TWM628587U - Probe detection system - Google Patents
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- TWM628587U TWM628587U TW111200393U TW111200393U TWM628587U TW M628587 U TWM628587 U TW M628587U TW 111200393 U TW111200393 U TW 111200393U TW 111200393 U TW111200393 U TW 111200393U TW M628587 U TWM628587 U TW M628587U
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Abstract
本申請提供一種探針檢測系統,包含:平台、光學檢測儀和主機。平台配置為承載探針卡。光學檢測儀與平台上的探針卡對準,配置為檢測探針卡的探針。主機與平台和光學檢測儀電連接。主機根據光學檢測儀的量測結果和/或平台的定位訊息獲取探針的長度、針端水平以及針端位置。The present application provides a probe detection system, comprising: a platform, an optical detector and a host. The platform is configured to host probe cards. The optical detector is aligned with the probe card on the platform and is configured to detect the probes of the probe card. The host is electrically connected with the platform and the optical detector. The host acquires the length of the probe, the level of the needle end and the position of the needle end according to the measurement result of the optical detector and/or the positioning information of the platform.
Description
本申請涉及檢測系統,特別是關於一種探針檢測系統。 The present application relates to detection systems, in particular to a probe detection system.
近年來,隨著電子產品朝向精密與多功能化發展,應用在電子產品內的積體電路之晶圓結構也趨於複雜。在晶圓的製造中通常採用批次性的大量生產。為了確保晶圓的電氣品質,在將晶圓進行封裝前會先進行量測。現今一般採用探針卡(Probe card)來測試晶片。藉由將探針卡的探針電性接觸晶圓的接觸墊,再經探針卡的電路板將電氣訊號連接到測試機,使測試機傳送測試訊號到晶圓或接收來自晶圓的輸出訊號,進而達到量測晶圓的電氣特性之功效。使用者可進一步根據量測的結果將不良晶圓剔除,以進行後續的封裝處理。 In recent years, with the development of electronic products toward precision and multi-functionality, the wafer structure of integrated circuits used in electronic products also tends to be more complex. In the manufacture of wafers, batch mass production is generally employed. To ensure the electrical quality of the wafers, measurements are performed before the wafers are packaged. Today, probe cards are generally used to test chips. By electrically contacting the probes of the probe card with the contact pads of the wafer, and then connecting the electrical signals to the tester through the circuit board of the probe card, the tester can transmit the test signal to the wafer or receive the output from the wafer. signal, and then achieve the effect of measuring the electrical characteristics of the wafer. The user can further remove defective wafers according to the measurement results for subsequent packaging processing.
探針卡作為測試機與晶圓間之介面,其必須具有高可靠度。因此,在探針卡的製造過程中,當探針與電路板組裝後,必須進行探針的檢測和調整。在現有技術中,一般是以人工方式使用工業顯微鏡來檢測探針的長度和針端的水平,並且以探針卡檢驗儀器(如PRVX)來檢測針端部位置。然而,以人工方式的檢測存在人為操作而導致的誤差,且耗費工時導致僅僅能採用抽樣方式檢驗。再者,針尖端部異常的探針卡必須等到PRVX檢測階段才可被檢出,無法在探針卡的製造過程中及時發現並進行維修。 As the interface between the tester and the wafer, the probe card must have high reliability. Therefore, in the manufacturing process of the probe card, after the probes are assembled with the circuit board, the detection and adjustment of the probes must be carried out. In the prior art, the length of the probe and the level of the needle tip are generally checked manually using an industrial microscope, and the position of the needle tip is checked with a probe card inspection instrument (eg PRVX). However, the manual inspection has errors caused by human operation, and labor-intensive inspection can only be performed by sampling. Furthermore, a probe card with an abnormal needle tip cannot be detected until the PRVX detection stage, and cannot be detected and repaired in time during the manufacturing process of the probe card.
有鑑於此,本申請提供一種探針檢測系統,以解決上述技術問題。 In view of this, the present application provides a probe detection system to solve the above technical problems.
本申請提供一種探針檢測系統,可避人為操作而導致的誤差以及無法在探針卡的製造過程中及時檢測出針尖端部異常的問題。 The present application provides a probe detection system, which can avoid errors caused by human operation and the problem that the abnormality of the needle tip cannot be detected in time during the manufacturing process of the probe card.
本申請提供一種探針檢測系統,包含:一平台,配置為承載一探針卡;一光學檢測儀,與該平台上的該探針卡對準,配置為檢測該探針卡的探針;以及主機,與該平台和該光學檢測儀電連接,其中該主機根據該光學檢測儀的量測結果和/或該平台的定位訊息獲取該探針的長度、針端水平以及針端位置。 The present application provides a probe detection system, comprising: a platform configured to carry a probe card; an optical detector aligned with the probe card on the platform and configured to detect probes of the probe card; and a host, which is electrically connected to the platform and the optical detector, wherein the host acquires the length of the probe, the level of the needle end and the position of the needle end according to the measurement result of the optical detector and/or the positioning information of the platform.
在一些實施例中,該光學檢測儀包含白光干涉儀。 In some embodiments, the optical detector comprises a white light interferometer.
在一些實施例中,該平台可相對於該光學檢測儀移動,並且藉由該平台的移動使得該光學檢測儀檢測該探針卡的多個該探針。 In some embodiments, the platform is movable relative to the optical detector, and the movement of the platform enables the optical detector to detect the plurality of probes of the probe card.
在一些實施例中,該平台包含X-Y定位平台。 In some embodiments, the platform includes an X-Y positioning platform.
在一些實施例中,該X-Y定位平台包含可相互垂直運動的X軸平台和Y軸平台。 In some embodiments, the X-Y positioning stage includes an X-axis stage and a Y-axis stage that can move perpendicular to each other.
在一些實施例中,該探針卡包含載板和安裝在該載板上的多個該探針,該主機配置為控制該平台相對於該光學檢測儀移動,且控制該光學檢測儀進行從所述載板掃描至該探針的端部的長行程掃描,以及該主機根據該長行程掃描的結果獲取該探針的該長度。 In some embodiments, the probe card includes a carrier board and a plurality of the probes mounted on the carrier board, the host is configured to control the platform to move relative to the optical detector, and to control the optical detector to perform slave The carrier plate is scanned to a long-stroke scanning of the end of the probe, and the host acquires the length of the probe according to the result of the long-stroke scanning.
在一些實施例中,該主機配置為控制該光學檢測儀檢測該光學檢測儀與該探針卡的多個該探針的端部的距離,以及該主機根據該距離獲取該探針的該針端水平。 In some embodiments, the host is configured to control the optical detector to detect the distance between the optical detector and the ends of the probes of the probe card, and the host acquires the needle of the probe according to the distance end level.
在一些實施例中,該主機還配置為根據該平台的移動獲取該光學檢測儀與該探針卡的多個該探針的端部對準時的該定位訊息,以獲取該探針的該針端位置。 In some embodiments, the host is further configured to obtain the positioning information when the optical detector is aligned with the ends of the probes of the probe card according to the movement of the platform, so as to obtain the needles of the probes end position.
相較於現有技術,本申請通過提供一種探針檢測系統,可同時獲取探針的的針長、針端水平以及針端位置,提高了檢測效率。再者,本申請還避免了人工檢測而導致的人員操作誤差,實現了非接觸式量測和產線的全自動化,進而提高了檢測資料的可靠性。另一方面,通過本申請的探針檢測系統,可在探針卡的製造過程中提前檢測出針端位置偏移的探針,不但可及時發現並進行維修,還可提高探針卡檢驗儀器(如PRVX)的設備效益。 Compared with the prior art, the present application improves the detection efficiency by providing a probe detection system, which can simultaneously acquire the needle length, the needle end level and the needle end position of the probe. Furthermore, the present application also avoids personnel operation errors caused by manual detection, realizes non-contact measurement and full automation of production lines, and further improves the reliability of detection data. On the other hand, through the probe detection system of the present application, the probes whose needle ends are shifted in position can be detected in advance during the manufacturing process of the probe card, which can not only be found and repaired in time, but also the probe card inspection instrument can be improved. (eg PRVX) equipment benefits.
1:探針檢測系統 1: Probe detection system
10:平台 10: Platform
11:X軸平台 11: X-axis platform
12:Y軸平台 12: Y-axis platform
20:光學檢測儀 20: Optical detector
30:主機 30: Host
31:處理器 31: Processor
32:儲存器 32: Storage
40:探針卡 40: Probe card
41:電路板 41: circuit board
42:載板 42: carrier board
43:探針 43: Probe
第1圖顯示根據本申請之實施例之探針檢測系統的示意圖。 FIG. 1 shows a schematic diagram of a probe detection system according to an embodiment of the present application.
現參考附圖更全面地描述示例實施方式。然而,示例實施方式能夠以多種形式實施,且不應被理解為限於在此闡述的範例。相反,提供這些實施方式使得本申請將更加全面和完整,並將示例實施方式的構思全面地傳達給本領域的技術人員。附圖僅為本申請的示意性圖解,並非一定是按比例繪製。圖中相同的附圖標記表示相同或類似的部分,因而將省略對它們的重複描述。 Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the examples set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.
參照第1圖,其顯示根據本申請之實施例之探針檢測系統的示意圖。探針檢測系統1適用於檢測探針卡,並且檢測並獲取探針卡的探針的訊息,其中該訊息包含每一探針的針長、針端水平以及針端位置,具體說明如下。
Referring to FIG. 1, a schematic diagram of a probe detection system according to an embodiment of the present application is shown. The
如第1圖所示,探針檢測系統1包含平台10、光學檢測儀20和主機30。平台10配置為承載探針卡40。探針卡40包含依序設置的電路板41、載板42和多個探針43。多個探針43垂直安裝在載板42上,以及載板42固定在電路板41上。當探針卡40放置在平台10上的定點時,探針卡40的電路板41與平台10接觸,以及探針43朝遠離平台10的方向延伸。具體來說,探針43包含相對的底部和端部,探針43的底部相對靠***台10,以及探針43的端部相對遠離平台10。在一些實施例中,隨著探針43與平台10的距離越遠,探針43的寬度逐漸減小。
As shown in FIG. 1 , the
如第1圖所示,平台10為定位平台,其可相對於光學檢測儀20移動。在本實施例中,平台10為X-Y定位平台,包含可相互垂直運動的X軸平台11和Y軸平台12。應當理解的是,平台10亦可採用其他種類的定位平台,不侷限於此。
As shown in FIG. 1 , the
如第1圖所示,光學檢測儀20與平台10上的探針卡40對準,配置為檢測探針卡40的探針43。具體來說,藉由平台10的移動使得光學檢測儀20可檢測探針卡40的多個探針43。在本實施例中,光學檢測儀包含白光干涉儀,惟不侷限於此。主機30與平台10和光學檢測儀20電連接。主機30根據平台10的定位訊息和/或光學檢測儀20的量測結果獲取探針43的長度、針端水平以及針端位置。
As shown in FIG. 1 , the
如第1圖所示,主機30可以包括以下部件中的一個或多個:處理器31、儲存器32、電路板、電源電路等。處理器31和儲存器32設置在電路板上。電源電路配置為向主機30的每個電路或元件供電。儲存器32配置為儲存可執行程式代碼。處理器31通過讀取儲存器32中儲存的可執行程式代碼,運行與這些可執行程式代碼對應的程式,以執行以下的探針檢測操作。
As shown in FIG. 1, the
當藉由探針檢測系統1獲取與每一探針的針長相關的訊息時,主機30配置為控制平台10相對於光學檢測儀移動20,且控制光學檢測儀20進行從載
板42掃描至每一探針43的端部的長行程掃描,以進行一次性的完整檢測。主機30根據長行程掃描的結果獲取每一探針43的長度。
When the information related to the needle length of each probe is acquired by the
當藉由探針檢測系統1獲取與每一探針的針端水平相關的訊息時,主機30配置為控制平台10相對於光學檢測儀移動20,且控制光學檢測儀20檢測光學檢測儀20的探測頭與探針卡40的多個探針43的端部的距離。主機30根據該距離獲取多個探針43的端部的水平面,進而獲取探針43的針端水平。在一些實施例中,當以預先獲得每一探針43的長度時,可通過探針43的長度將光學檢測儀移動20的Z軸移至對焦點,進行短行程掃描(如50um)。因此,相較於現有技術的接觸式量測,本申請可大幅縮短檢測時間。
When the information related to the needle end level of each probe is acquired by the
當藉由探針檢測系統1獲取與每一探針的針端位置相關的訊息時,主機30配置為控制平台10相對於光學檢測儀移動20。根據平台10的移動,主機30獲取光學檢測儀20與探針卡40的多個探針43的端部對準時的定位訊息,以獲取每一探針43的針端位置。也就是說,在獲取探針43的針端水平的同時,可一併獲取探針43的針端位置,進而達到同時檢測探針43的針端水平與針端位置的效益。
The
在本實施例中,處理器31通常配置為控制主機30的整體操作。處理器可包括一個或多個處理器以執行指令進而在上述探針檢測系統的操作中的全部或部分步驟中執行動作。此外,處理器31可包括促進處理器31與其他組件之間的交互的一個或多個模塊。例如,處理器可以包括通訊模塊以促進通訊組件和處理器31之間的交互。儲存器32配置為儲存各種類型的資料以支持主機30的操作。此類資料的示例包括用於在主機30上操作的任何應用或方法的指令。儲存器32可以使用任何類型的易失性或非易失性儲存器設備或它們的組合來實現。電源電路向主機30的各種組件供電。電源電路可以包括電源管理系統、一個或多個電
源、以及與主機30的電力的產生、管理和分配相關聯的任何其他組件。在示例性實施例中,主機30可以由獨立的終端設備或者是整合在光學檢測儀中的控制器、微控制器等電子組件來實現。
In this embodiment, the
綜上所述,本申請通過提供一種探針檢測系統,可同時獲取探針的的針長、針端水平以及針端位置,提高了檢測效率。再者,本申請還避免了人工檢測而導致的人員操作誤差,實現了非接觸式量測和產線的全自動化,進而提高了檢測資料的可靠性。另一方面,通過本申請的探針檢測系統,可在探針卡的製造過程中提前檢測出針端位置偏移的探針,不但可及時發現並進行維修,還可提高探針卡檢驗儀器(如PRVX)的設備效益。 To sum up, the present application improves the detection efficiency by providing a probe detection system, which can simultaneously acquire the needle length, the needle end level and the needle end position of the probe. Furthermore, the present application also avoids personnel operation errors caused by manual detection, realizes non-contact measurement and full automation of production lines, and further improves the reliability of detection data. On the other hand, through the probe detection system of the present application, the probes whose needle ends are shifted in position can be detected in advance during the manufacturing process of the probe card, which can not only be found and repaired in time, but also the probe card inspection instrument can be improved. (eg PRVX) equipment benefits.
以上所述僅為本申請的具體實施方式,但本申請的保護範圍並不局限於此,任何所屬技術領域通常知識者在本申請揭露的技術範圍內,可輕易想到變化或替換,都應涵蓋在本申請的保護範圍之內。因此,本申請的保護範圍應以所述申請專利範圍的保護範圍為准。 The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. Any person with ordinary knowledge in the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should cover within the scope of protection of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the application patent scope.
1:探針檢測系統 1: Probe detection system
10:平台 10: Platform
11:X軸平台 11: X-axis platform
12:Y軸平台 12: Y-axis platform
20:光學檢測儀 20: Optical detector
30:主機 30: Host
31:處理器 31: Processor
32:儲存器 32: Storage
40:探針卡 40: Probe card
41:電路板 41: circuit board
42:載板 42: carrier board
43:探針 43: Probe
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CN115469203A (en) * | 2022-09-05 | 2022-12-13 | 上海泽丰半导体科技有限公司 | Probe card stroke measuring system and method |
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CN115469203A (en) * | 2022-09-05 | 2022-12-13 | 上海泽丰半导体科技有限公司 | Probe card stroke measuring system and method |
CN115469203B (en) * | 2022-09-05 | 2023-09-19 | 上海泽丰半导体科技有限公司 | Probe card travel measurement system and method |
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