US20040207986A1 - Heat sink hold-down with fan-module attach location - Google Patents
Heat sink hold-down with fan-module attach location Download PDFInfo
- Publication number
- US20040207986A1 US20040207986A1 US10/419,386 US41938603A US2004207986A1 US 20040207986 A1 US20040207986 A1 US 20040207986A1 US 41938603 A US41938603 A US 41938603A US 2004207986 A1 US2004207986 A1 US 2004207986A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- heat
- lever spring
- cap
- operable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to heat transfer and more particularly to a heat sink hold-down with fan-module attach location.
- FIG. 1 is a cross-sectional view of a traditional glue-on heat sink 101 attached to processor chip 102 with adhesive 103 , which also acts as a thermally conducting interface.
- Processor chip 102 is typically mounted to bolster plate 104 , which provides rigid mechanical support.
- Glue-on heat sinks have limited ability to hold on to the chip during a shock load.
- Using adhesive for thermal conduction compromises heat transfer compared to compression type heat sink attachment.
- FIG. 2A is a cross-sectional view of a traditional shoulder screw/spring heat sink held under compression to a processor chip.
- Springs 201 are captured between heat sink base 202 and screw heads 203 .
- screws 204 are attached to bolster plate 104 , the spring compression between screw heads 203 and heat sink base 202 loads heat sink 202 onto processor chip 102 .
- Shoulder screw/spring heat sinks require a large amount of heat sink base space for mounting hardware. During installation they can cause uneven loading on the chip. Additionally, the screw assemblies are intrusive to air flow paths.
- FIG. 2B is a cross-sectional view of a traditional low-profile spring-attach heat sink hold-down.
- Spring 211 which is rigidly mounted to bolster plate 104 and presses on the base of heat sink 212 against processor chip 102 , has clearance slots for each heat sink fin.
- Low-profile spring-attach heat sink hold-down hardware is unobtrusive, but allows no place for mounting a fan to the top of the heat sink. It is also difficult to remove if chip replacement is required. Additionally it blocks air flow over the heat sink base.
- FIG. 2C is a cross-sectional view of a traditional high-profile spring-heat sink hold-down.
- Spring 221 is rigidly mounted to bolster plate 104 and presses on the tops of the fins of heat sink 222 .
- this traditional approach uses a screw running between the fins to transfer the load from spring 221 directly onto the base of heat sink 222 .
- High profile springs intrude on the ability to mount a cooling fan on top of the heat sink.
- a system for heat sink hold-down comprises a heat source; and a heat sink hold-down assembly.
- the heat sink hold-down assembly comprises a bolster plate operable to rigidly support the heat source and a heat sink.
- the heat sink comprises a heat sink base operable to press the heat source against the bolster plate and to transfer heat from the heat source, and a longitudinal post having a first end and a second end opposite from the first end, which is attached to the heat sink base substantially orthogonally near the center of said heat sink base.
- the post is operable to transfer a longitudinal compressive force substantially symmetrically to the heat sink base.
- the heat sink hold-down assembly further comprises a lever spring contacting near its midpoint the second end of the post.
- the lever spring is operable to apply a compressive force to the second end of the post in response to a bending moment.
- the heat sink hold-down assembly further comprises a cap rigidly coupled to the bolster plate and coupled to the lever spring near the two ends of the lever spring. The cap is operable to apply a bending moment to the lever spring.
- a method of heat transfer using a heat sink hold down assembly comprises attaching a first surface of a heat source onto a surface of a bolster plate and positioning a heat sink, such that a first surface of a heat sink base of the heat sink is in surface contact with a second surface opposite the first surface of the heat source.
- a longitudinal post having a first end and a second end opposite from the first end is attached at its first end substantially orthogonally to the second surface opposite the first surface of the heat sink base.
- the method further comprises applying longitudinal compressive force to the second end of the post in response to a bending moment of a lever spring in contact with the second end.
- the method further comprises transferring the longitudinal compressive force substantially symmetrically to the heat sink base, thereby holding the heat source rigidly under compression between the heat sink base and the bolster plate.
- the method further comprises transferring heat from the heat source through the heat sink into ambient air.
- a system for heat sink hold-down comprises means for attaching a first surface of a heat source onto a surface of a bolster plate, and means for positioning a heat sink, such that a first surface of a heat sink base of the heat sink is in surface contact with a second surface opposite said first surface of the heat source, and such that a longitudinal post having a first end and a second end opposite from the first end is attached at the first end substantially orthogonally to the second surface opposite the first surface of the heat sink base.
- the system further comprises means for applying longitudinal compressive force to the second end of the post in response to a bending moment of a lever spring in contact with the second end, and means for transferring the longitudinal compressive force substantially symmetrically to the heat sink base, thereby holding the heat source rigidly under compression between the heat sink base and the bolster plate.
- the system further comprises means for transferring heat from the heat source through the heat sink into ambient air.
- FIG. 1 is a cross-sectional view of a traditional glue-on heat sink
- FIG. 2A is a cross-sectional view of a traditional shoulder screw/spring heat sink held under compression to a processor chip
- FIG. 2B is a cross-sectional view of a traditional low profile spring attach heat sink hold down
- FIG. 2C is a cross-sectional view of a traditional high profile spring heat sink hold down
- FIG. 3A is a simplified schematic cross-sectional view depicting a heat sink hold-down assembly with fan-module attach location, in accordance with embodiments of the present invention
- FIG. 3B is an expanded schematic cross-sectional view depicting in more detail an embodiment of the heat sink hold-down assembly of FIG. 3A;
- FIG. 4A is a cutaway view illustrating a system configured to include, for example, two heat sinks loaded onto two processor chips;
- FIGS. 4B-4D are cutaway views depicting the system of FIG. 4A at further successive stages of assembly.
- FIG. 3A is a simplified schematic cross-sectional view depicting heat sink hold-down assembly 300 with fan-module attach location, in accordance with embodiments of the present invention.
- FIG. 3B is an expanded schematic cross-sectional view depicting in more detail an embodiment of heat sink hold-down assembly 300 .
- a heat source for example processor 301
- Processor 301 includes, for example, processor chip (integrated circuit) 301 a mounted and electrically interconnected to a circuit board, for example circuit board 301 c, which supplies the signal and power leads required by processor chip 301 a, and optional lid 301 b.
- Bolster plate 302 provides a mechanically stable, rigid support platform, which resists any bending of processor chip 301 a and interconnected circuit board 301 c.
- Heat sink 303 includes base 303 a in mechanical and thermal contact with processor 301 , centrally located vertical post 304 , and optional heat sink extension or pillar 303 b, which conducts heat from processor 301 to heat sink base 303 a.
- heat sink 303 includes finned, folded, or corrugated structure 303 c in intimate thermal contact with heat sink base 303 a and having an enlarged surface area to facilitate heat transfer from heat sink 303 to ambient air. Gaps at interfaces between adjacent heat conducting elements can optionally be filled with thin layers of conventional heat conducting compound (thermal grease) to enhance heat transfer.
- thermal grease conventional heat conducting compound
- Cage 305 is a mechanical structure rigidly mounted to bolster plate 302 using clips or other fasteners, which provides clearance slots through which lever spring 306 is inserted, such that the top of post 304 contacts lever spring 306 near its midpoint.
- Cap 307 when fastened rigidly to cage 305 using screws 308 or other fasteners, applies downward force on lever spring 306 near its ends. This creates a bending moment in lever spring 306 , which in turn applies a downward compressive load to post 304 . If the point of contact is at the ideal midpoint of lever spring, the bending moment is symmetric and the compressive load is maximized. However, in some implementations an appreciable offset near the ideal midpoint can be tolerated without adverse consequences.
- Post 304 is oriented substantially orthogonally to heat sink base 303 a, meaning that at least a portion of compressive force applied to post 304 by lever spring 306 is transferred to heat sink base 303 a in a direction normal to the plane of heat sink base 303 a.
- Heat sink hold-down assembly 300 exhibits mechanical integrity, such that compressive forces pressing processor 301 between lever spring 306 and bolster plate 302 are balanced by tensile forces transmitted through cage 305 from bolster plate 302 to cap 307 .
- cooling fan module 309 can be mounted atop cap 307 to provide forced air flow across heat sink 303 , thereby increasing heat transfer efficiency.
- FIG. 4A is a cutaway view illustrating system 400 configured to include, for example, two heat sinks 303 loaded onto two processor chips 301 a.
- Embodiments of the invention can be configured to accommodate any number of heat sinks in a row.
- one heat sink 303 is shown assembled in place onto heat sink base 303 a, exposing clearance slot 406 in heat sink finned structure 303 c, through which lever spring 306 is later inserted.
- Adjacent heat sink base 303 a including centrally located post 304 is exposed in system 400 .
- Post 304 provides a load point on heat sink base 303 a directly above processor chip 301 a for symmetric load distribution.
- FIGS. 4B-4D are cutaway views depicting system 400 at further successive stages of assembly.
- cage 305 is positioned over heat sink 303 assembled onto processor chip 301 a.
- Flanges 405 at the lower edge of cage 305 are operable to hook onto the underside of bolster plate 302 .
- Slots 416 in cage 305 aligned with slots 406 in heat sink finned structure 303 c provide clearance for inserting lever springs 306 .
- lever springs 306 When lever springs 306 are loaded as described above, cage 305 provides tension to system 400 .
- FIG. 4B cage 305 is positioned over heat sink 303 assembled onto processor chip 301 a.
- Flanges 405 at the lower edge of cage 305 are operable to hook onto the underside of bolster plate 302 .
- Slots 416 in cage 305 aligned with slots 406 in heat sink finned structure 303 c provide clearance for inserting lever springs 306 .
- lever springs 306 When lever
- FIG. 4C illustrates lever springs 306 being assembled into system 400 by inserting through slots 416 in cage 305 and slots 406 in heat sink finned structure 303 c and resting in contact with the upper end of post 304 , which has its lower end attached centrally to heat sink base 303 a (see FIG. 4B).
- cap 307 is being placed onto system 400 , where it is then fastened rigidly to cage 305 using screws 308 or other fasteners.
- Lever springs 306 may be provided with heads 306 a at each end which may be captured by notches 426 .
- cap 307 optionally contains opening 430 , which can be configured to mount a cooling fan module, for example cooling fan module 309 .
- the implementation disclosed above provides a number of advantages. It affords minimal intrusion into the heat sink base space. It loads the heat sink from a post in the heat sink base centered on a processor chip, facilitating symmetric distribution of mechanical load onto the chip and minimizing air flow disruption. Simulation results show that air flow near the heat sink base is important to heat sink performance, and that disrupting air flow lowers this performance. Some embodiments provide a location to mount a fan module adjacent the top of the heat sink for enhanced air flow, and provide for easy disassembly and removal to access the chip if required.
- cap 307 can be configured to extend to bolster plate 302 , thereby eliminating cage 305 as a separate component of heat sink hold-down assembly 300 .
- cap 307 may be attached rigidly to bolster plate 302 using screws, clips, and/or fasteners of other types.
- Other implementations include multiple heat sinks in a row, as illustrated in FIG. 4A, and alternative heat transfer structures that can be thicker, extruded, or cast into heat sink base 303 a instead of thin finned, folded, or corrugated structure 303 c as illustrated in FIGS. 3A and 3B.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- This application is related to concurrently filed, co-pending, and commonly assigned U.S. patent application [Attorney docket 200207374-1], titled “VARIABLE WEDGE THERMAL INTERFACE DEVICE,” and to concurrently filed, co-pending, and commonly assigned U.S. patent application [Attorney docket 200207213-1], titled “VARIABLE GAP THERMAL INTERFACE DEVICE,” the disclosures of which are hereby incorporated herein by reference.
- This invention relates to heat transfer and more particularly to a heat sink hold-down with fan-module attach location.
- A number of approaches to heat sink hold down design have been used traditionally, including the examples described below:
- FIG. 1 is a cross-sectional view of a traditional glue-on
heat sink 101 attached toprocessor chip 102 withadhesive 103, which also acts as a thermally conducting interface.Processor chip 102 is typically mounted tobolster plate 104, which provides rigid mechanical support. Glue-on heat sinks have limited ability to hold on to the chip during a shock load. Using adhesive for thermal conduction compromises heat transfer compared to compression type heat sink attachment. - FIG. 2A is a cross-sectional view of a traditional shoulder screw/spring heat sink held under compression to a processor chip. Springs201 are captured between
heat sink base 202 andscrew heads 203. Whenscrews 204 are attached tobolster plate 104, the spring compression betweenscrew heads 203 andheat sink base 202 loadsheat sink 202 ontoprocessor chip 102. Shoulder screw/spring heat sinks require a large amount of heat sink base space for mounting hardware. During installation they can cause uneven loading on the chip. Additionally, the screw assemblies are intrusive to air flow paths. - FIG. 2B is a cross-sectional view of a traditional low-profile spring-attach heat sink hold-down.
Spring 211, which is rigidly mounted tobolster plate 104 and presses on the base ofheat sink 212 againstprocessor chip 102, has clearance slots for each heat sink fin. Low-profile spring-attach heat sink hold-down hardware is unobtrusive, but allows no place for mounting a fan to the top of the heat sink. It is also difficult to remove if chip replacement is required. Additionally it blocks air flow over the heat sink base. - FIG. 2C is a cross-sectional view of a traditional high-profile spring-heat sink hold-down.
Spring 221 is rigidly mounted tobolster plate 104 and presses on the tops of the fins ofheat sink 222. Alternatively, this traditional approach uses a screw running between the fins to transfer the load fromspring 221 directly onto the base ofheat sink 222. High profile springs intrude on the ability to mount a cooling fan on top of the heat sink. - It would be desirable in the art to provide a heat sink hold down system and method that minimize intrusion into the heat sink base space and into cooling air flow, that advantageously provide a location for mounting an optional fan, that load the chip essentially uniformly, and that allow easy removal to access the chip if required.
- In accordance with a first embodiment disclosed herein, a system for heat sink hold-down is provided. The system comprises a heat source; and a heat sink hold-down assembly. The heat sink hold-down assembly comprises a bolster plate operable to rigidly support the heat source and a heat sink. The heat sink comprises a heat sink base operable to press the heat source against the bolster plate and to transfer heat from the heat source, and a longitudinal post having a first end and a second end opposite from the first end, which is attached to the heat sink base substantially orthogonally near the center of said heat sink base. The post is operable to transfer a longitudinal compressive force substantially symmetrically to the heat sink base. The heat sink hold-down assembly further comprises a lever spring contacting near its midpoint the second end of the post. The lever spring is operable to apply a compressive force to the second end of the post in response to a bending moment. The heat sink hold-down assembly further comprises a cap rigidly coupled to the bolster plate and coupled to the lever spring near the two ends of the lever spring. The cap is operable to apply a bending moment to the lever spring.
- In accordance with another embodiment disclosed herein, a method of heat transfer using a heat sink hold down assembly is provided. The method comprises attaching a first surface of a heat source onto a surface of a bolster plate and positioning a heat sink, such that a first surface of a heat sink base of the heat sink is in surface contact with a second surface opposite the first surface of the heat source. A longitudinal post having a first end and a second end opposite from the first end is attached at its first end substantially orthogonally to the second surface opposite the first surface of the heat sink base. The method further comprises applying longitudinal compressive force to the second end of the post in response to a bending moment of a lever spring in contact with the second end. The method further comprises transferring the longitudinal compressive force substantially symmetrically to the heat sink base, thereby holding the heat source rigidly under compression between the heat sink base and the bolster plate. The method further comprises transferring heat from the heat source through the heat sink into ambient air.
- In accordance with another embodiment disclosed herein, a system for heat sink hold-down is provided. The system comprises means for attaching a first surface of a heat source onto a surface of a bolster plate, and means for positioning a heat sink, such that a first surface of a heat sink base of the heat sink is in surface contact with a second surface opposite said first surface of the heat source, and such that a longitudinal post having a first end and a second end opposite from the first end is attached at the first end substantially orthogonally to the second surface opposite the first surface of the heat sink base. The system further comprises means for applying longitudinal compressive force to the second end of the post in response to a bending moment of a lever spring in contact with the second end, and means for transferring the longitudinal compressive force substantially symmetrically to the heat sink base, thereby holding the heat source rigidly under compression between the heat sink base and the bolster plate. The system further comprises means for transferring heat from the heat source through the heat sink into ambient air.
- FIG. 1 is a cross-sectional view of a traditional glue-on heat sink;
- FIG. 2A is a cross-sectional view of a traditional shoulder screw/spring heat sink held under compression to a processor chip;
- FIG. 2B is a cross-sectional view of a traditional low profile spring attach heat sink hold down;
- FIG. 2C is a cross-sectional view of a traditional high profile spring heat sink hold down;
- FIG. 3A is a simplified schematic cross-sectional view depicting a heat sink hold-down assembly with fan-module attach location, in accordance with embodiments of the present invention;
- FIG. 3B is an expanded schematic cross-sectional view depicting in more detail an embodiment of the heat sink hold-down assembly of FIG. 3A;
- FIG. 4A is a cutaway view illustrating a system configured to include, for example, two heat sinks loaded onto two processor chips; and
- FIGS. 4B-4D are cutaway views depicting the system of FIG. 4A at further successive stages of assembly.
- FIG. 3A is a simplified schematic cross-sectional view depicting heat sink hold-
down assembly 300 with fan-module attach location, in accordance with embodiments of the present invention. FIG. 3B is an expanded schematic cross-sectional view depicting in more detail an embodiment of heat sink hold-down assembly 300. A heat source, forexample processor 301, is rigidly pressed between bolsterplate 302 andheat sink 303.Processor 301 includes, for example, processor chip (integrated circuit) 301 a mounted and electrically interconnected to a circuit board, forexample circuit board 301 c, which supplies the signal and power leads required byprocessor chip 301 a, andoptional lid 301 b. Bolsterplate 302 provides a mechanically stable, rigid support platform, which resists any bending ofprocessor chip 301 a andinterconnected circuit board 301 c.Heat sink 303 includes base 303 a in mechanical and thermal contact withprocessor 301, centrally locatedvertical post 304, and optional heat sink extension orpillar 303 b, which conducts heat fromprocessor 301 toheat sink base 303 a. Typically,heat sink 303 includes finned, folded, orcorrugated structure 303 c in intimate thermal contact withheat sink base 303 a and having an enlarged surface area to facilitate heat transfer fromheat sink 303 to ambient air. Gaps at interfaces between adjacent heat conducting elements can optionally be filled with thin layers of conventional heat conducting compound (thermal grease) to enhance heat transfer. -
Cage 305 is a mechanical structure rigidly mounted to bolsterplate 302 using clips or other fasteners, which provides clearance slots through whichlever spring 306 is inserted, such that the top ofpost 304contacts lever spring 306 near its midpoint.Cap 307, when fastened rigidly tocage 305 usingscrews 308 or other fasteners, applies downward force onlever spring 306 near its ends. This creates a bending moment inlever spring 306, which in turn applies a downward compressive load to post 304. If the point of contact is at the ideal midpoint of lever spring, the bending moment is symmetric and the compressive load is maximized. However, in some implementations an appreciable offset near the ideal midpoint can be tolerated without adverse consequences. Because of the central location ofpost 304, this load is distributed substantially symmetrically across the area ofheat sink base 303 a, which pressesprocessor 301 against bolsterplate 302. As used herein, the term “substantially symmetric” is interpreted to mean that there are no abrupt nonuniformities or discontinuities.Post 304 is oriented substantially orthogonally toheat sink base 303 a, meaning that at least a portion of compressive force applied to post 304 bylever spring 306 is transferred toheat sink base 303 a in a direction normal to the plane ofheat sink base 303 a. Although ideally the orientation ofpost 304 is orthogonal or at right angles to the plane ofheat sink base 303 a, a range of orientations is possible and will be referred to as “substantially orthogonal orientation.” Similarly, a variety of shapes are possible forpost 304, including for example truncated pyramidal, prismatic, cylindrical, and tubular. Heat sink hold-down assembly 300 exhibits mechanical integrity, such that compressiveforces pressing processor 301 betweenlever spring 306 and bolsterplate 302 are balanced by tensile forces transmitted throughcage 305 from bolsterplate 302 to cap 307. Optionally, coolingfan module 309 can be mounted atopcap 307 to provide forced air flow acrossheat sink 303, thereby increasing heat transfer efficiency. - FIG. 4A is a cutaway
view illustrating system 400 configured to include, for example, twoheat sinks 303 loaded onto twoprocessor chips 301 a. Embodiments of the invention can be configured to accommodate any number of heat sinks in a row. At a stage of assembly ofsystem 400, oneheat sink 303 is shown assembled in place ontoheat sink base 303 a, exposingclearance slot 406 in heat sink finnedstructure 303 c, through whichlever spring 306 is later inserted. Adjacentheat sink base 303 a including centrally locatedpost 304 is exposed insystem 400.Post 304 provides a load point onheat sink base 303 a directly aboveprocessor chip 301 a for symmetric load distribution. - FIGS. 4B-4D are cutaway
views depicting system 400 at further successive stages of assembly. In FIG. 4B,cage 305 is positioned overheat sink 303 assembled ontoprocessor chip 301 a.Flanges 405 at the lower edge ofcage 305 are operable to hook onto the underside of bolsterplate 302.Slots 416 incage 305 aligned withslots 406 in heat sink finnedstructure 303 c provide clearance for inserting lever springs 306. When lever springs 306 are loaded as described above,cage 305 provides tension tosystem 400. FIG. 4C illustrates lever springs 306 being assembled intosystem 400 by inserting throughslots 416 incage 305 andslots 406 in heat sink finnedstructure 303 c and resting in contact with the upper end ofpost 304, which has its lower end attached centrally toheat sink base 303 a (see FIG. 4B). In FIG. 4D,cap 307 is being placed ontosystem 400, where it is then fastened rigidly tocage 305 usingscrews 308 or other fasteners.Notches 426 at the lower edges ofcap 307 engage and exert a downward force on the outer ends of lever springs 306, causing a bending moment insprings 306 aboutheat sink post 304, which then transmits and distributes the load betweenheat sink base 303 a andprocessor chip 301 a. Lever springs 306 may be provided withheads 306 a at each end which may be captured bynotches 426. As illustrated in FIG. 4D,cap 307 optionally containsopening 430, which can be configured to mount a cooling fan module, for example coolingfan module 309. - The implementation disclosed above provides a number of advantages. It affords minimal intrusion into the heat sink base space. It loads the heat sink from a post in the heat sink base centered on a processor chip, facilitating symmetric distribution of mechanical load onto the chip and minimizing air flow disruption. Simulation results show that air flow near the heat sink base is important to heat sink performance, and that disrupting air flow lowers this performance. Some embodiments provide a location to mount a fan module adjacent the top of the heat sink for enhanced air flow, and provide for easy disassembly and removal to access the chip if required.
- In some alternative embodiments,
cap 307 can be configured to extend to bolsterplate 302, thereby eliminatingcage 305 as a separate component of heat sink hold-down assembly 300. In such implementations,cap 307 may be attached rigidly to bolsterplate 302 using screws, clips, and/or fasteners of other types. Other implementations include multiple heat sinks in a row, as illustrated in FIG. 4A, and alternative heat transfer structures that can be thicker, extruded, or cast intoheat sink base 303 a instead of thin finned, folded, orcorrugated structure 303 c as illustrated in FIGS. 3A and 3B.
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/419,386 US6798663B1 (en) | 2003-04-21 | 2003-04-21 | Heat sink hold-down with fan-module attach location |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/419,386 US6798663B1 (en) | 2003-04-21 | 2003-04-21 | Heat sink hold-down with fan-module attach location |
Publications (2)
Publication Number | Publication Date |
---|---|
US6798663B1 US6798663B1 (en) | 2004-09-28 |
US20040207986A1 true US20040207986A1 (en) | 2004-10-21 |
Family
ID=32990323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/419,386 Expired - Lifetime US6798663B1 (en) | 2003-04-21 | 2003-04-21 | Heat sink hold-down with fan-module attach location |
Country Status (1)
Country | Link |
---|---|
US (1) | US6798663B1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040188065A1 (en) * | 2003-01-31 | 2004-09-30 | Cooligy, Inc. | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US20050199370A1 (en) * | 2004-03-15 | 2005-09-15 | Huang Ming T. | Heat dissipation module for CPU |
US20070008701A1 (en) * | 2005-07-06 | 2007-01-11 | Delta Electronics, Inc. | Heat-dissipating device |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US8157001B2 (en) | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
US20150061109A1 (en) * | 2013-08-30 | 2015-03-05 | Fuji Electric Co., Ltd. | Semiconductor device |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW564971U (en) * | 2003-01-10 | 2003-12-01 | Hon Hai Prec Ind Co Ltd | A heat dissipating assembly |
US6981542B2 (en) * | 2003-10-29 | 2006-01-03 | Rotys Inc. | Multi-heatsink integrated cooler |
JP4046703B2 (en) * | 2004-03-04 | 2008-02-13 | 三菱電機株式会社 | heatsink |
US7265974B2 (en) * | 2004-09-16 | 2007-09-04 | Industrial Design Laboratories Inc. | Multi-heatsink integrated cooling device |
US20060081357A1 (en) * | 2004-10-20 | 2006-04-20 | Wen-Hao Liu | Radiation module |
US7178587B2 (en) * | 2004-12-20 | 2007-02-20 | Asia Vital Component Co., Ltd. | Heat-dissipating module |
JP2006222388A (en) * | 2005-02-14 | 2006-08-24 | Toshiba Corp | Heat dissipation device and heat dissipation method of electronic apparatus |
US7343963B2 (en) * | 2005-12-07 | 2008-03-18 | International Business Machines Corporation | Hybrid heat sink performance enhancement using recirculating fluid |
US20080061046A1 (en) * | 2006-09-13 | 2008-03-13 | Hypertherm, Inc. | Power Supply Cooling System |
JP4697475B2 (en) * | 2007-05-21 | 2011-06-08 | トヨタ自動車株式会社 | Power module cooler and power module |
JP4703619B2 (en) * | 2007-09-10 | 2011-06-15 | 株式会社東芝 | Electronics |
CN102655727B (en) * | 2011-03-01 | 2016-06-29 | 华北理工大学 | Air guide member |
US8699226B2 (en) | 2012-04-03 | 2014-04-15 | Google Inc. | Active cooling debris bypass fin pack |
US10658717B2 (en) | 2014-09-30 | 2020-05-19 | Cps Technology Holdings Llc | Battery module active thermal management features and positioning |
US10720683B2 (en) | 2014-09-30 | 2020-07-21 | Cps Technology Holdings Llc | Battery module thermal management features for internal flow |
US9825343B2 (en) | 2014-09-30 | 2017-11-21 | Johnson Controls Technology Company | Battery module passive thermal management features and positioning |
US9301422B1 (en) * | 2015-04-01 | 2016-03-29 | John O. Tate | Heat sink with internal fan |
US20170075395A1 (en) * | 2015-09-12 | 2017-03-16 | Li Qingyuan | Solid cooling arrangement for electronic device |
Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4769744A (en) * | 1983-08-04 | 1988-09-06 | General Electric Company | Semiconductor chip packages having solder layers of enhanced durability |
US5010949A (en) * | 1988-03-22 | 1991-04-30 | Bull, S.A. | Device for fastening together under pressure two pieces, one to the other |
US5109317A (en) * | 1989-11-07 | 1992-04-28 | Hitachi, Ltd. | Mounting mechanism for mounting heat sink on multi-chip module |
US5208731A (en) * | 1992-01-17 | 1993-05-04 | International Electronic Research Corporation | Heat dissipating assembly |
US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
US5396402A (en) * | 1993-05-24 | 1995-03-07 | Burndy Corporation | Appliance for attaching heat sink to pin grid array and socket |
US5521439A (en) * | 1993-04-05 | 1996-05-28 | Sgs-Microelectronics S.R.L. | Combination and method for coupling a heat sink to a semiconductor device |
US5570271A (en) * | 1995-03-03 | 1996-10-29 | Aavid Engineering, Inc. | Heat sink assemblies |
US5581441A (en) * | 1995-06-07 | 1996-12-03 | At&T Global Information Solutions Company | Electrically-operated heat exchanger release mechanism |
US5615735A (en) * | 1994-09-29 | 1997-04-01 | Hewlett-Packard Co. | Heat sink spring clamp |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5734556A (en) * | 1996-06-26 | 1998-03-31 | Sun Microsystems, Inc. | Mechanical heat sink attachment having two pin headers and a spring clip |
US5777852A (en) * | 1995-07-20 | 1998-07-07 | Bell; James S. | Clamping device for securing an electrical component to a circuit board |
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US5990552A (en) * | 1997-02-07 | 1999-11-23 | Intel Corporation | Apparatus for attaching a heat sink to the back side of a flip chip package |
US6115253A (en) * | 1994-04-05 | 2000-09-05 | Thermalloy, Inc. | Strap spring for heat sink clip assembly |
US6175499B1 (en) * | 1998-03-09 | 2001-01-16 | International Business Machines Corporation | Heat sink clamping string additionally holding a ZIF socket locked |
US6198630B1 (en) * | 1999-01-20 | 2001-03-06 | Hewlett-Packard Company | Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules |
US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
US6219239B1 (en) * | 1999-05-26 | 2001-04-17 | Hewlett-Packard Company | EMI reduction device and assembly |
US6229703B1 (en) * | 1998-09-04 | 2001-05-08 | Hon Hai Precision Ind. Co., Ltd. | Cooler device |
US20010028552A1 (en) * | 2000-04-10 | 2001-10-11 | Cit Alcatel | Securing heat sinks to electronic components |
US6353537B2 (en) * | 1998-12-17 | 2002-03-05 | Canon Kabushiki Kaisha | Structure for mounting radiating plate |
US6390475B1 (en) * | 1999-08-31 | 2002-05-21 | Intel Corporation | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die |
US6395991B1 (en) * | 1996-07-29 | 2002-05-28 | International Business Machines Corporation | Column grid array substrate attachment with heat sink stress relief |
US6496371B2 (en) * | 2001-03-30 | 2002-12-17 | Intel Corporation | Heat sink mounting method and apparatus |
US6510054B1 (en) * | 2001-07-20 | 2003-01-21 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip assembly with handles |
US6518507B1 (en) * | 2001-07-20 | 2003-02-11 | Hon Hai Precision Ind. Co., Ltd. | Readily attachable heat sink assembly |
US6634890B2 (en) * | 2000-04-14 | 2003-10-21 | Hewlett-Packard Development Company, L.P. | Spring-loaded heat sink assembly for a circuit assembly |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0960554A1 (en) * | 1997-01-24 | 1999-12-01 | Aavid Thermal Technologies, Inc. | A spring clip for mounting a heat sink to an electronic component |
JP2000059072A (en) * | 1998-07-28 | 2000-02-25 | Hewlett Packard Co <Hp> | Emi shield |
-
2003
- 2003-04-21 US US10/419,386 patent/US6798663B1/en not_active Expired - Lifetime
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4769744A (en) * | 1983-08-04 | 1988-09-06 | General Electric Company | Semiconductor chip packages having solder layers of enhanced durability |
US5010949A (en) * | 1988-03-22 | 1991-04-30 | Bull, S.A. | Device for fastening together under pressure two pieces, one to the other |
US5109317A (en) * | 1989-11-07 | 1992-04-28 | Hitachi, Ltd. | Mounting mechanism for mounting heat sink on multi-chip module |
US5208731A (en) * | 1992-01-17 | 1993-05-04 | International Electronic Research Corporation | Heat dissipating assembly |
US5280409A (en) * | 1992-10-09 | 1994-01-18 | Sun Microsystems, Inc. | Heat sink and cover for tab integrated circuits |
US5521439A (en) * | 1993-04-05 | 1996-05-28 | Sgs-Microelectronics S.R.L. | Combination and method for coupling a heat sink to a semiconductor device |
US5396402A (en) * | 1993-05-24 | 1995-03-07 | Burndy Corporation | Appliance for attaching heat sink to pin grid array and socket |
US6115253A (en) * | 1994-04-05 | 2000-09-05 | Thermalloy, Inc. | Strap spring for heat sink clip assembly |
US5615735A (en) * | 1994-09-29 | 1997-04-01 | Hewlett-Packard Co. | Heat sink spring clamp |
US5570271A (en) * | 1995-03-03 | 1996-10-29 | Aavid Engineering, Inc. | Heat sink assemblies |
US5621615A (en) * | 1995-03-31 | 1997-04-15 | Hewlett-Packard Company | Low cost, high thermal performance package for flip chips with low mechanical stress on chip |
US5581441A (en) * | 1995-06-07 | 1996-12-03 | At&T Global Information Solutions Company | Electrically-operated heat exchanger release mechanism |
US5777852A (en) * | 1995-07-20 | 1998-07-07 | Bell; James S. | Clamping device for securing an electrical component to a circuit board |
US5734556A (en) * | 1996-06-26 | 1998-03-31 | Sun Microsystems, Inc. | Mechanical heat sink attachment having two pin headers and a spring clip |
US6395991B1 (en) * | 1996-07-29 | 2002-05-28 | International Business Machines Corporation | Column grid array substrate attachment with heat sink stress relief |
US5932925A (en) * | 1996-09-09 | 1999-08-03 | Intricast, Inc. | Adjustable-pressure mount heatsink system |
US5990552A (en) * | 1997-02-07 | 1999-11-23 | Intel Corporation | Apparatus for attaching a heat sink to the back side of a flip chip package |
US6175499B1 (en) * | 1998-03-09 | 2001-01-16 | International Business Machines Corporation | Heat sink clamping string additionally holding a ZIF socket locked |
US6229703B1 (en) * | 1998-09-04 | 2001-05-08 | Hon Hai Precision Ind. Co., Ltd. | Cooler device |
US6353537B2 (en) * | 1998-12-17 | 2002-03-05 | Canon Kabushiki Kaisha | Structure for mounting radiating plate |
US6198630B1 (en) * | 1999-01-20 | 2001-03-06 | Hewlett-Packard Company | Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules |
US6219239B1 (en) * | 1999-05-26 | 2001-04-17 | Hewlett-Packard Company | EMI reduction device and assembly |
US6390475B1 (en) * | 1999-08-31 | 2002-05-21 | Intel Corporation | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die |
US6208517B1 (en) * | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
US20010028552A1 (en) * | 2000-04-10 | 2001-10-11 | Cit Alcatel | Securing heat sinks to electronic components |
US6462951B2 (en) * | 2000-04-10 | 2002-10-08 | Alcatal Canada Inc. | Securing heat sinks to electronic components |
US6634890B2 (en) * | 2000-04-14 | 2003-10-21 | Hewlett-Packard Development Company, L.P. | Spring-loaded heat sink assembly for a circuit assembly |
US6496371B2 (en) * | 2001-03-30 | 2002-12-17 | Intel Corporation | Heat sink mounting method and apparatus |
US6510054B1 (en) * | 2001-07-20 | 2003-01-21 | Hon Hai Precision Ind. Co., Ltd. | Heat sink clip assembly with handles |
US6518507B1 (en) * | 2001-07-20 | 2003-02-11 | Hon Hai Precision Ind. Co., Ltd. | Readily attachable heat sink assembly |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040188065A1 (en) * | 2003-01-31 | 2004-09-30 | Cooligy, Inc. | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US20050199370A1 (en) * | 2004-03-15 | 2005-09-15 | Huang Ming T. | Heat dissipation module for CPU |
US20070008701A1 (en) * | 2005-07-06 | 2007-01-11 | Delta Electronics, Inc. | Heat-dissipating device |
US8157001B2 (en) | 2006-03-30 | 2012-04-17 | Cooligy Inc. | Integrated liquid to air conduction module |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20150061109A1 (en) * | 2013-08-30 | 2015-03-05 | Fuji Electric Co., Ltd. | Semiconductor device |
US9478477B2 (en) * | 2013-08-30 | 2016-10-25 | Fuji Electric Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
US6798663B1 (en) | 2004-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6798663B1 (en) | Heat sink hold-down with fan-module attach location | |
US5808236A (en) | High density heatsink attachment | |
US6634890B2 (en) | Spring-loaded heat sink assembly for a circuit assembly | |
US7193851B2 (en) | Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses | |
US6646881B1 (en) | Mounting assembly for heat sink | |
US7298622B2 (en) | Modular heat sink assembly | |
US7262969B2 (en) | Heat sink clip assembly | |
US5329426A (en) | Clip-on heat sink | |
US11439042B2 (en) | Heat exchange assembly for a communication system | |
US7558066B2 (en) | System and method for cooling a module | |
US7480144B2 (en) | Heat dissipation device | |
US7095614B2 (en) | Electronic module assembly | |
US6498724B1 (en) | Heat dissipation device for a computer | |
US8074705B2 (en) | Heat dissipation device having fastener assemblies for attachment thereof to a heat-generating component | |
US7362573B2 (en) | Heat dissipation device | |
US7564687B2 (en) | Heat dissipation device having a fixing base | |
US8125782B2 (en) | Heat sink assembly | |
US7626822B2 (en) | Heat sink assembly for multiple electronic components | |
US20090283243A1 (en) | Heat dissipation device | |
US6728103B1 (en) | Heat sink with a cutout | |
US20040109301A1 (en) | Cooling device for an integrated circuit | |
JP2005159357A (en) | Equipment in which heat sink device is combined with electronic substrate, and method thereof | |
US7950446B2 (en) | Heat dissipation device with clip for mounting a fan to a heat sink thereof | |
US20030231479A1 (en) | Retention module for heat sink | |
JPH0982859A (en) | Heat sink assembled body |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:RUBENSTEIN, BRANDON A.;REEL/FRAME:013894/0315 Effective date: 20030311 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;REEL/FRAME:037079/0001 Effective date: 20151027 |
|
FPAY | Fee payment |
Year of fee payment: 12 |