US20010043858A1 - Edge gripping specimen prealigner - Google Patents
Edge gripping specimen prealigner Download PDFInfo
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- US20010043858A1 US20010043858A1 US09/312,583 US31258399A US2001043858A1 US 20010043858 A1 US20010043858 A1 US 20010043858A1 US 31258399 A US31258399 A US 31258399A US 2001043858 A1 US2001043858 A1 US 2001043858A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Definitions
- This invention is directed to a specimen prealigning apparatus and method and, more particularly, to an edge gripping semiconductor wafer prealigner that substantially reduces wafer backside damage and particulate contamination.
- Integrated circuits are produced from wafers of semiconductor material.
- the wafers are typically housed in a cassette having a plurality of closely spaced slots, each of which can contain a wafer.
- the cassette is typically moved to a processing station where the wafers are removed from the cassette, placed in a predetermined orientation (prealigned), and returned to another location for further wafer processing.
- Various types of wafer handling devices are known for transporting the wafers to and from the cassette and among processing stations. Many employ a robotic arm having a spatula-shaped end that is inserted into the cassette to remove or insert a wafer. The end of the robotic arm typically employs vacuum pressure to releasably hold the wafer to the end of the arm. The robotic arm enters the cassette through the narrow gap between an adjacent pair of wafer slots and engages the backside of a wafer to retrieve it from the cassette. After the wafer has been processed, the robotic arm inserts the wafer back into the cassette.
- U.S. Pat. No. 5,513,948 for UNIVERSAL SPECIMEN PREALIGNER which is assigned to the assignee of this application
- U.S. Pat. No. 5,238,354 for SEMICONDUCTOR OBJECT PRE-ALIGNING APPARATUS describe prior semiconductor wafer prealigners that include a rotating vacuum chuck on which the wafer is placed by a robot arm for prealigning.
- An object of this invention is, therefore, to provide an apparatus and a method for prealigning semiconductor wafers.
- Another object of this invention is to provide an apparatus and a method for quickly and accurately prealigning specimens.
- a further object of this invention is to provide an apparatus and a method for prealigning wafers while minimizing particle contamination and wafer scratching.
- Specimen edge-gripping prealigners of this invention grasp a wafer by at least three edge-gripping capstans that are preferably equally spaced around the periphery of the wafer.
- Each of the edge-gripping capstans is coupled by a continuous synchronous belt to an axially centered, grooved drive hub that is rotated by a drive motor.
- Each of the capstans is also coaxially connected to a grooved drive drum that is coupled to the drive hub by one of the continuous synchronous belts, and each belt is routed in a unique location in a set of grooves in the drive drums and the drive hub.
- the continuous synchronous belts are tensioned by idler pulleys that are mounted to axially rotatable idler plates that are coupled together for common rotation by a belt tensioning motor or some other form of rotary biasing force, such as a spring, solenoid, or vacuum pressure actuated piston.
- edge-gripping capstans and the grooved drive drums are mounted to hinged bearing housings that are pivotally spring biased to preload the grooved drive drums radially away from the axially centered drive hub.
- the edge-gripping capstans can be driven radially inward to grip the wafer by rotating the belt tensioning motor to apply sufficient tension to overcome the spring preload force on the idler plates. Once gripped, the wafer can be rotated by energizing the drive motor to rotate the drive hub, which rotation is coupled through the tensioned belts and drive drums to the capstans.
- the edge-gripping specimen prealigner of this invention is suitable for prealigning semiconductor wafers. Simultaneously rotating all the edge-gripping capstans provides positive rotation of the wafer without wafer surface contact, which eliminates wafer backside damage. Synchronously driving of all the capstans prevents slippage between each capstan and the wafer and thereby results in minimized edge contamination.
- FIG. 1 is a sectional elevation view of a first embodiment of an edge-gripping specimen prealigner of this invention showing internal details of motors, belt drives, capstans, and a specimen peripheral edge scanner.
- FIG. 2 is a sectional top view taken along lines 2 - 2 of FIG. 1 showing belt driving and tensioning mechanisms coupling a drive motor to three specimen edge gripping capstans.
- FIG. 3 is a sectional elevation view taken along lines 3 - 3 of FIG. 2 showing internal details of a representative drive drum and specimen edge gripping capstan of this invention.
- FIG. 4 is an enlarged sectional view of an edge-gripping capstan gripping a wafer periphery in a manner according to this invention.
- FIG. 5 is a sectional elevation view of a second embodiment of an edge-gripping specimen prealigner of this invention showing internal details of motors, belt drives, and capstans.
- FIG. 6 is a bottom view of FIG. 5 showing belt driving and tensioning mechanisms coupling a drive motor to six specimen edge gripping capstans that are in a specimen edge-gripping position.
- FIG. 7 is a bottom view of FIG. 5 showing belt driving and tensioning mechanisms coupling a drive motor to six specimen edge gripping capstans that are in a specimen releasing position.
- FIG. 8 is an enlarged sectional elevation view showing internal details of a representative drive drum, specimen edge gripping capstan, and specimen peripheral edge scanner of this invention.
- FIGS. 1 and 2 show sectional side and bottom views of a first preferred embodiment of a specimen edge-gripping prealigner 8 (hereafter “prealigner 8 ”.)
- Prealigner 8 is composed of a frame 9 to which three edge-gripping capstans 12 are movably mounted and positioned to grasp a generally circular specimen, such as a wafer 10 (shown in phantom in FIG. 2).
- the capstans 12 are preferably spaced equally apart and located along a circle generally defined by a periphery 13 (shown in dashed lines in FIG. 2) of wafer 10 .
- Periphery 13 may include “flat” and “notch” features, which are used for orientating wafer 10 .
- Prealigner 8 may be adapted for use with any generally circular specimens.
- Edge-gripping capstans 12 are coupled by continuous synchronous belts 14 to a grooved drive hub 15 that is journaled in bearings 16 for rotation about a rotational axis 17 by a motor 18 , all of which are supported by frame 9 . Edge-gripping capstans 12 are directly coupled to grooved drive drums 20 . Each drive drum 20 is coupled to drive hub 15 by a different one of the three continuous synchronous belts 14 . Each of belts 14 is routed at a different elevation around the same set of associated grooves in its corresponding drive drum 20 and drive hub 15 . The resulting rotation of edge-gripping capstans 12 takes place about capstan axes 21 , which extend parallel to rotational axis 17 .
- Continuous synchronous belts 14 are tensioned by idler pulleys 22 that are mounted to radially extending arms of an axially rotatable idler plate 24 , which is shown in FIG. 2 rotated to a belt tensioning position 24 A (solid lines) and an alternate belt untensioned position 24 B (phantom lines).
- Idler plate 24 is rotated through a predetermined angular range about rotational axis 17 by a motor 25 or some other rotary biasing force, such as a spring and a solenoid.
- Motor 25 and idler plate 24 are journaled for rotation about bearings 26 , all of which are supported by frame 9 .
- each of grooved drive drums 20 is journaled for rotation about bearings 27 that are mounted in associated ones of hinged bearing housings 28 .
- Bearing housing 28 are journaled for pivotal movement about bearings 29 , which are supported by frame 9 .
- the pivoting of hinged bearing housings 28 allows radial displacement of capstan axis 21 relative to rotational axis 17 .
- the pivoting of hinged bearing housings 112 allows radial displacement of capstan axis 21 relative to rotational axis 17 .
- Each of hinged bearing housings 28 includes a coil spring 30 that preloads drive drum 20 away from rotational axis 17 .
- each of hinged bearing housings 28 further includes a vane 120 1 that protrudes from the end of hinged bearing housing 28 opposite pivot axis 116 1 .
- vane 120 1 is positioned to alternately interrupt (see FIG. 6 showing this position for an alternative embodiment) or not interrupt (see FIG. 7 showing this position for an alternative embodiment) a light beam within an optical sensor 122 1 . All three of optical sensors 122 1 acting together provide a positive electrical indication of whether prealigner 8 is in a wafer gripping state or a wafer releasing state.
- FIG. 4 shows an enlarged view of a representative one of edge-gripping capstans 12 , which includes a wafer-contacting pulley 31 that may be formed from various materials, and preferably polyetheretherketone “peek”), a semi-crystalline high temperature thermoplastic manufactured by Victrex in the United Kingdom.
- the material forming wafer-contacting pulley 31 may be changed to suit the working environment, such as in high temperature applications. Peek material provides a contamination resistant low scratching wafer contacting surface.
- Wafer-contacting pulley 31 includes a load/unload portion 32 ramped at a shallow angle for supporting wafer 10 when capstan 12 is in its specimen gripping and nongripping positions. Pulley 31 also includes an inwardly inclined ramp-backstop portion 34 that is pressed against the periphery 13 of wafer 10 when capstan 12 is in its specimen gripping position.
- Load/unload ramp portion 32 has a radial width 36 that allows adequate range for the wafer positioning variation of the mechanism which loads the wafer onto the prealigner.
- Load/unload ramp portion 32 is angled downwardly from the plane of wafer 10 by an angle greater than 0 degrees, and preferably 1 to 5 degrees.
- Inwardly inclined backstop portion 34 has a height 38 large enough to capture wafer 10 , preferably between about 1 mm and 2 mm and is angled upwardly from the plane of wafer 10 to secure it by about 3 degrees.
- Load/unload ramp portion 32 and backstop portion 34 together form an intersecting pair of truncated right conical sections having an included angle for gripping periphery 13 of wafer 10 .
- Prealigner 8 is in an initial state in which no wafer 10 is present and idler plate 24 is in belt untensioning position 24 B.
- a robot arm 50 grips wafer 10 by periphery 13 and positions wafer 10 at a wafer position 10 A that is separated apart from but substantially parallel to a plane passing through load/unload ramp portions 32 of edge-gripping capstans 12 .
- Robot arm 50 performs wafer 10 positioning movements in one of the approximately 120-degree clearance spaces between edge-gripping capstans 12 .
- a specimen edge-gripping robot arm suitable for use with this invention is described in copending U.S. patent application Ser. No. 09/204,747, filed Dec. 2, 1998, for ROBOT ARM WITH SPECIMEN EDGE GRIPPING END EFFECTOR, which is assigned to the assignee of this application.
- Robot arm 50 lowers wafer 10 to a wafer position 10 B such that wafer 10 is supported by the load/unload ramp portions 32 of edge-gripping capstans 12 .
- Robot arm 50 disengages from wafer 10 and moves to a wafer disengaged position (shown in dashed lines). Robot arm 50 may stay at the wafer disengaged position during subsequent wafer prealigning operations or it may be withdrawn from prealigner 8 .
- Motor 25 is actuated to rotate idler plate 24 from untensioned position 24 B to tensioned position 24 A to provide sufficient tension in belts 14 to overcome the preload force applied to grooved drive drums 20 and to draw edge-gripping capstans 12 radially inward to grip periphery 13 of wafer 10 .
- wafer 10 is rotated by energizing motor 18 to rotate drive hub 15 , which rotation is coupled through tensioned belts 14 and drive drums 20 and, therefore, to edge-gripping capstans 12 .
- edge-gripping capstans 12 are driven to prevent rotational slippage, even though wafer 10 is gripped with minimal force.
- a linear charge-coupled device (“CCD”) array 52 receives an image of a slice of periphery 13 of wafer 10 .
- Periphery 13 is illuminated through a collimating lens 53 by a light source 54 that casts a shadow of the periphery 13 on CCD array 52 .
- the “terminator” position of the shadow on individual sensors in the CCD array 52 provides a signal from CCD array 52 that accurately represents a radial distance between rotational axis 17 and periphery 13 for each of a set of rotational angles of wafer 10 .
- CCD array 52 may also sense when wafer 10 is gripped by detecting a lateral movement of periphery 13 .
- An optical rotary encoder 56 provides feedback to control the rotation of motor 25 .
- a notch (not shown) in periphery 13 serves as an angular index mark for determining in cooperation with optical rotary encoder 56 the actual rotational angles of wafer 10 since there is uncertainty of the actual effective radii of the wafer 10 and the edge-gripping capstans 12 .
- Prealigning of wafer 10 may be carried out in the manner described in the above-referenced U.S. Pat. No. 5,513,948 for UNIVERSAL SPECIMEN PREALIGNER.
- motor 18 is deactivated, motor 25 rotates idler plate 24 to belt untensioning position 24 B, and robot arm 50 retrieves wafer 10 from prealigner 8 .
- FIGS. 5, 6, and 7 show respectively a sectional side view and two bottom views of a second preferred embodiment of a specimen edge-gripping prealigner 80 (hereafter “prealigner 80 ”).
- Prealigner 80 is composed of a frame 82 to which six edge-gripping capstans 12 are movably mounted and positioned to grasp a generally circular specimen, such as wafer 10 (shown in phantom in FIGS. 6 and 7).
- the capstans are spaced apart and located along a circular plane generally defined by a periphery 13 (shown in dashed lines in FIGS. 6 and 7) of wafer 10 .
- Periphery 13 typically includes a “notch” feature for identifying a rotational index orientation for wafer 10 .
- FIGS. 6 and 7 show periphery 13 of wafer 10 respectively gripped and released by edge-gripping capstans 12 .
- Prealigner 80 may be adapted for use with generally circular specimens, such as wafer 10 having a nominal diameter ranging from about 200 mm to 300 mm, although other diameters would also be applicable.
- Edge-gripping capstans 12 are coupled by continuous synchronous belts 14 to a drive hub 84 that is journaled in bearings 86 for rotation about rotational axis 17 by a motor 88 , all of which are supported by frame 82 . Edge-gripping capstans 12 are directly coupled to drive drums 90 . Each drive drum 90 is coupled to drive hub 84 by a different one of the six continuous synchronous belts 14 . Each of belts 14 is routed at different elevations around the same set of associated grooves in its corresponding drive drum 90 and drive hub 84 . The resulting rotation of edge-gripping capstans 12 takes place about capstan axes 21 , which extend parallel to rotational axis 17 .
- Continuous synchronous belts 14 are tensioned by idler pulleys 92 that are mounted at the ends of arms that extend radially from an axially rotatable idler plate 94 , which is shown in FIG. 6 rotated to a belt tensioning position and in FIG. 7 rotated to a belt untensioned position.
- Idler plate 94 is rotated through an angular range about rotational axis 17 by a vacuum pressure actuated piston 96 acting through a coupling link 98 that is attached to the end of one of the arms of idler plate 94 .
- Idler plate 94 is journaled in bearings 100 for rotation about rotational axis 17 .
- a set of springs 102 extending between a rotationally adjustable hub 104 and the arms of idler plate 94 provide a biasing force that rotates idler plate 94 to the belt tensioning position shown in FIG. 6.
- the amount of biasing force is adjustable by rotating adjustable hub 104 . While a single spring 102 could provide the biasing force, multiple springs are preferred because they provide a more uniform and linear biasing force to idler plate 94 .
- vacuum pressure actuated piston 96 must provide sufficient force to overcome the biasing force of springs 102 .
- Drive hub 84 and drive drums 90 have unequal diameters that provide about a 3.6:1 drive ratio from drive hub 84 to drive drums 90 in a preferred embodiment.
- the rotational position of drive hub 84 is sensed by a conventional glass scale rotary encoder 106 and an associated optical sensor 108 .
- each drive drum 90 is journaled on bearings 110 that are mounted in associated ones of hinged bearing housings 112 .
- the hinged bearing housings 122 are journaled on bearings 114 for pivoting about a pivot axis 116 .
- the pivoting of hinged bearing housings 112 allows radial displacement of capstan axis 21 relative to rotational axis 17 .
- Each of hinged bearing housings 112 further includes a coil spring 118 that preloads drive drum 90 radially away from rotational axis 17 .
- each of hinged bearing housings 112 further includes a vane 120 that protrudes from the end of hinged bearing housing 112 opposite pivot axis 116 .
- vane 120 is positioned to alternately interrupt (FIG. 6) or not interrupt (FIG. 7) a light beam within an optical sensor 122 . All six of optical sensors 122 acting together provide a positive electrical indication of whether prealigner 80 is in a wafer gripping state or a wafer releasing state.
- prealigner 80 A typical operational sequence for prealigner 80 is described below with reference to FIGS. 5, 6, 7 , and 8 .
- Prealigner 80 is in an initial state in which no wafer 10 is present and idler plate 94 is in the belt untensioning position shown in FIG. 7.
- a robot arm (not shown) grips wafer 10 by periphery 13 and positions wafer 10 similar to the manner described-above for prealigner 8 .
- the robot arm lowers wafer 10 such that wafer 10 rests on load/unload ramp portions 32 of edge-gripping capstans 12 .
- the robot arm disengages from wafer 10 and moves to a wafer disengaged position.
- the robot arm may stay at the wafer disengaged position during subsequent wafer prealigning operations or it may be withdrawn from prealigner 80 .
- Vacuum pressure actuated piston 96 is deactuated to rotate idler plate 94 from the belt untensioned position shown in FIG. 7 to the belt tensioned position shown in FIG. 6, thereby drawing edge-gripping capstans 12 radially inward to grip periphery 13 of wafer 10 .
- wafer 10 is rotated by energizing motor 88 to rotate drive hub 84 , which rotation is coupled through tensioned belts 14 and drive drum 90 and, therefore, to edge-gripping capstans 12 .
- edge-gripping capstans 12 are driven to prevent rotational slippage, even though wafer 10 is gripped with minimal force.
- a linear charge-coupled device (“CCD”) array 124 receives an image of a slice of periphery 13 of wafer 10 .
- Periphery 13 is illuminated through a collimating lens 126 by a light source 128 that casts a shadow of the periphery 13 on CCD array 124 .
- the “terminator” position of the shadow on individual sensors in the CCD array 124 provides a signal from CCD array 124 that accurately represents a radial distance between rotational axis 17 and periphery 13 for each of a set of rotational angles of wafer 10 .
- CCD array 124 may also sense when wafer 10 is gripped by detecting a lateral movement of periphery 13 .
- Rotational axis 17 is substantially coaxial with the effective center of wafer 10 because of the angular spacing of edge-gripping capstans 12 around periphery 13 .
- Edge-gripping capstans 12 are arranged in two groups of three, with the groups on opposite sides of a first imaginary line 130 extending through rotational axis 17 and CCD array 124 .
- Adjacent capstans 12 in each group are angularly spaced apart from each other, with the center capstan in each group having its capstan axis 21 lying in a second imaginary line 132 that extends perpendicular to the first imaginary line 130 and through rotational axis 17 .
- the amount of angular rotation imparted by edge-gripping capstans 12 to wafer 10 is sensed by rotary encoder 106 and optical sensor 108 that is coupled to drive hub 84 .
- a notch (not shown) in periphery 13 serves as an angular index mark for determining in cooperation with rotary encoder 106 and optical sensor 108 the actual rotational angles of wafer 10 . Because the diameter of wafer 10 is a variable and wafer periphery 13 may be square, chamfered, or rounded, an angular encoding calibration is carried out as follows. Wafer 10 is rotated until CCD array 124 senses the notch. Wafer 10 is rotated one complete revolution until CCD array 124 again senses the notch.
- the distance travelled is measured by the optical sensor 108 .
- the total distance measured is divided by one revolution in the appropriate unit system to derive the appropriate relationship between the distance units of optical sensor 108 and wafer rotational units.
- a set of radius measurements made at predetermined angular intervals by CCD array 124 sensing periphery 13 of wafer 10 as described above.
- rotational prealigning of wafer 10 may be carried out in the manner described in the above-referenced U.S. Pat. No. 5,513,948.
- vacuum pressure actuated piston 96 is activated to rotate idler plate 94 to belt untensioned position shown in FIG. 7, and the robot arm retrieves wafer 10 from prealigner 80 .
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Abstract
Description
- This invention is directed to a specimen prealigning apparatus and method and, more particularly, to an edge gripping semiconductor wafer prealigner that substantially reduces wafer backside damage and particulate contamination.
- Integrated circuits are produced from wafers of semiconductor material. The wafers are typically housed in a cassette having a plurality of closely spaced slots, each of which can contain a wafer. The cassette is typically moved to a processing station where the wafers are removed from the cassette, placed in a predetermined orientation (prealigned), and returned to another location for further wafer processing.
- Various types of wafer handling devices are known for transporting the wafers to and from the cassette and among processing stations. Many employ a robotic arm having a spatula-shaped end that is inserted into the cassette to remove or insert a wafer. The end of the robotic arm typically employs vacuum pressure to releasably hold the wafer to the end of the arm. The robotic arm enters the cassette through the narrow gap between an adjacent pair of wafer slots and engages the backside of a wafer to retrieve it from the cassette. After the wafer has been processed, the robotic arm inserts the wafer back into the cassette.
- U.S. Pat. No. 5,513,948 for UNIVERSAL SPECIMEN PREALIGNER, which is assigned to the assignee of this application, and U.S. Pat. No. 5,238,354 for SEMICONDUCTOR OBJECT PRE-ALIGNING APPARATUS describe prior semiconductor wafer prealigners that include a rotating vacuum chuck on which the wafer is placed by a robot arm for prealigning.
- Unfortunately, transferring the wafer among the cassette, robot arm, and prealigner may cause backside damage thereto and contamination of the other wafers housed in the cassette because engagement with the wafer may dislodge particles that can fall and settle onto the other wafers. Robotic arms and prealigners that employ a vacuum pressure to grip the wafer can be designed to minimize particle creation. Even the few particles created with vacuum pressure gripping or any other non-edge gripping method are sufficient to contaminate adjacent wafers housed in the cassette. Reducing such contamination is particularly important to maintaining wafer processing yields. Moreover, the wafer being transferred may be scratched or abraded on its backside, resulting in wafer processing damage.
- What is needed, therefore, is a wafer gripping technique that can securely, quickly, and accurately prealign wafers while minimizing particle contamination and wafer scratching.
- An object of this invention is, therefore, to provide an apparatus and a method for prealigning semiconductor wafers.
- Another object of this invention is to provide an apparatus and a method for quickly and accurately prealigning specimens.
- A further object of this invention is to provide an apparatus and a method for prealigning wafers while minimizing particle contamination and wafer scratching.
- Specimen edge-gripping prealigners of this invention grasp a wafer by at least three edge-gripping capstans that are preferably equally spaced around the periphery of the wafer. Each of the edge-gripping capstans is coupled by a continuous synchronous belt to an axially centered, grooved drive hub that is rotated by a drive motor. Each of the capstans is also coaxially connected to a grooved drive drum that is coupled to the drive hub by one of the continuous synchronous belts, and each belt is routed in a unique location in a set of grooves in the drive drums and the drive hub. The continuous synchronous belts are tensioned by idler pulleys that are mounted to axially rotatable idler plates that are coupled together for common rotation by a belt tensioning motor or some other form of rotary biasing force, such as a spring, solenoid, or vacuum pressure actuated piston.
- The edge-gripping capstans and the grooved drive drums are mounted to hinged bearing housings that are pivotally spring biased to preload the grooved drive drums radially away from the axially centered drive hub. The edge-gripping capstans can be driven radially inward to grip the wafer by rotating the belt tensioning motor to apply sufficient tension to overcome the spring preload force on the idler plates. Once gripped, the wafer can be rotated by energizing the drive motor to rotate the drive hub, which rotation is coupled through the tensioned belts and drive drums to the capstans.
- The edge-gripping specimen prealigner of this invention is suitable for prealigning semiconductor wafers. Simultaneously rotating all the edge-gripping capstans provides positive rotation of the wafer without wafer surface contact, which eliminates wafer backside damage. Synchronously driving of all the capstans prevents slippage between each capstan and the wafer and thereby results in minimized edge contamination.
- Additional objects and advantages of this invention will be apparent from the following detailed description of preferred embodiments thereof that proceed with reference to the accompanying drawings.
- FIG. 1 is a sectional elevation view of a first embodiment of an edge-gripping specimen prealigner of this invention showing internal details of motors, belt drives, capstans, and a specimen peripheral edge scanner.
- FIG. 2 is a sectional top view taken along lines2-2 of FIG. 1 showing belt driving and tensioning mechanisms coupling a drive motor to three specimen edge gripping capstans.
- FIG. 3 is a sectional elevation view taken along lines3-3 of FIG. 2 showing internal details of a representative drive drum and specimen edge gripping capstan of this invention.
- FIG. 4 is an enlarged sectional view of an edge-gripping capstan gripping a wafer periphery in a manner according to this invention.
- FIG. 5 is a sectional elevation view of a second embodiment of an edge-gripping specimen prealigner of this invention showing internal details of motors, belt drives, and capstans.
- FIG. 6 is a bottom view of FIG. 5 showing belt driving and tensioning mechanisms coupling a drive motor to six specimen edge gripping capstans that are in a specimen edge-gripping position.
- FIG. 7 is a bottom view of FIG. 5 showing belt driving and tensioning mechanisms coupling a drive motor to six specimen edge gripping capstans that are in a specimen releasing position.
- FIG. 8 is an enlarged sectional elevation view showing internal details of a representative drive drum, specimen edge gripping capstan, and specimen peripheral edge scanner of this invention.
- FIGS. 1 and 2 show sectional side and bottom views of a first preferred embodiment of a specimen edge-gripping prealigner8 (hereafter “
prealigner 8”.) Prealigner 8 is composed of aframe 9 to which three edge-grippingcapstans 12 are movably mounted and positioned to grasp a generally circular specimen, such as a wafer 10 (shown in phantom in FIG. 2). Thecapstans 12 are preferably spaced equally apart and located along a circle generally defined by a periphery 13 (shown in dashed lines in FIG. 2) ofwafer 10. Periphery 13 may include “flat” and “notch” features, which are used fororientating wafer 10.Prealigner 8 may be adapted for use with any generally circular specimens. - Edge-gripping
capstans 12 are coupled by continuoussynchronous belts 14 to a grooveddrive hub 15 that is journaled inbearings 16 for rotation about arotational axis 17 by a motor 18, all of which are supported byframe 9. Edge-grippingcapstans 12 are directly coupled to grooveddrive drums 20. Eachdrive drum 20 is coupled to drivehub 15 by a different one of the three continuoussynchronous belts 14. Each ofbelts 14 is routed at a different elevation around the same set of associated grooves in itscorresponding drive drum 20 anddrive hub 15. The resulting rotation of edge-grippingcapstans 12 takes place aboutcapstan axes 21, which extend parallel torotational axis 17. - Continuous
synchronous belts 14 are tensioned by idler pulleys 22 that are mounted to radially extending arms of an axiallyrotatable idler plate 24, which is shown in FIG. 2 rotated to abelt tensioning position 24A (solid lines) and an alternate belt untensioned position 24B (phantom lines). Idlerplate 24 is rotated through a predetermined angular range aboutrotational axis 17 by amotor 25 or some other rotary biasing force, such as a spring and a solenoid.Motor 25 andidler plate 24 are journaled for rotation aboutbearings 26, all of which are supported byframe 9. - Referring to FIG. 3, each of
grooved drive drums 20 is journaled for rotation aboutbearings 27 that are mounted in associated ones of hinged bearinghousings 28. Bearinghousing 28 are journaled for pivotal movement aboutbearings 29, which are supported byframe 9. The pivoting of hinged bearinghousings 28 allows radial displacement ofcapstan axis 21 relative torotational axis 17. The pivoting of hinged bearinghousings 112 allows radial displacement ofcapstan axis 21 relative torotational axis 17. Each of hinged bearinghousings 28 includes acoil spring 30 that preloads drivedrum 20 away fromrotational axis 17. To ensure proper movement of edge-grippingcapstans 12, each of hinged bearinghousings 28 further includes avane 120 1 that protrudes from the end of hinged bearinghousing 28opposite pivot axis 116 1. Depending on the rotational state of hinged bearinghousing 112,vane 120 1 is positioned to alternately interrupt (see FIG. 6 showing this position for an alternative embodiment) or not interrupt (see FIG. 7 showing this position for an alternative embodiment) a light beam within anoptical sensor 122 1. All three ofoptical sensors 122 1 acting together provide a positive electrical indication of whetherprealigner 8 is in a wafer gripping state or a wafer releasing state. - FIG. 4 shows an enlarged view of a representative one of edge-gripping
capstans 12, which includes a wafer-contactingpulley 31 that may be formed from various materials, and preferably polyetheretherketone “peek”), a semi-crystalline high temperature thermoplastic manufactured by Victrex in the United Kingdom. The material forming wafer-contactingpulley 31 may be changed to suit the working environment, such as in high temperature applications. Peek material provides a contamination resistant low scratching wafer contacting surface. - Wafer-contacting
pulley 31 includes a load/unloadportion 32 ramped at a shallow angle for supportingwafer 10 whencapstan 12 is in its specimen gripping and nongripping positions.Pulley 31 also includes an inwardly inclined ramp-backstop portion 34 that is pressed against theperiphery 13 ofwafer 10 whencapstan 12 is in its specimen gripping position. - Load/unload
ramp portion 32 has aradial width 36 that allows adequate range for the wafer positioning variation of the mechanism which loads the wafer onto the prealigner. Load/unloadramp portion 32 is angled downwardly from the plane ofwafer 10 by an angle greater than 0 degrees, and preferably 1 to 5 degrees. - Inwardly inclined
backstop portion 34 has aheight 38 large enough to capturewafer 10, preferably between about 1 mm and 2 mm and is angled upwardly from the plane ofwafer 10 to secure it by about 3 degrees. - Load/unload
ramp portion 32 andbackstop portion 34 together form an intersecting pair of truncated right conical sections having an included angle for grippingperiphery 13 ofwafer 10. - When edge-gripping
capstans 12 are actuated to press againstperiphery 13 ofwafer 10, the intersecting inclined conical surfaces formed by load/unloadramp portion 32 and inwardlyinclined backstop portion 34 positively grip and maintainwafer 10 in a preferable horizontal attitude, although other attitudes are possible. When edge-grippingcapstans 12 are released from grippingwafer 10, load/unloadramp portion 32 supports theperiphery 13 ofwafer 10. - A typical operational sequence for
prealigner 8 is described below with reference to FIGS. 1 and 2. -
Prealigner 8 is in an initial state in which nowafer 10 is present andidler plate 24 is in belt untensioning position 24B. - A robot arm50 (fragmentary view shown in FIG. 1) grips
wafer 10 byperiphery 13 andpositions wafer 10 at awafer position 10A that is separated apart from but substantially parallel to a plane passing through load/unloadramp portions 32 of edge-grippingcapstans 12. Robot arm 50 performswafer 10 positioning movements in one of the approximately 120-degree clearance spaces between edge-grippingcapstans 12. A specimen edge-gripping robot arm suitable for use with this invention is described in copending U.S. patent application Ser. No. 09/204,747, filed Dec. 2, 1998, for ROBOT ARM WITH SPECIMEN EDGE GRIPPING END EFFECTOR, which is assigned to the assignee of this application. - Robot arm50 lowers
wafer 10 to a wafer position 10B such thatwafer 10 is supported by the load/unloadramp portions 32 of edge-grippingcapstans 12. - Robot arm50 disengages from
wafer 10 and moves to a wafer disengaged position (shown in dashed lines). Robot arm 50 may stay at the wafer disengaged position during subsequent wafer prealigning operations or it may be withdrawn fromprealigner 8. -
Motor 25 is actuated to rotateidler plate 24 from untensioned position 24B to tensionedposition 24A to provide sufficient tension inbelts 14 to overcome the preload force applied to grooved drive drums 20 and to draw edge-grippingcapstans 12 radially inward to gripperiphery 13 ofwafer 10. - Once gripped,
wafer 10 is rotated by energizing motor 18 to rotatedrive hub 15, which rotation is coupled through tensionedbelts 14 and drivedrums 20 and, therefore, to edge-grippingcapstans 12. Preferably all of edge-grippingcapstans 12 are driven to prevent rotational slippage, even thoughwafer 10 is gripped with minimal force. - During rotation of
wafer 10, a linear charge-coupled device (“CCD”) array 52 receives an image of a slice ofperiphery 13 ofwafer 10.Periphery 13 is illuminated through a collimating lens 53 by a light source 54 that casts a shadow of theperiphery 13 on CCD array 52. The “terminator” position of the shadow on individual sensors in the CCD array 52 provides a signal from CCD array 52 that accurately represents a radial distance betweenrotational axis 17 andperiphery 13 for each of a set of rotational angles ofwafer 10. CCD array 52 may also sense whenwafer 10 is gripped by detecting a lateral movement ofperiphery 13. - An optical rotary encoder56 provides feedback to control the rotation of
motor 25. A notch (not shown) inperiphery 13 serves as an angular index mark for determining in cooperation with optical rotary encoder 56 the actual rotational angles ofwafer 10 since there is uncertainty of the actual effective radii of thewafer 10 and the edge-grippingcapstans 12. - Prealigning of
wafer 10 may be carried out in the manner described in the above-referenced U.S. Pat. No. 5,513,948 for UNIVERSAL SPECIMEN PREALIGNER. - After
wafer 10 is prealigned, motor 18 is deactivated,motor 25 rotatesidler plate 24 to belt untensioning position 24B, and robot arm 50retrieves wafer 10 fromprealigner 8. - FIGS. 5, 6, and7 show respectively a sectional side view and two bottom views of a second preferred embodiment of a specimen edge-gripping prealigner 80 (hereafter “
prealigner 80”).Prealigner 80 is composed of aframe 82 to which six edge-grippingcapstans 12 are movably mounted and positioned to grasp a generally circular specimen, such as wafer 10 (shown in phantom in FIGS. 6 and 7). The capstans are spaced apart and located along a circular plane generally defined by a periphery 13 (shown in dashed lines in FIGS. 6 and 7) ofwafer 10.Periphery 13 typically includes a “notch” feature for identifying a rotational index orientation forwafer 10. FIGS. 6 and 7show periphery 13 ofwafer 10 respectively gripped and released by edge-grippingcapstans 12. - Prealigner80 may be adapted for use with generally circular specimens, such as
wafer 10 having a nominal diameter ranging from about 200 mm to 300 mm, although other diameters would also be applicable. - Edge-gripping
capstans 12 are coupled by continuoussynchronous belts 14 to adrive hub 84 that is journaled in bearings 86 for rotation aboutrotational axis 17 by amotor 88, all of which are supported byframe 82. Edge-grippingcapstans 12 are directly coupled to drive drums 90. Eachdrive drum 90 is coupled to drivehub 84 by a different one of the six continuoussynchronous belts 14. Each ofbelts 14 is routed at different elevations around the same set of associated grooves in itscorresponding drive drum 90 and drivehub 84. The resulting rotation of edge-grippingcapstans 12 takes place about capstan axes 21, which extend parallel torotational axis 17. - Continuous
synchronous belts 14 are tensioned byidler pulleys 92 that are mounted at the ends of arms that extend radially from an axiallyrotatable idler plate 94, which is shown in FIG. 6 rotated to a belt tensioning position and in FIG. 7 rotated to a belt untensioned position.Idler plate 94 is rotated through an angular range aboutrotational axis 17 by a vacuum pressure actuatedpiston 96 acting through acoupling link 98 that is attached to the end of one of the arms ofidler plate 94.Idler plate 94 is journaled in bearings 100 for rotation aboutrotational axis 17. - When vacuum pressure actuated
piston 96 receives no vacuum pressure and/orprealigner 80 is deenergized, a set ofsprings 102 extending between a rotationallyadjustable hub 104 and the arms ofidler plate 94 provide a biasing force that rotatesidler plate 94 to the belt tensioning position shown in FIG. 6. This is advantageous becauseprealigner 80 will remain in a wafer gripping state in the event of a power or vacuum pressure failure. The amount of biasing force is adjustable by rotatingadjustable hub 104. While asingle spring 102 could provide the biasing force, multiple springs are preferred because they provide a more uniform and linear biasing force toidler plate 94. Of course, when movingidler plate 94 to the belt relaxing position shown in FIG. 7, vacuum pressure actuatedpiston 96 must provide sufficient force to overcome the biasing force ofsprings 102. -
Drive hub 84 and drivedrums 90 have unequal diameters that provide about a 3.6:1 drive ratio fromdrive hub 84 to drivedrums 90 in a preferred embodiment. The rotational position ofdrive hub 84 is sensed by a conventional glassscale rotary encoder 106 and an associatedoptical sensor 108. - Referring also to FIG. 8, each
drive drum 90 is journaled on bearings 110 that are mounted in associated ones of hingedbearing housings 112. The hingedbearing housings 122 are journaled on bearings 114 for pivoting about apivot axis 116. The pivoting of hingedbearing housings 112 allows radial displacement ofcapstan axis 21 relative torotational axis 17. Each of hingedbearing housings 112 further includes acoil spring 118 that preloadsdrive drum 90 radially away fromrotational axis 17. - The preloading force provided by
springs 118 is sufficient to move edge-grippingcapstans 12 radially away fromrotational axis 17 whenbelts 14 are in the untensioned state, but the preloading force is insufficient whenbelts 14 are in the tensioned state. Accordingly, edge-grippingcapstans 12 alternate between wafer gripping and wafer releasing positions in response to actuation of vacuum pressure actuatedpiston 96. To ensure proper movement of edge-grippingcapstans 12, each of hingedbearing housings 112 further includes avane 120 that protrudes from the end of hinged bearinghousing 112opposite pivot axis 116. Depending on the rotational state of hinged bearinghousing 112,vane 120 is positioned to alternately interrupt (FIG. 6) or not interrupt (FIG. 7) a light beam within anoptical sensor 122. All six ofoptical sensors 122 acting together provide a positive electrical indication of whetherprealigner 80 is in a wafer gripping state or a wafer releasing state. - A typical operational sequence for
prealigner 80 is described below with reference to FIGS. 5, 6, 7, and 8. -
Prealigner 80 is in an initial state in which nowafer 10 is present andidler plate 94 is in the belt untensioning position shown in FIG. 7. - A robot arm (not shown) grips
wafer 10 byperiphery 13 andpositions wafer 10 similar to the manner described-above forprealigner 8. - The robot arm lowers
wafer 10 such thatwafer 10 rests on load/unloadramp portions 32 of edge-grippingcapstans 12. - The robot arm disengages from
wafer 10 and moves to a wafer disengaged position. The robot arm may stay at the wafer disengaged position during subsequent wafer prealigning operations or it may be withdrawn fromprealigner 80. - Vacuum pressure actuated
piston 96 is deactuated to rotateidler plate 94 from the belt untensioned position shown in FIG. 7 to the belt tensioned position shown in FIG. 6, thereby drawing edge-grippingcapstans 12 radially inward to gripperiphery 13 ofwafer 10. - Once gripped,
wafer 10 is rotated by energizingmotor 88 to rotatedrive hub 84, which rotation is coupled through tensionedbelts 14 and drivedrum 90 and, therefore, to edge-grippingcapstans 12. Preferably all of edge-grippingcapstans 12 are driven to prevent rotational slippage, even thoughwafer 10 is gripped with minimal force. - During rotation of
wafer 10, a linear charge-coupled device (“CCD”)array 124 receives an image of a slice ofperiphery 13 ofwafer 10.Periphery 13 is illuminated through acollimating lens 126 by alight source 128 that casts a shadow of theperiphery 13 onCCD array 124. The “terminator” position of the shadow on individual sensors in theCCD array 124 provides a signal fromCCD array 124 that accurately represents a radial distance betweenrotational axis 17 andperiphery 13 for each of a set of rotational angles ofwafer 10.CCD array 124 may also sense whenwafer 10 is gripped by detecting a lateral movement ofperiphery 13. -
Rotational axis 17 is substantially coaxial with the effective center ofwafer 10 because of the angular spacing of edge-grippingcapstans 12 aroundperiphery 13. Edge-grippingcapstans 12 are arranged in two groups of three, with the groups on opposite sides of a firstimaginary line 130 extending throughrotational axis 17 andCCD array 124.Adjacent capstans 12 in each group are angularly spaced apart from each other, with the center capstan in each group having itscapstan axis 21 lying in a secondimaginary line 132 that extends perpendicular to the firstimaginary line 130 and throughrotational axis 17. - The amount of angular rotation imparted by edge-gripping
capstans 12 towafer 10 is sensed byrotary encoder 106 andoptical sensor 108 that is coupled to drivehub 84. A notch (not shown) inperiphery 13 serves as an angular index mark for determining in cooperation withrotary encoder 106 andoptical sensor 108 the actual rotational angles ofwafer 10. Because the diameter ofwafer 10 is a variable andwafer periphery 13 may be square, chamfered, or rounded, an angular encoding calibration is carried out as follows.Wafer 10 is rotated untilCCD array 124 senses the notch.Wafer 10 is rotated one complete revolution untilCCD array 124 again senses the notch. During one complete notch-to-notch revolution ofwafer 10, the distance travelled is measured by theoptical sensor 108. The total distance measured is divided by one revolution in the appropriate unit system to derive the appropriate relationship between the distance units ofoptical sensor 108 and wafer rotational units. During a subsequent notch-to-notch rotation ofwafer 10, a set of radius measurements made at predetermined angular intervals byCCD array 124sensing periphery 13 ofwafer 10 as described above. - Thereafter, rotational prealigning of
wafer 10 may be carried out in the manner described in the above-referenced U.S. Pat. No. 5,513,948. - After
wafer 10 is prealigned, vacuum pressure actuatedpiston 96 is activated to rotateidler plate 94 to belt untensioned position shown in FIG. 7, and the robot arm retrieveswafer 10 fromprealigner 80. - Skilled workers will recognize that portions of this invention may be implemented differently from the implementations described above for preferred embodiments. For example, different drive hub to capstan ratios may be employed. Three and six capstan embodiments are shown, but many embodiments with more than three capstans are envisioned can be implemented. Also, the capstans necessarily require neither equal angular spacing around the specimen nor the spacings shown and described in the above-described embodiments.
- It will be obvious to those having skill in the art that many changes may be made to the details of the above-described embodiments of this invention without departing from the underlying principles thereof. Accordingly, it will be appreciated that this invention is also applicable to specimen handling applications other than those found in semiconductor wafer processing. The scope of the present invention should, therefore, be determined only by the following claims.
Claims (20)
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US09/312,583 US6357996B2 (en) | 1999-05-14 | 1999-05-14 | Edge gripping specimen prealigner |
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US09/312,583 US6357996B2 (en) | 1999-05-14 | 1999-05-14 | Edge gripping specimen prealigner |
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US20010043858A1 true US20010043858A1 (en) | 2001-11-22 |
US6357996B2 US6357996B2 (en) | 2002-03-19 |
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