US20050028965A1 - Combined structure of a thermal chamber and a thermal tower - Google Patents

Combined structure of a thermal chamber and a thermal tower Download PDF

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Publication number
US20050028965A1
US20050028965A1 US10/635,558 US63555803A US2005028965A1 US 20050028965 A1 US20050028965 A1 US 20050028965A1 US 63555803 A US63555803 A US 63555803A US 2005028965 A1 US2005028965 A1 US 2005028965A1
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Prior art keywords
thermal
chamber
tower
vacuum
vacuum thermal
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Abandoned
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US10/635,558
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Ching-Chih Chen
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HOTMON INERNATIONAL Corp
Hotmon International Corp
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HOTMON INERNATIONAL Corp
Hotmon International Corp
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Priority to US10/635,558 priority Critical patent/US20050028965A1/en
Assigned to HOTMON INERNATIONAL CORPORATION reassignment HOTMON INERNATIONAL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHING-CHIH
Assigned to HOTMON INTERNATIONAL CORPORATION reassignment HOTMON INTERNATIONAL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHING-CHIH
Publication of US20050028965A1 publication Critical patent/US20050028965A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a combined structure of a thermal chamber and a thermal tower; and especially relates to a heat sinking device of which the base is in the form of a hollow vacuum thermal chamber or vapor chamber, the upper surface of the base is combined with at least a vacuum thermal tower or heat pipe, wherein the inner spaces of the thermal chamber and the thermal tower are communicated with each other.
  • the structure suits a CPU of a computer, a projector, an LCD color monitor, a TV set and other heat generating electronic products.
  • a conventional heat-sinking device also has the chance of using a vacuum thermal tower, as the one shown in FIG. 1 , a conventional upright thermal tower 10 has a bottom 11 thereof welded to a heat-sinking bottom plate 12 to indirectly increase the contact area of the thermal tower with a heat generating source to increase the effect of heat sinking, however, the speed of heat sinking of it still is limited.
  • the primary object of the present invention is to provide a combined structure of a thermal chamber and a thermal tower, by mutual connecting of the thermal chamber and the thermal tower, the efficiency of heat sinking can be increased.
  • the combined structure of a thermal chamber and a thermal tower of the present invention comprises: a hollow vacuum thermal chamber forming a base, of which the upper surface is provided at least with an opening; and at least a vacuum thermal tower combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber and the thermal tower are communicated with each other. And the thermal tower can be added therearound with heat-sinking fins.
  • heat generating electronic products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc. can get excellent heat-sinking effects by heat conducting by means of the vacuum thermal chamber and the vacuum thermal tower.
  • FIG. 1 is an exploded perspective view showing the appearance of a conventional upright hollow thermal tower connected on the bottom thereof a bottom plate;
  • FIG. 2 is an exploded perspective view showing the appearance of a first embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention
  • FIG. 3 is an exploded perspective view showing the appearance of a second embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention
  • FIG. 4 is an analytic perspective view showing the combined structure of the second embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal column of the present invention
  • FIG. 5 is a perspective view showing the appearance of a third embodiment of the combined structure of a vacuum thermal chamber and two vacuum thermal towers or columns of the present invention
  • FIG. 5A is a sectional view showing the third embodiment of the combined structure of a vacuum thermal chamber and two vacuum thermal towers or columns of the present invention
  • FIG. 6 is a perspective view showing the appearance of a fourth embodiment of the combined structure of a vacuum thermal chamber and an inversed “U” shaped vacuum thermal tower or column of the present invention
  • FIG. 6A is a sectional view showing the fourth embodiment of the combined structure of a vacuum thermal chamber and an inversed “U” shaped vacuum thermal tower or column of the present invention
  • FIG. 7 is a perspective view showing the appearance of a fifth embodiment of the combined structure of a vacuum thermal chamber and four hollow heat pipes of the present invention.
  • the present invention is characterized in using the combined structure of a vacuum thermal chamber and at least a vacuum thermal tower or column to increase heat conductive heat-sinking effect, and to avoid damage or inferior function of products by overly large accumulating heat from heat generating sources.
  • the structure comprises an upright hollow vacuum thermal tower or thermal column 20 and a vacuum thermal chamber or vapor chamber 22 forming a base, the vacuum thermal chamber or vapor chamber 22 has on the upper surface thereof an opening 23 .
  • the hollow vacuum thermal tower or thermal column 20 has on the upper end thereof a vacuum sealed-opening 21 , and has the other end thereof the opened opening which is combined to the opening 23 to make the interior spaces communicated with each other.
  • a flat vacuum thermal chamber or vapor chamber 22 can be connected with a CPU of a computer, a projector, an LCD color monitor, a TV set and other heat generating electronic products; and heat can be fast scattered through the flat vacuum thermal chamber or vapor chamber 22 and the cylindrical vacuum thermal tower or thermal column 20 .
  • the structure comprises an upright hollow cylindrical vacuum thermal column 20 , a flat vacuum thermal chamber or vapor chamber 22 and a plurality of heat sinking fins 26 .
  • the upright hollow cylindrical vacuum thermal tower or thermal column 20 is combined at the periphery thereof with a plurality of heat sinking fins 26 parallel to the flat vacuum thermal chamber or vapor chamber 22 to increase the area and the effect of heat scattering.
  • the structure comprises: a hollow vacuum thermal chamber or vapor chamber 22 forming a base, the vacuum thermal chamber or vapor chamber 22 has on the upper surface thereof two openings 23 ; two cylindrical vacuum thermal towers or thermal columns 28 , 30 respectively combined with the two openings 23 , the interior space thereof is communicated with the interior space of the hollow vacuum thermal chamber or vapor chamber 22 ; and a plurality of heat sinking fins 26 combined with the peripheries of the two cylindrical vacuum thermal tower or thermal column 28 , 30 , and parallel to the vacuum thermal chamber or vapor chamber 22 .
  • the vacuum sealed-opening 21 can be provided on the upper end of either of the two cylindrical vacuum thermal tower or thermal column 28 , 30 , or can be provided on a side of the vacuum thermal chamber or vapor chamber 22 .
  • the structure comprises: an inversed “U” shaped vacuum thermal column 29 , a plurality of heat sinking fins 26 and a vacuum thermal chamber or vapor chamber 22 ; the inversed “U” shaped vacuum thermal column 29 is formed by bending of a straight vacuum thermal column.
  • a vacuum sealed-opening 25 is provided on one side of the vacuum thermal chamber or vapor chamber 22 .
  • the structure comprises: a vacuum thermal chamber or vapor chamber 22 forming a base, it has at the four corners on the upper surface thereof four openings; four hollow heat pipes all with a smaller diameter are combined respectively with the four openings of the vacuum thermal chamber or vapor chamber 22 , the interior space thereof are communicated with the interior space of the vacuum thermal chamber or vapor chamber 22 ; a plurality of heat sinking fins 27 combined with the peripheries of the four hollow heat pipes, the heat sinking fins 27 are parallel to the base or the vacuum thermal chamber or vapor chamber 22 , an opening 271 is formed centrally of the heat sinking fins 27 to get all the way through from the top to the bottom of them and to increase the effect of heat sinking.
  • the flat vacuum thermal chamber or vapor chamber 22 in the form of the base can be combined on the bottom thereof with a heat generating electronic device; heat can be effectively scattered through the combined structure stated above, and thereby the life of use of the electronic device can be elongated.
  • the present invention can surely get its expected object to provide a vacuum heat-sinking device.
  • the embodiments given are only for illustrating the present invention, and not for giving any limitation to the scope of the present invention. It will be apparent to those skilled in this art that various modifications or changes without departing from the spirit of this invention shall also fall within the scope of the appended claims. Having now particularly described and ascertained the nature of the present invention having its industrial value, we declare that what we claim are:

Abstract

A combined structure of a thermal chamber and a thermal tower, the structure suits heat generating products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc., and comprises: a hollow vacuum thermal chamber or vapor chamber forming a base, of which the upper surface has at least an opening; and at least a vacuum thermal tower or heat pipe combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber (or vapor chamber) and the thermal tower (or heat pipe) are communicated with each other. Thereby, heat can be fast conducted and scattered through the vacuum thermal chamber or vapor chamber and the vacuum thermal tower or heat pipe.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a combined structure of a thermal chamber and a thermal tower; and especially relates to a heat sinking device of which the base is in the form of a hollow vacuum thermal chamber or vapor chamber, the upper surface of the base is combined with at least a vacuum thermal tower or heat pipe, wherein the inner spaces of the thermal chamber and the thermal tower are communicated with each other. The structure suits a CPU of a computer, a projector, an LCD color monitor, a TV set and other heat generating electronic products.
  • 2. Description of the Prior Art
  • The art of computer information and techniques of the manufacturers of it have been developed very fast and updated from day to day, the assemblies in a CPU derived from them have had more and more circuits, thus energy consumption has been continuously increased, and problems of heat sinking can not help being mentioned again in order that heat accumulation by high speed operation of a CPU in a computer that induces raising of temperature and damage of the CPU can be avoided. In conventional CPU heat-sinking devices, it is often seen that a fan driven by electric power scatters heat absorbed by a heat-sinking body from an heat source object into a sealed housing of a mainframe in order to get a goal of forced convection; however, this has the defects of substantial electric power consumption, large volume, large noise, slow speed of heat sinking as well as vibration. And, at present time, there is a use of a thermal tower having no air pressure, wherein the thermal tower set with working fluid to efficiently increase the speed of heat sinking.
  • A conventional heat-sinking device also has the chance of using a vacuum thermal tower, as the one shown in FIG. 1, a conventional upright thermal tower 10 has a bottom 11 thereof welded to a heat-sinking bottom plate 12 to indirectly increase the contact area of the thermal tower with a heat generating source to increase the effect of heat sinking, however, the speed of heat sinking of it still is limited.
  • In view of these defects to be gotten rid of and to increase the efficiency of heat sinking, the present invention is developed.
    • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a combined structure of a thermal chamber and a thermal tower, by mutual connecting of the thermal chamber and the thermal tower, the efficiency of heat sinking can be increased.
  • To achieve the above stated object, the combined structure of a thermal chamber and a thermal tower of the present invention comprises: a hollow vacuum thermal chamber forming a base, of which the upper surface is provided at least with an opening; and at least a vacuum thermal tower combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber and the thermal tower are communicated with each other. And the thermal tower can be added therearound with heat-sinking fins.
  • Thereby, heat generating electronic products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc. can get excellent heat-sinking effects by heat conducting by means of the vacuum thermal chamber and the vacuum thermal tower.
  • The present invention will be apparent after reading the detailed description of the preferred embodiments thereof in reference to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded perspective view showing the appearance of a conventional upright hollow thermal tower connected on the bottom thereof a bottom plate;
  • FIG. 2 is an exploded perspective view showing the appearance of a first embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention;
  • FIG. 3 is an exploded perspective view showing the appearance of a second embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention;
  • FIG. 4 is an analytic perspective view showing the combined structure of the second embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal column of the present invention;
  • FIG. 5 is a perspective view showing the appearance of a third embodiment of the combined structure of a vacuum thermal chamber and two vacuum thermal towers or columns of the present invention;
  • FIG. 5A is a sectional view showing the third embodiment of the combined structure of a vacuum thermal chamber and two vacuum thermal towers or columns of the present invention;
  • FIG. 6 is a perspective view showing the appearance of a fourth embodiment of the combined structure of a vacuum thermal chamber and an inversed “U” shaped vacuum thermal tower or column of the present invention;
  • FIG. 6A is a sectional view showing the fourth embodiment of the combined structure of a vacuum thermal chamber and an inversed “U” shaped vacuum thermal tower or column of the present invention;
  • FIG. 7 is a perspective view showing the appearance of a fifth embodiment of the combined structure of a vacuum thermal chamber and four hollow heat pipes of the present invention.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • The present invention is characterized in using the combined structure of a vacuum thermal chamber and at least a vacuum thermal tower or column to increase heat conductive heat-sinking effect, and to avoid damage or inferior function of products by overly large accumulating heat from heat generating sources.
  • Referring to FIG. 2 showing a first embodiment of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention, the structure comprises an upright hollow vacuum thermal tower or thermal column 20 and a vacuum thermal chamber or vapor chamber 22 forming a base, the vacuum thermal chamber or vapor chamber 22 has on the upper surface thereof an opening 23.
  • The hollow vacuum thermal tower or thermal column 20 has on the upper end thereof a vacuum sealed-opening 21, and has the other end thereof the opened opening which is combined to the opening 23 to make the interior spaces communicated with each other.
  • Thereby as shown in FIG. 2, by drawing air to make a vacuum from the upper end of the vacuum sealed-opening 21, the bottom of a flat vacuum thermal chamber or vapor chamber 22 can be connected with a CPU of a computer, a projector, an LCD color monitor, a TV set and other heat generating electronic products; and heat can be fast scattered through the flat vacuum thermal chamber or vapor chamber 22 and the cylindrical vacuum thermal tower or thermal column 20.
  • Referring FIGS. 3 and 4 showing a second embodiment of the present invention, the structure comprises an upright hollow cylindrical vacuum thermal column 20, a flat vacuum thermal chamber or vapor chamber 22 and a plurality of heat sinking fins 26.
  • The upright hollow cylindrical vacuum thermal tower or thermal column 20 is combined at the periphery thereof with a plurality of heat sinking fins 26 parallel to the flat vacuum thermal chamber or vapor chamber 22 to increase the area and the effect of heat scattering.
  • Referring FIGS. 5 and 5A showing a third embodiment of the present invention, the structure comprises: a hollow vacuum thermal chamber or vapor chamber 22 forming a base, the vacuum thermal chamber or vapor chamber 22 has on the upper surface thereof two openings 23; two cylindrical vacuum thermal towers or thermal columns 28, 30 respectively combined with the two openings 23, the interior space thereof is communicated with the interior space of the hollow vacuum thermal chamber or vapor chamber 22; and a plurality of heat sinking fins 26 combined with the peripheries of the two cylindrical vacuum thermal tower or thermal column 28, 30, and parallel to the vacuum thermal chamber or vapor chamber 22. When in practicing, the vacuum sealed-opening 21 can be provided on the upper end of either of the two cylindrical vacuum thermal tower or thermal column 28, 30, or can be provided on a side of the vacuum thermal chamber or vapor chamber 22.
  • Referring FIGS. 6 and 6A showing a fourth embodiment of the present invention, the structure comprises: an inversed “U” shaped vacuum thermal column 29, a plurality of heat sinking fins 26 and a vacuum thermal chamber or vapor chamber 22; the inversed “U” shaped vacuum thermal column 29 is formed by bending of a straight vacuum thermal column. In the present embodiment of the present invention, a vacuum sealed-opening 25 is provided on one side of the vacuum thermal chamber or vapor chamber 22.
  • Referring to FIG. 7 showing a fifth embodiment of the present invention, the structure comprises: a vacuum thermal chamber or vapor chamber 22 forming a base, it has at the four corners on the upper surface thereof four openings; four hollow heat pipes all with a smaller diameter are combined respectively with the four openings of the vacuum thermal chamber or vapor chamber 22, the interior space thereof are communicated with the interior space of the vacuum thermal chamber or vapor chamber 22; a plurality of heat sinking fins 27 combined with the peripheries of the four hollow heat pipes, the heat sinking fins 27 are parallel to the base or the vacuum thermal chamber or vapor chamber 22, an opening 271 is formed centrally of the heat sinking fins 27 to get all the way through from the top to the bottom of them and to increase the effect of heat sinking.
  • Therefore, by drawing air to make a vacuum, the flat vacuum thermal chamber or vapor chamber 22 in the form of the base can be combined on the bottom thereof with a heat generating electronic device; heat can be effectively scattered through the combined structure stated above, and thereby the life of use of the electronic device can be elongated.
  • The present invention thereby has the following advantages:
      • 1. After drawing air to make a vacuum of a conventional upright thermal tower, a plate is welded to the bottom of the thermal tower to increase the contact area of the thermal tower with a heat generating body to increase the effect of heat sinking; however, the speed of heat sinking of it is far smaller than that of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention having the interior spaces of them mutually communicated, thereby, the present invention has higher efficiency of heat sinking.
      • 2. The interior spaces of the vacuum thermal chamber and the vacuum thermal tower of the present invention are mutually communicated, so that the vacuum sealed-opening of the present invention can be provided on the upper end of the vacuum thermal tower, or on a side of the vacuum thermal chamber, thus the present invention is more convenient in operation.
  • In conclusion, the present invention can surely get its expected object to provide a vacuum heat-sinking device. The embodiments given are only for illustrating the present invention, and not for giving any limitation to the scope of the present invention. It will be apparent to those skilled in this art that various modifications or changes without departing from the spirit of this invention shall also fall within the scope of the appended claims. Having now particularly described and ascertained the nature of the present invention having its industrial value, we declare that what we claim are:

Claims (9)

1. A combined structure of a thermal chamber and a thermal tower, said structure comprises:
a hollow vacuum thermal chamber forming a base, of which an upper surface is provided at least with an opening; and
at least a vacuum thermal tower combined with said opening of said vacuum thermal chamber, the inner spaces of said thermal chamber and said thermal tower are communicated with each other;
thereby, heat is conducted and scattered through said thermal chamber and said thermal tower.
2. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
said vacuum thermal tower has on an upper end thereof a vacuum sealed-opening.
3. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
a vacuum sealed-opening is provided on a side of said vacuum thermal chamber.
4. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
the bottom of said vacuum thermal chamber is connected with a heat generating body in use.
5. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
said vacuum thermal tower is upright and is provided at the periphery thereof with a plurality of heat sinking fins to increase heat sinking function.
6. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
said vacuum thermal tower is a vacuum thermal tower or a vacuum thermal column having air therein drawn to make a vacuum.
7. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
said vacuum thermal tower is an inversed “U” shaped vacuum thermal tower.
8. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
said thermal tower includes a plurality of heat pipes all of a smaller diameter.
9. The combined structure of a thermal chamber and a thermal tower as in claim 8, wherein:
said heat pipes are embedded in a plurality of heat sinking fins with an opening provided centrally thereof.
US10/635,558 2003-08-07 2003-08-07 Combined structure of a thermal chamber and a thermal tower Abandoned US20050028965A1 (en)

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Cited By (21)

* Cited by examiner, † Cited by third party
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US20060120050A1 (en) * 2004-12-06 2006-06-08 Win-Haw Chen Closed loop heat dissipation apparatus
US20070258213A1 (en) * 2006-05-03 2007-11-08 International Business Machines Corporation Apparatuses for dissipating heat from semiconductor devices
US20080043438A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Cross-Flow Thermal Management Device and Method of Manufacture Thereof
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
EP2248406A1 (en) * 2008-02-27 2010-11-10 Hewlett-Packard Development Company, L.P. Heat sink device
US20110157484A1 (en) * 2009-12-31 2011-06-30 Dell Products, Lp Integrated Projector System
US20140298677A1 (en) * 2013-04-08 2014-10-09 Quanta Computer Inc. Glue-thermal curing equipment
US9101125B2 (en) 2012-04-06 2015-08-11 Elizabeth Knote Heat chamber for termination of bed bugs and other arthropods
CN106643247A (en) * 2017-01-23 2017-05-10 中车大连机车研究所有限公司 Composite liquid absorption core type heat pipe radiator
CN106643246A (en) * 2017-01-23 2017-05-10 中车大连机车研究所有限公司 Composite wick type special-shaped heat pipe radiator
CN106705724A (en) * 2017-01-23 2017-05-24 中车大连机车研究所有限公司 Fluffy fin fiber composite groove type heat pipe
US20170314870A1 (en) * 2016-04-30 2017-11-02 Taiwan Microloops Corp. Heat dissipating structure and water-cooling heat dissipating apparatus including the structure
CN107462094A (en) * 2017-08-03 2017-12-12 四川建源节能科技有限公司 Phase transformation heat collector cavity heat pipe heat
CN107478081A (en) * 2017-08-30 2017-12-15 四川建源节能科技有限公司 It is easy to be fixed on the heat exchanger tube on water pipe
US10045464B1 (en) * 2017-03-31 2018-08-07 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
CN109708499A (en) * 2017-10-26 2019-05-03 新光电气工业株式会社 The manufacturing method of heat pipe and heat pipe
US10641556B1 (en) 2019-04-26 2020-05-05 United Arab Emirates University Heat sink with condensing fins and phase change material
US11026343B1 (en) 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US11092385B2 (en) * 2019-05-23 2021-08-17 Asia Vital Components (China) Co., Ltd. Complex vapor chamber structure
US11435144B2 (en) * 2019-08-05 2022-09-06 Asia Vital Components (China) Co., Ltd. Heat dissipation device
EP4060274A1 (en) * 2021-03-18 2022-09-21 Guangdong Envicool Technology Co., Ltd. Heat dissipation device

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060120050A1 (en) * 2004-12-06 2006-06-08 Win-Haw Chen Closed loop heat dissipation apparatus
US20070258213A1 (en) * 2006-05-03 2007-11-08 International Business Machines Corporation Apparatuses for dissipating heat from semiconductor devices
US7369410B2 (en) * 2006-05-03 2008-05-06 International Business Machines Corporation Apparatuses for dissipating heat from semiconductor devices
US20080043438A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Cross-Flow Thermal Management Device and Method of Manufacture Thereof
US20080043437A1 (en) * 2006-08-17 2008-02-21 Ati Technologies Inc. Three-Dimensional Thermal Spreading in an Air-Cooled Thermal Device
US7965511B2 (en) 2006-08-17 2011-06-21 Ati Technologies Ulc Cross-flow thermal management device and method of manufacture thereof
US7974096B2 (en) 2006-08-17 2011-07-05 Ati Technologies Ulc Three-dimensional thermal spreading in an air-cooled thermal device
EP2248406A4 (en) * 2008-02-27 2012-10-24 Hewlett Packard Development Co Heat sink device
EP2248406A1 (en) * 2008-02-27 2010-11-10 Hewlett-Packard Development Company, L.P. Heat sink device
US20100014251A1 (en) * 2008-07-15 2010-01-21 Advanced Micro Devices, Inc. Multidimensional Thermal Management Device for an Integrated Circuit Chip
US20110157484A1 (en) * 2009-12-31 2011-06-30 Dell Products, Lp Integrated Projector System
US8712326B2 (en) * 2009-12-31 2014-04-29 Dell Products, Lp Integrated projector system
US9160991B2 (en) 2009-12-31 2015-10-13 Dell Products, Lp Integrated projector system
US9101125B2 (en) 2012-04-06 2015-08-11 Elizabeth Knote Heat chamber for termination of bed bugs and other arthropods
US20140298677A1 (en) * 2013-04-08 2014-10-09 Quanta Computer Inc. Glue-thermal curing equipment
US9134066B2 (en) * 2013-04-08 2015-09-15 Quanta Computer Inc. Glue-thermal curing equipment
US11026343B1 (en) 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US20170314870A1 (en) * 2016-04-30 2017-11-02 Taiwan Microloops Corp. Heat dissipating structure and water-cooling heat dissipating apparatus including the structure
CN106643247A (en) * 2017-01-23 2017-05-10 中车大连机车研究所有限公司 Composite liquid absorption core type heat pipe radiator
CN106705724A (en) * 2017-01-23 2017-05-24 中车大连机车研究所有限公司 Fluffy fin fiber composite groove type heat pipe
CN106643246A (en) * 2017-01-23 2017-05-10 中车大连机车研究所有限公司 Composite wick type special-shaped heat pipe radiator
US10045464B1 (en) * 2017-03-31 2018-08-07 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US20180288902A1 (en) * 2017-03-31 2018-10-04 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US10575440B2 (en) * 2017-03-31 2020-02-25 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US10966351B2 (en) 2017-03-31 2021-03-30 Elpis Technologies Inc. Heat pipe and vapor chamber heat dissipation
CN107462094A (en) * 2017-08-03 2017-12-12 四川建源节能科技有限公司 Phase transformation heat collector cavity heat pipe heat
CN107478081A (en) * 2017-08-30 2017-12-15 四川建源节能科技有限公司 It is easy to be fixed on the heat exchanger tube on water pipe
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