TWM629084U - Automatic focusing and imaging system、microscope - Google Patents
Automatic focusing and imaging system、microscope Download PDFInfo
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本創作係關於顯微鏡的自動對焦及取像系統,特別是一種用於電子產品的快速對焦及取像的系統。This work is about the automatic focusing and imaging system of microscopes, especially a system for fast focusing and imaging of electronic products.
顯微鏡具有高影像放大率特性,可以將細小的物體放大來觀察,也因為高放大率的關係,景深(Depth of field)範圍相對會比較小,使用者需要花時間調整物鏡與被觀察物的距離才能夠清楚地看到被觀察物體,而市面上自動對焦系統因為對焦平面就是取像平面,所以可以快速的調整物鏡與被觀察物的距離,使用者不需要花太多時間就可以取得清楚的影像。The microscope has the characteristics of high image magnification, which can magnify small objects for observation. Because of the high magnification, the depth of field range is relatively small, and the user needs to spend time adjusting the distance between the objective lens and the object to be observed. In order to be able to see the observed object clearly, the autofocus system on the market can quickly adjust the distance between the objective lens and the observed object because the focal plane is the image acquisition plane. image.
然而目前的電子產品為了特殊功能性的設計,如屏下攝影機、LED玻璃基板封裝、液晶面板封裝(Chip on glass、Film on glass),大多會將相關電子元件放在一個介質材料上面,要檢查該電子元件時需要穿透該介質材料才能觀察,如果使用市面上的自動對焦系統就不容易達到快速對焦的目的,或者需要多道程序才能完成對焦,導致生產效率下降。However, for the special functional design of current electronic products, such as under-screen cameras, LED glass substrate packaging, and liquid crystal panel packaging (Chip on glass, Film on glass), most of the related electronic components are placed on a dielectric material, which needs to be checked. The electronic component needs to penetrate the medium material to be observed. If the automatic focusing system on the market is used, it is not easy to achieve the purpose of fast focusing, or multiple procedures are required to complete the focusing, resulting in a decrease in production efficiency.
基於上述缺失,本創作目的在於提供一種自動對焦系統,特別是一種用於電子產品的快速對焦及取像對焦系統。Based on the above deficiencies, the purpose of the present invention is to provide an automatic focusing system, especially a fast focusing and image capturing focusing system for electronic products.
根據本創作目的,提供一種自動對焦及取像系統,包含一焦距調整模組,具有一光學模組用以將一第一光源發出的光線轉換成一直線光束,該直線光束經由一第一光學元件傳遞至一待測物的一對焦平面,該待測物沿著一XY方向設置,及一第二光學元件將從該對焦平面反射的該直線光束傳遞至一第一感測器以取得一對焦影像,一運算單元根據該對焦影像的位置數值控制一置動器調整該第一光學元件的一Z方向位置,以及一取像模組,具有一第三光學元件將一第二光源發出的一光線投射至該待測物的一取像平面,及一第四光學元件將經由該取像平面反射的該光線成像至一第二感測器以取得一目標影像。According to the purpose of the present invention, an automatic focusing and imaging system is provided, which includes a focal length adjustment module and an optical module for converting the light emitted by a first light source into a straight beam, and the straight beam passes through a first optical element It is transmitted to a focal plane of an object to be tested, the object to be tested is arranged along an XY direction, and a second optical element transmits the straight beam reflected from the focal plane to a first sensor to obtain a focus image, an arithmetic unit controls a setter to adjust a Z-direction position of the first optical element according to the position value of the focused image, and an imaging module having a third optical element to emit a second light source The light is projected onto an imaging plane of the object to be tested, and a fourth optical element images the light reflected by the imaging plane to a second sensor to obtain a target image.
其中還具有一第一分光元件及一第二分光元件位於該對焦平面與該第一感測器之間的光線路徑上,該第一分光元件用以將該直線光束的部分傳遞至該第二分光元件,該第二分光元件將該直線光束的部分反射至該第一光學元件並由該第一光學元件將該直線光束的部分傳遞至該對焦平面,該第二分光元件允許從該對焦平面反射回該第一光學元件的該直線光束的部分反射至該第一分光元件,該第一分光元件允許該直線光束的部分反射至該第二光學元件,並由該第二光學元件傳遞至該第一感測器。There is also a first beam splitting element and a second beam splitting element located on the light path between the focal plane and the first sensor, and the first beam splitting element is used to transmit part of the straight beam to the second A beam splitting element, the second beam splitting element reflects the portion of the straight beam to the first optical element and transmits the portion of the straight beam to the focal plane by the first optical element, the second beam splitting element allows from the focal plane The portion of the straight beam reflected back to the first optical element is reflected to the first beam splitting element, which allows the portion of the straight beam to be reflected to the second optical element and transmitted to the second optical element by the first beam splitting element first sensor.
其中該第二分光元件與一第三分光元件位於該第二感測器與該取像平面之間及該第三光學元件與該取像平面之間的光線路徑上,該第三分光元件用以將該第二光源的部分光線反射至該第二分光元件,該第二分光元件將該光線的部分傳遞至該第一光學元件並由該第一光學元件將該光線的部分傳遞至該取像平面,該第二分光元件允許從該取像平面反射回該第一光學元件的該光線的部分傳遞至該第三分光元件,該第三分光元件允許將該光線的部分經過第四光學元件成像至該第二感測器。Wherein the second light splitting element and a third light splitting element are located on the light path between the second sensor and the image pickup plane and between the third optical element and the image pickup plane, and the third light splitting element is used for So that part of the light of the second light source is reflected to the second beam splitting element, the second beam splitting element transmits part of the light to the first optical element and the first optical element transmits the part of the light to the extraction The image plane, the second beam splitting element allows the portion of the light reflected from the image plane back to the first optical element to pass to the third beam splitting element, the third beam splitting element allows the portion of the light to pass through the fourth optical element imaged to the second sensor.
較佳的,該取像模組還具有一吸光板及一第一反射元件,該第一反射元件將該第二光源的光線經由一第三分光元件後的部分該光線反射至該吸光板。Preferably, the image capturing module further has a light absorbing plate and a first reflecting element, the first reflecting element reflects part of the light from the second light source after passing through a third beam splitting element to the light absorbing plate.
較佳的,還具有一第三光源及一第二反射元件,該第二反射元件將該第三光源的一光線反射至一第四分光元件,該第四分光元件將該第三光源的該光線的部分並反射至該第一光學元件,該第一光學元件將該光線傳遞至該取像平面,該第三光源為高功率的雷射光。Preferably, there is also a third light source and a second reflection element, the second reflection element reflects a light of the third light source to a fourth beam splitting element, the fourth beam splitting element The third light source A part of the light is reflected to the first optical element, the first optical element transmits the light to the imaging plane, and the third light source is a high-power laser light.
較佳的,該對焦平面與該取像平面間的距離介於0mm至10mm。Preferably, the distance between the focusing plane and the image capturing plane is between 0mm and 10mm.
較佳的,該第一光源為雷射光或發光二極體,該第二光源為發光二極體。Preferably, the first light source is a laser light or a light-emitting diode, and the second light source is a light-emitting diode.
本創作還具有一種顯微鏡,具有如前述的自動對焦及取像系統。The present creation also has a microscope with the aforementioned autofocus and imaging system.
為了清楚說明本創作之具體實施方式、構造及所達成之效果,提供實施例並配合圖式說明如下:In order to clearly illustrate the specific implementation, structure and achieved effects of this creation, the following examples are provided and described in conjunction with the drawings:
請參閱圖1,繪示一種自動對焦及取像系統,包含一焦距調整模組以及一取像模組,該焦距調整模組具有一光學模組11用以將一第一光源10發出的光線轉換成一直線光束101,該直線光束101經由一第一光學元件41傳遞至一待測物的一對焦平面51,該待測物沿著一XY方向設置,及一第二光學元件42將從該對焦平面51反射的該直線光束101傳遞至一第一感測器13以取得一對焦影像,一運算單元15根據該對焦影像的位置數值控制一置動器17調整該第一光學元件41的一Z方向位置,該運算單元15進行影像處理及分析,該運算單元15可以是但不限於CPU、DSP、FPGA或混合訊號處理器等可編程訊號處理元件。Please refer to FIG. 1 , which shows an automatic focusing and imaging system, including a focal length adjustment module and an imaging module. The focal length adjustment module has an
進一步說明,該焦距調整模組還具有一第一分光元件31及一第二分光元件32位於該對焦平面51與該第一感測器13之間的光線路徑上,該第一分光元件31用以將該直線光束101的部分傳遞至該第二分光元件32,該第二分光元件32將該直線光束101的部分反射至該第一光學元件41並由該第一光學元件41將該直線光束101的部分傳遞至該對焦平面51形成第一光路;而該第二分光元件32允許從該對焦平面51反射回該第一光學元件41的該直線光束101的部分反射至該第一分光元件31,該第一分光元件31允許該直線光束101的部分反射至該第二光學元件42,而該第二光學元件42將該直線光束101的部分傳遞至一第一感測器13形成第二光路並使該第一感測器13取得一對焦影像。其中該第一光源10可以是雷射光或發光二極體(LED),該第一感測器13為線掃描相機或面相機。該第一光學元件41及第二光學元件42為光學透鏡。Further description, the focal length adjustment module also has a first
而該取像模組具有一第三光學元件43將一第二光源20發出的一光線投射至該待測物的一取像平面52,及一第四光學元件44將經由該取像平面52反射的該光線傳遞至一第二感測器22取得一目標影像,該第二光源20為可見光或紅外光的發光二極體(LED),該第二感測器22為線掃描相機或面相機。該第三光學元件43及該第四光學元件44為光學透鏡。The imaging module has a third
進一步說明,該第二分光元件32與一第三分光元件33位於該第二感測器22與該取像平面52之間及該第三光學元件43與該取像平面52之間的光線路徑上,該第三分光元件33用以將該第二光源的光線的部分反射至該第二分光元件32,該第二分光元件32將該光線的部分傳遞至該第一光學元件41並由該第一光學元件41將該光線的部分傳遞至該取像平面52形成第三光路,該第二分光元件32允許從該取像平面52反射回該第一光學元件41的該光線的部分傳遞至該第三分光元件33,該第三分光元件33允許將該光線的部分傳遞至一第四光學元件44,該第四光學元件44將該光線的部分成像至該第二感測器22形成第四光路並使該第二感測器22取得目標影像。Further description, the second
前述的直線光束經由第一光路及第二光路到達第一感測器13進行對焦後,第二光源的光線經由第三光路及第四光路到達第二感測器22進行取像為一次完整的自動對焦及取像流程。After the aforementioned straight beam reaches the
進一步說明,請參閱圖2為第一感測器13取得的對焦影像畫面,該第一感測器13取得的對焦影像為直線光斑,當該第一光學元件41的Z方向位置改變(即影響該第一光學元件41與對焦平面51之間的距離z改變),該直線光斑會在第一感測器13沿著X方向移動,因此運算單元15會根據對焦影像的位置控制該第一光學元件41的Z方向位置以使第二感測器22取得清晰的影像。在其他的實施態樣中,該直線光束101也可以是長條狀以外的形狀,例如三角形、弧形或圓形,只要能在第一感測器13形成可供測量的光斑即可。For further description, please refer to FIG. 2 for the in-focus image frame obtained by the
請參閱圖3,該置動器17調整第一光學元件41的位置數值是依據下列公式:
z(x)
mkx+a
其中
,C是第一光學元件41的數值孔徑,a、k為校正常數,z是第一光學元件41與對焦平面51之間的距離,x是第一感測器13上的對焦影像位置,當該對焦影像在x1位置時,對應第一光學元件41在Z方向位置z1,當對焦影像在x2位置時,對應第一光學元件41在Z方向位置z2,當對焦影像在x3位置時,對應第一光學元件41在Z方向位置z3,以此類推,該對焦影像的x位置與第一光學元件41在Z方向位置呈線性關係。
Referring to FIG. 3 , the position value of the
請參閱圖4為本創作的第二實施例,於第二實施例中,待測物的取像平面處於不等高平面時,該第一感測器13上的對焦影像透過數位化方式處理,可以分解成一或多個線段做局部定位使用(圖中A、B、C線段), 藉此,使用者可設定取像平面52上的任意x,y位置以對應取像距離h(即對焦平面與該取像平面間的距離),於本新型的實施例中,對焦平面與該取像平面間的距離介於0mm至10mm,而前述第一光學元件41與對焦平面51之間的距離z大於前述取像距離h。Please refer to FIG. 4 of the second embodiment of the present invention. In the second embodiment, when the image capturing plane of the object to be measured is on a plane of unequal heights, the focused image on the
請參閱圖5為本創作的第三實施例,於第三實施例中該取像模組還具有一吸光板62及一第一反射元件61,該第二光源20發出的光線經由第三光學元件43傳遞至第三分光元件33後,部分的光線會反射至第二分光元件32,另一部分的光線穿透至第一反射元件61,並經由第一反射元件61反射至吸光板62並吸收形成第五光路,藉由第五光路的形成能夠避免光線反射至第二感測器22影響取像畫面,並且能夠提升目標影像對比度。Please refer to FIG. 5 of the third embodiment of the present invention. In the third embodiment, the image capturing module also has a
請參閱圖6為本創作的第四實施例,於第四實施例中還具有一第三光源73及一第二反射元件72,該第三光源73發出的光線為大於10W的高功率雷射光,雷射光經由第二反射元件72反射至一第四分光元件71,該第四分光元件71將該雷射光的部分反射至取像平面52,如此一來,可以直接藉由雷射光線對待測物進行加工(即取像平面52為加工平面),提高使用便利性。Please refer to FIG. 6 , which is the fourth embodiment of the present invention. In the fourth embodiment, there is also a
其中該第三分光元件33、第二分光元件32及第一光學元件41皆位於該取像平面52與該第四分光元件71的光線路徑上,雷射光經由第二反射元件72反射至第四分光元件71,該第四分光元件71將該雷射光的部分反射至第四光學元件44,第四光學元件44將雷射光傳遞至第三分光元件33,第三分光元件33將雷射光的部分傳遞至第二分光元件32,第二分光元件32將雷射光的部分傳遞至第一光學元件41,最後再由第一光學元件41將雷射光傳遞至取像平面52形成第六光路,藉此可以直接對待測物進行雷射加工,減少使用者移動待測物後進行加工的成本,提高便利性。The third
A、B、C:對焦影像之局部線段 h:取像距離 z:第一光學元件與對焦平面之間的距離 10:第一光源 101:直線光束 11:光學模組 13:第一感測器 15:運算單元 17:置動器 20:第二光源 22:第二感測器 31:第一分光元件 32:第二分光元件 33:第三分光元件 41:第一光學元件 42:第二光學元件 43:第三光學元件 44:第四光學元件 51:對焦平面 52:取像平面 61:第一反射元件 62:吸光板 71:第四分光元件 72:第二反射元件 73:第三光源A, B, C: local line segments of the focused image h: acquisition distance z: distance between the first optical element and the focal plane 10: The first light source 101: Straight Beam 11: Optical module 13: The first sensor 15: Operation unit 17: Setter 20: Second light source 22: Second sensor 31: The first light splitting element 32: Second beam splitting element 33: The third beam splitting element 41: First Optical Element 42: Second Optical Element 43: Third Optics 44: Fourth Optical Element 51: Focus plane 52: Acquisition plane 61: First reflective element 62: Absorbent plate 71: Fourth beam splitting element 72: Second reflective element 73: The third light source
圖1是本創作第一實施例之光線路徑圖。FIG. 1 is a light path diagram of the first embodiment of the present invention.
圖2是本創作第一感測器取得的對焦影像畫面示意圖。FIG. 2 is a schematic diagram of a focused image obtained by the first sensor of the present invention.
圖3是對焦影像的x位置與第一光學元件在Z方向位置呈線性關係圖。FIG. 3 is a linear relationship between the x position of the focused image and the position of the first optical element in the Z direction.
圖4是本創作之第二實施態樣的第一感測器取得的對焦影像畫面示意圖。FIG. 4 is a schematic diagram of a focused image frame obtained by the first sensor of the second embodiment of the present invention.
圖5是本創作的第三實施例之光線路徑圖。FIG. 5 is a light path diagram of the third embodiment of the present invention.
圖6是本創作的第四實施例之光線路徑圖。FIG. 6 is a light path diagram of the fourth embodiment of the present invention.
h:取像距離 h: acquisition distance
z:第一光學元件與對焦平面之間的距離 z: distance between the first optical element and the focal plane
10:第一光源 10: The first light source
101:直線光束 101: Straight Beam
11:光學模組 11: Optical module
13:第一感測器 13: The first sensor
15:運算單元 15: Operation unit
17:置動器 17: Setter
20:第二光源 20: Second light source
22:第二感測器 22: Second sensor
31:第一分光元件 31: The first light splitting element
32:第二分光元件 32: Second beam splitting element
33:第三分光元件 33: The third beam splitting element
41:第一光學元件 41: First Optical Element
42:第二光學元件 42: Second Optical Element
43:第三光學元件 43: Third Optics
44:第四光學元件 44: Fourth Optical Element
51:對焦平面 51: Focus plane
52:取像平面 52: Acquisition plane
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TWI813173B (en) * | 2022-02-18 | 2023-08-21 | 極智光電股份有限公司 | Automatic focusing and imaging system and method、microscope |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI813173B (en) * | 2022-02-18 | 2023-08-21 | 極智光電股份有限公司 | Automatic focusing and imaging system and method、microscope |
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