US20050062024A1 - Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof - Google Patents

Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof Download PDF

Info

Publication number
US20050062024A1
US20050062024A1 US10/903,462 US90346204A US2005062024A1 US 20050062024 A1 US20050062024 A1 US 20050062024A1 US 90346204 A US90346204 A US 90346204A US 2005062024 A1 US2005062024 A1 US 2005062024A1
Authority
US
United States
Prior art keywords
ohm
substrate
sensitive adhesive
volume resistivity
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/903,462
Inventor
Michael Bessette
Sankar Paul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
World Properties Inc
Original Assignee
World Properties Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Properties Inc filed Critical World Properties Inc
Priority to US10/903,462 priority Critical patent/US20050062024A1/en
Assigned to WORLD PROPERTIES, INC. reassignment WORLD PROPERTIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BESSETTE, MICHAEL D., PAUL, SANKAR K.
Publication of US20050062024A1 publication Critical patent/US20050062024A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane
    • C09J2483/006Presence of polysiloxane in the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • pressure sensitive adhesive or “PSA” is used herein in its conventional sense to mean that the composition is formulated to have a glass transition temperature, surface energy, and/or other properties such that it exhibits some degree of tack at normal room temperature.
  • the constituent polymers and/or copolymers of the composition generally will have a glass transition temperature of less than about 0° C. such that the mass of the composition is tacky at ambient temperatures and is thereby bondable under an applied pressure to a surface or other substrate.
  • Backing layer 20 has a first side or surface 24 and an opposing second side or surface 26 .
  • Adhesive layer 22 may be coated or laminated on, or otherwise bonded to or in intimate contact with second side 26 of the backing layer 20 to provide the laminar structure of tape 10 .
  • a second adhesive layer 22 may be coated on backing layer first side 24 (not shown).
  • Adhesive layer 22 has an inner face 30 adhesively or otherwise bonded to second side 26 , and an opposite outer face 32 that is adhesively bondable under an applied pressure to a surface of a substrate.
  • Suitable (meth)acrylate pressure sensitive adhesives are disclosed, for example, in U.S. Pat. No. 4,223,067; U.S. Pat. No. 4,181,752 U.S. Pat. No. 5,183,833; U.S. Pat. No. 5,645,764, and U.S. Pat. No. Re. 24,906.
  • Suitable compositions are also commercially available, for example from Ashland Chemicals under the trade name AEROSET.
  • the resulting composition is coated onto a substrate (which may be transparent to ultraviolet radiation) and polymerized in an inert (i. e., oxygen free) atmosphere, e.g., a nitrogen atmosphere by exposure to ultraviolet radiation.
  • an inert atmosphere i. e., oxygen free
  • suitable substrates include release liners (e.g., silicone release liners) and tape backings (which may be primed or unprimed paper or plastic).
  • a sufficiently inert atmosphere can also be achieved by covering a layer of the polymerizable coating with a plastic film which is substantially transparent to ultraviolet radiation, and irradiating through that film in air as described in the aforementioned Martens et al. patent using ultraviolet lamps.
  • the electronic components of the fixture are allowed to warm up and, in the case of the HP 34420 A, the internal calibration checks are done.
  • the samples are allowed to equilibrate, for a period of 24 hours, to the conditions of the test environment.
  • Typical test environment is 50% Relative Humidity (% RH) with a room temp of 23° C. (70° F.).

Abstract

An adhesive, comprising a pressure-sensitive adhesive composition; and carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive. Such adhesives are of particular use with gasketing materials.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims the benefit of the filing of U.S. Provisional Application No. 60/493,181, filed Aug. 6, 2003, which is incorporated herein by reference in its entirety.
  • BACKGROUND
  • This invention relates to electrically conductive pressure sensitive adhesives, methods of manufacture, and uses thereof.
  • Electrically conductive materials, particularly elastomers and foams, are of utility in a wide variety of applications such as electrical contacting devices, in sensors, and in applications requiring EMI/RFI shielding and/or electrostatic dissipation. Electrically conductive addition cure silicone compositions have been described, for example, in U.S. Pat. No. 5,932,145 to Mitani et al., U.S. Pat. No. 6,017,587 to Kleyer et al., European Patent No. 0 839 870, and European Patent No. 0 971 367. Other electrically conductive elastomers and foams are also known, for example polyurethanes and polyolefins.
  • It is often desirable in the above applications to use an electrically conductive adhesive, particularly a pressure-sensitive adhesive (PSA), to adhere the elastomer or foam to a substrate. Electrical conductivity is most often achieved in PSAs by adding electrically conductive fillers such as particulate polyaniline (see U.S. Pat. No. 5,645,764); particulate metals such as silver or copper (see U.S. Pat. No. 3,475,213 and U.S. Pat. No. 4,258,100); and carbonyl nickel powder (U.S. Pat. No. 3,762,946). Incorporation of enough filler to produce the desired conductivity can be difficult, however, especially without significantly adversely affecting the properties of the adhesive such as tack, peel strength, shear, and the like.
  • There accordingly remains a need in the art for compositions and methods whereby pressure sensitive adhesives can be provided with electrical conductivity without significant adverse effect on one or more physical properties desired for a particular application.
  • BRIEF SUMMARY
  • The above-described drawbacks and disadvantages are alleviated by a pressure sensitive adhesive comprising a pressure sensitive adhesive composition and carbon nanotubes in an amount effective to render the pressure sensitive adhesive electrically conductive. Use of carbon nanotubes allows the pressure sensitive adhesive compositions to attain a volume resistivity of about 10−3 ohm-cm to about 108 ohm-cm without significantly adversely affecting the properties of the compositions such as peel strength, tack, and shear.
  • Further disclosed is the above-described composition in the form of a tape, and an article comprising the electrically conductive pressure sensitive adhesive disposed on a substrate. The adhesives, tapes, and articles are of particular utility in applications such as EMI/RFI shielding, sensors, electrical contacts, and the like. The above discussed and other features and advantages of the present invention will be appreciated and understood by those skilled in the art from the following detailed description.
  • BRIEF DESCRIPTION OF THE FIGURE
  • The invention is illustrated by the following Figure, which is a cross-sectional view of on embodiment of an adhesive tape of the present invention.
  • DETAILED DESCRIPTION
  • The inventors hereof have unexpectedly found that carbon nanotubes can be used to confer high electrical conductivity to pressure sensitive adhesives without significantly affecting the physical properties of the adhesives. The adhesives are particularly suitable for use in adhering elastomers and foams that can provide electromagnetic shielding and/or electrostatic dissipation to articles. Uses include applications involving complicated geometries and forms, such as in computers, personal digital assistants, cell phones, medical diagnostics, and other wireless digital devices, electronic goods such as cassette and digital versatile disk players, as well as in automobiles, ships and aircraft, and the like, where high strength to weight ratios are desirable.
  • As used herein, the term “carbon nanotube” is inclusive of a variety of very small carbon fibers having average diameters of less than or equal to about 2000 nanometers (nm) and having graphitic or partially graphitic structures. Suitable carbon nanotubes include those wherein the outer surface of the graphitic or carbon layers is derivatized, for example bonded to a plurality of oxygen-containing groups such as carbonyl, carboxylic acid, carboxylic acid ester, epoxy, vinyl ester, hydroxy, alkoxy, isocyanate, or amide group, or derivatives thereof, for example, sulfhydryl, amino, or imino groups.
  • Suitable carbon nanotubes for imparting electrical conductivity to the pressure sensitive adhesive compositions have diameters of about 0.5 to about 2000 nm, with aspect ratios greater than or equal to about 5. Preferably, the carbon nanotubes have an aspect ratio greater than or equal to about 10, more preferably greater than or equal to about 100, and even more preferably greater than or equal to about 1000. Carbon nanotubes as defined herein include vapor grown carbon nanofibers (VGCF) and multi-wall and single carbon nanotubes obtained from processes such as laser ablation, carbon arc, chemical vapor deposition and other processes.
  • The VGCF have diameters of about 3.5 to about 2000 nm and are generally produced by chemical vapor deposition. Within this range, the VGCF generally have diameters of greater than or equal to about 3, preferably greater than or equal to about 4.5, and more preferably greater than or equal to about 5 nm. Also desirable within this range are diameters of less than or equal to about 1000, preferably less than or equal to about 500, and more preferably less than or equal to about 100, and even more preferably less than or equal to about 50 nm. The VGCF may be hollow or solid and may have outer surfaces comprising amorphous or graphitic carbon. Solid VGCF are often referred to as carbon nanofibers. VGCF typically exist in the form of clusters, often referred to as aggregates or agglomerates, which may or may not contain embedded catalyst particles utilized in their production.
  • Other carbon nanotubes are presently produced by laser-evaporation of graphite or by carbon arc synthesis, yielding fullerene-related structures that comprise graphene cylinders that may be open or closed at either end with caps containing pentagonal and/or hexagonal rings. These nanotubes may have a single wall of carbon, and are therefore generally called single wall carbon nanotubes. Preferred single wall carbon nanotubes have a diameter of about 0.5 to about 3 nm. Within this range it is desirable to use single wall carbon nanotubes having diameters of greater than or equal to about 0.6, preferably greater than or equal to about 0.7 nm. Also desirable within this range are single wall carbon nanotubes having diameters less than or equal to about 2.8, preferably less than or equal to about 2.7, and more preferably less than or equal to about 2.5 nm.
  • Carbon nanotubes having multiple concentrically arranged walls produced by laser-evaporation of graphite or by carbon arc synthesis are generally called multiwall carbon nanotubes. Multiwall nanotubes used in the polymeric foams and elastomers generally have diameters of about 2 nm to about 50 nm. Within this range it is generally desirable to have diameters greater than or equal to about 3, preferably greater than or equal to about 4, and more preferably greater than or equal to about 5 nm. Also desirable within this range are diameters of less than or equal to about 45, preferably less than or equal to about 40, more preferably less than or equal to about 35, even more preferably less than or equal to about 25, and most preferably less than or equal to about 20 nm. Single wall or multiwall carbon nanotubes generally exist in the form of clusters, (also often referred to as agglomerates and aggregates) and may or may not contain embedded catalyst particles utilized in their production. Single wall carbon nanotubes tend to exist in the form of ropes due to Van der Waal forces, and clusters formed by these ropes may also be used. Single wall nanotubes may be metallic or semi-conducting. It is preferable to use compositions having as high a weight percentage of metallic carbon nanotubes as possible for purposes of electromagnetic shielding.
  • Carbon nanotubes containing impurities such as amorphous carbon or soot, as well as catalytic materials such as iron, nickel, copper, aluminum, yttrium, cobalt, sulfur, platinum, gold, silver, or the like, or combinations comprising at least one of the foregoing catalytic materials, may also be used. In one embodiment, the carbon nanotubes may contain impurities in an amount less than or equal to about 80 weight percent (wt %), preferably less than or equal to about 60 wt %, more preferably less than or equal to about 40 wt %, and most preferably less than or equal to about 20 wt %, based upon the total weight of the carbon nanotubes and the impurities.
  • Effective amounts of VGCF, single wall, and/or multiwall carbon nanotubes, alone or in combination, will vary depending on the nature of the adhesive, the nature of the nanotubes, the intended use, the desired electrical conductivity, and similar factors, and can be readily determined by one of ordinary skill in the art. In general, the nanotubes will comprise about 0.0001 to about 50 wt % of the total weight of the pressures sensitive adhesive composition. Within this range, it is generally desirable to have the carbon nanotubes present in an amount of greater than or equal to about 0.05, preferably greater than or equal to about 0.1 of the total weight of the adhesive composition. Also desirable are carbon nanotubes present in an amount less than or equal to about 40, preferably less than or equal to about 20, and more preferably less than or equal to about 5 wt % of the total weight of the composition.
  • Other electrically conductive fillers may be used in addition to the carbon nanotubes, for example carbon black, carbon fibers such as PAN fibers, metal-coated fibers or spheres such as metal-coated glass fibers, metal-coated carbon fibers, metal-coated organic fibers, metal-coated ceramic spheres, metal-coated glass beads and the like, inherently conductive polymers such as polyaniline, polypyrrole, polythiophene in particulate or fibril form, conductive metal oxides such as tin oxide or indium tin oxide, and combinations comprising at least one of the foregoing conductive fillers may also be used. The amount of these fillers is preferably selected so as to not adversely affect the final properties of the pressure sensitive adhesive compositions. Typical amounts, when present, are about 0.1 to about 50 wt % based on the total weight of the composition. Within this range it is generally desirable to have an amount of greater than or equal to about 1.0, preferably greater than or equal to about 5 wt % of the total weight of the composition. Also desirable is an amount of less than or equal to about 40, more preferably less than or equal to about 25 wt %, of the total weight of the composition.
  • The term “pressure sensitive adhesive” or “PSA” is used herein in its conventional sense to mean that the composition is formulated to have a glass transition temperature, surface energy, and/or other properties such that it exhibits some degree of tack at normal room temperature. Thus, the constituent polymers and/or copolymers of the composition generally will have a glass transition temperature of less than about 0° C. such that the mass of the composition is tacky at ambient temperatures and is thereby bondable under an applied pressure to a surface or other substrate. In general, the formulation of the adhesive composition specifically may be selected to exhibit an affinity, as may be measured by lap shear, die shear, static or dynamic shear, peel, or other adhesion, to the material forming the substrate or substrates involved in the particular application, but which affinity is less than to the material forming a backing layer as described below. Such adhesion affinities may depend particularly on the surface energy of the materials involved, and may be developed from surface tension, valence, polar, electrostatic, van der Waals, or other attractive forces, mechanical interlocking action, or a combination thereof.
  • In use, pressure sensitive adhesives are generally provided in the form of a tape. An exemplary embodiment of a pressure sensitive adhesive tape is shown generally at FIG. 1, and comprises tape 10, which may have an overall thickness of between about 0.5 and about 10 mils, may be provided in the form of, or as formed from, a sheet, roll, tape, die-cut part, or the like. Tape 10, which may be of an indefinite length and/or width, includes a backing strip, sheet, or other generally flat layer 20, an adhesive layer 22 on at least one side or portion of backing layer 20, and, optionally, a release liner 24 for covering adhesive layer 22 during shipping and handling. Although adhesive layer 22 is shown as being coated on substantially the entirety of backing layer 20, adhesive layer 22 may alternatively be applied in a pattern or otherwise to cover only a portion of backing layer 20. For most applications, backing layer 20 can have a thickness of about 0.5-8 mils (0.013-0.203 mm), with adhesive layer 22 having a thickness of about 0.5-2.5 mils (0.013-0.064 mm).
  • Backing layer 20 has a first side or surface 24 and an opposing second side or surface 26. Adhesive layer 22 may be coated or laminated on, or otherwise bonded to or in intimate contact with second side 26 of the backing layer 20 to provide the laminar structure of tape 10. Depending on the intended application, a second adhesive layer 22 may be coated on backing layer first side 24 (not shown). Adhesive layer 22 has an inner face 30 adhesively or otherwise bonded to second side 26, and an opposite outer face 32 that is adhesively bondable under an applied pressure to a surface of a substrate.
  • Backing layer 20 may be a formed of a synthetic, natural, or glass fiber fabric, paper, or foamed or unfoamed plastic, resin, elastomer, or other polymeric or other material conventionally used in tape construction. In one embodiment, backing layer 20 is removable after bonding of adhesive layer 22 to the surface of a substrate. A second substrate may then be applied to the exposed face 30. In another embodiment, for example EMI shielding applications, backing layer 20 can be formed of an electrically-conductive material such as a conductive polymer, a conductive metal foil, or a cloth plated with a conductive metal such as copper, aluminum, nickel, silver, or alloys or mixtures comprising at least one of the foregoing conductive metals. Where similar materials are used for the substrate and backing layer 20, the backing layer second side 26 may be coated, prior to the application of the adhesive layer, with a higher surface energy “tie” layer so as to increase the affinity of the adhesive layer 22 thereto relative to the substrate surface. Such tie layer may be formed as a chemical bond coat, such as a thermoplastic dissolved in a solvent, which is applied to the side 26 and dried or otherwise cured thereon to form an intermediate tie layer between the side and the adhesive layer 22. Alternatively, other known surface treatments may employed such as cleaning or roughening the side 26 with one or more of compressed gas, chemical or solvent etching/cleaning, grit blasting, such as with aluminum oxide or other abrasive, or plasma, such as may be generated from the ionization of oxygen, argon, or another gas or mixture of gases.
  • Exemplary release liners 24 include face stocks or other films of polyolefins, plasticized polyvinyl chloride, polyesters, cellulosics, metal foils, composites, and waxed, siliconized, or other coated paper or plastic having a relatively low surface energy to be removable without appreciable lifting of the adhesive layer 22 from the backing layer 20.
  • Manufacture of the pressure sensitive adhesives is by processes recognized in the art. In general, the compositions for formation of the adhesive, additives, e.g., catalyst, crosslinking agent, additional fillers, and the like (which are described in further detail below), and the carbon nanotubes are mixed, frothed and/or blown if desired, shaped (e.g., cast), then cured, if applicable. Stepwise addition of the various components may also be used, e.g., the carbon nanotubes may be provided in the form of a masterbatch, and added after the other components are mixed.
  • During manufacture, it is generally desirable to disentangle any clusters, aggregates or agglomerates of carbon nanotubes with minimal damage to the aspect ratio, in order to provide enhanced electrical conductivity, in particular enhanced electromagnetic shielding or electrostatic dissipative properties at lower weight percentages of nanotubes. It may therefore be desirable that any mixing during manufacture be carried out at as low a viscosity as possible, as mixing at lower viscosities substantially reduces the shear forces acting on the nanotubes. Accordingly, it may be desirable to use a removable solvent or diluent (.g., an organic solvent and/or water) during mixing, to substantially reduce the melt viscosity of the composition. The diluent may be removed after some or all of the dispersion of the nanotubes in the elastomer is completed. Alternatively, the nanotubes may be pre-disbursed at a higher concentration in at least one of the adhesive components, i.e., masterbatch. In the preparation of foamed adhesives, it may be desirable to introduce desired blowing agents into the composition prior to the introduction of the nanotubes to facilitate dispersion while minimizing damage to the nanotubes. The blowing of the foam may produce a similar effect, in that it disentangles nanotubes with-low or minimal damage to the aspect ratio, because the expansion of any polymer trapped in a nanotube cluster or agglomerate or aggregate may cause the disentangling of the individual nanotubes with minimal damage. Thus, mixing nanotubes with the polymer at a reduced viscosities and subsequently foaming the polymer may achieve excellent conductivity at low loading levels, because of the preservation of nanotube aspect ratio. Low carbon nanotube loading aids in preserving the desirable physical properties of the adhesives.
  • Accordingly, in the production of commercial quantities of tape 10, the formulation for the adhesive layer 22 may be compounded in a conventional mixing apparatus as an admixture of a PSA composition, the carbon nanotubes, any additional fillers and/or additives, and a solvent or diluent. The formulation may be coated or otherwise applied to side 26 of the backing layer 20 in a conventional manner such as, for example, by a direct process such as spraying, knife coating, roller coating, casting, drum coating, dipping, dispensing, extrusion, screen printing, or like, or an indirect transfer process. After coating, the resultant film may be dried to remove the solvent or otherwise cured or cooled to develop an adherent film on backing layer 20. Curing, where used, is inclusive of polymerization, crosslinking, vulcanization, or otherwise chemical or physical changes that result in formation of a generally solid film from the applied composition. As a result of the inherent tack of the PSA film, an adhesive and/or mechanical bond may be developed between the layers 20 and 22 to form the integral, laminate structure of tape 10. Alternatively, the adhesive layer 22 may be separately formed and laminated under conditions of elevated temperature and/or pressure to the backing layer 20 in a separate operation.
  • A variety of pressure sensitive adhesive formulations may be suitable for use with the carbon nanotubes, and include film-forming materials such as a natural or synthetic rubber or elastomer, or other resin, plastic, or polymer exhibiting rubber-like properties of compliancy, resiliency or compression deflection, low compression set, flexibility, and an ability to recover after deformation. Examples of such materials include styrene-butadienes, styrene-isoprenes, polybutadienes, polyisobutylenes, polyurethanes, silicones, fluorosilicones and other fluoropolymers, chlorosulfonates, butyls, neoprenes, nitriles, polyisoprenes, plasticized nylons, polyesters, polyvinyl ethers, polyvinyl acetates, polyisobutylenes, ethylene vinyl acetates, polyolefins, and polyvinyl chlorides, copolymer rubbers such as ethylene-propylene (EPR), ethylene-propylene-diene monomer (EPDM), styrene-isoprene-styrene (SIS), styrene-butadiene-styrene (SBS), nitrile-butadienes (NBR) and styrene-butadienes (SBR), blends such as ethylene or propylene-EPDM, EPR, or NBR, and mixtures, blends, and copolymers thereof.
  • These materials may be compounded with a tackifier, which may be a resin such as glyceryl esters of hydrogenated resins, thermoplastic terpene resins, petroleum hydrocarbon resins, coumarone-indene resins, synthetic phenol resins, low molecular weight polybutenes, or a tackifying silicone. Generally, the tackifying resin may be compounded into the resin material at between about 40-150 parts per hundred parts of the resin.
  • Additional fillers and additives may be included in the PSA composition depending upon the requirements of the particular application, for example conventional wetting agents or surfactants, pigments, dyes, and other colorants, opacifying agents, anti-foaming agents, anti-static agents, coupling agents such as titanates, chain extending oils, lubricants, stabilizers, emulsifiers, antioxidants, thickeners, and/or flame retardants such as aluminum trihydrate, antimony trioxide, metal oxides and salts, intercalated graphite particles, phosphate esters, brominated diphenyl compounds such as decabromodiphenyl oxide, borates, phosphates, halogenated compounds, glass, silica, silicates, and mica. Typically, these fillers and additives are blended or otherwise admixed with the formulation, and may comprise between about 0.05-80% or more by total volume thereof.
  • Aqueous pressure sensitive adhesive compositions are useful with carbon nanotubes, for example those comprising a mechanically stable aqueous emulsion of polyethylene particles having an average molecular weight ranging from about 7,000 to 40,000 as described in U.S. Pat. No. 3,734,686; ethylene polymer latexes containing ethylene polymer particles of submicron size prepared by dispersing in water an ethylene polymer and a water-soluble block copolymer of ethylene oxide and propylene oxide as described in U.S. Pat. No. 3,418,26; latexes prepared from copolymers of ethylene and C3-C20 α-olefins as in U.S. Pat. No. 5,574,091; or compositions comprising homogenous ethylene/alpha-olefin interpolymers and substantially random interpolymers as disclosed in U.S. Pat. No. 6,521,696.
  • Another useful type of pressure sensitive adhesive composition is based on (meth) acrylates (i.e., acrylates and methacrylates). Such compositions include, for example, copolymers derived from compositions containing, based on the total weight of the monomer components, about 50 to about 99 weight percent of C4-C18 alkyl esters of (meth)acrylic acids, about 1 to about 50 weight percent of polar ethylenically unsaturated comonomers such as itaconic acid, certain substituted acrylamides such a N,N-dimethyl acrylamide, N-vinyl-2-pyrrolidone, or n-vinyl caprolactam, acrylonitrile, acrylic acid, glycidyl acrylate, and the like, and optionally, up to about 25 weight percent of a non-polar ethylenically unsaturated comonomer such as cyclohexyl acrylate, n-octyl acrylamide, t-butyl acrylate, methyl methacrylate, and the like, and/or a tackifier.
  • Other additives such as crosslinking agents may also be present, for example include di- and triacrylates, for instance 1,6-hexanediol diacrylate; and photoinitiators such as 1-hydroxycyclohexyl phenyl ketone or 2,2-dimethoxy-2-phenylacetophenone, which are commercially available from Ciba-Geigy under the trade names respectively of IRGACURE 184 and IRGACURE 651, or other photoinitiators for ethylenically-unsaturated monomers which are well known in the art. Cross-linking agents and photoinitiators, are each generally used in amounts of about 0.005 to about 0.5 weight percent, based on total weight of monomer composition. Suitable (meth)acrylate pressure sensitive adhesives are disclosed, for example, in U.S. Pat. No. 4,223,067; U.S. Pat. No. 4,181,752 U.S. Pat. No. 5,183,833; U.S. Pat. No. 5,645,764, and U.S. Pat. No. Re. 24,906. Suitable compositions are also commercially available, for example from Ashland Chemicals under the trade name AEROSET.
  • The (meth)acrylate containing monomer mixture may be polymerized by various techniques, preferably photoinitiated bulk polymerization as described, for example, in U.S. Pat. No. 5,620,795, wherein the polymerizable comonomers and a photoinitiator are mixed together in the absence of solvent and partially polymerized to a viscosity of about 500 to about 50,000 cps to achieve a coatable syrup. Alternatively, the monomers may be mixed with a thixotropic agent such as fumed hydrophilic silica to achieve a coatable thickness. A crosslinking agent, the carbon nanotubes, and any other components (including any tackifiers) are then added to the prepolymerized syrup. Alternatively, these components (including any tackifiers but with the exception of the crosslinking agent) can be added directly to the monomer mixture prior to pre-polymerization.
  • The resulting composition is coated onto a substrate (which may be transparent to ultraviolet radiation) and polymerized in an inert (i. e., oxygen free) atmosphere, e.g., a nitrogen atmosphere by exposure to ultraviolet radiation. Examples of suitable substrates include release liners (e.g., silicone release liners) and tape backings (which may be primed or unprimed paper or plastic). A sufficiently inert atmosphere can also be achieved by covering a layer of the polymerizable coating with a plastic film which is substantially transparent to ultraviolet radiation, and irradiating through that film in air as described in the aforementioned Martens et al. patent using ultraviolet lamps. The ultraviolet light source preferably has 90% of the emissions between 280 and 400 nm (more preferably between 300 and 400 nm), with a maximum at 351 nm. Where multi-layer tape constructions are desirable, a variety of conventional techniques may be used. For example, the coatings may be applied concurrently (e.g., through a die coater), after which the entire multi-layer structure is cured at the same time. The coatings may also be applied sequentially whereby each individual layer is partially or completely cured prior to application of the next layer.
  • Use of carbon nanotubes enables the production of electrically conductive adhesives having a volume resistivity of about 10−3 ohm-cm to about 108 ohm-cm. Within this range, the volume resistivity can be less than or equal to about 106, less than or equal to about 104, or less than or equal to about 103, and is preferably less than or equal to about 102, more preferably less than or equal to about 10, and most preferably less than or equal to about 1 ohm-cm.
  • Use of carbon nanotubes unexpectedly allows the manufacture of pressure sensitive adhesives that have excellent electrical conductivity and physical properties, particularly tack and peel strength. These characteristics permit the adhesives to be used with a variety of articles, particularly where electromagnetic and/or electrostatic dissipative properties are desired. The articles are suitable for use in a variety of commercial applications such as cell phones, global positioning systems, disk drives, personal digital assistants, personal or laptop computers, airplanes, radio receiver or transmitter, network server, cellular communication base station or other telecommunications equipment, or other articles of commerce.
  • The following examples, which are meant to be exemplary, not limiting, illustrate compositions and methods of manufacturing of some of the various embodiments of the pressure sensitive adhesives described herein.
  • EXAMPLES
  • As is known, particular values for volume resistivity and electrostatic shielding will depend on the particular test methods and conditions. For example, it is known that volume resistivity and shielding effectiveness may vary with the pressure placed on the sample during the test. Useful electrical equipment and test fixtures to measure volume resistivity in the sample below are as follows. The fixture is a custom fabricated press with gold plated, 2.5 cm×2.5 cm (1 inch×1 inch) square, and electrical contacts. The fixture is equipped with a digital force gauge that allows the operator to control and make adjustments to the force that is applied to the surface of the sample. The Power supply is capable of supplying 0 to 2 amps to the sample surface. The Voltage drop and ohms across the sample are measured using a HP 34420A Nano Volt/Micro Ohmmeter. The electronic components of the fixture are allowed to warm up and, in the case of the HP 34420 A, the internal calibration checks are done. The samples are allowed to equilibrate, for a period of 24 hours, to the conditions of the test environment. Typical test environment is 50% Relative Humidity (% RH) with a room temp of 23° C. (70° F.).
  • The sample to be tested is placed between the platens of the test fixture and a load is applied to the surface. The applied load is dependent on the type of sample to be tested, soft elastomers are tested using small loads while solids are tested using a load range from about 10 to 100 pounds per square inch). Once the load has been applied, the current is applied to the sample and the voltage drop through the sample thickness is measured. A typical test would include measurements at 4 different amp settings, 0.5, 1.0, 1.6, and 2.0 amps. For a conductive composite the resulting calculated volume resistivity for all four of the amp settings will be similar. The calculation for the volume resistivity is as follows:
    Volume resistivity (ohm-cm)=(E/I)*(A/T)
    wherein E=voltage drop (V), I=current (amps), A=area (cm2), and T=thickness (cm).
  • To make volume resistivity measurements, a conductive silicone elastomer is coated with a commercially available pressure sensitive adhesive composition (e.g., Aeroset 1450 from Ashland Chemicals) in an organic solvent and comprising 0.001 to 50 wt % of carbon nanotubes. After as described by the manufacturer, the elastomer is adhered to conductive silicone elastomer from BISCO, and a voltmeter is used to make resistance measurements as described above. The volume resistivity of such samples is lower than for comparable samples made using a commercially available conductive PSA available from 3M under the trade designation “9713”). The samples can have a volume resistivity of about 10−3 ohm-cm to about 108 ohm-cm. Within this range, the volume resistivity can be less than or equal to about 106, less than or equal to about 104, or less than or equal to about 103, and is preferably less than or equal to about 102, more preferably less than or equal to about 10, and most preferably less than or equal to about 1 ohm-cm.
  • Typically, the inventive pressure sensitive adhesive will be bondable to the substrate surface under firm hand pressure, and will exhibit thereon a 180° peel adhesion, such as may be determined in accordance with PSTC-1 (Pressure Sensitive Tape Council Test Methods for Pressure Sensitive Adhesive Tapes, Pressure Sensitive Tape Council, Northbrook, Ill. 60062), of between 0.5-5.0 lb/in initial. Preferably, such adhesion will be observed to increase or “build” on aging.
  • While preferred embodiments have been shown and described, various modifications and substitutions may be made thereto without departing from the spirit and scope of the invention. Accordingly, it is to be understood that the present invention has been described by way of illustration and not limitations.

Claims (20)

1. An adhesive, comprising
a pressure-sensitive adhesive composition; and
carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive.
2. The adhesive of claim 1, having a volume resistivity of about 10−3 ohm-cm to about 108 ohm-cm.
3. The adhesive of claim 1, having a volume resistivity of less than about 10 ohm-cm.
4. The adhesive of claim 1, having a volume resistivity of less than about 1 ohm-cm.
5. An article comprising the adhesive composition of claim 1 disposed on a substrate.
6. The article of claim 5, wherein the substrate is electrically conductive.
7. The article of claim 6, wherein the substrate has a volume resistivity of about 10−3 ohm-cm to about 108 ohm-cm.
8. The article of claim 7, wherein the substrate has a volume resistivity of less than about 10 ohm-cm.
9. The article of claim 7, wherein the substrate has a volume resistivity of less than about 1 ohm-cm.
10. A pressure-sensitive adhesive tape, comprising
a backing layer having a first side and a second side opposite said first side; and
a pressures-sensitive adhesive layer having a first side and a second side opposite the first side, wherein
the first side of the pressure-sensitive adhesive layer is in contact with at least a portion of the first side of the backing layer,
the second side is bondable under pressure to a substrate, and
the pressure-sensitive adhesive layer comprises
a pressure-sensitive adhesive composition; and
carbon nanotubes in an amount effective to render the pressure-sensitive adhesive composition electrically conductive.
11. The tape of claim 10, wherein the backing layer is an electrically conductive polymer.
12. The tape of claim 10, wherein the backing layer is an electrically conductive silicone.
13. The tape of claim 10, wherein the backing layer has a volume resistivity of about 10 −3 ohm-cm to about 108 ohm-cm.
14. The tape of claim 12, wherein the backing layer has a volume resistivity of less than about 10 ohm-cm.
15. The tape of claim 12, wherein the backing layer has a volume resistivity of less than about 1 ohm-cm.
16. An article, comprising
a substrate having a surface; and
the tape of claim 10, wherein the second side of the pressure-sensitive adhesive layer is bonded to at least a portion of the surface of the substrate.
17. The article of claim 16, wherein the tape provides an EMI shielding effectiveness of at least about 60 dB over a frequency range of about 10 to about 10 GRz.
18. The article of claim 16, wherein the initial peel strength between the backing and the surface of the substrate is about 1.5 to about 5.0 lb/in (0.26-0.87 N/m).
19. The article of claim 16, wherein the volume resistivity between the backing and the surface of the substrate is about 10−3 ohm-cm to about 108 ohm-cm.
20. A method of manufacture of an adhesive, comprising
mixing a pressure-sensitive adhesive formulation in a solvent or diluent with carbon nanotubes;
applying the mixture to a substrate or backing layer;
removing the solvent or diluent; and
optionally curing the adhesive.
US10/903,462 2003-08-06 2004-07-30 Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof Abandoned US20050062024A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/903,462 US20050062024A1 (en) 2003-08-06 2004-07-30 Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49318103P 2003-08-06 2003-08-06
US10/903,462 US20050062024A1 (en) 2003-08-06 2004-07-30 Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof

Publications (1)

Publication Number Publication Date
US20050062024A1 true US20050062024A1 (en) 2005-03-24

Family

ID=34193169

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/903,462 Abandoned US20050062024A1 (en) 2003-08-06 2004-07-30 Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof

Country Status (2)

Country Link
US (1) US20050062024A1 (en)
WO (1) WO2005017012A1 (en)

Cited By (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050244991A1 (en) * 2001-10-19 2005-11-03 Nano-Proprietary, Inc. Activation of carbon nanotubes for field emission applications
US20060036016A1 (en) * 2003-10-30 2006-02-16 Winey Karen I Flame retardant nanocomposite
US20060258054A1 (en) * 2005-05-11 2006-11-16 Molecular Nanosystems, Inc. Method for producing free-standing carbon nanotube thermal pads
US20070213449A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company Pressure-sensitive adhesive containing silica nanoparticles
WO2007102977A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company High shear pressure sensitive adhesive
US7393901B1 (en) 2007-02-16 2008-07-01 3M Innovative Properties Company Acrylate adhesives containing silica nanoparticles crosslinked with polyfunctional aziridines
US20080200587A1 (en) * 2007-02-16 2008-08-21 3M Innovative Properties Company Pressure-sensitive adhesive containing acicular silica particles crosslinked with polyfunctional aziridines
US20080241507A1 (en) * 2007-03-30 2008-10-02 Tsinghua University Conductive tape and method for making the same
US20080268318A1 (en) * 2006-12-26 2008-10-30 Jang Bor Z Carbon cladded composite flow field plate, bipolar plate and fuel cell
US20080311378A1 (en) * 2007-02-06 2008-12-18 Scott Simpson Conductive polymer foams, method of manufacture, and articles thereof
CN100467562C (en) * 2005-04-08 2009-03-11 鸿富锦精密工业(深圳)有限公司 Nano adhesive tape and its producing method
US20090087629A1 (en) * 2007-09-28 2009-04-02 Everaerts Albert I Indium-tin-oxide compatible optically clear adhesive
US20090226707A1 (en) * 2008-03-04 2009-09-10 Lintec Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US20090226708A1 (en) * 2008-03-04 2009-09-10 Lintec Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US20100024975A1 (en) * 2008-08-04 2010-02-04 Lockheed Martin Corporation Carbon/carbon film adhesive
US20100040842A1 (en) * 2008-08-12 2010-02-18 3M Innovative Properties Company Adhesives compatible with corrosion sensitive layers
US20100080978A1 (en) * 2006-12-04 2010-04-01 Universite Catholique De Louvain Polymer composite material structures comprising carbon based conductive loads
US20110024694A1 (en) * 2009-02-17 2011-02-03 Lockheed Martin Corporation Composites comprising carbon nanotubes on fiber
US20110104470A1 (en) * 2008-06-24 2011-05-05 Anderson Wayne H Method of forming a curable adhesive tape and an insulating layer on a conductive substrate
US20110124253A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Cnt-infused fibers in carbon-carbon composites
US20110123735A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoset matrices
US20110133031A1 (en) * 2009-11-23 2011-06-09 Applied Nanostructured Solutions, Llc Cnt-tailored composite air-based structures
US20110143087A1 (en) * 2009-12-14 2011-06-16 Applied Nanostructured Solutions, Llc Flame-resistant composite materials and articles containing carbon nanotube-infused fiber materials
US20110155945A1 (en) * 2007-02-06 2011-06-30 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
CN102118916A (en) * 2009-12-30 2011-07-06 昆山雅森电子材料科技有限公司 Heat-conducting covering film
US20110186775A1 (en) * 2010-02-02 2011-08-04 Applied Nanostructured Solutions, Llc. Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom
US20110297892A1 (en) * 2009-12-08 2011-12-08 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoplastic matrices
WO2012064133A2 (en) * 2010-11-12 2012-05-18 연세대학교 산학협력단 Conductive transparent adhesive composition, and conductive transparent adhesive produced by same
WO2012068424A2 (en) 2010-11-17 2012-05-24 Battelle Memorial Institute Carbon nanotube thin film laminate resistive heater
WO2012092623A2 (en) 2010-12-31 2012-07-05 Battelle Memorial Institute Anti-icing, de-icing, and heating configuration, integration, and power methods for aircraft, aerodynamic, and complex surfaces
US20120298345A1 (en) * 2010-02-17 2012-11-29 Green Star Co., Ltd. Heat sink sheet including an adhesive having good heat conductivity
US20130069013A1 (en) * 2010-06-18 2013-03-21 Mohamed Esseghir Electrically Conductive, Olefin Multiblock Copolymer Compositions
US20130076371A1 (en) * 2010-02-26 2013-03-28 TuTech Innoovation GmbH Adhesive with anisotropic electrical conductivity and methods of producing and using same
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
US20130319727A1 (en) * 2012-05-29 2013-12-05 Aurora Flight Sciences Corporation Apparatus and method for an aircraft conductor sandwich assembly embedded to an aircraft structure
US9017854B2 (en) 2010-08-30 2015-04-28 Applied Nanostructured Solutions, Llc Structural energy storage assemblies and methods for production thereof
WO2015095094A1 (en) * 2013-12-19 2015-06-25 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
WO2015094780A1 (en) * 2013-12-19 2015-06-25 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
WO2015101773A1 (en) * 2013-12-31 2015-07-09 Intelligent Energy Limited Fuel cell flow plate
US20150191636A1 (en) * 2012-07-05 2015-07-09 Lintec Corporation Pressure-sensitive adhesive sheet
WO2015112532A1 (en) * 2014-01-24 2015-07-30 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
CN105419674A (en) * 2016-01-18 2016-03-23 杨宜丰 Floating all-dimensional conductive adhesive film
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
US9546859B2 (en) 2011-03-25 2017-01-17 Peratech Holdco Limited Composite material
WO2017048813A1 (en) 2015-09-14 2017-03-23 Lintec Of America, Inc. Multilayer composites comprising adhesive and one or more nanofiber sheets
CN106661398A (en) * 2014-08-28 2017-05-10 琳得科株式会社 Conductive adhesive sheet
CN106661397A (en) * 2014-08-28 2017-05-10 琳得科株式会社 Conductive adhesive sheet
CN106795395A (en) * 2014-08-28 2017-05-31 琳得科株式会社 Electroconductive adhesive sheet
US9853487B2 (en) * 2015-10-13 2017-12-26 Samsung Electro-Mechanics Co., Ltd. Magnetic field shielding sheet and wireless power charging apparatus including the same
CN107709232A (en) * 2015-06-12 2018-02-16 琳得科株式会社 CNT woods layered product and the method for producing CNT woods layered product
US9929599B2 (en) * 2015-06-18 2018-03-27 Samsung Electro-Mechanics Co., Ltd. Sheet for shielding against electromagnetic waves and wireless power charging device
US10167550B2 (en) 2014-06-03 2019-01-01 Aurora Flight Sciences Corporation Multi-functional composite structures
US10285219B2 (en) 2014-09-25 2019-05-07 Aurora Flight Sciences Corporation Electrical curing of composite structures
US10368401B2 (en) 2014-06-03 2019-07-30 Aurora Flight Sciences Corporation Multi-functional composite structures
CN110295015A (en) * 2018-03-23 2019-10-01 普乐士株式会社 Stationery adhesive composition and laminated body
US10457410B2 (en) * 2016-04-27 2019-10-29 The Boeing Company Magnetic carbon nanotube cluster systems and methods
US10590539B2 (en) 2017-02-24 2020-03-17 Lintec Of America, Inc. Nanofiber thermal interface material
US10747028B2 (en) 2016-06-10 2020-08-18 Lintec Of America, Inc. Nanofiber sheet
US20200307048A1 (en) * 2019-03-26 2020-10-01 HubbellI Incorporated Molds for making protective coverings over metal structures
US11352528B1 (en) * 2019-03-12 2022-06-07 Seagate Technology Llc Adhesive compositions that contain adhesive polymer and carbon nanotubes, and related products and methods
CN114736620A (en) * 2022-06-15 2022-07-12 深圳市卓汉材料技术有限公司 Shielding adhesive tape, preparation method thereof and shielding structure
US11542019B2 (en) 2018-12-16 2023-01-03 Goodrich Corporation Z-CNT filled meltable adhesives for bonding of deicers
WO2024040582A1 (en) * 2022-08-26 2024-02-29 3M Innovative Properties Company Electrically conductive pressure sensitive adhesives containing nanoparticle additives

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006047734A1 (en) 2006-10-06 2008-04-10 Tesa Ag Adhesive tape with a carrier which is composed of one or more carrier films, wherein an adhesive is at least partially applied to the carrier at least on one side
CN201072451Y (en) * 2007-02-27 2008-06-11 叶隆泰 High-transparence and conductivity phasic difference glue film
US9260633B2 (en) 2010-01-12 2016-02-16 Concordia University Electrically conductive adhesives comprising bucky paper and an adhesive resin
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
JP2013014449A (en) * 2011-07-01 2013-01-24 Nitto Denko Corp Aggregation of fibrous columnar structure
CN110157347B (en) * 2019-05-05 2021-05-11 浙江夜光明光电科技股份有限公司 High-strength reflective film and preparation method thereof
DE202020101775U1 (en) * 2020-04-01 2020-05-26 Certoplast Technische Klebebänder Gmbh Adhesive tape, in particular cable winding tape for wrapping cables in automobiles

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2808352A (en) * 1951-03-22 1957-10-01 Burgess Battery Co Electrically conductive adhesive tape
USRE24906E (en) * 1955-11-18 1960-12-13 Pressure-sensitive adhesive sheet material
US3418265A (en) * 1964-05-25 1968-12-24 Nat Distillers Chem Corp Process of preparing latices of submicron size particles of ethylene polymers
US3475213A (en) * 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3734686A (en) * 1971-08-12 1973-05-22 Cosden Oil & Chem Co Composition and method for treating carpets and pile fabrics
US3762946A (en) * 1971-10-21 1973-10-02 Minnesota Mining & Mfg Small particle loaded electrically conductive adhesive tape
US4181752A (en) * 1974-09-03 1980-01-01 Minnesota Mining And Manufacturing Company Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing
US4223067A (en) * 1978-03-27 1980-09-16 Minnesota Mining And Manufacturing Company Foam-like pressure-sensitive adhesive tape
US4258100A (en) * 1977-09-09 1981-03-24 Kabushiki Kaisha Kyowa Pressure-sensitive electric conductive sheet material
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4612242A (en) * 1985-06-03 1986-09-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tape containing coated glass microbubbles
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
US5183833A (en) * 1989-11-02 1993-02-02 Adco Products Inc. Ultraviolet radiation photopolymerization of acrylic ester pressure sensitive adhesive formulation
US5366664A (en) * 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
US5574091A (en) * 1995-06-05 1996-11-12 The Dow Chemical Comapny Aqueous dispersions of olefin copolymers
US5611884A (en) * 1995-12-11 1997-03-18 Dow Corning Corporation Flip chip silicone pressure sensitive conductive adhesive
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5645764A (en) * 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5932145A (en) * 1996-10-31 1999-08-03 Dow Corning Toray Silicone Co., Ltd. Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
US6022914A (en) * 1995-11-27 2000-02-08 3M Innovative Properties Company Pressure-sensitive adhesive composition and tapes
US6410137B1 (en) * 1998-10-22 2002-06-25 Parker-Hannifin Corporation Intumescent, flame retardant pressure sensitive adhesive composition for EMI shielding applications
US6521696B2 (en) * 1997-11-12 2003-02-18 Dow Global Technologies Inc. Aqueous pressure sensitive adhesive formulations

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (en) * 1991-07-11 1993-01-26 Nitto Denko Corp Adhesive tape
JP2001172582A (en) * 1999-12-14 2001-06-26 Suzuki Sogyo Co Ltd Electroconductive pressure sensitive adhesive and electroconductive composite material having electroconductive pressure sensitive adhesive layer
WO2003013199A2 (en) * 2001-07-27 2003-02-13 Eikos, Inc. Conformal coatings comprising carbon nanotubes

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2808352A (en) * 1951-03-22 1957-10-01 Burgess Battery Co Electrically conductive adhesive tape
USRE24906E (en) * 1955-11-18 1960-12-13 Pressure-sensitive adhesive sheet material
US3418265A (en) * 1964-05-25 1968-12-24 Nat Distillers Chem Corp Process of preparing latices of submicron size particles of ethylene polymers
US3475213A (en) * 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3734686A (en) * 1971-08-12 1973-05-22 Cosden Oil & Chem Co Composition and method for treating carpets and pile fabrics
US3762946A (en) * 1971-10-21 1973-10-02 Minnesota Mining & Mfg Small particle loaded electrically conductive adhesive tape
US4181752A (en) * 1974-09-03 1980-01-01 Minnesota Mining And Manufacturing Company Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing
US4258100A (en) * 1977-09-09 1981-03-24 Kabushiki Kaisha Kyowa Pressure-sensitive electric conductive sheet material
US4223067A (en) * 1978-03-27 1980-09-16 Minnesota Mining And Manufacturing Company Foam-like pressure-sensitive adhesive tape
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4612242A (en) * 1985-06-03 1986-09-16 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive tape containing coated glass microbubbles
US5183833A (en) * 1989-11-02 1993-02-02 Adco Products Inc. Ultraviolet radiation photopolymerization of acrylic ester pressure sensitive adhesive formulation
US5082595A (en) * 1990-01-31 1992-01-21 Adhesives Research, Inc. Method of making an electrically conductive pressure sensitive adhesive
US5366664A (en) * 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5645764A (en) * 1995-01-19 1997-07-08 International Business Machines Corporation Electrically conductive pressure sensitive adhesives
US5574091A (en) * 1995-06-05 1996-11-12 The Dow Chemical Comapny Aqueous dispersions of olefin copolymers
US6022914A (en) * 1995-11-27 2000-02-08 3M Innovative Properties Company Pressure-sensitive adhesive composition and tapes
US5611884A (en) * 1995-12-11 1997-03-18 Dow Corning Corporation Flip chip silicone pressure sensitive conductive adhesive
US5932145A (en) * 1996-10-31 1999-08-03 Dow Corning Toray Silicone Co., Ltd. Addition reaction-curing electrically conductive silicone composition and method for the preparation thereof
US6521696B2 (en) * 1997-11-12 2003-02-18 Dow Global Technologies Inc. Aqueous pressure sensitive adhesive formulations
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
US6410137B1 (en) * 1998-10-22 2002-06-25 Parker-Hannifin Corporation Intumescent, flame retardant pressure sensitive adhesive composition for EMI shielding applications

Cited By (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462498B2 (en) * 2001-10-19 2008-12-09 Applied Nanotech Holdings, Inc. Activation of carbon nanotubes for field emission applications
US20050244991A1 (en) * 2001-10-19 2005-11-03 Nano-Proprietary, Inc. Activation of carbon nanotubes for field emission applications
US20060036016A1 (en) * 2003-10-30 2006-02-16 Winey Karen I Flame retardant nanocomposite
US7265175B2 (en) * 2003-10-30 2007-09-04 The Trustees Of The University Of Pennsylvania Flame retardant nanocomposite
CN100467562C (en) * 2005-04-08 2009-03-11 鸿富锦精密工业(深圳)有限公司 Nano adhesive tape and its producing method
US20060258054A1 (en) * 2005-05-11 2006-11-16 Molecular Nanosystems, Inc. Method for producing free-standing carbon nanotube thermal pads
WO2007102977A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company High shear pressure sensitive adhesive
US7531595B2 (en) 2006-03-08 2009-05-12 3M Innovative Properties Company Pressure-sensitive adhesive containing silica nanoparticles
US20070213449A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company Pressure-sensitive adhesive containing silica nanoparticles
US20070213448A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company High shear pressure-sensitive adhesive
US7645827B2 (en) 2006-03-08 2010-01-12 3M Innovative Properties Company High shear pressure-sensitive adhesive
WO2007102975A1 (en) * 2006-03-08 2007-09-13 3M Innovative Properties Company Pressure sensitive adhesive containing silica nanoparticles
US20100080978A1 (en) * 2006-12-04 2010-04-01 Universite Catholique De Louvain Polymer composite material structures comprising carbon based conductive loads
US9379393B2 (en) * 2006-12-26 2016-06-28 Nanotek Instruments, Inc. Carbon cladded composite flow field plate, bipolar plate and fuel cell
US20080268318A1 (en) * 2006-12-26 2008-10-30 Jang Bor Z Carbon cladded composite flow field plate, bipolar plate and fuel cell
US20110155945A1 (en) * 2007-02-06 2011-06-30 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
US20080311378A1 (en) * 2007-02-06 2008-12-18 Scott Simpson Conductive polymer foams, method of manufacture, and articles thereof
US8623265B2 (en) 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
US8613881B2 (en) 2007-02-06 2013-12-24 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
US20080200587A1 (en) * 2007-02-16 2008-08-21 3M Innovative Properties Company Pressure-sensitive adhesive containing acicular silica particles crosslinked with polyfunctional aziridines
US7393901B1 (en) 2007-02-16 2008-07-01 3M Innovative Properties Company Acrylate adhesives containing silica nanoparticles crosslinked with polyfunctional aziridines
US20080241507A1 (en) * 2007-03-30 2008-10-02 Tsinghua University Conductive tape and method for making the same
US20090087629A1 (en) * 2007-09-28 2009-04-02 Everaerts Albert I Indium-tin-oxide compatible optically clear adhesive
WO2009045889A3 (en) * 2007-09-28 2009-05-28 3M Innovative Properties Co Indium-tin-oxide compatible optically clear adhesive
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
US20090226707A1 (en) * 2008-03-04 2009-09-10 Lintec Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US20090226708A1 (en) * 2008-03-04 2009-09-10 Lintec Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US20110104470A1 (en) * 2008-06-24 2011-05-05 Anderson Wayne H Method of forming a curable adhesive tape and an insulating layer on a conductive substrate
US20100024975A1 (en) * 2008-08-04 2010-02-04 Lockheed Martin Corporation Carbon/carbon film adhesive
US9023175B2 (en) 2008-08-04 2015-05-05 Lockheed Martin Corporation Carbon/carbon film adhesive
US20100040842A1 (en) * 2008-08-12 2010-02-18 3M Innovative Properties Company Adhesives compatible with corrosion sensitive layers
US8585934B2 (en) 2009-02-17 2013-11-19 Applied Nanostructured Solutions, Llc Composites comprising carbon nanotubes on fiber
US20110024694A1 (en) * 2009-02-17 2011-02-03 Lockheed Martin Corporation Composites comprising carbon nanotubes on fiber
US20110135491A1 (en) * 2009-11-23 2011-06-09 Applied Nanostructured Solutions, Llc Cnt-tailored composite land-based structures
US20110124253A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Cnt-infused fibers in carbon-carbon composites
US8601965B2 (en) 2009-11-23 2013-12-10 Applied Nanostructured Solutions, Llc CNT-tailored composite sea-based structures
US20110132245A1 (en) * 2009-11-23 2011-06-09 Applied Nanostructured Solutions, Llc Cnt-tailored composite sea-based structures
US8662449B2 (en) 2009-11-23 2014-03-04 Applied Nanostructured Solutions, Llc CNT-tailored composite air-based structures
US20110133031A1 (en) * 2009-11-23 2011-06-09 Applied Nanostructured Solutions, Llc Cnt-tailored composite air-based structures
US20110123735A1 (en) * 2009-11-23 2011-05-26 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoset matrices
US20110297892A1 (en) * 2009-12-08 2011-12-08 Applied Nanostructured Solutions, Llc Cnt-infused fibers in thermoplastic matrices
US8545963B2 (en) 2009-12-14 2013-10-01 Applied Nanostructured Solutions, Llc Flame-resistant composite materials and articles containing carbon nanotube-infused fiber materials
US20110143087A1 (en) * 2009-12-14 2011-06-16 Applied Nanostructured Solutions, Llc Flame-resistant composite materials and articles containing carbon nanotube-infused fiber materials
CN102118916A (en) * 2009-12-30 2011-07-06 昆山雅森电子材料科技有限公司 Heat-conducting covering film
US8999453B2 (en) 2010-02-02 2015-04-07 Applied Nanostructured Solutions, Llc Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom
US20110186775A1 (en) * 2010-02-02 2011-08-04 Applied Nanostructured Solutions, Llc. Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom
US20120298345A1 (en) * 2010-02-17 2012-11-29 Green Star Co., Ltd. Heat sink sheet including an adhesive having good heat conductivity
US20130076371A1 (en) * 2010-02-26 2013-03-28 TuTech Innoovation GmbH Adhesive with anisotropic electrical conductivity and methods of producing and using same
US20130069013A1 (en) * 2010-06-18 2013-03-21 Mohamed Esseghir Electrically Conductive, Olefin Multiblock Copolymer Compositions
US10026519B2 (en) * 2010-06-18 2018-07-17 Union Carbide Chemicals & Plastics Technology Llc Electrically conductive, olefin multiblock copolymer compositions
US9017854B2 (en) 2010-08-30 2015-04-28 Applied Nanostructured Solutions, Llc Structural energy storage assemblies and methods for production thereof
US9907174B2 (en) 2010-08-30 2018-02-27 Applied Nanostructured Solutions, Llc Structural energy storage assemblies and methods for production thereof
US9096779B2 (en) 2010-11-12 2015-08-04 Industry-Academic Cooperation Foundation, Yonsei University Conductive transparent adhesive composition and adhesive prepared by using the same
WO2012064133A3 (en) * 2010-11-12 2012-09-13 연세대학교 산학협력단 Conductive transparent adhesive composition, and conductive transparent adhesive produced by same
WO2012064133A2 (en) * 2010-11-12 2012-05-18 연세대학교 산학협력단 Conductive transparent adhesive composition, and conductive transparent adhesive produced by same
US9468043B2 (en) 2010-11-17 2016-10-11 Battelle Memorial Institute Carbon nanotube thin film laminate resistive heater
US10109400B2 (en) 2010-11-17 2018-10-23 Battelle Memorial Institute Carbon nanotube thin film laminate resistive heater
WO2012068424A2 (en) 2010-11-17 2012-05-24 Battelle Memorial Institute Carbon nanotube thin film laminate resistive heater
EP3575218A1 (en) 2010-12-31 2019-12-04 Battelle Memorial Institute Antenna comprising a layer of carbon nanotubes
WO2012092623A3 (en) * 2010-12-31 2014-09-18 Battelle Memorial Institute Anti-icing, de-icing, and heating configuration, integration, and power methods for aircraft, aerodynamic, and complex surfaces
US10155593B2 (en) * 2010-12-31 2018-12-18 Battelle Memorial Institute Anti-icing, de-icing, and heating configuration, integration, and power methods for aircraft, aerodynamic, and complex surfaces
WO2012092623A2 (en) 2010-12-31 2012-07-05 Battelle Memorial Institute Anti-icing, de-icing, and heating configuration, integration, and power methods for aircraft, aerodynamic, and complex surfaces
US9546859B2 (en) 2011-03-25 2017-01-17 Peratech Holdco Limited Composite material
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
CN103201352A (en) * 2011-10-25 2013-07-10 3M创新有限公司 Nonwoven adhesive tapes and articles therefrom
US9426878B2 (en) 2011-10-25 2016-08-23 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
TWI555815B (en) * 2011-10-25 2016-11-01 3M新設資產公司 Nonwoven adhesive tapes and articles therefrom
WO2013062836A1 (en) * 2011-10-25 2013-05-02 3M Innovative Properties Company Nonwoven adhesive tapes and articles therefrom
US20130319727A1 (en) * 2012-05-29 2013-12-05 Aurora Flight Sciences Corporation Apparatus and method for an aircraft conductor sandwich assembly embedded to an aircraft structure
US8937254B2 (en) * 2012-05-29 2015-01-20 Aurora Flight Sciences Corporation Apparatus and method for an aircraft conductor sandwich assembly embedded to an aircraft structure
US20150191636A1 (en) * 2012-07-05 2015-07-09 Lintec Corporation Pressure-sensitive adhesive sheet
WO2015095094A1 (en) * 2013-12-19 2015-06-25 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
CN105829474A (en) * 2013-12-19 2016-08-03 3M创新有限公司 Electrically conductive adhesive tapes and articles therefrom
WO2015094780A1 (en) * 2013-12-19 2015-06-25 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
WO2015101773A1 (en) * 2013-12-31 2015-07-09 Intelligent Energy Limited Fuel cell flow plate
US10050286B2 (en) 2013-12-31 2018-08-14 Intelligent Energy Limited Fuel cell flow plate
WO2015112532A1 (en) * 2014-01-24 2015-07-30 3M Innovative Properties Company Electrically conductive adhesive tapes and articles therefrom
US10167550B2 (en) 2014-06-03 2019-01-01 Aurora Flight Sciences Corporation Multi-functional composite structures
US10368401B2 (en) 2014-06-03 2019-07-30 Aurora Flight Sciences Corporation Multi-functional composite structures
CN106795395A (en) * 2014-08-28 2017-05-31 琳得科株式会社 Electroconductive adhesive sheet
CN106661397A (en) * 2014-08-28 2017-05-10 琳得科株式会社 Conductive adhesive sheet
CN106661398A (en) * 2014-08-28 2017-05-10 琳得科株式会社 Conductive adhesive sheet
US10285219B2 (en) 2014-09-25 2019-05-07 Aurora Flight Sciences Corporation Electrical curing of composite structures
CN107709232A (en) * 2015-06-12 2018-02-16 琳得科株式会社 CNT woods layered product and the method for producing CNT woods layered product
US9929599B2 (en) * 2015-06-18 2018-03-27 Samsung Electro-Mechanics Co., Ltd. Sheet for shielding against electromagnetic waves and wireless power charging device
US10995195B2 (en) 2015-09-14 2021-05-04 Lintec Of America, Inc. Composite nanofiber sheet
US10189971B2 (en) 2015-09-14 2019-01-29 Lintec Of America, Inc. Flexible sheet, thermally conductive component, electrically conductive component, antistatic component, heating element, electromagnetic wave shield, and method of producing flexible sheet
WO2017048813A1 (en) 2015-09-14 2017-03-23 Lintec Of America, Inc. Multilayer composites comprising adhesive and one or more nanofiber sheets
US10717844B2 (en) 2015-09-14 2020-07-21 Lintec Corporation Multilayer conformable composites
US11377537B2 (en) 2015-09-14 2022-07-05 Lintec Of America, Inc. Multilayer composites comprising adhesive and one or more nanofiber sheets
US9853487B2 (en) * 2015-10-13 2017-12-26 Samsung Electro-Mechanics Co., Ltd. Magnetic field shielding sheet and wireless power charging apparatus including the same
CN105419674A (en) * 2016-01-18 2016-03-23 杨宜丰 Floating all-dimensional conductive adhesive film
US10457410B2 (en) * 2016-04-27 2019-10-29 The Boeing Company Magnetic carbon nanotube cluster systems and methods
US10747028B2 (en) 2016-06-10 2020-08-18 Lintec Of America, Inc. Nanofiber sheet
US10590539B2 (en) 2017-02-24 2020-03-17 Lintec Of America, Inc. Nanofiber thermal interface material
CN110295015A (en) * 2018-03-23 2019-10-01 普乐士株式会社 Stationery adhesive composition and laminated body
TWI790343B (en) * 2018-03-23 2023-01-21 日商普樂士股份有限公司 Adhesive composition for stationery and laminate thereof
US11542019B2 (en) 2018-12-16 2023-01-03 Goodrich Corporation Z-CNT filled meltable adhesives for bonding of deicers
US11919648B2 (en) 2018-12-16 2024-03-05 Goodrich Corporation Z-CNT filled meltable adhesives for bonding of deicers
US11352528B1 (en) * 2019-03-12 2022-06-07 Seagate Technology Llc Adhesive compositions that contain adhesive polymer and carbon nanotubes, and related products and methods
US20200307048A1 (en) * 2019-03-26 2020-10-01 HubbellI Incorporated Molds for making protective coverings over metal structures
CN114736620A (en) * 2022-06-15 2022-07-12 深圳市卓汉材料技术有限公司 Shielding adhesive tape, preparation method thereof and shielding structure
WO2024040582A1 (en) * 2022-08-26 2024-02-29 3M Innovative Properties Company Electrically conductive pressure sensitive adhesives containing nanoparticle additives

Also Published As

Publication number Publication date
WO2005017012A1 (en) 2005-02-24

Similar Documents

Publication Publication Date Title
US20050062024A1 (en) Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof
EP2204425B1 (en) Thermal expansion type removable acrylic pressure-sensitive adhesive tape or sheet and method of removal
EP2204426B1 (en) Thermal expansion type removable acrylic pressure-sensitive adhesive tape or sheet
WO2012063935A1 (en) Bubble-containing thermally-conductive resin-composition layer, manufacturing method therefor, and pressure-sensitive adhesive sheet using said resin-composition layer
CN103201352B (en) Nonwoven adhesive tapes and articles therefrom
US20190316008A1 (en) Stretchable electrically-conductive adhesive tape
EP1570017B1 (en) Anti-static self-adhesive strip
EP2871220A1 (en) Pressure-sensitive adhesive sheet
JPH04503831A (en) conductive pressure sensitive adhesive
WO2009041674A1 (en) Electroconductive pressure-sensitive adhesive tape
JPWO2010122943A1 (en) Heat-expandable removable acrylic adhesive tape or sheet
JP4610818B2 (en) Adhesive tape
JP2010209261A (en) Acrylic self-adhesive sheet
CN101874089A (en) Adhesive sheet and method for manufacturing same
US20160121576A1 (en) Electroconductive pressure-sensitive adhesive cushioning
EP4013832B1 (en) Core-sheath filament with a thermally conductive pressure-sensitive adhesive core
JP2008055710A (en) Antistatic adhesive tape
TWI484504B (en) Anisotropic conductive film, method for producing the same and method for pressing circuit terminals
JP5507806B2 (en) Conductive member having conductive material unevenly distributed polymer layer
JP5520785B2 (en) Insulating tape
KR102194023B1 (en) Process sheet for flexible printed circuit board and the manufacturing method thereof
WO2014075304A1 (en) Conductive resilient hollow microsphere, adhesive composition, and adhesive articles
CN115368845B (en) Conductive pressure sensitive adhesives containing nanoparticle additives
WO2011048701A1 (en) Heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet, and method of removing the same
WO2024040582A1 (en) Electrically conductive pressure sensitive adhesives containing nanoparticle additives

Legal Events

Date Code Title Description
AS Assignment

Owner name: WORLD PROPERTIES, INC., ILLINOIS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BESSETTE, MICHAEL D.;PAUL, SANKAR K.;REEL/FRAME:015412/0094;SIGNING DATES FROM 20041025 TO 20041027

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION