US11317263B2 - Package-less low energy communication system tag - Google Patents
Package-less low energy communication system tag Download PDFInfo
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- US11317263B2 US11317263B2 US16/665,329 US201916665329A US11317263B2 US 11317263 B2 US11317263 B2 US 11317263B2 US 201916665329 A US201916665329 A US 201916665329A US 11317263 B2 US11317263 B2 US 11317263B2
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/248—Supports; Mounting means by structural association with other equipment or articles with receiving set provided with an AC/DC converting device, e.g. rectennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/12—Protocols specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
Definitions
- the present disclosure generally relates to an internet of thing (IoT) devices, and more specifically to a package-less implementation of such devices.
- IoT internet of thing
- Bluetooth Low Energy is a wireless personal area network technology designed and marketed by the Bluetooth Special Interest Group (Bluetooth® SIG), aimed at novel applications in the healthcare, fitness, beacons, security, and home entertainment industries. Compared to Classic Bluetooth®, Bluetooth Low Energy is intended to provide considerably reduced power consumption and costs while maintaining a similar communication range.
- BLE technology is implemented in wireless communication devices, such as smart phones, tablet computers, and wearable devices operated using operating systems, such as iOS®, Android® and Windows® 10, that natively support Bluetooth Low Energy.
- BLE technologies is also implemented in Internet of Things (IoT) sensors or devices.
- IoT Internet of Things
- a typical BLE communication system includes a BLE microcontroller, a DC power source (e.g., a battery), power regulators, crystal oscillators, and an antenna.
- the BLE microcontroller typically combines programmable and reconfigurable analog and digital blocks combined to form a combination of a microcontroller with an integrated BLE radio system.
- the form factor of the BLE microcontroller is a system on chip, where its components are integrated in a die.
- a die is a small block of semiconductor material on which a given functional circuit is fabricated.
- ICs are produced in large batches on a single wafer of semiconductor material through a process such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
- the BLE microcontroller's die is packaged, depending on the form factor of the BLE communication system.
- the DC power source is typically a battery regulated by the power regulators. Such regulators both: provide local storage reservoirs and lower the effective impedance on the power supply.
- the crystal oscillator provides a clock reference signal to the BLE microcontroller. Such a clock signal is used by the BLE microcontroller to calibrate an oscillator. Specifically, the oscillator generates a radio frequency (RF) carrier signal that carries the data signal generated by the BLE microcontroller.
- the oscillator is typically a free-running oscillator, which may be used to directly generate an RF carrier signal. Thus, a free-running oscillator may replace a frequency synthesizer to generate an RF carrier signal. Utilization of a free-running oscillator may result in power savings.
- the free-running oscillator generates a RF carrier signal, having a frequency within a specific portion of the wireless spectrum, for example, the 2.4 GHz wireless band.
- the free running oscillator is locked via a phase-locked loop (PLL) to a clock, originating from a crystal oscillator.
- PLL phase-locked loop
- the antenna is designed to receive and transmit wireless signals at the BLE frequency spectrum.
- the antenna may be a PCB-trace antenna or connected outside of the PCB, depending on the form factor of the BLE communication system.
- FIG. 1 shows elements of a BLE communication system 100 mounted on a printed circuit board (PCB) 110 .
- the elements of the system 100 include a power source 101 , power regulators 102 , a crystal oscillator 103 , a BLE microcontroller 104 , and an antenna 105 .
- the BLE microcontroller 104 is packaged and coupled to the PCB 110 as a standalone chip.
- the antenna 105 is a PCB-trace antenna which is designed to enter the PCB 110 itself.
- BLE communication systems implemented as shown in FIG. 1 are typically sold as separate cards, and thus do not provide the option of embedding external functionalities (e.g., sensors). In fact, it may be impractical to implement small-size BLE tags based on the form factor shown in FIG. 1 .
- FIG. 2 shows elements of a BLE communication system 200 integrated in the same module or chip 210 .
- power regulators 202 a crystal oscillator 203 , and a BLE microcontroller 204 are integrated in the same package (module) 210 .
- the BLE microcontroller 204 is not packaged, but rather integrated in a semiconductor die.
- the power source 201 and antenna 205 are connected outside of the package 200 .
- the size of the above system is relatively small in comparison to the PCB-type of form factor and, therefore, is easy to integrate with other products.
- the cost of chip-type implementation is expensive relative to the PCB-type and demonstrates high operational complexity due to the need to integrate and connect many electronic components into one function. This would further require complex configuration of the entire BLE system.
- Certain embodiments disclosed herein include a low-energy communication system, comprising: at least one antenna; an energy harvester coupled to the at least one antenna and adapted to harvest energy from over-the-air signals; a first capacitor for storing the harvested energy; a system on chip (SoC) for allowing at least reception and transmission of wireless signals using a low-energy communication protocol; and wherein the energy harvester, the first capacitor, the SoC, are integrated in a semiconductor die, the die is placed on a substrate; and wherein the at least one antenna is included in the substrate.
- SoC system on chip
- Certain embodiments disclosed herein also include a battery-free internet of things (IoT) device, comprising: a die integrating functionality of a low-energy communication, wherein the die is placed on a substrate; at least one antenna connected to the die included on the substrate; and a sensor included on the substrate.
- IoT internet of things
- FIG. 1 illustrates a schematic diagram of conventional form factor of a BLE communication system mounted on a PCB.
- FIG. 2 illustrates a schematic diagram of conventional form factor of a BLE communication system integrated in a chip.
- FIG. 3 illustrates a block diagram of a low-energy communication system designed according to the disclosed embodiments.
- FIGS. 4 and 5 are pictures of on-die package less low-energy communication system designed according to the disclosed embodiments.
- a low-energy communication system having an on-die package-less form factor is provided.
- the elements of the such communication system are integrated on a single die where the antenna is printed on a substrate.
- the die is glued to the substrate.
- the form factor for the low-energy communication system eliminates the need for many external interfaces and devices. Therefore, reduces the overall cost and size of the system.
- the low-energy communication system is a BLE communication system.
- FIG. 3 shows an example schematic diagram of a low-energy communication system 300 , designed according to the disclosed embodiments.
- the form factor of the system 300 is an on-die package-less.
- the communication system 300 includes an energy harvester 301 , coupled to an on-die capacitor 302 , a power management unit (PMU) 303 , a microcontroller 304 , a system on chip (SoC) 305 , and a retention memory 306 .
- the communication system 300 further includes at least one antenna 310 glued to a substrate 320 . In another embodiment, the antenna 310 may be printed on the substrate or etched to the substrate.
- the substrate 320 is made of a low-cost material, such as, but not limited to, polyethylene (PET), polyimide (PI), and polystyrene (PS).
- the substrate 320 's pattern (layout) can be any of aluminum, copper, or silver.
- the glue utilized to glue to die and/or antenna 310 may be include materials such as an anisotropic conductive film (ACP), any type of conductive glue, solder past, and the like.
- capacitor 302 ′ which is an additional capacitor connected to the energy harvester and integrated on the substrate outside of the die.
- the antenna 310 is coupled to the harvester 301 and may be utilized for energy harvesting as well as wireless communication. In some embodiments, multiple antennas may be utilized to harvest energy at multiple frequency bands. Other embodiments may include one or more antenna for energy harvesting and an antenna to receive/transmit wireless signals at the BLE frequency band.
- the SoC 305 includes a number of execution functions realized as analog circuits, digital circuits, or both. Examples for such execution functions are provided below.
- the SoC 305 is also configured to carry out processes independently or under the control of the microcontroller 304 . Each process carried out by the SoC 305 also has a state, and processes can communicate with other processes through an IPC protocol. In the configuration illustrated in FIG. 3 , the SoC 305 and/or the microcontroller 304 loads the context of processes and read data from the retention memory 306 .
- the SoC 305 is partitioned into multiple power domains. Each power domain is a collection of gates powered by the same power and ground supply. To reduce the power consumption, only one power domain is turned on during execution.
- the SoC 305 can perform functions, such as reading from and writing to memory, e.g., of peripherals and can execute simple logic operations; tracking power level of the SoC 305 ; generating and preparing data packets for transmission; cyclic redundancy check (CRC) code generation; packet whitening; encrypting/decrypting of packets; converting data from parallel to serial; and staging the packet bits to the analog transmitter path for transmission.
- CRC cyclic redundancy check
- the SoC 305 includes an oscillator calibration circuit (OCC) 305 -A.
- the OCC 305 -A includes at least one frequency locking circuit (FLC), each of which is coupled to an oscillator (both are not shown).
- the FLC calibrates the frequency of an oscillator using an over-the-air reference signal.
- the calibration of the respective oscillator is performed immediately prior to a data transmission session and remains free running during the data transmission session.
- the FLC can be realized using frequency locked loop (FLL), a phased locked loop (PLL), and a delay locked loop (DLL).
- FLL frequency locked loop
- PLL phased locked loop
- DLL delay locked loop
- An example implementation of an oscillator calibration circuit 380 is discussed in U.S.
- the energy harvester 301 , the capacitor 302 , PMU 303 , microcontroller 304 , SoC 305 , and retention memory 307 are integrated in a die 330 .
- the die 330 is glued to the substrate 320 .
- the communication system 300 does not include any external DC power source, such as a battery.
- the microcontroller 304 implements electronic circuits (such as, memory, logic, RF, etc.) performing various functions allowing communication using a low energy (power) communication protocol.
- a low energy (power) communication protocol includes, but are not limited to, Bluetooth®, LoRa, Wi-Gi®, nRF, DECT®, Zigbee®, Z-Wave, EnOcean, and the like.
- the microcontroller 304 operates using a Bluetooth Low energy (BLE) communication protocol.
- BLE Bluetooth Low energy
- the microcontroller 304 is integrated with wireless sensors (not shown) to a complete an IoT device functionality.
- the sensors may include heart monitoring implants, biochip transponders on farm animals, automobiles with built-in sensors, automation of lighting, heating, ventilation, air conditioning (HVAC) systems, and appliances such as washer/dryers, robotic vacuums, air purifiers, ovens or refrigerators/freezers, and the like.
- HVAC heating, ventilation, air conditioning
- the sensors may further include actuators.
- the harvester 301 is configured to provide multiple voltage levels to the microcontroller 304 , while maintaining a low loading DC dissipation value.
- the energy harvester 301 may include a voltage multiplier coupled to the antenna 310 .
- the voltage multiplier may be a Dickson multiplier, while the antenna is a 310 receive/transmit antenna of the microcontroller 304 . That is, in such a configuration, the antenna is primarily designed to receive and/or transmit wireless signals according to the respective communication protocol of the low-energy communication system 300 (e.g., 2.400-2.4835 GHz signal for BLE communication).
- the antenna 310 may also be designed for energy harvesting and may operate on a different frequency band, direction, or both, than those defined in the standard of the respective communication protocol. Regardless of the configuration, energy can be harvested from any wireless signals received over the air. Alternatively, energy can be harvested from any other sources, such as solar, piezoelectric signals, and the like.
- the harvested energy is stored in the capacitor 302 .
- the capacitor 302 is part of the die 301 .
- the capacitor 302 is a metal capacitor form using the metal layers.
- An example implementation of an on-die capacitor is discussed in U.S. Provisional application Ser. No. 16/523,015 to Elboim, assigned to the common assignee. It should be noted that the capacitor 302 may not be limited to a metal capacitor, and other types of capacitors are applicable as well.
- the system 300 may include an additional capacitor 302 connected outside of the die 330 . Such a capacitor is also charged by the energy harvested by the harvester 301 .
- the PMU 303 is coupled to the capacitor 302 and is configured to regulate the power to the microcontroller 304 and SoC 305 . Specifically, as the capacitance of the capacitor 302 is very limited, the power consumption should be carefully maintained. This maintenance is performed to avoid draining of the capacitor 302 , thus resetting the microcontroller 304 .
- the PMU 303 may be further configured to provide multi-level voltage level indications to the microcontroller 304 . Such indications allow the microcontroller 304 to determine the state of a voltage supply at any given moment when the capacitor 302 charges or discharges.
- the PMU 303 may include a detection circuitry controlled by a controller.
- the detection circuitry includes different voltage reference threshold detectors, where only a subset of such detectors are active at a given time to perform the detection.
- the controller determines which sub-set of detectors are activated at any given moment.
- An example implementation of a multi-level PMU 220 is discussed in U.S. Provisional application Ser. No. 16/176,460 to Yehezkely, assigned to the common assignee.
- the low-energy communication system 300 does not include any crystal oscillator providing a reference clock signal.
- the reference clock signal is generated using over-the-air signals received from the antenna 310 .
- a free running oscillator is locked via a phase-locked loop (PLL) to a clock, originating from a crystal oscillator.
- PLL phase-locked loop
- the OCC 305 -A calibrates the frequency of an oscillator using an over-the-air reference signal.
- the oscillator(s) implemented in the system 300 are on-die oscillators and may be realized as a digitally controlled oscillator (DCO).
- DCO digitally controlled oscillator
- the retention memory 306 is a centralized area in the communication system 100 that is constantly powered. Data to be retained during low power states is located in the retention memory 140 .
- the retention area is optimized to subthreshold or near threshold voltage, e.g., 0.3V-0.4V. This allows for the reduction of the leakage of the retention cells.
- FIG. 4 shows an example picture 400 of the low-energy communication system designed according to the disclosed embodiments.
- the picture 400 demonstrates a die 410 , placed on a substrate 420 .
- the substrate 420 is made of polyethylene (PET), polyimide (PI) and polystyrene (PS) material.
- each antenna 430 may serve for energy harvesting and/or receiving/transmitting wireless signals. Further, each antenna 430 may operate at different frequency band.
- the bumps 440 may be electroless bumps, with copper pillars and gold stud bumps. This further allows reduction of the overall cost of the system. It should be noted that the antenna's shape is not limited to the shape shown in FIG. 4 . The antenna may be designed with a different shape or layout depending, for example, on the frequency band.
- FIG. 5 shows a picture of a different configuration of the low-energy communication system designed according to the disclosed embodiments.
- the picture 500 demonstrates a die 510 , placed on a substrate 520 .
- the substrate 520 is made of low-cost material, such as polyethylene (PET), polyimide (PI), and polystyrene (PS).
- PET polyethylene
- PI polyimide
- PS polystyrene
- the form factor of the low-energy communication system disclosed herein allows manufacture and mass-produced low-cost and ultra-low-power IoT devices (or tags). Such devices can be attached, for example, to consumer goods, such as shoes, clothing, bottles (wine, cosmetics, etc.), objects (such as, sunglasses, watches, etc.), and the likes.
- the phrase “at least one of” followed by a listing of items means that any of the listed items can be utilized individually, or any combination of two or more of the listed items can also be utilized. For example, if a system is described as including “at least one of A, B, and C,” the system can include A alone; B alone; C alone; A and B in combination; B and C in combination; A and C in combination; or A, B, and C in combination.
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US20210044004A1 (en) * | 2017-05-02 | 2021-02-11 | Richard A. Bean | Electromagnetic energy harvesting devices and methods |
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US11540119B2 (en) * | 2020-02-06 | 2022-12-27 | Wiliot, LTD. | System and method for providing secure and reliable communication over a low-energy wireless communication protocol |
CN113676224A (en) * | 2021-08-20 | 2021-11-19 | 深圳绅聚科技有限公司 | Bluetooth module, system and article of manufacture powered by radio frequency energy |
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US20110291816A1 (en) * | 2005-05-30 | 2011-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20140336474A1 (en) * | 2013-05-13 | 2014-11-13 | The Board Of Trustees Of The Leland Stanford Junior University | Hybrid communication system for implantable devices and ultra-low power sensors |
US20170092897A1 (en) * | 2016-10-12 | 2017-03-30 | Shanghai Tianma Micro-electronics Co., Ltd. | Flexible display device and fabrication method thereof |
US20180183274A1 (en) * | 2016-12-23 | 2018-06-28 | Stamina Energy, LLC | Wireless energy harvesting |
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US20110291816A1 (en) * | 2005-05-30 | 2011-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US20140336474A1 (en) * | 2013-05-13 | 2014-11-13 | The Board Of Trustees Of The Leland Stanford Junior University | Hybrid communication system for implantable devices and ultra-low power sensors |
US20170092897A1 (en) * | 2016-10-12 | 2017-03-30 | Shanghai Tianma Micro-electronics Co., Ltd. | Flexible display device and fabrication method thereof |
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