:
  • FIG. 1 is a perspective view of a contact sensor chip package according to the first embodiment;
  • FIG. 2 is a cross-sectional view along line 2-2 of the contact sensor chip package according to the first embodiment of FIG. 1;
  • FIG. 3 is a cross-sectional view along line 3-3 of the contact sensor chip package according to the first embodiment of FIG. 1;
  • FIG. 4 is a cross-sectional view along line 4-4 of the contact sensor chip package according to the first embodiment of FIG. 1;
  • FIG. 5 is a cross-sectional view of a contact sensor chip package according to the second embodiment of the present invention; and
  • FIG. 6 is a cross-sectional view of a contact sensor chip package according to the third embodiment of the present invention.
    • DETAILED DESCRIPTION OF THE INVENTION
  • The contact sensor chip package according to the preferred embodiments of this invention will be described herein below with reference to the accompanying drawings, wherein the same reference numbers refer to the same elements.
  • In accordance with a first preferred embodiment as shown in FIG. 1, there is provided a contact sensor chip package 100. The contact sensor chip package 100 mainly comprises a substrate 102, a contact sensor chip 104, a plurality of ground members 106 and an encapsulation 108. The contact sensor chip 104 is disposed on the substrate 102. The ground members are disposed close to the contact sensor chip 104. The encapsulation 108 covers the contact sensor chip 104 and the ground member 106, wherein the sensor area 104 a of the contact sensor chip 104 and a portion of the ground members 106 are exposed out of the encapsulation 108.
  • The substrate 102 can be a ceramic substrate, a glass substrate or an organic substrate. As shown in FIG. 3, the substrate 102 comprises a plurality of pads 102 a and 102 b. The pads 102 a and 102 b are respectively disposed on the upper and bottom surfaces. At least one of the pads 102 a is ground pad, which is connected to the pad 102 b through the electrical traces formed in the substrate 102.
  • The contact sensor chip package 100 can be a fingerprint sensor chip package which is used for the personal identification and verification. In the embodiments, the contact sensor chip is a fingerprint sensor chip or other sliding contact senor chip. The contact sensor chip 104 has a plurality of sensor electrodes (not show in the figures), which are disposed on the sensor area 104 a of the chip surface. FIG. 2 is a cross-sectional view along line 2-2 of the contact sensor chip package according to the FIG. 1. As shown in FIG. 2, the contact sensor chip 104 is electrically connected to the substrate 102 through the bonding wires 105. When the users' fingers or other objects contact the sensor area 104 exposed out of the encapsulation, the static electricity will be produced. The static electricity will cause the circuit of the chip being damaged.
  • FIG. 3 is a cross-sectional view along line 3-3 of the contact sensor chip package according to the FIG. 1. As shown in FIG. 2 and FIG. 3, the present invention provides ground members 106 disposed close to the contact sensor chip 104, wherein the ground members 106 are electrically connected to the ground pad of the substrate 102. For example, the substrate has a plurality of ground pad 102 b. Each of the ground members 106 is physically and electrically connected to each ground pad 102 b. Therefore, when the static electricity is formed on the chip due to friction, the static electricity will be removed through the ground member 106. In the embodiment, the ground member 106 is a solder ball. FIG. 4 is a cross-sectional view along line 4-4 of the contact sensor chip package according to the FIG. 1. As shown in FIG. 4, the ground member 106 is higher than the contact sensor chip 104, or the elevation of the ground member 106 and the contact sensor chip 104 are the same. Therefore, when the users' fingers contact the ground member 106, the static electricity will be removed effectively.
  • The encapsulation 108 covers the contact sensor chip 104 and the ground member 106, which is used for protecting the contact sensor chip 104 and the bonding wires 105. Besides, The encapsulation 108 can prevent the moisture from entering into the contact sensor chip package 100. The sensor area 104 a of the contact sensor chip 104 and the top of the ground members 106 are exposed out of the encapsulation.
  • In accordance with a second preferred embodiment as shown in FIG. 5, there is provided a contact sensor chip package 500. The ground member is a metal lump 502 disposed onto the ground pad 102 b. The upper surface of the metal lump 502 is exposed out of the encapsulation 108 and the upper surface is flush with the encapsulation. The metal lump 502 is disposed on the ground pad 102 a through the conductive adhesive (not shown in the figures).
  • In accordance with a third preferred embodiment as shown in FIG. 6, there is provided a contact sensor chip package 600. The ground member is a concave-convex metal plate 602 disposed on the ground pad 102 b. A portion of the upper surface of the concave-convex metal plate 602 is exposed out of the encapsulation 108. The concave-convex metal plate 602 is disposed on the ground pad 102 b through the conductive adhesive (not shown in the figures).
  • When the users contact the sensor area exposed out of the encapsulation, the static electricity produced due to friction will be eliminated through the ground member disposed on the ground pad of the substrate. Accordingly, the contact sensor chip will not be damaged by the static electricity remaining on the chip. Besides, the ground member is made of metal or high thermal conductive material, so the ground member can increase the reliability of heat dissipation.
  • Although the invention has been described in considerable detail with reference to certain preferred embodiments, it will be appreciated and understood that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (9)

1. A contact sensor chip package, comprising:
a substrate having a ground pad;
a contact sensor chip disposed on the substrate, wherein the contact sensor chip has a sensor area;
a ground member disposed on the ground pad of the substrate, wherein the ground member is electrically connected to the ground pad; and
an encapsulation covering the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.
2. The contact sensor chip package of claim 1, wherein the contact sensor chip is a sliding contact sensor chip.
3. The contact sensor chip package of claim 1, wherein the contact sensor chip is a fingerprint contact sensor chip.
4. The contact sensor chip package of claim 1, wherein the top of the ground member and the upper surface of the contact sensor chip are at the same elevation.
5. The contact sensor chip package of claim 1, wherein the top of the ground member is higher than the upper surface of the contact sensor chip.
6. The contact sensor chip package of claim 1, wherein the ground member is disposed close to the contact sensor chip.
7. The contact sensor chip package of claim 1, wherein the ground member is a solder ball.
8. The contact sensor chip package of claim 1, wherein the ground member is a metal lump having an upper surface exposed out of the encapsulation and the upper surface is flush with the encapsulation.
9. The contact sensor chip package of claim 1, wherein the ground member is a concave-convex metal plate.
US11/044,027 2004-01-30 2005-01-28 Contact sensor package Active 2025-09-19 US7193282B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW093102125 2004-01-30
TW093102125A TWI231584B (en) 2004-01-30 2004-01-30 Contact sensor package and method for making the same

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US20050168906A1 true US20050168906A1 (en) 2005-08-04
US7193282B2 US7193282B2 (en) 2007-03-20

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI515665B (en) 2015-03-25 2016-01-01 速博思股份有限公司 Finger-swiping biometric recognition apparatus
DE102020108927A1 (en) 2020-03-31 2021-09-30 Infineon Technologies Ag Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6028773A (en) * 1997-11-14 2000-02-22 Stmicroelectronics, Inc. Packaging for silicon sensors
US6804121B2 (en) * 2000-03-24 2004-10-12 Infineon Technologies Ag Housing for biometric sensor chips and method for producing the housing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6028773A (en) * 1997-11-14 2000-02-22 Stmicroelectronics, Inc. Packaging for silicon sensors
US6804121B2 (en) * 2000-03-24 2004-10-12 Infineon Technologies Ag Housing for biometric sensor chips and method for producing the housing

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US7193282B2 (en) 2007-03-20
TW200525716A (en) 2005-08-01
TWI231584B (en) 2005-04-21

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