US20020046877A1 - Cf card casing structure - Google Patents
Cf card casing structure Download PDFInfo
- Publication number
- US20020046877A1 US20020046877A1 US09/172,004 US17200498A US2002046877A1 US 20020046877 A1 US20020046877 A1 US 20020046877A1 US 17200498 A US17200498 A US 17200498A US 2002046877 A1 US2002046877 A1 US 2002046877A1
- Authority
- US
- United States
- Prior art keywords
- cover plate
- casing structure
- counter
- card casing
- counter cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
Definitions
- the present invention relates to a casing structure for packaging a small-sized PC card, which is commonly called “Compact Flash Card” (hereinafter referred to as “CF card”), and is used in a mobile personal computer, portable telephone, digital camera and any surrounding electric/electronic device therefor.
- CF card Compact Flash Card
- a conventional CF card casing structure is disclosed in U.S. Pat. No. 5,397,857.
- the conventional CF card casing structure comprises upper and lower insert-molded plates each having a metal sheet circumferentially embedded in its resin-molded frame.
- a chip-carrier substrate and an associated electric connector are sandwiched between the upper and lower insert-molded plates, and their resin-molded frames are super-sonic welded to form an integral package.
- the upper and lower plates when subjected to the supersonic welding are liable to be deviated from their alignment position.
- the chip-carrier substrate has SMT leads soldered to its selected conductors, but such SMT leads when subjected to supersonic vibration are likely to come off. These will lead to poor yield of final products.
- the supersonic welding makes it difficult to take chip-carrier substrates off from defective packages for reuse. Even though the chip-carrier substrates are removed from such defective packages for reuse, the remaining casings cannot be reused, and therefore, new cover plates are required. The manufacturing cost of extra or additional cover plates is relatively high. Also disadvantageously, the chip-carrier substrates and I/O connectors when removed from the defective packages, are likely to be damaged more or less, and the cost involved for fixing such defective chip-carrier substrates for reuse is relatively high.
- One object of the present invention is to provide an improved CF card casing structure which is free of such defects or problems as described above.
- a CF card casing structure comprising at least a cover plate having a metal sheet surrounded by and fixed to an insert-molded frame, a counter cover plate of metal sheet and a receptacle connector is improved according to the present invention in that: the insert-molded frame has a plurality of catch slots made therein; and the counter cover plate has a corresponding plurality of serrated latch pieces integrally connected thereto, each latch piece being adapted to be inserted into a corresponding catch slot for fastening the cover plate to the counter cover plate, thereby providing an integral assembly.
- the cover plate and/or the counter cover plate may have an adhesive tape on its inside, the adhesive tape having adhesive partly applied to its carrier material, thereby permitting a sticky area to be left for fixing the receptacle connector, I/O connector and the like to selected areas of the cover plate by removing the carrier material.
- the cover plate and/or the counter cover plate may have an adhesive tape on its inside, the adhesive tape having adhesive partly applied to its carrier material, thereby permitting a sticky area to be left for fixing the receptacle connector, I/O connector and the like to selected areas of the cover plate by removing the carrier material.
- the opposite cover plates may be latched together to be mechanically and electrically connected, thus permitting the shielding of a chip-carrier PCB sandwiched therebetween.
- the cover plate may have an insulating film applied to its inner metal surface, and likewise, the counter cover plate may have an insulating film applied to its inner metal surface, whereby the parts of the chip-carrier PCB sandwiched between the opposite cover plates may be protected from ESD voltage.
- FIG. 1 is a perspective view of a CF card casing structure according to the present invention in the state of being used;
- FIGS. 2 ( a ), ( b ) and ( c ) are rear, side and front views of the CF card casing structure respectively;
- FIGS. 3 ( a ) and ( b ) are plane views of the resin-framed metal cover plate of the CF card casing structure as seen from top and bottom sides respectively;
- FIGS. 4 ( a ), ( b ) and ( c ) are rear, front and side views of the resin-framed metal cover plate of the CF card casing structure respectively;
- FIGS. 5 ( a ), ( b ), ( c ) and ( d ) are sectional views taken along the line 5 a - 5 a, the line 5 b - 5 b, and the line 5 c - 5 c in FIG. 3, and FIG. 5( d ) is an enlarged fragmental view of encircled portion “ 5 d ” in FIG. 3;
- FIG. 6 is a plane view of the resin-framed metal cover plate with an adhesive tape applied to its metal sheet;
- FIG. 7 is a plane view of the metal cover plate of the CF card casing structure
- FIGS. 8 ( a ) and ( b ) are side and rear views of the metal cover plate respectively.
- FIG. 9 is a sectional view of a fragment of a conventional CF card casing structure.
- a CF card casing structure 1 comprises a cover plate (bottom cover) 1 a having a metal sheet 4 surrounded by and fixed to an insert-molded frame 2 of a synthetic resin such as PPS, a counter cover plate (top cover) 3 of metal sheet such as stainless sheet and a receptacle connector 11 and a socket 10 .
- the resin-framed metal cover plate 1 a is like a rectangular box, and it is for instance, about 36 mm long, about 43 mm wide and about 3.3 mm thick.
- a metal sheet 4 is circumferentially embedded in a surrounding resin frame 2 in inject-molding, thus providing a resin-framed metal cover plate 1 a.
- the resin-molded frame 2 has an opening 5 made on its rear side (upper side in FIG. 3 a ) for accommodating the socket 10 , which a cable adapter 9 can be applied to for connecting a mobile electronic device. Also, it has another opening 6 made on its front side (lower side in FIG. 3 a ) for accommodating the receptacle connector 11 , which the pin-header of a CF card can be applied to.
- the resin-molded frame 2 has guide slots 7 made on its opposite sides for insertion into an associated electric/electronic device. Also, it has a finger catch 8 projecting from its rear, lower edge for withdrawal from the associated electric/electronic device.
- the resin-molded frame 2 has engagement slots 12 made lengthwise in the rear, lateral side and engagement slots 13 made lengthwise in the opposite, longitudinal sides. These engagement slots 12 and 13 are adapted to catch the counter projections of the cover plate (top cover) 3 , as later described. Also, the resin-molded frame 2 has notches 2 a made in the opposite, longitudinal sides. These notches 2 a are adapted to catch the hook-like engagement projections of the top cover 3 , as later described, too.
- a resin framed metal plate or bottom cover 1 a has an insulating adhesive tape or sheet 14 applied to its inside.
- the adhesive sheet 14 has a flap 14 a extending from its front edge.
- the adhesive sheet 14 can be removed from the back of the bottom cover 1 a along the broken lines “a” by pulling the flap 14 to leave the adhesive area delimited by the outer circumference and broken lines “a” of the adhesive sheet.
- the socket 10 and the receptacle connector 11 are fixed to the adhesive area thus exposed.
- the adhesive agent-free area 14 d is defined inside the broken line “a”.
- the top metal cover 3 has serrated latch pieces 3 a and 3 d integrally connected to and standing upright from its rear, lateral and opposite longitudinal sides, and hook-like engagement pieces 3 b and 3 c integrally connected to and standing upright from its opposite longitudinal sides.
- the serrated latch pieces 3 a and 3 d are adapted to be caught by the catch slots whereas the hook-like engagement pieces 3 d and 3 e are adapted to be caught by the notches 2 a of the bottom cover 1 a. More specifically, when the top metal cover 3 is applied to the bottom framed-metal cover 1 a, the serrated latch pieces 3 a and 3 d are pushed in the catch slots 13 to be caught thereby. The serration of each latch piece effectively prevents the slipping-off of the top cover 3 from the bottom cover 1 a.
- the top metal cover 3 has an insulating adhesive sheet 15 applied to the whole inner surface thereof.
- the insulating adhesive sheet has perforation 15 a made therein, and a flap 15 b projecting from the metal cover 3 .
- the area of the insulating adhesive sheet 15 which is delimited by the outer circumference and the perforation 15 a can be removed by pulling the flap 15 b to leave the adhesive area behind.
- the insulating adhesive sheet has no adhesive applied to its center area encircled by the broken line “b”.
- the receptacle connector 11 and the socket 10 into a card package 1 , first, the insulating adhesive sheet 14 is partly removed along the perforation line “a” from the framed metal cover 1 a to leave the center adhesive-free area on the bottom plate 1 a (see FIG. 6), and then the receptacle connector 11 is put on the adhesive area thus exposed, and a printed circuit substrate is putted on the center insulating area.
- the socket 10 is put on the rear side of the framed metal cover 1 a.
- the insulating adhesive sheet 15 is partly removed from the top metal cover 3 along the perforation line 15 a , and then the top metal cover 3 is applied to the bottom cover 1 a with its serrated and hook-like engagement pieces 3 a , 3 d , and 3 b , 3 c caught by the catch slots 13 and notches 2 a .
- the card package 1 is provided as shown in FIG. 1.
- All parts are fixedly fastened in positions by means of latching means and by fixing the top and bottom covers in their adhesive circumferences.
- the chip-carrier PCB is pinched between the upper and lower insulating sheets of adhesive carrier material, and the top and bottom metal sheets are electrically connected by their hook-like engagement pieces 3 b , 3 c , thereby permitting the chip-carrier PCB and associated contacts to be grounded to the surrounding shield thus provided.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Disclosed is an improvement in a CF card casing structure comprising at least a cover plate having a metal sheet surrounded by and fixed to an insert-molded frame, a counter cover plate of metal sheet and a receptacle connector. The insert-molded frame has catch slots made therein; and the counter cover plate has serrated latch pieces integrally connected thereto. Each latch piece is adapted to be inserted into a corresponding catch slot for detachably fastening the cover plate to the counter cover plate, thereby providing an integral assembly.
Description
- 1. Field of the Invention
- The present invention relates to a casing structure for packaging a small-sized PC card, which is commonly called “Compact Flash Card” (hereinafter referred to as “CF card”), and is used in a mobile personal computer, portable telephone, digital camera and any surrounding electric/electronic device therefor.
- 2. Description of Related Art
- A conventional CF card casing structure is disclosed in U.S. Pat. No. 5,397,857. Referring to FIG. 9, the conventional CF card casing structure comprises upper and lower insert-molded plates each having a metal sheet circumferentially embedded in its resin-molded frame. A chip-carrier substrate and an associated electric connector are sandwiched between the upper and lower insert-molded plates, and their resin-molded frames are super-sonic welded to form an integral package.
- The upper and lower plates when subjected to the supersonic welding are liable to be deviated from their alignment position. The chip-carrier substrate has SMT leads soldered to its selected conductors, but such SMT leads when subjected to supersonic vibration are likely to come off. These will lead to poor yield of final products. The supersonic welding makes it difficult to take chip-carrier substrates off from defective packages for reuse. Even though the chip-carrier substrates are removed from such defective packages for reuse, the remaining casings cannot be reused, and therefore, new cover plates are required. The manufacturing cost of extra or additional cover plates is relatively high. Also disadvantageously, the chip-carrier substrates and I/O connectors when removed from the defective packages, are likely to be damaged more or less, and the cost involved for fixing such defective chip-carrier substrates for reuse is relatively high.
- One object of the present invention is to provide an improved CF card casing structure which is free of such defects or problems as described above.
- To attain this object a CF card casing structure comprising at least a cover plate having a metal sheet surrounded by and fixed to an insert-molded frame, a counter cover plate of metal sheet and a receptacle connector is improved according to the present invention in that: the insert-molded frame has a plurality of catch slots made therein; and the counter cover plate has a corresponding plurality of serrated latch pieces integrally connected thereto, each latch piece being adapted to be inserted into a corresponding catch slot for fastening the cover plate to the counter cover plate, thereby providing an integral assembly.
- The fastening of the opposite (top and bottom) cover plates by inserting the serrated latch pieces of one of the opposite cover plates into the catch slots of the other assures that the opposite cover plates thus fastened are free of any deviation in alignment position, which would be caused for instance, in subjecting the top and bottom cover plates to the supersonic welding. Also, chip-carrier substrates and I/O connectors can be easily removed from defective packages without being damaged, leaving the cover plates free of any damages, too. Thus, such disassembled parts can be reused.
- The cover plate and/or the counter cover plate may have an adhesive tape on its inside, the adhesive tape having adhesive partly applied to its carrier material, thereby permitting a sticky area to be left for fixing the receptacle connector, I/O connector and the like to selected areas of the cover plate by removing the carrier material. Thus, such parts can be fixedly attached to either cover plate with ease.
- The opposite cover plates may be latched together to be mechanically and electrically connected, thus permitting the shielding of a chip-carrier PCB sandwiched therebetween.
- The cover plate may have an insulating film applied to its inner metal surface, and likewise, the counter cover plate may have an insulating film applied to its inner metal surface, whereby the parts of the chip-carrier PCB sandwiched between the opposite cover plates may be protected from ESD voltage.
- Other objects and advantages of the present invention will be understood from the following description of a CF card casing structure according to a preferred embodiment of the present invention, which is shown in accompanying drawings.
- FIG. 1 is a perspective view of a CF card casing structure according to the present invention in the state of being used;
- FIGS.2(a), (b) and (c) are rear, side and front views of the CF card casing structure respectively;
- FIGS.3(a) and (b) are plane views of the resin-framed metal cover plate of the CF card casing structure as seen from top and bottom sides respectively;
- FIGS.4(a), (b) and (c) are rear, front and side views of the resin-framed metal cover plate of the CF card casing structure respectively;
- FIGS.5(a), (b), (c) and (d) are sectional views taken along the
line 5 a-5 a, theline 5 b-5 b, and theline 5 c-5 c in FIG. 3, and FIG. 5(d) is an enlarged fragmental view of encircled portion “5 d” in FIG. 3; - FIG. 6 is a plane view of the resin-framed metal cover plate with an adhesive tape applied to its metal sheet;
- FIG. 7 is a plane view of the metal cover plate of the CF card casing structure;
- FIGS.8(a) and (b) are side and rear views of the metal cover plate respectively; and
- FIG. 9 is a sectional view of a fragment of a conventional CF card casing structure.
- Referring to FIGS. 1 and 2, a CF
card casing structure 1 comprises a cover plate (bottom cover) 1 a having ametal sheet 4 surrounded by and fixed to an insert-moldedframe 2 of a synthetic resin such as PPS, a counter cover plate (top cover) 3 of metal sheet such as stainless sheet and areceptacle connector 11 and asocket 10. - As seen from FIG. 3, the resin-framed
metal cover plate 1 a is like a rectangular box, and it is for instance, about 36 mm long, about 43 mm wide and about 3.3 mm thick. - As seen from FIG. 5, a
metal sheet 4 is circumferentially embedded in a surroundingresin frame 2 in inject-molding, thus providing a resin-framedmetal cover plate 1 a. - The resin-molded
frame 2 has an opening 5 made on its rear side (upper side in FIG. 3a) for accommodating thesocket 10, which a cable adapter 9 can be applied to for connecting a mobile electronic device. Also, it has another opening 6 made on its front side (lower side in FIG. 3a) for accommodating thereceptacle connector 11, which the pin-header of a CF card can be applied to. - The resin-molded
frame 2 hasguide slots 7 made on its opposite sides for insertion into an associated electric/electronic device. Also, it has afinger catch 8 projecting from its rear, lower edge for withdrawal from the associated electric/electronic device. - Referring to FIGS.3 to 6, particularly FIG. 6, the resin-molded
frame 2 hasengagement slots 12 made lengthwise in the rear, lateral side andengagement slots 13 made lengthwise in the opposite, longitudinal sides. Theseengagement slots frame 2 hasnotches 2 a made in the opposite, longitudinal sides. Thesenotches 2 a are adapted to catch the hook-like engagement projections of thetop cover 3, as later described, too. - Referring to FIG. 6, a resin framed metal plate or
bottom cover 1 a has an insulating adhesive tape orsheet 14 applied to its inside. As shown in the drawing, theadhesive sheet 14 has aflap 14 a extending from its front edge. Theadhesive sheet 14 can be removed from the back of thebottom cover 1 a along the broken lines “a” by pulling theflap 14 to leave the adhesive area delimited by the outer circumference and broken lines “a” of the adhesive sheet. Thesocket 10 and thereceptacle connector 11 are fixed to the adhesive area thus exposed. The adhesive agent-free area 14 d is defined inside the broken line “a”. - Referring to FIGS. 7 and 8, the
top metal cover 3 has serratedlatch pieces 3 a and 3 d integrally connected to and standing upright from its rear, lateral and opposite longitudinal sides, and hook-like engagement pieces - The
serrated latch pieces 3 a and 3 d are adapted to be caught by the catch slots whereas the hook-like engagement pieces notches 2 a of thebottom cover 1 a. More specifically, when thetop metal cover 3 is applied to the bottom framed-metal cover 1 a, theserrated latch pieces 3 a and 3 d are pushed in thecatch slots 13 to be caught thereby. The serration of each latch piece effectively prevents the slipping-off of thetop cover 3 from thebottom cover 1 a. When thetop metal cover 3 is applied to the bottom framed-metal cover 1 a, the hook-like engagement pieces notched recesses 2 a with theirresilient hook ends like engagement pieces bottom cover 1 a by allowing theirresilient hook ends - As seen from FIG. 7, the
top metal cover 3 has an insulatingadhesive sheet 15 applied to the whole inner surface thereof. As shown, the insulating adhesive sheet hasperforation 15 a made therein, and aflap 15 b projecting from themetal cover 3. The area of the insulatingadhesive sheet 15 which is delimited by the outer circumference and theperforation 15 a can be removed by pulling theflap 15 b to leave the adhesive area behind. The insulating adhesive sheet has no adhesive applied to its center area encircled by the broken line “b”. - In assembling the top and
bottom plates receptacle connector 11 and thesocket 10 into acard package 1, first, the insulatingadhesive sheet 14 is partly removed along the perforation line “a” from the framedmetal cover 1 a to leave the center adhesive-free area on thebottom plate 1 a (see FIG. 6), and then thereceptacle connector 11 is put on the adhesive area thus exposed, and a printed circuit substrate is putted on the center insulating area. Thesocket 10 is put on the rear side of the framedmetal cover 1 a. - Likewise, the insulating
adhesive sheet 15 is partly removed from thetop metal cover 3 along theperforation line 15 a, and then thetop metal cover 3 is applied to thebottom cover 1 a with its serrated and hook-like engagement pieces catch slots 13 andnotches 2 a. Thus, thecard package 1 is provided as shown in FIG. 1. - All parts are fixedly fastened in positions by means of latching means and by fixing the top and bottom covers in their adhesive circumferences. The chip-carrier PCB is pinched between the upper and lower insulating sheets of adhesive carrier material, and the top and bottom metal sheets are electrically connected by their hook-
like engagement pieces
Claims (4)
1. A CF card casing structure comprising at least a cover plate having a metal sheet surrounded by and fixed to an insert-molded frame, a counter cover plate of metal sheet and a receptacle connector characterized in that: the insert-molded frame has a plurality of catch slots made therein; and the counter cover plate has a corresponding plurality of serrated latch pieces integrally connected thereto, each latch piece being adapted to be inserted into a corresponding catch slot for fastening the cover plate to the counter cover plate, thereby providing an integral assembly.
2. A CF card casing structure according to claim 1 wherein the cover plate and/or the counter cover plate have an adhesive sheet on its inside, the adhesive sheet having adhesive partly applied to its carrier material, thereby permitting a sticky area to be left for fixing the receptacle connector, an I/O connector and the like by removing the carrier material.
3. A CF card casing structure according to claim 2 wherein the cover plate and the counter cover plate are latched together to be mechanically and electrically connected, thus permitting the shielding of the chip-carrier PCB sandwiched therebetween.
4. A CF card casing structure according to claim 1 , 2 or 3 wherein the cover plate has an insulating film applied to its inner metal surface, and the counter cover plate has an insulating film applied to its inner metal surface, whereby the parts of the chip-carrier PCB sandwiched between the cover plate and the counter cover plate may be protected from ESD voltage.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10220191A JP2000057297A (en) | 1998-08-04 | 1998-08-04 | Frame kit of cf card |
JP10-220191 | 1998-08-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020046877A1 true US20020046877A1 (en) | 2002-04-25 |
US6417444B1 US6417444B1 (en) | 2002-07-09 |
Family
ID=16747319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/172,004 Expired - Fee Related US6417444B1 (en) | 1998-08-04 | 1998-10-14 | CF card casing structure |
Country Status (2)
Country | Link |
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US (1) | US6417444B1 (en) |
JP (1) | JP2000057297A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060192260A1 (en) * | 2004-11-26 | 2006-08-31 | Stmicroelectronics Sa | Process for packaging micro-components using a matrix |
US20060237538A1 (en) * | 2004-04-30 | 2006-10-26 | Keitaro Ado | Card access apparatus and electronic apparatus implementing the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001243436A (en) * | 2000-02-29 | 2001-09-07 | Murata Mfg Co Ltd | Information card and its card type enclosure |
JP3850812B2 (en) * | 2003-05-23 | 2006-11-29 | 三和電気工業株式会社 | Memory card adapter |
US7633763B1 (en) * | 2004-01-28 | 2009-12-15 | Amkor Technology, Inc. | Double mold memory card and its manufacturing method |
SG121909A1 (en) * | 2004-10-13 | 2006-05-26 | Seagate Technology Llc | Compact connector for small devices |
JP2007044088A (en) * | 2005-08-05 | 2007-02-22 | Azuma Industrial Co Ltd | Handy mop |
US9367712B1 (en) | 2007-03-01 | 2016-06-14 | Amkor Technology, Inc. | High density memory card using folded flex |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0749236B2 (en) * | 1988-12-19 | 1995-05-31 | 三菱電機株式会社 | IC card |
JPH07121636B2 (en) * | 1989-09-27 | 1995-12-25 | 三菱電機株式会社 | Semiconductor device card |
US5053613A (en) * | 1990-05-29 | 1991-10-01 | Mitsubishi Denki Kabushiki Kaisha | IC card |
JPH06171276A (en) * | 1992-12-07 | 1994-06-21 | Sony Corp | Production of memory card and panel |
US5397857A (en) | 1993-07-15 | 1995-03-14 | Dual Systems | PCMCIA standard memory card frame |
JPH07160837A (en) * | 1993-12-06 | 1995-06-23 | Hitachi Ltd | Ic card |
JP3084222B2 (en) * | 1995-11-30 | 2000-09-04 | ヒロセ電機株式会社 | PC card frame kit and PC card |
JPH10166768A (en) * | 1996-12-11 | 1998-06-23 | Mitsubishi Electric Corp | Ic card |
TW359394U (en) * | 1997-07-11 | 1999-05-21 | Hon Hai Prec Ind Co Ltd | Electrinic card device |
JPH11149539A (en) * | 1997-11-17 | 1999-06-02 | Mitsubishi Electric Corp | Ic card |
-
1998
- 1998-08-04 JP JP10220191A patent/JP2000057297A/en active Pending
- 1998-10-14 US US09/172,004 patent/US6417444B1/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060237538A1 (en) * | 2004-04-30 | 2006-10-26 | Keitaro Ado | Card access apparatus and electronic apparatus implementing the same |
US8047437B2 (en) * | 2004-04-30 | 2011-11-01 | Ricoh Company, Ltd. | Card access apparatus and electronic apparatus implementing the same |
US20060192260A1 (en) * | 2004-11-26 | 2006-08-31 | Stmicroelectronics Sa | Process for packaging micro-components using a matrix |
US7897436B2 (en) * | 2004-11-26 | 2011-03-01 | Stmicroelectronics, S.A. | Process for packaging micro-components using a matrix |
Also Published As
Publication number | Publication date |
---|---|
JP2000057297A (en) | 2000-02-25 |
US6417444B1 (en) | 2002-07-09 |
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Owner name: HONDA TSUSHIN KOGYO CO, LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HIRAI, YUJI;OHTANI, YUTAKA;REEL/FRAME:009520/0508 Effective date: 19981006 |
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Effective date: 20060709 |