US20050030714A1 - Heat dissipating structure for computer host - Google Patents
Heat dissipating structure for computer host Download PDFInfo
- Publication number
- US20050030714A1 US20050030714A1 US10/828,311 US82831104A US2005030714A1 US 20050030714 A1 US20050030714 A1 US 20050030714A1 US 82831104 A US82831104 A US 82831104A US 2005030714 A1 US2005030714 A1 US 2005030714A1
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- US
- United States
- Prior art keywords
- heat dissipating
- casing
- computer host
- side board
- heat
- Prior art date
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- Abandoned
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- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
- G02B9/12—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having three components only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
Definitions
- the present invention is related to a heat dissipating structure, and more particularly, to a heat dissipating structure for a computer host, which is able to increase the circulation of the air flowing inside the computer casing so that the heat conducted by the heat dissipating device on the CPU can be rapidly dissipated. Accordingly, the heat dissipating efficiency of the dissipating device is significantly enhanced so that the best heat dissipation is achieved.
- the conventional computer casing is mostly a rectangular body including a front, a back, a left side and a right side.
- disk drive and CD-ROM drive mounted on the front of the computer casing, while the power outlet, the connection ports for different interfaces and the heat dissipating fan are mounted at the back of the computer casing.
- the heat dissipating fan extracts the hot air from the inside computer casing and exhausts the hot air to the outside, or, draws the outside cold air into the computer casing so as to lower the temperature inside the computer casing. Accordingly, the heat dissipating efficiency for the CPU can be enhanced.
- the heat dissipating in the conventional computer casing depends on single heat dissipating fan, which often diminishes the efficiency of the air convection owing to the fewer air flowing or the low-speed flowing. Therefore, the hot air inside the computer casing can not be exhausted to the outside promptly, but accumulated inside the computer casing. Accordingly, the heat dissipating efficiency for the CPU is reduced and the heat dissipating effectiveness for the CPU is seriously affected.
- the present invention is to provide a heat dissipating structure for a computer host, which enhances the circulation of the air convection inside the computer casing so that the heat conducted by the heat dissipating device on the CPU can be rapidly dissipated. Hence, the heat dissipating efficiency of the dissipating device is significantly enhanced and the best heat dissipating effectiveness is achieved as well.
- the features of the present invention are that the computer host machine has a casing where a mother board, a CPU with a heat dissipating device mounted thereon, and plural electrical components are located.
- the plural ventilative openings are mounted at positions corresponding to each other.
- the plural ventilative openings on the respective side boards are mounted at positions facing the heat dissipating device.
- the feature of the present invention is that the heat dissipating device includes two adjacent heat dissipating fin modules, a first heat dissipating fin module and a second heat dissipating fin module. Further, there are a first and a second heat dissipating fans respectively mounted on the two external surfaces of the two heat dissipating fin modules, rather than the two inside surfaces between the two adjacent heat dissipating fin modules. The blades of the first heat dissipating fan and the second heat dissipating fan have the same rotary directions.
- the outside air is extracted inside from the ventilative openings on one side board and blown to an area around two adjacent heat dissipating fin modules.
- the second heat dissipating fan the heat conducted to the two adjacent heat dissipating fin modules is exhausted outside through the ventilative openings on other side board of the casing.
- FIG. 1 is a schematic diagram showing the structure of the computer casing, the mother board, and the heat dissipating device according to a preferred embodiment of the present invention
- FIG. 2 is a perspective view showing the outside appearance of the computer casing before assembling the left and right side boards according to a preferred embodiment of the present invention
- FIG. 3 is a perspective view showing the outside appearance of the computer casing according to a preferred embodiment of the present invention.
- FIG. 4 is a sectional view showing the air flowing inside the computer casing achieved by the heat dissipating device according to a preferred embodiment of the present invention.
- the computer host machine 10 includes the computer casing 1 which is generally a rectangular body.
- the computer casing 1 is defined as having a front 11 , a back 12 , a left side 13 and a right side 14 .
- the distance between the front 11 and the back 12 is lengthier than that between the left side 13 and the right side 14 .
- the CPU 21 and the electrical elements or devices 22 are positioned on the mother board 2 .
- the heat dissipating device 3 is positioned on the CPU 21 .
- the heat dissipating device 3 on the CPU 21 includes two adjacent heat dissipating fin modules, the first heat dissipating fin module 31 and the second heat dissipating fin module 32 . Further, there are the first heat dissipating fan 33 and the second heat dissipating fan 34 respectively mounted on the two external surfaces of the two heat dissipating fin modules 31 and 32 , rather than the two inside surfaces between the two adjacent heat dissipating fin modules 31 and 32 . The blades of the first heat dissipating fan 33 and the second heat dissipating fan 34 have the same rotary directions. Certainly, according to a preferred embodiment of the present invention, implementing a single one heat dissipating fin modules 31 (or 32 ) and a single one heat dissipating fan 33 (or 34 ) is workable as well.
- the left side 13 and the right side 14 of the computer casing 1 respectively have a left side board 4 and a right side board 5 .
- front board 6 and back board respectively mounted at the front 11 and the back 12 of the computer casing 1 .
- the plural ventilative openings 41 and 51 are respectively opened at positions corresponding to each other.
- the plural ventilative openings 41 and 51 on the respective left side board 4 and right side board 5 are opened at positions facing the heat dissipating device 3 .
- the heat dissipating device 3 will start to dissipate the heat for CPU 21 . Accordingly, the outside wind is drawn inside the computer casing 1 from the ventilative openings 51 on the right side board 5 . Plus the extracting driven by the first heat dissipating fan 33 , the outside wind is blown inside the computer casing 1 rapidly and blown to an area around two adjacent heat dissipating fin modules 31 and 32 for dissipating the generated heat. Meanwhile, via the second heat dissipating fan 34 , the heat conducted to the two adjacent heat dissipating fin modules 31 and 32 is exhausted outside through the ventilative openings 41 on the left side board 4 of the computer casing 1 . Hence, the generated heat will not accumulate inside the computer casing 1 .
- the present invention since the outside wind is extracted inside the computer casing 1 from the ventilative openings 51 on one side board 5 and the hot air is exhausted outside through the ventilative openings 41 on the other side board 4 , plus the distance between the left side board 4 and right side board 5 is shorter, the circulation efficiency of the air convection inside the computer casing 1 is enhanced.
- the heat conducted by the heat dissipating device 3 is rapidly dissipated.
- the heat dissipating efficiency of the dissipating device 3 is significantly enhanced and the best heat dissipating effectiveness is achieved as well. Accordingly, the present invention not only has a novelty and a progressive nature, but also has an industry utility.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat dissipating structure for a computer host is provided. The computer host has a casing where a mother board, a CPU with a heat dissipating device mounted thereon, and plural electrical components are located. On two side boards of the computer casing, plural ventilative openings corresponding to each other are formed. The plural ventilative openings on respective side board face the heat dissipating device. As such, the outside air is drawn into the inside casing from the ventilative openings on one side board, and the hot air inside the casing is exhausted to outside through the ventilative openings on other side board. Therefore, not only the circulation of the air convection inside the computer casing is increased, but also the heat conducted by the heat dissipating device is rapidly dissipated so that the heat dissipating efficiency of the dissipating device is significantly enhanced.
Description
- The present invention is related to a heat dissipating structure, and more particularly, to a heat dissipating structure for a computer host, which is able to increase the circulation of the air flowing inside the computer casing so that the heat conducted by the heat dissipating device on the CPU can be rapidly dissipated. Accordingly, the heat dissipating efficiency of the dissipating device is significantly enhanced so that the best heat dissipation is achieved.
- With the fast developments in the industry of scientific technology, the working speed of the computer has been prominently accelerated. Especially when the CPU has a higher and higher operation speed, the heat generated from the CPU during its operation is greatly increased.
- The conventional computer casing is mostly a rectangular body including a front, a back, a left side and a right side. There are disk drive and CD-ROM drive mounted on the front of the computer casing, while the power outlet, the connection ports for different interfaces and the heat dissipating fan are mounted at the back of the computer casing. The heat dissipating fan extracts the hot air from the inside computer casing and exhausts the hot air to the outside, or, draws the outside cold air into the computer casing so as to lower the temperature inside the computer casing. Accordingly, the heat dissipating efficiency for the CPU can be enhanced.
- However, the heat dissipating in the conventional computer casing depends on single heat dissipating fan, which often diminishes the efficiency of the air convection owing to the fewer air flowing or the low-speed flowing. Therefore, the hot air inside the computer casing can not be exhausted to the outside promptly, but accumulated inside the computer casing. Accordingly, the heat dissipating efficiency for the CPU is reduced and the heat dissipating effectiveness for the CPU is seriously affected.
- Hence, how to improve the heat dissipating efficiency for the CPU has become a major problem waited to be solved in the industry. In order to overcome the drawbacks in the prior art, a heat dissipating structure for a computer host capable of providing a fine air flowing, is provided.
- The present invention is to provide a heat dissipating structure for a computer host, which enhances the circulation of the air convection inside the computer casing so that the heat conducted by the heat dissipating device on the CPU can be rapidly dissipated. Hence, the heat dissipating efficiency of the dissipating device is significantly enhanced and the best heat dissipating effectiveness is achieved as well.
- According to one aspect of the present invention, the features of the present invention are that the computer host machine has a casing where a mother board, a CPU with a heat dissipating device mounted thereon, and plural electrical components are located. On the side boards of the computer casing, the plural ventilative openings are mounted at positions corresponding to each other. The plural ventilative openings on the respective side boards are mounted at positions facing the heat dissipating device. As such, the outside flowing wind is drawn into the inside casing from the ventilative openings on one side board, and the hot air inside the casing is exhausted to the outside through the ventilative openings on other side board. Therefore, not only the circulation efficiency of the air convection inside the computer casing is increased, but also the heat conducted by the heat dissipating device is rapidly dissipated so that the heat dissipating efficiency of the dissipating device is significantly enhanced.
- According to another aspect of the present invention, the feature of the present invention is that the heat dissipating device includes two adjacent heat dissipating fin modules, a first heat dissipating fin module and a second heat dissipating fin module. Further, there are a first and a second heat dissipating fans respectively mounted on the two external surfaces of the two heat dissipating fin modules, rather than the two inside surfaces between the two adjacent heat dissipating fin modules. The blades of the first heat dissipating fan and the second heat dissipating fan have the same rotary directions. As such, via the first heat dissipating fan, the outside air is extracted inside from the ventilative openings on one side board and blown to an area around two adjacent heat dissipating fin modules. Then, via the second heat dissipating fan, the heat conducted to the two adjacent heat dissipating fin modules is exhausted outside through the ventilative openings on other side board of the casing. Through the extraction and exhausting movements of the two heat dissipating fans, the air flowing inside the heat dissipating device is rapidly accelerated and therefore the heat dissipating efficiency is significantly enhanced.
- The foregoing and other features and advantages of the present invention will be more clearly understood through the following descriptions with reference to the drawings, wherein:
-
FIG. 1 is a schematic diagram showing the structure of the computer casing, the mother board, and the heat dissipating device according to a preferred embodiment of the present invention; -
FIG. 2 is a perspective view showing the outside appearance of the computer casing before assembling the left and right side boards according to a preferred embodiment of the present invention; -
FIG. 3 is a perspective view showing the outside appearance of the computer casing according to a preferred embodiment of the present invention; and -
FIG. 4 is a sectional view showing the air flowing inside the computer casing achieved by the heat dissipating device according to a preferred embodiment of the present invention. - The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.
- A heat dissipating structure for a computer host is provided in the present invention. Please refer to
FIG. 1 . Thecomputer host machine 10 includes thecomputer casing 1 which is generally a rectangular body. Thecomputer casing 1 is defined as having afront 11, aback 12, aleft side 13 and aright side 14. The distance between thefront 11 and theback 12 is lengthier than that between theleft side 13 and theright side 14. There are devices like disk cartridge and CD-ROM drive mounted at thefront 11 of thecomputer casing 1. And there are elements like power socket and connection ports for different interfaces mounted at theback 12. There is themother board 2 mounted inside thecomputer casing 1. TheCPU 21 and the electrical elements or devices 22 are positioned on themother board 2. Also, theheat dissipating device 3 is positioned on theCPU 21. - According to a preferred embodiment of the present invention, the
heat dissipating device 3 on theCPU 21 includes two adjacent heat dissipating fin modules, the first heat dissipatingfin module 31 and the second heat dissipatingfin module 32. Further, there are the firstheat dissipating fan 33 and the secondheat dissipating fan 34 respectively mounted on the two external surfaces of the two heat dissipatingfin modules fin modules heat dissipating fan 33 and the secondheat dissipating fan 34 have the same rotary directions. Certainly, according to a preferred embodiment of the present invention, implementing a single one heat dissipating fin modules 31 (or 32) and a single one heat dissipating fan 33 (or 34) is workable as well. - Please refer to
FIGS. 2-3 . Theleft side 13 and theright side 14 of thecomputer casing 1 respectively have aleft side board 4 and aright side board 5. Certainly, there arefront board 6 and back board (not shown) respectively mounted at thefront 11 and theback 12 of thecomputer casing 1. On theleft side board 4 and theright side board 5, the pluralventilative openings ventilative openings left side board 4 andright side board 5 are opened at positions facing theheat dissipating device 3. - Please refer
FIG. 4 . After thecomputer host machine 10 starts to operate, theheat dissipating device 3 will start to dissipate the heat forCPU 21. Accordingly, the outside wind is drawn inside thecomputer casing 1 from theventilative openings 51 on theright side board 5. Plus the extracting driven by the firstheat dissipating fan 33, the outside wind is blown inside thecomputer casing 1 rapidly and blown to an area around two adjacent heat dissipatingfin modules heat dissipating fan 34, the heat conducted to the two adjacent heat dissipatingfin modules ventilative openings 41 on theleft side board 4 of thecomputer casing 1. Hence, the generated heat will not accumulate inside thecomputer casing 1. - In this embodiment, since the outside wind is extracted inside the
computer casing 1 from theventilative openings 51 on oneside board 5 and the hot air is exhausted outside through theventilative openings 41 on theother side board 4, plus the distance between theleft side board 4 andright side board 5 is shorter, the circulation efficiency of the air convection inside thecomputer casing 1 is enhanced. The heat conducted by theheat dissipating device 3 is rapidly dissipated. Hence, the heat dissipating efficiency of thedissipating device 3 is significantly enhanced and the best heat dissipating effectiveness is achieved as well. Accordingly, the present invention not only has a novelty and a progressive nature, but also has an industry utility. - While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims (4)
1. A heat dissipating structure for a computer host, comprising:
a casing having a front side, a back side, a left side and a right side;
a mother board having a CPU, plural electrical components mounted thereon;
a heat dissipating device mounted on the CPU for dissipating heat generated therefrom,
wherein the left side and the right side respectively have a left side board and a right side board for opening thereon plural ventilative openings corresponding to each other, and the plural ventilative openings on respective left side board and right side board are opened at positions facing the heat dissipating device.
2. The heat dissipating structure for a computer host according to claim 1 , wherein the heat dissipating device comprises a first heat dissipating fin module and a second heat dissipating fin module which are adjacent to each other.
3. The heat dissipating structure for a computer host according to claim 2 , wherein two outside surfaces of the first heat dissipating fin module and the second heat dissipating fin module have a first heat dissipating fan and a second heat dissipating fan mounted thereon respectively.
4. The heat dissipating structure for a computer host according to claim 3 , wherein the first heat dissipating fan and the second heat dissipating fan are rotated at the same direction.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003287946A JP3521332B1 (en) | 2003-08-06 | 2003-08-06 | Imaging lens |
JP287946/2003 | 2003-08-06 |
Publications (1)
Publication Number | Publication Date |
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US20050030714A1 true US20050030714A1 (en) | 2005-02-10 |
Family
ID=32290692
Family Applications (2)
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US10/828,310 Expired - Fee Related US6985307B2 (en) | 2003-08-06 | 2004-04-21 | Imaging lens |
US10/828,311 Abandoned US20050030714A1 (en) | 2003-08-06 | 2004-04-21 | Heat dissipating structure for computer host |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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US10/828,310 Expired - Fee Related US6985307B2 (en) | 2003-08-06 | 2004-04-21 | Imaging lens |
Country Status (6)
Country | Link |
---|---|
US (2) | US6985307B2 (en) |
EP (1) | EP1505422B1 (en) |
JP (1) | JP3521332B1 (en) |
KR (1) | KR100567843B1 (en) |
CN (1) | CN1271439C (en) |
DE (1) | DE602004000394T2 (en) |
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2003
- 2003-08-06 JP JP2003287946A patent/JP3521332B1/en not_active Expired - Fee Related
-
2004
- 2004-04-21 US US10/828,310 patent/US6985307B2/en not_active Expired - Fee Related
- 2004-04-21 US US10/828,311 patent/US20050030714A1/en not_active Abandoned
- 2004-04-28 EP EP04252472A patent/EP1505422B1/en not_active Expired - Fee Related
- 2004-04-28 DE DE602004000394T patent/DE602004000394T2/en not_active Expired - Fee Related
- 2004-05-12 KR KR1020040033286A patent/KR100567843B1/en not_active IP Right Cessation
- 2004-05-27 CN CNB2004100475897A patent/CN1271439C/en not_active Expired - Fee Related
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US6043980A (en) * | 1997-02-24 | 2000-03-28 | Fujitsu Limited | Heat sink and information processor using it |
US5959837A (en) * | 1998-04-02 | 1999-09-28 | Ideal Electronics Inc. | Heat-radiating structure for CPU |
US6637505B1 (en) * | 1999-08-18 | 2003-10-28 | The Furukawa Electric Co., Ltd. | Apparatus for cooling a box with heat generating elements received therein and a method for cooling same |
US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
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US6909608B2 (en) * | 2003-02-25 | 2005-06-21 | Datech Technology Co., Ltd. | Heat sink assembly with heat pipe |
US6882532B2 (en) * | 2003-03-10 | 2005-04-19 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
US20040188063A1 (en) * | 2003-03-31 | 2004-09-30 | Hung Chang | Heat dissipating device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US7075787B2 (en) * | 2004-04-21 | 2006-07-11 | Shuttle Inc. | Heat dissipating structure for computer casing |
US20110080709A1 (en) * | 2009-10-05 | 2011-04-07 | Tony Lin | Digital Signage Player |
Also Published As
Publication number | Publication date |
---|---|
KR20050015974A (en) | 2005-02-21 |
DE602004000394T2 (en) | 2006-10-19 |
CN1580853A (en) | 2005-02-16 |
JP3521332B1 (en) | 2004-04-19 |
US20050030645A1 (en) | 2005-02-10 |
US6985307B2 (en) | 2006-01-10 |
DE602004000394D1 (en) | 2006-04-20 |
CN1271439C (en) | 2006-08-23 |
EP1505422B1 (en) | 2006-02-15 |
KR100567843B1 (en) | 2006-04-05 |
EP1505422A1 (en) | 2005-02-09 |
JP2005055751A (en) | 2005-03-03 |
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AS | Assignment |
Owner name: SHUTTLE INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WU, CHING-HIS;REEL/FRAME:015260/0932 Effective date: 20040308 |
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STCB | Information on status: application discontinuation |
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