TWM640978U

TWM640978U - Image sensing lens and outer closed sensing module

Info

Publication number: TWM640978U
Application number: TW111214152U
Authority: TW
Inventors: 廖志豪; 郭孟鑫
Original assignee: 海華科技股份有限公司
Priority date: 2022-12-21
Filing date: 2022-12-21
Publication date: 2023-05-11

Abstract

本創作公開一種影像感測鏡頭及外封閉式感測模組。所述外封閉式感測模組包含一影像感測晶片、設置於所述影像感測晶片的一支撐層、設置於所述支撐層上的一濾光片、形成有貫穿孔的一電路載板、一第一黏結層、及一第二黏結層。所述支撐層非為封閉圈狀且形成有至少一個連通口。所述影像感測晶片焊接固定於所述電路載板，所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成連通於至少一個所述連通口的一環形間隙。所述第一黏結層呈封閉圈狀且形成於所述環形間隙。所述第二黏結層連接且密封所述影像感測晶片以及所述電路載板。The invention discloses an image sensing lens and an externally closed sensing module. The externally enclosed sensing module includes an image sensing chip, a support layer disposed on the image sensing chip, a filter disposed on the support layer, and a circuit carrier formed with a through hole. board, a first adhesive layer, and a second adhesive layer. The supporting layer is not in the shape of a closed ring and is formed with at least one communication port. The image sensing chip is welded and fixed on the circuit carrier board, and at least part of the optical filter is penetrated through the through hole to form communication with the inner wall of the through hole and at least one of the communication holes. An annular gap at the mouth. The first adhesive layer is in the shape of a closed ring and is formed in the annular gap. The second adhesive layer connects and seals the image sensing chip and the circuit carrier.

Description

影像感測鏡頭及外封閉式感測模組Image sensing lens and outer closed sensing module

本創作涉及一種感測鏡頭，尤其涉及一種影像感測鏡頭及外封閉式感測模組。The invention relates to a sensing lens, in particular to an image sensing lens and an externally closed sensing module.

現有影像感測模組為了實現防塵功能，所以皆於其影像感測晶片與濾光片之間採用了呈封閉圈狀的支撐層，據以共同包圍形成一封閉空間。然而，現有影像感測模組所使用的所述支撐層僅能是封閉圈狀，此對後續研發與結構改良產生了莫大的阻礙；舉例來說，現有影像感測模組的影像感測晶片朝微型化發展，因而提供所述支撐層設置的塗膠空間也同步縮小。於是，本創作人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種架構合理且有效改善上述缺陷的本創作。In order to realize the dust-proof function, the existing image sensing modules all adopt a support layer in the shape of a closed ring between the image sensing chip and the filter to form a closed space together. However, the support layer used in the existing image sensing module can only be in the shape of a closed ring, which greatly hinders subsequent research and development and structural improvement; for example, the image sensing chip of the existing image sensing module With the development of miniaturization, the gluing space for providing the supporting layer is also reduced simultaneously. Therefore, the author of the present invention believes that the above-mentioned defects can be improved, and Naite devoted himself to research and combined with the application of scientific principles, and finally proposed a creation with a reasonable structure and effectively improved the above-mentioned defects.

本創作實施例在於提供一種影像感測鏡頭及外封閉式感測模組，其能有效地改善現有影像感測模組所可能產生的缺陷。The inventive embodiment provides an image sensing lens and an externally enclosed sensing module, which can effectively improve the possible defects of the existing image sensing module.

本創作實施例公開一種影像感測鏡頭，其包括：一外封閉式感測模組，包含有：一影像感測晶片，其於頂面配置有一感測區域、及位於所述感測區域外側的一接合區域；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔；其中，所述影像感測晶片固定於所述電路載板，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，呈封閉圈狀且形成於所述環形間隙，以封閉所述環形間隙、並黏接所述濾光片至所述電路載板；及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間；以及一光學模組，包含有安裝於所述外封閉式感測模組上的一支架、及安裝於所述支架內的至少一個透鏡；其中，所述光學模組與所述影像感測晶片是分別位於所述電路載板的相反兩側。The embodiment of the invention discloses an image sensing lens, which includes: an externally closed sensing module, including: an image sensing chip, which is configured with a sensing area on the top surface and is located outside the sensing area a joint area; a support layer, arranged in the joint area, and the support layer is not in the shape of a closed ring but at least one communication port is formed; a filter is arranged on the support layer and shields the Sensing area; wherein, a sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier , and at least part of the optical filter is pierced through the through hole, so as to form an annular gap communicating with at least one of the communication ports between the inner wall of the through hole; a first adhesive layer, It is in the shape of a closed ring and formed in the annular gap to close the annular gap and bond the filter to the circuit carrier; and a second adhesive layer to connect and seal the image sensing chip The periphery of the top surface and the circuit carrier board, so that the sensing space and the annular gap can communicate with each other through at least one communication port, and jointly form a sealed space; and an optical module, It includes a bracket installed on the outer closed sensing module, and at least one lens installed in the bracket; wherein, the optical module and the image sensing chip are respectively located in the circuit opposite sides of the carrier board.

本創作實施例也公開一種外封閉式感測模組，其包括：一影像感測晶片，其於頂面配置有一感測區域、及位於所述感測區域外側的一接合區域；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔；其中，所述影像感測晶片固定於所述電路載板，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，呈封閉圈狀且形成於所述環形間隙，以封閉所述環形間隙、並黏接所述濾光片至所述電路載板；以及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間。The embodiment of the invention also discloses an externally enclosed sensing module, which includes: an image sensing chip, which is configured with a sensing area on the top surface, and a bonding area located outside the sensing area; a support layer , arranged in the joint area, and the support layer is not in the shape of a closed circle but has at least one communication port; a filter is arranged on the support layer and shields the sensing area; wherein, the A sensing space is formed between the optical filter and the sensing area; a circuit carrier is formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier, and the optical filter at least partly pierced through the through hole to form an annular gap communicating with at least one of the communication ports between the inner wall of the through hole; a first adhesive layer is in the shape of a closed ring and formed on the The annular gap is used to close the annular gap and adhere the optical filter to the circuit carrier; and a second adhesive layer is used to connect and seal the top surface periphery of the image sensing chip and the The circuit carrier board, so that the sensing space and the annular gap can communicate with each other through at least one communication port, and jointly form a sealed space.

本創作實施例另公開一種外封閉式感測模組，其包括：一影像感測晶片，其於頂面配置有一感測區域、位於所述感測區域外側的一接合區域、及位於所述接合區域外側的多個焊接墊；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔，並且所述電路載板具有位於所述貫穿孔外側的多個接合墊；其中，所述影像感測晶片以多個所述焊接墊分別焊接固定於多個所述接合墊，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，為呈封閉圈狀的一膠帶，所述第一黏結層封閉所述環形間隙、並黏接所述濾光片至所述電路載板；以及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間。The embodiment of the invention further discloses an externally enclosed sensing module, which includes: an image sensing chip, which is configured with a sensing area on the top surface, a bonding area located outside the sensing area, and a bonding area located on the A plurality of welding pads on the outside of the joint area; a support layer, which is arranged on the joint area, and the support layer is not in the shape of a closed circle but has at least one communication port; an optical filter is arranged on the support layer and shield the sensing area; wherein, a sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole, and the circuit carrier has a A plurality of bonding pads on the outside of the hole; wherein, the image sensing chip is respectively welded and fixed to the plurality of bonding pads with the plurality of bonding pads, and at least part of the filter is penetrated through the through hole , an annular gap communicating with at least one of the communicating ports is formed between the inner wall of the through hole; a first adhesive layer is an adhesive tape in the shape of a closed ring, and the first adhesive layer closes the The annular gap, and bonding the filter to the circuit carrier; and a second adhesive layer, connecting and sealing the top surface periphery of the image sensing chip and the circuit carrier, so that The sensing space and the annular gap can communicate with each other through at least one communication port, and jointly form a sealed space.

綜上所述，本創作實施例所公開的影像感測鏡頭及外封閉式感測模組，其能通過形成有所述第一黏結層與所述第二黏結層，以使所述感測空間不再需要被所述支撐層所封閉，進而使所述支撐層的結構將不再受到過多侷限（如：所述外封閉式感測模組利於所述影像感測晶片的微型化）。也就是說，所述支撐層能夠依據不同的需求而有不同的變化，並且所述第一黏結層還能有助於所述濾光片更為穩定地結合於所述電路載板上。To sum up, the image sensing lens and the externally enclosed sensing module disclosed in the embodiment of the invention can make the sensing The space no longer needs to be enclosed by the support layer, so that the structure of the support layer will no longer be too limited (for example, the externally enclosed sensing module facilitates the miniaturization of the image sensing chip). That is to say, the supporting layer can have different changes according to different requirements, and the first adhesive layer can also help the filter to be more stably combined with the circuit carrier.

為能更進一步瞭解本創作的特徵及技術內容，請參閱以下有關本創作的詳細說明與附圖，但是此等說明與附圖僅用來說明本創作，而非對本創作的保護範圍作任何的限制。In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings about this creation, but these descriptions and drawings are only used to illustrate this creation, not to make any statement on the scope of protection of this creation limit.

以下是通過特定的具體實施例來說明本創作所公開有關“影像感測鏡頭及外封閉式感測模組”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本創作的構思下進行各種修改與變更。另外，本創作的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容，但所公開的內容並非用以限制本創作的保護範圍。The following is a description of the implementation of the "image sensing lens and externally enclosed sensing module" disclosed by this creation through specific specific examples. Those skilled in the art can understand the advantages and disadvantages of this creation from the content disclosed in this specification. Effect. This creation can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the idea of this creation. In addition, the drawings of this creation are only for simple illustration, not according to the actual size of the depiction, prior statement. The following embodiments will further describe the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.

應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[實施例一][Example 1]

請參閱圖1至圖7所示，其為本創作的實施例一。如圖1和圖2所示，本實施例公開一種影像感測鏡頭1000，其包含有一外封閉式感測模組100及安裝於所述外封閉式感測模組100上的一光學模組200。需說明的是，非屬於影像感測的任何鏡頭或封裝構造皆不同於本實施例所限定的所述影像感測鏡頭1000。Please refer to Fig. 1 to Fig. 7, which are the first embodiment of this creation. As shown in FIG. 1 and FIG. 2 , the present embodiment discloses an image sensing lens 1000, which includes an outer closed sensing module 100 and an optical module mounted on the outer closed sensing module 100. 200. It should be noted that any lens or packaging structure not belonging to image sensing is different from the image sensing lens 1000 defined in this embodiment.

如圖3和圖4所示，所述外封閉式感測模組100包含有一影像感測晶片1、設置於所述影像感測晶片1上的一支撐層2、設置於所述支撐層2上的一濾光片3、承載所述影像感測晶片1的一電路載板4、連接所述濾光片3與所述電路載板4的一第一黏結層5、及連接所述影像感測晶片1與所述電路載板4的一第二黏結層6。As shown in FIGS. 3 and 4 , the externally enclosed sensing module 100 includes an image sensing chip 1 , a supporting layer 2 disposed on the image sensing chip 1 , and a supporting layer 2 disposed on the supporting layer 2 . A filter 3 on the top, a circuit carrier 4 carrying the image sensing chip 1, a first adhesive layer 5 connecting the filter 3 and the circuit carrier 4, and connecting the image A second bonding layer 6 between the sensing chip 1 and the circuit carrier 4 is sensed.

所述影像感測晶片1於本實施例中可以是一互補式金屬氧化半導體(Complementary Metal-Oxide-Semiconductor，CMOS)感測器或者任何具有影像擷取功能的感測器，本創作在此不加以限制。其中，所述影像感測晶片1於其頂面10配置有一感測區域11、位於所述感測區域11外側的一接合區域12、及位於所述接合區域12外側的多個焊接墊13。The image sensing chip 1 in this embodiment may be a complementary metal-oxide-semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) sensor or any sensor with an image capture function, which is not described herein. be restricted. Wherein, the image sensing chip 1 is configured on its top surface 10 with a sensing area 11 , a bonding area 12 outside the sensing area 11 , and a plurality of welding pads 13 outside the bonding area 12 .

於本實施例中，所述接合區域12圍繞於所述感測區域11，並且多個所述焊接墊13排成兩列且分別位於所述感測區域11（或所述接合區域12）的相反兩側，但本創作不以此為限。舉例來說，在本創作未繪示的其他實施例中，多個所述焊接墊13可依據需求而呈環狀排列且圍繞於所述接合區域12；或者，多個所述焊接墊13可依據需求而排列成U字形且圍繞於所述接合區域12。In this embodiment, the bonding area 12 surrounds the sensing area 11, and a plurality of the welding pads 13 are arranged in two rows and are respectively located on the sensing area 11 (or the bonding area 12). opposite sides, but this creation is not limited thereto. For example, in other embodiments not shown in this creation, a plurality of the welding pads 13 can be arranged in a ring shape and surround the bonding area 12 according to requirements; or, a plurality of the welding pads 13 can be According to requirements, they are arranged in a U shape and surround the joint area 12 .

所述支撐層2（如：膠層）設置於所述影像感測晶片1的所述接合區域12，並且所述支撐層2非為封閉圈狀而形成有至少一個連通口21。也就是說，呈封閉圈狀的任何支撐層或膠層皆不同於本實施例所限定的所述支撐層2。The supporting layer 2 (such as an adhesive layer) is disposed on the bonding area 12 of the image sensing chip 1 , and the supporting layer 2 is not in the shape of a closed ring but has at least one communication opening 21 formed therein. That is to say, any support layer or adhesive layer in the shape of a closed circle is different from the support layer 2 defined in this embodiment.

所述濾光片3沿一預設方向D設置於所述支撐層2上並遮蔽所述感測區域11；也就是說，所述支撐層2是夾持於所述影像感測晶片1的所述接合區域12與所述濾光片3之間。需補充說明的是，所述濾光片3的選用較佳是對應於所述影像感測晶片1的所述感測區域11。舉例來說，當一光線穿過所述光學模組200時，所述濾光片3用以使對應於所述感測區域11的所述光線的波段能夠穿過。The filter 3 is disposed on the support layer 2 along a predetermined direction D and shields the sensing region 11; that is, the support layer 2 is clamped on the image sensing chip 1 Between the bonding area 12 and the filter 3 . It should be added that the selection of the optical filter 3 is preferably corresponding to the sensing area 11 of the image sensing chip 1 . For example, when a light passes through the optical module 200 , the filter 3 is used to allow the wavelength band of the light corresponding to the sensing area 11 to pass through.

更詳細地說，所述濾光片3具有一內表面31、位於所述內表面31相反側的一外表面32、及相連於所述內表面31與所述外表面32之間的一環側面33。其中，所述濾光片3的所述內表面31設置於所述支撐層2且其大致平行於所述影像感測晶片1的所述頂面10，並且所述濾光片3與所述感測區域11之間形成有連通於至少一個所述連通口21的一感測空間S1。In more detail, the filter 3 has an inner surface 31, an outer surface 32 located on the opposite side of the inner surface 31, and a ring side connected between the inner surface 31 and the outer surface 32 33. Wherein, the inner surface 31 of the optical filter 3 is arranged on the support layer 2 and is substantially parallel to the top surface 10 of the image sensing chip 1, and the optical filter 3 and the A sensing space S1 communicating with at least one of the communicating ports 21 is formed between the sensing regions 11 .

所述電路載板4於本實施例中呈平坦狀且可採用印刷電路板（printed circuit board，PCB）、軟式電路板（flexible printed circuit，FPC）、或陶瓷基板，本創作在此不加以限制。其中，所述電路載板4具有一下板面43及位於所述下板面43相反側的一上板面44，所述電路載板4形成有一貫穿孔41，並且所述電路載板4（的所述下板面43）具有位於所述貫穿孔41外側的多個接合墊42。The circuit carrier 4 is flat in this embodiment and can be a printed circuit board (printed circuit board, PCB), a flexible printed circuit board (flexible printed circuit, FPC), or a ceramic substrate, the invention is not limited here . Wherein, the circuit carrier 4 has a lower plate surface 43 and an upper plate surface 44 on the opposite side of the lower plate surface 43, the circuit carrier 4 is formed with a through hole 41, and the circuit carrier 4 ( The lower plate surface 43 ) has a plurality of bonding pads 42 located outside the through holes 41 .

於本實施例中，多個所述接合墊42排成兩列且分別位於所述貫穿孔41的相反兩側，並且多個所述接合墊42的位置是分別對應於多個所述焊接墊13的位置，但本創作不以此為限。舉例來說，在本創作未繪示的其他實施例中，多個所述接合墊42的位置可以在分別對應於多個所述焊接墊13位置的前提下、而依據需求形成環狀排列或U字型排列。In this embodiment, the plurality of bonding pads 42 are arranged in two rows and are respectively located on opposite sides of the through hole 41, and the positions of the plurality of bonding pads 42 are respectively corresponding to the plurality of welding pads 13, but this creation is not limited thereto. For example, in other embodiments not shown in this creation, the positions of the plurality of bonding pads 42 can be arranged in a ring or in accordance with requirements on the premise that they respectively correspond to the positions of the plurality of bonding pads 13 . U-shaped arrangement.

再者，所述影像感測晶片1以多個所述焊接墊13分別焊接固定於多個所述接合墊42，並且所述濾光片3的至少局部穿設於所述貫穿孔41、以與所述貫穿孔41的內壁之間形成有連通於至少一個所述連通口21的一環形間隙G。Furthermore, the image sensing chip 1 is welded and fixed to the plurality of bonding pads 42 with the plurality of bonding pads 13 respectively, and at least part of the optical filter 3 is penetrated through the through hole 41, so as to An annular gap G communicating with at least one of the communication ports 21 is formed between the inner wall of the through hole 41 .

進一步地說，所述濾光片3的所述外表面32（與局部所述環側面33）於本實施例中是突伸出所述電路載板4的所述貫穿孔41，所述第二黏結層6連接且密封所述影像感測晶片1的所述頂面10周緣以及所述電路載板4（如：所述下板面43），以使水氣或微粒（particle）無法穿過所述影像感測晶片1與所述電路載板4的相接處。Furthermore, in this embodiment, the outer surface 32 of the optical filter 3 (and part of the ring side surface 33 ) protrudes from the through hole 41 of the circuit carrier 4 , and the second Two adhesive layers 6 connect and seal the periphery of the top surface 10 of the image sensing chip 1 and the circuit carrier 4 (such as: the lower surface 43), so that moisture or particles cannot penetrate Pass through the junction of the image sensing chip 1 and the circuit carrier 4 .

所述第一黏結層5呈封閉圈狀且形成於所述環形間隙G（如：所述環形間隙G的頂部），以封閉所述環形間隙G、並黏接所述濾光片3至所述電路載板4。據此，水氣或微粒將無法經過所述環形間隙G而進入所述感測空間S1；也就是說，通過所述第一黏結層5與所述第二黏結層6的配置，所述感測空間S1與所述環形間隙G（僅）能通過至少一個所述連通口21而彼此相通、並共同形成一密封空間E。於本實施例中，所述第一黏結層5是由黏度介於1000cps～125000cps的材質（如：膠材）所固化形成，而所述環形間隙G的寬度W不大於2000微米（μm），但本創作不受限於此。The first adhesive layer 5 is in the shape of a closed ring and is formed on the annular gap G (such as: the top of the annular gap G), so as to close the annular gap G and bond the optical filter 3 to the Described circuit carrier board 4. Accordingly, moisture or particles will not be able to enter the sensing space S1 through the annular gap G; that is, through the configuration of the first bonding layer 5 and the second bonding layer 6, the sensing The measurement space S1 and the annular gap G (only) can communicate with each other through at least one communication port 21 , and jointly form a sealed space E. In this embodiment, the first adhesive layer 5 is formed by solidification of a material with a viscosity ranging from 1000 cps to 125000 cps (such as glue), and the width W of the annular gap G is not greater than 2000 microns (μm), But this creation is not limited thereto.

再者，如圖3和圖4所示，所述第一黏結層5黏著於所述貫穿孔41的所述內壁及所述濾光片3的所述環側面33（如：所述環側面33的頂部），並且所述第一黏結層5較佳是未觸及所述支撐層2與所述濾光片3的所述內表面31，但本創作不以此為限。Furthermore, as shown in Figure 3 and Figure 4, the first adhesive layer 5 is adhered to the inner wall of the through hole 41 and the ring side 33 of the filter 3 (such as: the ring The top of the side 33 ), and the first adhesive layer 5 preferably does not touch the inner surface 31 of the support layer 2 and the filter 3 , but the invention is not limited thereto.

舉例來說，如圖5所示，所述第一黏結層5可依據需求而進一步延伸至所述濾光片3的所述外表面32周圍部位；也就是說，所述第一黏結層5黏著於所述貫穿孔41的所述內壁、及所述濾光片3的所述環側面33（如：所述環側面33的所述頂部）與所述外表面32的所述周圍部位。其中，所述外表面32的所述周圍部位（沿所述預設方向D）正投影於所述頂面10所形成的一投影區域，其需位於所述感測區域11的外側，據以避免影響所述感測區域11的偵測準確度。For example, as shown in FIG. 5 , the first adhesive layer 5 can be further extended to the periphery of the outer surface 32 of the optical filter 3 according to requirements; that is, the first adhesive layer 5 Adhering to the inner wall of the through hole 41, the ring side 33 (such as: the top of the ring side 33) of the filter 3 and the surrounding parts of the outer surface 32 . Wherein, the surrounding portion of the outer surface 32 (along the predetermined direction D) is orthographically projected on a projection area formed by the top surface 10, which needs to be located outside the sensing area 11, according to Avoid affecting the detection accuracy of the sensing region 11 .

綜上所述，如圖3和圖4所示，所述外封閉式感測模組100（或所述影像感測鏡頭1000）於本實施例中能通過形成有所述第一黏結層5與所述第二黏結層6，以使所述感測空間S1不再需要被所述支撐層2所封閉，進而使所述支撐層2的結構將不再受到過多侷限。也就是說，所述支撐層2能夠依據不同的需求而有不同的變化，並且所述第一黏結層5還能有助於所述濾光片3更為穩定地結合於所述電路載板4上。In summary, as shown in FIG. 3 and FIG. 4 , the externally enclosed sensing module 100 (or the image sensing lens 1000 ) in this embodiment can be formed with the first adhesive layer 5 and the second adhesive layer 6, so that the sensing space S1 no longer needs to be enclosed by the support layer 2, so that the structure of the support layer 2 is no longer restricted too much. That is to say, the support layer 2 can have different changes according to different requirements, and the first adhesive layer 5 can also help the optical filter 3 to be more stably combined with the circuit carrier 4 on.

此外，所述支撐層2的至少一個所述連通口21的數量、尺寸、及位置可依據需求而加以調整變化，據以使所述外封閉式感測模組100能夠構成符合不同要求的架構，例如：所述支撐層2可以如圖4、圖6A、圖6B、及圖7所示，並且所述支撐層2較佳是僅配置於所述感測區域11的外邊緣的5%～95%，但本創作不以此為限。In addition, the number, size, and position of at least one communication port 21 of the support layer 2 can be adjusted and changed according to requirements, so that the externally enclosed sensing module 100 can form a structure that meets different requirements. , for example: the support layer 2 can be shown in Figure 4, Figure 6A, Figure 6B, and Figure 7, and the support layer 2 is preferably only configured on the outer edge of the sensing region 11 ~ 5% 95%, but this creation is not limited to this.

更詳細地說，如圖4所示，所述支撐層2大致呈C字形，以形成有一個所述連通口21。如圖6A和圖6B所示，所述感測區域11的所述外邊緣具有位於相反兩側的兩個第一邊緣111、及位於相反另兩側的兩個第二邊緣112，並且多個所述焊接墊13分別位於兩個所述第一邊緣111的外側，所述支撐層2包含有兩個條狀體23，其可以依據需求而如圖6A所示配置於兩個所述第一邊緣111與多個所述焊接墊13之間（也就是，兩個所述第一邊緣111的外側）或是如圖6B所示配置於兩個所述第二邊緣112的外側，據以形成多個所述連通口21。或者，如圖7所示，所述支撐層2包含有彼此間隔配置的多個柱狀體22，並且每個所述柱狀體22的兩端分別連接於所述接合區域12與所述濾光片3，而所述濾光片3的每個角落與所述接合區域12之間較佳是配置有一個所述柱狀體22。In more detail, as shown in FIG. 4 , the support layer 2 is roughly C-shaped to form one communication port 21 . As shown in FIG. 6A and FIG. 6B, the outer edge of the sensing region 11 has two first edges 111 located on opposite sides, and two second edges 112 located on opposite sides, and a plurality of The welding pads 13 are respectively located on the outer sides of the two first edges 111, and the support layer 2 includes two strips 23, which can be arranged on the two first edges as shown in FIG. 6A according to requirements. Between the edge 111 and a plurality of the welding pads 13 (that is, outside the two first edges 111) or as shown in FIG. 6B arranged outside the two second edges 112, so as to form Multiple communication ports 21 . Alternatively, as shown in FIG. 7 , the support layer 2 includes a plurality of columns 22 spaced apart from each other, and the two ends of each column 22 are respectively connected to the joint area 12 and the filter. An optical sheet 3 , and preferably one columnar body 22 is arranged between each corner of the optical filter 3 and the bonding area 12 .

如圖3和圖4所示，所述光學模組200包含有安裝於所述外封閉式感測模組100上的一支架201、及安裝於所述支架201內的至少一個透鏡202。其中，所述光學模組200以及所述影像感測晶片1是分別位於所述電路載板4的相反兩側；也就是說，所述光學模組200是以所述支架201固定（如：黏固）於所述電路載板4的所述上板面44，而所述影像感測晶片1則是固定於所述電路載板4的所述下板面43。As shown in FIG. 3 and FIG. 4 , the optical module 200 includes a bracket 201 installed on the outer closed sensing module 100 and at least one lens 202 installed in the bracket 201 . Wherein, the optical module 200 and the image sensing chip 1 are respectively located on opposite sides of the circuit carrier 4; that is, the optical module 200 is fixed by the bracket 201 (such as: glued) on the upper surface 44 of the circuit carrier 4 , and the image sensing chip 1 is fixed on the lower surface 43 of the circuit carrier 4 .

更詳細地說，至少一個所述透鏡202的一中心光軸L穿過所述影像感測晶片1的所述感測區域11（如：所述感測區域11的中心），並且所述光學模組200與所述外封閉式感測模組100所共同包圍的一空間S2，其能通過所述第一黏結層5而隔絕所述密封空間E（如：所述環形間隙G、至少一個所述連通口21、與所述感測空間S1）。需額外說明的是，至少一個所述透鏡202的數量於本實施例的圖式中是以一個來說明，但於本創作未繪示的其他實施例中，至少一個所述透鏡202的數量可以是多個且其中心光軸L大致彼此重疊。In more detail, a central optical axis L of at least one lens 202 passes through the sensing region 11 of the image sensing chip 1 (such as: the center of the sensing region 11), and the optical A space S2 surrounded by the module 200 and the outer closed sensing module 100 can isolate the sealed space E through the first adhesive layer 5 (such as: the annular gap G, at least one The communication port 21 and the sensing space S1). It should be noted that the number of at least one lens 202 is illustrated as one in the drawings of this embodiment, but in other embodiments not shown in this creation, the number of at least one lens 202 can be There are a plurality of them, and their central optical axes L substantially overlap each other.

此外，所述外封閉式感測模組100於本實施例中雖是以搭配於所述光學模組200來說明，但本創作不受限於此。舉例來說，在本創作未繪示的其他實施例中，所述外封閉式感測模組100也可以依據實際需求而被單獨地應用（如：販賣）或搭配其他構件使用。In addition, although the externally enclosed sensing module 100 is illustrated as collaborating with the optical module 200 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in this creation, the externally enclosed sensing module 100 can also be used independently (eg, sold) or used in conjunction with other components according to actual needs.

[實施例二][Example 2]

請參閱圖8和圖9所示，其為本創作的實施例二。由於本實施例類似於上述實施例一，所以兩個實施例的相同處不再加以贅述，而本實施例相較於上述實施例一的差異大致說明如下：Please refer to Fig. 8 and Fig. 9, which is the second embodiment of this creation. Since this embodiment is similar to the first embodiment above, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the first embodiment above are roughly described as follows:

於本實施例中，所述濾光片3整體位於所述貫穿孔41內（也就是，所述濾光片3的所述外表面32位於所述貫穿孔41之內、並且所述濾光片3的所述外表面32切齊或低於所述電路載板4的所述上板面44），並且所述第一黏結層5黏著於所述貫穿孔41的所述內壁及所述濾光片3的所述環側面33（的頂部）。In this embodiment, the filter 3 is entirely located in the through hole 41 (that is, the outer surface 32 of the filter 3 is located in the through hole 41, and the filter The outer surface 32 of the sheet 3 is flush with or lower than the upper surface 44 of the circuit carrier 4), and the first adhesive layer 5 is adhered to the inner wall of the through hole 41 and the The ring side 33 (the top) of the filter 3.

此外，如圖8所示，所述第一黏結層5也可依據需求而進一步延伸至所述濾光片3的所述外表面32周圍部位；也就是說，所述第一黏結層5黏著於所述貫穿孔41的所述內壁、及所述濾光片3的所述環側面33與所述外表面32的周圍部位，並且所述外表面32的所述周圍部位沿所述預設方向D正投影於所述頂面10所形成的一投影區域，其位於所述感測區域11的外側。In addition, as shown in FIG. 8, the first adhesive layer 5 can also be further extended to the periphery of the outer surface 32 of the optical filter 3 according to requirements; that is, the first adhesive layer 5 is adhered to On the inner wall of the through hole 41, and the ring side 33 of the filter 3 and the surrounding parts of the outer surface 32, and the surrounding parts of the outer surface 32 are along the predetermined Assume that the direction D is orthographically projected onto a projected area formed by the top surface 10 , which is located outside the sensing area 11 .

[實施例三][Embodiment three]

請參閱圖10和圖11所示，其為本創作的實施例三。由於本實施例類似於上述實施例一和二，所以兩個實施例的相同處不再加以贅述，而本實施例相較於上述實施例一和二的差異大致說明如下：Please refer to Fig. 10 and Fig. 11, which is the third embodiment of this invention. Since this embodiment is similar to the above-mentioned first and second embodiments, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first and second embodiments are roughly described as follows:

於本實施例中，所述第一黏結層5為呈封閉圈狀的一膠帶，所述第一黏結層5封閉所述環形間隙G、並黏接所述濾光片3至所述電路載板4。其中，所述濾光片3的所述外表面32及所述電路載板4的所述上板面44對應於所述預設方向D形成有不大於1000微米的一段差H，據以利於採用所述第一黏結層5進行黏接。In this embodiment, the first adhesive layer 5 is an adhesive tape in the shape of a closed ring, the first adhesive layer 5 closes the annular gap G, and adheres the optical filter 3 to the circuit carrier. plate 4. Wherein, the outer surface 32 of the optical filter 3 and the upper surface 44 of the circuit carrier 4 are formed with a step difference H not greater than 1000 microns corresponding to the preset direction D, so as to facilitate The first adhesive layer 5 is used for bonding.

需說明的是，於圖10中，所述濾光片3的所述外表面32是略高於所述電路載板4的所述上板面44；而於圖11中，所述濾光片3的所述外表面32及所述電路載板4的所述上板面44呈共平面設置，但不以此為限。舉例來說，在本創作未繪示的其他實施例中，所述濾光片3的所述外表面32也可以是略低於所述電路載板4的所述上板面44。It should be noted that, in FIG. 10, the outer surface 32 of the optical filter 3 is slightly higher than the upper surface 44 of the circuit carrier 4; and in FIG. 11, the filter The outer surface 32 of the sheet 3 and the upper surface 44 of the circuit carrier 4 are coplanar, but not limited thereto. For example, in other embodiments not shown in this invention, the outer surface 32 of the optical filter 3 may also be slightly lower than the upper surface 44 of the circuit carrier 4 .

進一步地說，所述第一黏結層5黏接於所述濾光片3的所述外表面32的周圍部位及所述電路載板4的所述上板面44，並且所述外表面32的所述周圍部位沿所述預設方向D正投影於所述頂面10所形成的一投影區域，其位於所述感測區域11的外側。Further, the first adhesive layer 5 is bonded to the peripheral portion of the outer surface 32 of the optical filter 3 and the upper surface 44 of the circuit carrier 4, and the outer surface 32 A projected area formed by the orthographic projection of the surrounding parts of the top surface 10 along the preset direction D is located outside the sensing area 11 .

此外，基於所述第一黏結層5於本實施例中是採用固態的膠帶，所以所述環形間隙G的寬度W可以依據設計需求而變化，較不受到所述第一黏結層5的限制。In addition, since the first adhesive layer 5 is made of solid adhesive tape in this embodiment, the width W of the annular gap G can be changed according to design requirements, and is not limited by the first adhesive layer 5 .

[實施例四][embodiment four]

請參閱圖12所示，其為本創作的實施例四。由於本實施例類似於上述實施例一至三，所以兩個實施例的相同處不再加以贅述，而本實施例相較於上述實施例一至三的差異大致說明如下：Please refer to Figure 12, which is the fourth embodiment of this invention. Since this embodiment is similar to the above-mentioned embodiments 1 to 3, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned embodiments 1 to 3 are roughly described as follows:

於本實施例中，所述外封閉式感測模組100進一步包含有至少一個電子元件7與一封裝層8。至少一個所述電子元件7安裝於所述電路載板4（如：所述上板面44）、並能通過所述電路載板4而電性耦接於所述影像感測晶片1。In this embodiment, the externally enclosed sensing module 100 further includes at least one electronic component 7 and a packaging layer 8 . At least one of the electronic components 7 is installed on the circuit carrier 4 (eg, the upper surface 44 ), and can be electrically coupled to the image sensor chip 1 through the circuit carrier 4 .

再者，所述封裝層8形成於所述電路載板4（如：所述上板面44）、以使至少一個所述電子元件7埋置於其內，並且所述封裝層8的內緣擋止於所述第一黏結層5。其中，所述封裝層8例如是模製封裝體（molding compound），並且所述光學模組200以所述支架201安裝固定（如：黏固）於所述封裝層8。Furthermore, the encapsulation layer 8 is formed on the circuit carrier 4 (eg, the upper surface 44 ), so that at least one electronic component 7 is embedded therein, and the inner portion of the encapsulation layer 8 The edge is stopped by the first adhesive layer 5. Wherein, the encapsulation layer 8 is, for example, a molding compound, and the optical module 200 is installed and fixed (eg, glued) on the encapsulation layer 8 by the bracket 201 .

[本創作實施例的技術效果][Technical effect of this creation embodiment]

以上所公開的內容僅為本創作的優選可行實施例，並非因此侷限本創作的專利範圍，所以凡是運用本創作說明書及圖式內容所做的等效技術變化，均包含於本創作的專利範圍內。The content disclosed above is only the preferred feasible embodiment of this creation, and does not limit the patent scope of this creation, so all equivalent technical changes made by using the instructions and drawings of this creation are included in the patent scope of this creation Inside.

1000:影像感測鏡頭 100:外封閉式感測模組 1:影像感測晶片 10:頂面 11:感測區域 111:第一邊緣 112:第二邊緣 12:接合區域 13:焊接墊 2:支撐層 21:連通口 22:柱狀體 23:條狀體 3:濾光片 31:內表面 32:外表面 33:環側面 4:電路載板 41:貫穿孔 42:接合墊 43:下板面 44:上板面 5:第一黏結層 6:第二黏結層 7:電子元件 8:封裝層 200:光學模組 201:支架 202:透鏡 G:環形間隙 W:寬度 S1:感測空間 S2:空間 E:密封空間 D:預設方向 L:中心光軸 H:段差 1000: image sensing lens 100: Outer closed sensing module 1: Image sensor chip 10: top surface 11: Sensing area 111: First edge 112: second edge 12:Joint area 13: Welding pad 2: support layer 21: Connecting port 22: columnar body 23: strip 3: Filter 31: inner surface 32: Outer surface 33: ring side 4: Circuit carrier board 41: Through hole 42: Bonding Pad 43: Lower panel surface 44: upper surface 5: The first bonding layer 6: Second bonding layer 7: Electronic components 8: Encapsulation layer 200:Optical module 201: Bracket 202: lens G: Annular gap W: width S1: Sensing space S2: space E: sealed space D: Default direction L: Central optical axis H: step difference

圖1為本創作實施例一的影像感測鏡頭的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of an image sensing lens according to Embodiment 1 of the present invention.

圖2為圖1的分解示意圖。FIG. 2 is an exploded schematic diagram of FIG. 1 .

圖3為圖1沿剖線III-III的剖視示意圖。FIG. 3 is a schematic cross-sectional view along line III-III in FIG. 1 .

圖4為圖1中的外封閉式感測模組的上視示意圖。FIG. 4 is a schematic top view of the externally enclosed sensing module in FIG. 1 .

圖5為圖3的變化態樣的剖視示意圖。FIG. 5 is a schematic cross-sectional view of a variation of FIG. 3 .

圖6A為圖4的變化態樣的上視示意圖。FIG. 6A is a schematic top view of a variation of FIG. 4 .

圖6B為圖4的又一變化態樣的上視示意圖。FIG. 6B is a schematic top view of another variation of FIG. 4 .

圖7為圖4的另一變化態樣的上視示意圖。FIG. 7 is a schematic top view of another variation of FIG. 4 .

圖8為本創作實施例二的影像感測鏡頭的剖視示意圖。FIG. 8 is a schematic cross-sectional view of an image sensing lens according to Embodiment 2 of the present invention.

圖9為本創作實施例二的影像感測鏡頭的另一剖視示意圖。FIG. 9 is another schematic cross-sectional view of the image sensing lens according to Embodiment 2 of the present invention.

圖10為本創作實施例三的影像感測鏡頭的剖視示意圖。FIG. 10 is a schematic cross-sectional view of an image sensing lens according to Embodiment 3 of the present invention.

圖11為本創作實施例三的影像感測鏡頭的另一剖視示意圖。FIG. 11 is another schematic cross-sectional view of the image sensing lens according to Embodiment 3 of the present invention.

圖12為本創作實施例四的影像感測鏡頭的剖視示意圖。FIG. 12 is a schematic cross-sectional view of an image sensing lens according to Embodiment 4 of the present invention.

1000:影像感測鏡頭 1000: image sensing lens

100:開放式感測模組 100: Open sensing module

1:影像感測晶片 1: Image sensor chip

10:頂面 10: top surface

11:感測區域 11: Sensing area

12:接合區域 12:Joint area

13:焊接墊 13: Welding pad

2:支撐層 2: support layer

21:內連通口 21: Internal communication port

3:濾光片 3: Filter

31:內表面 31: inner surface

32:外表面 32: Outer surface

33:環側面 33: ring side

4:電路載板 4: Circuit carrier board

41:貫穿孔 41: Through hole

42:接合墊 42: Bonding Pad

43:下板面 43: Lower panel surface

44:上板面 44: upper surface

5:第一黏結層 5: The first bonding layer

6:第二黏結層 6: Second bonding layer

200:光學模組 200:Optical module

201:支架 201: Bracket

202:透鏡 202: lens

G:環形間隙 G: Annular gap

W:寬度 W: width

S1:感測空間 S1: Sensing space

S2:空間 S2: space

E:密封空間 E: sealed space

D:預設方向 D: Default direction

L:中心光軸 L: Central optical axis

Claims

一種影像感測鏡頭，其包括：一外封閉式感測模組，包含有：一影像感測晶片，其於頂面配置有一感測區域、及位於所述感測區域外側的一接合區域；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔；其中，所述影像感測晶片固定於所述電路載板，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，呈封閉圈狀且形成於所述環形間隙，以封閉所述環形間隙、並黏接所述濾光片至所述電路載板；及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間；以及一光學模組，包含有安裝於所述外封閉式感測模組上的一支架、及安裝於所述支架內的至少一個透鏡；其中，所述光學模組與所述影像感測晶片是分別位於所述電路載板的相反兩側。 An image sensing lens, which includes: an externally closed sensing module, including: an image sensing chip, which is configured with a sensing area on the top surface, and a bonding area located outside the sensing area; A support layer is arranged on the joint area, and the support layer is not in the shape of a closed ring but has at least one communication port; an optical filter is arranged on the support layer and shields the sensing area; wherein A sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole; wherein the image sensing chip is fixed on the circuit carrier, and the filter At least part of the optical sheet is penetrated through the through hole to form an annular gap connected to at least one of the communication ports between the inner wall of the through hole; a first adhesive layer is in the shape of a closed ring and formed in the annular gap to close the annular gap and bond the optical filter to the circuit carrier; and a second adhesive layer to connect and seal the top surface of the image sensing chip The peripheral edge and the circuit carrier board, so that the sensing space and the annular gap can communicate with each other through at least one communication port, and jointly form a sealed space; and an optical module, including an optical module installed on the A bracket on the outer closed sensing module, and at least one lens installed in the bracket; wherein, the optical module and the image sensing chip are respectively located on the opposite sides of the circuit carrier side.

如請求項1所述的影像感測鏡頭，其中，至少一個所述透鏡的一中心光軸穿過所述影像感測晶片的所述感測區域，並且所述光學模組與所述外封閉式感測模組所共同包圍的一空間，其能通過所述第一黏結層而隔絕所述環形間隙及所述感測空間。 The image sensing lens according to claim 1, wherein at least one of the lenses A central optical axis of the sensor passes through the sensing area of the image sensing chip, and a space enclosed by the optical module and the outer closed sensing module can pass through the first The adhesive layer isolates the annular gap and the sensing space.

如請求項1所述的影像感測鏡頭，其中，所述支撐層包含有彼此間隔配置的多個柱狀體，並且每個所述柱狀體的兩端分別連接於所述接合區域與所述濾光片。 The image sensing lens according to claim 1, wherein the support layer includes a plurality of columnar bodies spaced apart from each other, and two ends of each columnar body are respectively connected to the bonding area and the filter described above.

如請求項1所述的影像感測鏡頭，其中，所述感測區域具有位於相反兩側的兩個第一邊緣、及位於相反另兩側的兩個第二邊緣，所述支撐層包含有兩個條狀體，其分別配置於兩個所述第一邊緣的外側或兩個所述第二邊緣的外側。 The image sensing lens according to claim 1, wherein the sensing region has two first edges on opposite sides and two second edges on opposite sides, and the support layer includes The two strips are respectively arranged on the outside of the two first edges or the outside of the two second edges.

如請求項1所述的影像感測鏡頭，其中，所述濾光片具有設置於所述支撐層的一內表面、位於所述內表面相反側的一外表面、及相連於所述內表面與所述外表面之間的一環側面；其中，所述第一黏結層未觸及所述支撐層與所述濾光片的所述內表面，並且所述環形間隙的寬度不大於2000微米(μm)；所述支撐層僅配置於所述感測區域的外邊緣的5%~95%的外側。 The image sensing lens according to claim 1, wherein the optical filter has an inner surface disposed on the supporting layer, an outer surface opposite to the inner surface, and connected to the inner surface A ring side between the outer surface; wherein, the first adhesive layer does not touch the inner surface of the support layer and the filter, and the width of the annular gap is not greater than 2000 microns (μm ); the support layer is only disposed outside of 5% to 95% of the outer edge of the sensing area.

如請求項5所述的影像感測鏡頭，其中，所述第一黏結層黏著於所述貫穿孔的所述內壁、及所述濾光片的所述環側面與所述外表面的周圍部位，並且所述外表面的所述周圍部位正投影於所述頂面所形成的一投影區域，其位於所述感測區域的外側。 The image sensing lens according to claim 5, wherein the first adhesive layer is adhered to the inner wall of the through hole, and the periphery of the ring side and the outer surface of the optical filter part, and the surrounding part of the outer surface is orthographically projected on a projected area formed by the top surface, which is located outside the sensing area.

如請求項1所述的影像感測鏡頭，其中，所述外封閉式感測模組進一步包含有：至少一個電子元件，安裝於所述電路載板，並且至少一個所述電子元件通過所述電路載板而電性耦接於所述影像感測晶片；及一封裝層，形成於所述電路載板、以使至少一個所述電子元件埋置於其內，並且所述封裝層的內緣擋止於所述第一黏結層；其中，所述光學模組以所述支架安裝固定於所述封裝層。 The image sensing lens according to claim 1, wherein the externally enclosed sensing module further includes: at least one electronic component mounted on the circuit carrier board, and at least one electronic component passes through the a circuit carrier electrically coupled to the image sensing chip; and an encapsulation layer formed on the circuit carrier so that at least one of the electronic components is embedded therein, and the inner portion of the encapsulation layer The edge is stopped by the first bonding layer; wherein, the optical module is installed and fixed on the encapsulation layer by the bracket.

如請求項1至7中任一項所述的影像感測鏡頭，其中，所述影像感測晶片於所述頂面包含有位於所述接合區域外側的多個焊接墊，並且所述電路載板具有位於所述貫穿孔外側的多個接合墊，所述影像感測晶片以多個所述焊接墊分別焊接固定於多個所述接合墊。 The image sensing lens according to any one of Claims 1 to 7, wherein the image sensing chip has a plurality of soldering pads on the top surface outside the bonding area, and the circuit carrier There are a plurality of bonding pads located outside the through hole, and the image sensing chip is respectively soldered and fixed to the plurality of bonding pads by the plurality of bonding pads.

一種外封閉式感測模組，其包括：一影像感測晶片，其於頂面配置有一感測區域、及位於所述感測區域外側的一接合區域；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔；其中，所述影像感測晶片固定於所述電路載板，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，呈封閉圈狀且形成於所述環形間隙，以封閉所述環形間隙、並黏接所述濾光片至所述電路載板；以及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間。 An externally enclosed sensing module, comprising: an image sensing chip configured with a sensing region on the top surface and a bonding region located outside the sensing region; a support layer disposed on the bonding area, and the support layer is not closed ring-shaped but at least one communication port is formed; a filter is arranged on the support layer and shields the sensing area; wherein, the filter and the A sensing space is formed between the sensing areas; a circuit carrier board is formed with a through hole; wherein, the image sensing chip is fixed on the circuit carrier board, and at least part of the optical filter passes through the circuit carrier board. The through hole is formed to communicate with the inner wall of the through hole at least An annular gap of the communication port; a first adhesive layer, which is in the shape of a closed ring and formed in the annular gap, so as to close the annular gap and bond the optical filter to the circuit carrier; and a second adhesive layer, which connects and seals the periphery of the top surface of the image sensing chip and the circuit carrier, so that the sensing space and the annular gap can be connected through at least one communication port. communicate with each other and jointly form a sealed space.

一種外封閉式感測模組，其包括：一影像感測晶片，其於頂面配置有一感測區域、位於所述感測區域外側的一接合區域、及位於所述接合區域外側的多個焊接墊；一支撐層，設置於所述接合區域，並且所述支撐層非為封閉圈狀而形成有至少一個連通口；一濾光片，設置於所述支撐層上並遮蔽所述感測區域；其中，所述濾光片與所述感測區域之間形成有一感測空間；一電路載板，形成有一貫穿孔，並且所述電路載板具有位於所述貫穿孔外側的多個接合墊；其中，所述影像感測晶片以多個所述焊接墊分別焊接固定於多個所述接合墊，並且所述濾光片的至少局部穿設於所述貫穿孔、以與所述貫穿孔的內壁之間形成有連通於至少一個所述連通口的一環形間隙；一第一黏結層，為呈封閉圈狀的一膠帶，所述第一黏結層封閉所述環形間隙、並黏接所述濾光片至所述電路載板；以及一第二黏結層，連接且密封所述影像感測晶片的所述頂面周緣以及所述電路載板，以使所述感測空間與所述環形間隙能通過至少一個所述連通口而彼此相通、並共同形成一密封空間。 An externally enclosed sensing module, which includes: an image sensing chip, which is configured with a sensing area on the top surface, a bonding area located outside the sensing area, and a plurality of bonding areas located outside the bonding area. Welding pad; a support layer, arranged in the joint area, and the support layer is not in the shape of a closed ring and at least one communication port is formed; a filter, arranged on the support layer and shielding the sensing area; wherein, a sensing space is formed between the filter and the sensing area; a circuit carrier is formed with a through hole, and the circuit carrier has a plurality of joints located outside the through hole Pads; wherein, the image sensing chip is respectively welded and fixed to a plurality of the bonding pads with a plurality of the welding pads, and at least a part of the optical filter is penetrated in the through hole, so as to be connected with the through hole An annular gap communicating with at least one of the communication ports is formed between the inner walls of the holes; a first adhesive layer is an adhesive tape in the shape of a closed ring, and the first adhesive layer closes the annular gap and sticks connecting the optical filter to the circuit carrier; and a second adhesive layer, connecting and sealing the periphery of the top surface of the image sensing chip and the circuit carrier, so that the sensing space and the circuit carrier The annular gap They can communicate with each other through at least one communication port, and jointly form a sealed space.