US20050005623A1 - Pumped liquid cooling system using a phase change refrigerant - Google Patents

Pumped liquid cooling system using a phase change refrigerant Download PDF

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Publication number
US20050005623A1
US20050005623A1 US10/723,529 US72352903A US2005005623A1 US 20050005623 A1 US20050005623 A1 US 20050005623A1 US 72352903 A US72352903 A US 72352903A US 2005005623 A1 US2005005623 A1 US 2005005623A1
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US
United States
Prior art keywords
refrigerant
cooling system
condenser
liquid
cold plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/723,529
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English (en)
Inventor
Joseph Marsala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermal Form and Function LLC
Original Assignee
Thermal Form and Function LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/292,071 external-priority patent/US6679081B2/en
Application filed by Thermal Form and Function LLC filed Critical Thermal Form and Function LLC
Priority to US10/723,529 priority Critical patent/US20050005623A1/en
Priority to TW093136107A priority patent/TW200521657A/zh
Priority to CN200410096016.3A priority patent/CN1624911A/zh
Publication of US20050005623A1 publication Critical patent/US20050005623A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling of electrical and electronic components, and more particularly, to a liquid refrigerant pump to circulate refrigerant to multiple cold plate/evaporators in thermal contact with the electrical or electronic component to be cooled.
  • Electrical and electronic components e.g. microprocessors, IGBT's, power semiconductors etc.
  • IGBT's, power semiconductors etc. are most often cooled by air-cooled heat sinks with extended surfaces, directly attached to the surface to be cooled.
  • a fan or blower moves air across the heat sink fins, removing the heat generated by the component.
  • One method for removing heat from components when direct air-cooling is not possible uses a single-phase fluid which is pumped to a cold plate.
  • the cold plate typically has a serpentine tube attached to a flat metal plate.
  • the component to be cooled is thermally attached to the flat plate and a pumped single-phase fluid flowing through the tube removes the heat generated by the component.
  • Heat pipes are sealed devices which use a condensable fluid to move heat from one location to another. Fluid transfer is accomplished by capillary pumping of the liquid phase using a wick structure.
  • One end of the heat pipe (the evaporator) is located where the heat is generated in the component, and the other end (the condenser) is located where the heat is to be dissipated; often the condenser end is in contact with extended surfaces such as fins to help remove heat to the ambient air.
  • This method of removing heat is limited by the ability of the wick structure to transport fluid to the evaporator.
  • the cold plate is the evaporator of the cycle.
  • a compressor raises the temperature and pressure of the vapor, leaving the evaporator to a level such that an air-cooled condenser can be used to condense the vapor to its liquid state and be fed back to the cold plate for further evaporation and cooling.
  • This method has the advantage of high isothermal heat transfer rates and the ability to move heat considerable distances.
  • this method suffers from some major disadvantages which limit its practical application in cooling electrical and electronic devices.
  • Vapor compression refrigeration cycles are designed so as not to return any liquid refrigerant to the compressor which may cause physical damage to the compressor and shorten its life by diluting its lubricating oil.
  • the thermal load can be highly variable, causing unevaporated refrigerant to exit the cold plate and enter the compressor. This can cause damage and shorten the life of the compressor. This is yet another disadvantage of vapor compression cooling of components.
  • a liquid refrigerant pump circulates refrigerant to cold plate/evaporators which are in thermal contact with the electrical or electronic component to be cooled.
  • the liquid refrigerant is then partially or completely evaporated by the heat generated by the component.
  • the vapor is condensed by a conventional condenser coil, and the condensed liquid, along with any unevaporated liquid, is returned to the pump.
  • the system of the present invention operates nearly isothermally in both evaporation and condensation.
  • FIG. 1A is a schematic block diagram illustrating a parallel configuration of the pumped liquid cooling system in accordance with the present invention
  • FIG. 1B is a schematic block diagram illustrating a series configuration of the pumped liquid cooling system in accordance with the present invention.
  • FIG. 2 illustrates a plurality of cold plate evaporator devices, each in thermal contact with a component to be cooled.
  • the refrigerant may be any suitable vaporizable refrigerant, such as R-134a.
  • the cooling cycle can begin at liquid pump 12 , shown as a Hermetic Liquid Pump. Pump 12 pumps the liquid phase refrigerant to a liquid manifold 14 where it is distributed to one or a plurality of branches or lines 16 . From the manifold 14 , each branch or line 16 feeds liquid refrigerant to a cold plate 18 .
  • the condensing temperature of the refrigerant is preferably controlled so as to be above the ambient dew point where the cold plate evaporator device is located.
  • each cold plate 18 is in thermal contact with an electrical or electronic component or components 20 to be cooled, causing the liquid refrigerant to evaporate at system pressure. None, some, or all of the liquid refrigerant may evaporate at cold plate 18 , depending on how much heat is being generated by component 20 . In most cases, some of the refrigerant will have evaporated and a two-phase mixture of liquid and vapor refrigerant will leave each cold plate 18 , as shown by arrow 22 in FIGS. 1A and 1B .
  • each cold plate 18 discharges its mixture of two-phase refrigerant to conduit 24 , as illustrated in FIGS. 1A and 1B .
  • the conduit 24 is a tube.
  • the conduit 24 is attached to condenser 28 , comprised of a condensing coil 30 and a fan 32 .
  • Condenser coil 30 attached to conduit 24 , condenses the vapor phase back to a liquid and removes the heat generated by the electronic components 20 , shown in FIG. 2 . Any unevaporated liquid in conduit 24 merely passes through condenser 28 .
  • an ambient air-cooled condenser 28 is shown, using fan 32 , although it will occur to those skilled in the art that any suitable form of heat rejection may be used without departing from the scope of the invention, such as an air cooled condenser, a water or liquid cooled condenser, or an evaporative condenser.
  • the condenser 28 operates at a pressure which corresponds to a temperature somewhat higher than the dew point temperature of the ambient air. In this way, it is impossible for water condensation to form, since no system temperature will be below the ambient dew point temperature.
  • the condenser operating point sets the pressure of the entire system by means of the entering coolant temperature and its ability to remove heat from the condenser, thus fixing the condensing temperature and pressure. Also, since vaporized refrigerant is being condensed to a liquid phase, the condenser 28 sets up a flow of vaporized refrigerant from the conduit 24 into the condenser 28 , without the need for any compressor to move the vapor from the cold plate-evaporator 18 to the condenser 28 .
  • the liquid refrigerant exits the condenser 28 travels through conduit 34 as indicated by arrow 35 , and moves to an additional volume 36 , which holds a quantity of liquid refrigerant.
  • Pump 12 pumps the liquid refrigerant from the additional volume 36 into the cold plate where the refrigerant evaporates, becoming a two-phase mixture, all without the need of any vapor/liquid separation.
  • the two-phase mixture leaves the cold plate and goes into the condenser, which condenses the vapor into liquid, so that only liquid leaves the condenser.
  • the outlet of the additional volume 36 is connected to the inlet of the liquid refrigerant pump 12 .
  • the pressure of the refrigerant is raised sufficiently to overcome the frictional losses in the system and the cooling cycle begins again.
  • the pump 12 is selected so that its pressure rise is equal to or exceeds the frictional loss in the system at the design flow rate.
  • the present invention operates isothermally, since it uses change of phase to remove heat rather than the sensible heat capacity of a liquid coolant. This allows for cooler temperatures at the evaporator and cooler components than a single-phase liquid system. Low liquid flow rates are achieved through the evaporation of the working fluid to remove heat, keeping the fluid velocities low and the pumping power very low for the heat removed. Parasitic electric power is reduced over both the pumped single-phase liquid system and the vapor compression refrigeration system.
  • the cooling system of the present invention comprises at least one component generating heat and required to be cooled, and at least one cold plate evaporator device in thermal contact with the at least one component.
  • a vaporizable refrigerant is circulated by the liquid refrigerant pump to the at least one cold plate evaporator device, whereby the refrigerant is at least partially evaporated by the heat generated by the at least component(s), creating a vapor.
  • a condenser condenses the partially evaporated refrigerant vapor, creating a single liquid phase.
  • the vaporizable refrigerant from the pump is received by a first liquid conduit connected to the cold plate evaporator device(s).
  • a second conduit from the cold plate evaporator devices is connected to the condenser.
  • a liquid return line is provided from the condenser to an inlet of the refrigerant pump.
  • Another advantage of the present invention over heat pipe and vapor compression based systems is the ability to separate the evaporator and condenser over greater distances. This allows more flexibility in packaging systems and design arrangements.
  • the present invention easily handles variation in thermal load of the components 20 to be cooled. Since any unevaporated liquid refrigerant is returned to the pump, multiple cold plates at varying loads are easily accommodated without fear of damaging a compressor. Since the current invention does not operate at any point in the system 10 at temperatures below ambient dew point temperature, there is no possibility of causing water vapor condensation and the formation of liquid water.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US10/723,529 2002-11-12 2003-11-26 Pumped liquid cooling system using a phase change refrigerant Abandoned US20050005623A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/723,529 US20050005623A1 (en) 2002-11-12 2003-11-26 Pumped liquid cooling system using a phase change refrigerant
TW093136107A TW200521657A (en) 2003-11-26 2004-11-24 Pumped liquid cooling system using a phase change refrigerant
CN200410096016.3A CN1624911A (zh) 2003-11-26 2004-11-25 使用相变制冷剂的泵送液体冷却***

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/292,071 US6679081B2 (en) 2000-04-04 2002-11-12 Pumped liquid cooling system using a phase change refrigerant
US10/723,529 US20050005623A1 (en) 2002-11-12 2003-11-26 Pumped liquid cooling system using a phase change refrigerant

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/292,071 Continuation-In-Part US6679081B2 (en) 2000-04-04 2002-11-12 Pumped liquid cooling system using a phase change refrigerant

Publications (1)

Publication Number Publication Date
US20050005623A1 true US20050005623A1 (en) 2005-01-13

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US10/723,529 Abandoned US20050005623A1 (en) 2002-11-12 2003-11-26 Pumped liquid cooling system using a phase change refrigerant

Country Status (3)

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US (1) US20050005623A1 (zh)
CN (1) CN1624911A (zh)
TW (1) TW200521657A (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090229283A1 (en) * 2007-08-24 2009-09-17 Joseph Marsala Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
EP2073617A3 (en) * 2007-12-19 2010-06-09 Thermal Form & Function LLC System and method for controlling the cooling of variable heat loads in heat generating devices
US20140311727A1 (en) * 2011-11-15 2014-10-23 Carrier Corporation Air Conditioner Terminal Device, Air Conditioning Apparatus And Data Center
US20140332197A1 (en) * 2011-11-15 2014-11-13 Carrier Corporation Air Conditioner Terminal Device, Air Conditioning Apparatus And Data Center
US20150062821A1 (en) * 2012-03-22 2015-03-05 Nec Corporation Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US10477731B1 (en) * 2019-01-30 2019-11-12 Champ Tech Optical (Foshan) Corporation Liquid-cooled radiator
US20220236018A1 (en) * 2019-03-15 2022-07-28 Shimadzu Corporation Cooling device
CN114838551A (zh) * 2022-01-13 2022-08-02 东莞市科美斯科技实业有限公司 一种在冬季低温条件下的用于果蔬保鲜库的热管降温加湿***

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155026A1 (en) * 2008-12-19 2010-06-24 Walther Steven R Condensible gas cooling system
CN101865864B (zh) * 2010-06-08 2012-07-04 华东理工大学 电子元器件相变冷却效果的测试***
CN102589190A (zh) * 2012-02-24 2012-07-18 刘小江 一种不用压缩机的制冷方法及专用设备
EP2833084B1 (en) * 2013-08-02 2016-10-12 ABB Research Ltd. Refrigeration apparatus and method
US11365906B2 (en) * 2017-07-23 2022-06-21 Zuta-Core Ltd. Systems and methods for heat exchange
CN110044105B (zh) * 2018-01-16 2020-11-03 华为技术有限公司 制冷***及其控制方法与控制器
CN112902715A (zh) * 2019-12-03 2021-06-04 中兴通讯股份有限公司 一种液冷板及散热设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
US5984647A (en) * 1997-04-03 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Process for producing a hermetic electric compressor
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
US6826923B2 (en) * 2002-04-25 2004-12-07 Matsushita Electric Industrial Co., Ltd. Cooling device for semiconductor elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
US5984647A (en) * 1997-04-03 1999-11-16 Mitsubishi Denki Kabushiki Kaisha Process for producing a hermetic electric compressor
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
US6826923B2 (en) * 2002-04-25 2004-12-07 Matsushita Electric Industrial Co., Ltd. Cooling device for semiconductor elements

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090229283A1 (en) * 2007-08-24 2009-09-17 Joseph Marsala Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
EP2073617A3 (en) * 2007-12-19 2010-06-09 Thermal Form & Function LLC System and method for controlling the cooling of variable heat loads in heat generating devices
US20140311727A1 (en) * 2011-11-15 2014-10-23 Carrier Corporation Air Conditioner Terminal Device, Air Conditioning Apparatus And Data Center
US20140332197A1 (en) * 2011-11-15 2014-11-13 Carrier Corporation Air Conditioner Terminal Device, Air Conditioning Apparatus And Data Center
US20150062821A1 (en) * 2012-03-22 2015-03-05 Nec Corporation Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US20170077970A1 (en) * 2014-04-03 2017-03-16 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US9819373B2 (en) * 2014-04-03 2017-11-14 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US10477731B1 (en) * 2019-01-30 2019-11-12 Champ Tech Optical (Foshan) Corporation Liquid-cooled radiator
US20220236018A1 (en) * 2019-03-15 2022-07-28 Shimadzu Corporation Cooling device
CN114838551A (zh) * 2022-01-13 2022-08-02 东莞市科美斯科技实业有限公司 一种在冬季低温条件下的用于果蔬保鲜库的热管降温加湿***

Also Published As

Publication number Publication date
TW200521657A (en) 2005-07-01
CN1624911A (zh) 2005-06-08

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