US20050023663A1 - Method of forming a package - Google Patents
Method of forming a package Download PDFInfo
- Publication number
- US20050023663A1 US20050023663A1 US10/930,026 US93002604A US2005023663A1 US 20050023663 A1 US20050023663 A1 US 20050023663A1 US 93002604 A US93002604 A US 93002604A US 2005023663 A1 US2005023663 A1 US 2005023663A1
- Authority
- US
- United States
- Prior art keywords
- attaching
- subassembly
- lead
- cover
- placing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/141—Analog devices
- H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present invention relates generally to device packaging and, more particularly, to lead frame packaging.
- Wire bonding is typically used to provide electrical connections between bonding pads of the chip and the leads of the package.
- Current wire bonding technology prevents wire bonds from being formed that are less than about ten mils long. This drawback, coupled with the fact that wire bonds cannot be formed with acceptably tight tolerances at such dimensions, often results in unpredictable and/or unacceptable transmission characteristics for microwave devices.
- the flip chip mounting technique involves flipping the chip and connecting the chip's top surface to the substrate.
- a number of electrically conductive flip chip bumps are typically provided between the chip's top surface and the substrate to provide an electrical connection between the chip and the substrate, and hence the other components connected to the top surface of the substrate.
- the present invention is directed to a method of packaging a device as well as an apparatus formed by the method.
- the apparatus includes a base connected to the device, and a cover.
- the cover includes a plastic body and at least one electrically conductive lead.
- the body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.
- the apparatus includes a device connected to an electrically conductive baseplate, and a cover.
- the cover includes a plastic body and at least one electrically conductive lead.
- the body of the cover is connected to the baseplate such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is connected to the device via an electrically conductive bump.
- the method includes attaching the device to a base, and attaching the base to a cover, the cover including a plastic body and at least one electrically conductive lead, such that the body encloses the device and such that the exposed portion of the lead is electrically connected to the device.
- the present invention provides a lead frame package that realizes the mechanical and electrical qualities necessary for high performance RF and microwave semiconductor.
- the package of the present invention may provide an air gap that is ideally suited for devices requiring free spaces.
- embodiments of the present invention contemplate the use of materials that are ideally suited for high frequency applications, such as a low loss liquid crystal polymer injection molded plastic cover and a baseplate having a coefficient of thermal expansion (CTE) that matches the substrate material of the device.
- the leads of the package may be configured to provide controlled matching for high frequency applications.
- the present invention provides cost advantages. The materials are relatively inexpensive, and the assembly process is ideally suited for high volume production and automation.
- FIG. 1 is a cross-sectional diagram of an apparatus according to one embodiment of the present invention.
- FIG. 2 is a diagram illustrating a method of fabricating the apparatus of FIG. 1 according to one embodiment of the present invention
- FIG. 3 is a perspective view of a lead of the apparatus of FIG. 1 according to one embodiment of the present invention.
- FIG. 4 is a cross-sectional diagram of the apparatus according to another embodiment of the present invention.
- FIG. 5 is a graph illustrating the performance of the apparatus according to one embodiment of the present invention.
- FIG. 1 is a cross-sectional diagram of an apparatus 10 according to one embodiment of the present invention.
- the apparatus 10 includes a device 12 , a cover 14 , and a baseplate 16 .
- the cover 14 includes a body 17 and a number of electrically conductive leads 18 captured therein. Although only two are shown in FIG. 1 , the apparatus 10 may include as many leads 18 as are necessary to provide the appropriate external connections for the device 12 .
- the body 17 may be fabricated from injection molded plastic with the leads 18 captured therein, such that a portion 20 of the leads 18 are exposed on the inner surface 21 of the body 17 of the cover 14 .
- the apparatus 10 includes electrically conductive bumps 22 mounted to the bonding pads of the device 12 .
- the exposed portions 20 of the leads 18 are in electrical contact with the bonding pads of the device 12 via the bumps 22 .
- the resulting air gap 24 between the upper surface 26 of the device 12 and the inner surface 21 of the body 17 makes the apparatus 10 well suited for applications requiring free spaces, such as, for example, when the device 12 is a microwave device.
- the air gap 24 may be filled with air, any other gas, or combination of gases.
- the device 12 may be a semiconductor or a non-semiconductor device.
- the device 12 may be a chip fabricated from, for example, a silicon or gallium arsenide substrate, and may be, for example, a conventional integrated circuit (IC), an RF device, or a microwave device, such as a MMIC (monolithic microwave integrated circuit).
- the device 12 may be, for example, a MIC (microwave integrated circuit) fabricated from ceramic material such as, for example, Al 2 O 3 , AlN, or BeO.
- the device 12 may also be a power device such as, for example, a power amplifier.
- the device 12 may be a MEMS (micro electromechanical systems) device, an optoelectronic device, a crystal device, or an acoustic wave device. According to other embodiments, the device 12 may be, for example, a capacitor.
- MEMS micro electromechanical systems
- the device 12 may be, for example, a capacitor.
- the body 17 of the cover 14 may be formed from injection molded plastic.
- the leads 18 may be captured in the body 17 such that the exposed portions 20 of the leads 18 are exposed on the inner surface 21 of the body 17 of the cover 14 .
- the exposed portions 20 of the leads 18 may be configured to correspond to the bonding pad locations on the device 12 .
- the inner surface 21 of the body 17 may have sidewalls 27 connected to the base 16 by, for example, epoxy as discussed further hereinbelow.
- the body 17 of the cover 14 may additionally include a lip (not shown) that is connected to an upper surface of the base 16 .
- the body 17 may be fabricated from any material suitable for injection molding, including materials that have low electrical loss at high frequency.
- the body 17 may be fabricated from liquid crystal polymer (LCP), a relatively low loss material at microwave frequencies.
- the body 17 may include a metallization layer (not shown) on its outer surface 28 to minimize radiation.
- the cover 14 may be configured to include a layer of absorbing material (not shown) in the body 17 of the cover 14 to prevent coupling.
- the device 12 is attached to the baseplate 16 .
- the baseplate 16 may be made of an electrically conductive material such as, for example, copper, aluminum, or a metal matrix composite. Therefore, for an embodiment in which the device 12 is a microwave device, such as MMIC, the baseplate 16 may act as a ground.
- the baseplate 16 may be fabricated from a material that is thermally conductive as well, such as aluminum, to therefore act as a heat sink for the device 12 .
- the baseplate 16 may have a coefficient of thermal expansion (CTE) that matches that of the device 12 .
- CTE coefficient of thermal expansion
- the baseplate 16 may include a low CTE material such as, for example, CuW or Cu/Mo/Cu. According to such an embodiment, the baseplate 16 may be attached to the device 12 using a eutectic die attach. According to other embodiments, such as when thermal and electrical properties of the baseplate 16 are not critical, the baseplate 16 may be fabricated from an insulative (i.e., dielectric) material such as, for example, plastic.
- insulative i.e., dielectric
- the leads 18 may have a variety of geometric formations, and may be made of any suitable electrically and thermally conductive material.
- the leads 18 may be flat, they may be gull-wing shaped for, e.g., surface mount applications, or they may be bent backward underneath the cover 14 to thereby provide a leadless package.
- solder balls (not shown) may be attached to the leads 18 to provide a ball grid array (BGA) package.
- BGA ball grid array
- the electrically conductive bumps 22 provide an electrical connection between the exposed portions 20 of the leads 18 and the bonding pads, or electrodes, of the device 12 .
- the bumps 22 may be formed of, for example, metal, such as gold, or conductive polymers, and may have a diameter of approximately four mills or less.
- FIG. 2 is a flowchart of a process of making the apparatus 10 according to one embodiment of the present invention.
- the process initiates at block 40 , where the device 12 is attached to the baseplate 16 .
- the device 12 may be attached to the baseplate 16 using a conductive epoxy.
- the process advances to block 42 , where the electrically conductive bumps 22 are attached to the bonding pads of the device 12 .
- the bumps 22 may be attached using ball bonders.
- the process advances to block 44 , where the subassembly (i.e., the device 12 , the baseplate 16 , and the bumps 22 ) is flipped and placed in the opening revealed by an inverted cover 14 .
- the subassembly i.e., the device 12 , the baseplate 16 , and the bumps 22 .
- conductive epoxy is dispensed on the exposed portions 20 of the leads 18 to thereby facilitate attachment of the subassembly to the cover 14 .
- nonconductive epoxy is dispensed in the gaps between the baseplate 16 and the cover 14 to thereby seal the device 12 in the package.
- the process advances to block 48 , where the apparatus 10 is cured.
- pressure may be applied to the baseplate 16 to facilitate bonding.
- one cure may only be required for both the conductive and nonconductive epoxy, although additional curing steps may be used if necessary.
- the bumps 22 may be bonded to the exposed portions 20 of the leads 18 using, for example, solder, thermal compression, or ultrasonic bonding.
- the process just described is advantageously suited for large volume production and automation.
- the process may be implemented using a conventional pick-and-place machine to place the cover/baseplate subassembly in the opening of the inverted cover 14 although, according to other embodiments, a flip-chip automation process may be used.
- the leads 18 and the baseplate 16 form an essential geometry of microstrip lines. Consequently, according to one embodiment, the geometry of the leads 18 may be configured to provide adequate matching between the leads 18 and the bumps 22 , which is critical at microwave frequencies. For example, by selecting the proper lead width, even using a stepped width configuration if necessary, reasonably good wide band or narrow band matching may be realized.
- FIG. 3 is a perspective view of a lead 18 according to such an embodiment. In the illustrated embodiment, the vertical portion 50 of the lead 18 is much wider than its horizontal portions 52 , 54 . For purposes of clarity, the body 17 portion of the cover 14 is not shown in FIG. 3 . In addition, the horizontal portion 54 may include the exposed portion 22 of the lead 18 , which is electronically connected to the device 12 .
- FIG. 4 is a cross-sectional diagram of the apparatus 10 according to another embodiment of the present invention.
- a number of devices 12 a - c is fabricated on a substrate 60 .
- some or all of the devices 12 a - c may be attached to the substrate 60 .
- the substrate 60 mechanically supports the body 17 portion of the cover 14 , which is connected thereto.
- the exposed portions 20 of the leads 18 are bonded directly to the bonding pads of the substrate 60 , thus eliminating the conductive bumps 22 .
- the exposed portions 20 of the leads 18 may be bonded to the substrate using, for example, conductive epoxy or solder. Such a configuration may be acceptable where the bonding pads are physically large enough that the bumps 22 are not needed.
- the substrate 60 may include one or more electrically conductive vias 62 extending from a bottom surface 64 of the substrate 60 to an upper surface 66 of the substrate 60 .
- the vias 62 may be any suitable electrically conductive material including, for example, metal or conductive polymers, and may be formed in the substrate 60 using, for example, thick film techniques such as screen-printing.
- an electrically conductive ball 68 may be connected to each of the vias 62 by, for example, conductive epoxy, to also provide an external connection for the devices 12 a - c according to a ball grid array (BGA) arrangement, for example.
- BGA ball grid array
- Embodiments of the present invention have been constructed and tested where the devices connected to the baseplate 16 include a C-band MMIC power amplifier with a gain of approximately 29 dBm and two by-pass capacitors.
- the baseplate 16 was fabricated from Cu/Mo/Cu with a gold-tin solder.
- the MMIC was electrically connected to the leads 18 using the conductive bumps 22 , but the leads 18 for the capacitors were connected directly to the bonding pads for the capacitors using conductive epoxy.
- the body 17 portion of the cover 14 was constructed of LCP, and the leads 18 were copper.
- FIG. 5 is a graph illustrating the performance of the apparatus 10 . Trace 2 of the graph illustrates that the apparatus 10 has a gain of approximately 22 dB for the frequency range of approximately 5.6 GHz to 6.8 GHz.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
A method of forming a package. The method includes attaching a device to a baseplate to form a subassembly, and placing the subassembly into an opening defined by a cover that includes a plastic body and a lead such that the device is connected to the lead. The method further includes sealing a gap between the cover and the baseplate.
Description
- This application is a divisional of copending U.S. patent application Ser. No. 09/801,339, filed Mar. 7, 2001.
- 1. Field of Invention
- The present invention relates generally to device packaging and, more particularly, to lead frame packaging.
- 2. Description of the Background
- Conventional semiconductor chip packaging techniques are not ideal for RF or microwave circuits. For example, with conventional semiconductor chip packaging techniques, an injection molded plastic package is molded onto the surface of the chip. A majority of microwave circuit chips, however, are fabricated from a gallium arsenide (GaAs) substrate, which is generally thin and fragile. Therefore, when the plastic is molded onto the surface of a GaAs microwave chip, it may damage the chip mechanically. In addition, microwave chips often include air bridges. Because plastic is a dielectric, molding plastic onto the surface of the chip may also have the effect of detuning the circuit. Another drawback of conventional semiconductor processing techniques is that the leads are typically not designed for controlled impedances. Impedance matching of the leads, however, is critical for high performance RF and microwave circuits. A further drawback of conventional semiconductor packaging techniques is that the plastic used for the packaging is very lossy at high frequencies, which may cause significant performance degradation in RF and microwave circuits.
- Another problem with conventional semiconductor packaging techniques is wire bonding. Wire bonding is typically used to provide electrical connections between bonding pads of the chip and the leads of the package. Current wire bonding technology, however, prevents wire bonds from being formed that are less than about ten mils long. This drawback, coupled with the fact that wire bonds cannot be formed with acceptably tight tolerances at such dimensions, often results in unpredictable and/or unacceptable transmission characteristics for microwave devices.
- In view of these drawbacks, some microwave device manufacturers have mounted microwave circuits using flip chip technology. Flip chip mounting has found wide application in the semiconductor packaging and assembly industry for digital and low frequency analog chips because it typically provides a cost and size reduction for the resulting semiconductor package. In contrast to the conventional wire bonding interconnect approach, the flip chip mounting technique involves flipping the chip and connecting the chip's top surface to the substrate. A number of electrically conductive flip chip bumps, depending upon the complexity of the chip, are typically provided between the chip's top surface and the substrate to provide an electrical connection between the chip and the substrate, and hence the other components connected to the top surface of the substrate.
- In the microwave industry, however, because of difficulties in matching the orientation of the transmission mode fields for the circuits and the substrate, efforts to incorporate flip chip mounting have been primarily limited to devices employing co-planar waveguide (CPW) structures as the transmission media. That is, the circuit and substrate are both designed to support CPW. Many, if not most, commercially available MMICs (monolithic microwave integrated circuits), however, are designed for microstrip transmission modes, and are therefore ill suited for CPW transmission structures. Accordingly, using flip chip technology for microwave devices has ordinarily necessitated redesign or modification of existing microwave circuits to make them compatible with CPW. In addition, the CPW structure has the drawback that it typically requires the use of wire bonding to balance the ground strips of the CPW transmission line structure.
- Accordingly, there exists a need for a lead frame package that provides the mechanical and electrical qualities necessary for high performance RF and microwave semiconductor devices, as well as for other types of devices. There further exists a need for such a package to be cost effective, both in terms of materials and assembly.
- The present invention is directed to a method of packaging a device as well as an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes a plastic body and at least one electrically conductive lead. The body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.
- According to another embodiment, the apparatus includes a device connected to an electrically conductive baseplate, and a cover. The cover includes a plastic body and at least one electrically conductive lead. The body of the cover is connected to the baseplate such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is connected to the device via an electrically conductive bump.
- The method, according to one embodiment, includes attaching the device to a base, and attaching the base to a cover, the cover including a plastic body and at least one electrically conductive lead, such that the body encloses the device and such that the exposed portion of the lead is electrically connected to the device.
- In contrast to conventional semiconductor packaging techniques, the present invention provides a lead frame package that realizes the mechanical and electrical qualities necessary for high performance RF and microwave semiconductor. For example, the package of the present invention may provide an air gap that is ideally suited for devices requiring free spaces. In addition, embodiments of the present invention contemplate the use of materials that are ideally suited for high frequency applications, such as a low loss liquid crystal polymer injection molded plastic cover and a baseplate having a coefficient of thermal expansion (CTE) that matches the substrate material of the device. Furthermore, the leads of the package may be configured to provide controlled matching for high frequency applications. In addition to these performance benefits, the present invention provides cost advantages. The materials are relatively inexpensive, and the assembly process is ideally suited for high volume production and automation. These and other benefits of the present invention will be apparent from the detailed description hereinbelow.
- For the present invention to be clearly understood and readily practiced, the present invention will be described in conjunction with the following figures, wherein:
-
FIG. 1 is a cross-sectional diagram of an apparatus according to one embodiment of the present invention; -
FIG. 2 is a diagram illustrating a method of fabricating the apparatus ofFIG. 1 according to one embodiment of the present invention; -
FIG. 3 is a perspective view of a lead of the apparatus ofFIG. 1 according to one embodiment of the present invention; -
FIG. 4 is a cross-sectional diagram of the apparatus according to another embodiment of the present invention; and -
FIG. 5 is a graph illustrating the performance of the apparatus according to one embodiment of the present invention. -
FIG. 1 is a cross-sectional diagram of anapparatus 10 according to one embodiment of the present invention. Theapparatus 10 includes adevice 12, acover 14, and abaseplate 16. Thecover 14 includes abody 17 and a number of electrically conductive leads 18 captured therein. Although only two are shown inFIG. 1 , theapparatus 10 may include as many leads 18 as are necessary to provide the appropriate external connections for thedevice 12. As described further hereinbelow, thebody 17 may be fabricated from injection molded plastic with theleads 18 captured therein, such that aportion 20 of theleads 18 are exposed on theinner surface 21 of thebody 17 of thecover 14. In addition, theapparatus 10 includes electricallyconductive bumps 22 mounted to the bonding pads of thedevice 12. The exposedportions 20 of theleads 18 are in electrical contact with the bonding pads of thedevice 12 via thebumps 22. The resultingair gap 24 between theupper surface 26 of thedevice 12 and theinner surface 21 of thebody 17 makes theapparatus 10 well suited for applications requiring free spaces, such as, for example, when thedevice 12 is a microwave device. Theair gap 24 may be filled with air, any other gas, or combination of gases. - The
device 12 may be a semiconductor or a non-semiconductor device. For an embodiment in which thedevice 12 is a semiconductor device, thedevice 12 may be a chip fabricated from, for example, a silicon or gallium arsenide substrate, and may be, for example, a conventional integrated circuit (IC), an RF device, or a microwave device, such as a MMIC (monolithic microwave integrated circuit). For an embodiment in which thedevice 12 is a non-semiconductor device, thedevice 12 may be, for example, a MIC (microwave integrated circuit) fabricated from ceramic material such as, for example, Al2O3, AlN, or BeO. In addition, thedevice 12 may also be a power device such as, for example, a power amplifier. According to other embodiments, thedevice 12 may be a MEMS (micro electromechanical systems) device, an optoelectronic device, a crystal device, or an acoustic wave device. According to other embodiments, thedevice 12 may be, for example, a capacitor. - The
body 17 of thecover 14 may be formed from injection molded plastic. The leads 18 may be captured in thebody 17 such that the exposedportions 20 of theleads 18 are exposed on theinner surface 21 of thebody 17 of thecover 14. The exposedportions 20 of theleads 18 may be configured to correspond to the bonding pad locations on thedevice 12. In addition, theinner surface 21 of thebody 17 may have sidewalls 27 connected to thebase 16 by, for example, epoxy as discussed further hereinbelow. According to another embodiment, thebody 17 of thecover 14 may additionally include a lip (not shown) that is connected to an upper surface of thebase 16. - The
body 17 may be fabricated from any material suitable for injection molding, including materials that have low electrical loss at high frequency. For example, according to one embodiment, thebody 17 may be fabricated from liquid crystal polymer (LCP), a relatively low loss material at microwave frequencies. In addition, according to another embodiment, thebody 17 may include a metallization layer (not shown) on itsouter surface 28 to minimize radiation. According to yet another embodiment, thecover 14 may be configured to include a layer of absorbing material (not shown) in thebody 17 of thecover 14 to prevent coupling. - As described further hereinbelow, the
device 12 is attached to thebaseplate 16. Thebaseplate 16 may be made of an electrically conductive material such as, for example, copper, aluminum, or a metal matrix composite. Therefore, for an embodiment in which thedevice 12 is a microwave device, such as MMIC, thebaseplate 16 may act as a ground. For an embodiment in which thedevice 12 is a power device, thebaseplate 16 may be fabricated from a material that is thermally conductive as well, such as aluminum, to therefore act as a heat sink for thedevice 12. In addition, to provide improved mechanical performance, thebaseplate 16 may have a coefficient of thermal expansion (CTE) that matches that of thedevice 12. For example, for an embodiment in which thedevice 12 includes a GaAs substrate, thebaseplate 16 may include a low CTE material such as, for example, CuW or Cu/Mo/Cu. According to such an embodiment, thebaseplate 16 may be attached to thedevice 12 using a eutectic die attach. According to other embodiments, such as when thermal and electrical properties of thebaseplate 16 are not critical, thebaseplate 16 may be fabricated from an insulative (i.e., dielectric) material such as, for example, plastic. - The leads 18 may have a variety of geometric formations, and may be made of any suitable electrically and thermally conductive material. For example, the
leads 18 may be flat, they may be gull-wing shaped for, e.g., surface mount applications, or they may be bent backward underneath thecover 14 to thereby provide a leadless package. According to another embodiment, solder balls (not shown) may be attached to theleads 18 to provide a ball grid array (BGA) package. - The electrically
conductive bumps 22 provide an electrical connection between the exposedportions 20 of theleads 18 and the bonding pads, or electrodes, of thedevice 12. Thebumps 22 may be formed of, for example, metal, such as gold, or conductive polymers, and may have a diameter of approximately four mills or less. -
FIG. 2 is a flowchart of a process of making theapparatus 10 according to one embodiment of the present invention. The process initiates atblock 40, where thedevice 12 is attached to thebaseplate 16. According to one embodiment, thedevice 12 may be attached to thebaseplate 16 using a conductive epoxy. Fromblock 40 the process advances to block 42, where the electricallyconductive bumps 22 are attached to the bonding pads of thedevice 12. According to one embodiment, thebumps 22 may be attached using ball bonders. - From
block 42 the process advances to block 44, where the subassembly (i.e., thedevice 12, thebaseplate 16, and the bumps 22) is flipped and placed in the opening revealed by aninverted cover 14. Prior to placing the subassembly in thecover 14, conductive epoxy is dispensed on the exposedportions 20 of theleads 18 to thereby facilitate attachment of the subassembly to thecover 14. - Next, at block 46, nonconductive epoxy is dispensed in the gaps between the
baseplate 16 and thecover 14 to thereby seal thedevice 12 in the package. From block 46 the process advances to block 48, where theapparatus 10 is cured. During the curing, pressure may be applied to thebaseplate 16 to facilitate bonding. In addition, one cure may only be required for both the conductive and nonconductive epoxy, although additional curing steps may be used if necessary. According to other embodiments, thebumps 22 may be bonded to the exposedportions 20 of theleads 18 using, for example, solder, thermal compression, or ultrasonic bonding. - The process just described is advantageously suited for large volume production and automation. According to one embodiment, the process may be implemented using a conventional pick-and-place machine to place the cover/baseplate subassembly in the opening of the
inverted cover 14 although, according to other embodiments, a flip-chip automation process may be used. - For an embodiment in which the
device 12 includes a microwave circuit, it should be noted that theleads 18 and thebaseplate 16 form an essential geometry of microstrip lines. Consequently, according to one embodiment, the geometry of theleads 18 may be configured to provide adequate matching between theleads 18 and thebumps 22, which is critical at microwave frequencies. For example, by selecting the proper lead width, even using a stepped width configuration if necessary, reasonably good wide band or narrow band matching may be realized.FIG. 3 is a perspective view of a lead 18 according to such an embodiment. In the illustrated embodiment, thevertical portion 50 of thelead 18 is much wider than itshorizontal portions 52, 54. For purposes of clarity, thebody 17 portion of thecover 14 is not shown inFIG. 3 . In addition, the horizontal portion 54 may include the exposedportion 22 of thelead 18, which is electronically connected to thedevice 12. -
FIG. 4 is a cross-sectional diagram of theapparatus 10 according to another embodiment of the present invention. InFIG. 4 , a number ofdevices 12 a-c is fabricated on asubstrate 60. According to another embodiment, some or all of thedevices 12 a-c may be attached to thesubstrate 60. Thesubstrate 60 mechanically supports thebody 17 portion of thecover 14, which is connected thereto. Also as illustrated inFIG. 4 , the exposedportions 20 of theleads 18 are bonded directly to the bonding pads of thesubstrate 60, thus eliminating the conductive bumps 22. The exposedportions 20 of theleads 18 may be bonded to the substrate using, for example, conductive epoxy or solder. Such a configuration may be acceptable where the bonding pads are physically large enough that thebumps 22 are not needed. - According to another embodiment, as illustrated in
FIG. 4 , thesubstrate 60 may include one or more electricallyconductive vias 62 extending from abottom surface 64 of thesubstrate 60 to an upper surface 66 of thesubstrate 60. Thevias 62 may be any suitable electrically conductive material including, for example, metal or conductive polymers, and may be formed in thesubstrate 60 using, for example, thick film techniques such as screen-printing. In addition, an electricallyconductive ball 68 may be connected to each of thevias 62 by, for example, conductive epoxy, to also provide an external connection for thedevices 12 a-c according to a ball grid array (BGA) arrangement, for example. - Embodiments of the present invention have been constructed and tested where the devices connected to the
baseplate 16 include a C-band MMIC power amplifier with a gain of approximately 29 dBm and two by-pass capacitors. Thebaseplate 16 was fabricated from Cu/Mo/Cu with a gold-tin solder. The MMIC was electrically connected to theleads 18 using theconductive bumps 22, but theleads 18 for the capacitors were connected directly to the bonding pads for the capacitors using conductive epoxy. Thebody 17 portion of thecover 14 was constructed of LCP, and theleads 18 were copper.FIG. 5 is a graph illustrating the performance of theapparatus 10.Trace 2 of the graph illustrates that theapparatus 10 has a gain of approximately 22 dB for the frequency range of approximately 5.6 GHz to 6.8 GHz. - Although the present invention has been described herein with respect to certain embodiments, those of ordinary skill in the art will recognize that many modifications and variations of the present invention may be implemented. For example, the materials and processes disclosed are illustrative, but are not exhaustive. Other materials and processes may also be used to make devices embodying the present invention. In addition, the described sequences of the processing may also be varied. The foregoing description and the following claims are intended to cover all such modifications and variations.
Claims (29)
1-22. (Canceled)
23. A method of packaging a device, comprising:
attaching the device to a base; and
attaching the base to a cover, the cover including a plastic body and at least one electrically conductive lead, such that the body encloses the device and such that the an exposed portion of the lead is electrically connected to the device.
24. The method of claim 23 , wherein attaching the device to the base includes attaching the device to an electrically conductive baseplate with conductive epoxy.
25. The method of claim 23 , further comprising attaching at least one electrically conductive bump to the device prior to attaching the base to the cover, and wherein attaching the base to the cover includes attaching the base to the cover such that the exposed portion of the lead is electrically connected to the device via the bump.
26. The method of claim 25 , wherein attaching at least one electrically conductive bump to the device includes attaching at least one electrically conductive bump to the device with conductive epoxy.
27. The method of claim 25 , wherein attaching the base to the cover includes:
positioning the base with a pick-and-place machine such that an inner surface of the body of the cover is adjacent to the base and such that the that the exposed portion of the lead is electrically connected to the device via the bump;
curing a conductive epoxy between the bump and the exposed portion of the lead; and
curing an epoxy between the inner surface of the body of the cover and the base.
28. A method of forming a package, the method comprising:
attaching a device to a baseplate to form a subassembly;
placing the subassembly into an opening defined by a cover that includes a plastic body and a lead such that the device is connected to the lead; and
sealing a gap between the cover and the baseplate.
29. The method of claim 28 , wherein attaching the device includes attaching the device with a eutectic die attach.
30. The method of claim 28 , wherein attaching the device includes attaching the device with a conductive epoxy.
31. The method of claim 28 , wherein attaching the device includes attaching the device to an electrically conductive baseplate.
32. The method of claim 31 , wherein attaching the device includes attaching the device to a thermally conductive baseplate.
33. The method of claim 28 , wherein attaching the device includes attaching the device to an insulative baseplate.
34. The method of claim 28 , wherein placing the subassembly includes placing the subassembly with a pick-and-place machine.
35. The method of claim 28 , wherein placing the subassembly includes flipping the subassembly prior to placing the subassembly.
36. The method of claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad.
37. The method of claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad of a substrate.
38. The method of claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad of the device.
39. The method of claim 38 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via an electrically conductive bump.
40. The method of claim 28 , wherein sealing the gap between the cover and the baseplate includes sealing the gap with a nonconductive epoxy.
41. The method of claim 28 , further comprising attaching an electrically conductive bump to a bonding pad of the device prior to placing the subassembly.
42. The method of claim 41 , wherein attaching the electrically conductive bump includes attaching the electrically conductive bump with a ball bonder.
43. The method of claim 41 , further comprising soldering the electrically conductive bump to an exposed portion of the lead.
44. The method of claim 41 , further comprising thermally compressing the electrically conductive bump to an exposed portion of the lead.
45. The method of claim 41 , further comprising ultrasonically bonding the electrically conductive bump to an exposed portion of the lead.
46. The method of claim 28 , further comprising applying a conductive epoxy on an exposed portion of the lead prior to placing the subassembly.
47. The method of claim 28 , further comprising curing the package after sealing the gap between the cover and the baseplate
48. The method of claim 47 , wherein curing the package includes curing a conductive epoxy applied to an exposed portion of the lead.
49. The method of claim 47 , wherein curing the package includes curing a nonconductive epoxy applied between the cover and the baseplate.
50. The method of claim 47 , wherein curing the package includes applying pressure to the baseplate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/930,026 US20050023663A1 (en) | 2001-03-07 | 2004-08-30 | Method of forming a package |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/801,339 US6828663B2 (en) | 2001-03-07 | 2001-03-07 | Method of packaging a device with a lead frame, and an apparatus formed therefrom |
US10/930,026 US20050023663A1 (en) | 2001-03-07 | 2004-08-30 | Method of forming a package |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/801,339 Division US6828663B2 (en) | 2001-03-07 | 2001-03-07 | Method of packaging a device with a lead frame, and an apparatus formed therefrom |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050023663A1 true US20050023663A1 (en) | 2005-02-03 |
Family
ID=25180845
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/801,339 Expired - Lifetime US6828663B2 (en) | 2001-03-07 | 2001-03-07 | Method of packaging a device with a lead frame, and an apparatus formed therefrom |
US10/930,026 Abandoned US20050023663A1 (en) | 2001-03-07 | 2004-08-30 | Method of forming a package |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/801,339 Expired - Lifetime US6828663B2 (en) | 2001-03-07 | 2001-03-07 | Method of packaging a device with a lead frame, and an apparatus formed therefrom |
Country Status (3)
Country | Link |
---|---|
US (2) | US6828663B2 (en) |
AU (1) | AU2002250249A1 (en) |
WO (1) | WO2002073690A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050260828A1 (en) * | 2003-01-30 | 2005-11-24 | Tokyo Electron Limited | Bonding method, bonding apparatus and sealing means |
US20110079925A1 (en) * | 2009-10-02 | 2011-04-07 | Northrop Grumman Systems Corporation | Flip Chip Interconnect Method and Design For GaAs MMIC Applications |
US11424177B2 (en) | 2020-05-07 | 2022-08-23 | Wolfspeed, Inc. | Integrated circuit having die attach materials with channels and process of implementing the same |
US11830810B2 (en) * | 2020-05-07 | 2023-11-28 | Wolfspeed, Inc. | Packaged transistor having die attach materials with channels and process of implementing the same |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003264265A (en) * | 2002-03-08 | 2003-09-19 | Mitsubishi Electric Corp | Power semiconductor device |
US6982483B2 (en) * | 2003-05-30 | 2006-01-03 | Freescale Semiconductor, Inc. | High impedance radio frequency power plastic package |
US6934065B2 (en) * | 2003-09-18 | 2005-08-23 | Micron Technology, Inc. | Microelectronic devices and methods for packaging microelectronic devices |
US7583862B2 (en) * | 2003-11-26 | 2009-09-01 | Aptina Imaging Corporation | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7253397B2 (en) * | 2004-02-23 | 2007-08-07 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US8092734B2 (en) | 2004-05-13 | 2012-01-10 | Aptina Imaging Corporation | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
US7253957B2 (en) * | 2004-05-13 | 2007-08-07 | Micron Technology, Inc. | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers |
US20050275750A1 (en) * | 2004-06-09 | 2005-12-15 | Salman Akram | Wafer-level packaged microelectronic imagers and processes for wafer-level packaging |
US7498647B2 (en) * | 2004-06-10 | 2009-03-03 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7262405B2 (en) * | 2004-06-14 | 2007-08-28 | Micron Technology, Inc. | Prefabricated housings for microelectronic imagers |
US7199439B2 (en) * | 2004-06-14 | 2007-04-03 | Micron Technology, Inc. | Microelectronic imagers and methods of packaging microelectronic imagers |
US7232754B2 (en) | 2004-06-29 | 2007-06-19 | Micron Technology, Inc. | Microelectronic devices and methods for forming interconnects in microelectronic devices |
US7294897B2 (en) * | 2004-06-29 | 2007-11-13 | Micron Technology, Inc. | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
US7416913B2 (en) | 2004-07-16 | 2008-08-26 | Micron Technology, Inc. | Methods of manufacturing microelectronic imaging units with discrete standoffs |
US7189954B2 (en) | 2004-07-19 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
US7402453B2 (en) * | 2004-07-28 | 2008-07-22 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7364934B2 (en) | 2004-08-10 | 2008-04-29 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7397066B2 (en) * | 2004-08-19 | 2008-07-08 | Micron Technology, Inc. | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
US7223626B2 (en) * | 2004-08-19 | 2007-05-29 | Micron Technology, Inc. | Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers |
US7429494B2 (en) | 2004-08-24 | 2008-09-30 | Micron Technology, Inc. | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers |
US7115961B2 (en) * | 2004-08-24 | 2006-10-03 | Micron Technology, Inc. | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices |
US7276393B2 (en) * | 2004-08-26 | 2007-10-02 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US20070148807A1 (en) * | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
US7511262B2 (en) * | 2004-08-30 | 2009-03-31 | Micron Technology, Inc. | Optical device and assembly for use with imaging dies, and wafer-label imager assembly |
US7646075B2 (en) * | 2004-08-31 | 2010-01-12 | Micron Technology, Inc. | Microelectronic imagers having front side contacts |
US7300857B2 (en) * | 2004-09-02 | 2007-11-27 | Micron Technology, Inc. | Through-wafer interconnects for photoimager and memory wafers |
US7271482B2 (en) * | 2004-12-30 | 2007-09-18 | Micron Technology, Inc. | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
US7214919B2 (en) * | 2005-02-08 | 2007-05-08 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
US7303931B2 (en) * | 2005-02-10 | 2007-12-04 | Micron Technology, Inc. | Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces |
US7190039B2 (en) * | 2005-02-18 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers |
US7795134B2 (en) * | 2005-06-28 | 2010-09-14 | Micron Technology, Inc. | Conductive interconnect structures and formation methods using supercritical fluids |
US20070029649A1 (en) * | 2005-08-08 | 2007-02-08 | Honeywell International Inc. | Plastic lead frame with snap-together circuitry |
US20070085179A1 (en) * | 2005-08-08 | 2007-04-19 | Honeywell International Inc. | Automotive plastic lead frame sensor |
US7262134B2 (en) | 2005-09-01 | 2007-08-28 | Micron Technology, Inc. | Microfeature workpieces and methods for forming interconnects in microfeature workpieces |
US7288757B2 (en) * | 2005-09-01 | 2007-10-30 | Micron Technology, Inc. | Microelectronic imaging devices and associated methods for attaching transmissive elements |
US7895309B2 (en) * | 2006-01-11 | 2011-02-22 | Microsoft Corporation | Network event notification and delivery |
US8198712B2 (en) * | 2006-06-07 | 2012-06-12 | International Rectifier Corporation | Hermetically sealed semiconductor device module |
US8742557B2 (en) * | 2007-06-19 | 2014-06-03 | Honeywell International Inc. | Die mounting stress isolator |
US20100194465A1 (en) * | 2009-02-02 | 2010-08-05 | Ali Salih | Temperature compensated current source and method therefor |
US20110103632A1 (en) * | 2009-10-30 | 2011-05-05 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Integrated acoustic horn and lead frame |
US8810023B2 (en) | 2012-07-06 | 2014-08-19 | Texas Instruments Incorporated | Cantilever packages for sensor MEMS (micro-electro-mechanical system) |
Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
US4907065A (en) * | 1988-03-01 | 1990-03-06 | Lsi Logic Corporation | Integrated circuit chip sealing assembly |
US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
US4974057A (en) * | 1986-10-31 | 1990-11-27 | Texas Instruments Incorporated | Semiconductor device package with circuit board and resin |
US5097318A (en) * | 1988-04-04 | 1992-03-17 | Hitachi, Ltd. | Semiconductor package and computer using it |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
US5300791A (en) * | 1992-09-29 | 1994-04-05 | Industrial Technology Research Institute | Light emitting diode |
US5311402A (en) * | 1992-02-14 | 1994-05-10 | Nec Corporation | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
US5477081A (en) * | 1991-03-29 | 1995-12-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device package |
US5529959A (en) * | 1992-06-23 | 1996-06-25 | Sony Corporation | Charge-coupled device image sensor |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
US5598034A (en) * | 1992-07-22 | 1997-01-28 | Vlsi Packaging Corporation | Plastic packaging of microelectronic circuit devices |
US5623123A (en) * | 1993-06-10 | 1997-04-22 | Texas Instruments Incorporated | Semiconductor device package with small die pad and method of making same |
US5644169A (en) * | 1993-03-04 | 1997-07-01 | Goldstar Electron Co., Ltd. | Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby |
US5723904A (en) * | 1993-03-10 | 1998-03-03 | Sumitomo Electric Industries, Ltd. | Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board |
US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
US5753857A (en) * | 1996-06-14 | 1998-05-19 | Lg Semicon Co., Ltd. | Charge coupled device (CCD) semiconductor chip package |
US5825195A (en) * | 1992-06-10 | 1998-10-20 | Micron Technology, Inc. | Method and apparatus for testing an unpackaged semiconductor die |
US5832598A (en) * | 1995-03-02 | 1998-11-10 | Circuit Components Incorporated | Method of making microwave circuit package |
US5998862A (en) * | 1993-03-26 | 1999-12-07 | Sony Corporation | Air-packed CCD images package and a mold for manufacturing thereof |
US5998877A (en) * | 1996-08-29 | 1999-12-07 | Oki Electric Industry Co., Ltd. | Semiconductor device packaged in plastic and mold employable for production thereof |
US6008534A (en) * | 1998-01-14 | 1999-12-28 | Lsi Logic Corporation | Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
US6069027A (en) * | 1997-05-21 | 2000-05-30 | Lsi Logic Corporation | Fixture for lid-attachment for encapsulated packages |
US6087716A (en) * | 1997-02-03 | 2000-07-11 | Nec Corporation | Semiconductor device package having a connection substrate with turned back leads and method thereof |
US6124636A (en) * | 1998-01-26 | 2000-09-26 | Nec Corporation | MMIC package |
US6137168A (en) * | 1998-01-13 | 2000-10-24 | Lsi Logic Corporation | Semiconductor package with traces routed underneath a die |
US6140710A (en) * | 1999-05-05 | 2000-10-31 | Lucent Technologies Inc. | Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding |
US6157085A (en) * | 1998-04-07 | 2000-12-05 | Citizen Watch Co., Ltd. | Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate |
US6157080A (en) * | 1997-11-06 | 2000-12-05 | Sharp Kabushiki Kaisha | Semiconductor device using a chip scale package |
US6169323B1 (en) * | 1997-02-25 | 2001-01-02 | Oki Electric Industry Co., Ltd. | Semiconductor device with improved leads |
US6274927B1 (en) * | 1999-06-03 | 2001-08-14 | Amkor Technology, Inc. | Plastic package for an optical integrated circuit device and method of making |
US6353257B1 (en) * | 2000-05-19 | 2002-03-05 | Siliconware Precision Industries Co., Ltd. | Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention |
US20020030269A1 (en) * | 2000-09-11 | 2002-03-14 | Xytrans, Inc. | Microwave monolithic integrated circuit package |
US6358773B1 (en) * | 2000-12-27 | 2002-03-19 | Vincent Lin | Method of making substrate for use in forming image sensor package |
US6414849B1 (en) * | 1999-10-29 | 2002-07-02 | Stmicroelectronics, Inc. | Low stress and low profile cavity down flip chip and wire bond BGA package |
US6443632B2 (en) * | 2000-03-31 | 2002-09-03 | Hitachi, Ltd. | Photo-electronic device and method of producing the same |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0393584B1 (en) | 1989-04-17 | 1994-07-13 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
JPH0348448A (en) * | 1990-01-16 | 1991-03-01 | Sumitomo Electric Ind Ltd | Ccd package |
JPH06275677A (en) | 1993-03-23 | 1994-09-30 | Shinko Electric Ind Co Ltd | Package for semiconductor device and semiconductor device |
WO2000007239A1 (en) | 1998-07-28 | 2000-02-10 | Infineon Technologies Ag | Integrated component, composite body consisting of an integrated component and a conductive structure, chip card and method for producing the integrated component |
-
2001
- 2001-03-07 US US09/801,339 patent/US6828663B2/en not_active Expired - Lifetime
-
2002
- 2002-03-04 AU AU2002250249A patent/AU2002250249A1/en not_active Abandoned
- 2002-03-04 WO PCT/US2002/006907 patent/WO2002073690A2/en not_active Application Discontinuation
-
2004
- 2004-08-30 US US10/930,026 patent/US20050023663A1/en not_active Abandoned
Patent Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3423638A (en) * | 1964-09-02 | 1969-01-21 | Gti Corp | Micromodular package with compression means holding contacts engaged |
US4974057A (en) * | 1986-10-31 | 1990-11-27 | Texas Instruments Incorporated | Semiconductor device package with circuit board and resin |
US4907065A (en) * | 1988-03-01 | 1990-03-06 | Lsi Logic Corporation | Integrated circuit chip sealing assembly |
US5097318A (en) * | 1988-04-04 | 1992-03-17 | Hitachi, Ltd. | Semiconductor package and computer using it |
US4967260A (en) * | 1988-05-04 | 1990-10-30 | International Electronic Research Corp. | Hermetic microminiature packages |
US5477081A (en) * | 1991-03-29 | 1995-12-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device package |
US5311402A (en) * | 1992-02-14 | 1994-05-10 | Nec Corporation | Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
US5825195A (en) * | 1992-06-10 | 1998-10-20 | Micron Technology, Inc. | Method and apparatus for testing an unpackaged semiconductor die |
US5529959A (en) * | 1992-06-23 | 1996-06-25 | Sony Corporation | Charge-coupled device image sensor |
US5598034A (en) * | 1992-07-22 | 1997-01-28 | Vlsi Packaging Corporation | Plastic packaging of microelectronic circuit devices |
US5300791A (en) * | 1992-09-29 | 1994-04-05 | Industrial Technology Research Institute | Light emitting diode |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
US5644169A (en) * | 1993-03-04 | 1997-07-01 | Goldstar Electron Co., Ltd. | Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby |
US5723904A (en) * | 1993-03-10 | 1998-03-03 | Sumitomo Electric Industries, Ltd. | Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board |
US5998862A (en) * | 1993-03-26 | 1999-12-07 | Sony Corporation | Air-packed CCD images package and a mold for manufacturing thereof |
US5623123A (en) * | 1993-06-10 | 1997-04-22 | Texas Instruments Incorporated | Semiconductor device package with small die pad and method of making same |
US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
US5832598A (en) * | 1995-03-02 | 1998-11-10 | Circuit Components Incorporated | Method of making microwave circuit package |
US5753857A (en) * | 1996-06-14 | 1998-05-19 | Lg Semicon Co., Ltd. | Charge coupled device (CCD) semiconductor chip package |
US5998877A (en) * | 1996-08-29 | 1999-12-07 | Oki Electric Industry Co., Ltd. | Semiconductor device packaged in plastic and mold employable for production thereof |
US6087716A (en) * | 1997-02-03 | 2000-07-11 | Nec Corporation | Semiconductor device package having a connection substrate with turned back leads and method thereof |
US6169323B1 (en) * | 1997-02-25 | 2001-01-02 | Oki Electric Industry Co., Ltd. | Semiconductor device with improved leads |
US6069027A (en) * | 1997-05-21 | 2000-05-30 | Lsi Logic Corporation | Fixture for lid-attachment for encapsulated packages |
US6157080A (en) * | 1997-11-06 | 2000-12-05 | Sharp Kabushiki Kaisha | Semiconductor device using a chip scale package |
US6137168A (en) * | 1998-01-13 | 2000-10-24 | Lsi Logic Corporation | Semiconductor package with traces routed underneath a die |
US6008534A (en) * | 1998-01-14 | 1999-12-28 | Lsi Logic Corporation | Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines |
US6124636A (en) * | 1998-01-26 | 2000-09-26 | Nec Corporation | MMIC package |
US6157085A (en) * | 1998-04-07 | 2000-12-05 | Citizen Watch Co., Ltd. | Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate |
US6140710A (en) * | 1999-05-05 | 2000-10-31 | Lucent Technologies Inc. | Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding |
US6274927B1 (en) * | 1999-06-03 | 2001-08-14 | Amkor Technology, Inc. | Plastic package for an optical integrated circuit device and method of making |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
US6414849B1 (en) * | 1999-10-29 | 2002-07-02 | Stmicroelectronics, Inc. | Low stress and low profile cavity down flip chip and wire bond BGA package |
US6443632B2 (en) * | 2000-03-31 | 2002-09-03 | Hitachi, Ltd. | Photo-electronic device and method of producing the same |
US6353257B1 (en) * | 2000-05-19 | 2002-03-05 | Siliconware Precision Industries Co., Ltd. | Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention |
US20020030269A1 (en) * | 2000-09-11 | 2002-03-14 | Xytrans, Inc. | Microwave monolithic integrated circuit package |
US6358773B1 (en) * | 2000-12-27 | 2002-03-19 | Vincent Lin | Method of making substrate for use in forming image sensor package |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050260828A1 (en) * | 2003-01-30 | 2005-11-24 | Tokyo Electron Limited | Bonding method, bonding apparatus and sealing means |
US20110079925A1 (en) * | 2009-10-02 | 2011-04-07 | Northrop Grumman Systems Corporation | Flip Chip Interconnect Method and Design For GaAs MMIC Applications |
US8476757B2 (en) * | 2009-10-02 | 2013-07-02 | Northrop Grumman Systems Corporation | Flip chip interconnect method and design for GaAs MMIC applications |
US11424177B2 (en) | 2020-05-07 | 2022-08-23 | Wolfspeed, Inc. | Integrated circuit having die attach materials with channels and process of implementing the same |
US11830810B2 (en) * | 2020-05-07 | 2023-11-28 | Wolfspeed, Inc. | Packaged transistor having die attach materials with channels and process of implementing the same |
Also Published As
Publication number | Publication date |
---|---|
WO2002073690A2 (en) | 2002-09-19 |
US20020125553A1 (en) | 2002-09-12 |
WO2002073690A3 (en) | 2003-05-15 |
AU2002250249A1 (en) | 2002-09-24 |
US6828663B2 (en) | 2004-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6828663B2 (en) | Method of packaging a device with a lead frame, and an apparatus formed therefrom | |
US7268426B2 (en) | High-frequency chip packages | |
US6163456A (en) | Hybrid module and methods for manufacturing and mounting thereof | |
EP1351301B1 (en) | Semiconductor built-in millimeter-wave band module | |
JP3013831B2 (en) | MMIC package | |
US5409865A (en) | Process for assembling a TAB grid array package for an integrated circuit | |
US5075759A (en) | Surface mounting semiconductor device and method | |
US5796165A (en) | High-frequency integrated circuit device having a multilayer structure | |
US5602059A (en) | Semiconductor device and method for manufacturing same | |
US6261868B1 (en) | Semiconductor component and method for manufacturing the semiconductor component | |
JP2000114413A (en) | Semiconductor device, its manufacture, and method for mounting parts | |
US20020113306A1 (en) | Semiconductor packages | |
US6507110B1 (en) | Microwave device and method for making same | |
EP3769336A1 (en) | Semiconductor packages | |
US6483186B1 (en) | High power monolithic microwave integrated circuit package | |
US6426565B1 (en) | Electronic package and method of making same | |
US6531775B1 (en) | High-frequency module | |
EP0835047A2 (en) | RF-driven semiconductor device | |
US6933603B2 (en) | Multi-substrate layer semiconductor packages and method for making same | |
US20020145207A1 (en) | Method and structure for integrated circuit package | |
WO2001008221A1 (en) | High frequency module | |
JP2001053092A (en) | Package, device and its manufacture | |
JP2004071950A (en) | Semiconductor package and manufacturing method thereof | |
WO1996012296A1 (en) | Semiconductor device and its manufacture | |
JP4127589B2 (en) | High frequency semiconductor device package and high frequency semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |