US20010001301A1 - Chemical mechanical polishing conditioner - Google Patents
Chemical mechanical polishing conditioner Download PDFInfo
- Publication number
- US20010001301A1 US20010001301A1 US09/746,710 US74671000A US2001001301A1 US 20010001301 A1 US20010001301 A1 US 20010001301A1 US 74671000 A US74671000 A US 74671000A US 2001001301 A1 US2001001301 A1 US 2001001301A1
- Authority
- US
- United States
- Prior art keywords
- disk
- conditioning
- conditioner head
- polishing pad
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 106
- 239000000126 substance Substances 0.000 title description 6
- 230000003750 conditioning effect Effects 0.000 claims abstract description 85
- 230000008878 coupling Effects 0.000 claims abstract description 5
- 238000010168 coupling process Methods 0.000 claims abstract description 5
- 238000005859 coupling reaction Methods 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 230000007935 neutral effect Effects 0.000 claims description 6
- 239000000356 contaminant Substances 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 31
- 239000012636 effector Substances 0.000 description 28
- 239000002002 slurry Substances 0.000 description 11
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000619 316 stainless steel Inorganic materials 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000755 6061-T6 aluminium alloy Inorganic materials 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Definitions
- This invention relates generally to the planarization of semiconductor substrates and, more particularly to the conditioning of polishing pads in slurry-type polishers.
- Integrated circuits are typically formed on substrates, particularly silicon wafers, by the sequential deposition of conductive, semiconductive or insulative layers. After each layer is deposited, the layer is etched to create circuitry features. As a series of layers are sequentially deposited and etched, the outer or uppermost surface of the substrate, i.e., the exposed surface of the substrate, becomes successively less planar. This non-planar outer surface presents a problem for the integrated circuit manufacturer as a non-planar surface can prevent proper focusing of the photolithography apparatus. Therefore, there is a need to periodically planarize the substrate surface to provide a planar surface. Planarization, in effect, polishes away a non-planar, outer surface, whether a conductive, semiconductive, or insulative layer, to form a relatively flat, smooth surface.
- Chemical mechanical polishing is one accepted method of planarization. This planarization method typically requires that the substrate be mounted on a carrier or polishing head, with the surface of the substrate to be polished exposed. The substrate is then placed against a rotating polishing pad. The carrier head may also rotate and/or oscillate to provide additional motion between the substrate and polishing surface. Further, a polishing slurry, including an abrasive and at least one chemically-reactive agent, may be spread on the polishing pad to provide an abrasive chemical solution at the interface between the pad and substrate.
- a polishing slurry including an abrasive and at least one chemically-reactive agent
- polishing rate sets the time needed to polish a layer. Thus, it sets the maximum throughput of the polishing apparatus.
- the glazing phenomenon is a complex combination of contamination, thermal, chemical and mechanical damage to the pad material.
- the pad When the polisher is in operation, the pad is subject to compression, shear and friction producing heat and wear. Slurry and abraded material from the wafer and pad are pressed into the pores of the pad material and the material itself becomes matted and even partially fused. These effects reduce the pad's roughness and its ability to apply fresh slurry to the substrate.
- a number of conditioning procedures and apparatus have been developed. Common are mechanical methods wherein an abrasive material is placed in contact with the moving polishing pad. For example, a diamond coated screen or bar may be used which scrapes and abrades the pad surface, and both removes the contaminated slurry trapped in the pad pores and expands and re-roughens the pad.
- the invention is directed to a conditioner head for conditioning the polishing surface of a polishing pad.
- the head includes a drive element carried for rotation about a longitudinal axis.
- the head further includes a disk backing element for carrying an abrasive disk and holding the lower surface of the disk in engagement with the polishing pad.
- a driven element couples the disk backing element to the drive element and transmits torque and rotation therebetween.
- the driven element is longitudinally movable between retracted and extended positions.
- An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and the driven element so as to rotate therewith as a unit.
- Implementations of the invention may include one or more of the following.
- the diaphragm may in part bound a pressure chamber which may be pressurized to shift the driven element from the retracted position to the extended position and depressurized to shift the driven element from the extended position to the retracted position.
- a first surface of the diaphragm, exterior to the pressure chamber, rolls of a generally annular outer surface portion of the driven element traverses the gap and rolls onto a generally annular inner surface portion of the drive element.
- the drive element may include a drive shaft and a collar substantially fixed to the drive shaft and having a generally annular inner surface portion.
- the driven element may include a drive sleeve encircling at least a length of the drive shaft and having a generally annular outer surface portion.
- the annular diaphragm may extend between an outer periphery and an inner aperture and may be sealingly secured along the outer periphery to the collar and along the inner aperture to the drive sleeve.
- the generally annular outer surface portion of the drive sleeve may be a circular cylinder and the generally annular inner surface portion of the collar may be a circular cylinder.
- the diaphragm may in part bound a pressure chamber.
- the pressure chamber may be pressurized to shift the drive sleeve from the retracted position to the extended position and depressurized to shift the drive sleeve from the extended position to the retracted position.
- a first surface of the diaphragm, exterior to the pressure chamber may roll off the generally annular outer surface portion of the drive sleeve.
- the first surface of the diaphragm may then traverse a gap between the generally annular outer surface portion of the drive sleeve and the generally annular inner surface portion of the collar and roll onto the generally annular inner surface portion of the collar.
- a fluid for inflating the pressure chamber may be introduced to the pressure chamber through a channel in the drive shaft.
- the head may include a housing substantially rigidly coupled to a conditioner arm for moving the head at least transverse to the longitudinal axis.
- the housing may include a first portion encircling at least the length of the collar, which first portion is coupled to the collar by a bearing system for permitting the collar to rotate relative to the first portion about the longitudinal axis.
- a web may be formed at the upper end of the drive shaft, the collar depending from the web.
- a pulley may be substantially fixed to the web for transmitting torque to the drive shaft.
- the collar may comprise a first piece depending from and fixed to the web and a second piece, separately formed from the first piece. The second piece may engage the bearing system and the diaphragm may be secured along the outer periphery to the collar between the first and second pieces.
- the diaphragm may be partially sandwiched between an outer cylindrical surface of an annular lip depending from the first piece and a generally annular inner surface of the second piece which forms the generally annular inner surface portion of the collar.
- the invention is directed to a disk holder for holding a conditioning disk for conditioning a polishing pad.
- the disk holding element has a lower face for engaging an upper surface of the conditioning disk.
- the disk holding element defines a plurality of generally radially outward extending channels along the upper surface of the conditioning disk.
- Implementations of the invention may include one or more of the following.
- the disk may comprise a central region, an outer perimeter, a plurality of radially extending spokes, and a plurality of webs.
- the spokes may extend from the central region to the outer perimeter, each spoke having a lower surface for engaging the upper surface of the conditioning disk.
- the webs one such web between each adjacent pair of spokes, may each have a lower surface at least partially vertically recessed from the lower surfaces of the adjacent spokes so as to define one channel.
- Each web may extend from the central region and terminate at an outboard edge, radially recessed from the outer perimeter.
- the outer perimeter may be formed as a rim having a plurality of radially extending passageways.
- Each passageway may be generally aligned with an associated channel for permitting flow radially outward through the passageway from the associated channel when the disk holding element and disk are rotated about a central longitudinal axis while at least a lower surface of the disk is exposed to a liquid.
- Each of the radially extending passageways may be formed as a downwardly extending recess in the rim.
- the conditioning disk may be readily securable to and removable from the disk holding element.
- Each spoke may carry a magnet for attracting the conditioning disk.
- the conditioning disk may be readily securable to and removable from the disk holder element and the disk holder element may be readily securable to and removable from a rotating fixture.
- Each spoke may carry a magnet for securing the conditioning disk to the disk holder element and for securing the disk holder element to the rotating fixture.
- a first pin may depend from a first spoke and a second pin may depend from a second spoke, the first and second pins receivable by the conditioning disk for preventing rotation of the conditioning disk relative to the disk holder element.
- the central region, outer perimeter, plurality of radially extending spokes, and plurality of webs may be unitarily formed as a single piece of material.
- Each spoke may have a relatively narrow section extending outward from the central region and joining a relatively wider section adjacent the outer perimeter.
- Each web may have an upper surface substantially coplanar with the upper surfaces of adjacent spokes.
- the invention is directed to a disk holder element for holding a conditioning disk used in association with a conditioner head of an apparatus for conditioning the polishing surface of a polishing pad.
- the disk holder element includes a lower surface magnetically engageable with an upper surface of the disk and an upper surface magnetically engageable with a lower surface of the head.
- the disk holder element may comprise a plurality of magnets securing the disk to the disk holder element and securing the disk holder element to the conditioner head.
- the invention is directed to a conditioner head for conditioning the polishing surface of the polishing pad.
- the head includes a generally circular abrasive disk having upper and lower surfaces. The lower surface defining a disk plane.
- a drive element is carried for rotation about a longitudinal axis.
- a disk backing element carries the disk and holds the lower surface of the disk in engagement with the polishing pad and applies force and torque to the disk.
- the disk backing element has an upper member, fixed to the drive element, which upper member has a central downward facing socket having a spherical surface portion.
- the disk backing element further includes a lower member, fixed to the abrasive disk, which lower membrane has a central upward facing projection with a spherical surface portion in sliding engagement with the spherical surface portion of the socket.
- the disk backing element further includes at least one resilient member, coupling the upper member to the lower member so as to bias the lower member toward a neutral orientation. In the neutral orientation the disk plane is perpendicular to longitudinal axis.
- the resilient member permits tilting of the disk plane relative to the longitudinal axis and permits transmission of torque and rotation from the drive element to the disk.
- the upper member may comprises a central hub.
- the at least one resilient member may comprise a plurality of radially extending spokes extending radially outward from the central hub.
- Each spoke may be upwardly and downwardly flexible for permitting tilting of the disk plane relative to the longitudinal axis while transmitting rotation from the drive element to the rim.
- the spherical surface portions of the socket and projection may have a common center lying substantially within the disk plane.
- the invention is directed to a conditioner head for conditioning the polishing surface of a polishing pad using an abrasive conditioning disk.
- the conditioner includes a drive element carried for rotation about a longitudinal axis and a disk backing element for holding and applying torque to the abrasive conditioning disk.
- the disk backing element includes a central hub fixed to the drive element, an outer rim generally defining a rim plane, and a plurality of radially extending spokes.
- the spokes extend from the central hub to the outer rim.
- Each spoke is upwardly and downwardly flexible for permitting tilting of the rim plane relative to the longitudinal axis while transmitting rotation from the drive element to the rim.
- Each spoke may have a transversely extending wave for increasing the flexibility of the spoke.
- the spokes may be formed of steel.
- the head may further comprise a plate having a central upward facing projection having a spherical surface portion.
- the hub may have a central downward facing socket having a spherical surface portion in sliding engagement with the spherical surface portion of the projection.
- the invention is directed to a process for conditioning a polishing pad.
- the process includes providing an abrasive conditioning disk carried by a disk carrier and having a lower surface engageable with a polishing surface of the polishing pad.
- the carrier is caused to rotate the conditioning disk and bring the lower surface of the conditioning disk into engagement with the polishing surface of the polishing pad.
- the carrier is caused to reciprocate in the path along the rotating polishing pad.
- a carrier is caused to disengage the conditioning disk form the polishing pad.
- the carrier is caused to rotate the conditioning disk and introduce the conditioning disk to a body of cleaning liquid so as to cause a flow of the cleaning liquid longitudinally upward from the lower surface of the conditioning disk, through the conditioning disk, and radially outward along an upper surface of the conditioning disk so as to clean the conditioning disk.
- Implementations of the inventive process may include on or more of the following.
- a second liquid may be applied to the polishing surface of the polishing pad.
- the second liquid may be permitted to flow up through the lower surface of the conditioning disk, through the conditioning disk, and radially outward along the upper surface of the conditioning disk when the conditioning disk is engaged with the polishing surface of the polishing pad.
- the flow of the cleaning liquid along the upper surface of the conditioning disk may be through a plurality of generally radially outwardly extending channels defined by a disk holder.
- the diaphragm may be fixed at its inner aperture and outer periphery to the associated elements, it need not be in sliding engagement with those elements either during rotation or in translation of the end effector between retracted and extended positions. This lack of sliding engagement reduces wear and the associated particle generation between slidingly engaged surfaces and prevents contaminants from entering the pressure chamber between slidingly engaged surfaces.
- the end effector featuring a spoked flexure and spherical socket and projection joint.
- the joint permits the application of downward force from the head to the conditioning disk to maintain compression between the conditioning disk and polishing pad surface.
- the flexure transmits torque and rotation to the disk while permitting the disk plane to tilt relative to the axis of rotation allowing the disk to remain flat against the polishing pad during conditioning.
- the flexure may bias the disk into a neutral orientation with the disk plane substantially perpendicular to the axis of rotation.
- a disk holding element which defines a plurality of channels along the upper surface of the disk so that during conditioning of the pad or during rinsing of the disk, there is a flow of either slurry or cleaning fluid upward through the bottom surface of the disk, through the disk, and radially outward along the upper surface of the disk through the channels.
- the channels facilitate more efficient conditioning and cleaning of the disk.
- a further advantage is provided by a disk holding element which is made readily removable from the backing element and from the disk.
- the holding element may first be secured to the disk and then the combined holding element and disk may be secured to the backing element. Alignment features on the disk holding element facilitate the precise registration of the disk and holder relative to the backing element without undue effort.
- a fresh disk can be secured to a second disk holding element.
- the first disk and first holder may be removed from the head, and replaced with a second disk and second holding element and the conditioner restarted. The first disk may then be separated from the first disk holding element and the first disk holding element secured to a new disk to await subsequent use.
- FIG. 1A is a perspective view of a polishing apparatus.
- FIG. 1B is a partially exploded view of the polishing apparatus of FIG. 1.
- FIGS. 2A and 2B are diagrammatic top views of a substrate being polished and a polishing pad being conditioned by the polishing apparatus of FIG. 1.
- FIG. 3A is a diagrammatic cross-sectional view of a conditioner head with an end effector in a retracted position.
- FIG. 3B is a diagrammatic cross-sectional view of a conditioner head with an end effector in an extended position.
- FIG. 4 is a diagrammatic cross-sectional view of the end effector of the conditioner head of FIGS. 3A and 3B.
- FIG. 5 is a top view of a flexure of the end effector of FIG. 4.
- FIG. 6 is a top view of a backing plate of the end effector of FIG. 4.
- FIG. 7A is a top perspective view of a disk holding member of the end effector of FIG. 4.
- FIG. 7B is a top view of the disk holding member of FIG. 7A.
- FIG. 7C is a bottom view of a disk holding member of FIG. 7A.
- FIG. 8 is a side view of the disk holding member along line 8 - 8 of FIG. 7C.
- FIG. 9 is a perspective view of a conditioning disk of FIG. 4.
- FIG. 10 is a diagrammatic cross-sectional view of a conditioner head with an end effector tilted to engage a polishing pad.
- FIG. 11 is a diagrammatic cross-sectional view of a conditioner head with an end effector immersed in a cup of cleaning liquid.
- a polishing apparatus 10 includes a housing 12 that contains three independently-operated polishing stations 14 , a substrate transfer station 16 , and a rotatable carousel 18 which choreographs the operation of four independently rotatable carrier heads 20 .
- a substrate loading apparatus 22 Attached to one side of the housing 12 is a substrate loading apparatus 22 that includes a tub 24 that contains a liquid bath 26 in which cassettes 28 containing substrates 30 are immersed.
- An arm 32 rides along a linear track 34 and supports a wrist assembly 36 , which includes a cassette claw 38 for moving cassettes 28 from a holding station 39 into the tub 24 and a substrate blade 40 for transferring substrates from the tub 24 to the transfer station 16 .
- the carousel 18 has a support plate 42 with slots 44 through which shafts 46 of the carrier heads 20 extend.
- the carrier heads 20 can independently rotate and oscillate back-and-forth in the slots 44 to achieve a uniformly polished substrate surface.
- the carrier heads 20 are rotated by respective motors 48 , which are normally hidden behind removable sidewalls 50 of the carousel 18 .
- a substrate is loaded from the tub 24 to the transfer station 16 , from which the substrate is transferred to a carrier head 20 .
- the carousel 18 then transfers the substrate through a series of one or more polishing stations 14 and finally returns the polished substrate to the transfer station 16 .
- Each polishing station 14 includes a rotatable platen 52 , which supports a polishing pad 54 , and a pad conditioner 56 .
- the platen 52 and conditioner 56 are both mounted to a table top 57 inside the polishing apparatus 10 .
- Each pad conditioner 56 includes a conditioner head 60 , an arm 62 , and a base 64 .
- the arm 62 has a distal end coupled to the conditioner head 60 and a proximal end coupled to the base 64 , which sweeps the conditioner head 60 across the polishing pad surface 76 to condition the surface 76 by abrading the surface to remove contaminants and retexturize the surface.
- Each polishing station 14 also includes a cup 66 , which contains a cleaning liquid for rinsing or cleaning the conditioner head 60 .
- a polishing pad 54 is conditioned by a pad conditioner 56 while the polishing pad polishes a substrate which is mounted on a carrier head 20 .
- the conditioner head 60 sweeps across the polishing pad 54 with a reciprocal motion that is synchronized with the motion of the carrier head 20 across the polishing pad 54 .
- a carrier head 20 with a substrate to be polished may be positioned in the center of the polishing pad 54 and conditioner head 60 may be immersed in the cleaning liquid contained within the cup 66 .
- the cup 66 may pivot out of the way as shown by arrow 69 , and the conditioner head 60 and the carrier head 20 carrying a substrate may be swept back-and-forth across the polishing pad 54 as shown by arrows 70 and 72 , respectively.
- Three water jets 74 may direct streams of water toward the polishing pad 54 to rinse slurry from the polishing or upper pad surface 76 .
- polishing apparatus 10 For further details regarding the general features and operation of polishing apparatus 10 , please refer to co-pending application Ser. No. 08/549,336, filed, Oct. 27, 1995, by Perlov et al., entitled “Continuous Processing System for Chemical Mechanical Polishing,” and assigned to the assignee of the present invention, which is hereby incorporated by reference.
- a conditioner head 60 includes an actuation and drive mechanism 78 which rotates an end effector 80 carrying a diamond impregnated conditioning disk 82 (see also FIG. 9) about a central vertically-oriented longitudinal axis 300 of the head.
- the actuation and drive mechanism further provides for the movement of the end effector 80 and disk 82 between an elevated retracted position (FIG. 3A) and a lowered extended position (FIG. 3B). In substantially the extended position, the lower surface 84 of the disk 82 may be brought into engagement with the polishing surface 76 of the pad 54 .
- the end effector may be introduced to the cup 66 (FIG. 2B) for cleaning the disk or the disk may be replaced, both of which are described in further detail below.
- the actuation and drive mechanism 78 includes a vertically-extending drive shaft 86 which, at its upper end, includes a unitarily-formed, radially-extending web 88 .
- the drive shaft may be formed of heat treated 440C stainless steel.
- a pulley 90 is secured to the web and carries a belt 92 which extends along the length of the arm 62 and is coupled to a remote motor (not shown) for rotating the shaft 86 about the longitudinal axis 300 .
- a rotary union 94 is secured to the upper end of the shaft for introducing and withdrawing air from an actuation chamber via a longitudinal channel 96 in the shaft.
- a collar having upper and lower pieces 98 and 100 , respectively, coaxially encompasses the shaft, defining a generally annular space 102 therebetween.
- the upper collar piece 98 is fired to arch depends from the web 88 .
- the pulley may be formed of aluminum and the collar may be formed of 303 stainless steel. Accordingly, the shaft, pulley, and collar form a generally rigid structure which rotates as a unit about the longitudinal axis 300 .
- the shaft/pulley/collar unit is carried within the head by a bearing system 104 comprising upper and lower ball bearing units 104 A and 104 B.
- the bearing system 104 couples the lower collar 100 of the collar piece to an inner head housing 106 which is fixed to the structure of the arm.
- An annular clamp 114 is secured to the base of lower collar piece 100 so as to vertically clamp an inner portion of the bearing system 104 between the clamp 114 and upper collar piece 98 .
- the inner head housing 106 is held within a centrally-apertured cup-shaped outer head housing 108 and secured thereto to vertically clamp an outer portion of the bearing system 104 between the inner and outer head housings.
- the outer head housing 108 is secured to a lower arm housing 110 so that the arm 62 supports the head 60 .
- An upper arm housing 112 provides additional structural support.
- the inner and outer head housings may be formed of 303 and 316 stainless steel, respectively, and the clamp may be formed of 303 stainless steel.
- a generally-annular drive sleeve 120 couples the end effector 80 to the drive shaft 86 .
- the drive sleeve may be formed of 316 stainless steel.
- the drive sleeve 120 is accommodated within the annular space 102 between the collar and drive shaft.
- the drive sleeve 120 is keyed to the drive shaft 86 so as to permit relative longitudinal translation therebetween while preventing relative rotation. In the illustrated embodiment, this is achieved by a keying member 122 having an outwardly projected keying tab 124 .
- the keying member 122 is secured within a vertical slot 126 in the periphery of shaft 86 and the tab 124 rides within a vertical slot 128 in the interior of sleeve 120 and interacts with the sides of the slot 128 to prevent relative rotation of the shaft and sleeve.
- the shaft transmits torque and rotation from the pulley to the sleeve 120 .
- a bearing having a cage 130 and a plurality of balls 132 is interposed between the inner cylindrical surface of the sleeve 120 and the outer cylindrical surface of the shaft 86 .
- a generally-annular elastomeric diaphragm 134 having an outer periphery 136 and an inner periphery 138 off an upper portion of the annular space 102 to form a pressure chamber 102 A.
- the diaphragm has an upper surface 140 A generally interior to the pressure chamber 102 A and a lower surface 140 B generally exterior to the pressure chamber.
- the diaphragm is made of neoprene having a thickness of about 0.03 inches.
- the diaphragm is sealingly secured between an upward facing shoulder of the drive sleeve 120 and a lower face an annular internally threaded clamp 142 .
- the clamp 142 (which may be formed as a nut) is engaged to an externally threaded reduced diameter portion 144 at the upper end of the drive sleeve 120 .
- the clamp may be formed of 6061-T6 aluminum.
- the diaphragm extends radially outward from between the clamp and shoulder and then curves downward along a round 146 formed between the shoulder and a cylindrical outer surface portion 148 of the drive sleeve. The diaphragm disengages the circular cylindrical outer surface portion and continues radially outward, traversing a gap (the annular space 102 ) between the drive sleeve and the collar.
- the lower surface 140 B of the diaphragm engages a circular cylindrical inner surface 150 of the lower collar piece 100 and extends upward therealong.
- the diaphragm wraps over a round 152 formed between the cylindrical inner surface 150 and an upward facing shoulder of the lower collar piece and is clamped between the upward facing shoulder and a downward facing shoulder of the upper collar piece 98 .
- an annular lip 154 projects downward from the upper collar piece, sandwiching a portion of the diaphragm between an outer cylindrical surface of the lip 154 and the inner cylindrical surface 150 of the lower collar piece.
- the chamber 102 A may be inflated to move the drive sleeve 120 and end effector 86 from the retracted position (FIG. 3A) to the extended position (FIG. 3B).
- the chamber may be deflated, such as by applying a vacuum through the rotary union 94 , move the drive sleeve and end effector from the extended position to the retracted position. Because gravity naturally biases the end effector and drive sleeve toward the extended position, vacuum is provided for retraction.
- the lower surface 140 B of the diaphragm rolls off the cylindrical outer surface 148 of the drive sleeve, traverses the gap formed by annular space 102 , and rolls onto the cylindrical inner surface 150 of the lower collar piece.
- the amount of downforce applied to the end effector will be proportional to the pressure applied to the chamber.
- a spring (not shown) may be provided to bias the drive sleeve toward the retracted position and, thereby, eliminate or reduce the need for applying a vacuum to retract the end effector.
- the drive sleeve couples the end effector to the drive shaft to transmit torque and rotation from the drive shaft and downforce from the pressure chamber to the end effector shown in FIG. 4.
- the end effector 80 includes a backing element 156 for transmitting the torque, rotation, and downward force to the conditioning disk 82 .
- An optional removable disk holder 158 may intervene between the disk and the backing element. In the illustrated cross-sectional views, including FIG. 4, the section through the disk holder 158 is taken at an angle of 150° about the axis 300 . The remainder of the head is sectioned by a plane.
- a central cylindrical projection 160 depends from the base of the drive sleeve 120 and is received by a cylindrical well 162 in a hub 164 of the backing element 156 and is secured thereto by means such as screws (not shown).
- a centrally-apertured annular elastomeric membrane cover 166 prevents contaminants from falling into the interior of the backing element.
- the cover 166 is clamped at its aperture between a horizontal shoulder 168 of the drive sleeve base and an annular surface of the top of the hub 164 , outboard of the projection 160 and well 162 .
- the cover may be formed of ethylene propylene diene terpolymer (EPDM) rubber.
- a central downward facing socket 170 having a concave spherical surface portion is formed in the bottom of the hub 164 .
- the socket is a sector comprising approximately 63.5° degrees of arc.
- Extending radially outward from the hub 164 are four generally flat sheet-like spokes 172 (see also FIG. 5), each oriented so as to have generally upper and lower surfaces. At the proximal end of each spoke, the spoke's upper surface is in contact with an annular downward facing shoulder 176 of the hub 164 radially outboard of the socket 170 .
- the hub may be formed of 303 stainless steel.
- the spokes may be formed of 302 stainless steel with an exemplary thickness of 0.010 inches (0.25 mm).
- Each spoke's proximal end is secured to the hub 164 such as by rivets, screws, or other fastening means (not shown).
- the distal ends of the spokes are secured to an annular rim 178 which may be formed as a flat horizontal 303 stainless steel band to which the spokes are welded or otherwise secured.
- the spokes 172 are resiliently flexible upward and downward so as to permit tilting of the rim, relative to the axis 300 from the otherwise neutral horizontal orientation.
- the configuration of the spokes makes them substantially inflexible transverse to the axis 300 , so that they effectively transmit torque and rotation about the axis 300 from the hub 164 to the rim 178 .
- the spokes may each be provided with a transversely extending wave or ruffle 180 .
- the wave extends two cycles, each cycle having a length of approximately 0.22 inches (5.6 mm) and an amplitude of approximately 0.04 inches (1.0 mm). Three to five spokes are preferred to balance torque transmission and flexibility.
- the backing element includes a rigid, generally disk-shaped, polyethylene terepthalate (PET) backing plate 182 .
- the backing plate has a central upward facing projection 184 having a convex spherical surface portion 186 (see also FIG. 6) of equal radius to and in sliding engagement with the concave spherical surface portion of the socket 170 . Interaction of the projection 184 and socket 170 can transmit compressive force between drive sleeve 120 and backing element 156 while permitting the backing element to rotate about axes orthogonal to the axis 300 .
- the backing plate 182 has a generally flat lower surface 188 in contact with an upper surface 190 of a body 192 of the disk holder 158 .
- the plate 182 extends radially outward to a generally annular rim section 194 .
- the rim section 194 is secured to the band 178 such as by screws extending through the band.
- the rim section 194 is also secured to the outer periphery of the cover 166 such as by screws extending through a clamp ring 198 clamping the cover 166 to the rim 194 .
- the plate rim 194 carries a generally-annular L-sectioned stainless steel ring 196 in an annular upwardly directed pocket. The pocket is sealed with a PET plug which is flush with the lower surface 188 of the backing plate 182 .
- the disk holder 158 shown in FIG. 4 and in isolated perspective, top, bottom and side views in FIGS. 7A, 7B, 7 C and 8 , respectively, has a central core or hub region 200 from which radiate six radially-extending spokes 202 .
- Each spoke has substantially flat lower surface 206 .
- Each spoke has a relatively narrow section extending outward from the core and diverging to form a relatively wide section 208 adjacent an outer perimeter rim 210 .
- the rim 210 is formed as a generally annular band.
- a web 212 is formed between each adjacent pair of spokes 202 . Each web extends from the core 200 and terminates at an outboard edge 218 which is radially recessed from the rim 210 .
- Each web has a lower surface 214 which is vertically recessed from the lower surfaces of adjacent spokes.
- Each web also has a flat upper surface that is substantially coplanar with the upper surfaces of the adjacent spokes to form an upper surface 216 of the disk holder which contacts the lower surface 188 of the backing plate.
- the upper surface 216 of each web may be slightly recessed from the upper surface of the spoke to reduce the effects of slurry trapped between the disk holder and backing element.
- Associated and aligned with each web 212 is a downwardly extending recess 220 (FIGS. 4 and 7) in the upper edge of the rim 210 . Between each recess 220 , the rim 210 includes a projection 222 at the outer end of each spoke 202 .
- the projections 222 extend above the upper surfaces of the spokes. As shown in FIG. 4, when the disk holder is engaged to the backing plate, each projection 222 is received by a corresponding recess or cutout 224 in the rim 194 of the backing plate 182 (see FIG. 6). The projections 222 fit securely within the recesses 224 to prevent relative rotation of the disk holder and backing element.
- Radially outward extending channels 223 are each defined by an adjacent pair of the spokes 202 , the lower surface 214 of the web 212 between such pair of spokes, and the upper surface 238 of the disk 82 . The role of these channels is described in further detail below.
- the core 200 , spokes 202 , webs 212 , and rim 210 are unitarily formed, preferably as a single molding of a polymer material such as PET.
- a cylindrical blind bore is formed in the wide section of each spoke 202 adjacent the rim 210 .
- the bore accommodates a cylindrical magnet 230 and is plugged by a polyethylene terepthalate (PET) cylinder.
- PET polyethylene terepthalate
- the bore extends down from the upper surface 204 of the spoke, and the cylinder is flush with the upper surface of the spoke. Magnetic attraction between the magnets 230 and the ring 196 vertically secures the disk holder to the backing element by magnetic attraction.
- a drive pin 232 depends from the spoke immediately inboard of the magnet 230 .
- the drive pins are received by associated bores 234 in the disk and serve to prevent rotation of the disk relative to the disk holder.
- the disk 82 (see also FIG. 9) may be formed of nickel-coated carbon steel having the lower surface 84 embedded with diamond particles for an abrasive. The magnets attract the disk, vertically securing the disk to the holding element with the upper surface 238 of the disk contacting the lower surfaces of the spokes 202 .
- the flat lower surface 84 of the disk defines a disk plane 302 .
- the disk plane is perpendicular to the longitudinal axis 300 which extends through the center of the disk.
- the concave and convex spherical surface portions of socket 170 and projection 184 respectively, have a common center of curvature 304 at the intersection of the disk plane 302 with the longitudinal axis 300 .
- the drive shaft 86 is caused to rotate, which rotation is transmitted to the disk 82 .
- the end effector 80 is then shifted from the retracted position to an extended position to bring the lower surface 84 of the disk into engagement with the polishing surface 76 of the pad.
- the downward force compressing the disk against the pad is controlled by modulating the pressure in the pressure chamber 102 A.
- the downward force is transmitted through the drive sleeve, the hub, between the concave and convex spherical surface portions to the backing plate, to the disk holder, and then to the disk.
- Torque to rotate the disk relative to the pad is supplied from the drive shaft to the drive sleeve, the hub, the spokes, the rim of the backing element, the holder, and then to the disk via the pins.
- the disk, disk holder and backing element may tilt relative to the axis via sliding of the convex spherical surface of the projection 184 relative to the concave spherical surface of the socket 170 .
- the hub 164 remains fixed relative to the axis 300 .
- the spokes 172 flex either upward or downward depending on their location at any given point in time.
- the location of the common center 304 in disk plane 302 minimizes fluctuations in the compression force between the disk and the pad when the end effector 80 tilts to maintain engagement between the end effector and pad.
- the shear force applied to the disk by friction with the polishing pad is directed in the disk plane 302 and, thereby, does not exert a moment about the center 304 which would otherwise tend to pivot the disk and produce an uneven pressure distribution between the disk and pad.
- the cover 166 is free to flex and stretch to accommodate the tilting.
- the lower surface of the rotating conditioning disk 82 engaged with the polishing surface of the rotating polishing pad, is reciprocated in a path along the rotating polishing pad as described above.
- the bottom surface of the disk is immersed in the thin layer of a polishing slurry 299 atop the polishing pad.
- the rotation of the disk may induce a flow 248 of the polishing slurry longitudinally upward from the lower surface 84 of the disk, through an array of holes 242 in the disk, and radially outward along the upper surface of the disk through the channels 223 .
- the flow proceeds outward through radially-extending passageways in the rim 210 formed by the recesses 220 .
- Each passageway/recess 220 is generally aligned with an associated channel 223 . This flow of the slurry may increase the effectiveness of conditioning by helping to evacuate material from the pad surface.
- the end effector is raised, causing the disk to disengage from the polishing pad.
- the cup 66 may then be pivoted to a location below the head and the end effector extended so as to immerse the disk in a cleaning liquid 298 in the cup.
- the disk is rotated about the axis 300 within the body of cleaning liquid (the rotation need not have been altered since the disk was engaged to the pad).
- the rotation causes a flow 250 of the cleaning liquid longitudinally upward from the lower surface of the disk, through the holes 242 , through the disk, and radially outward along the upper surface of the disk through the channels 223 .
- Flow of the cleaning liquid which may comprise deionized water, serves to clean the disk of contaminants including material worn from the pad, byproducts of the polishing etc.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
A conditioner head for conditioning the polishing surface of a polishing pad. The conditioner head includes a drive element carried for rotation about a longitudinal axis and a disk backing element. The disk backing element carries an abrasive disk and holds the lower surface of the disk in engagement with the polishing pad. The conditioner head further includes a driven element coupling the disk backing element to the drive element to transmit torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and to the driven element to rotate therewith as a unit.
Description
- 1. 1. Technical Field
- 2. This invention relates generally to the planarization of semiconductor substrates and, more particularly to the conditioning of polishing pads in slurry-type polishers.
- 3. 2. Background Information
- 4. Integrated circuits are typically formed on substrates, particularly silicon wafers, by the sequential deposition of conductive, semiconductive or insulative layers. After each layer is deposited, the layer is etched to create circuitry features. As a series of layers are sequentially deposited and etched, the outer or uppermost surface of the substrate, i.e., the exposed surface of the substrate, becomes successively less planar. This non-planar outer surface presents a problem for the integrated circuit manufacturer as a non-planar surface can prevent proper focusing of the photolithography apparatus. Therefore, there is a need to periodically planarize the substrate surface to provide a planar surface. Planarization, in effect, polishes away a non-planar, outer surface, whether a conductive, semiconductive, or insulative layer, to form a relatively flat, smooth surface.
- 5. Chemical mechanical polishing is one accepted method of planarization. This planarization method typically requires that the substrate be mounted on a carrier or polishing head, with the surface of the substrate to be polished exposed. The substrate is then placed against a rotating polishing pad. The carrier head may also rotate and/or oscillate to provide additional motion between the substrate and polishing surface. Further, a polishing slurry, including an abrasive and at least one chemically-reactive agent, may be spread on the polishing pad to provide an abrasive chemical solution at the interface between the pad and substrate.
- 6. Important factors in the chemical mechanical polishing process are: substrate surface planarity and uniformity, and the polishing rate. Inadequate planarity and uniformity can produce substrate defects. The polishing rate sets the time needed to polish a layer. Thus, it sets the maximum throughput of the polishing apparatus.
- 7. It is important to take appropriate steps to counteract any deteriorative factors which either present the possibility of damaging the substrate (such as by scratches resulting from accumulated debris in the pad) or reduce polishing speed and efficiency (such as results from glazing of the pad surface after extensive use). The problems associated with scratching the substrate surface are self-evident. The more general pad deterioration problems both decrease polishing efficiency, which increases cost, and create difficulties in maintaining consistent operation from substrate to substrate as the pad decays.
- 8. The glazing phenomenon is a complex combination of contamination, thermal, chemical and mechanical damage to the pad material. When the polisher is in operation, the pad is subject to compression, shear and friction producing heat and wear. Slurry and abraded material from the wafer and pad are pressed into the pores of the pad material and the material itself becomes matted and even partially fused. These effects reduce the pad's roughness and its ability to apply fresh slurry to the substrate.
- 9. It is, therefore, desirable to continually condition the pad by removing trapped slurry, and unmatting or re-expanding the pad material.
- 10. A number of conditioning procedures and apparatus have been developed. Common are mechanical methods wherein an abrasive material is placed in contact with the moving polishing pad. For example, a diamond coated screen or bar may be used which scrapes and abrades the pad surface, and both removes the contaminated slurry trapped in the pad pores and expands and re-roughens the pad.
- 11. In one aspect, the invention is directed to a conditioner head for conditioning the polishing surface of a polishing pad. The head includes a drive element carried for rotation about a longitudinal axis. The head further includes a disk backing element for carrying an abrasive disk and holding the lower surface of the disk in engagement with the polishing pad. A driven element couples the disk backing element to the drive element and transmits torque and rotation therebetween. The driven element is longitudinally movable between retracted and extended positions. An annular diaphragm spans a gap between the drive element and the driven element and is coupled to the drive element and the driven element so as to rotate therewith as a unit.
- 12. Implementations of the invention may include one or more of the following. The diaphragm may in part bound a pressure chamber which may be pressurized to shift the driven element from the retracted position to the extended position and depressurized to shift the driven element from the extended position to the retracted position. During transition between the retracted and extended positions a first surface of the diaphragm, exterior to the pressure chamber, rolls of a generally annular outer surface portion of the driven element traverses the gap and rolls onto a generally annular inner surface portion of the drive element.
- 13. The drive element may include a drive shaft and a collar substantially fixed to the drive shaft and having a generally annular inner surface portion. The driven element may include a drive sleeve encircling at least a length of the drive shaft and having a generally annular outer surface portion. The annular diaphragm may extend between an outer periphery and an inner aperture and may be sealingly secured along the outer periphery to the collar and along the inner aperture to the drive sleeve. The generally annular outer surface portion of the drive sleeve may be a circular cylinder and the generally annular inner surface portion of the collar may be a circular cylinder. The diaphragm may in part bound a pressure chamber. The pressure chamber may be pressurized to shift the drive sleeve from the retracted position to the extended position and depressurized to shift the drive sleeve from the extended position to the retracted position. During transition between the retracted and extended positions, a first surface of the diaphragm, exterior to the pressure chamber, may roll off the generally annular outer surface portion of the drive sleeve. The first surface of the diaphragm may then traverse a gap between the generally annular outer surface portion of the drive sleeve and the generally annular inner surface portion of the collar and roll onto the generally annular inner surface portion of the collar. A fluid for inflating the pressure chamber may be introduced to the pressure chamber through a channel in the drive shaft. The head may include a housing substantially rigidly coupled to a conditioner arm for moving the head at least transverse to the longitudinal axis. The housing may include a first portion encircling at least the length of the collar, which first portion is coupled to the collar by a bearing system for permitting the collar to rotate relative to the first portion about the longitudinal axis. A web may be formed at the upper end of the drive shaft, the collar depending from the web. A pulley may be substantially fixed to the web for transmitting torque to the drive shaft. The collar may comprise a first piece depending from and fixed to the web and a second piece, separately formed from the first piece. The second piece may engage the bearing system and the diaphragm may be secured along the outer periphery to the collar between the first and second pieces. The diaphragm may be partially sandwiched between an outer cylindrical surface of an annular lip depending from the first piece and a generally annular inner surface of the second piece which forms the generally annular inner surface portion of the collar.
- 14. In another aspect, the invention is directed to a disk holder for holding a conditioning disk for conditioning a polishing pad. The disk holding element has a lower face for engaging an upper surface of the conditioning disk. The disk holding element defines a plurality of generally radially outward extending channels along the upper surface of the conditioning disk.
- 15. Implementations of the invention may include one or more of the following. The disk may comprise a central region, an outer perimeter, a plurality of radially extending spokes, and a plurality of webs. The spokes may extend from the central region to the outer perimeter, each spoke having a lower surface for engaging the upper surface of the conditioning disk. The webs, one such web between each adjacent pair of spokes, may each have a lower surface at least partially vertically recessed from the lower surfaces of the adjacent spokes so as to define one channel. Each web may extend from the central region and terminate at an outboard edge, radially recessed from the outer perimeter. The outer perimeter may be formed as a rim having a plurality of radially extending passageways. Each passageway may be generally aligned with an associated channel for permitting flow radially outward through the passageway from the associated channel when the disk holding element and disk are rotated about a central longitudinal axis while at least a lower surface of the disk is exposed to a liquid. Each of the radially extending passageways may be formed as a downwardly extending recess in the rim. The conditioning disk may be readily securable to and removable from the disk holding element. Each spoke may carry a magnet for attracting the conditioning disk. The conditioning disk may be readily securable to and removable from the disk holder element and the disk holder element may be readily securable to and removable from a rotating fixture. Each spoke may carry a magnet for securing the conditioning disk to the disk holder element and for securing the disk holder element to the rotating fixture. A first pin may depend from a first spoke and a second pin may depend from a second spoke, the first and second pins receivable by the conditioning disk for preventing rotation of the conditioning disk relative to the disk holder element. The central region, outer perimeter, plurality of radially extending spokes, and plurality of webs may be unitarily formed as a single piece of material. Each spoke may have a relatively narrow section extending outward from the central region and joining a relatively wider section adjacent the outer perimeter. Each web may have an upper surface substantially coplanar with the upper surfaces of adjacent spokes.
- 16. In another aspect, the invention is directed to a disk holder element for holding a conditioning disk used in association with a conditioner head of an apparatus for conditioning the polishing surface of a polishing pad. The disk holder element includes a lower surface magnetically engageable with an upper surface of the disk and an upper surface magnetically engageable with a lower surface of the head. The disk holder element may comprise a plurality of magnets securing the disk to the disk holder element and securing the disk holder element to the conditioner head.
- 17. In another aspect, the invention is directed to a conditioner head for conditioning the polishing surface of the polishing pad. The head includes a generally circular abrasive disk having upper and lower surfaces. The lower surface defining a disk plane. A drive element is carried for rotation about a longitudinal axis. A disk backing element carries the disk and holds the lower surface of the disk in engagement with the polishing pad and applies force and torque to the disk. The disk backing element has an upper member, fixed to the drive element, which upper member has a central downward facing socket having a spherical surface portion. The disk backing element further includes a lower member, fixed to the abrasive disk, which lower membrane has a central upward facing projection with a spherical surface portion in sliding engagement with the spherical surface portion of the socket. The disk backing element further includes at least one resilient member, coupling the upper member to the lower member so as to bias the lower member toward a neutral orientation. In the neutral orientation the disk plane is perpendicular to longitudinal axis. The resilient member permits tilting of the disk plane relative to the longitudinal axis and permits transmission of torque and rotation from the drive element to the disk. The upper member may comprises a central hub. The at least one resilient member may comprise a plurality of radially extending spokes extending radially outward from the central hub. Each spoke may be upwardly and downwardly flexible for permitting tilting of the disk plane relative to the longitudinal axis while transmitting rotation from the drive element to the rim. The spherical surface portions of the socket and projection may have a common center lying substantially within the disk plane.
- 18. In another aspect, the invention is directed to a conditioner head for conditioning the polishing surface of a polishing pad using an abrasive conditioning disk. The conditioner includes a drive element carried for rotation about a longitudinal axis and a disk backing element for holding and applying torque to the abrasive conditioning disk. The disk backing element includes a central hub fixed to the drive element, an outer rim generally defining a rim plane, and a plurality of radially extending spokes. The spokes extend from the central hub to the outer rim. Each spoke is upwardly and downwardly flexible for permitting tilting of the rim plane relative to the longitudinal axis while transmitting rotation from the drive element to the rim. Each spoke may have a transversely extending wave for increasing the flexibility of the spoke. The spokes may be formed of steel. The head may further comprise a plate having a central upward facing projection having a spherical surface portion. The hub may have a central downward facing socket having a spherical surface portion in sliding engagement with the spherical surface portion of the projection.
- 19. In another aspect, the invention is directed to a process for conditioning a polishing pad. The process includes providing an abrasive conditioning disk carried by a disk carrier and having a lower surface engageable with a polishing surface of the polishing pad. The carrier is caused to rotate the conditioning disk and bring the lower surface of the conditioning disk into engagement with the polishing surface of the polishing pad. The carrier is caused to reciprocate in the path along the rotating polishing pad. A carrier is caused to disengage the conditioning disk form the polishing pad. The carrier is caused to rotate the conditioning disk and introduce the conditioning disk to a body of cleaning liquid so as to cause a flow of the cleaning liquid longitudinally upward from the lower surface of the conditioning disk, through the conditioning disk, and radially outward along an upper surface of the conditioning disk so as to clean the conditioning disk.
- 20. Implementations of the inventive process may include on or more of the following. A second liquid may be applied to the polishing surface of the polishing pad. The second liquid may be permitted to flow up through the lower surface of the conditioning disk, through the conditioning disk, and radially outward along the upper surface of the conditioning disk when the conditioning disk is engaged with the polishing surface of the polishing pad. The flow of the cleaning liquid along the upper surface of the conditioning disk may be through a plurality of generally radially outwardly extending channels defined by a disk holder.
- 21. Among the advantages which may be provided by the invention are improved sealing and reduced wear and particle generation. Since the diaphragm may be fixed at its inner aperture and outer periphery to the associated elements, it need not be in sliding engagement with those elements either during rotation or in translation of the end effector between retracted and extended positions. This lack of sliding engagement reduces wear and the associated particle generation between slidingly engaged surfaces and prevents contaminants from entering the pressure chamber between slidingly engaged surfaces.
- 22. Further advantages are provided by the end effector featuring a spoked flexure and spherical socket and projection joint. The joint permits the application of downward force from the head to the conditioning disk to maintain compression between the conditioning disk and polishing pad surface. The flexure transmits torque and rotation to the disk while permitting the disk plane to tilt relative to the axis of rotation allowing the disk to remain flat against the polishing pad during conditioning. The flexure may bias the disk into a neutral orientation with the disk plane substantially perpendicular to the axis of rotation. By forming the flexure with a plurality of thin flat spokes, a balance is achieved between the ability to transmit torque about the axis of rotation and the ability to flex to allow the disk plane to tilt relative to the axis of rotation. The sliding spherical surface joint, with a center of rotation located in the center of the lower surface of the disk, also allows for smooth tilting of the disk during operation.
- 23. Further advantages are provided by a disk holding element which defines a plurality of channels along the upper surface of the disk so that during conditioning of the pad or during rinsing of the disk, there is a flow of either slurry or cleaning fluid upward through the bottom surface of the disk, through the disk, and radially outward along the upper surface of the disk through the channels. The channels facilitate more efficient conditioning and cleaning of the disk.
- 24. A further advantage is provided by a disk holding element which is made readily removable from the backing element and from the disk. The holding element may first be secured to the disk and then the combined holding element and disk may be secured to the backing element. Alignment features on the disk holding element facilitate the precise registration of the disk and holder relative to the backing element without undue effort. To allow faster changeout and thus reduce downtime when a disk is replaced, while one disk is in the conditioning head, a fresh disk can be secured to a second disk holding element. The first disk and first holder may be removed from the head, and replaced with a second disk and second holding element and the conditioner restarted. The first disk may then be separated from the first disk holding element and the first disk holding element secured to a new disk to await subsequent use.
- 25. The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims.
- 26.FIG. 1A is a perspective view of a polishing apparatus.
- 27.FIG. 1B is a partially exploded view of the polishing apparatus of FIG. 1.
- 28.FIGS. 2A and 2B are diagrammatic top views of a substrate being polished and a polishing pad being conditioned by the polishing apparatus of FIG. 1.
- 29.FIG. 3A is a diagrammatic cross-sectional view of a conditioner head with an end effector in a retracted position.
- 30.FIG. 3B is a diagrammatic cross-sectional view of a conditioner head with an end effector in an extended position.
- 31.FIG. 4 is a diagrammatic cross-sectional view of the end effector of the conditioner head of FIGS. 3A and 3B.
- 32.FIG. 5 is a top view of a flexure of the end effector of FIG. 4.
- 33.FIG. 6 is a top view of a backing plate of the end effector of FIG. 4.
- 34.FIG. 7A is a top perspective view of a disk holding member of the end effector of FIG. 4.
- 35.FIG. 7B is a top view of the disk holding member of FIG. 7A.
- 36.FIG. 7C is a bottom view of a disk holding member of FIG. 7A.
- 37.FIG. 8 is a side view of the disk holding member along line 8-8 of FIG. 7C.
- 38.FIG. 9 is a perspective view of a conditioning disk of FIG. 4.
- 39.FIG. 10 is a diagrammatic cross-sectional view of a conditioner head with an end effector tilted to engage a polishing pad.
- 40.FIG. 11 is a diagrammatic cross-sectional view of a conditioner head with an end effector immersed in a cup of cleaning liquid.
- 41. Like reference numbers and designations in the various drawings indicate like elements.
- 42. Referring to FIGS. 1A and 1B, a polishing
apparatus 10 includes ahousing 12 that contains three independently-operatedpolishing stations 14, asubstrate transfer station 16, and arotatable carousel 18 which choreographs the operation of four independently rotatable carrier heads 20. Attached to one side of thehousing 12 is a substrate loading apparatus 22 that includes atub 24 that contains aliquid bath 26 in which cassettes 28 containingsubstrates 30 are immersed. Anarm 32 rides along alinear track 34 and supports awrist assembly 36, which includes acassette claw 38 for movingcassettes 28 from a holdingstation 39 into thetub 24 and asubstrate blade 40 for transferring substrates from thetub 24 to thetransfer station 16. - 43. The
carousel 18 has asupport plate 42 withslots 44 through whichshafts 46 of the carrier heads 20 extend. The carrier heads 20 can independently rotate and oscillate back-and-forth in theslots 44 to achieve a uniformly polished substrate surface. The carrier heads 20 are rotated byrespective motors 48, which are normally hidden behindremovable sidewalls 50 of thecarousel 18. In operation, a substrate is loaded from thetub 24 to thetransfer station 16, from which the substrate is transferred to acarrier head 20. Thecarousel 18 then transfers the substrate through a series of one ormore polishing stations 14 and finally returns the polished substrate to thetransfer station 16. - 44. Each polishing
station 14 includes arotatable platen 52, which supports apolishing pad 54, and apad conditioner 56. Theplaten 52 andconditioner 56 are both mounted to atable top 57 inside the polishingapparatus 10. Eachpad conditioner 56 includes aconditioner head 60, anarm 62, and abase 64. Thearm 62 has a distal end coupled to theconditioner head 60 and a proximal end coupled to thebase 64, which sweeps theconditioner head 60 across the polishingpad surface 76 to condition thesurface 76 by abrading the surface to remove contaminants and retexturize the surface. Each polishingstation 14 also includes acup 66, which contains a cleaning liquid for rinsing or cleaning theconditioner head 60. - 45. Referring to FIGS. 2A and 2B, in one mode of operation, a
polishing pad 54 is conditioned by apad conditioner 56 while the polishing pad polishes a substrate which is mounted on acarrier head 20. Theconditioner head 60 sweeps across thepolishing pad 54 with a reciprocal motion that is synchronized with the motion of thecarrier head 20 across thepolishing pad 54. For example, acarrier head 20 with a substrate to be polished may be positioned in the center of thepolishing pad 54 andconditioner head 60 may be immersed in the cleaning liquid contained within thecup 66. During polishing, thecup 66 may pivot out of the way as shown byarrow 69, and theconditioner head 60 and thecarrier head 20 carrying a substrate may be swept back-and-forth across thepolishing pad 54 as shown byarrows water jets 74 may direct streams of water toward thepolishing pad 54 to rinse slurry from the polishing orupper pad surface 76. - 46. For further details regarding the general features and operation of polishing
apparatus 10, please refer to co-pending application Ser. No. 08/549,336, filed, Oct. 27, 1995, by Perlov et al., entitled “Continuous Processing System for Chemical Mechanical Polishing,” and assigned to the assignee of the present invention, which is hereby incorporated by reference. - 47. Referring to FIGS. 3A and 3B, a
conditioner head 60 includes an actuation and drivemechanism 78 which rotates anend effector 80 carrying a diamond impregnated conditioning disk 82 (see also FIG. 9) about a central vertically-orientedlongitudinal axis 300 of the head. The actuation and drive mechanism further provides for the movement of theend effector 80 anddisk 82 between an elevated retracted position (FIG. 3A) and a lowered extended position (FIG. 3B). In substantially the extended position, thelower surface 84 of thedisk 82 may be brought into engagement with the polishingsurface 76 of thepad 54. Additionally, the end effector may be introduced to the cup 66 (FIG. 2B) for cleaning the disk or the disk may be replaced, both of which are described in further detail below. - 48. The actuation and drive
mechanism 78 includes a vertically-extendingdrive shaft 86 which, at its upper end, includes a unitarily-formed, radially-extendingweb 88. In the exemplary embodiment, the drive shaft may be formed of heat treated 440C stainless steel. Apulley 90 is secured to the web and carries abelt 92 which extends along the length of thearm 62 and is coupled to a remote motor (not shown) for rotating theshaft 86 about thelongitudinal axis 300. Arotary union 94 is secured to the upper end of the shaft for introducing and withdrawing air from an actuation chamber via alongitudinal channel 96 in the shaft. A collar, having upper andlower pieces annular space 102 therebetween. Theupper collar piece 98 is fired to arch depends from theweb 88. In the exemplary embodiment, the pulley may be formed of aluminum and the collar may be formed of 303 stainless steel. Accordingly, the shaft, pulley, and collar form a generally rigid structure which rotates as a unit about thelongitudinal axis 300. To permit rotation, the shaft/pulley/collar unit is carried within the head by abearing system 104 comprising upper and lowerball bearing units bearing system 104 couples thelower collar 100 of the collar piece to aninner head housing 106 which is fixed to the structure of the arm. Anannular clamp 114 is secured to the base oflower collar piece 100 so as to vertically clamp an inner portion of thebearing system 104 between theclamp 114 andupper collar piece 98. Theinner head housing 106 is held within a centrally-apertured cup-shapedouter head housing 108 and secured thereto to vertically clamp an outer portion of thebearing system 104 between the inner and outer head housings. Theouter head housing 108 is secured to alower arm housing 110 so that thearm 62 supports thehead 60. Anupper arm housing 112 provides additional structural support. In the exemplary embodiment, the inner and outer head housings may be formed of 303 and 316 stainless steel, respectively, and the clamp may be formed of 303 stainless steel. - 49. A generally-
annular drive sleeve 120 couples theend effector 80 to thedrive shaft 86. The drive sleeve may be formed of 316 stainless steel. Thedrive sleeve 120 is accommodated within theannular space 102 between the collar and drive shaft. Thedrive sleeve 120 is keyed to thedrive shaft 86 so as to permit relative longitudinal translation therebetween while preventing relative rotation. In the illustrated embodiment, this is achieved by a keyingmember 122 having an outwardly projectedkeying tab 124. The keyingmember 122 is secured within avertical slot 126 in the periphery ofshaft 86 and thetab 124 rides within avertical slot 128 in the interior ofsleeve 120 and interacts with the sides of theslot 128 to prevent relative rotation of the shaft and sleeve. Thus the shaft transmits torque and rotation from the pulley to thesleeve 120. To provide a smooth sliding vertical engagement between thedrive shaft 86 and drivesleeve 120, a bearing having acage 130 and a plurality ofballs 132 is interposed between the inner cylindrical surface of thesleeve 120 and the outer cylindrical surface of theshaft 86. - 50. A generally-annular
elastomeric diaphragm 134 having anouter periphery 136 and aninner periphery 138 off an upper portion of theannular space 102 to form apressure chamber 102A. The diaphragm has anupper surface 140A generally interior to thepressure chamber 102A and alower surface 140B generally exterior to the pressure chamber. In an exemplary embodiment, the diaphragm is made of neoprene having a thickness of about 0.03 inches. Along itsinner periphery 138, the diaphragm is sealingly secured between an upward facing shoulder of thedrive sleeve 120 and a lower face an annular internally threadedclamp 142. The clamp 142 (which may be formed as a nut) is engaged to an externally threaded reduceddiameter portion 144 at the upper end of thedrive sleeve 120. In the exemplary embodiment, the clamp may be formed of 6061-T6 aluminum. The diaphragm extends radially outward from between the clamp and shoulder and then curves downward along around 146 formed between the shoulder and a cylindricalouter surface portion 148 of the drive sleeve. The diaphragm disengages the circular cylindrical outer surface portion and continues radially outward, traversing a gap (the annular space 102) between the drive sleeve and the collar. Continuing and curving upwardly, thelower surface 140B of the diaphragm engages a circular cylindricalinner surface 150 of thelower collar piece 100 and extends upward therealong. The diaphragm wraps over around 152 formed between the cylindricalinner surface 150 and an upward facing shoulder of the lower collar piece and is clamped between the upward facing shoulder and a downward facing shoulder of theupper collar piece 98. Inboard of the innercylindrical surface 150, anannular lip 154 projects downward from the upper collar piece, sandwiching a portion of the diaphragm between an outer cylindrical surface of thelip 154 and the innercylindrical surface 150 of the lower collar piece. - 51. In operation, the
chamber 102A may be inflated to move thedrive sleeve 120 andend effector 86 from the retracted position (FIG. 3A) to the extended position (FIG. 3B). The chamber may be deflated, such as by applying a vacuum through therotary union 94, move the drive sleeve and end effector from the extended position to the retracted position. Because gravity naturally biases the end effector and drive sleeve toward the extended position, vacuum is provided for retraction. During transition between the retracted and extended positions, thelower surface 140B of the diaphragm rolls off the cylindricalouter surface 148 of the drive sleeve, traverses the gap formed byannular space 102, and rolls onto the cylindricalinner surface 150 of the lower collar piece. The amount of downforce applied to the end effector will be proportional to the pressure applied to the chamber. Optionally, a spring (not shown) may be provided to bias the drive sleeve toward the retracted position and, thereby, eliminate or reduce the need for applying a vacuum to retract the end effector. - 52. The drive sleeve couples the end effector to the drive shaft to transmit torque and rotation from the drive shaft and downforce from the pressure chamber to the end effector shown in FIG. 4. The
end effector 80 includes abacking element 156 for transmitting the torque, rotation, and downward force to theconditioning disk 82. An optionalremovable disk holder 158 may intervene between the disk and the backing element. In the illustrated cross-sectional views, including FIG. 4, the section through thedisk holder 158 is taken at an angle of 150° about theaxis 300. The remainder of the head is sectioned by a plane. A centralcylindrical projection 160 depends from the base of thedrive sleeve 120 and is received by a cylindrical well 162 in ahub 164 of thebacking element 156 and is secured thereto by means such as screws (not shown). A centrally-apertured annularelastomeric membrane cover 166 prevents contaminants from falling into the interior of the backing element. Thecover 166 is clamped at its aperture between ahorizontal shoulder 168 of the drive sleeve base and an annular surface of the top of thehub 164, outboard of theprojection 160 and well 162. In the exemplary embodiment, the cover may be formed of ethylene propylene diene terpolymer (EPDM) rubber. A central downward facingsocket 170 having a concave spherical surface portion is formed in the bottom of thehub 164. In the illustrated embodiment, the socket is a sector comprising approximately 63.5° degrees of arc. Extending radially outward from thehub 164 are four generally flat sheet-like spokes 172 (see also FIG. 5), each oriented so as to have generally upper and lower surfaces. At the proximal end of each spoke, the spoke's upper surface is in contact with an annular downward facingshoulder 176 of thehub 164 radially outboard of thesocket 170. In the exemplary embodiment, the hub may be formed of 303 stainless steel. The spokes may be formed of 302 stainless steel with an exemplary thickness of 0.010 inches (0.25 mm). Each spoke's proximal end is secured to thehub 164 such as by rivets, screws, or other fastening means (not shown). The distal ends of the spokes are secured to anannular rim 178 which may be formed as a flat horizontal 303 stainless steel band to which the spokes are welded or otherwise secured. - 53. With their low profile, the
spokes 172 are resiliently flexible upward and downward so as to permit tilting of the rim, relative to theaxis 300 from the otherwise neutral horizontal orientation. However, the configuration of the spokes makes them substantially inflexible transverse to theaxis 300, so that they effectively transmit torque and rotation about theaxis 300 from thehub 164 to therim 178. Optionally, to increase vertical flexibility without compromising lateral strength and ability to transmit torque, the spokes may each be provided with a transversely extending wave orruffle 180. In the exemplary embodiment, the wave extends two cycles, each cycle having a length of approximately 0.22 inches (5.6 mm) and an amplitude of approximately 0.04 inches (1.0 mm). Three to five spokes are preferred to balance torque transmission and flexibility. - 54. Immediately below the spokes, the backing element includes a rigid, generally disk-shaped, polyethylene terepthalate (PET)
backing plate 182. The backing plate has a centralupward facing projection 184 having a convex spherical surface portion 186 (see also FIG. 6) of equal radius to and in sliding engagement with the concave spherical surface portion of thesocket 170. Interaction of theprojection 184 andsocket 170 can transmit compressive force betweendrive sleeve 120 andbacking element 156 while permitting the backing element to rotate about axes orthogonal to theaxis 300. Thebacking plate 182 has a generally flatlower surface 188 in contact with anupper surface 190 of abody 192 of thedisk holder 158. Theplate 182 extends radially outward to a generallyannular rim section 194. Therim section 194 is secured to theband 178 such as by screws extending through the band. Therim section 194 is also secured to the outer periphery of thecover 166 such as by screws extending through aclamp ring 198 clamping thecover 166 to therim 194. The plate rim 194 carries a generally-annular L-sectionedstainless steel ring 196 in an annular upwardly directed pocket. The pocket is sealed with a PET plug which is flush with thelower surface 188 of thebacking plate 182. - 55. The
disk holder 158, shown in FIG. 4 and in isolated perspective, top, bottom and side views in FIGS. 7A, 7B, 7C and 8, respectively, has a central core orhub region 200 from which radiate six radially-extendingspokes 202. Each spoke has substantially flatlower surface 206. Each spoke has a relatively narrow section extending outward from the core and diverging to form a relativelywide section 208 adjacent anouter perimeter rim 210. In the illustrated embodiment, therim 210 is formed as a generally annular band. Aweb 212 is formed between each adjacent pair ofspokes 202. Each web extends from thecore 200 and terminates at anoutboard edge 218 which is radially recessed from therim 210. Each web has alower surface 214 which is vertically recessed from the lower surfaces of adjacent spokes. Each web also has a flat upper surface that is substantially coplanar with the upper surfaces of the adjacent spokes to form anupper surface 216 of the disk holder which contacts thelower surface 188 of the backing plate. Alternatively, theupper surface 216 of each web may be slightly recessed from the upper surface of the spoke to reduce the effects of slurry trapped between the disk holder and backing element. Associated and aligned with eachweb 212 is a downwardly extending recess 220 (FIGS. 4 and 7) in the upper edge of therim 210. Between eachrecess 220, therim 210 includes aprojection 222 at the outer end of each spoke 202. Theprojections 222 extend above the upper surfaces of the spokes. As shown in FIG. 4, when the disk holder is engaged to the backing plate, eachprojection 222 is received by a corresponding recess orcutout 224 in therim 194 of the backing plate 182 (see FIG. 6). Theprojections 222 fit securely within therecesses 224 to prevent relative rotation of the disk holder and backing element. Radially outward extendingchannels 223 are each defined by an adjacent pair of thespokes 202, thelower surface 214 of theweb 212 between such pair of spokes, and theupper surface 238 of thedisk 82. The role of these channels is described in further detail below. - 56. In the illustrated embodiment, the
core 200,spokes 202,webs 212, and rim 210 are unitarily formed, preferably as a single molding of a polymer material such as PET. - 57. A cylindrical blind bore is formed in the wide section of each spoke 202 adjacent the
rim 210. The bore accommodates acylindrical magnet 230 and is plugged by a polyethylene terepthalate (PET) cylinder. In the illustrated embodiment, the bore extends down from the upper surface 204 of the spoke, and the cylinder is flush with the upper surface of the spoke. Magnetic attraction between themagnets 230 and thering 196 vertically secures the disk holder to the backing element by magnetic attraction. - 58. In each spoke of one diametrically opposed first pair of spokes, a
drive pin 232 depends from the spoke immediately inboard of themagnet 230. When the disk holder is mated to thedisk 82, the drive pins are received by associatedbores 234 in the disk and serve to prevent rotation of the disk relative to the disk holder. The disk 82 (see also FIG. 9) may be formed of nickel-coated carbon steel having thelower surface 84 embedded with diamond particles for an abrasive. The magnets attract the disk, vertically securing the disk to the holding element with theupper surface 238 of the disk contacting the lower surfaces of thespokes 202. - 59. The flat
lower surface 84 of the disk defines adisk plane 302. In a neutral orientation, the disk plane is perpendicular to thelongitudinal axis 300 which extends through the center of the disk. The concave and convex spherical surface portions ofsocket 170 andprojection 184, respectively, have a common center ofcurvature 304 at the intersection of thedisk plane 302 with thelongitudinal axis 300. In operation, with the conditioner head located above the polishing pad as described above, thedrive shaft 86 is caused to rotate, which rotation is transmitted to thedisk 82. Theend effector 80 is then shifted from the retracted position to an extended position to bring thelower surface 84 of the disk into engagement with the polishingsurface 76 of the pad. The downward force compressing the disk against the pad is controlled by modulating the pressure in thepressure chamber 102A. The downward force is transmitted through the drive sleeve, the hub, between the concave and convex spherical surface portions to the backing plate, to the disk holder, and then to the disk. Torque to rotate the disk relative to the pad is supplied from the drive shaft to the drive sleeve, the hub, the spokes, the rim of the backing element, the holder, and then to the disk via the pins. - 60. Precise perpendicular alignment between the
axis 300 and the polishingsurface 76 of the pad is not easily provided. Because of this, it is desirable that at least the disk be able to tilt to maintain its lower surface flat against the polishing surface of the pad as shown in FIG. 10. If the polishing surface of the pad is not perpendicular to theaxis 300, the disk, disk holder and backing element may tilt relative to the axis via sliding of the convex spherical surface of theprojection 184 relative to the concave spherical surface of thesocket 170. Thehub 164 remains fixed relative to theaxis 300. To accommodate the tilt, thespokes 172 flex either upward or downward depending on their location at any given point in time. The location of thecommon center 304 indisk plane 302 minimizes fluctuations in the compression force between the disk and the pad when theend effector 80 tilts to maintain engagement between the end effector and pad. The shear force applied to the disk by friction with the polishing pad is directed in thedisk plane 302 and, thereby, does not exert a moment about thecenter 304 which would otherwise tend to pivot the disk and produce an uneven pressure distribution between the disk and pad. Thecover 166 is free to flex and stretch to accommodate the tilting. - 61. In operation, the lower surface of the
rotating conditioning disk 82, engaged with the polishing surface of the rotating polishing pad, is reciprocated in a path along the rotating polishing pad as described above. During this process, the bottom surface of the disk is immersed in the thin layer of a polishingslurry 299 atop the polishing pad. The rotation of the disk may induce aflow 248 of the polishing slurry longitudinally upward from thelower surface 84 of the disk, through an array ofholes 242 in the disk, and radially outward along the upper surface of the disk through thechannels 223. The flow proceeds outward through radially-extending passageways in therim 210 formed by therecesses 220. Each passageway/recess 220 is generally aligned with an associatedchannel 223. This flow of the slurry may increase the effectiveness of conditioning by helping to evacuate material from the pad surface. - 62. As shown in FIG. 11, for cleaning the
disk 82, the end effector is raised, causing the disk to disengage from the polishing pad. Thecup 66 may then be pivoted to a location below the head and the end effector extended so as to immerse the disk in a cleaning liquid 298 in the cup. The disk is rotated about theaxis 300 within the body of cleaning liquid (the rotation need not have been altered since the disk was engaged to the pad). The rotation causes aflow 250 of the cleaning liquid longitudinally upward from the lower surface of the disk, through theholes 242, through the disk, and radially outward along the upper surface of the disk through thechannels 223. Flow of the cleaning liquid, which may comprise deionized water, serves to clean the disk of contaminants including material worn from the pad, byproducts of the polishing etc. - 63. A number of embodiments of the present invention have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, various features may be adapted for use with a variety of existing or future conditioner and polisher configurations other than those specifically shown. Although the exemplary end effector is shown constructed with particular components, various of the components may be combined or further subdivided. Additionally, various elements of these components or their subcomponents and their associated functions may be shifted to other components. Accordingly, other embodiments are within the scope of the following claims.
Claims (38)
1. A conditioner head for conditioning the polishing surface of a polishing pad, comprising:
a drive element carried for rotation about a longitudinal axis;
a disk backing element for carrying an abrasive disk and holding it in engagement with the polishing pad;
a driven element coupling the disk backing element to the drive element for transmitting torque and rotation therebetween, the driven element longitudinally movable between retracted and extended positions; and
an annular diaphragm spanning a gap between the drive element and the driven element and coupled to the drive element and to the driven element to rotate therewith as a unit.
2. The conditioner head of wherein the diaphragm in part bounds a pressure chamber which may be pressurized to shift the driven element from the retracted position to the extended position and depressurized to shift the driven element from the extended position to the retracted position.
claim 1
3. The conditioner head of wherein during transition between the retracted and extended positions a first surface of the diaphragm, exterior to the pressure chamber, rolls off a generally annular outer surface portion of the driven element, traverses the gap and rolls onto a generally annular inner surface portion of the drive element.
claim 2
4. The conditioner head of wherein:
claim 1
the drive element includes a drive shaft and a collar, the collar being substantially fixed to the drive shaft and having a generally annular inner surface portion;
the driven element includes a drive sleeve encircling at least a length of the drive shaft and having a generally annular outer surface portion; and
the annular diaphragm has an outer periphery and an inner aperture, and is sealingly secured along the outer periphery to the collar and along the inner aperture to the drive sleeve.
5. The conditioner head of wherein:
claim 4
the generally annular outer surface portion of the drive sleeve is a circular cylinder; and
the generally annular inner surface portion of the collar is a circular cylinder.
6. The conditioner head of wherein the diaphragm in part bounds a pressure chamber which may be pressurized to shift the drive sleeve from the retracted position to the extended position and depressurized to shift the drive sleeve from the extended position to the retracted position.
claim 4
7. The conditioner head of wherein during transition between the retracted and extended positions, a first surface of the diaphragm, exterior to the pressure chamber rolls off the generally annular outer surface portion of the drive sleeve, traverses a gap between the generally annular outer surface portion of the drive sleeve and the generally annular inner surface portion of the collar and rolls onto the generally annular inner surface portion of the collar.
claim 6
8. The conditioner head of wherein a fluid for inflating the pressure chamber is introduced to the pressure chamber through a channel in the drive shaft.
claim 7
9. The conditioner head of further comprising a housing substantially rigidly coupled to a conditioner arm for moving the head at least transverse to the longitudinal axis and wherein the housing includes a first portion encircling at least a length of the collar, the first portion coupled to the collar by a bearing system for permitting the collar to rotate relative to the first portion about the longitudinal axis.
claim 7
10. The conditioner head of comprising a web formed at an upper end of the drive shaft, the collar depending from the web and wherein the conditioning head further comprises a pulley substantially fixed to the web for transmitting torque to the drive shaft.
claim 7
11. The conditioner head of wherein the collar comprises a first piece depending from and fixed to the web and a second piece separately formed from the first piece, the second piece engaging the bearing system, wherein the diaphragm is secured along the outer periphery to the collar between the first and second pieces.
claim 7
12. The conditioner head of wherein the diaphragm is partially sandwiched between an outer cylindrical surface of an annular lip depending from the first piece and a generally annular inner surface of the second piece which forms the generally annular inner surface portion of the collar.
claim 11
13. A disk holder for holding a conditioning disk for conditioning a polishing pad, comprising:
a lower face for engaging an upper surface of the conditioning disk and defining a plurality of generally radially outward extending channels along the upper surface of the conditioning disk.
14. The disk holder of further comprising:
claim 13
a central region;
an outer perimeter;
a plurality of radially extending spokes, extending from the central region to the outer perimeter, each said spoke having a lower surface for engaging the upper surface of the conditioning disk; and
a plurality of webs, one such web between each adjacent pair of said spokes, each web having a lower surface at least partially vertically recessed from the lower surfaces of the adjacent spokes so as to define one said channel.
15. The disk holder of wherein each web extends from the central region and terminates at an outboard edge, radially recessed from the outer perimeter.
claim 14
16. The disk holder of wherein the outer perimeter is formed as a rim and wherein the rim has a plurality of radially extending passageways, each passage generally aligned with an associated one of the channels for permitting flow radially outward through the passageway from the associated channel when the disk holder and disk are rotated about a central longitudinal axis while at least a lower surface of the disk is exposed to a liquid.
claim 15
17. The disk holder of wherein each of the radially extending passageways is formed as a downwardly extending recess in the rim.
claim 16
18. The disk holder of wherein the conditioning disk is readily securable to and removable from the disk holder and each spoke carries a magnet for attracting the conditioning disk.
claim 14
19. The disk holder of wherein the conditioning disk is readily securable to and removable from the disk holder, and the disk holder is readily securable to and removable from a rotating fixture wherein each spoke carries a magnet for securing the conditioning disk to the disk holder and for securing the disk holder to the rotating fixture.
claim 14
20. The disk holder of further comprising a first pin depending from a first one of said spokes and a second pin depending from a second one of said spokes, the first and second pins receivable by the conditioning disk for preventing rotation of the conditioning disk relative to the disk holder.
claim 14
21. The disk holder of wherein the central region, outer perimeter, said spokes and said webs are unitarily formed as a single piece of material.
claim 14
22. The disk holder of wherein each one of said spokes has a relatively narrow section extending outward from the central region and joining a relatively wider section adjacent the outer perimeter.
claim 21
23. The disk holder of wherein each one of said webs has an upper surface, substantially coplanar with the upper surfaces of adjacent ones of said spokes.
claim 21
24. A disk holder for holding a conditioning disk used with a conditioner head of an apparatus for conditioning the polishing surface of a polishing pad, the disk holder comprising:
a lower surface magnetically engageable with an upper surface of the disk; and
an upper surface magnetically engageable with a lower surface of the conditioner head.
25. The disk holder of further comprising:
claim 24
a plurality of magnets securing the disk to the disk holder and securing the disk holder to the conditioner head.
26. A conditioner head for conditioning a polishing surface of a polishing pad, comprising:
an abrasive disk having a lower surface defining a disk plane;
a driven element carried for rotation about a longitudinal axis; and
a disk backing element to carry the disk, hold it in engagement with the polishing pad and apply force and torque to it, the disk backing element including:
an upper member fixed to the driven element and having a central downward facing socket having a spherical surface portion;
a lower member fixed to the abrasive disk, and having a central upward facing projection having a spherical surface portion in sliding engagement with the spherical surface portion of the socket; and
at least one resilient member, coupling the upper member to the lower member so as to bias the lower member toward a neutral orientation wherein the disk plane is perpendicular to the longitudinal axis, while permitting tilting of the disk plane relative to the longitudinal axis and transmitting rotation from the driven element to the disk, said tilting causing relative sliding of the respective spherical surface portions of the projection and socket.
27. A conditioner head for conditioning a polishing surface of a polishing pad, comprising:
a driven element for rotating an abrasive disk having a surface defining a disk plane about a longitudinal axis so as to apply a force and a torque to the disk as it engages the polishing pad;
a first member fixed to the driven element and having a socket having a concave surface portion;
a second member having a projection having a convex surface portion in sliding engagement with the concave surface portion of the socket; and
at least one resilient member coupling the first member to the second member so as to bias the second member toward an orientation wherein the disk plane is substantially perpendicular to the longitudinal axis, while permitting tilting of the disk plane relative to the longitudinal axis and transmitting rotation from the driven element to the disk, said tilting causing relative sliding of the respective convex and concave surface portions of the projection and socket.
28. The conditioner head of wherein:
claim 27
the first member comprises a central hub; and
the at least one resilient member comprises a plurality of radially extending spokes, extending radially outward from the central hub, each said spoke upwardly and downwardly flexible for permitting tilting of the disk plane relative to the longitudinal axis while transmitting rotation from the driven element to the disk.
29. The conditioner head of wherein the respective concave and convex surface portion of the socket and projection are spherical surface portions and have a common center lying substantially within the disk plane.
claim 27
30. The conditioner head of wherein the second member is generally disk-shaped.
claim 27
31. The conditioner head of further comprising: a protective membrane extending from an inner aperture to an outer periphery and covering the at least one resilient member so as to prevent contaminants from falling into the at least one resilient member.
claim 27
32. A conditioner head for conditioning a polishing surface of a polishing pad using an abrasive conditioning disk, comprising:
a drive element carried for rotation about a longitudinal axis; and
a disk backing element for holding and applying force and torque to the abrasive conditioning disk, including:
a central hub fixed to the drive element;
an outer rim generally defining a rim plane; and
a plurality of radially extending spokes extending from the central hub to the outer rim, each said spoke upwardly and downwardly flexible for permitting tilting of the rim plane relative to the longitudinal axis while transmitting rotation from the drive element to the rim to apply torque to the conditioning disk.
33. The conditioner head of wherein each spoke has a transversely extending wave for increasing the flexibility of the spoke.
claim 32
34. The conditioner head of wherein the spokes are formed of steel.
claim 32
35. The conditioner head of further comprising a plate having a central upward facing projection having a spherical surface portion, and wherein the hub has a central, downward facing socket having a spherical surface portion in sliding engagement with the spherical surface portion of the projection.
claim 32
36. A process for conditioning a polishing pad having a polishing surface, comprising:
providing an abrasive conditioning disk carried by a disk carrier and having a lower surface engageable with the polishing surface of the polishing pad;
causing the carrier to rotate the conditioning disk and bring the lower surface of the conditioning disk into engagement with the polishing surface of the polishing pad;
causing the carrier to reciprocate in a path along the rotating polishing pad;
causing the carrier to disengage the conditioning disk from the polishing pad; and
causing the carrier to rotate the conditioning disk and introduce the conditioning disk to a body of cleaning liquid so as to cause a flow of the cleaning liquid longitudinally upward from the lower surface of the conditioning disk, through the conditioning disk, and radially outward along an upper surface of the conditioning disk so as to clean the conditioning disk.
37. The process of further comprising:
claim 36
applying a second liquid to the polishing surface of the polishing pad; and
permitting the second liquid to flow up through the lower surface of the conditioning disk, through the conditioning disk and radially outward along the upper surface of the conditioning disk when the conditioning disk is engaged with the polishing surface of the polishing pad.
38. The process of wherein the flow of the cleaning liquid along the upper surface of the conditioning disk is through a plurality of generally radially outwardly extending channels defined by a disk holder.
claim 36
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/746,710 US6361423B2 (en) | 1998-03-31 | 2000-12-22 | Chemical mechanical polishing conditioner |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/052,798 US6200199B1 (en) | 1998-03-31 | 1998-03-31 | Chemical mechanical polishing conditioner |
US09/746,710 US6361423B2 (en) | 1998-03-31 | 2000-12-22 | Chemical mechanical polishing conditioner |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/052,798 Division US6200199B1 (en) | 1998-03-31 | 1998-03-31 | Chemical mechanical polishing conditioner |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010001301A1 true US20010001301A1 (en) | 2001-05-17 |
US6361423B2 US6361423B2 (en) | 2002-03-26 |
Family
ID=21979961
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/052,798 Expired - Lifetime US6200199B1 (en) | 1998-03-31 | 1998-03-31 | Chemical mechanical polishing conditioner |
US09/746,710 Expired - Fee Related US6361423B2 (en) | 1998-03-31 | 2000-12-22 | Chemical mechanical polishing conditioner |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/052,798 Expired - Lifetime US6200199B1 (en) | 1998-03-31 | 1998-03-31 | Chemical mechanical polishing conditioner |
Country Status (6)
Country | Link |
---|---|
US (2) | US6200199B1 (en) |
EP (1) | EP1068046A2 (en) |
JP (1) | JP2002509811A (en) |
KR (1) | KR100536513B1 (en) |
TW (1) | TW411291B (en) |
WO (1) | WO1999050022A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019089467A1 (en) * | 2017-11-06 | 2019-05-09 | Axus Technology, Llc | Planarized membrane and methods for substrate processing systems |
CN113183031A (en) * | 2021-05-20 | 2021-07-30 | 杭州众硅电子科技有限公司 | Dressing head rotating part, polishing pad dressing head and dresser |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6123612A (en) | 1998-04-15 | 2000-09-26 | 3M Innovative Properties Company | Corrosion resistant abrasive article and method of making |
KR19990081117A (en) * | 1998-04-25 | 1999-11-15 | 윤종용 | CMP Pad Conditioning Disc and Conditioner, Manufacturing Method, Regeneration Method and Cleaning Method of the Disc |
US6554314B1 (en) * | 1999-02-03 | 2003-04-29 | Takata Corporation | Protective cushion for vehicle occupant's head |
US6302772B1 (en) * | 1999-04-01 | 2001-10-16 | Mitsubishi Materials Corporation | Apparatus and method for dressing a wafer polishing pad |
JP2000343407A (en) * | 1999-06-08 | 2000-12-12 | Ebara Corp | Dressing device |
US6589876B1 (en) | 1999-07-22 | 2003-07-08 | Micron Technology, Inc. | Methods of forming conductive capacitor plugs, methods of forming capacitor contact openings, and methods of forming memory arrays |
TW458853B (en) * | 2000-07-14 | 2001-10-11 | Applied Materials Inc | Diaphragm for a CMP machine |
ITCA20010001A1 (en) * | 2001-01-19 | 2002-07-19 | Commersald S P A | APPARATUS TO SHARP OBJECTS |
US6368186B1 (en) * | 2001-01-19 | 2002-04-09 | Taiwan Semiconductor Manufacturing Company, Ltd | Apparatus for mounting a rotational disk |
JP4072810B2 (en) * | 2001-01-19 | 2008-04-09 | 株式会社荏原製作所 | Dressing apparatus and polishing apparatus provided with the dressing apparatus |
US6461441B1 (en) * | 2001-05-09 | 2002-10-08 | Speedfam-Ipec Corporation | Method of removing debris from cleaning pads in work piece cleaning equipment |
KR100449630B1 (en) * | 2001-11-13 | 2004-09-22 | 삼성전기주식회사 | Apparatus for conditioning a polishing pad used in a chemical-mechanical polishing system |
US20030109204A1 (en) * | 2001-12-06 | 2003-06-12 | Kinik Company | Fixed abrasive CMP pad dresser and associated methods |
TWI260256B (en) * | 2002-03-25 | 2006-08-21 | Thomas West Inc | Conditioner and conditioning methods for smooth pads |
US6949016B1 (en) * | 2002-03-29 | 2005-09-27 | Lam Research Corporation | Gimballed conditioning apparatus |
AU2003218477A1 (en) * | 2002-04-02 | 2003-10-20 | Rodel Holdings, Inc. | Composite conditioning tool |
US7367872B2 (en) * | 2003-04-08 | 2008-05-06 | Applied Materials, Inc. | Conditioner disk for use in chemical mechanical polishing |
US6905399B2 (en) * | 2003-04-10 | 2005-06-14 | Applied Materials, Inc. | Conditioning mechanism for chemical mechanical polishing |
US6887138B2 (en) * | 2003-06-20 | 2005-05-03 | Freescale Semiconductor, Inc. | Chemical mechanical polish (CMP) conditioning-disk holder |
US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
US20050181711A1 (en) * | 2004-02-12 | 2005-08-18 | Alexander Starikov | Substrate confinement apparatus and method |
US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
US6945857B1 (en) | 2004-07-08 | 2005-09-20 | Applied Materials, Inc. | Polishing pad conditioner and methods of manufacture and recycling |
US7040954B1 (en) | 2004-09-28 | 2006-05-09 | Lam Research Corporation | Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing |
US7066795B2 (en) * | 2004-10-12 | 2006-06-27 | Applied Materials, Inc. | Polishing pad conditioner with shaped abrasive patterns and channels |
US7402520B2 (en) * | 2004-11-26 | 2008-07-22 | Applied Materials, Inc. | Edge removal of silicon-on-insulator transfer wafer |
KR20080033368A (en) * | 2005-07-09 | 2008-04-16 | 티비더블유 인더스트리즈, 인코포레이티드 | Enhanced end effector arm arrangement for cmp pad conditioning |
US7270303B1 (en) * | 2005-09-21 | 2007-09-18 | The United States of America as repesented by the Secretary of the Air Force | Pincer apparatus for nanosat transport across a satellite |
US7354413B2 (en) * | 2005-11-02 | 2008-04-08 | Fisher Robert C | Device for treating foot drop |
US7749048B2 (en) * | 2006-05-19 | 2010-07-06 | Applied Materials, Inc. | Polishing pad conditioning process |
US20080070485A1 (en) * | 2006-09-14 | 2008-03-20 | United Microelectronics Corp. | Chemical mechanical polishing process |
US7815495B2 (en) * | 2007-04-11 | 2010-10-19 | Applied Materials, Inc. | Pad conditioner |
KR200453313Y1 (en) | 2008-09-03 | 2011-04-20 | 그린스펙(주) | retainer ring for chemical mechanical polishing |
JP5236515B2 (en) | 2009-01-28 | 2013-07-17 | 株式会社荏原製作所 | Dressing apparatus, chemical mechanical polishing apparatus and method |
CN101972988B (en) * | 2010-06-28 | 2012-05-16 | 清华大学 | Trimming head for polishing pad |
US9149906B2 (en) | 2011-09-07 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for CMP pad conditioning |
JP5919157B2 (en) * | 2012-10-01 | 2016-05-18 | 株式会社荏原製作所 | dresser |
TWI511841B (en) * | 2013-03-15 | 2015-12-11 | Kinik Co | Stick-type chemical mechanical polishing conditioner and manufacturing method thereof |
JP6254383B2 (en) * | 2013-08-29 | 2017-12-27 | 株式会社荏原製作所 | Dressing apparatus, chemical mechanical polishing apparatus including the dressing apparatus, and dresser disk used therefor |
JP6342198B2 (en) * | 2014-03-31 | 2018-06-13 | 株式会社荏原製作所 | Cover for constituent parts of polishing apparatus, constituent parts of polishing apparatus, and polishing apparatus |
JP6592355B2 (en) | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | Connecting mechanism and substrate polishing apparatus |
CN108857858A (en) * | 2017-05-15 | 2018-11-23 | 株式会社荏原制作所 | Device and method, Wafer Backside Cleaning device and the substrate board treatment at the back side of cleaning base plate |
KR101951186B1 (en) * | 2017-11-07 | 2019-02-25 | 한국생산기술연구원 | Conditioner of chemical mechanical polishing apparatus for uniform-wearing of polishing pad |
KR102128772B1 (en) * | 2018-11-29 | 2020-07-01 | 한국생산기술연구원 | Conditioning device for cmp equipment |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1466545A (en) | 1974-03-26 | 1977-03-09 | Nederman B | Abrasive disc |
FR2523892A1 (en) | 1982-03-26 | 1983-09-30 | Procedes Equip Sciences Ind | IMPROVEMENTS ON TURNING POLISHING MACHINES |
US5081051A (en) | 1990-09-12 | 1992-01-14 | Intel Corporation | Method for conditioning the surface of a polishing pad |
DE9016249U1 (en) | 1990-11-29 | 1992-04-02 | Vorwerk & Co Interholding Gmbh, 5600 Wuppertal | Floor care work disc that can be clipped onto the drive plate of a floor care device |
US5245796A (en) | 1992-04-02 | 1993-09-21 | At&T Bell Laboratories | Slurry polisher using ultrasonic agitation |
US5216843A (en) | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5433650A (en) | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
US5374146A (en) * | 1993-08-10 | 1994-12-20 | Ring Screw Works | Bolt including a cleaning thread point tip |
US5456627A (en) | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
US5423558A (en) | 1994-03-24 | 1995-06-13 | Ipec/Westech Systems, Inc. | Semiconductor wafer carrier and method |
US5575707A (en) | 1994-10-11 | 1996-11-19 | Ontrak Systems, Inc. | Polishing pad cluster for polishing a semiconductor wafer |
US5908530A (en) | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US5569062A (en) * | 1995-07-03 | 1996-10-29 | Speedfam Corporation | Polishing pad conditioning |
US5762544A (en) * | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5804507A (en) * | 1995-10-27 | 1998-09-08 | Applied Materials, Inc. | Radially oscillating carousel processing system for chemical mechanical polishing |
US5683289A (en) * | 1996-06-26 | 1997-11-04 | Texas Instruments Incorporated | CMP polishing pad conditioning apparatus |
US6036587A (en) * | 1996-10-10 | 2000-03-14 | Applied Materials, Inc. | Carrier head with layer of conformable material for a chemical mechanical polishing system |
EP0868976A3 (en) | 1997-03-06 | 2000-08-23 | Keltech Engineering | Lapping apparatus and method for high speed lapping with a rotatable abrasive platen |
US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6036583A (en) * | 1997-07-11 | 2000-03-14 | Applied Materials, Inc. | Conditioner head in a substrate polisher and method |
US6080050A (en) * | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6033290A (en) * | 1998-09-29 | 2000-03-07 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
-
1998
- 1998-03-31 US US09/052,798 patent/US6200199B1/en not_active Expired - Lifetime
-
1999
- 1999-03-23 TW TW088104576A patent/TW411291B/en not_active IP Right Cessation
- 1999-03-25 JP JP2000540970A patent/JP2002509811A/en active Pending
- 1999-03-25 WO PCT/US1999/006300 patent/WO1999050022A2/en active IP Right Grant
- 1999-03-25 KR KR10-2000-7010863A patent/KR100536513B1/en not_active IP Right Cessation
- 1999-03-25 EP EP99914989A patent/EP1068046A2/en not_active Withdrawn
-
2000
- 2000-12-22 US US09/746,710 patent/US6361423B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019089467A1 (en) * | 2017-11-06 | 2019-05-09 | Axus Technology, Llc | Planarized membrane and methods for substrate processing systems |
US11685012B2 (en) | 2017-11-06 | 2023-06-27 | Axus Technology, Llc | Planarized membrane and methods for substrate processing systems |
CN113183031A (en) * | 2021-05-20 | 2021-07-30 | 杭州众硅电子科技有限公司 | Dressing head rotating part, polishing pad dressing head and dresser |
Also Published As
Publication number | Publication date |
---|---|
US6361423B2 (en) | 2002-03-26 |
WO1999050022A3 (en) | 2000-03-09 |
KR20010042314A (en) | 2001-05-25 |
WO1999050022A2 (en) | 1999-10-07 |
EP1068046A2 (en) | 2001-01-17 |
JP2002509811A (en) | 2002-04-02 |
TW411291B (en) | 2000-11-11 |
KR100536513B1 (en) | 2005-12-14 |
US6200199B1 (en) | 2001-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6200199B1 (en) | Chemical mechanical polishing conditioner | |
US6299511B1 (en) | Chemical mechanical polishing conditioner | |
US7367872B2 (en) | Conditioner disk for use in chemical mechanical polishing | |
KR100315722B1 (en) | Polishing machine for flattening substrate surface | |
US6165058A (en) | Carrier head for chemical mechanical polishing | |
US6729943B2 (en) | System and method for controlled polishing and planarization of semiconductor wafers | |
US6241585B1 (en) | Apparatus and method for chemical mechanical polishing | |
US7419420B2 (en) | Substrate holding mechanism, substrate polishing apparatus and substrate polishing method | |
US9751189B2 (en) | Compliant polishing pad and polishing module | |
US6409580B1 (en) | Rigid polishing pad conditioner for chemical mechanical polishing tool | |
JP2004517479A (en) | System and method for polishing and planarizing a semiconductor wafer using a reduced surface area polishing pad and a variable partial pad-wafer overlap technique | |
JP2001526969A (en) | Carrier head with removable retainer ring for chemical mechanical polishing equipment | |
JP4750250B2 (en) | Carrier head with modified flexible membrane | |
US6217429B1 (en) | Polishing pad conditioner | |
US6419559B1 (en) | Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet | |
US6935938B1 (en) | Multiple-conditioning member device for chemical mechanical planarization conditioning | |
US6949016B1 (en) | Gimballed conditioning apparatus | |
US20020016136A1 (en) | Conditioner for polishing pads | |
US10784113B2 (en) | Chemical mechanical polishing apparatus | |
US6368186B1 (en) | Apparatus for mounting a rotational disk | |
US6821190B1 (en) | Static pad conditioner | |
KR20000008937A (en) | Method and apparatus for polishing wafer | |
KR20030030630A (en) | an apparatus for polishing semiconductor wafer | |
JP2000254856A (en) | Polishing device and polishing method | |
KR20010039710A (en) | Carrier head with a modified flexible membrane |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20140326 |