US11293603B2 - Light vectoring apparatus - Google Patents
Light vectoring apparatus Download PDFInfo
- Publication number
- US11293603B2 US11293603B2 US16/212,281 US201816212281A US11293603B2 US 11293603 B2 US11293603 B2 US 11293603B2 US 201816212281 A US201816212281 A US 201816212281A US 11293603 B2 US11293603 B2 US 11293603B2
- Authority
- US
- United States
- Prior art keywords
- chamber
- light
- areas
- layer
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 49
- 239000011800 void material Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000047 product Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 phosphor compound Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/65—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/036—Light emitting elements
- H01H2219/05—Key offset in relation to switch site
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/056—Diffuser; Uneven surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/06—Reflector
Definitions
- the intensity of visible light on that surface may generally depend on the level of reflectivity versus absorption of elements situated in the pathway between the light source and the surface and the original concentration of the light being emitted at the light source. In general, however, the intensity and concentration of light from a light source appears greatest at the source point when there is a direct path between the light source and the receiving surface.
- LED light emitting diodes
- LED light emitting diodes
- LEDs In an attempt to minimize light losses, multiple modifications to LEDs have been devised, and are sometimes known as “right-angle,” “side-firing,” or “side-looker” LEDs. These are LEDs that have been modified to include additional structural features that assist in directing the emitted light in a focused direction, usually at a right angle to mounting position or to emit in a direction parallel to the surface on which the LED is mounted.
- right-angle LEDs are more bulky than a regular packaged LED, which is already more bulky than an unpackaged LED. Therefore, the surrounding structure in which a right-angle LED is mounted must be large enough to accommodate the larger size. An increase in size, however, generally also indicates an increase in the cost of materials and potentially other manufacturing costs as well.
- FIG. 1 depicts an exploded view of an illustrative embodiment of a lighting apparatus according to the instant application.
- FIG. 2A depicts a top view of features of a lighting apparatus according to an embodiment of the instant application.
- FIG. 2B depicts a top view of additional features of a lighting apparatus according to an embodiment of the instant application.
- FIG. 2C depicts a top view of additional features of a lighting apparatus according to an embodiment of the instant application.
- FIG. 2D depicts a top view of additional features of a lighting apparatus according to an embodiment of the instant application.
- FIG. 3 depicts a cross-sectional view of the lighting apparatus at line according to the embodiment of FIG. 2C .
- FIG. 4 depicts a cross-sectional view of a lighting apparatus according to an embodiment of the instant application.
- FIG. 5 depicts a cross-sectional view of a lighting apparatus according to an embodiment of the instant application.
- FIG. 6 depicts a top view of a lighting apparatus according to an embodiment of the instant application.
- This disclosure is directed to a light vectoring apparatus that directs and diffuses light from a light source prior to the light being emitted into an external environment from the apparatus.
- the chamber structure of the apparatus vectors or directs (i.e., funnels, focuses, or channels) light in a first direction away from the light source and then redirects it in a second direction transverse to the first direction.
- the redirection may be discussed herein as a light emission or transmission position that is laterally displaced from the position of the origination of the light.
- additional light altering materials may be included in the apparatus to assist in diffusing the light.
- an unpackaged LED refers to an unenclosed LED without protective features.
- an unpackaged LED may refer to an LED die that does not include a plastic or ceramic enclosure, pins/wires connected to die contacts (e.g., for interfacing/interconnecting with ultimate circuitry), and/or a sealing (e.g., to protect the die from the environment).
- the techniques described herein may implement an LED for lighting in a variety of manners.
- the LED may be applied to a top surface of the chamber of the apparatus, and/or a bottom surface of the chamber of the apparatus.
- the chamber may contain a single or multiple LEDs therein.
- circuit substrate and/or alternatively, “substrate,” may include, but is not limited to: a paper, glass, or polymer substrate formed as a sheet or other non-planar shape, where the polymer—translucent or otherwise—may be selected from any suitable polymers, including, but not limited to, a silicone, an acrylic, a polyester, a polycarbonate, etc.; a circuit board (such as a printed circuit board (PCB)); a string or thread circuit, which may include a pair of conductive wires or “threads” extending in parallel; and a cloth material of cotton, nylon, rayon, leather, etc.
- PCB printed circuit board
- circuit substrate or “substrate” does not necessarily mean that a circuit or circuit trace has yet been added to the substrate.
- the lighting apparatus may implement a variety of substrates, with or without a circuit, as described herein.
- the choice of material of the substrates, as discussed herein, may include durable materials, flexible materials, rigid materials, and/or other materials which maintain suitability for the end use of the product.
- a substrate, such as a circuit substrate may be formed solely or at least partially of conductive material such that the substrate acts as a conductive circuit for providing electricity to an LED.
- a product substrate may be a flexible, translucent polyester sheet having a desired circuit pattern screen printed thereon using a silver-based conductive ink material to form a circuit trace.
- the thickness of the product substrate may be range from about 5 microns to about 80 microns, about 10 microns to about 80 microns, about 10 microns to about 100 microns, and so on.
- the circuit substrates containing LEDs may be prepared using a “direct transfer” process, where an unpackaged LED die is transferred from a wafer or wafer tape directly to a substrate, such as a circuit substrate, and then implemented into an apparatus at assembly, with or without further processing, such as the addition of a phosphor or other down-converting media such as quantum dots or organic dyes.
- the direct transfer of the unpackaged LED die may significantly reduce the thickness of an end product (in comparison to other techniques), as well as the amount of time and/or cost to manufacture the product substrate.
- the fabrication of LEDs typically involves an intricate manufacturing process with a myriad of steps.
- the fabrication may start with handling a semiconductor wafer.
- the wafer is diced into a multitude of “unpackaged” LEDs.
- the “unpackaged” modifier refers to an unenclosed LED device without protective features.
- An unpackaged LED device may be referred to as an LED die, or just a “die.”
- a single semiconductor wafer may be diced to create multiple dies of various sizes, so as to form upwards of more than 100,000 or even 1,000,000 dies from the semiconductor wafer.
- unpackaged dies are then generally “packaged.”
- the “packaged” modifier refers to the enclosure and protective features built into a final LED as well as the interface that enables the die in the package to ultimately be incorporated into a circuit.
- packaging may involve mounting a die into a plastic-molded lead frame or onto a ceramic substrate, connecting the die contacts to pins/wires for interfacing/interconnecting with ultimate circuitry, and sealing the die with an encapsulant to improve light extraction and protect it from the environment (e.g., dust). Due to the packaging, the LED dies are ready to be “plugged in” to the circuit assembly of the product being manufactured. A product manufacturer then places packaged LEDs in product circuitry.
- packaged LED dies are inherently larger (e.g., in some cases, around 10 times the thickness and 10 times the area, resulting in 100 times the volume) than the die found inside the package. Thus, the resulting circuit assembly cannot be any thinner than the packaging of the LED die.
- the techniques discussed herein implement the “direct transfer” process where an LED die is transferred directly from a wafer or wafer tape to a product substrate. Although in other instances, the techniques may be implemented in other contexts that do not implement a direct transfer process for the LED dies.
- an apparatus 100 may include a lighting assembly 102 .
- the lighting assembly 102 may be implemented in any apparatus or device in which illumination of a component of the apparatus or device is desired, particularly in a setting where indirect and/or diffused lighting is beneficial.
- lighting assembly 102 may be used as backlighting for keycaps on a keyboard, for a display device, etc.
- lighting assembly 102 may include a backing layer 104 , a coverlay layer 106 , and a transmission layer 108 .
- Backing layer 104 may be formed as a substrate from among a variety of materials and have one or more functions.
- backing layer 104 may be a circuit substrate in the assembly 102 , which may be entirely incorporated into a housing for a product.
- backing layer 104 may be a portion of an external frame or housing of a product.
- backing layer 104 may vary according to the properties of the material selected.
- backing layer 104 may be formed of a metal plate that is substantially rigid so as to maintain a planar shape, or backing layer 104 may be formed of a thin polymer film that is substantially flexible so as to conform to contours of adjacent elements in the apparatus or device in which lighting assembly 102 is implemented.
- the polymer may be selected from any suitable polymers, including, but not limited to, a silicone, an acrylic, a polyester, a polycarbonate, etc.
- backing layer 104 may be a conventional printed circuit board (PCB).
- PCB printed circuit board
- backing layer 104 is depicted as a circuit substrate that carries a light source 110 , such as an LED, attached to circuitry 112 .
- Circuitry 112 includes a conductive circuit trace 114 .
- circuit trace 114 may be formed from a printed conductive ink disposed via screen printing, inkjet printing, laser printing, manual printing, or other printing means. Further, circuit trace 114 may be pre-cured and semi-dry or dry to provide additional stability, while still being activatable for die conductivity purposes. A wet conductive ink may also be used to form circuit trace 114 , or a combination of wet and dry ink may be used for circuit trace 114 .
- circuit trace 114 may be pre-formed as a wire trace, or photo-etched, or from molten material formed into a circuit pattern and subsequently adhered, embedded, or otherwise secured to backing layer 104 .
- circuit trace 114 may include, but is not limited to, silver, copper, gold, carbon, conductive polymers, etc. In some instances, circuit trace 114 may include a silver-coated copper particle.
- a thickness of circuit trace 114 may vary depending on the type of material used, the intended function and appropriate strength or flexibility to achieve that function, the energy capacity, the size of the light source 110 (e.g., LED), etc. For example, a thickness of circuit trace 114 may range from about 5 microns to about 20 microns, from about 7 microns to about 15 microns, or from about 10 microns to about 12 microns.
- circuitry 112 may be formed additionally, or alternatively, on transmission layer 108 .
- backing layer 104 may be considered to be the surface of a component that has been preformed for a final product, in which case, circuitry 112 may be printed or added thereon by any suitable means.
- lighting assembly 102 further includes coverlay layer 106 .
- coverlay layer 106 may be formed of a polymer film substrate. Additionally, or alternatively, coverlay layer 106 may be formed via printing or screenprinting a liquid material over the surface of backing layer 104 . As depicted in FIG. 1 , coverlay layer 106 is disposed against backing layer 104 , and coverlay layer 106 includes void 116 . Void 116 may be a hole/aperture or an empty space cut from or otherwise created in coverlay layer 106 during formation thereof. In lighting assembly 102 , coverlay layer 106 is oriented, with respect to backing layer 104 , such that light source 110 is disposed within the void 116 .
- a chamber may be formed by virtue of void 116 being sandwiched in the layers. That is, coverlay layer 106 becomes sandwiched between backing layer 104 and transmission layer 108 and the opposing surfaces of backing layer 102 and transmission layer 108 adjacent void 116 form at least a partially enclosed chamber in connection with sidewalls of void 116 . As discussed further herein, in some embodiments, the chamber may be fully enclosed.
- FIG. 1 illustrates that a least a portion of transmission layer 108 includes a transmission region 118 . Further, transmission region 118 is oriented to be adjacent void 116 . Transmission region 118 is subdivided into a first area 120 and a second area 122 . First area 120 of transmission region 118 has a first light transmissivity level. Second area 122 of transmission region 118 has a second light transmissivity level. The respective light transmissivity levels of first area 120 and second area 122 regard the relative amount of light from the light source 110 that may pass through the first area 120 and second area 122 .
- the second transmissivity level of second area 122 is greater than the first transmissivity level of first area 120 , which means that more light is allowed to transmit via second area 122 than may be transmit via first area 120 .
- first area 120 may be completely opaque, or first area 120 may be less than completely opaque, thus allowing a restricted amount of light from light source 110 to pass therethrough.
- second area 122 may be a complete aperture through transmission layer 108 , in which case, the absence of substrate material in second area 122 of transmission region 118 is ensures that second area 122 is more transmissive to light than first area 120 , which does not have a hole/aperture therethrough.
- the substrate material of transmission layer 108 in second area 122 may include a translucent material that is more transmissive to light than the substrate material of the first area 120 in transmission layer 108 .
- FIGS. 2A-2D depict a top view of stages 200 , 202 , 204 , and 206 , respectively, in an assembly of at least a portion of an apparatus according to the instant application.
- the following description is not intended to mandate any particular order of assembly, but rather is merely a convenient way to describe the overlapping layers of the apparatus.
- first stage 200 is depicted showing backing layer 104 including light source 110 disposed on circuitry 112 .
- First stage 200 may, in some instances, include the deposition on circuitry 112 and light source 110 onto backing layer 104 .
- second stage 202 is depicted showing a top view of coverlay layer 106 disposed on backing layer 104 , such that light source 110 is located in void 116 .
- light rays emitted from light source 110 are depicted in FIG. 2B , as dotted arrows 208 .
- light rays 208 are depicted as emanating away from light source 110 in a direction toward sidewall 210 of void 116 .
- a third stage 204 is shown in FIG. 2C , depicting transmission layer 108 disposed on coverlay layer 106 (seen at peripheral edges of void 116 ) so as to also overlap backing layer 104 .
- chamber 212 is formed, as discussed above, by the sandwiching of void 116 between backing layer 104 and transmission layer 108 .
- dashed lines are intended to depict hidden contours and boundaries of features beneath transmission layer 108
- solid lines are intended to depict visible boundaries. For example, in some instances, as depicted in FIG.
- second area 122 of transmission region 118 is an aperture, and as such, the portion of sidewall 210 of void 116 showing within second area 122 is depicted with a solid line, while the portion of sidewall 210 of void 116 showing within first area 120 of transmission region 118 is depicted with a dashed line. Similarly, light source 110 is depicted with a dashed line to indicate that light source 110 is hidden beneath the substrate material of first area 120 .
- light rays 208 may not be directly visible above light source 110 . Instead, even in an embodiment where first area 120 is not completely opaque, light rays 208 may be reflected in a first general direction away from light source 110 and toward second area 122 so as to transmit out of chamber 212 via second area 122 in a second general direction that is transverse to the first general direction.
- light rays 208 may be focused, vectored, or channeled away from light source 120 to transmit via second area 122 by reflecting off of one or more surfaces in chamber 212 , including: the floor beneath light source 110 (i.e., the surface of backing layer 104 facing void 116 ), the ceiling above light source 110 (i.e., the surface of first area 120 of transmission region 118 of transmission layer 108 facing void 116 ), or sidewall 210 of void 116 .
- FIG. 2D depicts a fourth stage 206 including an additional feature of a device or apparatus into which a lighting assembly may be implemented.
- lighting assembly 102 may be incorporated into a device with a cover such as cover 214 in FIG. 2D .
- Cover 214 may be, for example, as illustrated a keycap for a keyboard.
- this implementation is non-limiting and is only considered an example of a cover of a device for purposes of convenient illustration. It is contemplated that there are many devices that require lighting and a cover may be implemented for diffused lighting or other desirable effects in many different types of devices/apparatuses, in which a lighting assembly, such as lighting assembly 102 , may be used.
- dashed lines in FIG. 2D also represent hidden elements beneath cover 214 to provide perspective of the orientation of features in the depicted layers of the structure.
- cover 214 may include a translucent portion 216 , depicted in FIG. 2D as a letter “R” like on a keycap cover for a keyboard, and a non-translucent portion 218 , which may include the remainder of the cover 214 outside of portion 216 .
- light rays 208 which were reflected and transmitted out of chamber 212 , as shown in FIG. 2C , may pass through portion 216 of cover 214 as diffused or indirect light rays 220 .
- the respective levels of translucency of portion 216 and portion 218 may be swapped, such that the “R” of portion 216 allows no light to pass therethrough, while all or some of portion 218 is translucent.
- an entirety of the cover 214 may be translucent so as to be completely illuminated, or even transparent.
- lighting assembly 102 may be incorporated into a light bulb or other lighting apparatus, where the cover is transparent, such as a clear glass, so that the cover allows the indirect (or redirected) light from the lighting assembly to emanate therethrough essentially unhindered.
- the cover 214 may be formed from a phosphor compound material or from a material having a phosphor coating, so as to modify the light as it is transmitted. It is contemplated that other light modifying materials (e.g. color changing materials, quantum dots, color filters, etc.) may be incorporated within any of the features of lighting assembly 102 or cover 214 so as to modify the emitted light from light source 110 .
- FIG. 3 A cross-sectional view 300 of the lighting assembly 102 taken at line shown in FIG. 2C is depicted in FIG. 3 .
- light source 110 may be attached to backing layer 104 (circuitry 112 not shown in FIG. 3 ).
- light source 110 may further be located at a position P 1 , which is oriented in vertical alignment with first area 120 .
- the substrate material of transmission layer 108 extends across a vertical space above light source 110 as first area 120 .
- the surface of first area 120 may have reflective properties.
- first area 120 may include a coating of reflective material facing light source 110 , or the material of the entirety of transmission layer 108 may be reflective generally.
- the “floor” or the surface of backing layer 104 may have reflective properties as well, either by a material coating or by the inherent properties thereof.
- second area 122 Also depicted in FIG. 3 is a set of dashed lines extending through second area 122 .
- the absence of material explicitly shown in second area 122 indicates that (as discussed above) that second area 122 may be an aperture through transmission layer 108 .
- the dashed lines are intended to show that the transmission layer 108 may actually be continuous in second area 122 of transmission region 118 .
- second area 122 is still more light transmissive than first area 120 .
- light rays (dotted lines) reflect within chamber 212 to exit chamber 212 via second area 122 , which is vertically aligned at position P 2 .
- the light rays are generally directed in a first lateral direction away from light source 110 at position P 1 and are transmitted out of chamber 212 at position P 2 , which is laterally displaced from P 1 , so that the light is directed generally in a second direction transverse to the first direction.
- lighting assembly 400 may include a backing layer 402 sandwiching a coverlay layer 404 with a transmission layer 406 .
- Transmission layer 406 may include a transmission region 408 having one or more interconnected first areas 410 and one or more second areas 412 .
- First area 410 and second area 412 may have similar levels of light transmissivity as are described above with respect to similarly discussed first area 120 and second area 122 .
- transmission layer 406 has light sources 414 a and 414 b attached thereto with circuitry (not shown, but like circuitry 112 previously discussed).
- chamber 416 that is formed with a void in coverlay layer 404 .
- Light rays are emitted from light sources 414 a and 414 b into chamber 416 .
- Light rays may reflect around chamber 416 via the floor, ceiling, and sidewall(s).
- a coating 418 which may have texture may be disposed on the floor of chamber 416 to assist in reflection and diffusion of the light.
- chamber 416 may be at least partially filled with a light modifying material 420 , such as phosphor or other diffusive and/or reflective material.
- a light modifying material 420 such as phosphor or other diffusive and/or reflective material.
- FIG. 5 another cross-section of a lighting apparatus 500 shows a backing layer 502 sandwiching a coverlay layer 504 with a transmission layer 506 .
- a transmission region 508 of transmission layer 506 may include a first area 510 having a first level of light transmissivity and a second area 512 having a second level of light transmissivity that is greater than the first level of light transmissivity.
- Light source 514 such as an LED, is disposed on backing layer 502 , and emits light rays 516 that may reflect off of sidewall 518 , which is formed from a void in coverlay layer 504 , for example. Note that sidewall 518 is beveled.
- the beveling of sidewall 518 may be achieved via a laser or other angled cutting means, for example.
- the beveled edge of sidewall 518 may create a naturally reflective surface and assist is transmitting light rays 516 away from light source 514 in a transverse direction outward through second area 512 .
- Light rays 516 may provide illumination in a space 520 between transmission layer 506 and a cover 522 .
- cover 522 may include a non-translucent portion 524 and a translucent portion 526 .
- light rays 516 which were reflected and transmitted through second area 512 and into space 520 , may pass through portion 526 of cover 522 as diffused or indirect light rays 516 .
- Light rays 516 may be appropriately be referred to as indirect because there is no line of sight LS directly from translucent portion 526 of cover 522 to light source 514 , as indicated by the line LS shown in FIG. 5 .
- the size of space 520 and/or the distance between cover 522 and a border edge of first area 510 and second area 512 may be such that a line LS from translucent portion 526 would not intersect with light source 510 . In this manner, a bright spot from visible direct lighting through translucent portion 526 may be eliminated or substantially minimized.
- Apparatus 600 of FIG. 6 illustrates a chamber 602 (that is hidden as illustrated by the dashed star-shaped perimeter line).
- Chamber 602 is formed with backing layer 604 , a void in a coverlay layer 606 (hidden), and a transmission layer 608 .
- Light is emitted into chamber 602 via light source 610 located substantially in the center of the star-shaped chamber 602 .
- Light from light source 610 may be blocked partially or entirely by a first area 612 of transmission layer 608 in the same manner as described above with respect to first areas 120 , 410 , and 510 . Further, in FIG.
- second areas 614 may be more light transmissive than first area 612 so as to allow light rays 616 , which have generally been vectored, channeled, or funneled off of sidewall 618 of chamber 602 in a first direction 620 away from light source 610 , to pass into the atmosphere via the second areas 614 in a second direction transverse to the first direction.
- the shape of the chamber need not be limited to the partially parabolic shape depicted in FIGS. 1 and 2B-2D . Instead, alternate shapes are contemplated, such as the star of FIG. 6 or other shapes including square, rectangle, triangle, circle, etc. To avoid dampening of light rays and loss of light to corners of a shape of a chamber, shapes without corners are implemented in some instances.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/212,281 US11293603B2 (en) | 2016-05-13 | 2018-12-06 | Light vectoring apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/154,478 US10309589B2 (en) | 2016-05-13 | 2016-05-13 | Light vectoring apparatus |
US16/212,281 US11293603B2 (en) | 2016-05-13 | 2018-12-06 | Light vectoring apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/154,478 Continuation US10309589B2 (en) | 2016-05-13 | 2016-05-13 | Light vectoring apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
US20190162372A1 US20190162372A1 (en) | 2019-05-30 |
US11293603B2 true US11293603B2 (en) | 2022-04-05 |
Family
ID=60266812
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/154,478 Active 2036-10-21 US10309589B2 (en) | 2016-05-13 | 2016-05-13 | Light vectoring apparatus |
US16/212,281 Active 2036-08-31 US11293603B2 (en) | 2016-05-13 | 2018-12-06 | Light vectoring apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/154,478 Active 2036-10-21 US10309589B2 (en) | 2016-05-13 | 2016-05-13 | Light vectoring apparatus |
Country Status (6)
Country | Link |
---|---|
US (2) | US10309589B2 (en) |
EP (1) | EP3455551A4 (en) |
JP (1) | JP6825009B2 (en) |
KR (1) | KR102339233B1 (en) |
CN (1) | CN109477630A (en) |
WO (1) | WO2017197340A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10309589B2 (en) | 2016-05-13 | 2019-06-04 | Rohinni, LLC | Light vectoring apparatus |
TWI639172B (en) * | 2017-12-01 | 2018-10-21 | 致伸科技股份有限公司 | Luminous keyboard |
US10692663B2 (en) * | 2018-05-31 | 2020-06-23 | Darfon Electronics Corp. | Light source board, manufacturing method thereof, and luminous keyboard using the same |
JP7345346B2 (en) * | 2019-10-11 | 2023-09-15 | コイズミ照明株式会社 | lighting equipment |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5568367A (en) | 1994-06-08 | 1996-10-22 | Universal Electronics Inc. | Remote control with key lighting |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
JP2004022374A (en) | 2002-06-18 | 2004-01-22 | Yazaki Corp | Switch |
JP2004022378A (en) | 2002-06-18 | 2004-01-22 | Yazaki Corp | Switch |
CN1839279A (en) | 2003-07-25 | 2006-09-27 | Az电子材料日本株式会社 | Surface light source device |
US20100061789A1 (en) | 2008-09-11 | 2010-03-11 | Chin-Wen Chou | Self-luminous keyboard with brightness-enhanced keycaps |
US20100097246A1 (en) * | 2008-10-16 | 2010-04-22 | Alps Electric Co., Ltd. | Input device and keyboard device having illumination function |
JP2010097801A (en) | 2008-10-16 | 2010-04-30 | Alps Electric Co Ltd | Input device having illumination function |
US20100141172A1 (en) * | 2005-02-14 | 2010-06-10 | Mitsubishi Chemical Corporation | Light Source, Solid State Light Emitting Element Module, Fluorescent Module, Light Orientation Element Module, Illumination Device, Image Display Device, and Light Source Adjustment Method |
US20100147661A1 (en) | 2008-12-16 | 2010-06-17 | Yasunori Takeda | Key sheet, light blocking effect sheet, push button switch and key sheet manufacturing method |
CN101918245A (en) | 2007-12-12 | 2010-12-15 | 英特拉姆有限责任公司 | Light for vehicles |
US20110051412A1 (en) | 2009-08-27 | 2011-03-03 | Chansung Jeong | Backlight unit and display device |
US20110211335A1 (en) * | 2010-12-06 | 2011-09-01 | Se Jin Ko | Backlight unit |
US20110220479A1 (en) * | 2010-03-15 | 2011-09-15 | Mi Zhou | Keys with double-diving-board spring mechanisms |
CN102207277A (en) | 2010-03-30 | 2011-10-05 | 恩普乐股份有限公司 | Light flux controlling member, light emitting device and lighting device |
US20110303439A1 (en) * | 2009-02-24 | 2011-12-15 | Shingo Kaimori | Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
US20110309384A1 (en) | 2010-06-22 | 2011-12-22 | Nitto Denko Corporation | Semiconductor light emitting device |
US20120057351A1 (en) | 2010-09-07 | 2012-03-08 | Ruud Lighting, Inc. | LED Lighting Fixture |
US20120161113A1 (en) | 2007-05-31 | 2012-06-28 | Nthdegree Technologies Worldwide Inc. | Diode for a Printable Composition |
US20120171455A1 (en) * | 2009-10-07 | 2012-07-05 | Salah Boussaad | Filled polyimides and methods related thereto |
KR20120073932A (en) * | 2010-12-27 | 2012-07-05 | 엘지이노텍 주식회사 | Light emitting element array |
CN102691899A (en) | 2011-03-22 | 2012-09-26 | 隆达电子股份有限公司 | Lampshade and lamp structure |
US20120286306A1 (en) * | 2009-11-11 | 2012-11-15 | Danmarks Tekniske Universitet | Diffusely radiating led light system |
JP2013182730A (en) | 2012-02-29 | 2013-09-12 | Sharp Corp | Lighting module, and lighting device having the same |
JP2013201060A (en) | 2012-03-26 | 2013-10-03 | Kawai Musical Instr Mfg Co Ltd | Switch, and keyboard instrument having the same |
US8636379B2 (en) | 2010-02-19 | 2014-01-28 | Federal Signal Corporation | Warning light assembly; components; and, methods |
JP3199622U (en) | 2015-06-19 | 2015-09-03 | 株式会社島津製作所 | Key operation mechanism |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
US20170328524A1 (en) | 2016-05-13 | 2017-11-16 | Rohinni, Inc. | Light Vectoring Apparatus |
US10276326B1 (en) * | 2015-12-22 | 2019-04-30 | Apple Inc. | Illumination systems with light-emitting diodes |
-
2016
- 2016-05-13 US US15/154,478 patent/US10309589B2/en active Active
-
2017
- 2017-05-12 EP EP17796988.8A patent/EP3455551A4/en active Pending
- 2017-05-12 JP JP2018559947A patent/JP6825009B2/en active Active
- 2017-05-12 KR KR1020187036179A patent/KR102339233B1/en active IP Right Grant
- 2017-05-12 CN CN201780043316.0A patent/CN109477630A/en active Pending
- 2017-05-12 WO PCT/US2017/032522 patent/WO2017197340A1/en unknown
-
2018
- 2018-12-06 US US16/212,281 patent/US11293603B2/en active Active
Patent Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5568367A (en) | 1994-06-08 | 1996-10-22 | Universal Electronics Inc. | Remote control with key lighting |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
JP2004022374A (en) | 2002-06-18 | 2004-01-22 | Yazaki Corp | Switch |
JP2004022378A (en) | 2002-06-18 | 2004-01-22 | Yazaki Corp | Switch |
CN1839279A (en) | 2003-07-25 | 2006-09-27 | Az电子材料日本株式会社 | Surface light source device |
US20060268571A1 (en) | 2003-07-25 | 2006-11-30 | Takamasa Harada | Surface light source device |
US20100141172A1 (en) * | 2005-02-14 | 2010-06-10 | Mitsubishi Chemical Corporation | Light Source, Solid State Light Emitting Element Module, Fluorescent Module, Light Orientation Element Module, Illumination Device, Image Display Device, and Light Source Adjustment Method |
US20120161113A1 (en) | 2007-05-31 | 2012-06-28 | Nthdegree Technologies Worldwide Inc. | Diode for a Printable Composition |
CN101918245A (en) | 2007-12-12 | 2010-12-15 | 英特拉姆有限责任公司 | Light for vehicles |
US20100061789A1 (en) | 2008-09-11 | 2010-03-11 | Chin-Wen Chou | Self-luminous keyboard with brightness-enhanced keycaps |
JP2010097801A (en) | 2008-10-16 | 2010-04-30 | Alps Electric Co Ltd | Input device having illumination function |
US20100097246A1 (en) * | 2008-10-16 | 2010-04-22 | Alps Electric Co., Ltd. | Input device and keyboard device having illumination function |
US20100147661A1 (en) | 2008-12-16 | 2010-06-17 | Yasunori Takeda | Key sheet, light blocking effect sheet, push button switch and key sheet manufacturing method |
US20110303439A1 (en) * | 2009-02-24 | 2011-12-15 | Shingo Kaimori | Adhesive resin compositions, and laminates and flexible printed wiring boards using same |
US20110051412A1 (en) | 2009-08-27 | 2011-03-03 | Chansung Jeong | Backlight unit and display device |
US20120171455A1 (en) * | 2009-10-07 | 2012-07-05 | Salah Boussaad | Filled polyimides and methods related thereto |
US20120286306A1 (en) * | 2009-11-11 | 2012-11-15 | Danmarks Tekniske Universitet | Diffusely radiating led light system |
US8636379B2 (en) | 2010-02-19 | 2014-01-28 | Federal Signal Corporation | Warning light assembly; components; and, methods |
US20110220479A1 (en) * | 2010-03-15 | 2011-09-15 | Mi Zhou | Keys with double-diving-board spring mechanisms |
US20110255291A1 (en) | 2010-03-30 | 2011-10-20 | Akinobu Seki | Light flux controlling member, light emitting device, and lighting device |
CN102207277A (en) | 2010-03-30 | 2011-10-05 | 恩普乐股份有限公司 | Light flux controlling member, light emitting device and lighting device |
US20110309384A1 (en) | 2010-06-22 | 2011-12-22 | Nitto Denko Corporation | Semiconductor light emitting device |
US20120057351A1 (en) | 2010-09-07 | 2012-03-08 | Ruud Lighting, Inc. | LED Lighting Fixture |
US20110211335A1 (en) * | 2010-12-06 | 2011-09-01 | Se Jin Ko | Backlight unit |
KR20120073932A (en) * | 2010-12-27 | 2012-07-05 | 엘지이노텍 주식회사 | Light emitting element array |
CN102691899A (en) | 2011-03-22 | 2012-09-26 | 隆达电子股份有限公司 | Lampshade and lamp structure |
US20120243216A1 (en) | 2011-03-22 | 2012-09-27 | Lextar Electronics Corporation | Lamp cover and lamp structure |
JP2013182730A (en) | 2012-02-29 | 2013-09-12 | Sharp Corp | Lighting module, and lighting device having the same |
JP2013201060A (en) | 2012-03-26 | 2013-10-03 | Kawai Musical Instr Mfg Co Ltd | Switch, and keyboard instrument having the same |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
JP3199622U (en) | 2015-06-19 | 2015-09-03 | 株式会社島津製作所 | Key operation mechanism |
US10276326B1 (en) * | 2015-12-22 | 2019-04-30 | Apple Inc. | Illumination systems with light-emitting diodes |
US20170328524A1 (en) | 2016-05-13 | 2017-11-16 | Rohinni, Inc. | Light Vectoring Apparatus |
Non-Patent Citations (9)
Title |
---|
Chinese Office Action dated Dec. 24, 2020 for Chinese Patent Application No. 201780043316.0, a counterpart foreign application of U.S. Pat. No. 10,309,589, 8 pages. |
Definition of Against, retrieved from www.dictionary.cambridge.org/us/dictionary/english/against on Apr. 28, 2021 (Year: 2021). * |
Definition of Chamber, retrieved from www.vocabulary.com/dictionary/chamber on Apr. 28, 2021 (Year: 2021). * |
Machine translation of KR-20120073932-A, retrieved Nov. 8, 2021 (Year: 2021). * |
PCT Search Report and Written Opinion, dated Aug. 31, 2017, for PCT Application No. PCT/US17/32522, 9 pages. |
The European Office Action dated Oct. 22, 2020 for European Patent Application No. 17796988.8, a counterpart of U.S. Pat. No. 10,309,589, 5 pages. |
The Extended European Search Report dated Nov. 11, 2019 for European Patent Application No. 17796988.8, 9 pages. |
The Japanese Office Action dated Sep. 1, 2020 for Japanese Patent Application No. 2018-559947, a counterpart of U.S. Pat. No. 10,309,589, 14 pages. |
U.S. Appl. No. 62/270,833 to Wang et al., filed Dec. 22, 2015 (Year: 2015). * |
Also Published As
Publication number | Publication date |
---|---|
US20170328524A1 (en) | 2017-11-16 |
JP6825009B2 (en) | 2021-02-03 |
KR102339233B1 (en) | 2021-12-13 |
WO2017197340A1 (en) | 2017-11-16 |
US10309589B2 (en) | 2019-06-04 |
KR20190016965A (en) | 2019-02-19 |
JP2019515473A (en) | 2019-06-06 |
US20190162372A1 (en) | 2019-05-30 |
CN109477630A (en) | 2019-03-15 |
EP3455551A4 (en) | 2019-12-11 |
EP3455551A1 (en) | 2019-03-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11293603B2 (en) | Light vectoring apparatus | |
KR102389676B1 (en) | Method and apparatus for light diffusion | |
EP3133432B1 (en) | Optical lens, light emitting device package using the optical lens, and backlight unit | |
US7309151B2 (en) | Light emitting panel | |
US8643041B2 (en) | Light emitting device package | |
EP2355194A2 (en) | Light emitting device package | |
JP2007053063A (en) | Sheet switch module | |
CN111129258A (en) | Light emitting device and light emitting module | |
JP2009506501A (en) | Direct type backlight with light source for bifunctional spectrometer | |
CN111458925A (en) | Light source module and display device | |
CN111025743A (en) | Light source module and display device | |
US10678036B2 (en) | Optical device and light source module including the same | |
JP6580161B2 (en) | Display device | |
US20210391515A1 (en) | Light - emitter - mounted substrate and backlight | |
US9310046B2 (en) | Light emitting module and lighting device using the same | |
JP2013110057A (en) | Switch device | |
US20110043724A1 (en) | Backlight unit and display device using the same | |
JP2008277189A (en) | Linear light source apparatus, and manufacturing method thereof | |
JPH0429579Y2 (en) | ||
KR20130095051A (en) | Ligout source package and backlight unit including the same | |
KR101818752B1 (en) | Light emitting device array | |
US20240006565A1 (en) | Light-emitting module and method for manufacturing the same, display panel, and electronic device | |
JP2022180211A (en) | Electronic device and manufacturing method thereof | |
TW202121030A (en) | Surface-emitting light source capable of suppressing unevenness in luminance of leaked light from a lighting region to an adjacent extinguishing region | |
KR200462966Y1 (en) | Light emitting diode display |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
|
AS | Assignment |
Owner name: ROHINNI, LLC, IDAHO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PETERSON, CODY;WENDT, JUSTIN;HUSKA, ANDREW;AND OTHERS;SIGNING DATES FROM 20180516 TO 20180524;REEL/FRAME:048504/0367 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO MICRO (ORIGINAL EVENT CODE: MICR); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
AS | Assignment |
Owner name: COWLES COMPANY, WASHINGTON Free format text: SECURITY INTEREST;ASSIGNOR:ROHINNI, INC.;REEL/FRAME:064417/0238 Effective date: 20230404 |
|
AS | Assignment |
Owner name: MAGNA ELECTRONICS, INC., CANADA Free format text: LICENSE;ASSIGNOR:ROHINNI INC.;REEL/FRAME:066286/0270 Effective date: 20220921 |
|
AS | Assignment |
Owner name: COWLES SEMI, LLC, WASHINGTON Free format text: COURT ORDER;ASSIGNOR:ROHINNI, INC.;REEL/FRAME:067428/0189 Effective date: 20240507 |