TWM638516U

TWM638516U - Electronic device

Info

Publication number: TWM638516U
Application number: TW111210253U
Authority: TW
Inventors: 楊鴻祥; 薛華; 盛趙偉
Original assignee: 華碩電腦股份有限公司
Priority date: 2022-09-08
Filing date: 2022-09-21
Publication date: 2023-03-11
Also published as: CN218416811U

Abstract

An electronic device includes a circuit board and an expansion module. The expansion module is disposed on the circuit board and includes an adapter card, an expansion card, and a support member. The adapter card is adapted for being inserted into the circuit board upright. The expansion card is inserted into the adapter card. The support member is fixed on the adapter card and is adapted for being detachably disposed on the circuit board. The expansion card is supported above the circuit board by the adapter card, so as to form an accommodating space between the expansion card and the circuit board. More components are able to be disposed at the electronic device.

Description

電子裝置electronic device

本案是有關於一種可設置較多元件的電子裝置。This case is about an electronic device that can be equipped with more components.

隨著科技的進步，電子裝置的功能越來越強大，固定或是插設在電路板上的電子元件數量越來越多，要如何在有限空間的電路板下設置更多元件，是本領域研究的目標。With the advancement of science and technology, the functions of electronic devices are becoming more and more powerful, and the number of electronic components fixed or inserted on the circuit board is increasing. How to install more components under the circuit board in a limited space is an issue in this field. research goals.

本案提供一種電子裝置，其包括電路板以及擴充模組，擴充模組設置於電路板，且包括轉接卡、擴充卡、支撐件。轉接卡適於立起地插設於電路板。擴充卡插設於轉接卡。支撐件固定於轉接卡，且適於可拆卸地設置於電路板，其中擴充卡藉由轉接卡而被架高於電路板上方，而與電路板之間存在容置空間。This case provides an electronic device, which includes a circuit board and an expansion module, the expansion module is arranged on the circuit board, and includes an adapter card, an expansion card, and a support. The riser card is suitable for being inserted into the circuit board upright. The expansion card is inserted into the riser card. The supporting member is fixed on the riser card and is suitable for being detachably arranged on the circuit board, wherein the expansion card is mounted higher than the circuit board by the riser card, and there is an accommodating space between the riser card and the circuit board.

基於上述，本案的電子裝置的擴充模組包括轉接卡、擴充卡、支撐件。轉接卡適於立起地插設於電路板。擴充卡插設於轉接卡。擴充卡藉由轉接卡而被架高於電路板上方，而與電路板之間存在容置空間。此外，支撐件固定於轉接卡且適於可拆卸地設置於電路板，以對轉接卡與擴充卡提供支持。Based on the above, the expansion module of the electronic device in this case includes an adapter card, an expansion card, and a supporting member. The riser card is suitable for being inserted into the circuit board upright. The expansion card is inserted into the riser card. The expansion card is mounted higher than the circuit board by the riser card, and there is an accommodating space between the expansion card and the circuit board. In addition, the supporting member is fixed on the riser card and is adapted to be detachably arranged on the circuit board to provide support for the riser card and the expansion card.

圖1是依照本案的一實施例的一種電子裝置的示意圖。圖2是圖1的電子裝置的***示意圖。圖3是圖1的電子裝置的擴充模組設置於電路板的示意圖。FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application. FIG. 2 is an exploded schematic diagram of the electronic device of FIG. 1 . FIG. 3 is a schematic diagram of an expansion module of the electronic device of FIG. 1 disposed on a circuit board.

請參閱圖1至圖3，本實施例的電子裝置100包括電路板105以及擴充模組(下面以第一擴充模組110表示)。電路板105例如是主機板，但不以此為限制，電路板105包括第一連接器106，第一擴充模組110可拆卸地設置於電路板105上。Please refer to FIG. 1 to FIG. 3 , the electronic device 100 of this embodiment includes a circuit board 105 and an expansion module (referred to as a first expansion module 110 below). The circuit board 105 is, for example, a motherboard, but not limited thereto. The circuit board 105 includes a first connector 106 , and the first expansion module 110 is detachably disposed on the circuit board 105 .

第一擴充模組110包括擴充卡(下面以第一擴充卡112表示)、轉接卡(下面以第一轉接卡114表示)及支撐件130。第一擴充卡112電性連接於電路板105。第一擴充卡112例如是M.2介面的固態硬碟，但第一擴充卡112的種類不以此為限制。第一轉接卡114插設於電路板105的第一連接器106，第一擴充卡112插設於第一轉接卡114，以藉由第一轉接卡114電性連接至電路板105。The first expansion module 110 includes an expansion card (referred to as the first expansion card 112 below), a riser card (represented as the first riser card 114 below) and a supporting member 130 . The first expansion card 112 is electrically connected to the circuit board 105 . The first expansion card 112 is, for example, a solid state drive with an M.2 interface, but the type of the first expansion card 112 is not limited thereto. The first riser card 114 is inserted into the first connector 106 of the circuit board 105 , and the first expansion card 112 is inserted into the first riser card 114 to be electrically connected to the circuit board 105 through the first riser card 114 .

在本實施例中，第一轉接卡114立起於電路板105設置，第一擴充卡112水平地插設至第一轉接卡114，以讓出下方空間，給其他的元件(例如第二擴充模組150與第一散熱件122)配置。In this embodiment, the first riser card 114 is erected on the circuit board 105, and the first expansion card 112 is horizontally inserted into the first riser card 114 to allow space below for other components (such as the first riser card 114). The second expansion module 150 is configured with the first heat sink 122).

也就是說，本實施例的第一擴充卡112藉由第一轉接卡114而被架高於電路板105上方，而與電路板105之間存在容置空間。電子裝置100的其他電子元件(例如是第二擴充模組150)便可設置於第一擴充模組110與電路板105之間，而在有限空間的電路板105上設置更多的元件，以提升電子裝置100的效能。That is to say, the first expansion card 112 of this embodiment is mounted higher than the circuit board 105 by the first riser card 114 , and there is an accommodating space between the first expansion card 112 and the circuit board 105 . Other electronic components of the electronic device 100 (such as the second expansion module 150) can be arranged between the first expansion module 110 and the circuit board 105, and more components are arranged on the circuit board 105 in a limited space, so as to Improve the performance of the electronic device 100 .

為了使第一轉接卡114與第一擴充卡112穩定地設置於電路板105上方，在本實施例中，支撐件130設置在第一轉接卡114旁且固定於第一轉接卡114。支撐件130可用來提升第一擴充模組110的結構強度，並且可用來固定至電路板105，而提供第一擴充模組110的穩固性。In order to stably arrange the first riser card 114 and the first expansion card 112 above the circuit board 105 , in this embodiment, the support member 130 is arranged beside the first riser card 114 and fixed on the first riser card 114 . The supporting member 130 can be used to enhance the structural strength of the first expansion module 110 and can be used to fix to the circuit board 105 to provide the stability of the first expansion module 110 .

具體地說，支撐件130可選擇地包括依序彎折地連接的第一區段132、第二區段134及第三區段136，第一區段132最靠近電路板105，第三區段136最遠離電路板105。第一固定件140將第一區段132固定於電路板105。Specifically, the support member 130 may optionally include a first section 132, a second section 134 and a third section 136 that are sequentially bent and connected, the first section 132 is closest to the circuit board 105, and the third section Segment 136 is furthest from circuit board 105 . The first fixing member 140 fixes the first section 132 to the circuit board 105 .

在本實施例中，第一區段132與第三區段136平行於電路板105，第二區段134垂直於電路板105，且平行於第一轉接卡114。支撐件130的第一區段132、第二區段134及第三區段136呈C型，但支撐件130的形狀不以此為限制，在其他實施例中，支撐件130也可以呈L型或是其他形狀。In this embodiment, the first section 132 and the third section 136 are parallel to the circuit board 105 , and the second section 134 is perpendicular to the circuit board 105 and parallel to the first riser card 114 . The first section 132, the second section 134 and the third section 136 of the support 130 are C-shaped, but the shape of the support 130 is not limited thereto. In other embodiments, the support 130 can also be L type or other shapes.

第一擴充模組110可選擇地包括散熱組件120。散熱組件120包括第一散熱件122，第一散熱件122位於電路板105與第一擴充卡112之間。也就是說，第一散熱件122位於第一擴充卡112下方的容置空間。如圖2所示，在本實施例中，第一散熱件122呈倒L型，但第一散熱件122的形狀不以此為限制。The first expansion module 110 optionally includes a heat dissipation component 120 . The heat dissipation assembly 120 includes a first heat dissipation element 122 , and the first heat dissipation element 122 is located between the circuit board 105 and the first expansion card 112 . That is to say, the first heat sink 122 is located in the accommodating space below the first expansion card 112 . As shown in FIG. 2 , in this embodiment, the first heat sink 122 is in an inverted L shape, but the shape of the first heat sink 122 is not limited thereto.

第一轉接卡114位於第一散熱件122與第二區段134之間，且連接於第一散熱件122與第二區段134，而使第一散熱件122固定於支撐件130的第二區段134。具體地說，第一轉接卡114透過結合部139固定至第一散熱件122。第一散熱件122透過結合部138固定於結合部139，而固定於支撐件130的第二區段134。The first riser card 114 is located between the first heat sink 122 and the second section 134 , and is connected to the first heat sink 122 and the second section 134 , so that the first heat sink 122 is fixed on the first heat sink 130 of the supporting member 130 Second section 134. Specifically, the first riser card 114 is fixed to the first heat sink 122 through the joint portion 139 . The first heat sink 122 is fixed to the joint portion 139 through the joint portion 138 , so as to be fixed to the second section 134 of the supporting member 130 .

由圖3可見，支撐件130的高度H2介於第一轉接卡114的高度H1的0.8倍至1.2倍之間。這樣的設計可使得支撐件130在高度方向上能夠較佳地提供第一轉接卡114支撐。It can be seen from FIG. 3 that the height H2 of the support member 130 is between 0.8 times and 1.2 times the height H1 of the first riser card 114 . Such a design can enable the supporting member 130 to better support the first riser card 114 in the height direction.

在本實施例中，結合部138的數量例如是兩個，兩結合部138位於第二區段在對角的兩個角落。當然，在其他實施例中，結合部138的數量也可以是四個，四結合部138位於第二區段在對角的四個角落。結合部138的數量與設置位置不以此為限制。In this embodiment, the number of the joint portions 138 is, for example, two, and the two joint portions 138 are located at two opposite corners of the second section. Of course, in other embodiments, the number of joints 138 may also be four, and the four joints 138 are located at four diagonal corners of the second section. The number and arrangement positions of the joint parts 138 are not limited thereto.

此外，散熱組件120還包括第二散熱件124，第一擴充卡112位於第一散熱件122與第二散熱件124之間。也就是說，第二散熱件124位於第一擴充卡112的上方。第二散熱件124透過螺絲與螺柱的配合而固定於第一散熱件122。第一擴充卡112被夾置且固定在第一散熱件122與第二散熱件124之間。此外，第二散熱件124固定於支撐件130的第三區段136。In addition, the heat dissipation assembly 120 further includes a second heat dissipation element 124 , and the first expansion card 112 is located between the first heat dissipation element 122 and the second heat dissipation element 124 . That is to say, the second heat sink 124 is located above the first expansion card 112 . The second heat sink 124 is fixed to the first heat sink 122 through cooperation of screws and studs. The first expansion card 112 is interposed and fixed between the first heat sink 122 and the second heat sink 124 . In addition, the second cooling element 124 is fixed on the third section 136 of the support element 130 .

在本實施例中，第一固定件140將支撐件130的第一區段132可拆卸地設置於電路板105。第二固定件142用以固定散熱組件120與電路板105的相對位置。具體地說，電子裝置100更包括第三固定件144(例如是螺柱)，固定至電路板105，第二固定件142可拆卸地設置於第三固定件144，以將散熱組件120固定至電路板105。In this embodiment, the first fixing member 140 detachably disposes the first section 132 of the supporting member 130 on the circuit board 105 . The second fixing member 142 is used for fixing the relative position of the heat dissipation assembly 120 and the circuit board 105 . Specifically, the electronic device 100 further includes a third fixing member 144 (such as a stud), which is fixed to the circuit board 105, and the second fixing member 142 is detachably arranged on the third fixing member 144 to fix the heat dissipation assembly 120 to the circuit board 105 .

因此，在本實施例中，由於第一擴充模組110被架高而讓出下方的空間，電子裝置100更可選擇地包括設置於第一擴充模組110下方的電子元件(例如是第二擴充模組150)，以提供更多元與高效能的功能。Therefore, in this embodiment, since the first expansion module 110 is elevated to make way for the space below, the electronic device 100 may further optionally include electronic components (such as the second The expansion module 150) provides more diverse and high-performance functions.

在本實施例中，第二擴充模組150包括第二擴充卡152、第二轉接卡154及第三散熱件160。第二擴充卡152例如是M.2介面的固態硬碟，但第一擴充卡112的種類不以此為限制。In this embodiment, the second expansion module 150 includes a second expansion card 152 , a second riser card 154 and a third heat sink 160 . The second expansion card 152 is, for example, a solid state drive with an M.2 interface, but the type of the first expansion card 112 is not limited thereto.

第二擴充卡152位於第一擴充卡112與電路板105之間，第三散熱件160位於第二擴充卡152與電路板105之間。第二擴充卡152抵靠於第三固定件144。第二轉接卡154插設於電路板105的第二連接器107，第二擴充卡152插設於第二轉接卡154，以藉由第二轉接卡154電性連接至電路板105。The second expansion card 152 is located between the first expansion card 112 and the circuit board 105 , and the third heat sink 160 is located between the second expansion card 152 and the circuit board 105 . The second expansion card 152 leans against the third fixing member 144 . The second riser card 154 is inserted into the second connector 107 of the circuit board 105 , and the second expansion card 152 is inserted into the second riser card 154 to be electrically connected to the circuit board 105 through the second riser card 154 .

在本實施例中，第二轉接卡154與第二擴充卡152平行於電路板105配置，但第二轉接卡154與第二擴充卡152的配置方式不以此為限制。在其他實施例中，第二轉接卡154也可以被省略。In this embodiment, the second riser card 154 and the second expansion card 152 are disposed parallel to the circuit board 105 , but the arrangement of the second riser card 154 and the second expansion card 152 is not limited thereto. In other embodiments, the second riser card 154 can also be omitted.

綜上所述，本案的電子裝置的擴充模組包括轉接卡、擴充卡、支撐件。轉接卡適於立起地插設於電路板。擴充卡插設於轉接卡。擴充卡藉由轉接卡而被架高於電路板上方，而與電路板之間存在容置空間。此外，支撐件固定於轉接卡且適於可拆卸地設置於電路板，以對轉接卡與擴充卡提供支持。To sum up, the expansion module of the electronic device in this case includes an adapter card, an expansion card, and a support. The riser card is suitable for being inserted into the circuit board upright. The expansion card is inserted into the riser card. The expansion card is mounted higher than the circuit board by the riser card, and there is an accommodating space between the expansion card and the circuit board. In addition, the supporting member is fixed on the riser card and is adapted to be detachably arranged on the circuit board to provide support for the riser card and the expansion card.

H1、H2:高度 100:電子裝置 105:電路板 106:第一連接器 107:第二連接器 110:擴充模組 112:擴充卡 114:轉接卡 120:散熱組件 122:第一散熱件 124:第二散熱件 130:支撐件 132:第一區段 134:第二區段 136:第三區段 138、139:結合部 140:第一固定件 142:第二固定件 144:第三固定件 150:第二擴充模組 152:第二擴充卡 154:第二轉接卡 160:第三散熱件H1, H2: Height 100: Electronic device 105: circuit board 106: first connector 107: Second connector 110: Expansion module 112: expansion card 114: Riser card 120: cooling components 122: the first heat sink 124: the second radiator 130: support 132: first section 134:Second section 136: The third section 138, 139: junction 140: the first fixing part 142: the second fixing piece 144: The third fixing piece 150: Second Expansion Module 152: Second expansion card 154:Second Riser Card 160: the third radiator

圖1是依照本案的一實施例的一種電子裝置的示意圖。圖2是圖1的電子裝置的***示意圖。圖3是圖1的電子裝置的擴充模組設置於電路板的示意圖。 FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application. FIG. 2 is an exploded schematic diagram of the electronic device of FIG. 1 . FIG. 3 is a schematic diagram of an expansion module of the electronic device of FIG. 1 disposed on a circuit board.

H1、H2:高度 H1, H2: Height

100:電子裝置 100: Electronic device

105:電路板 105: circuit board

106:第一連接器 106: first connector

107:第二連接器 107: Second connector

110:擴充模組 110: Expansion module

112:擴充卡 112: expansion card

114:轉接卡 114: Riser card

130:支撐件 130: support

132:第一區段 132: first section

134:第二區段 134:Second segment

136:第三區段 136: The third section

138:結合部 138: junction

140:第一固定件 140: the first fixing part

Claims

一種電子裝置，包括：電路板；以及擴充模組，設置於所述電路板，且包括：轉接卡，適於立起地插設於所述電路板；擴充卡，插設於所述轉接卡；以及支撐件，固定於所述轉接卡，且適於可拆卸地設置於所述電路板，其中所述擴充卡藉由所述轉接卡而被架高於所述電路板上方，而與所述電路板之間存在容置空間。 An electronic device comprising: circuit boards; and The expansion module is arranged on the circuit board and includes: The riser card is suitable for being inserted into the circuit board in an upright manner; an expansion card inserted into the riser card; and The supporting member is fixed on the riser card and is adapted to be detachably arranged on the circuit board, wherein the expansion card is mounted higher than the circuit board by the riser card, and is connected with the circuit board There is an accommodating space between the circuit boards.

如請求項1所述的電子裝置，其中所述支撐件位於所述轉接卡旁，且所述支撐件在所述電路板上的高度介於所述轉接卡在所述電路板上的高度的0.8倍至1.2倍之間。The electronic device according to claim 1, wherein the support is located beside the riser card, and the height of the support on the circuit board is between the height of the riser card on the circuit board Between 0.8 and 1.2 times the height.

如請求項1所述的電子裝置，其中所述支撐件包括彎折地連接的第一區段及第二區段，所述第一區段固定於所述電路板，所述轉接卡固定於所述第二區段。The electronic device according to claim 1, wherein the support member includes a first section and a second section connected in a bent manner, the first section is fixed to the circuit board, and the riser card is fixed to in the second section.

如請求項3所述的電子裝置，其中所述轉接卡藉由多個結合部固定於所述第二區段，所述多個結合部位於所述第二區段的多個角落。The electronic device according to claim 3, wherein the riser card is fixed on the second section by a plurality of joints, and the joints are located at corners of the second section.

如請求項3所述的電子裝置，其中所述擴充模組還包括第一散熱件，位於所述容置空間，且固定於所述支撐件的所述第二區段。The electronic device according to claim 3, wherein the expansion module further includes a first heat dissipation element located in the accommodating space and fixed to the second section of the supporting element.

如請求項3所述的電子裝置，還包括第二散熱件，所述擴充卡位於所述第二散熱件與所述電路板之間，所述第二散熱件固定於所述支撐件。The electronic device according to claim 3 further includes a second heat sink, the expansion card is located between the second heat sink and the circuit board, and the second heat sink is fixed to the support.

如請求項6所述的電子裝置，其中所述支撐件還包括彎折連接於所述第二區段的第三區段，所述第三區段遠離所述電路板，所述第二散熱件固定於所述第三區段。The electronic device according to claim 6, wherein the supporting member further includes a third section bent and connected to the second section, the third section is away from the circuit board, and the second heat dissipation A piece is fixed to the third section.

如請求項7所述的電子裝置，其中所述第一區段與所述第三區段平行於所述電路板，所述第二區段垂直於所述電路板，且平行於所述轉接卡。The electronic device according to claim 7, wherein the first section and the third section are parallel to the circuit board, and the second section is perpendicular to the circuit board and parallel to the turn Pick up the card.

如請求項7所述的電子裝置，其中所述支撐件的所述第一區段、所述第二區段、所述第三區段呈C型。The electronic device according to claim 7, wherein the first section, the second section, and the third section of the support member are C-shaped.

如請求項1所述的電子裝置，更包括電子元件，設置於所述擴充模組與所述電路板之間。The electronic device according to claim 1 further includes electronic components disposed between the expansion module and the circuit board.