TWM653042U - Electronic device - Google Patents
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- TWM653042U TWM653042U TW112210943U TW112210943U TWM653042U TW M653042 U TWM653042 U TW M653042U TW 112210943 U TW112210943 U TW 112210943U TW 112210943 U TW112210943 U TW 112210943U TW M653042 U TWM653042 U TW M653042U
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- 238000001816 cooling Methods 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
Description
本案是關於一種電子裝置,尤其是關於一種具有電路板與散熱風扇之電子裝置。This case is about an electronic device, especially an electronic device with a circuit board and a cooling fan.
一般筆記型電腦的內部散熱設計可以分為正壓與負壓系統這兩種流場型態。負壓系統是利用風扇產生的負壓從入風口吸入冷空氣,並與設置於風扇之出風口的散熱鰭片進行熱交換。不過,若是吸入系統的冷空氣受到系統元件加熱,就容易影響散熱氣流與散熱鰭片的熱交換效率,進而影響中央處理單元與圖形處理器的散熱效果。另一方面,正壓系統則是利用風扇將冷空氣直接吹向系統元件與殼體進行冷卻,再透過系統殼體之出風口將熱空氣排出。正壓系統容易會受到殼體內部空間尺寸的影響。若殼體內部空間不足,就容易導致熱空氣無法有效地排除到系統外而影響表面溫度。The internal heat dissipation design of general notebook computers can be divided into two flow field types: positive pressure and negative pressure systems. The negative pressure system uses the negative pressure generated by the fan to suck in cold air from the air inlet and conduct heat exchange with the heat dissipation fins provided at the fan outlet. However, if the cold air sucked into the system is heated by the system components, it will easily affect the heat exchange efficiency of the cooling airflow and the cooling fins, thereby affecting the cooling effect of the central processing unit and graphics processor. On the other hand, a positive pressure system uses a fan to blow cold air directly to the system components and casing for cooling, and then discharges the hot air through the air outlet of the system casing. Positive pressure systems are easily affected by the dimensions of the internal space of the housing. If the internal space of the casing is insufficient, it is easy to cause the hot air to be unable to be effectively discharged out of the system and affect the surface temperature.
此二種系統各有其缺點。目前筆記型電腦的內部散熱設計只能在這兩種流場型態中擇一進行,而無法兼顧此二種系統的優點。Each of these two systems has its own disadvantages. Currently, the internal heat dissipation design of notebook computers can only choose one of these two flow field types, and cannot take into account the advantages of these two systems.
本案提供一種電子裝置,包含一殼體、一電路板、一散熱風扇以及一遮擋件。殼體具有一空間。電路板設於殼體內,將空間區分出一上部分空間以及一下部分空間,且電路板具有一缺口。散熱風扇安裝於缺口,且散熱風扇與缺口之邊緣之間具有一安裝間隙。遮擋件設於電路板與散熱風扇之間,用以遮擋安裝間隙。The present invention provides an electronic device, comprising a housing, a circuit board, a heat dissipation fan and a shielding member. The housing has a space. The circuit board is arranged in the housing, dividing the space into an upper space and a lower space, and the circuit board has a notch. The heat dissipation fan is installed in the notch, and there is an installation gap between the heat dissipation fan and the edge of the notch. The shielding member is arranged between the circuit board and the heat dissipation fan to shield the installation gap.
本案之電子裝置具有遮擋件遮蔽電路板與散熱風扇之間的安裝間隙,可以有效地將殼體之內部空間區分為正壓區以及負壓區。在電路板與鍵盤模組之間(也就是殼體內的上部分空間)形成負壓區,可以有效地透過鍵盤模組上的開孔吸入冷空氣對殼體內部系統元件進行冷卻。在電路板與底殼之間(也就是殼體內之下部分空間)形成正壓區,可以有效地將散熱風扇吹向下部分空間之散熱氣流經由殼體之側面或後緣的殼體出風口向外排出,避免熱空氣在系統內部累積,影響電子裝置之運作效能。如此,即可兼顧正壓系統以及負壓系統的優點,在有限的空間內,同時解決電子裝置之內部系統元件與殼體表面發熱的問題並提升使用者的體驗。The electronic device in this case has a shielding member to cover the installation gap between the circuit board and the cooling fan, which can effectively divide the internal space of the casing into a positive pressure area and a negative pressure area. A negative pressure zone is formed between the circuit board and the keyboard module (that is, the upper space in the casing), which can effectively suck in cold air through the openings in the keyboard module to cool the system components inside the casing. A positive pressure area is formed between the circuit board and the bottom case (that is, the lower space inside the case), which can effectively blow the cooling fan to the lower space through the air outlet on the side or rear edge of the case. Expelled to the outside to prevent hot air from accumulating inside the system and affecting the operating performance of electronic devices. In this way, the advantages of the positive pressure system and the negative pressure system can be taken into account, and the problem of heat generation of the internal system components and the casing surface of the electronic device can be solved at the same time in a limited space, and the user experience can be improved.
下面將結合示意圖對本案的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍,本案的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精準的比例,僅用以方便、明晰地輔助說明本案實施例的目的。The following will be combined with schematic diagrams to describe the specific implementation of this case in more detail. According to the following description and the scope of the patent application, the advantages and features of this case will be clearer. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of this case.
第一圖係依據本案一實施例所提供之電子裝置100之示意圖。第二圖係第一圖之電子裝置100之內部結構示意圖。第二圖係移除第一圖之殼體110的上蓋120而顯示電子裝置100之內部結構。The first figure is a schematic diagram of an
本實施例之電子裝置100係一筆記型電腦,尤其是其主機部分。不過本案不限於此。本案亦可適用於其他需要設置散熱風扇進行散熱之電子裝置。The
如圖中所示,此電子裝置100包含一殼體110、一電路板170以及至少一散熱風扇(圖中顯示二散熱風扇180a, 180b)。As shown in the figure, the
殼體110包含一底殼140以及一上蓋120,上蓋120結合於底殼140而在殼體110內形成一空間S0。The
上蓋120設有一鍵盤模組160。此鍵盤模組160包含一底板162以及複數按鍵164。這些按鍵164係分布於底板162上,供使用者按壓以輸入訊號。請一併參照第三圖所示,第三圖係第一圖中之鍵盤模組160之底板162之示意圖。如圖中所示,鍵盤模組160之底板162具有複數開孔1622,這些開孔1622可作為殼體110表面的入風區。一實施例中,這些開孔1622係位於底板162上對應於按鍵164的位置,避免外部灰塵透過這些開孔1622進入殼體110內部。The
另外,本實施例之殼體110之底殼140之側面140a與後緣140b均具有殼體出風口142, 144。氣流可由殼體110之上蓋120流入殼體110內部對電子裝置100之內部系統元件進行散熱,再由底殼140的側面140a或後緣140b向外流出(如第一與二圖中箭頭所示)。In addition, the
電路板170與散熱風扇180a, 180b係設於殼體110內。一實施例中,此電路板170係一主機板。電路板170朝向上蓋120之一側具有一中央處理單元(CPU)172以及一圖形處理器(GPU)174。電路板170上並設有散熱導管176。散熱導管176係由中央處理單元172以及圖形處理器174延伸至二散熱風扇180a, 180b,以傳遞中央處理單元172以及圖形處理器174運作過程所產生之熱,並透過設置於散熱風扇180a, 180b與殼體出風口142之間的散熱鰭片(圖未示)與散熱氣流進行熱交換而產生散熱效果。The
電路板170之兩側各具有一缺口171a, 171b以安裝散熱風扇180a, 180b。缺口171a, 171b之邊緣係呈弧形,以配合散熱風扇180a, 180b之外型。散熱風扇180a, 180b係設置於電路板170之兩側,靠近底殼140的側面140a。Each side of the
請一併參照第四圖,第四圖係對應於第一圖之電子裝置100之右側部分的剖面示意圖。圖中呈現本案電子裝置100之殼體110、電路板170與散熱風扇180a的相對位置。Please refer to FIG. 4, which is a cross-sectional view of the right side of the
如圖中所示,電路板170係呈水平方向安裝於殼體110內,而將殼體110之內部空間S0區分出一上部分空間S1以及一下部分空間S2。上部分空間S1是位於電路板170朝向上蓋120之一側,下部分空間S2則是位於電路板朝向底殼140之一側,也就是位於上部分空間S1之相對側。As shown in the figure, the
此散熱風扇180a係一離心式風扇。散熱風扇180a朝向上蓋120之一側具有一第一風扇入風口182,散熱風扇180a之側壁181具有一第一風扇出風口184以及一第二風扇出風口186。The
第一風扇出風口184係朝向底殼140之側面140a之殼體出風口142,用以產生氣流吹向設置於殼體出風口142旁邊的散熱鰭片(圖未示)進行熱交換。此散熱鰭片係連接散熱導管176,用以對電路板170上的熱源(如中央處理單元172或圖形處理器174)進行散熱。The
第二風扇出風口186係朝向下部分空間S2的中間位置,以產生散熱氣流對電路板170之熱源(例如中央處理單元172或圖形處理器174)以及下部分空間內之系統元件進行散熱。下部分空間S2的熱空氣會進一步透過底殼140之後緣140b之殼體出風口144向外排除。The
散熱風扇180a之第一風扇入風口182係透過鍵盤模組160之底板162上的開孔1622吸入外部冷空氣,而在殼體110之上部分空間S1產生散熱氣流對電路板170上的系統元件進行散熱。散熱風扇180a之運轉會透過第一風扇出風口184將冷空氣吹向散熱鰭片進行熱交換,同時會透過第二風扇出風口186將冷空氣吹向下部分空間S2進一步提升散熱效果。The
請一併參照第五圖,第五圖係放大顯示第四圖中之區域A。如圖中所示,散熱風扇180a與電路板170的缺口171a之邊緣之間具有一安裝間隙g1,以利於安裝散熱風扇180a。此散熱風扇180a可另外透過鎖固、扣合等固定方式固定於電路板170,或是固定於殼體110。Please refer to FIG. 5, which is an enlarged view of the area A in FIG. 4. As shown in the figure, there is an installation gap g1 between the
為了有效隔離殼體110內的正壓區與負壓區,以提升散熱氣流在殼體110內的循環效果。本實施例具有一遮擋件190。此遮擋件190係設於電路板170與散熱風扇180a之間以遮擋安裝間隙g1,使殼體110內之上部分空間S1(對應於電路板170與鍵盤模組160之間)形成一負壓區,下部分空間S2(對應於電路板170與底殼140之間)形成一正壓區,以促進散熱氣流流動,提升散熱效率。In order to effectively isolate the positive pressure area and the negative pressure area in the
具體來說,上部分空間S1形成負壓區有助於引導外部冷空氣流入殼體110內部。下部分空間S2形成正壓區有助於將系統內部的熱空氣向外排除。Specifically, the upper space S1 forms a negative pressure area, which helps to guide the external cold air to flow into the
一實施例中,如圖中所示,遮擋件190係形成於散熱風扇180a之側壁181,且與散熱風扇180a之外殼一體成形。遮擋件190係呈現為一凸出結構191,電路板170之邊緣係直接安放在凸出結構191之上表面,而使上部分空間S1與下部分空間S2區隔開來。In one embodiment, as shown in the figure, the shielding
一實施例中,散熱風扇180a在相對於第一風扇入風口182的位置具有一第二風扇入風口188。此第二風扇入風口188朝向底殼140之底部。底殼140在對應於散熱風扇180a的位置具有一殼體底部入風口146。散熱風扇180a可透過此殼體底部入風口146吸入冷空氣以提高散熱氣流流量。又,一實施例中,為了提升散熱風扇180a由第二風扇入風口188吸入冷空氣的運作效率,散熱風扇180a之側壁181的下緣處係形成另一遮擋件195。此遮擋件195係位於風扇180a與底殼140之間,而將散熱風扇180a之第二風扇入風口188與殼體底部入風區146之間的空間S3(可視為負壓區)與下部分空間S2(可視為正壓區)區隔開來。In one embodiment, the cooling
前述實施例之電子裝置100設置二散熱風扇180a, 180b進行散熱,不過本案不限於此。其他實施例中,依據實際需求,電子裝置100內可以只設置單一散熱風扇180a, 180a進行散熱,也可以設置三個或更多數量的散熱風扇180a, 180b。The
第六圖顯示本案遮擋件690之另一實施例。不同於第五圖所示之遮擋件190,本實施例之遮擋件690並非散熱風扇180a之一部分,而是附加於散熱風扇180a與電路板170上的獨立元件,用以遮蔽安裝間隙g1。具體來說,此遮擋件690係由電路板170之一上表面171c延伸至散熱風扇180a,且固定於散熱風扇180a的側壁或上表面。此遮擋件690舉例來說可以是一氣密膠帶,其透過貼附方式固定於電路板170與散熱風扇180a之間。FIG. 6 shows another embodiment of the shielding
第七圖顯示本案遮擋件790之又一實施例。不同於第六圖所示之遮擋件690是由電路板170之上表面171c延伸至散熱風扇180a以遮蔽安裝間隙g1,本實施例之遮擋件790則是位於電路板170之板邊171d與散熱風扇180a之間。具體來說,此遮擋件790可以是由一可變形材料構成。遮擋件790可以在散熱風扇180a安裝於電路板170之缺口171a內之後,塞入電路板170之板邊171d與散熱風扇180a之間的安裝間隙g1內,以遮蔽安裝間隙g1。FIG. 7 shows another embodiment of the shielding
本案之電子裝置100具有遮擋件190, 690, 790遮蔽電路板170與散熱風扇180a, 180b之間的安裝間隙g1,可以有效地將殼體110之內部空間S0區分為正壓區以及負壓區。在電路板170與鍵盤模組160之間(也就是殼體110內的上部分空間S1)形成負壓區,可以有效地透過鍵盤模組160上的開孔1622吸入冷空氣對殼體110內部系統元件進行冷卻。在電路板170與底殼140之間(也就是殼體110內之下部分空間S2)形成正壓區,可以有效地將散熱風扇180a, 180b吹向下部分空間S2之散熱氣流經由殼體110之側面140a或後緣140b的殼體出風口144向外排出,避免熱空氣在系統內部累積,影響電子裝置100之運作效能。如此,即可兼顧正壓系統以及負壓系統的優點,在有限的空間內,同時解決電子裝置100之內部系統元件與殼體110表面發熱的問題並提升使用者的體驗。The
上述僅為本案較佳之實施例而已,並不對本案進行任何限制。任何所屬技術領域的技術人員,在不脫離本案的技術手段的範圍內,對本案揭露的技術手段和技術內容做任何形式的等同替換或修改等變動,均屬未脫離本案的技術手段的內容,仍屬於本案的保護範圍之內。The above are only preferred embodiments of this case and do not impose any restrictions on this case. Any technical personnel in the technical field who make any form of equivalent substitution or modification to the technical means and technical content disclosed in this case shall not deviate from the technical means of this case. It is still within the scope of protection of this case.
100:電子裝置
110:殼體
120:上蓋
140:底殼
140a:側面
140b:後緣
142, 144:殼體出風口
146:殼體底部入風口
160:鍵盤模組
162:底板
1622:開孔
164:按鍵
170:電路板
171a, 171b:缺口
171c:上表面
171d:板邊
172:中央處理單元
174:圖形處理器
176:散熱導管
180a, 180b:散熱風扇
181:側壁
182:第一風扇入風口
184:第一風扇出風口
186:第二風扇出風口
188:第二風扇入風口
190:遮擋件
191:凸出結構
195:遮擋件
S0:空間
S1:上部分空間
S2:下部分空間
g1:安裝間隙
S3:空間
690:遮擋件
790:遮擋件
100: electronic device
110: housing
120: upper cover
140:
第一圖係依據本案一實施例所提供之電子裝置之示意圖; 第二圖係第一圖之電子裝置之內部結構示意圖; 第三圖係第一圖中之鍵盤模組之底板之示意圖; 第四圖係對應於第一圖之電子裝置之右側部分的剖面示意圖; 第五圖係放大顯示第四圖中之區域A; 第六圖顯示本案遮擋件之另一實施例;以及 第七圖顯示本案遮擋件之又一實施例。 The first figure is a schematic diagram of an electronic device provided according to an embodiment of the present invention; The second figure is a schematic diagram of the internal structure of the electronic device in the first figure; The third picture is a schematic diagram of the base plate of the keyboard module in the first picture; The fourth figure is a schematic cross-sectional view of the right part of the electronic device corresponding to the first figure; The fifth picture shows an enlarged view of area A in the fourth picture; Figure 6 shows another embodiment of the blocking member of the present invention; and The seventh figure shows another embodiment of the shielding member of this case.
100:電子裝置 100: Electronic devices
120:上蓋 120: Upper cover
140:底殼 140: bottom shell
140a:側面 140a: Side
142:殼體出風口 142: Shell air outlet
146:殼體底部入風口 146: Air inlet at the bottom of the housing
160:鍵盤模組 160:Keyboard module
162:底板 162: Base plate
164:按鍵 164:Button
170:電路板 170: Circuit board
171a:缺口 171a: Gap
176:散熱導管 176: Heat dissipation pipe
180a:散熱風扇 180a: Cooling fan
182:第一風扇入風口 182: First fan air inlet
184:第一風扇出風口 184: First fan outlet
186:第二風扇出風口 186: Second fan outlet
188:第二風扇入風口 188:Second fan air inlet
190:遮擋件 190: shielding piece
195:遮擋件 195: Shielding piece
S0:空間 S0: Space
S1:上部分空間 S1: Upper space
S2:下部分空間 S2: Lower space
g1:安裝間隙 g1: Installation clearance
S3:空間 S3: Space
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112210943U TWM653042U (en) | 2023-10-12 | 2023-10-12 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112210943U TWM653042U (en) | 2023-10-12 | 2023-10-12 | Electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM653042U true TWM653042U (en) | 2024-03-21 |
Family
ID=91269085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112210943U TWM653042U (en) | 2023-10-12 | 2023-10-12 | Electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM653042U (en) |
-
2023
- 2023-10-12 TW TW112210943U patent/TWM653042U/en unknown
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