TWM623482U

TWM623482U - Composite substrate cutting device

Info

Publication number: TWM623482U
Application number: TW110206227U
Authority: TW
Inventors: 廖嘉郁; 楊順龍
Original assignee: 鈞旺股份有限公司; 尚楊科技有限公司
Priority date: 2021-05-28
Filing date: 2021-05-28
Publication date: 2022-02-21

Abstract

揭示一複合基材切割裝置，包含機台、輸送模組、雷射模組、切割模組及控制模組。機台定義有X、Y、Z三軸方向；輸送模組設置於機台並沿著X軸方向輸送；雷射模組包含位於輸送模組上方之雷射源、雷射頭及反光鏡，雷射源設置於機台並包含雷射光入射方向，雷射頭滑設於機台並沿著Y軸方向滑動、並包含對應朝向輸送模組之雷射光出射方向，反光鏡設置於雷射頭內並對應於雷射光入射、出射方向之間反射；切割模組設置於機台並包含位於輸送模組上方之刀件，其沿著Z軸方向朝向輸送模組進給；控制模組電性連接於輸送模組、雷射模組及切割模組。A composite substrate cutting device is disclosed, which includes a machine, a conveying module, a laser module, a cutting module and a control module. The machine is defined with three axes: X, Y, and Z; the conveying module is set on the machine and conveyed along the X-axis; the laser module includes a laser source, a laser head and a reflector located above the conveying module. The laser source is arranged on the machine table and includes the incident direction of the laser light, the laser head is slidably arranged on the machine table and slides along the Y-axis direction, and includes the laser light outgoing direction corresponding to the conveying module, and the reflector is arranged on the laser head Inside and corresponding to the reflection between the incident and outgoing directions of the laser light; the cutting module is set on the machine and includes a knife above the conveying module, which feeds toward the conveying module along the Z-axis direction; the electrical properties of the control module are Connected to the conveying module, the laser module and the cutting module.

Description

複合基材切割裝置Composite substrate cutting device

本創作係為材料切割的技術領域，尤指一種對於複合基材進行切割的裝置，藉其可大幅減少切割時所產生之粉塵、切割品質與系統穩定性、並且降低成本。The present invention belongs to the technical field of material cutting, especially a device for cutting composite substrates, which can greatly reduce the dust generated during cutting, cutting quality and system stability, and reduce costs.

例如在銅箔基板的領域中，其主要產品就是以兩片銅片夾住絕緣含浸黏合膠片之樹脂基材，而其在生產過程中必須經歷分條與切割（裁切）之製程。For example, in the field of copper foil substrates, its main product is a resin substrate with two copper sheets sandwiched by insulating impregnated adhesive films, which must undergo a process of slitting and cutting (cutting) during the production process.

在以往的作法中，分條與切割都是以機械式剪斷的製程進行，然而，樹脂片係為一種由外側樹脂材料包裏內部的玻璃纖維布所製成之複合基材，由於樹脂材料往往在發生塑性變形前就直接斷裂，故在切割過程中容易產生大量粉塵，其在品質控管上係為一個不可不面對的問題。In the past, the slitting and cutting were carried out by mechanical shearing. However, the resin sheet is a composite substrate made of glass fiber cloth inside the outer resin material bag. It often breaks directly before plastic deformation occurs, so a large amount of dust is easily generated during the cutting process, which is an inevitable problem in quality control.

面對降低粉塵之需求，目前常用的解決方案有兩種，一是先將樹脂基材加熱後再進行切割，二是用雷射直接切割樹脂基材。於第一種方式中，樹脂基材之加熱的方式係使用熱風或紅外線加熱器（IR Heater），但這兩種加熱方式對於熱影響區之大小、與樹脂基材之加熱程度的控制皆不易與不佳；於第二種方式中，由於樹脂材料與玻璃纖維布的熔點差異過大，用雷射直接進行切割，容易發生樹脂材料汽化但是玻璃纖維布沒斷、或是玻璃纖維布切斷但是樹脂材料卻燒焦的情形。Faced with the need to reduce dust, there are currently two commonly used solutions, one is to heat the resin substrate before cutting, and the other is to directly cut the resin substrate with a laser. In the first method, the heating method of the resin substrate is to use hot air or an infrared heater (IR Heater), but these two heating methods are not easy to control the size of the heat affected zone and the degree of heating of the resin substrate. In the second method, due to the large difference in melting point between the resin material and the glass fiber cloth, cutting directly with a laser may easily cause the resin material to vaporize but the glass fiber cloth is not broken, or the glass fiber cloth is cut but The resin material is burnt.

為解決上述習知複合基材於切割時所會產生之各種問題，本創作係提出一種複合基材切割裝置，藉其可大幅減少切割時所產生之粉塵、提高控制精準度與系統穩定性、並且降低成本。前述本創作之目的及功效係可藉由以下所述之技術手段達成。In order to solve the above-mentioned various problems in the cutting of conventional composite substrates, the present invention proposes a composite substrate cutting device, by which the dust generated during cutting can be greatly reduced, the control accuracy and system stability can be improved, and reduce costs. The aforementioned purpose and effect of this creation can be achieved by the technical means described below.

本創作所提出之複合基材切割裝置包含一機台、一輸送模組、一雷射模組、一切割模組以及一控制模組。其中，該機台定義有一X軸方向、一Y軸方向及一Z軸方向；該輸送模組係設置於該機台並沿著該X軸方向輸送；該雷射模組包含位於該輸送模組上方之一第一雷射源、一第一雷射頭及一第一反光鏡，該第一雷射源係設置於該機台並包含一第一雷射光入射方向，該第一雷射頭係滑設於該機台並沿著該Y軸方向滑動、並包含一第一雷射光出射方向，該第一雷射光出射方向並對應朝向該輸送模組，該第一反光鏡係設置於該第一雷射頭內並對應於該第一雷射光入射方向與該第一雷射光出射方向之間反射；該切割模組係設置於該機台並包含位於該輸送模組上方之一第一刀件，該第一刀件並沿著該Z軸方向朝向該輸送模組進給；該控制模組係電性連接於該輸送模組、該雷射模組及該切割模組。The composite substrate cutting device proposed in this creation includes a machine, a conveying module, a laser module, a cutting module and a control module. Wherein, the machine table defines an X-axis direction, a Y-axis direction and a Z-axis direction; the conveying module is arranged on the machine table and conveys along the X-axis direction; the laser module includes a position in the conveying mold A first laser source, a first laser head and a first reflector above the group, the first laser source is arranged on the machine and includes a first incident direction of laser light, the first laser The head is slidably arranged on the machine table and slid along the Y-axis direction, and includes a first laser light outgoing direction, the first laser light outgoing direction is correspondingly facing the conveying module, and the first reflecting mirror is arranged on The inside of the first laser head corresponds to the reflection between the incident direction of the first laser light and the outgoing direction of the first laser light; the cutting module is set on the machine and includes a first laser positioned above the conveying module A blade, the first blade is fed toward the conveying module along the Z-axis direction; the control module is electrically connected to the conveying module, the laser module and the cutting module.

在對複合基材進行切割時，係先利用該雷射模組以雷射方式加熱而使複合基材軟化，之後再利用該切割模組對複合基材進行切割。如此採用先加熱後裁切之方式，可大幅減少切割時所產生之粉塵；另外，藉由雷射方式加熱可大幅減少在複合基材上之熱影響區之範圍，相對能精確控制熱影響之程度，亦即可提高控制精準度；又，藉由雷射加熱軟化後再切割之方式相較於傳統直接以雷射加工進行切割之方式而言，成本可降低，且可提高系統穩定性。When cutting the composite base material, the laser module is used to heat the composite base material in a laser manner to soften the composite base material, and then the cutting module is used to cut the composite base material. In this way, the method of heating first and then cutting can greatly reduce the dust generated during cutting; in addition, heating by laser can greatly reduce the scope of the heat-affected zone on the composite substrate, which can relatively accurately control the heat-affected zone. Compared with the traditional method of cutting directly by laser processing, the cost can be reduced and the system stability can be improved.

可選擇地，於一非限制性的例示實施態樣中，該控制模組更包含一補償機制。於設計上，前述之該補償機制包含一二次曲線函數；或者，該補償機制包含一預先設定函數；當然並不以此為限。Optionally, in a non-limiting exemplary implementation, the control module further includes a compensation mechanism. In terms of design, the aforementioned compensation mechanism includes a quadratic curve function; or, the compensation mechanism includes a preset function; of course, it is not limited thereto.

可選擇地，於一非限制性的例示實施態樣中，該機台更包含一機架，且該第一雷射頭係滑設於該機台之該機架並沿著該Y軸方向滑動。Optionally, in a non-limiting exemplary embodiment, the machine further includes a frame, and the first laser head is slidably disposed on the frame of the machine and along the Y-axis direction slide.

可選擇地，於一非限制性的例示實施態樣中，該複合基材切割裝置更包含至少一吸氣模組，其係設置於該機台與該雷射模組之至少其中一者並電性連接於該控制模組。於設計上，前述之該至少一吸氣模組係固定不動地設置於該機台；或者，該至少一吸氣模組係設置於該雷射模組之該第一雷射頭並隨該第一雷射頭沿著該Y軸方向滑動；當然並不以此為限。Optionally, in a non-limiting exemplary embodiment, the composite substrate cutting device further includes at least one suction module, which is disposed in parallel with at least one of the machine and the laser module. It is electrically connected to the control module. In terms of design, the aforementioned at least one air intake module is fixedly disposed on the machine; or, the at least one air intake module is disposed on the first laser head of the laser module and is associated with the The first laser head slides along the Y-axis direction; of course, it is not limited to this.

可選擇地，於一非限制性的例示實施態樣中，該第一反光鏡係樞轉設置於該第一雷射頭內並相對於該第一雷射頭轉動，亦即該第一反光鏡可調整反光角度。Optionally, in a non-limiting exemplary embodiment, the first reflection mirror is pivotally disposed in the first laser head and rotates relative to the first laser head, that is, the first reflection mirror The mirror can adjust the reflection angle.

可選擇地，於一非限制性的例示實施態樣中，該雷射模組更包含位於該輸送模組下方之一第二雷射源、一第二雷射頭及一第二反光鏡，該第二雷射源係設置於該機台並包含一第二雷射光入射方向，該第二雷射頭係滑設於該機台並沿著該Y軸方向滑動、並包含一第二雷射光出射方向，該第二雷射光出射方向並對應朝向該輸送模組，該第二反光鏡係設置於該第二雷射頭內並對應於該第二雷射光入射方向與該第二雷射光出射方向之間反射。Optionally, in a non-limiting exemplary embodiment, the laser module further includes a second laser source, a second laser head and a second reflector located below the conveying module, The second laser source is disposed on the machine and includes a second laser light incident direction, the second laser head is slidably installed on the machine and slides along the Y-axis direction, and includes a second laser The outgoing direction of the outgoing light, the outgoing direction of the second laser light is corresponding to the conveying module, the second mirror is arranged in the second laser head and corresponds to the incoming direction of the second laser light and the second laser light Reflection between outgoing directions.

可選擇地，於一非限制性的例示實施態樣中，該第二反光鏡係樞轉設置於該第二雷射頭內並相對於該第二雷射頭轉動，如同上述，該第二反光鏡可調整反光角度。Optionally, in a non-limiting exemplary embodiment, the second mirror is pivotally disposed in the second laser head and rotates relative to the second laser head, as described above, the second mirror The reflector can adjust the reflection angle.

可選擇地，於一非限制性的例示實施態樣中，該切割模組更包含位於該輸送模組下方之一第二刀件，該第二刀件並沿著該Z軸方向朝向該輸送模組進給。Optionally, in a non-limiting exemplary embodiment, the cutting module further includes a second blade located below the conveying module, the second blade facing the conveying along the Z-axis direction module feed.

可選擇地，於一非限制性的例示實施態樣中，該輸送模組沿著該X軸方向輸送有一複合基材，且該複合基材係由一樹酯及一不織布所組成；或者，該複合基材係為一具有含膠量之複合基材；或者，該複合基材係為一脆性複合基材；或者，該複合基材係為一非金屬複合基材；當然並不以此為限。Optionally, in a non-limiting exemplary embodiment, the conveying module conveys a composite substrate along the X-axis direction, and the composite substrate is composed of a resin and a non-woven fabric; or, the The composite substrate is a composite substrate with glue content; or, the composite substrate is a brittle composite substrate; or, the composite substrate is a non-metallic composite substrate; of course, this does not mean limit.

可選擇地，於一非限制性的例示實施態樣中，該輸送模組包含複數個輸送滾輪；或者輸送帶；當然並不以此為限。Optionally, in a non-limiting exemplary embodiment, the conveying module includes a plurality of conveying rollers; or conveying belts; of course, it is not limited thereto.

以下配合隨附圖式，以較佳具體實施例之表達方式進一步說明本創作之技術內容及其所具有之優點和所能達成之功效，惟其目的僅是用於說明以利於更加瞭解，而非用於限制。The technical content of the present creation, its advantages and achievable effects are further described below in the form of preferred specific embodiments in conjunction with the accompanying drawings, but its purpose is only for illustration to facilitate better understanding, not for used for restriction.

請同時參照第1圖及第2圖，其中之第1圖係為本創作第一較佳具體實施例之立體圖，第2圖係為本創作第一較佳具體實施例之作動示意圖之一。於第1圖及第2圖中顯示有一複合基材切割裝置1，其係用於切割一複合基材9，此複合基材9例如由一樹酯及一不織布所組成、或者為一具有含膠量之複合基材、或者為一脆性複合基材、或者為一非金屬複合基材等，例如第2圖所示，由上下兩樹脂91夾設一纖維布92所組成。Please refer to Figure 1 and Figure 2 at the same time, wherein Figure 1 is a perspective view of the first preferred embodiment of the creation, and Figure 2 is one of the schematic diagrams of the operation of the first preferred embodiment of the creation. Figures 1 and 2 show a composite substrate cutting device 1, which is used for cutting a composite substrate 9. The composite substrate 9 is, for example, composed of a resin and a non-woven fabric, or a The amount of composite substrate, or a brittle composite substrate, or a non-metallic composite substrate, etc., for example, as shown in Figure 2, is composed of a fiber cloth 92 sandwiched between two resins 91 up and down.

再如第1圖及第2圖所示，複合基材切割裝置1包含一機台2、一輸送模組3、一雷射模組4、一切割模組5以及一控制模組6。其中，機台2定義有一座標系統，亦即機台2定義有一X軸方向21、一Y軸方向22及一Z軸方向23。此外，輸送模組3係設置於機台2並沿著X軸方向21輸送，亦即輸送模組3係沿著X軸方向21輸送複合基材9。另於本實施例中，輸送模組3包含複數個輸送滾輪31，當然，輸送模組3亦可為輸送帶。As shown in FIGS. 1 and 2 , the composite substrate cutting device 1 includes a machine 2 , a conveying module 3 , a laser module 4 , a cutting module 5 and a control module 6 . The machine table 2 defines a coordinate system, that is, the machine table 2 defines an X-axis direction 21 , a Y-axis direction 22 and a Z-axis direction 23 . In addition, the conveying module 3 is arranged on the machine table 2 and conveys along the X-axis direction 21 , that is, the conveying module 3 conveys the composite substrate 9 along the X-axis direction 21 . In addition, in this embodiment, the conveying module 3 includes a plurality of conveying rollers 31. Of course, the conveying module 3 can also be a conveying belt.

另外，圖式中之雷射模組4包含一第一雷射源41、一第一雷射頭42及一第一反光鏡43，第一雷射源41、第一雷射頭42及第一反光鏡43係位於輸送模組3上方，亦即當輸送模組3沿著X軸方向21輸送複合基材9時，第一雷射源41、第一雷射頭42及第一反光鏡43亦會位於複合基材9上方。再者，第一雷射源41係設置於機台2並包含一第一雷射光入射方向411，第一雷射頭42係滑設於機台2並沿著Y軸方向22滑動（如第1圖之箭號所示）、並包含一第一雷射光出射方向421，第一雷射光出射方向421並對應朝向輸送模組3，第一反光鏡43係設置於第一雷射頭42內並對應於第一雷射光入射方向411與第一雷射光出射方向421之間反射。In addition, the laser module 4 in the figure includes a first laser source 41 , a first laser head 42 and a first reflector 43 , the first laser source 41 , the first laser head 42 and the first A reflecting mirror 43 is located above the conveying module 3 , that is, when the conveying module 3 conveys the composite substrate 9 along the X-axis direction 21 , the first laser source 41 , the first laser head 42 and the first reflecting mirror 43 would also be located above the composite substrate 9 . Furthermore, the first laser source 41 is disposed on the machine table 2 and includes a first laser light incident direction 411 , and the first laser head 42 is slidably disposed on the machine table 2 and slides along the Y-axis direction 22 (eg, the 1), and includes a first laser light outgoing direction 421 , the first laser light outgoing direction 421 corresponds to the conveying module 3 , and the first reflecting mirror 43 is disposed in the first laser head 42 It corresponds to the reflection between the first laser light incident direction 411 and the first laser light exit direction 421 .

於本實施例中，機台2更包含一機架24，且第一雷射頭42係滑設於此機架24並沿著Y軸方向22滑動，例如第一雷射頭42以滑塊241、線軌242之結構滑設於機架24。In this embodiment, the machine 2 further includes a frame 24, and the first laser head 42 is slidably mounted on the frame 24 and slid along the Y-axis direction 22. For example, the first laser head 42 is slid with a slider. 241 . The structure of the wire rail 242 is slidably arranged on the frame 24 .

再由第1圖及第2圖可知，切割模組5係設置於機台2並包含位於輸送模組3上方之一第一刀件51，此第一刀件51並沿著Z軸方向23朝向輸送模組3進給，如圖所示，第一刀件51於本實施例中係為一裁刀之形式。另外，如同上述，當輸送模組3沿著X軸方向21輸送複合基材9時，第一刀件51亦會位於複合基材9上方。又，控制模組6係電性連接於上述之輸送模組3、雷射模組4及切割模組5。It can be seen from Figures 1 and 2 that the cutting module 5 is disposed on the machine table 2 and includes a first blade 51 located above the conveying module 3. The first blade 51 is along the Z-axis direction 23. Feeding toward the conveying module 3, as shown in the figure, the first blade 51 is in the form of a cutter in this embodiment. In addition, as described above, when the conveying module 3 conveys the composite substrate 9 along the X-axis direction 21 , the first blade 51 will also be located above the composite substrate 9 . In addition, the control module 6 is electrically connected to the above-mentioned conveying module 3 , the laser module 4 and the cutting module 5 .

當要使用複合基材切割裝置1進行複合基材9之切割時，輸送模組3係沿著X軸方向21輸送複合基材9至一定位，亦即輸送模組3係輸送複合基材9以使複合基材9之欲切割之位置對齊於第一雷射頭42之第一雷射光出射方向421。之後，如第2圖所示，第一雷射源41以第一雷射光入射方向411發射雷射光入射至第一反光鏡43，第一反光鏡43反射雷射光並使得雷射光以第一雷射光出射方向421出射至位於輸送模組3上之複合基材9，此時，雷射光會使複合基材9之欲切割之位置加熱軟化，如第2圖之A部分所示，且如第1圖所示，第一雷射頭42沿著Y軸方向22滑動，因而雷射光會在複合基材9上形成一條加熱軟化的線條。When the composite substrate cutting device 1 is used to cut the composite substrate 9 , the conveying module 3 conveys the composite substrate 9 to a certain position along the X-axis direction 21 , that is, the conveying module 3 conveys the composite substrate 9 The position where the composite substrate 9 is to be cut is aligned with the first laser light emitting direction 421 of the first laser head 42 . Afterwards, as shown in FIG. 2 , the first laser source 41 emits laser light in the first laser light incident direction 411 and is incident on the first mirror 43 . The first mirror 43 reflects the laser light and makes the laser light as the first laser The outgoing direction 421 of the emitted light is emitted to the composite substrate 9 located on the conveying module 3. At this time, the laser light will heat and soften the position of the composite substrate 9 to be cut, as shown in part A of FIG. 2, and as shown in the first As shown in FIG. 1 , the first laser head 42 slides along the Y-axis direction 22 , so that the laser light will form a heated and softened line on the composite substrate 9 .

請參照第3圖，其係為本創作第一較佳具體實施例之作動示意圖之二。當以雷射光加熱軟化複合基材9所欲切割之位置後，輸送模組3係再沿著X軸方向21輸送複合基材9，如第3圖以箭號示意輸送滾輪31轉動，使得已加熱軟化之欲切割位置（A部分）位於第一刀件51下方。Please refer to FIG. 3 , which is the second schematic diagram of the operation of the first preferred embodiment of the present creation. After heating and softening the position of the composite substrate 9 to be cut by the laser light, the conveying module 3 conveys the composite substrate 9 along the X-axis direction 21. As shown in FIG. The desired cutting position (part A) for heating and softening is located below the first blade 51 .

請參照第4圖，其係為本創作第一較佳具體實施例之作動示意圖之三。當複合基材9之已加熱軟化之欲切割位置（A部分）經輸送而位於第一刀件51下方時，第一刀件51係沿著Z軸方向23朝向輸送模組3進給，並因此對複合基材9之已加熱軟化之欲切割位置（A部分）進行切割，如第4圖箭號所示。Please refer to FIG. 4 , which is the third schematic diagram of the operation of the first preferred embodiment of the present creation. When the heated and softened cutting position (part A) of the composite base material 9 is conveyed and positioned below the first blade 51 , the first blade 51 is fed toward the conveying module 3 along the Z-axis direction 23 , and Therefore, the cutting position (part A) of the composite base material 9 that has been softened by heating is cut, as shown by the arrow in FIG. 4 .

請再同時參閱第1圖至第4圖，如上所述，於切割複合基材9時，係先利用雷射模組4之第一雷射源41照射雷射光，並經第一反光鏡43反射而照射至複合基材9，使得複合基材9之欲切割位置加熱軟化，之後再利用切割模組5之第一刀件51朝向複合基材9之已加熱軟化之切割位置進行切割即可。Please refer to FIG. 1 to FIG. 4 at the same time. As mentioned above, when cutting the composite substrate 9 , the first laser source 41 of the laser module 4 is used to irradiate the laser light, and the first reflection mirror 43 is used to irradiate the laser light. Reflect and irradiate the composite substrate 9 to heat and soften the desired cutting position of the composite substrate 9, and then use the first blade 51 of the cutting module 5 to cut toward the heated and softened cutting position of the composite substrate 9. .

如此，採用先加熱後裁切之方式，可大幅減少切割時所產生之粉塵。此外，以雷射光加熱軟化複合基材9之作法，可大幅減少複合基材9上熱影響區之範圍（例如雷射光會聚焦在設定位置而不會影響到過大範圍之區域），相對能精確控制複合基材9熱影響之程度，亦即在複合基材9之切割作業上可提高控制精準度。另外，相較於傳統直接以雷射加工方式進行切割，上述以雷射光使複合基材9加熱軟化後再切割之方式可大幅降低成本，在系統穩定性上亦可大幅提高。In this way, the method of heating first and then cutting can greatly reduce the dust generated during cutting. In addition, the method of heating and softening the composite substrate 9 by the laser light can greatly reduce the range of the heat-affected zone on the composite substrate 9 (for example, the laser light will focus on the set position without affecting the area with an excessively large area), which is relatively accurate. The degree of thermal influence of the composite substrate 9 is controlled, that is, the control precision can be improved in the cutting operation of the composite substrate 9 . In addition, compared with the traditional direct cutting by laser processing, the above method of heating and softening the composite substrate 9 with laser light before cutting can greatly reduce the cost and greatly improve the system stability.

請參照第5圖，其係為本創作第二較佳具體實施例之作動示意圖。於本實施例中，其主要結構皆與上述第一較佳具體實施例相同，唯差別在於第一反光鏡43係樞轉設置於第一雷射頭42內並相對於第一雷射頭42轉動。換言之，當第一雷射頭42以及其內所設置之第一反光鏡43滑動時，因為第一雷射頭42以及其內所設置之第一反光鏡43相對於第一雷射源41之距離會產生變化，相對使得第一雷射源41所照射之雷射光在經由第一反光鏡43反射時亦因此產生角度變化，此時即可利用第一反光鏡43之轉動來補償此角度變化。Please refer to FIG. 5 , which is a schematic diagram of the operation of the second preferred embodiment of the present invention. In this embodiment, the main structures thereof are the same as those in the above-mentioned first preferred embodiment, the only difference is that the first reflecting mirror 43 is pivotally arranged in the first laser head 42 and is opposite to the first laser head 42 turn. In other words, when the first laser head 42 and the first reflection mirror 43 disposed therein slide, because the first laser head 42 and the first reflection mirror 43 disposed therein are relative to the first laser source 41 The distance will change, and the angle of the laser light irradiated by the first laser source 41 will also change when reflected by the first reflector 43 . At this time, the rotation of the first reflector 43 can be used to compensate for the angle change. .

請同時參照第6圖及第7圖，其中之第6圖係為本創作第三較佳具體實施例之作動示意圖，第7圖係為本創作第三較佳具體實施例之補償機制圖表，並請同時一併參照第1圖。於本實施例中，其主要結構皆與上述各較佳具體實施例相同，唯差別在於控制模組6更包含一補償機制61（如第1圖所示）。換言之，當第一雷射頭42以及其內所設置之第一反光鏡43滑動時，因為第一雷射頭42以及其內所設置之第一反光鏡43相對於第一雷射源41之距離會產生變化，相對使得第一反光鏡43接收到之第一雷射源41所照射之雷射光的能量亦會產生變化，例如第一反光鏡43較接近第一雷射頭42時，接收到之雷射光的能量會較大，第一反光鏡43遠離第一雷射頭42時，接收到之雷射光的能量會較小，如在第6圖中以較長、較短之線條來示意雷射光的能量大小。此時，即可利用補償機制61來補償此變化，例如第7圖所示，在距離0時，即第一雷射頭42以及其內所設置之第一反光鏡43與第一雷射源41鄰接時，第一雷射源41可以功率20W發射雷射光，當第一雷射頭42以及其內所設置之第一反光鏡43滑動相距第一雷射源41至距離50（例如公分）時，因距離變遠，雷射光可提高以功率28W發射雷射光，依此類推，距離70（例如公分）時，雷射光可再提高以功率32W發射雷射光，距離100（例如公分）時，雷射光可再提高以功率40W發射雷射光，如此使得第一雷射源41所發射之雷射光在第一雷射頭42以及其內所設置之第一反光鏡43滑動至不同距離之情況下仍可很穩定地以固定的能量照射至複合基材9。Please refer to Fig. 6 and Fig. 7 at the same time, wherein Fig. 6 is a schematic diagram of the operation of the third preferred embodiment of the creation, and Fig. 7 is a compensation mechanism diagram of the third preferred embodiment of the creation. Please also refer to Figure 1 at the same time. In this embodiment, the main structures thereof are the same as those of the above-mentioned preferred embodiments, and the only difference is that the control module 6 further includes a compensation mechanism 61 (as shown in FIG. 1 ). In other words, when the first laser head 42 and the first reflection mirror 43 disposed therein slide, because the first laser head 42 and the first reflection mirror 43 disposed therein are relative to the first laser source 41 The distance will change, and the energy of the laser light irradiated by the first laser source 41 received by the first reflecting mirror 43 will also change. For example, when the first reflecting mirror 43 is closer to the first laser head 42, the receiving The energy of the received laser light will be larger. When the first reflector 43 is far away from the first laser head 42, the energy of the received laser light will be smaller. Indicates the energy of the laser light. At this time, the compensation mechanism 61 can be used to compensate for this change. For example, as shown in FIG. 7, when the distance is 0, that is, the first laser head 42, the first reflector 43 disposed therein, and the first laser source When 41 are adjacent to each other, the first laser source 41 can emit laser light with a power of 20W. When the first laser head 42 and the first reflector 43 set in it slide away from the first laser source 41 to a distance of 50 (for example, cm) When the distance becomes farther, the laser light can be increased to emit laser light with a power of 28W, and so on. When the distance is 70 (such as cm), the laser light can be further increased to emit laser light with a power of 32W, and when the distance is 100 (such as cm), The laser light can be further increased to emit laser light with a power of 40W, so that the laser light emitted by the first laser source 41 slides to different distances when the first laser head 42 and the first reflector 43 disposed therein slide to different distances. The composite substrate 9 can still be irradiated with a fixed energy very stably.

上述之補償機制61可包含一二次曲線函數，例如ax ²+bx+c或 ax ²+c等，當然並不以此為限。此外，上述之補償機制61亦可包含一預先設定函數，例如由使用者直接輸入一預先設定函數，例如前述之ax ²+bx+c或 ax ²+c等，而前述之預先設定函數可由使用者經不斷實驗（如利用試誤法（try and error））而得，舉例而言，在實驗時，可先依照起始點之最佳加熱及切割得到一個最佳的切割加熱數據值，並形成一第一數據，之後依照最終點之最佳加熱及切割得到一個最佳的切割加熱數據值，並形成一第二數據，然後依照第一數據和第二數據之間得到不同距離間複數個檢測點之最佳的切割加熱數據值，並形成一第三數據，再依照第一數據、第二數據以及第三數據而得到一個檢測線，最後，當機台實際作業所檢測到之數據與檢測線做比較，即可得到補償之參數，而其最佳值可依照材料本身的厚度、材質以及加熱切割所得到綜合的結果。 The above compensation mechanism 61 may include a quadratic curve function, such as ax ² +bx+c or ax ² +c, etc., of course, it is not limited thereto. In addition, the aforementioned compensation mechanism 61 may also include a preset function, such as a preset function directly input by the user, such as the aforementioned ax ² +bx+c or ax ² +c, etc., and the aforementioned preset function can be used It is obtained through continuous experiments (such as using the trial and error method). For example, in the experiment, an optimal cutting heating data value can be obtained first according to the optimal heating and cutting at the starting point, and then A first data is formed, and then an optimal cutting heating data value is obtained according to the optimal heating and cutting of the final point, and a second data is formed, and then a plurality of different distances are obtained according to the first data and the second data. The best cutting and heating data value of the detection point is formed to form a third data, and then a detection line is obtained according to the first data, the second data and the third data. Finally, when the actual operation of the machine detects the data and Compensation parameters can be obtained by comparing the detection lines, and the optimal value can be obtained according to the thickness of the material itself, the material itself, and the comprehensive results obtained by heating and cutting.

請參照第8圖，其係為本創作第四較佳具體實施例之立體圖。於本實施例中，其主要結構皆與上述各較佳具體實施例相同，唯差別在於第一雷射源（請參照第2圖）、第一雷射頭42及第一反光鏡（請參照第2圖）具有三組，換言之，前述結構之數量可視實際需要而變化，且同樣可達成上述之各種功效。Please refer to FIG. 8 , which is a perspective view of the fourth preferred embodiment of the present invention. In this embodiment, the main structures are the same as the above preferred embodiments, the only difference is the first laser source (please refer to FIG. 2), the first laser head 42 and the first reflector (please refer to FIG. 2). Figure 2) has three groups, in other words, the number of the aforementioned structures can be changed according to actual needs, and the above-mentioned various effects can also be achieved.

請參照第9圖，其係為本創作第五較佳具體實施例之立體圖。於本實施例中，其主要結構皆與上述各較佳具體實施例相同，唯差別在於切割模組5之第一刀件51係為一圓刀之形式，而此設計方式同樣可達成上述之各種功效。Please refer to FIG. 9 , which is a perspective view of a fifth preferred embodiment of the present invention. In this embodiment, the main structure is the same as the above-mentioned preferred embodiments, the only difference is that the first blade 51 of the cutting module 5 is in the form of a circular blade, and this design method can also achieve the above-mentioned various effect.

請參照第10圖，其係為本創作第六較佳具體實施例之立體圖。如同第9圖之第五較佳具體實施例所示，本實施例之第一刀件51亦為圓刀之形式，但數量變更，而如此之設計方式同樣可達成上述之各種功效。Please refer to FIG. 10, which is a perspective view of the sixth preferred embodiment of the present invention. As shown in the fifth preferred embodiment in FIG. 9, the first blade 51 of this embodiment is also in the form of a round blade, but the number is changed, and such a design method can also achieve the above-mentioned various effects.

請參照第11圖，其係為本創作第七較佳具體實施例之立體圖。其主要結構皆與上述各較佳具體實施例相同，唯差別在於複合基材切割裝置1更包含至少一吸氣模組8，其係電性連接於控制模組6，而此至少一吸氣模組8係可用於吸取因雷射光照射所產生之氣體。Please refer to FIG. 11, which is a perspective view of the seventh preferred embodiment of the present invention. Its main structure is the same as the above-mentioned preferred embodiments, the only difference is that the composite substrate cutting device 1 further includes at least one air suction module 8, which is electrically connected to the control module 6, and the at least one air suction module 8 is electrically connected to the control module 6. Module 8 can be used to absorb gas generated by laser irradiation.

如第11圖所示，於本實施例中，吸氣模組8係固定不動地設置於機台2，且吸氣模組8係有兩組並分別設置於雷射位置之兩側，並分別藉由吸氣口82與吸氣管線81吸取因雷射光照射所產生之氣體。As shown in FIG. 11, in this embodiment, the suction module 8 is fixedly arranged on the machine table 2, and there are two sets of suction modules 8, which are respectively arranged on both sides of the laser position, and The gas generated by the irradiation of the laser light is sucked through the suction port 82 and the suction line 81 respectively.

請參照第12圖，其係為本創作第八較佳具體實施例之立體圖。於本實施例中顯示複合基材切割裝置1（請參照第11圖）同樣包含一吸氣模組8，其係電性連接於控制模組6（請參照第11圖），且吸氣模組8係設置於雷射模組4之第一雷射頭42並隨第一雷射頭42沿著Y軸方向22（請參照第1圖所示之座標系統）滑動，如第12圖之箭號所示。換言之，雷射模組4作動時可同時以吸氣模組8進行氣體之吸取。Please refer to FIG. 12 , which is a perspective view of the eighth preferred embodiment of the present invention. In this embodiment, it is shown that the composite substrate cutting device 1 (please refer to FIG. 11 ) also includes a suction module 8 , which is electrically connected to the control module 6 (please refer to FIG. 11 ), and the suction module 8 is The group 8 is disposed on the first laser head 42 of the laser module 4 and slides along the Y-axis direction 22 (please refer to the coordinate system shown in FIG. 1 ) with the first laser head 42 , as shown in FIG. 12 . indicated by arrows. In other words, when the laser module 4 is actuated, the gas suction module 8 can simultaneously absorb the gas.

由第11圖及第12圖所示之實施例可知，吸氣模組8可設置於機台2或雷射模組4，但並不以此為限，例如機台2與雷射模組4可同時設置有吸氣模組8，且數量亦不限制，以更加提高氣體之吸取效果。It can be seen from the embodiments shown in FIGS. 11 and 12 that the suction module 8 can be disposed in the machine 2 or the laser module 4, but not limited to this, for example, the machine 2 and the laser module 4. A suction module 8 can be provided at the same time, and the number is not limited, so as to further improve the suction effect of the gas.

請參照第13圖，其係為本創作第九較佳具體實施例之配置示意圖。於本實施例中，係再於輸送模組3下方增加設置一第二雷射源44、一第二雷射頭45、一第二反光鏡46及一第二刀件52。詳言之，雷射模組4更包含位於輸送模組3下方之一第二雷射源44、一第二雷射頭45及一第二反光鏡46，同樣的，第二雷射源44係設置於機台2（請參照第1圖）並包含一第二雷射光入射方向441，第二雷射頭45係滑設於機台2並沿著Y軸方向22（請參照第1圖所示之座標系統）滑動、並包含一第二雷射光出射方向451，第二雷射光出射方向451並對應朝向輸送模組3，第二反光鏡46係設置於第二雷射頭45內並對應於第二雷射光入射方向441與第二雷射光出射方向451之間反射；切割模組5更包含位於輸送模組3下方之一第二刀件52，第二刀件52並沿著Z軸方向23（請參照第1圖所示之座標系統）朝向輸送模組3進給。Please refer to FIG. 13, which is a schematic configuration diagram of the ninth preferred embodiment of the present invention. In this embodiment, a second laser source 44 , a second laser head 45 , a second reflector 46 and a second blade 52 are additionally disposed below the conveying module 3 . Specifically, the laser module 4 further includes a second laser source 44 , a second laser head 45 and a second mirror 46 located below the conveying module 3 . Similarly, the second laser source 44 The second laser head 45 is slidably arranged on the machine 2 and along the Y-axis direction 22 (please refer to the first figure) The coordinate system shown) slides and includes a second laser light outgoing direction 451, the second laser light outgoing direction 451 is correspondingly facing the conveying module 3, and the second reflecting mirror 46 is disposed in the second laser head 45 and Corresponding to the reflection between the second laser light incident direction 441 and the second laser light exit direction 451; the cutting module 5 further includes a second blade 52 located under the conveying module 3, and the second blade 52 extends along the Z direction. The axis direction 23 (please refer to the coordinate system shown in Figure 1) is fed toward the conveying module 3.

如上所述，藉由於輸送模組3下方增加設置之第二雷射源44、第二雷射頭45、第二反光鏡46及第二刀件52，使得複合基材9可同時從上面與下面進行雷射加熱軟化並切割，藉以更加提高切割效果。As described above, by adding the second laser source 44 , the second laser head 45 , the second reflector 46 and the second blade 52 under the conveying module 3 , the composite substrate 9 can be simultaneously attached to the composite substrate 9 from above. Next, the laser is heated to soften and cut, so as to further improve the cutting effect.

另欲說明，位於輸送模組3上方之第一雷射頭42、第一反光鏡43及第一刀件51與位於輸送模組3下方之第二雷射頭45、第二反光鏡46及第二刀件52可形成錯位設置，亦即複合基材9可同時從上面與從下面切割不同位置。For further explanation, the first laser head 42 , the first reflecting mirror 43 and the first blade 51 located above the conveying module 3 and the second laser head 45 , the second reflecting mirror 46 and the second laser head 45 , the second reflecting mirror 46 and The second blade 52 can be formed in a staggered arrangement, that is, the composite substrate 9 can be cut at different positions from above and from below at the same time.

另外，如同第5圖所示之實施例，於第13圖所示之實施例中，第二反光鏡46亦可以樞轉方式設置於第二雷射頭45內並相對於第二雷射頭45轉動，藉以補償反光角度變化。In addition, like the embodiment shown in FIG. 5, in the embodiment shown in FIG. 13, the second reflector 46 can also be pivotally disposed in the second laser head 45 relative to the second laser head 45 to compensate for the angle of reflection.

以上所述僅為本創作的較佳具體實施例，其並不用以限制本創作，凡在本創作的精神和原則之內，所作的任何修改、等同替換、改進等，均應包含在本創作的保護範圍之內。The above are only preferred specific embodiments of this creation, and are not intended to limit this creation. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of this creation shall be included in this creation. within the scope of protection.

1:複合基材切割裝置 2:機台 21:X軸方向 22:Y軸方向 23:Z軸方向 24:機架 241:滑塊 242:線軌 3:輸送模組 31:輸送滾輪 4:雷射模組 41:第一雷射源 411:第一雷射光入射方向 42:第一雷射頭 421:第一雷射光出射方向 43:第一反光鏡 44:第二雷射源 441:第二雷射光入射方向 45:第二雷射頭 451:第二雷射光出射方向 46:第二反光鏡 5:切割模組 51:第一刀件 52:第二刀件 6:控制模組 61:補償機制 8:吸氣模組 81:吸氣管線 82:吸氣口 9:複合基材 91:樹脂 92:纖維布1: Composite substrate cutting device 2: Machine 21: X-axis direction 22: Y-axis direction 23: Z-axis direction 24: Rack 241: Slider 242: Line rail 3: Conveying module 31: Conveying rollers 4: Laser module 41: The first laser source 411: The first laser light incident direction 42: The first laser head 421: The first laser light exit direction 43: First reflector 44: Second laser source 441: Incident direction of the second laser light 45: Second laser head 451: The second laser light exit direction 46: Second reflector 5: Cutting module 51: The first knife 52: The second knife 6: Control module 61: Compensation Mechanism 8: Inhalation module 81: Suction line 82: Inhalation port 9: Composite substrate 91: Resin 92: fiber cloth

第1圖係為本創作第一較佳具體實施例之立體圖。第2圖係為本創作第一較佳具體實施例之作動示意圖之一。第3圖係為本創作第一較佳具體實施例之作動示意圖之二。第4圖係為本創作第一較佳具體實施例之作動示意圖之三。第5圖係為本創作第二較佳具體實施例之作動示意圖。第6圖係為本創作第三較佳具體實施例之作動示意圖。第7圖係為本創作第三較佳具體實施例之補償機制圖表。第8圖係為本創作第四較佳具體實施例之立體圖。第9圖係為本創作第五較佳具體實施例之立體圖。第10圖係為本創作第六較佳具體實施例之立體圖。第11圖係為本創作第七較佳具體實施例之立體圖。第12圖係為本創作第八較佳具體實施例之作動示意圖。第13圖係為本創作第九較佳具體實施例之配置示意圖。 Figure 1 is a perspective view of the first preferred embodiment of the creation. FIG. 2 is one of the schematic diagrams of the operation of the first preferred embodiment of the present invention. Figure 3 is the second schematic diagram of the operation of the first preferred embodiment of the creation. Fig. 4 is the third schematic diagram of the operation of the first preferred embodiment of the present creation. FIG. 5 is a schematic diagram of the operation of the second preferred embodiment of the creation. FIG. 6 is a schematic diagram of the operation of the third preferred embodiment of the creation. FIG. 7 is a diagram of the compensation mechanism of the third preferred embodiment of the creation. FIG. 8 is a perspective view of the fourth preferred embodiment of the present invention. FIG. 9 is a perspective view of the fifth preferred embodiment of the present invention. FIG. 10 is a perspective view of the sixth preferred embodiment of the present invention. FIG. 11 is a perspective view of the seventh preferred embodiment of the present invention. FIG. 12 is a schematic diagram of the operation of the eighth preferred embodiment of the present invention. FIG. 13 is a schematic diagram of the configuration of the ninth preferred embodiment of the present invention.

1:複合基材切割裝置 1: Composite substrate cutting device

2:機台 2: Machine

21:X軸方向 21: X-axis direction

22:Y軸方向 22: Y-axis direction

23:Z軸方向 23: Z-axis direction

24:機架 24: Rack

241:滑塊 241: Slider

242:線軌 242: Line rail

3:輸送模組 3: Conveying module

31:輸送滾輪 31: Conveying rollers

4:雷射模組 4: Laser module

42:第一雷射頭 42: The first laser head

421:第一雷射光出射方向 421: The first laser light exit direction

5:切割模組 5: Cutting module

51:第一刀件 51: The first knife

6:控制模組 6: Control module

61:補償機制 61: Compensation Mechanism

9:複合基材 9: Composite substrate

91:樹脂 91: Resin

92:纖維布 92: fiber cloth

Claims

一種複合基材切割裝置，包含：一機台(2)，定義有一X軸方向(21)、一Y軸方向(22)及一Z軸方向(23)；一輸送模組(3)，係設置於該機台(2)並沿著該X軸方向(21)輸送；一雷射模組(4)，包含位於該輸送模組(3)上方之一第一雷射源(41)、一第一雷射頭(42)及一第一反光鏡(43)，該第一雷射源(41)係設置於該機台(2)並包含一第一雷射光入射方向(411)，該第一雷射頭(42)係滑設於該機台(2)並沿著該Y軸方向(22)滑動、並包含一第一雷射光出射方向(421)，該第一雷射光出射方向(421)並對應朝向該輸送模組(3)，該第一反光鏡(43)係設置於該第一雷射頭(42)內並對應於該第一雷射光入射方向(411)與該第一雷射光出射方向(421)之間反射；一切割模組(5)，係設置於該機台(2)並包含位於該輸送模組(3)上方之一第一刀件(51)，該第一刀件(51)並沿著該Z軸方向(23)朝向該輸送模組(3)進給；以及一控制模組(6)，係電性連接於該輸送模組(3)、該雷射模組(4)及該切割模組(5)。 A composite substrate cutting device, comprising: a machine table (2), defining an X-axis direction (21), a Y-axis direction (22) and a Z-axis direction (23); a conveying module (3), which is arranged on the machine table (2) and conveys along the X-axis direction (21); A laser module (4), comprising a first laser source (41), a first laser head (42) and a first reflector (43) located above the conveying module (3), the The first laser source (41) is arranged on the machine (2) and includes a first incident direction (411) of laser light, and the first laser head (42) is slidably arranged on the machine (2) and Sliding along the Y-axis direction (22), and including a first laser light exit direction (421), the first laser light exit direction (421) and corresponding to the conveying module (3), the first reflection mirror (43) is disposed in the first laser head (42) and corresponds to the reflection between the first laser light incident direction (411) and the first laser light exit direction (421); A cutting module (5) is arranged on the machine table (2) and includes a first blade (51) located above the conveying module (3), the first blade (51) extending along the The Z-axis direction (23) is fed towards the conveying module (3); and A control module (6) is electrically connected to the conveying module (3), the laser module (4) and the cutting module (5).

如請求項1所述之複合基材切割裝置，其中該控制模組(6)更包含一補償機制(61)。The composite substrate cutting device according to claim 1, wherein the control module (6) further comprises a compensation mechanism (61).

如請求項2所述之複合基材切割裝置，其中該補償機制(61) 包含一二次曲線函數。The composite substrate cutting device as claimed in claim 2, wherein the compensation mechanism (61) comprises a quadratic curve function.

如請求項2所述之複合基材切割裝置，其中該補償機制(61) 包含一預先設定函數。The composite substrate cutting device as claimed in claim 2, wherein the compensation mechanism (61) includes a predetermined function.

如請求項1所述之複合基材切割裝置，其中該機台(2)更包含一機架(24)，且該第一雷射頭(42)係滑設於該機台(2)之該機架(24)並沿著該Y軸方向(22)滑動。The composite substrate cutting device according to claim 1, wherein the machine (2) further comprises a frame (24), and the first laser head (42) is slidably arranged on the machine (2) The frame (24) slides along the Y-axis direction (22).

如請求項1所述之複合基材切割裝置，其中更包含至少一吸氣模組(8)，其係設置於該機台(2)與該雷射模組(4)之至少其中一者並電性連接於該控制模組(6)。The composite substrate cutting device as claimed in claim 1, further comprising at least one suction module (8), which is disposed at at least one of the machine (2) and the laser module (4) and is electrically connected to the control module (6).

如請求項6所述之複合基材切割裝置，其中該至少一吸氣模組(8)係固定不動地設置於該機台(2)。The composite substrate cutting device according to claim 6, wherein the at least one suction module (8) is fixedly arranged on the machine table (2).

如請求項6所述之複合基材切割裝置，其中該至少一吸氣模組(8)係設置於該雷射模組(4)之該第一雷射頭(42)並隨該第一雷射頭(42)沿著該Y軸方向(22)滑動。The composite substrate cutting device as claimed in claim 6, wherein the at least one air suction module (8) is arranged on the first laser head (42) of the laser module (4) and follows the first laser head (42) of the laser module (4). The laser head (42) slides along the Y-axis direction (22).

如請求項1所述之複合基材切割裝置，其中該第一反光鏡(43)係樞轉設置於該第一雷射頭(42)內並相對於該第一雷射頭(42)轉動。The composite substrate cutting device according to claim 1, wherein the first reflector (43) is pivotally arranged in the first laser head (42) and rotates relative to the first laser head (42) .

如請求項1所述之複合基材切割裝置，其中該雷射模組(4)更包含位於該輸送模組(3)下方之一第二雷射源(44)、一第二雷射頭(45)及一第二反光鏡(46)，該第二雷射源(44)係設置於該機台(2)並包含一第二雷射光入射方向(441)，該第二雷射頭(45)係滑設於該機台(2)並沿著該Y軸方向(22)滑動、並包含一第二雷射光出射方向(451)，該第二雷射光出射方向(451)並對應朝向該輸送模組(3)，該第二反光鏡(46)係設置於該第二雷射頭(45)內並對應於該第二雷射光入射方向(441)與該第二雷射光出射方向(451)之間反射。The composite substrate cutting device according to claim 1, wherein the laser module (4) further comprises a second laser source (44) and a second laser head located below the conveying module (3) (45) and a second reflector (46), the second laser source (44) is arranged on the machine (2) and includes a second laser light incident direction (441), the second laser head (45) is slidably arranged on the machine table (2) and slides along the Y-axis direction (22), and includes a second laser light exit direction (451), and the second laser light exit direction (451) corresponds to Facing the conveying module (3), the second reflector (46) is disposed in the second laser head (45) and corresponds to the second laser light incident direction (441) and the second laser light exits Reflection between directions (451).

如請求項10所述之複合基材切割裝置，其中該第二反光鏡(46)係樞轉設置於該第二雷射頭(45)內並相對於該第二雷射頭(45)轉動。The composite substrate cutting device according to claim 10, wherein the second mirror (46) is pivotally arranged in the second laser head (45) and rotates relative to the second laser head (45) .

如請求項10所述之複合基材切割裝置，其中該切割模組(5)更包含位於該輸送模組(3)下方之一第二刀件(52)，該第二刀件(52)並沿著該Z軸方向(23)朝向該輸送模組(3)進給。The composite substrate cutting device according to claim 10, wherein the cutting module (5) further comprises a second blade (52) located under the conveying module (3), the second blade (52) and feed toward the conveying module (3) along the Z-axis direction (23).

如請求項1所述之複合基材切割裝置，其中該輸送模組(3)沿著該X軸方向(21)輸送有一複合基材(9)，且該複合基材(9)係由一樹酯及一不織布所組成。The composite substrate cutting device according to claim 1, wherein the conveying module (3) conveys a composite substrate (9) along the X-axis direction (21), and the composite substrate (9) is made of a tree Ester and a non-woven composition.

如請求項1所述之複合基材切割裝置，其中該輸送模組(3)沿著該X軸方向(21)輸送有一複合基材(9)，且該複合基材(9)係為一具有含膠量之複合基材。The composite substrate cutting device according to claim 1, wherein the conveying module (3) conveys a composite substrate (9) along the X-axis direction (21), and the composite substrate (9) is a Composite substrate with glue content.

如請求項1所述之複合基材切割裝置，其中該輸送模組(3)沿著該X軸方向(21)輸送有一複合基材(9)，且該複合基材(9)係為一脆性複合基材。The composite substrate cutting device according to claim 1, wherein the conveying module (3) conveys a composite substrate (9) along the X-axis direction (21), and the composite substrate (9) is a Brittle composite substrates.

如請求項1所述之複合基材切割裝置，其中該輸送模組(3)沿著該X軸方向(21)輸送有一複合基材(9)，且該複合基材(9)係為一非金屬複合基材。The composite substrate cutting device according to claim 1, wherein the conveying module (3) conveys a composite substrate (9) along the X-axis direction (21), and the composite substrate (9) is a Non-metallic composite substrates.

如請求項1所述之複合基材切割裝置，其中該輸送模組(3)包含複數個輸送滾輪(31)。The composite substrate cutting device according to claim 1, wherein the conveying module (3) comprises a plurality of conveying rollers (31).

一種複合基材切割裝置，包含：一機台(2)，定義有一X軸方向(21)、一Y軸方向(22)及一Z軸方向(23)；一輸送模組(3)，係設置於該機台(2)並沿著該X軸方向(21)輸送；一雷射模組(4)，包含位於該輸送模組(3)上方之一第一雷射源(41)、一第一雷射頭(42)及一第一反光鏡(43)，該第一雷射源(41)係設置於該機台(2)並包含一第一雷射光入射方向(411)，該第一雷射頭(42)係滑設於該機台(2)並沿著該Y軸方向(22)滑動、並包含一第一雷射光出射方向(421)，該第一雷射光出射方向(421)並對應朝向該輸送模組(3)，該第一反光鏡(43)係設置於該第一雷射頭(42)內並對應於該第一雷射光入射方向(411)與該第一雷射光出射方向(421)之間反射；一切割模組(5)，係設置於該機台(2)並包含位於該輸送模組(3)上方之一第一刀件(51)，該第一刀件(51)並沿著該Z軸方向(23)朝向該輸送模組(3)進給；一控制模組(6)，係電性連接於該輸送模組(3)、該雷射模組(4)及該切割模組(5)，該控制模組(6)更包含一補償機制(61)；以及至少一吸氣模組(8)，其係設置於該機台(2)與該雷射模組(4)之至少其中一者並電性連接於該控制模組(6)。 A composite substrate cutting device, comprising: a machine table (2), defining an X-axis direction (21), a Y-axis direction (22) and a Z-axis direction (23); a conveying module (3), which is arranged on the machine table (2) and conveys along the X-axis direction (21); A laser module (4), comprising a first laser source (41), a first laser head (42) and a first reflector (43) located above the conveying module (3), the The first laser source (41) is arranged on the machine (2) and includes a first incident direction (411) of laser light, and the first laser head (42) is slidably arranged on the machine (2) and Sliding along the Y-axis direction (22), and including a first laser light exit direction (421), the first laser light exit direction (421) and corresponding to the conveying module (3), the first reflection mirror (43) is disposed in the first laser head (42) and corresponds to the reflection between the first laser light incident direction (411) and the first laser light exit direction (421); A cutting module (5) is arranged on the machine table (2) and includes a first blade (51) located above the conveying module (3), the first blade (51) extending along the The Z-axis direction (23) is fed towards the conveying module (3); A control module (6) is electrically connected to the conveying module (3), the laser module (4) and the cutting module (5), and the control module (6) further comprises a compensation mechanism (61); and At least one suction module (8) is disposed on at least one of the machine (2) and the laser module (4) and is electrically connected to the control module (6).

如請求項18所述之複合基材切割裝置，其中該補償機制(61)包含一二次曲線函數。The composite substrate cutting device of claim 18, wherein the compensation mechanism (61) includes a quadratic curve function.

如請求項18所述之複合基材切割裝置，其中該補償機制(61)包含一預先設定函數。The composite substrate cutting device of claim 18, wherein the compensation mechanism (61) includes a predetermined function.