US1844928A - Copper oxide rectifier - Google Patents
Copper oxide rectifier Download PDFInfo
- Publication number
- US1844928A US1844928A US223019A US22301927A US1844928A US 1844928 A US1844928 A US 1844928A US 223019 A US223019 A US 223019A US 22301927 A US22301927 A US 22301927A US 1844928 A US1844928 A US 1844928A
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- US
- United States
- Prior art keywords
- electrolyte
- layer
- copper oxide
- copper
- oxidized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 title description 6
- 239000005751 Copper oxide Substances 0.000 title description 6
- 229910000431 copper oxide Inorganic materials 0.000 title description 6
- 239000003792 electrolyte Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000010425 asbestos Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000011244 liquid electrolyte Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000012047 saturated solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/16—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising cuprous oxide or cuprous iodide
- H01L21/161—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate, reduction treatment
- H01L21/165—Reduction of the copper oxide, treatment of the oxide layer
Definitions
- One object of my invention is to provide means by which an electrolytic process may be racticed at the surface of a material wit out subjecting it to too intimate or too 1 prolonged contact with the electrolyte.
- Another object of my invention is to provide means for electrolytically affecting the surface of a porous material without permitting an appreciable impregnation of the material by the electrol te.
- a further object o my invention is to provide means by which the surface of an oxidized copper electrode may be reduced by electrolysis without permittlng the electrode to become saturated with the electrolyte.
- igure 1 is a dia rammatic side elevation of an apparatus em odying one form of my invention.
- Fig. 2 is a diagrammatic representation of another embodiment thereof.
- the above-mentioned diflicult is avoided by subjecting the oxidized sur aces to electrolytic action, not by immersing them in a liquid electrolyte, as is the common process in the electrolytic art generally, but by placing them in contact with a pad of asbestos, or other 'chemically inert fibrous material, which is impregnated to a rcater or less degree, by the electrolyte. 5y this means, the oxide surface never comes in contact with any large amount ofyfree liquid, and it has been found that the penetration of liquid through the oxide layer is practically avoided. Referring particularly to Fig.
- a blank of copper 1, having a surface layer 2 of oxide thereon, is connected to the negative terminal 3 of a source of current 4.
- a pad 5 which may be of woven asbestos partially saturated with an electrolyte, such as a saturated solution of potassium fluoride, by previously dipping it in the latter. It may be found desirable to partially dry out this pad.
- an electrode 6 which may, for example, be of graphite, or other chemically inert conductor which is connected to the positive terminal 7 of the source 4.
- Any suitable current regulator 8 may be provided to adjust the density of current taking part in the electrolytic process. I have found 0.2 to 0.5 amperes per square centimeter to be a suitable density.
- the blank 1 should be kept in contact with the pad only so long as is necessary to affect a reduction of the surface of the layer 2 of the metallic condition.
- a member 11 which may, for convenience, hereinafter be termed a brush.
- This member 11 comprises a core 12, which may be of woven asbestos, clamped in a conducting collar 13.
- the end of the brush 12 remote from the oxide layer may be dipped into a container 14 filled with an electrolyte 15.
- the member 12 acts as a wick and conductsthe electrolyte l5 downward to its lower end 16, as shown in the drawing.
- the end 16 may then be rubbed over'the surface of layer 2 until the required reduction has taken place thereon. By this means, the impregnation of the electrolyte into the surface of the layler 2 is prevented.
- ahigher current density than that which is usual in electrol tic processes may be employed.
- a density of ten amperes per square centimeter has been found to give satisfactor results.
- Apparatus including a cathode faced with copper oxide, an absorbent body serving as an anode and impregnated with electrolyte and movable over the face of the copper oxide, the electrolyte being of such a character as to yield hydrogen ions at the copper oxide surface, and electrical supply means for the electrodes.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Feb. 9, 1932. J. SLEPIAN 1,844,928
I COPPER OXIDE RECTIFIER Filed Sept. 30, 1921 INVENTOR J05 6,0/2 J/6P/C7/7 ATTORNWEY Patented Feb. 9, 1932 UNITED STATES PATENT OFFICE JOSEPH BLEPIAN, OI PITTSBURGH, PENNSYLVANIA, ASSIGNOB TO WESTINGHOUSE ELECTRIC & MANUFACTURING COMPANY, A CORPORATION 01' PENNSYLVANIA COPPER OXIDE RECTIFIER Application fled September 80, 1927. Serial 110.223.019.
surfaces of electrode materials.
One object of my invention is to provide means by which an electrolytic process may be racticed at the surface of a material wit out subjecting it to too intimate or too 1 prolonged contact with the electrolyte.
Another object of my invention is to provide means for electrolytically affecting the surface of a porous material without permitting an appreciable impregnation of the material by the electrol te.
A further object o my invention is to provide means by which the surface of an oxidized copper electrode may be reduced by electrolysis without permittlng the electrode to become saturated with the electrolyte.
Other objects of my invention will become evident through reading the following specification, taken in connection with the drawin s wherein:
igure 1 is a dia rammatic side elevation of an apparatus em odying one form of my invention, and
Fig. 2 is a diagrammatic representation of another embodiment thereof.
In connection with the manufacture of oxidized copper blanks to be assembled into rectifiers of the thin-layer type, it has been desirable to reduce the outer surface of an oxidized layer by making it the negative electrode in an electrolytic cell containing dilute acid or other electrolyte. Such an oxidized surface is very likely to contain numerous cracks and pores, and difficulty arises from the fact that the electrolyte may penetrate these pores and thereb make contact with the mother copper eneath the oxide layer. This results in an increase of the inverse current through the resulting rectifier units and is undesirable.
In accordance with my invention, the above-mentioned diflicult is avoided by subjecting the oxidized sur aces to electrolytic action, not by immersing them in a liquid electrolyte, as is the common process in the electrolytic art generally, but by placing them in contact with a pad of asbestos, or other 'chemically inert fibrous material, which is impregnated to a rcater or less degree, by the electrolyte. 5y this means, the oxide surface never comes in contact with any large amount ofyfree liquid, and it has been found that the penetration of liquid through the oxide layer is practically avoided. Referring particularly to Fig. 1, a blank of copper 1, having a surface layer 2 of oxide thereon, is connected to the negative terminal 3 of a source of current 4. Upon the layer 2 is laid a pad 5 which may be of woven asbestos partially saturated with an electrolyte, such as a saturated solution of potassium fluoride, by previously dipping it in the latter. It may be found desirable to partially dry out this pad. On top of the pad is laid an electrode 6 which may, for example, be of graphite, or other chemically inert conductor which is connected to the positive terminal 7 of the source 4. Any suitable current regulator 8 may be provided to adjust the density of current taking part in the electrolytic process. I have found 0.2 to 0.5 amperes per square centimeter to be a suitable density. The blank 1 should be kept in contact with the pad only so long as is necessary to affect a reduction of the surface of the layer 2 of the metallic condition.
Referring to the modification of my invention shown in Fig. 2, a copper blank 1, having a layer 2 of oxide formed thereon, is supported on a conductor 9 of any suitable material which is connected to the negative terminal 3 of a source of current 4. Connected to the positive terminal 7 of source 4, is a member 11 which may, for convenience, hereinafter be termed a brush. This member 11 comprises a core 12, which may be of woven asbestos, clamped in a conducting collar 13. The end of the brush 12 remote from the oxide layer may be dipped into a container 14 filled with an electrolyte 15. The member 12 acts as a wick and conductsthe electrolyte l5 downward to its lower end 16, as shown in the drawing. The end 16 may then be rubbed over'the surface of layer 2 until the required reduction has taken place thereon. By this means, the impregnation of the electrolyte into the surface of the layler 2 is prevented. I have found that, with t is method, ahigher current density than that which is usual in electrol tic processes may be employed. For examp e, a density of ten amperes per square centimeter has been found to give satisfactor results. At present, I regard the effect the heat developed at the surface in drying out the electrolyte before it can penetrate the pores of the material, as furnishing a probable explanation of the desirable results obtained. Because of the rectifying action of the junction between the oxidized copper and the mother metal, an alternating electromotive force may be substituted for the direct-current sources above described, if it is desired to do so.
It will be evident that, while I have described this electrolytic process in connection with electrolytic reduction of a surface of oxidized copper, it is broadly applicable to many other electrochemical processes, such as metallic deposition, as will be evident to those skilled in the art. I desire, therefore,
that the following claims be given the broadest interpretation of which they are susceptible in view of their expressed terms and of the prior art.
so I claim as my invention:
1. The method of producing a conductive layer on the surface of an oxidized cop r disc which consists in connecting said isc to one terminal of a source of electric current and placing it in contact with a fibrous ad impregnated with an electrolyte adapte to yield reducing ions when connected to the other terminal of said source.
2. Apparatus including a cathode faced with copper oxide, an absorbent body serving as an anode and impregnated with electrolyte and movable over the face of the copper oxide, the electrolyte being of such a character as to yield hydrogen ions at the copper oxide surface, and electrical supply means for the electrodes.
3. In a method of preparing a conductor having a uni-lateral electric conductivity, the steps of electrolytically reducing the surface of an oxidized layer at such a current density as to vaporize all electrolyte making contact with said layer before it has time to penetrate through said layer.
In testimony whereof, I have hereunto subscribed my name this 21st day of Septemen,
JOSEPH SLEPIAN.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US223019A US1844928A (en) | 1927-09-30 | 1927-09-30 | Copper oxide rectifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US223019A US1844928A (en) | 1927-09-30 | 1927-09-30 | Copper oxide rectifier |
Publications (1)
Publication Number | Publication Date |
---|---|
US1844928A true US1844928A (en) | 1932-02-09 |
Family
ID=22834671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US223019A Expired - Lifetime US1844928A (en) | 1927-09-30 | 1927-09-30 | Copper oxide rectifier |
Country Status (1)
Country | Link |
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US (1) | US1844928A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2421735A (en) * | 1940-04-27 | 1947-06-03 | Clarence O Prest | Method of electrolytically reproducing prints or designs |
US2492214A (en) * | 1945-10-25 | 1949-12-27 | Douglass C Fonda | Method of marking tungsten carbide |
US3208923A (en) * | 1965-09-28 | Method and apparatus for electrolytic etching | ||
US3340171A (en) * | 1963-02-14 | 1967-09-05 | Corning Glass Works | Method for electrophoretic separation of materials in a localized area |
-
1927
- 1927-09-30 US US223019A patent/US1844928A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3208923A (en) * | 1965-09-28 | Method and apparatus for electrolytic etching | ||
US2421735A (en) * | 1940-04-27 | 1947-06-03 | Clarence O Prest | Method of electrolytically reproducing prints or designs |
US2492214A (en) * | 1945-10-25 | 1949-12-27 | Douglass C Fonda | Method of marking tungsten carbide |
US3340171A (en) * | 1963-02-14 | 1967-09-05 | Corning Glass Works | Method for electrophoretic separation of materials in a localized area |
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