TWM644308U - Display device and information processing device - Google Patents
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Abstract
本創作揭示一種顯示裝置，其包括：一顯示面板、至少一顯示驅動晶片以及一軟性電路板，其中，該顯示面板包括一基板以及形成在該基板上的一主動區塊與一電路。依據本創作之設計，該軟性電路板具有複數個錫球，該電路具有複數個電極墊，且該複數個錫球向下連接該複數個電極墊。並且，該顯示驅動晶片的底部亦設有複數個錫球，且該複數個錫球可向下連接該複數個電極墊，使得該顯示驅動晶片同時耦接該電路與該軟性電路板。 The creation discloses a display device, which includes: a display panel, at least one display driver chip and a flexible circuit board, wherein the display panel includes a substrate, an active block and a circuit formed on the substrate. According to the design of the invention, the flexible circuit board has a plurality of solder balls, the circuit has a plurality of electrode pads, and the plurality of solder balls are connected downward to the plurality of electrode pads. Moreover, a plurality of solder balls are also provided on the bottom of the display driver chip, and the plurality of solder balls can be connected downward to the plurality of electrode pads, so that the display driver chip is coupled to the circuit and the flexible circuit board at the same time.
Description
本創作為平面顯示裝置的相關技術領域，尤指一種顯示裝置，其包含至少二個利用軟板接合(FPC bonding)相互電連接的電路。The present invention is related to the technical field of flat panel display devices, especially a display device comprising at least two circuits electrically connected to each other by FPC bonding.
已知，平面顯示器包含非自發光型平面顯示器以及自發光型平面顯示器，其中液晶顯示器為使用已久的一種非自發光型平面顯示器，而有機發光二極體(Organic light-emitting diode, OLED)顯示器以及發光二極體(Light-emitting diode, LED)顯示器則為目前具有主流應用的自發光型平面顯示器。圖1為習知的一種OLED顯示裝置的方塊圖。如圖1所示，習知的OLED顯示裝置1a係主要包括：一OLED面板11a、一閘極驅動單元121a、一源極驅動單元122a、以及一時序控制器(Tcon)120a，其中該OLED面板11a包括X×Y個畫素電路111a以及X×Y個OLED元件112a。熟悉OLED顯示裝置1a之設計與製造的工程師必然知道，當該OLED顯示裝置1a整合在行動電子裝置(如：智慧型手機、智慧型手錶)之時，該閘極驅動單元121a、該源極驅動單元122a和該時序控制器120a係被一同整合在一顯示驅動晶片之中。It is known that flat panel displays include non-self-illuminating flat-panel displays and self-illuminating flat-panel displays, wherein liquid crystal displays are a kind of non-self-illuminating flat-panel displays that have been used for a long time, and organic light-emitting diodes (Organic light-emitting diode, OLED) Displays and light-emitting diode (Light-emitting diode, LED) displays are self-illuminating flat-panel displays currently in mainstream applications. FIG. 1 is a block diagram of a conventional OLED display device. As shown in FIG. 1 , the conventional OLED display device 1a mainly includes: an OLED panel 11a, a gate driving unit 121a, a source driving unit 122a, and a timing controller (Tcon) 120a, wherein the OLED panel 11a includes X×Y pixel circuits 111a and X×Y OLED elements 112a. Engineers who are familiar with the design and manufacture of the OLED display device 1a must know that when the OLED display device 1a is integrated into mobile electronic devices (such as: smart phones, smart watches), the gate drive unit 121a, the source drive unit 121a The unit 122a and the timing controller 120a are integrated into a display driver chip.
然而，隨著智慧型手機、智慧型手錶、平板電腦等行動電子裝置朝向全屏顯示設計發展，所述OLED面板11a的有效區域(Active area, AA)也越來越寬，使得單一顯示驅動晶片需要處理龐大的資訊流，故而需要利用先進積體電路製程技術來製造，顯然不符合商業成本。因此，基於商業成本考量，GOA技術被提出並應用在所述OLED顯示裝置1a之中。GOA為Gate Driver on Array的英文縮寫，即陣列閘極驅動技術，是將用以驅動閘極線(或稱水平掃描線)的閘極驅動單元121a直接製作在該OLED面板11a的玻璃基板之上。如此，該顯示驅動晶片只需要包含用以處理高速數據流(data stream)的時序控制器(Tcon)120a、源極驅動單元122a以及數據傳輸介面。換句話說，GOA技術具有以下優點：減少該顯示驅動晶片的外接pin腳、降低OLED顯示裝置1a的產品成本、提高OLED顯示裝置1a的屏占比、以及提高產能。However, with the development of mobile electronic devices such as smart phones, smart watches, and tablet computers towards full-screen display designs, the active area (Active area, AA) of the OLED panel 11a is also getting wider and wider, so that a single display driver chip requires To deal with huge information flows, it is necessary to use advanced integrated circuit process technology to manufacture, which obviously does not meet the commercial cost. Therefore, based on commercial cost considerations, the GOA technology is proposed and applied in the OLED display device 1a. GOA is the English abbreviation of Gate Driver on Array, that is, the array gate drive technology, which is to directly manufacture the gate drive unit 121a for driving the gate line (or horizontal scanning line) on the glass substrate of the OLED panel 11a . In this way, the display driver chip only needs to include a timing controller (Tcon) 120a for processing a high-speed data stream, a source driver unit 122a and a data transmission interface. In other words, the GOA technology has the following advantages: reducing the external pins of the display driver chip, reducing the product cost of the OLED display device 1a, increasing the screen-to-body ratio of the OLED display device 1a, and increasing productivity.
圖2、圖3分別為利用COF技術進行整合的OLED顯示裝置的上視圖及側視圖。目前，藉由薄膜覆晶封裝(Chip On Film, COF)技術可將包含該閘極驅動單元121a、該源極驅動單元122a與該時序控制器(Tcon)120a的顯示驅動晶片以及包含陣列閘極驅動電路的OLED面板11a進行整合。更詳細地說明，如圖1、圖2與圖3所示，該OLED面板11a包括一基板11Sa以及形成在該基板11Sa上的一主動區塊11Aa，且該基板11Sa之上還形成有該X×Y個畫素電路111a以及陣列閘極驅動電路。其中，包含圖1所示之閘極驅動單元121a、源極驅動單元122a以及時序控制器(Tcon)120a的一顯示驅動晶片12a設置在一電連接膜片(film)123a之上，且該電連接膜片123a的兩側分別連接該基板11Sa和一軟性電路板(Flexible print circuit, FPC)13a。2 and 3 are respectively a top view and a side view of an OLED display device integrated using COF technology. At present, the display driver chip including the gate driving unit 121a, the source driving unit 122a and the timing controller (Tcon) 120a and the array gate can be packaged using Chip On Film (COF) technology. The OLED panel 11a of the driving circuit is integrated. In more detail, as shown in FIG. 1, FIG. 2 and FIG. 3, the OLED panel 11a includes a substrate 11Sa and an active block 11Aa formed on the substrate 11Sa, and the X is also formed on the substrate 11Sa. ×Y pixel circuits 111a and array gate driving circuits. Wherein, a display driver chip 12a comprising gate driver unit 121a, source driver unit 122a and timing controller (Tcon) 120a shown in FIG. 1 is arranged on an electrical connection film (film) 123a, and the electrical connection Two sides of the connecting film 123a are respectively connected to the substrate 11Sa and a flexible printed circuit (FPC) 13a.
由前述說明可知，由於該電連接膜片123a的兩側係分別連接該基板11Sa和該軟性電路板13a，因此，該電連接膜片123a作為一連接基板(interposer)，使得該顯示驅動晶片12a通過該電連接膜片123a耦接該基板11Sa上的X×Y個畫素電路111a及/或陣列閘極驅動電路，且該顯示驅動晶片12a還通過該電連接膜片123a以及該軟性電路板13a耦接一上位機(如：智慧型手機的應用處理器)。然而，實務經驗指出，該電連接膜片123a的使用反而使得一電路與另一電路之間需要進行個別接合(bonding)，導致量產的成本無法進一步地下降。換句話說，習知的用於將顯示驅動晶片12a、其上形成有電路的基板11Sa以及軟性電路板13a進行整合性接合的薄膜覆晶封裝結構仍存在需要進一步改善的空間。As can be seen from the foregoing description, since the two sides of the electrical connection film 123a are respectively connected to the substrate 11Sa and the flexible circuit board 13a, the electrical connection film 123a is used as a connection substrate (interposer), so that the display driver chip 12a The X×Y pixel circuits 111a and/or array gate drive circuits on the substrate 11Sa are coupled through the electrical connection film 123a, and the display driver chip 12a is also connected to the flexible circuit board through the electrical connection film 123a 13a is coupled to a host computer (such as an application processor of a smart phone). However, practical experience points out that the use of the electrical connection film 123 a requires individual bonding between one circuit and another circuit, resulting in that the cost of mass production cannot be further reduced. In other words, there is still room for further improvement in the conventional film-on-chip package structure for integrally bonding the display driver chip 12a, the substrate 11Sa on which the circuit is formed, and the flexible circuit board 13a.
由上述說明可知，本領域亟需一種新式的顯示裝置及資訊處理裝置。It can be seen from the above description that there is an urgent need for a new type of display device and information processing device in this field.
本創作之主要目的在於提供一種顯示裝置，其包括：一顯示面板、至少一顯示驅動晶片以及一軟性電路板，其特徵在於，該顯示面板的基板具有至少一電路，且該電路具有複數個電極墊。並且，該顯示驅動晶片具有複數個錫球向下連接該複數個電極墊或直接電連接該電路，且該軟性電路板複數個錫球向下連接該複數個電極墊。The main purpose of this creation is to provide a display device, which includes: a display panel, at least one display driver chip and a flexible circuit board, characterized in that the substrate of the display panel has at least one circuit, and the circuit has a plurality of electrodes pad. Moreover, the display driver chip has a plurality of solder balls connected downwards to the plurality of electrode pads or directly electrically connected to the circuit, and the plurality of solder balls of the flexible circuit board is connected downwards to the plurality of electrode pads.
簡單地說，取代習知技術將顯示驅動晶片設置在電連接膜片(film)之上，本創作將顯示驅動晶片直接設置在顯示面板的基板上，並利用錫球焊接(bump bonding)技術使顯示驅動晶片、基板上的電路及/或軟性電路板達成電性連接，藉此方式實現製程簡化並降低量產成本。Simply put, instead of placing the display driver chip on the electrical connection film in the conventional technology, the present invention directly arranges the display driver chip on the substrate of the display panel, and utilizes bump bonding technology to make the The display driver chip, the circuit on the substrate and/or the flexible circuit board are electrically connected, thereby simplifying the manufacturing process and reducing the cost of mass production.
為達成上述目的，本創作提出所述顯示裝置的一實施例，其包括： 一顯示面板，包括一基板以及形成於該基板之上的一主動區塊，且該基板上進一步形成有與該主動區塊電連接的一電路； 至少一顯示驅動晶片，設置在該基板上，且具有一第一電連接介面電連接該電路；以及 一軟性電路板； 其中，該電路具有一第二電連接介面，且該軟性電路板具有一第三電連接介面電連接該第二電連接介面。 To achieve the above purpose, this creation proposes an embodiment of the display device, which includes: A display panel, including a substrate and an active block formed on the substrate, and a circuit electrically connected to the active block is further formed on the substrate; At least one display driver chip is arranged on the substrate and has a first electrical connection interface electrically connected to the circuit; and a flexible circuit board; Wherein, the circuit has a second electrical connection interface, and the flexible circuit board has a third electrical connection interface electrically connected to the second electrical connection interface.
在一實施例中，該第一電連接介面與該第三電連接介面皆包括複數個錫球，且該第二電連接介面包括複數個電極墊(electrode pad)。In one embodiment, both the first electrical connection interface and the third electrical connection interface include a plurality of solder balls, and the second electrical connection interface includes a plurality of electrode pads.
在可行的實施例中，該第二電連接介面進一步包括複數個高速信號電極墊、至少一公共電源電極墊以及至少一公共接地電極墊，且該顯示驅動晶片進一步具有一第四電連接介面電連接該複數個高速信號電極墊、該至少一公共電源電極墊以及該至少一公共接地電極墊。並且，該第四電連接介面包括用以連接該複數個高速信號電極墊的複數個信號錫球、用以連接該至少一公共電源電極墊的至少一公共電源錫球以及用以連接該至少一公共接地電極墊的至少一公共接地錫球。In a feasible embodiment, the second electrical connection interface further includes a plurality of high-speed signal electrode pads, at least one common power electrode pad and at least one common ground electrode pad, and the display driver chip further has a fourth electrical connection interface The plurality of high-speed signal electrode pads, the at least one common power electrode pad and the at least one common ground electrode pad are connected. Moreover, the fourth electrical connection interface includes a plurality of signal solder balls used to connect the plurality of high-speed signal electrode pads, at least one common power solder ball used to connect the at least one common power electrode pad, and used to connect the at least one At least one common ground solder ball of the common ground electrode pad.
並且，本創作還提出所述顯示裝置的另一實施例，其包括： 一顯示面板，包括一基板以及形成於該基板之上的一主動區塊，且該基板上進一步形成有與該主動區塊電連接的一電路； 至少一顯示驅動晶片，設置在該基板上，且具有一第一電連接介面電連接該電路； 一軟性電路板； 其中，該電路具有一第二電連接介面，該軟性電路板具有一第三電連接介面，該顯示驅動晶片進一步具有一第四電連接介面，且該第三電連接介面同時電連接該第二電連接介面與該第四電連接介面。 Moreover, this creation also proposes another embodiment of the display device, which includes: A display panel, including a substrate and an active block formed on the substrate, and a circuit electrically connected to the active block is further formed on the substrate; At least one display driver chip is arranged on the substrate and has a first electrical connection interface electrically connected to the circuit; a flexible circuit board; Wherein, the circuit has a second electrical connection interface, the flexible circuit board has a third electrical connection interface, the display driver chip further has a fourth electrical connection interface, and the third electrical connection interface is simultaneously electrically connected to the second The electrical connection interface is connected with the fourth electrical connection interface.
在一實施例中， 該第一電連接介面、該第三電連接介面與該第四電連接介面皆包括複數個錫球，該第二電連接介面包括複數個電極墊，且該軟性電路板進一步包括複數個導通孔，使得該第三電連接介面的該複數個錫球透過該複數個導通孔分別連接該第四電連接介面的該複數個錫球接介面。In one embodiment, the first electrical connection interface, the third electrical connection interface and the fourth electrical connection interface all include a plurality of solder balls, the second electrical connection interface includes a plurality of electrode pads, and the flexible circuit board It further includes a plurality of via holes, so that the plurality of solder balls of the third electrical connection interface are respectively connected to the plurality of solder ball interfaces of the fourth electrical connection interface through the plurality of via holes.
在一實施例中，該電路和該第一電連接介面之間設有一中介層(interposer)。In one embodiment, an interposer is provided between the circuit and the first electrical connection interface.
進一步地，本創作還提出所述顯示裝置的又一實施例，其包括： 一顯示面板，包括一基板以及形成於該基板之上的一主動區塊，且該基板上進一步形成有與該主動區塊電連接的一電路； 至少一顯示驅動晶片，設置在該基板上，其中，該顯示驅動晶片具有一第一電連接介面，且該電路具有一第二電連接介面電連接該第一電連接介面；以及 一軟性電路板； 其中，該軟性電路板具有一第三電連接介面，且該顯示驅動晶片進一步具有一第四電連接介面電連接該第三電連接介面。 Furthermore, this creation also proposes another embodiment of the display device, which includes: A display panel, including a substrate and an active block formed on the substrate, and a circuit electrically connected to the active block is further formed on the substrate; At least one display driver chip is disposed on the substrate, wherein the display driver chip has a first electrical connection interface, and the circuit has a second electrical connection interface electrically connected to the first electrical connection interface; and a flexible circuit board; Wherein, the flexible circuit board has a third electrical connection interface, and the display driver chip further has a fourth electrical connection interface electrically connected to the third electrical connection interface.
在一實施例中，該第一電連接介面、該第三電連接介面與該第四電連接介面皆包括複數個錫球。In one embodiment, the first electrical connection interface, the third electrical connection interface and the fourth electrical connection interface all include a plurality of solder balls.
在一實施例中，該第二電連接介面和該第一電連接介面之間設有一中介層。In one embodiment, an intermediary layer is disposed between the second electrical connection interface and the first electrical connection interface.
此外，本創作還提供一種資訊處理裝置，其特徵在於，包含如前所述本創作之任一顯示裝置。並且，在可行的實施例中，該資訊處理裝置為選自於由頭戴式顯示裝置、智慧型電視、智慧型手機、智慧型手錶、平板電腦、一體式電腦、筆記型電腦、車載娛樂裝置、數位相機、和視訊式門口機所組成群組之中的一種電子裝置。In addition, the invention also provides an information processing device, which is characterized in that it includes any display device of the invention as mentioned above. And, in a feasible embodiment, the information processing device is selected from a head-mounted display device, a smart TV, a smart phone, a smart watch, a tablet computer, an all-in-one computer, a notebook computer, a car entertainment device , a digital camera, and an electronic device in the group consisting of a video-based outdoor station.
為使 貴審查委員能進一步瞭解本創作之結構、特徵、目的、與其優點，茲附以圖式及較佳具體實施例之詳細說明如後。In order to enable your review committee to further understand the structure, characteristics, purpose, and advantages of this creation, drawings and detailed descriptions of preferred specific embodiments are hereby attached.
第一實施例first embodiment
圖4為本創作之一種顯示裝置的第一實施例的上視圖，且圖5為本創作之顯示裝置的第一實施例的側視圖。如圖4與圖5所示，在第一實施例之中，本創作之顯示裝置1包括：一顯示面板11、至少一顯示驅動晶片12以及一軟性電路板(Flexible print circuit, FPC)13，其中，該顯示面板11可以是但不限於LCD面板、OLED面板、LED面板、Micro-LED面板、或QLED面板，且其包括一基板11S以及形成於該基板11S之上的一主動區塊11A，且該基板11S上進一步形成有與該主動區塊11A電連接的一電路。更詳細地說明，該電路包括X×Y個畫素電路，且該主動區塊11A包括X×Y個發光元件(如：OLED元件)。其中，X、Ý為正整數，且實務上還可以利用GOA技術使該電路同時包含一陣列閘極驅動電路。FIG. 4 is a top view of the first embodiment of a display device of the present invention, and FIG. 5 is a side view of the first embodiment of the display device of the present invention. As shown in FIG. 4 and FIG. 5, in the first embodiment, the display device 1 of the present invention includes: a display panel 11, at least one display driver chip 12 and a flexible circuit board (Flexible print circuit, FPC) 13, Wherein, the display panel 11 can be but not limited to LCD panel, OLED panel, LED panel, Micro-LED panel, or QLED panel, and it includes a substrate 11S and an active block 11A formed on the substrate 11S, And a circuit electrically connected to the active block 11A is further formed on the substrate 11S. In more detail, the circuit includes X×Y pixel circuits, and the active block 11A includes X×Y light emitting elements (such as OLED elements). Wherein, X and Ý are positive integers, and in practice, the GOA technology can also be used to make the circuit include an array gate driving circuit at the same time.
如圖4與圖5所示，在第一實施例之中，該顯示驅動晶片12設置在該基板11S上，且具有一第一電連接介面121直接電連接該電路。並且，依據本創作之設計，該電路具有一第二電連接介面11A1，且該軟性電路板13具有一第三電連接介面131電連接該第二電連接介面11A1。具體地，如圖5所示，該第一電連接介面121與該第三電連接介面131皆包括複數個錫球(solder bumps)，且該第二電連接介面11A1包括複數個電極墊(electrode pad)。換句話說，該顯示驅動晶片12的該第一電連接介面121通過錫球焊接(bump bonding)而與形成在該基板11S之上的該電路接合，且該軟性電路板13的該第三電連接介面131通過錫球焊接而與該電路的該第二電連接介面11A1接合。As shown in FIG. 4 and FIG. 5 , in the first embodiment, the display driver chip 12 is disposed on the substrate 11S, and has a first electrical connection interface 121 directly electrically connected to the circuit. Moreover, according to the design of the present invention, the circuit has a second electrical connection interface 11A1, and the flexible circuit board 13 has a third electrical connection interface 131 electrically connected to the second electrical connection interface 11A1. Specifically, as shown in FIG. 5, both the first electrical connection interface 121 and the third electrical connection interface 131 include a plurality of solder bumps, and the second electrical connection interface 11A1 includes a plurality of electrode pads. pad). In other words, the first electrical connection interface 121 of the display driver chip 12 is bonded to the circuit formed on the substrate 11S through bump bonding, and the third electrical connection interface 121 of the flexible circuit board 13 The connection interface 131 is bonded to the second electrical connection interface 11A1 of the circuit by solder ball welding.
第二實施例second embodiment
圖6為本創作之顯示裝置的第二實施例的上視圖，且圖7為本創作之顯示裝置的第二實施例的側視圖。如圖6與圖7所示，在第二實施例之中，本創作之顯示裝置1同樣包括：一顯示面板11、至少一顯示驅動晶片12以及一軟性電路板13，其中，該顯示面板11包括一基板11S以及形成於該基板11S之上的一主動區塊11A，且該基板11S上進一步形成有與該主動區塊11A電連接的一電路。更詳細地說明，該電路包括X×Y個畫素電路，且該主動區塊11A包括X×Y個發光元件(如：OLED元件)。實務上，可以利用GOA技術使該電路同時包含一陣列閘極驅動電路。FIG. 6 is a top view of the second embodiment of the display device of the present invention, and FIG. 7 is a side view of the second embodiment of the display device of the present invention. As shown in FIG. 6 and FIG. 7, in the second embodiment, the display device 1 of the present invention also includes: a display panel 11, at least one display driver chip 12 and a flexible circuit board 13, wherein the display panel 11 It includes a substrate 11S and an active block 11A formed on the substrate 11S, and a circuit electrically connected to the active block 11A is further formed on the substrate 11S. In more detail, the circuit includes X×Y pixel circuits, and the active block 11A includes X×Y light emitting elements (such as OLED elements). In practice, the GOA technology can be used to make the circuit include an array gate driving circuit at the same time.
如圖6與圖7所示，在第二實施例之中，該顯示驅動晶片12設置在該基板11S上，且具有一第一電連接介面121直接電連接該電路。並且，該電路具有一第二電連接介面11A1，且該軟性電路板13具有一第三電連接介面131電連接該第二電連接介面11A1。具體地，如圖5所示，該第一電連接介面121與該第三電連接介面131皆包括複數個錫球(solder bumps)，且該第二電連接介面11A1包括複數個電極墊。換句話說，該顯示驅動晶片12的該第一電連接介面121通過錫球焊接(bump bonding)而與形成在該基板11S之上的該電路接合，且該軟性電路板13的該第三電連接介面131通過錫球焊接而與該電路的該第二電連接介面11A1接合。As shown in FIGS. 6 and 7 , in the second embodiment, the display driver chip 12 is disposed on the substrate 11S, and has a first electrical connection interface 121 directly electrically connected to the circuit. Moreover, the circuit has a second electrical connection interface 11A1 , and the flexible circuit board 13 has a third electrical connection interface 131 electrically connected to the second electrical connection interface 11A1 . Specifically, as shown in FIG. 5 , both the first electrical connection interface 121 and the third electrical connection interface 131 include a plurality of solder bumps, and the second electrical connection interface 11A1 includes a plurality of electrode pads. In other words, the first electrical connection interface 121 of the display driver chip 12 is bonded to the circuit formed on the substrate 11S through bump bonding, and the third electrical connection interface 121 of the flexible circuit board 13 The connection interface 131 is bonded to the second electrical connection interface 11A1 of the circuit by solder ball welding.
特別地，在第二實施例中，該第二電連接介面11A1進一步包括複數個高速信號電極墊11A2、至少一公共電源電極墊11AP以及至少一公共接地電極墊11AG，且該顯示驅動晶片12進一步具有一第四電連接介面122電連接該複數個高速信號電極墊11A2、該至少一公共電源電極墊11AP以及該至少一公共接地電極墊11AG。具體地，該第四電連接介面122包括用以連接該複數個高速信號電極墊11A2的複數個信號錫球、用以連接該至少一公共電源電極墊11AP的至少一公共電源錫球以及用以連接該至少一公共接地電極墊11AG的至少一公共接地錫球。簡單地說，第二實施例的設計使得形成於該基板11S上的該電路以及該顯示驅動晶片12能夠享有良好的電源供應品質，同時使該顯示驅動晶片12和該軟性電路板13之間能夠透過高速介面進行高速數據流(data stream)的傳輸。此外，如圖7所示，由於該顯示驅動晶片12的該第二電連接介面11A1通過錫球焊接(bump bonding)而與形成在該電路的該複數個高速信號電極墊11A2接合，且該軟性電路板13的該第三電連接介面131通過錫球焊接而與該電路的該第二電連接介面11A1接合，因此可以降低線路總阻值(即，降低IR drop)。 In particular, in the second embodiment, the second electrical connection interface 11A1 further includes a plurality of high-speed signal electrode pads 11A2, at least one common power electrode pad 11AP, and at least one common ground electrode pad 11AG, and the display driver chip 12 further A fourth electrical connection interface 122 is provided to electrically connect the plurality of high-speed signal electrode pads 11A2 , the at least one common power electrode pad 11AP and the at least one common ground electrode pad 11AG. Specifically, the fourth electrical connection interface 122 includes a plurality of signal solder balls for connecting the plurality of high-speed signal electrode pads 11A2, at least one common power solder ball for connecting the at least one common power electrode pad 11AP, and At least one common ground solder ball connected to the at least one common ground electrode pad 11AG. In short, the design of the second embodiment enables the circuit formed on the substrate 11S and the display driver chip 12 to enjoy a good power supply quality, and at the same time enables the connection between the display driver chip 12 and the flexible circuit board 13 to be stable. High-speed data stream (data stream) transmission is performed through the high-speed interface. In addition, as shown in FIG. 7, since the second electrical connection interface 11A1 of the display driver chip 12 is bonded to the plurality of high-speed signal electrode pads 11A2 formed in the circuit through bump bonding, and the flexible The third electrical connection interface 131 of the circuit board 13 is bonded to the second electrical connection interface 11A1 of the circuit through solder ball welding, so that the total circuit resistance (ie, IR drop) can be reduced.
第三實施例 third embodiment
圖8為本創作之顯示裝置的第三實施例的上視圖，且圖9為本創作之顯示裝置的第三實施例的側視圖。如圖8與圖9所示，在第三實施例之中，本創作之顯示裝置1同樣包括：一顯示面板11、至少一顯示驅動晶片12以及一軟性電路板13，其中，該顯示面板11包括一基板11S以及形成於該基板11S之上的一主動區塊11A，且該基板11S上進一步形成有與該主動區塊11A電連接的一電路。更詳細地說明，該電路包括X×Y個畫素電路，且該主動區塊11A包括X×Y個發光元件(如：OLED元件)。實務上，可以利用GOA技術使該電路同時包含一陣列閘極驅動電路。 FIG. 8 is a top view of the third embodiment of the display device of the present invention, and FIG. 9 is a side view of the third embodiment of the display device of the present invention. As shown in FIG. 8 and FIG. 9, in the third embodiment, the display device 1 of the present invention also includes: a display panel 11, at least one display driver chip 12 and a flexible circuit board 13, wherein the display panel 11 It includes a substrate 11S and an active block 11A formed on the substrate 11S, and a circuit electrically connected to the active block 11A is further formed on the substrate 11S. In more detail, the circuit includes X×Y pixel circuits, and the active block 11A includes X×Y light emitting elements (such as OLED elements). In practice, the GOA technology can be used to make the circuit include an array gate driving circuit at the same time.
如圖8與圖9所示，在第三實施例之中，該顯示驅動晶片12設置在該基板11S上，且具有一第一電連接介面121電連接該電路。並且，依據本創作之設計，該電路具有一第二電連接介面11A1，該軟性電路板13具有一第三電連接介面131，該顯示驅動晶片12進一步具有一第四電連接介面122，且該第三電連接介面131同時電連接該第二電連接介面11A1與該第四電連接介面122。具體地，該第一電連接介面121、該第三電連接介面131與該第四電連接介面122皆包括複數個錫球，該第二電連接介面11A1包括複數個電極墊，且該軟性電路板13進一步包括複數個導通孔，使得該第三電連接介面131的該複數個錫球透過該複數個導通孔分別連接該第四電連接介面122的該複數個錫球接介面11A1。特別地，在第三實施例中，該電路和該第一電連接介面121之間設有一中介層(interposer)120。As shown in FIG. 8 and FIG. 9 , in the third embodiment, the display driver chip 12 is disposed on the substrate 11S, and has a first electrical connection interface 121 electrically connected to the circuit. Moreover, according to the design of the present creation, the circuit has a second electrical connection interface 11A1, the flexible circuit board 13 has a third electrical connection interface 131, the display driver chip 12 further has a fourth electrical connection interface 122, and the The third electrical connection interface 131 is electrically connected to the second electrical connection interface 11A1 and the fourth electrical connection interface 122 at the same time. Specifically, the first electrical connection interface 121, the third electrical connection interface 131 and the fourth electrical connection interface 122 all include a plurality of solder balls, the second electrical connection interface 11A1 includes a plurality of electrode pads, and the flexible circuit The board 13 further includes a plurality of via holes, so that the plurality of solder balls of the third electrical connection interface 131 are respectively connected to the plurality of solder ball connection interfaces 11A1 of the fourth electrical connection interface 122 through the plurality of via holes. In particular, in the third embodiment, an interposer 120 is provided between the circuit and the first electrical connection interface 121 .
簡單地說，在第三實施例中，在共接該第二電連接介面11A1的情況下，在該軟性電路板13之上製作複數個導通孔，可使形成在該基板11S之上的該電路和該顯示驅動晶片通過設置在該複數個導通孔之中的複數個錫球而達成電性連接。因此，第三實施例的設計使得形成於該基板11S上的該電路以及該顯示驅動晶片12能夠享有良好的電源供應品質，同時使該顯示驅動晶片12和該軟性電路板13之間能夠透過高速介面進行高速數據流(data stream)的傳輸。In short, in the third embodiment, in the case of sharing the second electrical connection interface 11A1, a plurality of via holes are made on the flexible circuit board 13, so that the formed on the substrate 11S The circuit and the display driver chip are electrically connected through a plurality of solder balls arranged in the plurality of through holes. Therefore, the design of the third embodiment enables the circuit formed on the substrate 11S and the display driver chip 12 to enjoy good power supply quality, and at the same time enables high-speed communication between the display driver chip 12 and the flexible circuit board 13 . The interface performs high-speed data stream (data stream) transmission.
第四實施例Fourth embodiment
圖10為本創作之顯示裝置的第四實施例的上視圖，且圖11為本創作之顯示裝置的第四實施例的側視圖。如圖10與圖11所示，在第四實施例之中，本創作之顯示裝置1同樣包括：一顯示面板11、至少一顯示驅動晶片12以及一軟性電路板13，其中，該顯示面板11包括一基板11S以及形成於該基板11S之上的一主動區塊11A，且該基板11S上進一步形成有與該主動區塊11A電連接的一電路。更詳細地說明，該電路包括X×Y個畫素電路，且該主動區塊11A包括X×Y個發光元件(如：OLED元件)。實務上，可以利用GOA技術使該電路同時包含一陣列閘極驅動電路。FIG. 10 is a top view of the fourth embodiment of the display device of the present invention, and FIG. 11 is a side view of the fourth embodiment of the display device of the present invention. As shown in Figure 10 and Figure 11, in the fourth embodiment, the display device 1 of the present invention also includes: a display panel 11, at least one display driver chip 12 and a flexible circuit board 13, wherein the display panel 11 It includes a substrate 11S and an active block 11A formed on the substrate 11S, and a circuit electrically connected to the active block 11A is further formed on the substrate 11S. In more detail, the circuit includes X×Y pixel circuits, and the active block 11A includes X×Y light emitting elements (such as OLED elements). In practice, the GOA technology can be used to make the circuit include an array gate driving circuit at the same time.
如圖10與圖11所示，在第四實施例之中，該顯示驅動晶片12設置在該基板11S上，其中，該顯示驅動晶片12具有一第一電連接介面121，且該電路具有一第二電連接介面11A1電連接該第一電連接介面121。另一方面，依據本創作之設計，該該軟性電路板13具有一第三電連接介面131，且該顯示驅動晶片12進一步具有一第四電連接介面122電連接該第三電連接介面131。具體地，該第一電連接介面121、該第三電連接介面131與該第四電連接介面122皆包括複數個錫球。並且，如圖11所示，該第二電連接介面11A1和該第一電連接介面121之間設有一中介層(interposer)120。As shown in FIG. 10 and FIG. 11, in the fourth embodiment, the display driver chip 12 is disposed on the substrate 11S, wherein the display driver chip 12 has a first electrical connection interface 121, and the circuit has a The second electrical connection interface 11A1 is electrically connected to the first electrical connection interface 121 . On the other hand, according to the design of the present invention, the flexible circuit board 13 has a third electrical connection interface 131 , and the display driver chip 12 further has a fourth electrical connection interface 122 electrically connected to the third electrical connection interface 131 . Specifically, the first electrical connection interface 121 , the third electrical connection interface 131 and the fourth electrical connection interface 122 all include a plurality of solder balls. Moreover, as shown in FIG. 11 , an interposer 120 is disposed between the second electrical connection interface 11A1 and the first electrical connection interface 121 .
如此，上述已完整且清楚地說明本創作之顯示裝置；並且，經由上述可得知本創作具有下列優點：In this way, the above has completely and clearly described the display device of this creation; and, through the above, it can be known that this creation has the following advantages:
(1)本創作揭示一種顯示裝置，其主要包括：一顯示面板、至少一顯示驅動晶片以及一軟性電路板，其特徵在於，該顯示面板的基板具有至少一電路，且該電路具有複數個電極墊。並且，該顯示驅動晶片具有複數個錫球向下連接該複數個電極墊或直接電連接該電路，且該軟性電路板複數個錫球向下連接該複數個電極墊。簡單地說，取代習知技術將顯示驅動晶片設置在電連接膜片(film)之上，本創作將顯示驅動晶片直接設置在顯示面板的基板上，並利用錫球焊接(bump bonding)技術使顯示驅動晶片、基板上的電路及/或軟性電路板達成電性連接，藉此方式實現製程簡化並降低量產成本。(1) This creation discloses a display device, which mainly includes: a display panel, at least one display driver chip, and a flexible circuit board, characterized in that the substrate of the display panel has at least one circuit, and the circuit has a plurality of electrodes pad. Moreover, the display driver chip has a plurality of solder balls connected downwards to the plurality of electrode pads or directly electrically connected to the circuit, and the plurality of solder balls of the flexible circuit board is connected downwards to the plurality of electrode pads. Simply put, instead of placing the display driver chip on the electrical connection film in the conventional technology, the present invention directly arranges the display driver chip on the substrate of the display panel, and utilizes bump bonding technology to make the The display driver chip, the circuit on the substrate and/or the flexible circuit board are electrically connected, thereby simplifying the manufacturing process and reducing the cost of mass production.
(2)並且，本創作同時提出一種資訊處理裝置，其特徵在於，包含如前所述本創作之任一顯示裝置。在一實施例中，該資訊處理裝置為選自於由頭戴式顯示裝置、智慧型電視、智慧型手機、智慧型手錶、平板電腦、一體式電腦、筆記型電腦、車載娛樂裝置、數位相機、和視訊式門口機所組成群組之中的一種電子裝置。(2) In addition, this creation also proposes an information processing device, which is characterized in that it includes any display device of this creation as mentioned above. In one embodiment, the information processing device is selected from a head-mounted display device, a smart TV, a smart phone, a smart watch, a tablet computer, an all-in-one computer, a notebook computer, a car entertainment device, a digital camera , and an electronic device in the group formed by the video door station.
必須加以強調的是，前述本案所揭示者乃為較佳實施例，舉凡局部之變更或修飾而源於本案之技術思想而為熟習該項技藝之人所易於推知者，俱不脫本案之專利權範疇。It must be emphasized that what is disclosed in the above-mentioned case is a preferred embodiment, and all partial changes or modifications derived from the technical ideas of this case and easily deduced by those familiar with the technology are all inseparable from the patent of this case. category of rights.
綜上所陳，本案無論目的、手段與功效，皆顯示其迥異於習知技術，且其首先創作合於實用，確實符合新型之專利要件，懇請 貴審查委員明察，並早日賜予專利俾嘉惠社會，是為至禱。In conclusion, regardless of the purpose, means and effects of this case, it shows that it is very different from the conventional technology, and its first creation is practical, and it does meet the requirements of a patent for a new model. I implore your review committee to be aware and grant a patent as soon as possible to benefit you Society is for the Most Prayer.
1a:OLED顯示裝置1a: OLED display device
11a:OLED面板11a: OLED panel
111a:畫素電路111a: Pixel circuit
112a:OLED元件112a: OLED element
11Sa:基板11Sa: Substrate
11Aa:主動區塊11Aa: Active block
12a:顯示驅動晶片 12a: Display driver chip
120a:時序控制器 120a: timing controller
121a:閘極驅動單元 121a: Gate drive unit
122a:源極驅動單元 122a: source drive unit
123a:電連接膜片 123a: electrical connection diaphragm
13a:軟性電路板 13a: Flexible printed circuit board
1:顯示裝置 1: Display device
11:顯示面板 11: Display panel
11S:基板 11S: Substrate
11A:主動區塊 11A: Active block
11A1:第二電連接介面 11A1: the second electrical connection interface
11A2:高速信號電極墊 11A2: High-speed signal electrode pad
11AP:公共電源電極墊 11AP: Common Power Electrode Pad
11AG:公共接地電極墊 11AG: Common ground electrode pad
12:顯示驅動晶片 12: Display driver chip
120:中介層 120: intermediary layer
121:第一電連接介面 121: the first electrical connection interface
122:第四電連接介面 122: the fourth electrical connection interface
13:軟性電路板 13: Flexible circuit board
131:第三電連接介面 131: the third electrical connection interface
圖1為習知的一種OLED顯示裝置的方塊圖； 圖2為利用COF技術進行整合的OLED顯示裝置的上視圖； 圖3為利用COF技術進行整合的OLED顯示裝置的側視圖； 圖4為本創作之一種顯示裝置的第一實施例的上視圖； 圖5為本創作之顯示裝置的第一實施例的側視圖； 圖6為本創作之顯示裝置的第二實施例的上視圖； 圖7為本創作之顯示裝置的第二實施例的側視圖； 圖8為本創作之顯示裝置的第三實施例的上視圖； 圖9為本創作之顯示裝置的第三實施例的側視圖； 圖10為本創作之顯示裝置的第四實施例的上視圖；以及 圖11為本創作之顯示裝置的第四實施例的側視圖。 1 is a block diagram of a known OLED display device; FIG. 2 is a top view of an OLED display device integrated using COF technology; 3 is a side view of an OLED display device integrated using COF technology; FIG. 4 is a top view of a first embodiment of a display device of the present invention; Fig. 5 is the side view of the first embodiment of the display device of the present invention; Fig. 6 is the top view of the second embodiment of the display device of the present invention; Fig. 7 is the side view of the second embodiment of the display device of the present invention; Fig. 8 is the upper view of the third embodiment of the display device of the present invention; 9 is a side view of a third embodiment of the display device of the present invention; Fig. 10 is the top view of the fourth embodiment of the display device of the present invention; and FIG. 11 is a side view of the fourth embodiment of the display device of the present invention.
1:顯示裝置 1: Display device
11:顯示面板 11: Display panel
11S:基板 11S: Substrate
11A:主動區塊 11A: Active block
11A1:第二電連接介面 11A1: the second electrical connection interface
12:顯示驅動晶片 12: Display driver chip
121:第一電連接介面 121: the first electrical connection interface
13:軟性電路板 13: Flexible circuit board
131:第三電連接介面 131: the third electrical connection interface
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112204773U TWM644308U (en) | 2023-05-15 | 2023-05-15 | Display device and information processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112204773U TWM644308U (en) | 2023-05-15 | 2023-05-15 | Display device and information processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM644308U true TWM644308U (en) | 2023-07-21 |
Family
ID=88148881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112204773U TWM644308U (en) | 2023-05-15 | 2023-05-15 | Display device and information processing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM644308U (en) |
-
2023
- 2023-05-15 TW TW112204773U patent/TWM644308U/en unknown
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