US20030139057A1 - Process and apparatus for removal of photoresist from semiconductor wafers - Google Patents
Process and apparatus for removal of photoresist from semiconductor wafers Download PDFInfo
- Publication number
- US20030139057A1 US20030139057A1 US10/053,371 US5337102A US2003139057A1 US 20030139057 A1 US20030139057 A1 US 20030139057A1 US 5337102 A US5337102 A US 5337102A US 2003139057 A1 US2003139057 A1 US 2003139057A1
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- United States
- Prior art keywords
- ozone
- deionized water
- photoresist
- semiconductor wafers
- tank
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
Definitions
- This invention relates to methods and systems for removing photoresist from the surfaces of silicon semiconductor wafers.
- DIO 3 which is a mixture of chilled distilled water (DI) and ozone ( 0 3 ), to remove photoresist from surfaces of a silicon wafer has been taught by Matthews in U. S. Pat. No. 5,776,296. Matthews discloses a process and an apparatus for removing photoresist from a semiconductor wafer using DIO 3 at sub-ambient temperatures of 1 to 15° C.
- the ozone is introduced into the process tank with “a composite element having a permeable member and a nonpermeable member, the permeable member having a top portion and a bottom portion, a means defining an open space in a center portion of the permeable member, and a means defining a trench positioned on the top portion of the permeable member between an outer periphery of the permeable member and the means defining an open space.”
- the Matthews system suffers from certain disadvantages with respect to the speed, efficiency, and effectiveness of photoresist removal.
- DIO 3 water which is a mixture of deionized (“DI”) water and ozone (“O 3 ”) is sprayed at ambient temperature or higher in a process tank via nozzles.
- DI deionized
- O 3 ozone
- the apparatus of the invention comprises a tank capable of holding semiconductor wafers and one or more nozzles within the tank adapted to spray a mixture of deionized water and ozone.
- a pressure plenum set in excess of one atmosphere a temperature control system, an ozonator, a filter connected to the tank, and a recirculating pump are included. It is further preferred that the temperature controller is set to maintain the liquid temperature at 20-21° C. or higher.
- a preferred method comprises placing semiconductor wafers within a process tank which is filled with deionized water, introducing ozone and continuously the ozone by pumping ozone and recirculating it through a filter, through an ozonator and then back to the pressurized plenum connected to the process tank.
- the ozone is generated from the generator and fed into the tank and also to another ozonator where the ozone gas is mixed with the deionized water.
- the ozone is mixed with deionized water which is sprayed onto the silicon semiconductor wafers via nozzles.
- the DIO 3 water mixture can be exposed to the photoresist in the form of a fog and/or tiny droplets of water.
- the concentration level of the gaseous and dissolved ozone can be monitored using inline ozone analyzers.
- the rate of photoresist removal raises the rate of photoresist removal, i.e., the “strip rate” for photoresist treated with DIO 3 water is linked to the velocity rate of the DIO 3 water.
- an increase in the fluid velocity reduces the boundary layer thickness, thereby resulting in a higher rate of O 3 oxidizing the photoresist (also known as “the etching rate”).
- the use of sonic energy also reduces the boundary layer thickness, again resulting in a higher rate of O 3 oxidizing the photoresist or etch rate.
- the higher the kinetic energy and O 3 concentration the shorter the strip time.
- FIG. 1 is a schematic of a photoresist stripping apparatus comprising nozzles according to the invention.
- FIG. 2 is a chart of the rate of etching of the photoresist versus the ambient temperature.
- FIG. 3 is a chart of the rate of etching of the photoresist versus the velocity of DIO 3 water.
- the object of the present invention is to provide a method which significantly increases the O 3 concentration in a DI water solution from the methods currently available.
- the series of nozzles seek to increase the velocity rate of the DIO 3 water so as to reduce the boundary layer thickness and therefore increase the rate of etching.
- it is an object of the invention to provide for a process for removing photoresist from semiconductor wafers comprising applying pressure in excess of one atmosphere to ozone, mixing said ozone with deionized water, and finally exposing the semiconductor wafers having at least one layer of photoresist to said mixture of ozone and deionized water via a series of nozzles.
- the preferred process for removing photoresist from semiconductor wafers includes recirculating the mixture of deionized water and ozone and adding ozone when needed so that the concentration of ozone in the mixture is about constant.
- the temperature of the liquied in the process tank is maintained at or above ambient temperature, which is about 20-21° C.
- the mixture of deionized water and ozone is agitated by spraying the semiconductor wafers with droplets of the mixture of deionized water and ozone.
- the apparatus includes the process tank capable of holding semiconductor wafers, one or a series of nozzles, a source of ozone connected to the tank, a source of deionized water connected to the tank, and means for recirculating the deionized water.
- a pressure plenum connected to the source of ozone is included, and the series of nozzles is located at the top of the tank.
- the means for recirculating the deionized water is preferably connected to the source of the ozone and a pressure plenum.
- the apparatus includes cassettes filled with semiconductor wafers having a layer or multi-layers of photoresist wherein the semiconductor wafers are exposed to pressurized DIO 3 water at ambient temperatures and with a velocity produced by a series of nozzles so as to etch or remove the photoresist at a higher rate than previously known.
- the illustrated photoresist removal apparatus including a process tank 10 which holds semiconductor wafers 20 in a cassette 30 .
- the semiconductor wafers 20 have a layer or multiple layers of photoresist baked onto them.
- the semiconductor wafers 20 are placed within the cassette 30 and process tank 10 so as to have this photoresist removed in as quickly and completely as possible.
- DIO 3 water 40 is produced by combining pure ozone gas (O 3 ) 50 from an ozone generator 60 with deionized water 70 .
- Deionized water 70 is pumped into the process tank via multiple nozzles 80 .
- the multiple nozzles 80 thus produce DIO 3 fog wherein the DIO 3 fog interacts with the photoresist on the semiconductor wafers 20 .
- the multiple nozzles 80 also produce DIO 3 droplet varying in diameter which then interact with the photoresist on the semiconductor wafers 20 .
- the droplet size of the sprayed deionized-water will range from a few microns in the fogging stage to a few millimeters in size once collected on the semiconductor wafers 20 .
- the level of ozone in the DIO 3 water 40 is kept in constant through regulation of a gas O 3 sensor 90 . If the ozone level is high enough, it passes through the gas sensor 90 and into the process tank 10 . On the other hand, if the ozone level is too low, then the ozone passes through the gas sensor 90 and into an ozonator 100 where more ozone is added until it reaches the proper level, at which time it passes into the process tank 10 . O 3 50 is dispersed into the process tank 10 via the multiple nozzles 90 and thus the process begins anew.
- the DIO 3 water 40 flows from the process tank 10 back into a pump 120 after passing through a second sensor, a dissolved O 3 50 sensor 130 which measures the level of concentration of O 3 50 in the DIO 3 water 40 .
- the recirculated DIO 3 water 40 passes through the pump 120 and into the filter 140 before O 3 50 added back into the DIO 3 water 40 .
- the temperature in the process tank 10 is maintained at higher than the atmospheric pressure to help maintain a high ozone concentration inside the process tank 10 and to enhance the stripping rate. Further, since the process tank 10 is kept pressurized the temperature within the process tank 10 is increased above ambient temperature.
- the DIO 3 water 40 Upon condensation of the DIO 3 water 40 as droplets upon the semiconductor wafers 20 the DIO 3 water 40 is collected in the bottom 150 of the process tank 10 . This liquid is then recirculated through the pump 120 and process through a filter 140 . The DIO 3 water 40 is then passed through the gas sensor 60 at which time the ozone layer is measured and if low passes through the ozonator 100 where more ozone is added until it reaches the proper level, at which time it passes into the process tank 10 .
- the rate relationship between the ambient temperature and concentration of ozone in the DIO 3 water 40 indicates that a process time of 15-25 min. can be used to strip about 15000 Angstrom of positive hard baked photoresist at ambient temperature.
- the photoresist strip rate depends on the dissolved O 3 concentration and average fluid velocity.
- FIG. 3 presents experimental data showing the relationship between the etching rate and the velocity of DIO 3 water 40 , the higher the kinetic energy (from the fluid velocities) and ozone concentration, the shorter the strip time.
- ozone is introduced to the wafer surface and penetrates the boundary layer.
- the series of nozzles play a significant role to reduce the process time significantly when optimized.
- the removal rate has shown to depend on the fluid velocity, turbulence intensity, and ozone concentration.
- the pressure of the DIO 3 water also directly affects the O 3 concentration and correspondingly affects the etch rate.
- the etch rate is affected by the O 3 concentration in the DI water which is in turn affected by the temperature and pressure of the DIO 3 water. Further, the etch rate is directly affected by the velocity rate of the DIO 3 water.
Abstract
A process for removing photoresist from semiconductor wafers is disclosed wherein pressure in excess of one atmosphere is applied to ozone, followed by a mixing of the ozone with deionized water via a series of nozzles, and finally where the semiconductor wafers having at least one layer of photoresist are exposed to the mixture of ozone and deionized water. The temperature during the process is maintained at above ambient temperatures of 20-21° C. or 70° F.
An apparatus for the removal of photoresist from semiconductor wafers wherein the apparatus is comprised of a tank capable of holding semiconductor wafers, a series of nozzles, a source of ozone connected to the tank, a source of deionized water connected to the tank; and finally a means for recirculating the deionized water connected to the tank
Description
- This invention relates to methods and systems for removing photoresist from the surfaces of silicon semiconductor wafers.
- The need for quick and efficient removal of photoresist is critical in the area of semiconductor manufacturing. In order to produce a useful semiconductor wafer, first a silicon crystal is grown, sliced into thin wafers, and exposed to a photoresist which forms a layer on the wafers. Multiple layers of photoresist can be formed on the surface of the wafers and then etched off to form patterns on the wafers.
- The use of DIO3 which is a mixture of chilled distilled water (DI) and ozone (0 3), to remove photoresist from surfaces of a silicon wafer has been taught by Matthews in U. S. Pat. No. 5,776,296. Matthews discloses a process and an apparatus for removing photoresist from a semiconductor wafer using DIO3 at sub-ambient temperatures of 1 to 15° C. wherein the ozone is introduced into the process tank with “a composite element having a permeable member and a nonpermeable member, the permeable member having a top portion and a bottom portion, a means defining an open space in a center portion of the permeable member, and a means defining a trench positioned on the top portion of the permeable member between an outer periphery of the permeable member and the means defining an open space.” The Matthews system suffers from certain disadvantages with respect to the speed, efficiency, and effectiveness of photoresist removal.
- It is an object of the present invention to provide an improved process of removal of photoresist from semiconductor wafers during the manufacture thereof. Another object is to provide a process and system at high rates and efficiency.
- These objects, and others which will become apparant from the following disclosure and the accompanying drawings, are achieved by the present invention which comprises in one aspect a method of removing photoresist from silicon wafers wherein DIO3 water which is a mixture of deionized (“DI”) water and ozone (“O3”) is sprayed at ambient temperature or higher in a process tank via nozzles.
- In another aspect, the apparatus of the invention comprises a tank capable of holding semiconductor wafers and one or more nozzles within the tank adapted to spray a mixture of deionized water and ozone.
- Preferably a pressure plenum set in excess of one atmosphere, a temperature control system, an ozonator, a filter connected to the tank, and a recirculating pump are included. It is further preferred that the temperature controller is set to maintain the liquid temperature at 20-21° C. or higher.
- A preferred method comprises placing semiconductor wafers within a process tank which is filled with deionized water, introducing ozone and continuously the ozone by pumping ozone and recirculating it through a filter, through an ozonator and then back to the pressurized plenum connected to the process tank. The ozone is generated from the generator and fed into the tank and also to another ozonator where the ozone gas is mixed with the deionized water. In addition, the ozone is mixed with deionized water which is sprayed onto the silicon semiconductor wafers via nozzles. The DIO3 water mixture can be exposed to the photoresist in the form of a fog and/or tiny droplets of water. The concentration level of the gaseous and dissolved ozone can be monitored using inline ozone analyzers.
- Agitation of the DIO3 water on the photoresist layers raises the rate of photoresist removal, i.e., the “strip rate” for photoresist treated with DIO3 water is linked to the velocity rate of the DIO3 water. Notably, an increase in the fluid velocity reduces the boundary layer thickness, thereby resulting in a higher rate of O3 oxidizing the photoresist (also known as “the etching rate”). In addition, the use of sonic energy also reduces the boundary layer thickness, again resulting in a higher rate of O3 oxidizing the photoresist or etch rate. Thus, the higher the kinetic energy and O3 concentration, the shorter the strip time.
- FIG. 1 is a schematic of a photoresist stripping apparatus comprising nozzles according to the invention.
- FIG. 2 is a chart of the rate of etching of the photoresist versus the ambient temperature.
- FIG. 3 is a chart of the rate of etching of the photoresist versus the velocity of DIO3 water.
- Inasmuch as the etch rate of photoresist utilizing a solution of O3 in DI water increases linearly with the increase in O3 concentration, the object of the present invention is to provide a method which significantly increases the O3 concentration in a DI water solution from the methods currently available. In addition, the series of nozzles seek to increase the velocity rate of the DIO3 water so as to reduce the boundary layer thickness and therefore increase the rate of etching.
- Thus, it is an object of the invention to provide for a process for removing photoresist from semiconductor wafers comprising applying pressure in excess of one atmosphere to ozone, mixing said ozone with deionized water, and finally exposing the semiconductor wafers having at least one layer of photoresist to said mixture of ozone and deionized water via a series of nozzles.
- The preferred process for removing photoresist from semiconductor wafers includes recirculating the mixture of deionized water and ozone and adding ozone when needed so that the concentration of ozone in the mixture is about constant. The temperature of the liquied in the process tank is maintained at or above ambient temperature, which is about 20-21° C. The mixture of deionized water and ozone is agitated by spraying the semiconductor wafers with droplets of the mixture of deionized water and ozone.
- The apparatus includes the process tank capable of holding semiconductor wafers, one or a series of nozzles, a source of ozone connected to the tank, a source of deionized water connected to the tank, and means for recirculating the deionized water. In some preferred embodiments a pressure plenum connected to the source of ozone is included, and the series of nozzles is located at the top of the tank. The means for recirculating the deionized water is preferably connected to the source of the ozone and a pressure plenum.
- In some embodiments, the apparatus includes cassettes filled with semiconductor wafers having a layer or multi-layers of photoresist wherein the semiconductor wafers are exposed to pressurized DIO3 water at ambient temperatures and with a velocity produced by a series of nozzles so as to etch or remove the photoresist at a higher rate than previously known.
- Referring now to FIG. 1, the illustrated photoresist removal apparatus including a
process tank 10 which holds semiconductor wafers 20 in acassette 30. The semiconductor wafers 20 have a layer or multiple layers of photoresist baked onto them. Thesemiconductor wafers 20 are placed within thecassette 30 andprocess tank 10 so as to have this photoresist removed in as quickly and completely as possible. - The
semiconductor wafers 20 are thus exposed to DIO3 water 40 at ambient temperatures of between 20-21° C. DIO3 water 40 is produced by combining pure ozone gas (O3) 50 from anozone generator 60 with deionizedwater 70. Deionizedwater 70 is pumped into the process tank viamultiple nozzles 80. Themultiple nozzles 80 thus produce DIO3 fog wherein the DIO3 fog interacts with the photoresist on thesemiconductor wafers 20. Themultiple nozzles 80 also produce DIO3 droplet varying in diameter which then interact with the photoresist on the semiconductor wafers 20. The droplet size of the sprayed deionized-water will range from a few microns in the fogging stage to a few millimeters in size once collected on thesemiconductor wafers 20. The level of ozone in the DIO3 water 40 is kept in constant through regulation of a gas O3 sensor 90. If the ozone level is high enough, it passes through thegas sensor 90 and into theprocess tank 10. On the other hand, if the ozone level is too low, then the ozone passes through thegas sensor 90 and into anozonator 100 where more ozone is added until it reaches the proper level, at which time it passes into theprocess tank 10. O3 50 is dispersed into theprocess tank 10 via themultiple nozzles 90 and thus the process begins anew. - The DIO3 water 40 flows from the
process tank 10 back into apump 120 after passing through a second sensor, a dissolvedO 3 50sensor 130 which measures the level of concentration ofO 3 50 in the DIO3 water 40. The recirculated DIO3 water 40 passes through thepump 120 and into the filter 140 beforeO 3 50 added back into the DIO3 water 40. - The temperature in the
process tank 10 is maintained at higher than the atmospheric pressure to help maintain a high ozone concentration inside theprocess tank 10 and to enhance the stripping rate. Further, since theprocess tank 10 is kept pressurized the temperature within theprocess tank 10 is increased above ambient temperature. - Upon condensation of the DIO3 water 40 as droplets upon the semiconductor wafers 20 the DIO3 water 40 is collected in the
bottom 150 of theprocess tank 10. This liquid is then recirculated through thepump 120 and process through a filter 140. The DIO3 water 40 is then passed through thegas sensor 60 at which time the ozone layer is measured and if low passes through theozonator 100 where more ozone is added until it reaches the proper level, at which time it passes into theprocess tank 10. - Referring now to FIG. 2, the rate relationship between the ambient temperature and concentration of ozone in the DIO3 water 40 indicates that a process time of 15-25 min. can be used to strip about 15000 Angstrom of positive hard baked photoresist at ambient temperature. The photoresist strip rate depends on the dissolved O3 concentration and average fluid velocity.
- Referring now to FIG. 3 which presents experimental data showing the relationship between the etching rate and the velocity of DIO3 water 40, the higher the kinetic energy (from the fluid velocities) and ozone concentration, the shorter the strip time. By increasing the fluid velocity and turbulence intensity, ozone is introduced to the wafer surface and penetrates the boundary layer. The series of nozzles play a significant role to reduce the process time significantly when optimized. The removal rate has shown to depend on the fluid velocity, turbulence intensity, and ozone concentration.
- Further, the pressure of the DIO3 water also directly affects the O3 concentration and correspondingly affects the etch rate. In summary, the etch rate is affected by the O3 concentration in the DI water which is in turn affected by the temperature and pressure of the DIO3 water. Further, the etch rate is directly affected by the velocity rate of the DIO3 water.
- Various modifications and alterations of this invention will become apparent to those skilled in the art without departing from the scope and spirit of this invention, and it should be understood that this invention is not limited to the illustrative embodiments set forth herein.
Claims (21)
1. A process for removing photoresist from semiconductor wafers comprising applying pressure in excess of one atmosphere to ozone; mixing said ozone with deionized water; and exposing semiconductor wafers having at least one layer of photoresist to said mixture of ozone and deionized water via at least one nozzle.
2. The process according to claim 1 further comprising the step of placing the semiconductor wafers within a processing tank.
3. The process according to claim 1 further comprising the step of keeping the temperature in the processing tank at ambient temperature.
4. The process according to claim 3 wherein the temperature is above 20-21° C.
5. The process according to claim 1 wherein the mixture of ozone and deionized water is recirculated and flows back into the processing tank.
6. The process according to claim 1 wherein the mixture of deionized water and ozone is recirculated and ozone added thereby keeping the concentration of ozone in said mixture about constant.
7. The process according to claim 7 wherein said mixture of deionized water and ozone is agitated via at least one nozzle.
8. The process according to claim 1 where said mixture of deionized water and ozone is a vapor within said processing tank.
9. The process according to claim 2 wherein said mixture of deionized water and ozone is pumped into said processing tank in droplets.
11. An apparatus for the removal of photoresist from semiconductor wafers, comprising:
(a) a tank capable of holding semiconductor wafers;
(b) at least one nozzle set within said tank;
(c) a source of ozone connected to said tank;
(d) a source of deionized water connected to said tank; and
(e) a means for recirculating said deionized water.
12. An apparatus according to claim 11 further comprising a pressure plenum connected to said source of ozone.
13. The apparatus according to claim 11 wherein said pressure plenum is set in excess of one atmosphere.
14. An apparatus according to claim 11 further comprising a means for temperature control.
15. An apparatus according to claim 14 wherein said temperature is above 20-21° C.
16. An apparatus according to claim 11 wherein said means for recirculating said deionized water is connected to said source of ozone.
17. An apparatus according to claim 11 wherein said means for recirculating said deionized water is connected to a pressure plenum.
18. The apparatus according to claim 11 further comprising an ozonator.
19. The apparatus according to claim 11 further comprising a filter connected to said processing tank.
20. The apparatus according to claim 11 wherein said source of ozone is an ozone generator.
21. The apparatus according to claim 11 wherein said means for recirculating said deionized water is a pump.
22. The apparatus according to claim 11 wherein the nozzles are at the top of the process tank.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/053,371 US20030139057A1 (en) | 2002-01-18 | 2002-01-18 | Process and apparatus for removal of photoresist from semiconductor wafers |
AU2003205245A AU2003205245A1 (en) | 2002-01-18 | 2003-01-20 | Process and appratus for removal of photoresist from semiconductor wafers using spray nozzles |
PCT/US2003/001668 WO2003062921A2 (en) | 2002-01-18 | 2003-01-20 | Process and appratus for removal of photoresist from semiconductor wafers using spray nozzles |
US10/366,054 US6818563B2 (en) | 2002-01-18 | 2003-02-13 | Process and apparatus for removal of photoresist from semiconductor wafers using spray nozzles |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/053,371 US20030139057A1 (en) | 2002-01-18 | 2002-01-18 | Process and apparatus for removal of photoresist from semiconductor wafers |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US10/366,054 Continuation-In-Part US6818563B2 (en) | 2002-01-18 | 2003-02-13 | Process and apparatus for removal of photoresist from semiconductor wafers using spray nozzles |
Publications (1)
Publication Number | Publication Date |
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US20030139057A1 true US20030139057A1 (en) | 2003-07-24 |
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ID=21983757
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/053,371 Abandoned US20030139057A1 (en) | 2002-01-18 | 2002-01-18 | Process and apparatus for removal of photoresist from semiconductor wafers |
US10/366,054 Expired - Fee Related US6818563B2 (en) | 2002-01-18 | 2003-02-13 | Process and apparatus for removal of photoresist from semiconductor wafers using spray nozzles |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US10/366,054 Expired - Fee Related US6818563B2 (en) | 2002-01-18 | 2003-02-13 | Process and apparatus for removal of photoresist from semiconductor wafers using spray nozzles |
Country Status (3)
Country | Link |
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US (2) | US20030139057A1 (en) |
AU (1) | AU2003205245A1 (en) |
WO (1) | WO2003062921A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050003737A1 (en) * | 2003-06-06 | 2005-01-06 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
US20050178401A1 (en) * | 2002-04-26 | 2005-08-18 | Boyers David G. | Method and apparatus for treating a substrate with an ozone-solvent solution III |
US20050186803A1 (en) * | 2004-02-20 | 2005-08-25 | Kaori Umezawa | Method of manufacturing semiconductor device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102253608B (en) * | 2010-05-19 | 2012-09-05 | 常州瑞择微电子科技有限公司 | Method for removing photoresist on photomask |
US9056262B2 (en) * | 2012-11-08 | 2015-06-16 | Mks Instruments, Inc. | Pressure-less ozonated Di-water (DIO3) recirculation reclaim system |
US10170350B2 (en) | 2014-05-02 | 2019-01-01 | Naura Akrion Inc. | Correlation between conductivity and pH measurements for KOH texturing solutions and additives |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5464480A (en) * | 1993-07-16 | 1995-11-07 | Legacy Systems, Inc. | Process and apparatus for the treatment of semiconductor wafers in a fluid |
WO1996015550A1 (en) * | 1994-11-10 | 1996-05-23 | Lawrence Semiconductor Research Laboratory, Inc. | Silicon-germanium-carbon compositions and processes thereof |
US6701941B1 (en) * | 1997-05-09 | 2004-03-09 | Semitool, Inc. | Method for treating the surface of a workpiece |
US6017827A (en) * | 1998-05-04 | 2000-01-25 | Micron Technology, Inc. | System and method for mixing a gas into a solvent used in semiconductor processing |
US6103680A (en) * | 1998-12-31 | 2000-08-15 | Arch Specialty Chemicals, Inc. | Non-corrosive cleaning composition and method for removing photoresist and/or plasma etching residues |
US6758938B1 (en) * | 1999-08-31 | 2004-07-06 | Micron Technology, Inc. | Delivery of dissolved ozone |
US6634368B1 (en) * | 1999-11-12 | 2003-10-21 | Texas Instruments Incorporated | Application of ozonated DI water to scrubbers for resist strip and particle removal processes |
US6272768B1 (en) * | 1999-11-12 | 2001-08-14 | Michael J. Danese | Apparatus for treating an object using ultra-violet light |
US6666928B2 (en) * | 2001-09-13 | 2003-12-23 | Micell Technologies, Inc. | Methods and apparatus for holding a substrate in a pressure chamber |
US6706641B2 (en) * | 2001-09-13 | 2004-03-16 | Micell Technologies, Inc. | Spray member and method for using the same |
-
2002
- 2002-01-18 US US10/053,371 patent/US20030139057A1/en not_active Abandoned
-
2003
- 2003-01-20 AU AU2003205245A patent/AU2003205245A1/en not_active Abandoned
- 2003-01-20 WO PCT/US2003/001668 patent/WO2003062921A2/en not_active Application Discontinuation
- 2003-02-13 US US10/366,054 patent/US6818563B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050178401A1 (en) * | 2002-04-26 | 2005-08-18 | Boyers David G. | Method and apparatus for treating a substrate with an ozone-solvent solution III |
US20050003737A1 (en) * | 2003-06-06 | 2005-01-06 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
US7238085B2 (en) | 2003-06-06 | 2007-07-03 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
US20050186803A1 (en) * | 2004-02-20 | 2005-08-25 | Kaori Umezawa | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
WO2003062921A3 (en) | 2004-08-19 |
US20030136334A1 (en) | 2003-07-24 |
AU2003205245A1 (en) | 2003-09-02 |
US6818563B2 (en) | 2004-11-16 |
WO2003062921A2 (en) | 2003-07-31 |
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