TWM657011U - Filter - Google Patents
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- TWM657011U TWM657011U TW113200410U TW113200410U TWM657011U TW M657011 U TWM657011 U TW M657011U TW 113200410 U TW113200410 U TW 113200410U TW 113200410 U TW113200410 U TW 113200410U TW M657011 U TWM657011 U TW M657011U
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 238000002955 isolation Methods 0.000 claims abstract description 30
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 73
- 230000008878 coupling Effects 0.000 claims description 14
- 238000010168 coupling process Methods 0.000 claims description 14
- 238000005859 coupling reaction Methods 0.000 claims description 14
- 238000006880 cross-coupling reaction Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 210000005069 ears Anatomy 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
本申請公開一種濾波器，包括：殼體、電路板及設置在殼體兩側的輸入連接器和輸出連接器。殼體包括上蓋和下蓋，上蓋可拆卸地安裝於下蓋，下蓋設置有隔離壁；電路板設置在上蓋和下蓋之間且包括貫穿電路板的多個導電通孔和設置在電路板的相對兩側的兩個金屬諧振層，兩個金屬諧振層各自包括的間隔設置的多個諧振器、隔離相鄰諧振器的隔離圖案和與多個諧振器連接的接地邊框，通過多個導電通孔相互對應連接，兩個金屬諧振層各自包括的隔離圖案對應配置於隔離壁上，兩個金屬諧振層各自包括的接地邊框對應配置於下蓋朝向上蓋的邊緣上；輸入連接器的連接桿和位於殼體內一個側邊的一個諧振器相連；輸出連接器的連接桿和位於殼體內另一個側邊的一個諧振器相連。The present application discloses a filter, comprising: a housing, a circuit board, and an input connector and an output connector arranged on both sides of the housing. The housing comprises an upper cover and a lower cover, the upper cover is detachably mounted on the lower cover, and the lower cover is provided with an isolation wall; the circuit board is arranged between the upper cover and the lower cover and comprises a plurality of conductive through holes penetrating the circuit board and two metal resonant layers arranged on opposite sides of the circuit board, the two metal resonant layers each comprising a plurality of resonators arranged at intervals, an isolation pattern for isolating adjacent resonators, and a grounding frame connected to the plurality of resonators, The two metal resonant layers are connected to each other through a plurality of conductive through holes, and the isolation patterns included in each of the two metal resonant layers are correspondingly arranged on the isolation wall, and the grounding frames included in each of the two metal resonant layers are correspondingly arranged on the edge of the lower cover facing the upper cover; the connecting rod of the input connector is connected to a resonator located on one side of the housing; and the connecting rod of the output connector is connected to a resonator located on the other side of the housing.
Description
本申請涉及通訊技術領域，具體涉及一種濾波器。The present application relates to the field of communication technology, and in particular to a filter.
在無線通訊系統中，外部環境的干擾會嚴重影響整個系統的性能，因此，用於選擇通訊信號、濾除雜波或干擾信號的濾波器成為必不可少的元件。In wireless communication systems, interference from the external environment can seriously affect the performance of the entire system. Therefore, filters used to select communication signals and filter out noise or interference signals become essential components.
然而，不同的通訊環境需要不同規格的濾波器，不同規格的濾波器所需的諧振器的材料、尺寸大小無法統一，且可能需要運用多種加工手段（例如：車、銑、CNC加工、拉伸、冷鐓等工藝），導致加工成本很高，存在不能大批量模組化生產的問題。此外，不同規格濾波器也存在零件尺寸相對不穩定，同時裝配複雜的問題。However, different communication environments require filters of different specifications. The materials and sizes of the resonators required for filters of different specifications cannot be unified, and multiple processing methods may be required (such as turning, milling, CNC processing, stretching, cold rolling, etc.), resulting in high processing costs and the problem of not being able to produce modular products in large quantities. In addition, filters of different specifications also have the problem of relatively unstable part sizes and complex assembly.
本申請實施例提供一種濾波器，其能夠解決現有技術中適用於不同通訊環境的濾波器因規格不同而存在不能大批量模組化生產、零件尺寸相對不穩定與裝配複雜的問題。The present application embodiment provides a filter that can solve the problems in the prior art that filters suitable for different communication environments cannot be mass-produced in a modular manner due to different specifications, the size of the parts is relatively unstable, and the assembly is complicated.
為了解決上述技術問題，本申請是這樣實現的：In order to solve the above technical problems, this application is implemented as follows:
本申請提供了一種濾波器，其包括：殼體、電路板、輸入連接器和輸出連接器。殼體包括上蓋和下蓋，上蓋可拆卸地安裝於下蓋，下蓋設置有隔離壁；電路板設置在上蓋和下蓋之間，且包括貫穿電路板的多個導電通孔和設置在電路板的相對兩側的兩個金屬諧振層，兩個金屬諧振層各自包括的間隔設置的多個諧振器、隔離相鄰諧振器的隔離圖案和與多個諧振器連接的接地邊框，通過多個導電通孔相互對應連接，兩個金屬諧振層各自包括的隔離圖案對應配置於隔離壁上，兩個金屬諧振層各自包括的接地邊框對應配置於下蓋朝向上蓋的邊緣上；輸入連接器設置在殼體的一側，輸入連接器的連接桿和位於殼體內一個側邊的一個諧振器相連；輸出連接器設置在殼體的另一側，輸出連接器的連接桿和位於殼體內另一個側邊的一個諧振器相連。The present application provides a filter, which includes: a housing, a circuit board, an input connector, and an output connector. The housing includes an upper cover and a lower cover, the upper cover is detachably mounted on the lower cover, and the lower cover is provided with an isolation wall; the circuit board is arranged between the upper cover and the lower cover, and includes a plurality of conductive through holes penetrating the circuit board and two metal resonant layers arranged on opposite sides of the circuit board, the two metal resonant layers each include a plurality of resonators arranged at intervals, an isolation pattern for isolating adjacent resonators, and a grounding frame connected to the plurality of resonators, which are connected to each other through a plurality of conductive through holes. The isolation patterns included in the two metal resonant layers are respectively configured on the isolation wall, and the grounding frames included in the two metal resonant layers are respectively configured on the edge of the lower cover facing the upper cover; the input connector is arranged on one side of the shell, and the connecting rod of the input connector is connected to a resonator located on one side of the shell; the output connector is arranged on the other side of the shell, and the connecting rod of the output connector is connected to a resonator located on the other side of the shell.
在本申請實施例中，通過集成配置於電路板上的隔離圖案和接地邊框與殼體（即上蓋和下蓋）的設計，仿真形成空氣腔，搭配集成配置於電路板上的諧振器，構成印刷電路板（printed circuit board，PCB）式堆疊濾波器。其中，PCB板式堆疊濾波器包括上蓋、下蓋、集成配置有兩個金屬諧振層的電路板、輸入連接器和輸出連接器；上蓋和下蓋可採用合金材質製成，其表面可採用鍍銀、鍍銅或鍍金處理；兩個金屬諧振層可採用沉鋁、沉銅、沉銀或沉金方式集成配置於電路板上；因此，PCB板式堆疊濾波器具有易於構建的框架，且濾波器所需的功率、頻率、插損、耦合也能在有限的空間內實現最優電氣性能，從而適用於各種拓撲結構，同時也能夠解決現有技術中適用於不同通訊環境的濾波器因規格不同而存在不能大批量模組化生產、零件尺寸相對不穩定與裝配複雜的問題。In the embodiment of the present application, an air cavity is simulated by designing an isolation pattern and a grounding frame and a housing (i.e., an upper cover and a lower cover) integrated on a circuit board, and a printed circuit board (PCB) stacked filter is formed by matching a resonator integrated on the circuit board. The PCB stacked filter includes an upper cover, a lower cover, a circuit board integrated with two metal resonant layers, an input connector, and an output connector; the upper cover and the lower cover can be made of alloy material, and their surfaces can be silver-plated, copper-plated, or gold-plated; the two metal resonant layers can be integrated on the circuit board by aluminum deposition, copper deposition, silver deposition, or gold deposition; therefore, the PCB stacked filter is a kind of filter that can be used for the purpose of filtering the filter. The stacked filter has an easy-to-build framework, and the power, frequency, insertion loss, and coupling required by the filter can also achieve the best electrical performance in a limited space, making it suitable for various topological structures. At the same time, it can also solve the problems in the existing technology that filters suitable for different communication environments cannot be mass-produced in a modular manner due to different specifications, the size of parts is relatively unstable, and the assembly is complicated.
以下將配合相關附圖來說明本申請的實施例。在這些附圖中，相同的標號表示相同或類似的組件或方法流程。The following will be used in conjunction with the accompanying drawings to illustrate the embodiments of the present application. In these drawings, the same reference numerals represent the same or similar components or method flows.
必須瞭解的是，使用在本說明書中的“包含”、“包括”等詞，是被配置為表示存在特定的技術特徵、數值、方法步驟、作業處理及/或組件，但並不排除可加上更多的技術特徵、數值、方法步驟、作業處理、組件，或以上的任意組合。It must be understood that the words "comprise", "include" and the like used in this specification are configured to indicate the existence of specific technical features, numerical values, method steps, operation processes and/or components, but do not exclude the addition of more technical features, numerical values, method steps, operation processes, components, or any combination of the above.
必須瞭解的是，當組件描述為“連接”或“耦接”至另一組件時，可以是直接連結、或耦接至其他組件，可能出現中間組件。相反地，當組件描述為“直接連接”或“直接耦接”至另一組件時，其中不存在任何中間組件。It should be understood that when a component is described as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, and intermediate components may be present. Conversely, when a component is described as being "directly connected" or "directly coupled" to another component, there are no intermediate components.
請參閱圖1至圖5，圖1為依據本申請的濾波器的一實施例立體示意圖，圖2為圖1的濾波器的***示意圖，圖3為圖1所示的AA線段剖面示意圖，圖4為圖1所示的BB線段剖面示意圖，圖5為圖1的電路板與金屬諧振層的集成示意圖。如圖1至圖5所示，濾波器1包括：殼體11、電路板12、輸入連接器13和輸出連接器14。Please refer to Figures 1 to 5, Figure 1 is a three-dimensional schematic diagram of an embodiment of the filter according to the present application, Figure 2 is an exploded schematic diagram of the filter of Figure 1, Figure 3 is a schematic diagram of the AA line segment cross-section shown in Figure 1, Figure 4 is a schematic diagram of the BB line segment cross-section shown in Figure 1, and Figure 5 is a schematic diagram of the integration of the circuit board and the metal resonant layer of Figure 1. As shown in Figures 1 to 5, the filter 1 includes: a housing 11, a circuit board 12, an input connector 13, and an output connector 14.
殼體11包括上蓋111和下蓋112，上蓋111可拆卸地安裝於下蓋112，下蓋112設置有隔離壁1121。其中，上蓋111和下蓋112僅需表面為金屬表面，因此，可大批量採用各種材質（例如：合金材質）模組化生產後，表面經過電鍍金屬（例如：銀、銅或金）處理即可。The housing 11 includes an upper cover 111 and a lower cover 112. The upper cover 111 is detachably mounted on the lower cover 112. The lower cover 112 is provided with a separation wall 1121. The upper cover 111 and the lower cover 112 only need to have metal surfaces. Therefore, various materials (such as alloy materials) can be used in large quantities for modular production, and the surfaces can be electroplated with metal (such as silver, copper or gold).
電路板12設置在上蓋111和下蓋112之間，且包括貫穿電路板12的多個導電通孔121（如圖2、圖3和圖5中的虛線圓圈所示）和設置在電路板12的相對兩側的兩個金屬諧振層122（即兩個金屬諧振層122集成配置於電路板12上，如圖6所示，圖6為圖5的側視示意圖，需注意的是，為避免圖6的圖面過於複雜，僅繪製四個導電通孔121為代表），兩個金屬諧振層122各自包括間隔設置的多個諧振器1221、隔離相鄰諧振器1221的隔離圖案1222和與多個諧振器1221連接的接地邊框1223，兩個金屬諧振層122各自包括的多個諧振器1221、隔離圖案1222和接地邊框1223通過多個導電通孔121相互對應連接（即設置在電路板12的相對兩側的兩個金屬諧振層122通過多個導電通孔121相互對應電性連接）。The circuit board 12 is disposed between the upper cover 111 and the lower cover 112, and includes a plurality of conductive through holes 121 penetrating the circuit board 12 (as shown by the dotted circles in FIGS. 2, 3 and 5) and two metal resonant layers 122 disposed on opposite sides of the circuit board 12 (i.e., the two metal resonant layers 122 are integrated and configured on the circuit board 12, as shown in FIG. 6, which is a side view schematic diagram of FIG. 5. It should be noted that, in order to avoid the drawing of FIG. 6 being too complicated, only four conductive through holes 121 are drawn as a representative), the two metal resonant layers 122 each includes a plurality of resonators 1221 arranged at intervals, an isolation pattern 1222 isolating adjacent resonators 1221, and a grounding frame 1223 connected to the plurality of resonators 1221. The plurality of resonators 1221, the isolation pattern 1222, and the grounding frame 1223 included in each of the two metal resonant layers 122 are connected to each other correspondingly through a plurality of conductive through holes 121 (that is, the two metal resonant layers 122 arranged on opposite sides of the circuit board 12 are electrically connected to each other correspondingly through a plurality of conductive through holes 121).
其中，兩個金屬諧振層122各自包括的隔離圖案1222對應配置於隔離壁1121上，兩個金屬諧振層122各自包括的接地邊框1223對應配置於下蓋112朝向上蓋111的邊緣1122上，以仿真形成濾波器1所需的空氣腔；隔離圖案1222與隔離壁1121的數量和形狀相互對應（在這個實施例中，隔離圖案1222與隔離壁1121的數量為三個，兩個隔離圖案1222的形狀為長條形，一個隔離圖案1222的形狀為T形）；諧振器1221和隔離圖案1222的數量、形狀與配置位置可根據濾波器1的信號傳輸路徑與其他需求進行設計（在這個實施例中，諧振器1221的形狀為倒山形，諧振器1221的數量為八個，分兩排設置且呈現鏡像分佈）；多個導電通孔121與兩個金屬諧振層122的材質可以相同，也可以不同；兩個金屬諧振層122可採用沉鋁、沉銅、沉銀或沉金方式圖案化集成於電路板12上，利於大批量模組化生產且不存在裝配複雜的問題。需說明的是，在這個實施例中，兩個金屬諧振層122各自包括的多個諧振器1221、隔離圖案1222和接地邊框1223的形狀均相同，因此，圖2、圖3和圖5中僅描繪出單一個金屬諧振層122的多個諧振器1221、隔離圖案1222和接地邊框1223的形狀。The isolation patterns 1222 included in each of the two metal resonant layers 122 are correspondingly arranged on the isolation wall 1121, and the grounding frames 1223 included in each of the two metal resonant layers 122 are correspondingly arranged on the edge 1122 of the lower cover 112 facing the upper cover 111, so as to simulate the air cavity required for forming the filter 1; the number and shape of the isolation patterns 1222 and the isolation wall 1121 correspond to each other (in this embodiment, the number of the isolation patterns 1222 and the isolation wall 1121 is three, the shapes of the two isolation patterns 1222 are long strips, and the shape of one isolation pattern 1222 is T-shaped) ; The number, shape and configuration position of the resonator 1221 and the isolation pattern 1222 can be designed according to the signal transmission path of the filter 1 and other requirements (in this embodiment, the shape of the resonator 1221 is an inverted mountain shape, and the number of resonators 1221 is eight, which are arranged in two rows and present a mirror image distribution); the materials of the multiple conductive through holes 121 and the two metal resonant layers 122 can be the same or different; the two metal resonant layers 122 can be patterned and integrated on the circuit board 12 by aluminum deposition, copper deposition, silver deposition or gold deposition, which is conducive to large-scale modular production and does not have the problem of complex assembly. It should be noted that in this embodiment, the shapes of the multiple resonators 1221, the isolation pattern 1222 and the ground frame 1223 included in each of the two metal resonant layers 122 are the same. Therefore, Figures 2, 3 and 5 only depict the shapes of the multiple resonators 1221, the isolation pattern 1222 and the ground frame 1223 of a single metal resonant layer 122.
輸入連接器13設置在殼體11的一側，輸入連接器13的連接桿131和位於殼體11內一個側邊的一個諧振器1221相連；輸出連接器14設置在殼體11的另一側，輸出連接器14的連接桿141和位於殼體11內另一個側邊的一個諧振器1221相連。其中，輸入連接器13用於輸入信號至濾波器1，輸出連接器14用於輸出經由濾波器1濾波處理後的信號，輸入連接器13和輸出連接器14可通過螺釘2設置在殼體11的兩側，輸入連接器13的連接桿131與其相鄰的諧振器1221相連，輸出連接器14的連接桿141與其相鄰的諧振器1221相連，輸入連接器13和輸出連接器14相連接的諧振器1221位於同一金屬諧振層122（如圖3所示）。The input connector 13 is disposed on one side of the housing 11, and a connecting rod 131 of the input connector 13 is connected to a resonator 1221 located on one side of the housing 11; the output connector 14 is disposed on the other side of the housing 11, and a connecting rod 141 of the output connector 14 is connected to a resonator 1221 located on another side of the housing 11. The input connector 13 is used to input a signal to the filter 1, and the output connector 14 is used to output a signal after filtering by the filter 1. The input connector 13 and the output connector 14 can be arranged on both sides of the housing 11 through screws 2. The connecting rod 131 of the input connector 13 is connected to the adjacent resonator 1221, and the connecting rod 141 of the output connector 14 is connected to the adjacent resonator 1221. The resonators 1221 connected to the input connector 13 and the output connector 14 are located on the same metal resonant layer 122 (as shown in FIG. 3 ).
在一實施例中，濾波器1還可包括抽頭片(tap piece)15，抽頭片15設置於殼體11內且集成配置於電路板12上，輸入連接器13的連接桿131通過抽頭片15和位於殼體11內所述一個側邊的一個諧振器1221相連。In one embodiment, the filter 1 may further include a tap piece 15, which is disposed in the housing 11 and integrated on the circuit board 12, and the connecting rod 131 of the input connector 13 is connected to a resonator 1221 located on one side of the housing 11 through the tap piece 15.
在一實施例中，輸出連接器14的連接桿141可為連接器內導體1411和連接主桿1412，連接器內導體1411通過連接主桿1412連接位於殼體11內所述另一個側邊的一個諧振器1221相連。In one embodiment, the connecting rod 141 of the output connector 14 may be a connector inner conductor 1411 and a connecting main rod 1412 , and the connector inner conductor 1411 is connected to a resonator 1221 located at the other side of the housing 11 via the connecting main rod 1412 .
在一實施例中，上蓋111可設置有多個螺桿孔1111，濾波器1還可包括多個調諧螺桿16和/或多個耦合螺桿17，多個調諧螺桿16和/或多個耦合螺桿17穿過多個螺桿孔1111，伸入到殼體11內。其中，調諧螺桿16和耦合螺桿17伸入殼體11內的長度可調，調諧螺桿16用於調整諧振頻率，耦合螺桿17用於調整耦合量，提高濾波器1的精度，使得濾波器1的整體指標可調節，便於大批量生產；調諧螺桿16和耦合螺桿17可採用合金材質製成，調諧螺桿16和耦合螺桿17的表面可採用鈍化、鍍金屬（例如：銅、銀、金）及打蠟處理。In one embodiment, the upper cover 111 may be provided with a plurality of screw holes 1111 , and the filter 1 may further include a plurality of tuning screws 16 and/or a plurality of coupling screws 17 , and the plurality of tuning screws 16 and/or a plurality of coupling screws 17 pass through the plurality of screw holes 1111 and extend into the housing 11 . The lengths of the tuning screw 16 and the coupling screw 17 extending into the housing 11 are adjustable. The tuning screw 16 is used to adjust the harmonic frequency, and the coupling screw 17 is used to adjust the coupling amount, thereby improving the accuracy of the filter 1 and making the overall index of the filter 1 adjustable, which is convenient for mass production. The tuning screw 16 and the coupling screw 17 can be made of alloy material, and the surfaces of the tuning screw 16 and the coupling screw 17 can be passivated, metal-plated (e.g., copper, silver, gold) and waxed.
在一實施例中，下蓋112朝向上蓋111的邊緣1122上可設有定位銷1123，電路板12上可設置有具有定位孔123的定位耳124，定位銷1123和定位耳124的定位孔123對位匹配，用以對電路板12進行固定。其中，定位銷1123和定位耳124的數量與配置位置可依據實際需求進行調整。In one embodiment, a positioning pin 1123 may be provided on the edge 1122 of the lower cover 112 facing the upper cover 111, and a positioning ear 124 having a positioning hole 123 may be provided on the circuit board 12. The positioning pin 1123 and the positioning hole 123 of the positioning ear 124 are aligned and matched to fix the circuit board 12. The number and configuration position of the positioning pin 1123 and the positioning ear 124 can be adjusted according to actual needs.
在一實施例中，下蓋112朝向上蓋111的邊緣1122上可設有錫膏，下蓋112與配置於電路板12上的接地邊框1223通過所述錫膏焊接。In one embodiment, solder paste may be provided on the edge 1122 of the lower cover 112 facing the upper cover 111, and the lower cover 112 and the grounding frame 1223 disposed on the circuit board 12 are welded by the solder paste.
在一實施例中，下蓋112的周緣可設置有多個螺紋槽1124，上蓋111的周緣可設置有多個設有螺紋孔1112的連接耳1113，濾波器1還可包括多個螺釘18，多個連接耳1113和多個螺紋槽1124通過多個螺釘18連接，以將上蓋111安裝於下蓋112。因此，當濾波器1出現故障需要修理或更換安裝在殼體11內配置有兩個金屬諧振層122的電路板12時，可便於拆卸並重複組裝使用。In one embodiment, the lower cover 112 may be provided with a plurality of threaded grooves 1124 on its periphery, the upper cover 111 may be provided with a plurality of connecting ears 1113 provided with threaded holes 1112 on its periphery, and the filter 1 may further include a plurality of screws 18, and the plurality of connecting ears 1113 and the plurality of threaded grooves 1124 are connected by the plurality of screws 18 to mount the upper cover 111 on the lower cover 112. Therefore, when the filter 1 fails and needs to be repaired or replaced, the circuit board 12 installed in the housing 11 and provided with two metal resonant layers 122 can be easily disassembled and reassembled for use.
在一實施例中，連接諧振器1221的多個導電通孔121的密度越大，則兩個金屬諧振層122各自包括的多個諧振器1221的品質因數（Q值）越大。具體地，多個導電通孔121越密集，Q值改善越明顯，但相鄰的導電通孔121之間的間距小於或等於濾波器1的諧振頻率的八分之一波長時，對Q值影響會逐步變小。In one embodiment, the greater the density of the plurality of conductive vias 121 connecting the resonators 1221, the greater the quality factor (Q value) of the plurality of resonators 1221 included in each of the two metal resonant layers 122. Specifically, the denser the plurality of conductive vias 121, the more obvious the improvement in the Q value, but when the spacing between adjacent conductive vias 121 is less than or equal to one eighth of the wavelength of the resonant frequency of the filter 1, the influence on the Q value will gradually decrease.
在一實施例中，兩個金屬諧振層122各自包括的多個諧振器1221的形狀可相同或不同。In one embodiment, the shapes of the plurality of resonators 1221 included in each of the two metal resonant layers 122 may be the same or different.
在一實施例中，兩個金屬諧振層122各自包括的多個諧振器1221的形狀可呈倒山形、T形、S形、F形或其它不規則形狀。In one embodiment, the shapes of the plurality of resonators 1221 included in each of the two metal resonant layers 122 may be inverted mountain shapes, T shapes, S shapes, F shapes, or other irregular shapes.
在一實施例中，兩個金屬諧振層122各自還可包括實現不相鄰的兩個諧振器1221之間的容***叉耦合的交叉耦合圖案1224（即飛桿），兩個金屬諧振層122各自包括的交叉耦合圖案1224通過多個導電通孔121對應連接。其中，交叉耦合圖案1224的數量與配置位置可根據濾波器1的實際需求進行設計。因此，交叉耦合圖案1224可集成配置於電路板12上，利於大批量模組化生產且不存在裝配複雜的問題。In one embodiment, each of the two metal resonant layers 122 may further include a cross-coupling pattern 1224 (i.e., a flying rod) for realizing capacitive cross-coupling between two non-adjacent resonators 1221, and the cross-coupling patterns 1224 included in each of the two metal resonant layers 122 are connected to each other through a plurality of conductive vias 121. The number and configuration positions of the cross-coupling patterns 1224 may be designed according to the actual requirements of the filter 1. Therefore, the cross-coupling patterns 1224 may be integrated and configured on the circuit board 12, which is conducive to mass modular production without the problem of complex assembly.
在一實施例中，兩個金屬諧振層122中的一個金屬諧振層122還可包括連接相鄰的兩個諧振器1221的加強筋1225。其中，加強筋1225用於加強相連接的兩個諧振器1221之間的耦合強度；加強筋1225的數量與配置位置可根據濾波器1的實際需求進行設計。因此，加強筋1225可集成配置於電路板12上，利於大批量模組化生產且不存在裝配複雜的問題。In one embodiment, one of the two metal resonant layers 122 may further include a reinforcing rib 1225 connecting two adjacent resonators 1221. The reinforcing rib 1225 is used to strengthen the coupling strength between the two connected resonators 1221; the number and configuration position of the reinforcing rib 1225 may be designed according to the actual requirements of the filter 1. Therefore, the reinforcing rib 1225 may be integrated and configured on the circuit board 12, which is conducive to mass modular production without the problem of complex assembly.
在一實施例中，電路板12可為單層板、雙層板、多層板中的任一種，電路板12的層數越多，則兩個金屬諧振層122各自包括的多個諧振器1221的品質因數（Q值）越小。換句話說，電路板12的層數越多，則兩個金屬諧振層122各自包括的多個諧振器1221的Q值會逐步惡化。In one embodiment, the circuit board 12 can be any one of a single-layer board, a double-layer board, and a multi-layer board. The more layers the circuit board 12 has, the smaller the quality factor (Q value) of the multiple resonators 1221 included in each of the two metal resonant layers 122. In other words, the more layers the circuit board 12 has, the smaller the Q value of the multiple resonators 1221 included in each of the two metal resonant layers 122 will be.
在一實施例中，電路板12可為多層板且可包括交錯堆疊的多個佈線層125及多個介電層126，多個介電層126可為相同材質或不同材質，多個佈線層125與兩個金屬諧振層122之間通過貫穿介電層126的多個導電通孔127電性連接（如圖7所示，圖7為本申請的電路板的一實施例的側視圖，需注意的是，為避免圖7的圖面過於複雜，僅繪製四個導電通孔127為代表）。In one embodiment, the circuit board 12 may be a multi-layer board and may include a plurality of wiring layers 125 and a plurality of dielectric layers 126 stacked in an alternating manner. The plurality of dielectric layers 126 may be made of the same material or different materials. The plurality of wiring layers 125 and the two metal resonance layers 122 are electrically connected via a plurality of conductive vias 127 penetrating the dielectric layers 126 (as shown in FIG. 7 , which is a side view of an embodiment of the circuit board of the present application. It should be noted that, in order to avoid making the drawing of FIG. 7 too complicated, only four conductive vias 127 are drawn as a representative).
在一實施例中，多個佈線層125和兩個金屬諧振層122的結構形狀可相同或不同。In one embodiment, the structural shapes of the plurality of wiring layers 125 and the two metal resonance layers 122 may be the same or different.
在一實施例中，多個佈線層125的層數越多，則兩個金屬諧振層122各自包括的多個諧振器1221的Q值越大。In one embodiment, the more the number of the wiring layers 125 is, the greater the Q value of the resonators 1221 included in each of the two metal resonant layers 122 is.
請參閱圖2與圖8，圖8為圖2的濾波器的傳輸係數（S21）和反射係數（S11）的仿真特性曲線圖，其中，圖8的橫軸為頻率，單位為赫茲（Hertz，Hz）；圖8的左邊縱軸為傳輸係數（S21），單位為分貝（dB）；圖8的右邊縱軸為反射係數（S11），單位為分貝（dB）；圖8的實線為反射係數的仿真特性曲線；圖8的虛線為傳輸係數的仿真特性曲線。如圖2與圖8所示，濾波器1選用八個諧振器1221，加載3個傳輸極點（在低端（即圖8的左側）產生一個零點，在高端（即圖8的右側）產生兩個零點），滿足濾波器1的通帶低損耗特性，呈現帶通濾波器特點。Please refer to FIG. 2 and FIG. 8 , FIG. 8 is a simulated characteristic curve diagram of the transmission coefficient (S21) and the reflection coefficient (S11) of the filter in FIG. 2 , wherein the horizontal axis of FIG. 8 is frequency, and the unit is Hertz (Hz); the left vertical axis of FIG. 8 is the transmission coefficient (S21), and the unit is decibel (dB); the right vertical axis of FIG. 8 is the reflection coefficient (S11), and the unit is decibel (dB); the solid line of FIG. 8 is the simulated characteristic curve of the reflection coefficient; and the dotted line of FIG. 8 is the simulated characteristic curve of the transmission coefficient. As shown in FIG. 2 and FIG. 8 , filter 1 uses eight resonators 1221 and loads three transmission poles (generating one zero point at the low end (i.e., the left side of FIG. 8 ) and two zero points at the high end (i.e., the right side of FIG. 8 )), satisfying the passband low-loss characteristics of filter 1 and presenting the characteristics of a bandpass filter.
綜上所述，通過集成配置於電路板上的隔離圖案和接地邊框與殼體（即上蓋和下蓋）的設計，仿真形成空氣腔，搭配集成配置於電路板上的諧振器，構成PCB板式堆疊濾波器。其中，PCB板式堆疊濾波器包括上蓋、下蓋、集成配置有兩個金屬諧振層的電路板、輸入連接器和輸出連接器；上蓋和下蓋可採用合金材質製成，其表面可採用鍍銀、鍍銅或鍍金處理；兩個金屬諧振層可採用沉鋁、沉銅、沉銀或沉金方式集成配置於電路板上；因此，PCB板式堆疊濾波器具有易於構建的框架，且濾波器所需的功率、頻率、插損、耦合也能在有限的空間內實現最優電氣性能，從而適用於各種拓撲結構，同時也能夠解決現有技術中適用於不同通訊環境的濾波器因規格不同而存在不能大批量模組化生產、零件尺寸相對不穩定與裝配複雜的問題。In summary, the isolation pattern and grounding frame integrated on the circuit board and the shell (i.e., the upper cover and the lower cover) are designed to simulate the formation of an air cavity, and the resonator integrated on the circuit board is matched to form a PCB stacked filter. The PCB stacked filter includes an upper cover, a lower cover, a circuit board with two metal resonant layers integrated, an input connector, and an output connector; the upper cover and the lower cover can be made of alloy materials, and their surfaces can be silver-plated, copper-plated, or gold-plated; the two metal resonant layers can be integrated on the circuit board by aluminum, copper, silver, or gold; therefore, the PCB stacked filter is a kind of filter with a plurality of layers of metal resonant layers. The stacked filter has an easy-to-build framework, and the power, frequency, insertion loss, and coupling required by the filter can also achieve the best electrical performance in a limited space, making it suitable for various topological structures. At the same time, it can also solve the problems in the existing technology that filters suitable for different communication environments cannot be mass-produced in a modular manner due to different specifications, the size of parts is relatively unstable, and the assembly is complicated.
雖然本新型申請使用以上實施例進行說明，但需要注意的是，這些描述並非被配置為限縮本申請。相反地，此申請涵蓋了所屬技術領域中的技術人員顯而易見的修改與相似設置。所以，申請專利範圍須以最寬廣的方式解釋來包含所有顯而易見的修改與相似設置。Although the present invention is described using the above embodiments, it should be noted that these descriptions are not configured to limit the present invention. On the contrary, the present invention covers modifications and similar arrangements that are obvious to a person skilled in the art. Therefore, the scope of the patent application should be interpreted in the broadest way to include all obvious modifications and similar arrangements.
1:濾波器 2:螺釘 11:殼體 111:上蓋 1111:螺桿孔 1112:螺紋孔 1113:連接耳 112:下蓋 1121:隔離壁 1122:邊緣 1123:定位銷 1124:螺紋槽 12:電路板 121:導電通孔 122:金屬諧振層 1221:諧振器 1222:隔離圖案 1223:接地邊框 1224:交叉耦合圖案 1225:加強筋 123:定位孔 124:定位耳 125:佈線層 126:介電層 127:導電通孔 13:輸入連接器 131:連接桿 14:輸出連接器 141:連接桿 1411:連接器內導體 1412:連接主桿 15:抽頭片 16:調諧螺桿 17:耦合螺桿 18:螺釘 1: Filter 2: Screw 11: Housing 111: Upper cover 1111: Screw hole 1112: Threaded hole 1113: Connecting ear 112: Lower cover 1121: Isolation wall 1122: Edge 1123: Positioning pin 1124: Threaded groove 12: Circuit board 121: Conductive via 122: Metal resonant layer 1221: Resonator 1222: Isolation pattern 1223: Ground frame 1224: Cross-coupling pattern 1225: Reinforcement rib 123: Positioning hole 124: Positioning ear 125: Wiring layer 126: Dielectric layer 127: Conductive via 13: Input connector 131: Connector rod 14: Output connector 141: Connector rod 1411: Conductor inside connector 1412: Connector rod 15: Tap piece 16: Tuning screw 17: Coupling screw 18: Screw
此處所說明的附圖用來提供對本申請的進一步理解，構成本申請的一部分，本申請的示意性實施例及其說明被配置為解釋本申請，並不構成對本申請的不當限定。在附圖中： 圖1為依據本申請的濾波器的一實施例立體示意圖； 圖2為圖1的濾波器的***示意圖； 圖3為圖1所示的AA線段剖面示意圖； 圖4為圖1所示的BB線段剖面示意圖； 圖5為圖1的電路板與金屬諧振層的集成示意圖； 圖6為圖5的側視示意圖； 圖7為本申請的電路板的一實施例的側視圖；以及 圖8為圖2的濾波器的傳輸係數和反射係數的仿真特性曲線圖。 The attached figures described here are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their description are configured to explain the present application and do not constitute an improper limitation on the present application. In the attached figures: Figure 1 is a three-dimensional schematic diagram of an embodiment of a filter according to the present application; Figure 2 is an exploded schematic diagram of the filter of Figure 1; Figure 3 is a schematic diagram of the AA line segment cross-section shown in Figure 1; Figure 4 is a schematic diagram of the BB line segment cross-section shown in Figure 1; Figure 5 is a schematic diagram of the integration of the circuit board and the metal resonant layer of Figure 1; Figure 6 is a side view schematic diagram of Figure 5; Figure 7 is a side view of an embodiment of the circuit board of the present application; and Figure 8 is a simulated characteristic curve of the transmission coefficient and reflection coefficient of the filter of Figure 2.
1:濾波器 1: Filter
2:螺釘 2: Screws
11:殼體 11: Shell
111:上蓋 111: Upper cover
1111:螺桿孔 1111: Screw hole
1112:螺紋孔 1112: threaded hole
1113:連接耳 1113:Connecting ear
112:下蓋 112: Lower cover
1121:隔離壁 1121: Isolation wall
1122:邊緣 1122: Edge
1123:定位銷 1123: Positioning pin
1124:螺紋槽 1124: Thread groove
12:電路板 12: Circuit board
124:定位耳 124: Positioning ear
13:輸入連接器 13: Input connector
14:輸出連接器 14: Output connector
16:調諧螺桿 16: Tuning screw
17:耦合螺桿 17: Coupling screw
18:螺釘 18: Screws
Claims (16)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2023234247168 | 2023-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM657011U true TWM657011U (en) | 2024-06-21 |
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