US11432413B2 - Multi-layer vent for increased airflow and EMI shielding in an information handling system - Google Patents
Multi-layer vent for increased airflow and EMI shielding in an information handling system Download PDFInfo
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- US11432413B2 US11432413B2 US16/866,325 US202016866325A US11432413B2 US 11432413 B2 US11432413 B2 US 11432413B2 US 202016866325 A US202016866325 A US 202016866325A US 11432413 B2 US11432413 B2 US 11432413B2
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- structures
- contact area
- plate
- base opening
- vent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0041—Ventilation panels having provisions for screening
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- This disclosure relates generally to information handling systems and, more particularly, to vents for improved airflow and electromagnetic interference (EMI) shielding of an information handling system.
- EMI electromagnetic interference
- An information handling system generally processes, compiles, stores, and communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information.
- information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated.
- the variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications.
- information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
- Examples of information handling systems include servers, gaming systems, desktop computers, and may include other information handling systems such as laptop computers and media players.
- Components in a chassis of an information handling system may generate heat and electromagnetic energy.
- a common approach for cooling information handling systems is to generate an airflow in the chassis to facilitate convective heat transfer from the components. The airflow flows through the chassis and is heated by the components, and the heated airflow exits the chassis to the ambient environment through a vent. The vent is formed to allow the heated air to flow out of the chassis and also to reduce the amount of electromagnetic energy to exit the vent.
- components increase in their performance capabilities, they generate more heat and more electromagnetic energy, and as information handling systems increase in complexity, more airflow is needed to cool the components and more EMI shielding is necessary.
- a vent in a chassis of an information handling system may be configured to decrease airflow impedance and increase electromagnetic interference (EMI) shielding.
- EMI electromagnetic interference
- a vent for an information handling system includes two plates, wherein each plate comprises a plurality of structures.
- Each structure comprises a base opening having a first set of dimensions, a contact area having a second set of dimensions smaller than the first set of dimensions, and at least one wall extending at an angle between the base opening and the contact area. Joining the contact areas of the first plate with the contact areas of the second plate forms a vent with an increased open percentage for lower airflow impedance and increased EMI shielding.
- each structure is formed with a single curved or arcuate wall, forming a conical, frustoconical shape or spherical shape. In some embodiments, each structure is formed with three or four flat walls, forming a pyramidal shape.
- a wall may extend at an angle of between 15-75 degrees relative to a plate. In some embodiments, a wall may extend at an angle between 30-60 degrees relative to a plate.
- a wall has a plurality of holes for decreased airflow impedance.
- the size and shape of each hole and the number of holes on a wall may be configured to maximize airflow through a plate.
- the open percentage of a plate may depend on one or more of the number and shape of the plurality of structures extending from the plate, the angle of each wall relative to the plate, and the number and size of the holes on each wall.
- FIG. 1 is a block diagram of selected elements of an embodiment of an information handling system
- FIG. 2 is a front view of vent for an information handling system with a plurality of openings separated by a plurality of ribs;
- FIG. 3 is a perspective view of one embodiment of a multi-layered vent for an information handling system
- FIG. 4 is a perspective view of one embodiment of a multi-layered vent for an information handling system
- FIG. 5A depicts a side view of a first plate of a multi-layered vent
- FIG. 5B depicts a side view of a plate of a multi-layered vent, illustrating a method for forming a plurality of structures on the plate;
- FIG. 5C depicts a side view of first and second plates such as depicted in FIG. 5B , illustrating contact areas of a first plate positioned relative to contact areas of a second plate;
- FIG. 5D depicts a side view of one embodiment of a vent formed by first and second plates with joined contact areas.
- an information handling system may include an instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize various forms of information, intelligence, or data for business, scientific, control, entertainment, or other purposes and contained in a chassis.
- an information handling system may be a laptop computer, a consumer electronic device, a network storage device, or another suitable device contained in a chassis and may vary in size, shape, performance, functionality, and price.
- the information handling system may include memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic.
- Additional components of the information handling system may include one or more storage devices, one or more communications ports for communicating with external devices as well as various input and output (I/O) devices, such as a keyboard, a mouse, and a video display.
- the information handling system may also include one or more buses operable to transmit communication between the various hardware components.
- FIGS. 1-4 and 5A-5D Particular embodiments may be best understood by reference to FIGS. 1-4 and 5A-5D , wherein like numbers are used to indicate like and corresponding parts.
- FIG. 1 illustrates a block diagram depicting selected elements of an embodiment of an information handling system 100 enclosed in chassis 110 with vent 112 .
- components of information handling system 100 may include, but are not limited to, processor subsystem 120 , which may comprise one or more processors, and system bus 121 that communicatively couples various system components to processor subsystem 120 including, for example, a memory subsystem 130 , an I/O subsystem 140 , a local storage resource 150 and a network interface 160 .
- processor subsystem 120 may comprise a system, device, or apparatus operable to interpret and execute program instructions and process data, and may include a microprocessor, microcontroller, digital signal processor (DSP), application specific integrated circuit (ASIC), or other digital or analog circuitry configured to interpret and execute program instructions and process data.
- processor subsystem 120 may interpret and execute program instructions and process data stored locally (e.g., in memory subsystem 130 ). In the same or alternative embodiments, processor subsystem 120 may interpret and execute program instructions and process data stored remotely (e.g., in a network storage resource).
- System bus 121 may represent a variety of suitable types of bus structures, e.g., a memory bus, a peripheral bus, or a local bus using various bus architectures in selected embodiments.
- bus architectures may include, but are not limited to, Micro Channel Architecture (MCA) bus, Industry Standard Architecture (ISA) bus, Enhanced ISA (EISA) bus, Peripheral Component Interconnect (PCI) bus, PCI-Express bus, HyperTransport (HT) bus, and Video Electronics Standards Association (VESA) local bus.
- MCA Micro Channel Architecture
- ISA Industry Standard Architecture
- EISA Enhanced ISA
- PCI Peripheral Component Interconnect
- PCI-Express PCI-Express
- HT HyperTransport
- VESA Video Electronics Standards Association
- memory subsystem 130 may comprise a system, device, or apparatus operable to retain and retrieve program instructions and data for a period of time (e.g., computer-readable media).
- Memory subsystem 130 may comprise random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), a PCMCIA card, flash memory, magnetic storage, opto-magnetic storage or a suitable selection or array of volatile or non-volatile memory that retains data after power is removed.
- RAM random access memory
- EEPROM electrically erasable programmable read-only memory
- PCMCIA card electrically erasable programmable read-only memory
- flash memory magnetic storage
- opto-magnetic storage or a suitable selection or array of volatile or non-volatile memory that retains data after power is removed.
- I/O subsystem 140 may comprise a system, device, or apparatus generally operable to receive and transmit data to, from or within information handling system 100 .
- I/O subsystem 140 may represent, for example, a variety of communication interfaces, graphics interfaces, video interfaces, user input interfaces, and peripheral interfaces.
- I/O subsystem 140 may include more, fewer, or different input/output devices or components.
- Local storage resource 150 may comprise computer-readable media (e.g., hard disk drive, floppy disk drive, CD-ROM, and other type of rotating storage media, flash memory, EEPROM, or another type of solid-state storage media) and may be generally operable to store instructions and data.
- computer-readable media may include an instrumentality or aggregation of instrumentalities that may retain data and instructions for a period of time.
- Computer-readable media may include, without limitation, storage media such as a direct access storage device (e.g., a hard disk drive or floppy disk), a sequential access storage device (e.g., a tape disk drive), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory such as a solid-state drive (SSD) comprising solid-state flash memory.
- direct access storage device e.g., a hard disk drive or floppy disk
- sequential access storage device e.g., a tape disk drive
- compact disk CD-ROM, DVD, random access memory (RAM)
- RAM random access memory
- ROM read-only memory
- EEPROM electrically erasable programmable read-only memory
- flash memory such as a solid-state drive (SSD) comprising solid-state flash memory.
- SSD solid-state drive
- network interface 160 may be a suitable system, apparatus, or device operable to serve as an interface between information handling system 100 and a network (not shown).
- Network interface 160 may enable information handling system 100 to communicate over a network using a suitable transmission protocol or standard.
- network interface 160 may be communicatively coupled via a network to a network storage resource (not shown).
- a network coupled to network interface 160 may be implemented as, or may be a part of, a storage area network (SAN), personal area network (PAN), local area network (LAN), a metropolitan area network (MAN), a wide area network (WAN), a wireless local area network (WLAN), a virtual private network (VPN), an intranet, the Internet or another appropriate architecture or system that facilitates the communication of signals, data and messages (generally referred to as data).
- SAN storage area network
- PAN personal area network
- LAN local area network
- MAN metropolitan area network
- WAN wide area network
- WLAN wireless local area network
- VPN virtual private network
- intranet the Internet or another appropriate architecture or system that facilitates the communication of signals, data and messages (generally referred to as data).
- a network coupled to network interface 160 may transmit data using a desired storage or communication protocol, including, but not limited to, Fibre Channel, Frame Relay, Asynchronous Transfer Mode (ATM), Internet protocol (IP), other packet-based protocol, small computer system interface (SCSI), Internet SCSI (iSCSI), Serial Attached SCSI (SAS) or another transport that operates with the SCSI protocol, Advanced Technology Attachment (ATA), Serial ATA (SATA), Advanced Technology Attachment Packet Interface (ATAPI), Serial Storage Architecture (SSA), Integrated Drive Electronics (IDE), or any combination thereof.
- a network coupled to network interface 160 or various components associated therewith may be implemented using hardware, software, or any combination thereof.
- components of information handling system 100 may generate heat in performing any of the processes or purposes as mentioned above and may require cooling.
- a chassis 110 for information handling system 100 may include a fan (not shown) for generating an airflow in chassis 110 and vent 112 for allowing heated airflow to exit chassis 110 .
- FIG. 2 depicts a front view of an exemplary vent 200 formed from plate 202 with a plurality of openings 204 separated by continuous surface areas 206 , wherein the open percentage of vent 200 formed from a single plate 202 is defined by the total area of openings 204 relative to the total area of plate 202 .
- the total area of openings 204 may be based on the shape, size and number of openings 204 . Openings 204 may be square, rectangular, circular, or some other shape. For vent 200 depicted with square openings 204 , if each opening 204 has a length (L OPENING ) of 4.5 mm and a width (W OPENING ) of 4.5 mm, each opening 204 will have an area of approximately 20.25 mm 2 (4.5 mm ⁇ 4.5 mm). Vent 200 comprises six openings, so the total area of openings 204 will be approximately 121.5 mm 2 (6 openings ⁇ 20.25 mm 2 ).
- Continuous surface areas 206 may depend on the material used to form plate 202 and the size and shape of each opening 204 .
- plate 202 may be formed with continuous surface areas 206 formed as ribs with each rib requiring a minimum rib thickness (T RIB ) of 1.2 mm.
- plate 202 may be rectangular and defined by a plate length (L PLATE ) and a plate width (W PLATE ).
- the plate length (L PLATE ) depends on the number of openings 204 , the length (L OPENING ) of each opening 204 , and the thickness (T RIB ) of each continuous surface area 206 between adjacent openings 204 and at the top and bottom edges.
- Plate 202 configured with three openings 204 along its length with each opening 204 having a length (L OPENING ) of 4.5 mm, and four continuous surface areas 206 with each continuous surface 206 having a thickness (T RIB ) of 1.2 mm may have a plate length (L PLATE ) of approximately 18.3 mm.
- the plate width (W PLATE ) depends on the number of openings 204 , the width (W OPENING ) of each opening 204 , and the thickness (T RIB ) of each continuous surface area 206 between adjacent openings 204 and at the side edges.
- Plate 202 configured with two openings 204 along its width with each opening 204 having a length (L OPENING ) of 4.5 mm, and three continuous surface areas 206 with each continuous surface 206 having a thickness (T RIB ) of 1.2 mm may have a plate width (L PLATE ) of approximately 12.6 mm.
- a total area of plate 202 may be calculated as approximately 230.6 mm 2 .
- the open percentage of plate 202 (and therefore vent 200 ) depicted in FIG. 2 may be calculated as approximately 62% (121.5 mm 2 /230.6 mm 2 ).
- vent 200 must also provide more EMI shielding and increasing the size of openings 204 would increase the amount of electromagnetic interference (EMI).
- EMI electromagnetic interference
- Vents disclosed herein provide a technical solution for increasing the open percentage to decrease airflow impedance and increasing EMI shielding capability.
- embodiments of a multi-layered vent may be configured with multiple plates.
- Each plate may be configured to with an open percentage to decrease airflow impedance through the vent, and two or more plates may be joined to form a vent with increased EMI shielding.
- vent 300 may comprise first plate 302 A configured with a first plurality of structures 304 and second plate 302 B configured with a second plurality of structures 304 .
- Each structure 304 may be separated from adjacent structures 304 by continuous surface areas 306 .
- Each structure 304 comprises base opening 308 , contact area 310 and at least one wall 312 extending at an angle from base opening 308 to contact area 310 .
- Base opening 308 may have a first set of dimensions (e.g., length, width) and contact area 310 may have a second set of dimensions (e.g., length, width) such that the surface area of contact area 310 is smaller than base opening 308 and each wall 312 extends at a non-orthogonal angle relative to first plate 302 A or 302 B.
- first set of dimensions e.g., length, width
- second set of dimensions e.g., length, width
- base opening 308 may be square with a length and a width and structure 304 may be pyramidal with four walls 312 extending between base opening 308 and contact area 310 .
- Each wall 312 comprises a plurality of holes 314 to allow airflow through plates 302 A, 302 B of vent 300 .
- Each continuous surface area 306 may have a thickness (T RIB ).
- vent 400 may comprise first plate 402 A configured with a first plurality of structures 404 and second plate 402 B configured with a second plurality of structures 404 .
- Each structure 404 may be separated from adjacent structures 404 by continuous surface areas 406 .
- Each structure 404 comprises base opening 408 , contact area 410 and at least one wall 412 extending at an angle from base opening 408 to contact area 410 .
- Base opening 408 may have a first set of dimensions (e.g. a diameter) and contact area 410 may have a second set of dimensions (e.g., a diameter) such that contact area 410 is smaller than base opening 408 and each wall 412 extends at a non-orthogonal angle relative to first plate 402 A or 402 B.
- base opening 408 may be circular and structures 404 may be frustoconical with a single wall 412 extending between base opening 408 and contact area 410 .
- Wall 412 comprises a plurality of holes 414 to allow airflow through plates 402 A, 402 B of vent 400 .
- Each continuous surface area 406 may have a minimum thickness (T RIB ) between adjacent structures 404 .
- FIGS. 5A-5D depict side views illustrating steps in one embodiment of a method for manufacturing a vent for improved cooling and EMI shielding of components in chassis 110 of information handling system 100 .
- a method for manufacturing vent 500 may start with plate 502 .
- Plate 502 may initially be formed as a continuous surface.
- plate 502 may be formed with a plurality of holes 514 formed therein.
- plate 502 may be stamped with stamp 503 or machined to have a plurality of structures 504 formed therein.
- the shape of stamp 503 may be configured to form a desired shape of structures 504 .
- Stamp 503 depicted in FIG. 5B is representative for describing a process for forming structures 504 and is not drawn to scale.
- the angle (A) may be formed at any angle between 15-75 degrees
- contact areas 510 and base openings 508 may be larger or smaller
- the position of holes 514 on walls 512 may vary.
- stamp 503 may have a shape to form structures 504 similar to structures 304 depicted in FIG. 3 or structures 404 depicted in FIG. 4 .
- Each structure 504 may be separated from adjacent structures 504 by continuous surface areas 506 .
- Each structure 504 may be formed with base opening 508 , contact area 510 and at least one wall 512 extending from base opening 508 to contact area 510 at an angle (A).
- Base opening 508 may have a first set of dimensions and contact area 510 may have a second set of dimensions such that contact area 510 is smaller than base opening 508 and each wall 512 extends at a non-orthogonal angle relative to plate 502 .
- each wall 512 extends at an angle (A) of between 15-75 degrees relative to plates 502 A, 502 B to form structure 504 .
- each wall 512 extends at an angle (A) between 30-60 degrees relative to plate 502 to form structure 504 .
- first plate 502 A and second plate 502 B may be positioned relative to each other and coupled to form vent 500 with increased open percentage for reduced airflow impedance and with increased EMI shielding.
- first plate 502 A may be positioned relative to second plate 502 B to align contact areas 510 .
- contact areas 510 on first plate 502 A and second plate 502 B may be welded to form continuous surfaces for increased EMI shielding.
- FIGS. 5A-5D may be used to form multiple-layered vents with various structures, including vents 300 and 400 having an increased open percentage and increased EMI shielding as compared to single layer vents such as vent 200 depicted in FIG. 2 .
- vent 300 comprising two plates 302 may be compared with vent 200 .
- base openings 308 in plates 302 A, 302 B and openings 204 are square with a length of 4.5 mm and a width of 4.5 mm.
- vent 200 comprises a single plate 202 with a plurality of openings 204 , with each opening 204 being square with a length (L OPENING ) and a width (W OPENING ).
- L OPENING a length
- W OPENING a width
- the open percentage and EMI shielding of plate 202 (and therefore vent 200 ) corresponds to the shape, size and number of openings 204 .
- vent 300 comprises multiple plates 302 A, 302 B with a plurality of pyramidal structures 304 , wherein each structure 304 comprises base opening 306 . If each plate 302 A, 302 B in vent 300 has the same number of structures 304 as the number of openings 204 in plate 202 and each base opening 308 in plates 302 A, 302 B has the same dimensions as each opening 204 in plate 202 , then a difference in open percentage may depend on one or more of the number, shape and size of holes 314 . Since each structure 304 depicted in FIG.
- vent 300 may be formed with an open percentage greater than 80%, whereas the open percentage of vent 200 may be approximately 62% as discussed above. Vent 400 may also be formed with an open percentage greater than 80%.
- EMI shielding by vent 200 may depend on the size and number of openings 204 in plate 202 .
- vent 300 the amount of electromagnetic interference (EMI) associated with vent 300 may depend on the amount of electromagnetic energy that can pass through both plates 302 A and 302 B. Accordingly, vent 300 may be configured with smaller holes 314 and walls 312 formed at an angle (A) to provide the smallest number of direct routes between plates 302 A and 302 B.
- A angle
- FIG. 5D depicts a side view of vent 500 .
- Contact areas 510 of plates 502 A, 502 B may be welded to form continuous surfaces, and continuous surface areas 506 and welded contact areas 510 prevent direct passage of electromagnetic energy.
- the electromagnetic energy must pass through a first hole 514 in a first wall 512 configured at a first angle (A) and pass through a second hole 514 on a second wall 512 configured at a second angle (A).
- Walls 512 extending at an angle (A) relative to plates 502 A, 502 B may deflect electromagnetic energy in directions away from holes 514 , decreasing the amount of electromagnetic energy that passes through both plates 502 A and 502 B of vent 500 .
- Holes 514 formed on walls 512 extending at an angle (A) provide a smaller direct passage for electromagnetic energy, decreasing the amount of electromagnetic energy that passes through both plates 502 A and 502 B of vent 500 .
- the angle (A) is a non-orthogonal angle.
- the angle (A) is between 15 and 75 degrees.
- the angle (A) is between 30 and 60 degrees.
- the angle (A) for a first plate 502 A is equal to the angle (A) of the second plate 502 B.
- structures 304 may be configured with angular walls 310 oriented such that electromagnetic energy passes through holes 312 only in certain directions, reducing the likelihood that electromagnetic energy can pass through holes 314 in both plates 302 A and 302 B.
- structures 404 may be configured with curved or arcuate walls 410 such that only a small percentage of electromagnetic energy passes through openings 414 in any given direction, reducing the likelihood that electromagnetic energy can pass through holes 412 in both plates 402 A and 402 B.
Abstract
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Cited By (1)
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US20230146766A1 (en) * | 2021-11-10 | 2023-05-11 | Dell Products L.P. | Cooling system with a porous foam heat exchanger and a positive displacement air pump |
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JP7299959B2 (en) * | 2021-11-11 | 2023-06-28 | レノボ・シンガポール・プライベート・リミテッド | Electronics |
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