TWM653042U

TWM653042U - Electronic device

Info

Publication number: TWM653042U
Application number: TW112210943U
Authority: TW
Inventors: 毛郁婷
Original assignee: 華碩電腦股份有限公司
Priority date: 2023-10-12
Filing date: 2023-10-12
Publication date: 2024-03-21

Abstract

An electronic device comprising a housing, a circuit board, a cooling fan, and a shielding element is provided. The housing has an internal space. The circuit board is disposed in the housing to divide the internal space into an upper space and a lower space. The circuit board also has a notch for locating the cooling fan. An assembling gap is formed between the cooling fan and the notch. The shielding element is disposed between the circuit board and the cooling fan for shielding the assembling gap.

Description

電子裝置Electronic devices

本案是關於一種電子裝置，尤其是關於一種具有電路板與散熱風扇之電子裝置。This case is about an electronic device, especially an electronic device with a circuit board and a cooling fan.

一般筆記型電腦的內部散熱設計可以分為正壓與負壓系統這兩種流場型態。負壓系統是利用風扇產生的負壓從入風口吸入冷空氣，並與設置於風扇之出風口的散熱鰭片進行熱交換。不過，若是吸入系統的冷空氣受到系統元件加熱，就容易影響散熱氣流與散熱鰭片的熱交換效率，進而影響中央處理單元與圖形處理器的散熱效果。另一方面，正壓系統則是利用風扇將冷空氣直接吹向系統元件與殼體進行冷卻，再透過系統殼體之出風口將熱空氣排出。正壓系統容易會受到殼體內部空間尺寸的影響。若殼體內部空間不足，就容易導致熱空氣無法有效地排除到系統外而影響表面溫度。The internal heat dissipation design of general notebook computers can be divided into two flow field types: positive pressure and negative pressure systems. The negative pressure system uses the negative pressure generated by the fan to suck in cold air from the air inlet and conduct heat exchange with the heat dissipation fins provided at the fan outlet. However, if the cold air sucked into the system is heated by the system components, it will easily affect the heat exchange efficiency of the cooling airflow and the cooling fins, thereby affecting the cooling effect of the central processing unit and graphics processor. On the other hand, a positive pressure system uses a fan to blow cold air directly to the system components and casing for cooling, and then discharges the hot air through the air outlet of the system casing. Positive pressure systems are easily affected by the dimensions of the internal space of the housing. If the internal space of the casing is insufficient, it is easy to cause the hot air to be unable to be effectively discharged out of the system and affect the surface temperature.

此二種系統各有其缺點。目前筆記型電腦的內部散熱設計只能在這兩種流場型態中擇一進行，而無法兼顧此二種系統的優點。Each of these two systems has its own disadvantages. Currently, the internal heat dissipation design of notebook computers can only choose one of these two flow field types, and cannot take into account the advantages of these two systems.

本案提供一種電子裝置，包含一殼體、一電路板、一散熱風扇以及一遮擋件。殼體具有一空間。電路板設於殼體內，將空間區分出一上部分空間以及一下部分空間，且電路板具有一缺口。散熱風扇安裝於缺口，且散熱風扇與缺口之邊緣之間具有一安裝間隙。遮擋件設於電路板與散熱風扇之間，用以遮擋安裝間隙。The present invention provides an electronic device, comprising a housing, a circuit board, a heat dissipation fan and a shielding member. The housing has a space. The circuit board is arranged in the housing, dividing the space into an upper space and a lower space, and the circuit board has a notch. The heat dissipation fan is installed in the notch, and there is an installation gap between the heat dissipation fan and the edge of the notch. The shielding member is arranged between the circuit board and the heat dissipation fan to shield the installation gap.

本案之電子裝置具有遮擋件遮蔽電路板與散熱風扇之間的安裝間隙，可以有效地將殼體之內部空間區分為正壓區以及負壓區。在電路板與鍵盤模組之間（也就是殼體內的上部分空間）形成負壓區，可以有效地透過鍵盤模組上的開孔吸入冷空氣對殼體內部系統元件進行冷卻。在電路板與底殼之間（也就是殼體內之下部分空間）形成正壓區，可以有效地將散熱風扇吹向下部分空間之散熱氣流經由殼體之側面或後緣的殼體出風口向外排出，避免熱空氣在系統內部累積，影響電子裝置之運作效能。如此，即可兼顧正壓系統以及負壓系統的優點，在有限的空間內，同時解決電子裝置之內部系統元件與殼體表面發熱的問題並提升使用者的體驗。The electronic device in this case has a shielding member to cover the installation gap between the circuit board and the cooling fan, which can effectively divide the internal space of the casing into a positive pressure area and a negative pressure area. A negative pressure zone is formed between the circuit board and the keyboard module (that is, the upper space in the casing), which can effectively suck in cold air through the openings in the keyboard module to cool the system components inside the casing. A positive pressure area is formed between the circuit board and the bottom case (that is, the lower space inside the case), which can effectively blow the cooling fan to the lower space through the air outlet on the side or rear edge of the case. Expelled to the outside to prevent hot air from accumulating inside the system and affecting the operating performance of electronic devices. In this way, the advantages of the positive pressure system and the negative pressure system can be taken into account, and the problem of heat generation of the internal system components and the casing surface of the electronic device can be solved at the same time in a limited space, and the user experience can be improved.

下面將結合示意圖對本案的具體實施方式進行更詳細的描述。根據下列描述和申請專利範圍，本案的優點和特徵將更清楚。需說明的是，圖式均採用非常簡化的形式且均使用非精準的比例，僅用以方便、明晰地輔助說明本案實施例的目的。The following will be combined with schematic diagrams to describe the specific implementation of this case in more detail. According to the following description and the scope of the patent application, the advantages and features of this case will be clearer. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of this case.

第一圖係依據本案一實施例所提供之電子裝置100之示意圖。第二圖係第一圖之電子裝置100之內部結構示意圖。第二圖係移除第一圖之殼體110的上蓋120而顯示電子裝置100之內部結構。The first figure is a schematic diagram of an electronic device 100 provided according to an embodiment of the present invention. The second figure is a schematic diagram of the internal structure of the electronic device 100 of the first figure. The second figure shows the internal structure of the electronic device 100 by removing the upper cover 120 of the casing 110 of the first figure.

本實施例之電子裝置100係一筆記型電腦，尤其是其主機部分。不過本案不限於此。本案亦可適用於其他需要設置散熱風扇進行散熱之電子裝置。The electronic device 100 of this embodiment is a notebook computer, especially its host part. However, the present invention is not limited to this. The present invention can also be applied to other electronic devices that need to be equipped with a heat dissipation fan for heat dissipation.

如圖中所示，此電子裝置100包含一殼體110、一電路板170以及至少一散熱風扇（圖中顯示二散熱風扇180a, 180b）。As shown in the figure, the electronic device 100 includes a housing 110, a circuit board 170 and at least one cooling fan (two cooling fans 180a and 180b are shown in the figure).

殼體110包含一底殼140以及一上蓋120，上蓋120結合於底殼140而在殼體110內形成一空間S0。The housing 110 includes a bottom housing 140 and an upper cover 120 . The upper cover 120 is combined with the bottom housing 140 to form a space S0 in the housing 110 .

上蓋120設有一鍵盤模組160。此鍵盤模組160包含一底板162以及複數按鍵164。這些按鍵164係分布於底板162上，供使用者按壓以輸入訊號。請一併參照第三圖所示，第三圖係第一圖中之鍵盤模組160之底板162之示意圖。如圖中所示，鍵盤模組160之底板162具有複數開孔1622，這些開孔1622可作為殼體110表面的入風區。一實施例中，這些開孔1622係位於底板162上對應於按鍵164的位置，避免外部灰塵透過這些開孔1622進入殼體110內部。The upper cover 120 is provided with a keyboard module 160. The keyboard module 160 includes a bottom plate 162 and a plurality of keys 164. These keys 164 are distributed on the bottom plate 162 for users to press to input signals. Please refer to the third figure, which is a schematic diagram of the bottom plate 162 of the keyboard module 160 in the first figure. As shown in the figure, the bottom plate 162 of the keyboard module 160 has a plurality of openings 1622, and these openings 1622 can be used as air inlet areas on the surface of the housing 110. In one embodiment, these openings 1622 are located on the bottom plate 162 at positions corresponding to the keys 164 to prevent external dust from entering the interior of the housing 110 through these openings 1622.

另外，本實施例之殼體110之底殼140之側面140a與後緣140b均具有殼體出風口142, 144。氣流可由殼體110之上蓋120流入殼體110內部對電子裝置100之內部系統元件進行散熱，再由底殼140的側面140a或後緣140b向外流出（如第一與二圖中箭頭所示）。In addition, the side 140a and the rear edge 140b of the bottom shell 140 of the casing 110 of this embodiment both have casing air outlets 142, 144. The airflow can flow into the interior of the casing 110 from the upper cover 120 of the casing 110 to dissipate heat for the internal system components of the electronic device 100, and then flow out from the side 140a or the rear edge 140b of the bottom casing 140 (as shown by the arrows in the first and second figures). ).

電路板170與散熱風扇180a, 180b係設於殼體110內。一實施例中，此電路板170係一主機板。電路板170朝向上蓋120之一側具有一中央處理單元(CPU)172以及一圖形處理器(GPU)174。電路板170上並設有散熱導管176。散熱導管176係由中央處理單元172以及圖形處理器174延伸至二散熱風扇180a, 180b，以傳遞中央處理單元172以及圖形處理器174運作過程所產生之熱，並透過設置於散熱風扇180a, 180b與殼體出風口142之間的散熱鰭片（圖未示）與散熱氣流進行熱交換而產生散熱效果。The circuit board 170 and the cooling fans 180a and 180b are installed in the casing 110. In one embodiment, the circuit board 170 is a motherboard. The circuit board 170 has a central processing unit (CPU) 172 and a graphics processor (GPU) 174 on a side facing the upper cover 120 . The circuit board 170 is also provided with a heat dissipation pipe 176 . The heat dissipation duct 176 extends from the central processing unit 172 and the graphics processor 174 to the two cooling fans 180a, 180b to transfer the heat generated by the operation of the central processing unit 172 and the graphics processor 174, and through the heat dissipation fans 180a, 180b. The heat dissipation fins (not shown) between the housing air outlet 142 exchange heat with the heat dissipation airflow to produce a heat dissipation effect.

電路板170之兩側各具有一缺口171a, 171b以安裝散熱風扇180a, 180b。缺口171a, 171b之邊緣係呈弧形，以配合散熱風扇180a, 180b之外型。散熱風扇180a, 180b係設置於電路板170之兩側，靠近底殼140的側面140a。Each side of the circuit board 170 has a notch 171a, 171b for installing the cooling fans 180a, 180b. The edges of the notches 171a and 171b are curved to match the appearance of the cooling fans 180a and 180b. The cooling fans 180a and 180b are disposed on both sides of the circuit board 170, close to the side 140a of the bottom case 140.

請一併參照第四圖，第四圖係對應於第一圖之電子裝置100之右側部分的剖面示意圖。圖中呈現本案電子裝置100之殼體110、電路板170與散熱風扇180a的相對位置。Please refer to FIG. 4, which is a cross-sectional view of the right side of the electronic device 100 corresponding to FIG. 1. The relative positions of the housing 110, the circuit board 170 and the heat dissipation fan 180a of the electronic device 100 of the present embodiment are shown in the figure.

如圖中所示，電路板170係呈水平方向安裝於殼體110內，而將殼體110之內部空間S0區分出一上部分空間S1以及一下部分空間S2。上部分空間S1是位於電路板170朝向上蓋120之一側，下部分空間S2則是位於電路板朝向底殼140之一側，也就是位於上部分空間S1之相對側。As shown in the figure, the circuit board 170 is installed in the housing 110 in a horizontal direction, and the internal space S0 of the housing 110 is divided into an upper space S1 and a lower space S2. The upper space S1 is located on the side of the circuit board 170 facing the upper cover 120 , and the lower space S2 is located on the side of the circuit board facing the bottom case 140 , that is, on the opposite side of the upper space S1 .

此散熱風扇180a係一離心式風扇。散熱風扇180a朝向上蓋120之一側具有一第一風扇入風口182，散熱風扇180a之側壁181具有一第一風扇出風口184以及一第二風扇出風口186。The cooling fan 180a is a centrifugal fan. The cooling fan 180a has a first fan air inlet 182 on one side facing the upper cover 120, and the side wall 181 of the cooling fan 180a has a first fan air outlet 184 and a second fan air outlet 186.

第一風扇出風口184係朝向底殼140之側面140a之殼體出風口142，用以產生氣流吹向設置於殼體出風口142旁邊的散熱鰭片（圖未示）進行熱交換。此散熱鰭片係連接散熱導管176，用以對電路板170上的熱源（如中央處理單元172或圖形處理器174）進行散熱。The first fan outlet 184 is oriented toward the housing outlet 142 on the side surface 140a of the bottom housing 140, and is used to generate airflow to blow toward the heat sink fin (not shown) disposed next to the housing outlet 142 for heat exchange. The heat sink fin is connected to the heat dissipation pipe 176 to dissipate heat from the heat source on the circuit board 170 (such as the central processing unit 172 or the graphics processor 174).

第二風扇出風口186係朝向下部分空間S2的中間位置，以產生散熱氣流對電路板170之熱源（例如中央處理單元172或圖形處理器174）以及下部分空間內之系統元件進行散熱。下部分空間S2的熱空氣會進一步透過底殼140之後緣140b之殼體出風口144向外排除。The second fan outlet 186 is directed toward the middle position of the lower space S2 to generate cooling airflow to dissipate heat from the heat source of the circuit board 170 (such as the central processing unit 172 or the graphics processor 174) and the system components in the lower space. The hot air in the lower space S2 will be further discharged outward through the housing air outlet 144 on the rear edge 140b of the bottom housing 140 .

散熱風扇180a之第一風扇入風口182係透過鍵盤模組160之底板162上的開孔1622吸入外部冷空氣，而在殼體110之上部分空間S1產生散熱氣流對電路板170上的系統元件進行散熱。散熱風扇180a之運轉會透過第一風扇出風口184將冷空氣吹向散熱鰭片進行熱交換，同時會透過第二風扇出風口186將冷空氣吹向下部分空間S2進一步提升散熱效果。The first fan inlet 182 of the cooling fan 180a inhales external cold air through the opening 1622 on the bottom plate 162 of the keyboard module 160, and generates cooling airflow in part of the space S1 above the casing 110 to affect the system components on the circuit board 170. To dissipate heat. The operation of the cooling fan 180a will blow the cold air to the cooling fins through the first fan outlet 184 for heat exchange, and at the same time blow the cold air to the lower space S2 through the second fan outlet 186 to further improve the heat dissipation effect.

請一併參照第五圖，第五圖係放大顯示第四圖中之區域A。如圖中所示，散熱風扇180a與電路板170的缺口171a之邊緣之間具有一安裝間隙g1，以利於安裝散熱風扇180a。此散熱風扇180a可另外透過鎖固、扣合等固定方式固定於電路板170，或是固定於殼體110。Please refer to FIG. 5, which is an enlarged view of the area A in FIG. 4. As shown in the figure, there is an installation gap g1 between the heat dissipation fan 180a and the edge of the notch 171a of the circuit board 170 to facilitate the installation of the heat dissipation fan 180a. The heat dissipation fan 180a can be fixed to the circuit board 170 or to the housing 110 by locking, snapping, etc.

為了有效隔離殼體110內的正壓區與負壓區，以提升散熱氣流在殼體110內的循環效果。本實施例具有一遮擋件190。此遮擋件190係設於電路板170與散熱風扇180a之間以遮擋安裝間隙g1，使殼體110內之上部分空間S1（對應於電路板170與鍵盤模組160之間）形成一負壓區，下部分空間S2（對應於電路板170與底殼140之間）形成一正壓區，以促進散熱氣流流動，提升散熱效率。In order to effectively isolate the positive pressure area and the negative pressure area in the housing 110, so as to enhance the circulation effect of the heat dissipation airflow in the housing 110, the present embodiment has a shielding member 190. The shielding member 190 is disposed between the circuit board 170 and the heat dissipation fan 180a to shield the installation gap g1, so that the upper part of the space S1 in the housing 110 (corresponding to between the circuit board 170 and the keyboard module 160) forms a negative pressure area, and the lower part of the space S2 (corresponding to between the circuit board 170 and the bottom housing 140) forms a positive pressure area, so as to promote the flow of the heat dissipation airflow and enhance the heat dissipation efficiency.

具體來說，上部分空間S1形成負壓區有助於引導外部冷空氣流入殼體110內部。下部分空間S2形成正壓區有助於將系統內部的熱空氣向外排除。Specifically, the upper space S1 forms a negative pressure area, which helps to guide the external cold air to flow into the housing 110. The lower space S2 forms a positive pressure area, which helps to discharge the hot air inside the system to the outside.

一實施例中，如圖中所示，遮擋件190係形成於散熱風扇180a之側壁181，且與散熱風扇180a之外殼一體成形。遮擋件190係呈現為一凸出結構191，電路板170之邊緣係直接安放在凸出結構191之上表面，而使上部分空間S1與下部分空間S2區隔開來。In one embodiment, as shown in the figure, the shielding member 190 is formed on the side wall 181 of the heat dissipation fan 180a and is formed integrally with the outer shell of the heat dissipation fan 180a. The shielding member 190 is presented as a protruding structure 191, and the edge of the circuit board 170 is directly placed on the upper surface of the protruding structure 191, so that the upper space S1 is separated from the lower space S2.

一實施例中，散熱風扇180a在相對於第一風扇入風口182的位置具有一第二風扇入風口188。此第二風扇入風口188朝向底殼140之底部。底殼140在對應於散熱風扇180a的位置具有一殼體底部入風口146。散熱風扇180a可透過此殼體底部入風口146吸入冷空氣以提高散熱氣流流量。又，一實施例中，為了提升散熱風扇180a由第二風扇入風口188吸入冷空氣的運作效率，散熱風扇180a之側壁181的下緣處係形成另一遮擋件195。此遮擋件195係位於風扇180a與底殼140之間，而將散熱風扇180a之第二風扇入風口188與殼體底部入風區146之間的空間S3（可視為負壓區）與下部分空間S2（可視為正壓區）區隔開來。In one embodiment, the cooling fan 180a has a second fan air inlet 188 at a position relative to the first fan air inlet 182. The second fan air inlet 188 faces the bottom of the bottom case 140 . The bottom case 140 has an air inlet 146 at the bottom of the case at a position corresponding to the cooling fan 180a. The cooling fan 180a can suck in cold air through the air inlet 146 at the bottom of the casing to increase the cooling airflow. Furthermore, in one embodiment, in order to improve the operating efficiency of the cooling fan 180a in sucking cold air from the second fan inlet 188, another shielding member 195 is formed at the lower edge of the side wall 181 of the cooling fan 180a. This shielding member 195 is located between the fan 180a and the bottom case 140, and separates the space S3 (can be regarded as a negative pressure area) between the second fan air inlet 188 of the cooling fan 180a and the air inlet area 146 at the bottom of the case with the lower part. Space S2 (can be regarded as a positive pressure area) is separated.

前述實施例之電子裝置100設置二散熱風扇180a, 180b進行散熱，不過本案不限於此。其他實施例中，依據實際需求，電子裝置100內可以只設置單一散熱風扇180a, 180a進行散熱，也可以設置三個或更多數量的散熱風扇180a, 180b。The electronic device 100 of the aforementioned embodiment is provided with two cooling fans 180a, 180b for cooling, but the present invention is not limited thereto. In other embodiments, according to actual needs, the electronic device 100 may be provided with only a single cooling fan 180a, 180a for cooling, or may be provided with three or more cooling fans 180a, 180b.

第六圖顯示本案遮擋件690之另一實施例。不同於第五圖所示之遮擋件190，本實施例之遮擋件690並非散熱風扇180a之一部分，而是附加於散熱風扇180a與電路板170上的獨立元件，用以遮蔽安裝間隙g1。具體來說，此遮擋件690係由電路板170之一上表面171c延伸至散熱風扇180a，且固定於散熱風扇180a的側壁或上表面。此遮擋件690舉例來說可以是一氣密膠帶，其透過貼附方式固定於電路板170與散熱風扇180a之間。FIG. 6 shows another embodiment of the shielding member 690 of the present invention. Unlike the shielding member 190 shown in FIG. 5, the shielding member 690 of the present embodiment is not a part of the heat dissipation fan 180a, but an independent component attached to the heat dissipation fan 180a and the circuit board 170 to shield the installation gap g1. Specifically, the shielding member 690 extends from an upper surface 171c of the circuit board 170 to the heat dissipation fan 180a, and is fixed to the side wall or upper surface of the heat dissipation fan 180a. For example, the shielding member 690 can be an airtight tape, which is fixed between the circuit board 170 and the heat dissipation fan 180a by attaching.

第七圖顯示本案遮擋件790之又一實施例。不同於第六圖所示之遮擋件690是由電路板170之上表面171c延伸至散熱風扇180a以遮蔽安裝間隙g1，本實施例之遮擋件790則是位於電路板170之板邊171d與散熱風扇180a之間。具體來說，此遮擋件790可以是由一可變形材料構成。遮擋件790可以在散熱風扇180a安裝於電路板170之缺口171a內之後，塞入電路板170之板邊171d與散熱風扇180a之間的安裝間隙g1內，以遮蔽安裝間隙g1。FIG. 7 shows another embodiment of the shielding member 790 of the present invention. Unlike the shielding member 690 shown in FIG. 6, which extends from the upper surface 171c of the circuit board 170 to the heat dissipation fan 180a to shield the installation gap g1, the shielding member 790 of this embodiment is located between the board edge 171d of the circuit board 170 and the heat dissipation fan 180a. Specifically, the shielding member 790 can be made of a deformable material. After the heat dissipation fan 180a is installed in the notch 171a of the circuit board 170, the shielding member 790 can be inserted into the installation gap g1 between the board edge 171d of the circuit board 170 and the heat dissipation fan 180a to shield the installation gap g1.

本案之電子裝置100具有遮擋件190, 690, 790遮蔽電路板170與散熱風扇180a, 180b之間的安裝間隙g1，可以有效地將殼體110之內部空間S0區分為正壓區以及負壓區。在電路板170與鍵盤模組160之間（也就是殼體110內的上部分空間S1）形成負壓區，可以有效地透過鍵盤模組160上的開孔1622吸入冷空氣對殼體110內部系統元件進行冷卻。在電路板170與底殼140之間（也就是殼體110內之下部分空間S2）形成正壓區，可以有效地將散熱風扇180a, 180b吹向下部分空間S2之散熱氣流經由殼體110之側面140a或後緣140b的殼體出風口144向外排出，避免熱空氣在系統內部累積，影響電子裝置100之運作效能。如此，即可兼顧正壓系統以及負壓系統的優點，在有限的空間內，同時解決電子裝置100之內部系統元件與殼體110表面發熱的問題並提升使用者的體驗。The electronic device 100 in this case has shielding members 190, 690, 790 to shield the installation gap g1 between the circuit board 170 and the cooling fans 180a, 180b, which can effectively divide the internal space S0 of the casing 110 into a positive pressure area and a negative pressure area. . A negative pressure area is formed between the circuit board 170 and the keyboard module 160 (that is, the upper space S1 in the casing 110 ), which can effectively inhale cold air through the opening 1622 on the keyboard module 160 to the inside of the casing 110 System components are cooled. A positive pressure area is formed between the circuit board 170 and the bottom case 140 (that is, the lower space S2 in the casing 110), which can effectively blow the cooling airflow from the cooling fans 180a, 180b to the lower space S2 through the casing 110. The air outlet 144 of the casing on the side 140a or the rear edge 140b is discharged outward to prevent hot air from accumulating inside the system and affecting the operating performance of the electronic device 100. In this way, the advantages of the positive pressure system and the negative pressure system can be taken into account, and the problem of heat generation of the internal system components of the electronic device 100 and the surface of the housing 110 can be solved in a limited space and the user experience can be improved.

上述僅為本案較佳之實施例而已，並不對本案進行任何限制。任何所屬技術領域的技術人員，在不脫離本案的技術手段的範圍內，對本案揭露的技術手段和技術內容做任何形式的等同替換或修改等變動，均屬未脫離本案的技術手段的內容，仍屬於本案的保護範圍之內。The above are only preferred embodiments of this case and do not impose any restrictions on this case. Any technical personnel in the technical field who make any form of equivalent substitution or modification to the technical means and technical content disclosed in this case shall not deviate from the technical means of this case. It is still within the scope of protection of this case.

100:電子裝置 110:殼體 120:上蓋 140:底殼 140a:側面 140b:後緣 142, 144:殼體出風口 146:殼體底部入風口 160:鍵盤模組 162:底板 1622:開孔 164:按鍵 170:電路板 171a, 171b:缺口 171c:上表面 171d:板邊 172:中央處理單元 174:圖形處理器 176:散熱導管 180a, 180b:散熱風扇 181:側壁 182:第一風扇入風口 184:第一風扇出風口 186:第二風扇出風口 188:第二風扇入風口 190:遮擋件 191:凸出結構 195:遮擋件 S0:空間 S1:上部分空間 S2:下部分空間 g1:安裝間隙 S3:空間 690:遮擋件 790:遮擋件 100: electronic device 110: housing 120: upper cover 140: bottom housing 140a: side 140b: rear edge 142, 144: housing air outlet 146: housing bottom air inlet 160: keyboard module 162: bottom plate 1622: opening 164: key 170: circuit board 171a, 171b: notch 171c: upper surface 171d: board edge 172: central processing unit 174: graphics processor 176: heat dissipation duct 180a, 180b: heat dissipation fan 181: side wall 182: first fan air inlet 184: First fan outlet 186: Second fan outlet 188: Second fan inlet 190: Shielding piece 191: Protruding structure 195: Shielding piece S0: Space S1: Upper space S2: Lower space g1: Installation gap S3: Space 690: Shielding piece 790: Shielding piece

第一圖係依據本案一實施例所提供之電子裝置之示意圖；第二圖係第一圖之電子裝置之內部結構示意圖；第三圖係第一圖中之鍵盤模組之底板之示意圖；第四圖係對應於第一圖之電子裝置之右側部分的剖面示意圖；第五圖係放大顯示第四圖中之區域A；第六圖顯示本案遮擋件之另一實施例；以及第七圖顯示本案遮擋件之又一實施例。 The first figure is a schematic diagram of an electronic device provided according to an embodiment of the present invention; The second figure is a schematic diagram of the internal structure of the electronic device in the first figure; The third picture is a schematic diagram of the base plate of the keyboard module in the first picture; The fourth figure is a schematic cross-sectional view of the right part of the electronic device corresponding to the first figure; The fifth picture shows an enlarged view of area A in the fourth picture; Figure 6 shows another embodiment of the blocking member of the present invention; and The seventh figure shows another embodiment of the shielding member of this case.

100:電子裝置 100: Electronic devices

120:上蓋 120: Upper cover

140:底殼 140: bottom shell

140a:側面 140a: Side

142:殼體出風口 142: Shell air outlet

146:殼體底部入風口 146: Air inlet at the bottom of the housing

160:鍵盤模組 160:Keyboard module

162:底板 162: Base plate

164:按鍵 164:Button

170:電路板 170: Circuit board

171a:缺口 171a: Gap

176:散熱導管 176: Heat dissipation pipe

180a:散熱風扇 180a: Cooling fan

182:第一風扇入風口 182: First fan air inlet

184:第一風扇出風口 184: First fan outlet

186:第二風扇出風口 186: Second fan outlet

188:第二風扇入風口 188:Second fan air inlet

190:遮擋件 190: shielding piece

195:遮擋件 195: Shielding piece

S0:空間 S0: Space

S1:上部分空間 S1: Upper space

S2:下部分空間 S2: Lower space

g1:安裝間隙 g1: Installation clearance

S3:空間 S3: Space

Claims

一種電子裝置，包含：一殼體，具有一空間；一電路板，設於該殼體內，將該空間區分出一上部分空間以及一下部分空間，且該電路板具有一缺口；一散熱風扇，安裝於該缺口，且該散熱風扇與該缺口之邊緣之間具有一安裝間隙；以及一遮擋件，設於該電路板與該散熱風扇之間，用以遮擋該安裝間隙。 An electronic device comprises: a housing having a space; a circuit board disposed in the housing, dividing the space into an upper space and a lower space, and the circuit board having a notch; a heat dissipation fan mounted in the notch, and a mounting gap between the heat dissipation fan and the edge of the notch; and a shielding member disposed between the circuit board and the heat dissipation fan to shield the mounting gap.

如請求項1所述之電子裝置，其中，該散熱風扇具有一側壁，該遮擋件係形成於該側壁。An electronic device as described in claim 1, wherein the heat dissipation fan has a side wall and the shielding member is formed on the side wall.

如請求項1所述之電子裝置，其中，該遮擋件係由該電路板之一上表面延伸至該散熱風扇。The electronic device as claimed in claim 1, wherein the shielding member extends from an upper surface of the circuit board to the cooling fan.

如請求項1所述之電子裝置，其中，該遮擋件係由一可變形材料構成，且該遮擋件係位於該電路板之一板邊與該散熱風扇之間。An electronic device as described in claim 1, wherein the shielding member is made of a deformable material and is located between a board edge of the circuit board and the heat dissipation fan.

如請求項1所述之電子裝置，其中，該殼體包含一底殼以及一上蓋，該上蓋結合於該底殼而形成該空間。The electronic device as claimed in claim 1, wherein the housing includes a bottom case and an upper cover, and the upper cover is combined with the bottom case to form the space.

如請求項5所述之電子裝置，更包含一鍵盤模組，設於該上蓋，該鍵盤模組之底板具有複數開孔，該些開孔係連通至該上部分空間。The electronic device as claimed in claim 5 further includes a keyboard module located on the upper cover. The bottom plate of the keyboard module has a plurality of openings, and the openings are connected to the upper space.

如請求項5所述之電子裝置，其中，該底殼包含一殼體出風口，該殼體出風口係連通至該下部分空間。An electronic device as described in claim 5, wherein the bottom shell includes a shell air outlet, and the shell air outlet is connected to the lower space.

如請求項5所述之電子裝置，其中，該底殼包含一殼體底部入風口，該殼體底部入風口係連通至該散熱風扇。 An electronic device as described in claim 5, wherein the bottom housing includes a housing bottom air inlet, and the housing bottom air inlet is connected to the heat dissipation fan.

如請求項1所述之電子裝置，其中，該上部分空間係一負壓區，該下部分空間係一正壓區。 An electronic device as described in claim 1, wherein the upper space is a negative pressure area and the lower space is a positive pressure area.

如請求項5所述之電子裝置，其中，該散熱風扇具有一第一風扇出風口以及一第二風扇出風口，該第一風扇出風口係朝向該底殼之側面，該第二風扇出風口係朝向該下部分空間。 The electronic device as claimed in claim 5, wherein the cooling fan has a first fan outlet and a second fan outlet, the first fan outlet faces the side of the bottom case, and the second fan outlet The system is facing the lower part of the space.

如請求項1所述之電子裝置，其中，該散熱風扇係鎖固於該電路板。 The electronic device as claimed in claim 1, wherein the cooling fan is locked to the circuit board.

如請求項1所述之電子裝置，其中，該電子裝置係一筆記型電腦之主機部分。 The electronic device as claimed in claim 1, wherein the electronic device is the host part of a notebook computer.