TWM631263U - Main board set and electronic device - Google Patents
Main board set and electronic device Download PDFInfo
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- TWM631263U TWM631263U TW111205571U TW111205571U TWM631263U TW M631263 U TWM631263 U TW M631263U TW 111205571 U TW111205571 U TW 111205571U TW 111205571 U TW111205571 U TW 111205571U TW M631263 U TWM631263 U TW M631263U
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
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Abstract
一種主機板組用以供一介面裝置及一散熱裝置裝設。主機板組包含一電路板、一介面卡固定機構及一扣柱。介面卡固定機構凸出於電路板,並用以固定介面裝置。扣柱凸出於介面卡固定機構遠離電路板之一側,並用以供設置於介面裝置之散熱裝置的一鎖扣部卡扣。A mainboard assembly is used for installing an interface device and a heat dissipation device. The main board set includes a circuit board, an interface card fixing mechanism and a buckle column. The interface card fixing mechanism protrudes from the circuit board and is used for fixing the interface device. The clasp protrudes from a side of the interface card fixing mechanism away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.
Description
本新型係關於一種主機板組及電子裝置,特別是一種能免工具安裝的一種主機板組及包含其的電子裝置。The new model relates to a mainboard assembly and an electronic device, in particular to a mainboard assembly that can be installed without tools and an electronic device including the same.
由於固態式硬碟在運作時會產生大量的熱,因此固定式硬碟上通常會設置散熱片以有效地將熱逸散至外界。並且,散熱片與固態式硬碟的晶片之間的熱接觸會影響散熱片與晶片之間的熱傳遞效率。有鑑於此,散熱片通常會透過螺絲固定在供固態式硬碟插接的連接器之殼體,以確保散熱片與晶片之間的熱接觸。Since solid state drives generate a lot of heat during operation, heat sinks are usually installed on fixed hard drives to effectively dissipate heat to the outside world. Also, the thermal contact between the heat sink and the chip of the solid state drive will affect the heat transfer efficiency between the heat sink and the chip. In view of this, the heat sink is usually screwed to the housing of the connector for the solid state drive to be inserted into, so as to ensure thermal contact between the heat sink and the chip.
然,因為散熱片是透過螺絲固定於連接器的殼體,所以會需要使用工具拆裝螺絲才能將散熱片安裝至連接器的殼體或是將散熱片從連接器的殼體拆下,這使得散熱片以及連接器的殼體之間有組裝不便利的問題。Of course, because the heat sink is fixed to the connector housing by screws, it is necessary to use tools to disassemble the screws to install the heat sink to the connector housing or remove the heat sink from the connector housing. As a result, there is a problem of inconvenient assembly between the heat sink and the housing of the connector.
本新型在於提供一種主機板組及電子裝置,藉以能以免工具的方式拆裝於擴充卡。The present invention provides a mainboard assembly and an electronic device, so that the expansion card can be disassembled and assembled in a tool-free manner.
本新型之一實施例所揭露之主機板組用以供一介面裝置及一散熱裝置裝設。主機板組包含一電路板、一介面卡固定機構及一扣柱。介面卡固定機構凸出於電路板,並用以固定介面裝置。扣柱凸出於介面卡固定機構遠離電路板之一側,並用以供設置於介面裝置之散熱裝置的一鎖扣部卡扣。The motherboard assembly disclosed in one embodiment of the present invention is used for installing an interface device and a heat dissipation device. The mainboard set includes a circuit board, an interface card fixing mechanism and a buckle column. The interface card fixing mechanism protrudes from the circuit board and is used for fixing the interface device. The clasp protrudes from a side of the interface card fixing mechanism away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.
本新型之另一實施例所揭露之電子裝置包含一主機板組、一介面裝置及一散熱裝置。主機板組包含一電路板、一電連接器、一介面卡固定機構及一扣柱。電連接器設置於電路板,並具有一電性插槽及至少一卡槽。介面卡固定機構凸出於電路板。扣柱凸出於介面卡固定機構遠離電路板之一側。介面裝置之一側插設於電連接器。介面裝置之另一側受介面卡固定機構固定。散熱裝置包含一散熱部、至少一卡扣部及一鎖扣部。至少一卡扣部與鎖扣部分別設置於散熱部之相對兩側。至少一卡扣部卡合於電連接器之至少一卡槽。鎖扣部扣合於扣柱。Another embodiment of the present invention discloses an electronic device including a motherboard set, an interface device and a heat dissipation device. The main board set includes a circuit board, an electrical connector, an interface card fixing mechanism and a buckle column. The electrical connector is arranged on the circuit board and has an electrical slot and at least one card slot. The interface card fixing mechanism protrudes out of the circuit board. The buckle post protrudes from a side of the interface card fixing mechanism away from the circuit board. One side of the interface device is inserted into the electrical connector. The other side of the interface device is fixed by the interface card fixing mechanism. The heat dissipation device includes a heat dissipation part, at least one buckle part and a lock part. At least one snap portion and the lock portion are respectively disposed on opposite sides of the heat dissipation portion. At least one clasp portion is engaged with at least one clasp of the electrical connector. The locking part is fastened to the locking post.
本新型之另一實施例所揭露之主機板組用以供一介面裝置及一散熱裝置裝設。主機板組包含一電路板、一電連接器及一扣柱。電連接器凸出於電路板,並用以供介面裝置插設。扣柱凸出於電連接器遠離電路板之一側,並用以供設置於介面裝置之散熱裝置的一鎖扣部卡扣。Another embodiment of the present invention discloses a motherboard assembly for installing an interface device and a heat dissipation device. The main board set includes a circuit board, an electrical connector and a buckle column. The electrical connector protrudes from the circuit board and is used for inserting the interface device. The clasp protrudes from a side of the electrical connector away from the circuit board, and is used for clasping a clasp portion of a heat sink disposed on the interface device.
根據上述實施例之主機板組及電子裝置,由於扣柱之柱體凸出於介面卡固定機構遠離電路板之一側或電連接器遠離電路板之一側,故扣柱之柱體無需安裝於電路板,故可減少電路板之破孔而增加電路板之佈線區域。According to the motherboard assembly and the electronic device of the above-mentioned embodiments, since the column of the buckle column protrudes from the side of the interface card fixing mechanism away from the circuit board or the side of the electrical connector away from the circuit board, the column of the buckle column does not need to be installed In the circuit board, it can reduce the hole of the circuit board and increase the wiring area of the circuit board.
此外,透過扣柱與散熱裝置中的鎖扣部搭配,可讓散熱裝置透過免工具的方式自擴充卡上拆卸。同樣地,散熱裝置亦可以免工具的方式安裝於擴充卡上。因此,散熱裝置能以簡便且有效率的方式拆裝於擴充卡。In addition, through the matching of the locking post with the locking portion in the heat dissipation device, the heat dissipation device can be disassembled from the expansion card in a tool-free manner. Likewise, the heat sink can also be installed on the expansion card in a tool-free manner. Therefore, the heat sink can be attached to and detached from the expansion card in a simple and efficient manner.
以上關於本新型內容的說明及以下實施方式的說明係用以示範與解釋本新型的原理,並且提供本新型的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.
請參閱圖1至圖3。圖1為根據本新型第一實施例所述之電子裝置1的立體示意圖。圖2為圖1之分解示意圖。圖3為圖1之局部側視示意圖。See Figures 1 through 3. FIG. 1 is a schematic perspective view of an
本實施例之電子裝置1包含一主機板組10、一介面裝置20及一散熱裝置30。主機板組10包含一電路板100、一電連接器200、一介面卡固定機構300及一扣柱400。電連接器200設置於電路板100,並具有一電性插槽210及二卡槽220。電性插槽210例如為M.2規格的插槽,並用以供介面裝置20插設。卡槽220用以供散熱裝置30卡合,請容後一併說明。The
在本實施例中,卡槽220的數量為二個,但並不以此為限。在其他實施例中,卡槽的數量亦可改為單個。In this embodiment, the number of the
介面卡固定機構300包含一固定柱310及一旋轉扣件320。固定柱310固定並凸出於電路板100。固定柱310例如透過螺合的方式鎖固於電路板100之螺合部110。旋轉扣件320可轉動地設置於固定柱310而可轉至一扣合位置。位於扣合位置之旋轉扣件320用以扣壓介面裝置20。詳細來說,固定柱310具有一組裝槽311。旋轉扣件320包含一承載部321、一扣部322及一操作部323。承載部321套設於固定柱310,並位於組裝槽311。扣部322連接於承載部321並與承載部321共同形成一扣合槽S。扣合槽S用以容置至少部分介面裝置20。操作部323連接於扣部322,以帶動扣部322與承載部321相對固定柱310轉動。The interface
在本實施例中,介面裝置20係透過旋轉式之旋轉扣件320扣合而固定,但並不以此為限。在其他實施例中,介面裝置係也可以改為透過滑動式之滑動扣件扣合而固定,甚或也可以改為透過其他形式之扣件扣合而固定。In the present embodiment, the
扣柱400包含一柱體410及一扣體420。柱體410凸出於介面卡固定機構300遠離電路板100之一側。扣體420連接於柱體410遠離電路板100之一側,且扣體420的寬度W1大於柱體410的寬度W2。扣體420遠離柱體410之一側具有一導弧面421,導弧面421之功用容後一併說明。由於柱體410凸出於介面卡固定機構300遠離電路板100之一側,故扣柱400之柱體410無需安裝於電路板100,故可減少電路板100之破孔而增加電路板100之佈線區域。The
在本實施例中,扣柱400之柱體410與固定柱310同軸設置,即扣柱400之柱體410的軸線X與固定柱310之軸線X重疊,但並不以此為限。在其他實施例中,扣柱之柱體與固定柱亦可非同軸設置,即扣柱之柱體的軸線與固定柱之軸線不重疊。In this embodiment, the
介面裝置20例如為M.2規格的SSD記憶體,且介面裝置20之一側22插設於電連接器200,以及介面裝置20之另一側24受介面卡固定機構300之旋轉扣件320之扣部322扣合而固定。The
散熱裝置30包含一散熱部32、二卡扣部34及一鎖扣部35。散熱部32例如透過散熱膠熱耦合於介面裝置20。此外,散熱部32例如但不限於具有鰭片結構。二卡扣部34設置於散熱部32之其中一側,且每一卡扣部34例如具有尺寸較大的頭部,以透過卡扣部34之頭部卡合於電連接器200之卡槽220。鎖扣部35例如可滑移地設置於散熱部32之另一側。詳細來說,鎖扣部35具有多個導槽36及一扣孔37。散熱裝置30還可以包含多個導引柱38及一復位件39。這些導引柱38分別穿過這些導槽36而結合於散熱部32,且這些導引柱38分別可於這些導槽36內滑移,以令鎖扣部35可相對散熱部32滑移。復位件39例如為壓縮彈簧。復位件39之一端固定於散熱部32,以及復位件39之另一端固定於鎖扣部35,以透過復位件39之彈力帶動鎖扣部35移至一鎖扣位置而用以扣合於扣柱400。The
在本實施例中,鎖扣部35係透過導槽36與導引柱38之搭配來相對散熱部32滑移,但並不以此為限。在其他實施例中,鎖扣部亦可透過滑軌結構來相對散熱部滑移。In this embodiment, the locking
在本實施例中,鎖扣部35係可滑移地設置於散熱部32,但並不以此為限。在其他實施例中,鎖扣部亦可改為可轉動地設置於散熱部。In this embodiment, the locking
在本實施例中,卡扣部34的數量為二個,但並不以此為限。在其他實施例中,卡扣部的數量亦可改為單個。In this embodiment, the number of the
請參閱圖4與圖5。圖4與圖5為圖1之電子裝置1的組裝示意圖。如圖2與圖4所示,介面裝置20之一側22已插設於電連接器200之電性插槽210,以及介面裝置20之另一側24受位於扣合位置之旋轉扣件320之扣部322抵壓而被固定。此外,將散熱裝置30之卡扣部34先扣合於電連接器200之卡槽220,再讓散熱裝置30之鎖扣部35沿方向A下壓,使得鎖扣部35受到扣體420之導弧面421之引導而沿方向B移動。接著,如圖5所示,繼續沿方向A下壓鎖扣部35,待扣體420穿過扣孔37而讓柱體410位於扣孔37時,鎖扣部35會受到復位件39之帶動而沿方向C移動至鎖扣位置,並讓鎖扣部35扣住扣柱400之扣體420靠近電路板100之一側而完成散熱裝置30之固定。Please refer to Figure 4 and Figure 5. 4 and 5 are schematic diagrams of assembly of the
在上述實施例中,扣柱400係設置於介面卡固定機構300,但並不以此為限。在其他實施例中,扣柱亦可設置於電路板上之其他零件,如電連接器或其他固定結構、組裝結構等。In the above embodiment, the locking
根據上述實施例之主機板組及電子裝置,由於扣柱之柱體凸出於介面卡固定機構遠離電路板之一側,故扣柱之柱體無需安裝於電路板,故可減少電路板之破孔而增加電路板之佈線區域。According to the motherboard assembly and the electronic device of the above-mentioned embodiments, since the cylinder of the clasp protrudes from the side of the interface card fixing mechanism away from the circuit board, the cylinder of the clasp does not need to be installed on the circuit board, so the circuit board can be reduced. The hole is broken to increase the wiring area of the circuit board.
此外,透過扣柱與散熱裝置中滑移式的鎖扣部搭配,可讓散熱裝置透過免工具的方式自擴充卡上拆卸。同樣地,散熱裝置亦可以免工具的方式安裝於擴充卡上。因此,散熱裝置能以簡便且有效率的方式拆裝於擴充卡。In addition, through the combination of the buckle column and the sliding locking part in the heat sink, the heat sink can be disassembled from the expansion card in a tool-free manner. Likewise, the heat sink can also be installed on the expansion card in a tool-free manner. Therefore, the heat sink can be attached to and detached from the expansion card in a simple and efficient manner.
雖然本新型以前述之諸項實施例揭露如上,然其並非用以限定本新型,任何熟習相像技藝者,在不脫離本新型之精神和範圍內,當可作些許之更動與潤飾,因此本新型之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed by the above-mentioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for a new model shall be determined by the scope of the patent application attached to this specification.
1:電子裝置 10:主機板組 20:介面裝置 22:一側 24:另一側 30:散熱裝置 32:散熱部 34:卡扣部 35:鎖扣部 36:導槽 37:扣孔 38:導引柱 39:復位件 100:電路板 110:螺合部 200:電連接器 210:電性插槽 220:卡槽 300:介面卡固定機構 310:固定柱 311:組裝槽 320:旋轉扣件 321:承載部 322:扣部 323:操作部 400:扣柱 410:柱體 420:扣體 421:導弧面 A~C:方向 W1、W2:寬度 X:軸線 S:扣合槽 1: Electronic device 10: Motherboard group 20: Interface Device 22: one side 24: The other side 30: Cooling device 32: heat dissipation department 34: Buckle part 35: Locking part 36: Guide groove 37: button hole 38: Guide column 39: reset piece 100: circuit board 110: Screw part 200: Electrical Connector 210: Electrical socket 220: Card slot 300: Interface card fixing mechanism 310: Fixed column 311: Assembly slot 320: Rotary Fastener 321: Bearing Department 322: Buckle 323: Operation Department 400: Buckle Post 410: Cylinder 420: Buckle 421: arc guide surface A~C: Direction W1, W2: width X: axis S: Snap groove
圖1為根據本新型第一實施例所述之電子裝置的立體示意圖。 圖2為圖1之分解示意圖。 圖3為圖1之局部側視示意圖。 圖4與圖5為圖1之電子裝置的組裝示意圖。 FIG. 1 is a three-dimensional schematic diagram of an electronic device according to a first embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 . FIG. 3 is a schematic partial side view of FIG. 1 . FIG. 4 and FIG. 5 are schematic diagrams of assembly of the electronic device of FIG. 1 .
1:電子裝置 1: Electronic device
10:主機板組 10: Motherboard group
20:介面裝置 20: Interface Device
22:一側 22: one side
24:另一側 24: The other side
30:散熱裝置 30: Cooling device
32:散熱部 32: heat dissipation department
34:卡扣部 34: Buckle part
35:鎖扣部 35: Locking part
36:導槽 36: Guide groove
37:扣孔 37: button hole
38:導引柱 38: Guide column
39:復位件 39: reset piece
100:電路板 100: circuit board
110:螺合部 110: Screw part
200:電連接器 200: Electrical Connector
210:電性插槽 210: Electrical socket
220:卡槽 220: Card slot
300:介面卡固定機構 300: Interface card fixing mechanism
310:固定柱 310: Fixed column
311:組裝槽 311: Assembly slot
320:旋轉扣件 320: Rotary Fastener
321:承載部 321: Bearing Department
322:扣部 322: Buckle
323:操作部 323: Operation Department
400:扣柱 400: Buckle Post
410:柱體 410: Cylinder
420:扣體 420: Buckle
S:扣合槽 S: Snap groove
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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TW111205571U TWM631263U (en) | 2022-05-27 | 2022-05-27 | Main board set and electronic device |
CN202221762718.0U CN217936059U (en) | 2022-05-27 | 2022-07-07 | Main board set and electronic device |
DE202022104224.1U DE202022104224U1 (en) | 2022-05-27 | 2022-07-26 | Motherboard assembly and electronic device |
JP2022002532U JP3239281U (en) | 2022-05-27 | 2022-08-01 | Motherboard assemblies and electronic devices |
Applications Claiming Priority (1)
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TW111205571U TWM631263U (en) | 2022-05-27 | 2022-05-27 | Main board set and electronic device |
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TWM631263U true TWM631263U (en) | 2022-08-21 |
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TW111205571U TWM631263U (en) | 2022-05-27 | 2022-05-27 | Main board set and electronic device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3239281U (en) |
CN (1) | CN217936059U (en) |
DE (1) | DE202022104224U1 (en) |
TW (1) | TWM631263U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI823736B (en) * | 2022-12-30 | 2023-11-21 | 技嘉科技股份有限公司 | Heat dissipation assembly and electric device therefore |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024124430A1 (en) * | 2022-12-14 | 2024-06-20 | Amphenol Commercial Products (Chengdu) Co., Ltd. | Connector interface for engagement with plate |
-
2022
- 2022-05-27 TW TW111205571U patent/TWM631263U/en unknown
- 2022-07-07 CN CN202221762718.0U patent/CN217936059U/en active Active
- 2022-07-26 DE DE202022104224.1U patent/DE202022104224U1/en active Active
- 2022-08-01 JP JP2022002532U patent/JP3239281U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI823736B (en) * | 2022-12-30 | 2023-11-21 | 技嘉科技股份有限公司 | Heat dissipation assembly and electric device therefore |
Also Published As
Publication number | Publication date |
---|---|
DE202022104224U1 (en) | 2022-08-09 |
JP3239281U (en) | 2022-10-03 |
CN217936059U (en) | 2022-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |