TWM622861U

TWM622861U - Heat dissipation device

Info

Publication number: TWM622861U
Application number: TW110210035U
Authority: TW
Inventors: 陳建佑; 葉恬利
Original assignee: 雙鴻科技股份有限公司
Priority date: 2020-09-29
Filing date: 2021-08-25
Publication date: 2022-02-01
Also published as: TW202213030A; TWI818284B; CN216146638U; TWM623902U; CN215774001U; TWM617977U; CN215991705U; TWM622843U; CN216163097U

Abstract

The disclosure provides a heat dissipation device for a plurality of parallel memory modules, the heat dissipation device comprises: at least one channel unit attached on a surface of the memory module; a first housing unit provided at one end of the channel unit and had a first opening; and a second housing unit provided at the other end of the channel unit and had a second opening; wherein a working medium is filled within the first housing unit, the second housing unit and the channel unit for absorbing the heat generated by the memory modules and flowing out to the outside of the heat dissipation device for cooling.

Description

散熱裝置 heat sink

本創作涉及一種散熱裝置，尤指一種用於複數排並列之記憶體模組之散熱裝置。 The present invention relates to a heat dissipation device, especially a heat dissipation device used for a plurality of parallel rows of memory modules.

因應現代化需求，電腦與各種電子裝置發展快速且效能不斷地提昇，但在此過程中，高效能之硬體所帶來之散熱問題亦隨之而來。一般而言，電腦與各種電子裝置通常會使用散熱元件來進行散熱，例如使用散熱膏或散熱片來貼附於欲散熱之電子元件上，以將熱吸出並逸散。 In response to modern needs, computers and various electronic devices have developed rapidly and their performance has been continuously improved. However, in the process, the heat dissipation problem brought by high-performance hardware also comes along. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat. For example, heat dissipation paste or heat sinks are attached to the electronic components to be dissipated, so as to absorb and dissipate heat.

現有之記憶體模組為解決高功率不易散熱問題而採用了水冷方案，但由於記憶體模組之間的間距狹隘(例如僅7mm)，水冷方案的水管不易穿設，而有著使用者難以安裝之問題。此外，若為了便於安裝，其多採記憶體模組之單面安裝之設計，但反而造成單面散熱技術之散熱面積不足之問題。 In order to solve the problem of high power and difficult to dissipate heat, the existing memory modules adopt a water-cooling solution. However, due to the narrow distance between the memory modules (for example, only 7mm), the water pipes of the water-cooling solution are not easy to pass through, which is difficult for users to install. the problem. In addition, in order to facilitate installation, it adopts the design of single-side installation of memory modules, but it causes the problem of insufficient heat dissipation area of the single-side heat dissipation technology.

是以，如何提供一種可解決上述問題之散熱裝置，是目前業界所亟待克服之課題之一。 Therefore, how to provide a heat dissipation device that can solve the above problems is one of the problems that the industry needs to overcome urgently.

本創作之一目的在於提供一種散熱裝置，用於複數排並列之記憶體模組，該散熱裝置包括：至少一通道單元，貼附於該記憶體模組之一表面上；第一箱體單元，設於該通道單元之一端並具有第一開口；以及第二箱體單元，設於該通道單元之另一端並具有第二開口；其中，該通道單元連通該第一箱體單元及該第二箱體單元，且工作流體填充於該第一箱體單元、該第二箱體單元及該通道單元中，於該通道單元中之該工作流體用以吸收該記憶體模組所產生之熱能之後，經由該第二箱體單元及該第二開口流出並進行冷卻，經冷卻之該工作流體再經由該第一開口及該第一箱體單元而流回該通道單元中。 One objective of the present invention is to provide a heat dissipation device for a plurality of parallel memory modules, the heat dissipation device includes: at least one channel unit attached to a surface of the memory module; a first case unit , which is arranged at one end of the channel unit and has a first opening; and a second box unit, which is arranged at the other end of the channel unit and has a second opening; wherein, the channel unit communicates with the first box unit and the first box unit. Two case units, and the working fluid is filled in the first case unit, the second case unit and the channel unit, and the working fluid in the channel unit is used to absorb the thermal energy generated by the memory module Afterwards, it flows out through the second box unit and the second opening and is cooled, and the cooled working fluid flows back into the channel unit through the first opening and the first box unit.

如前述之散熱裝置中，更包括至少一導熱單元，設於該通道單元及該記憶體模組之間。 As mentioned above, the heat dissipation device further includes at least one heat conduction unit disposed between the channel unit and the memory module.

如前述之散熱裝置中，該導熱單元之數量為二個，分別貼附於該記憶體模組之二相對表面。 As in the aforementioned heat dissipation device, the number of the heat conducting units is two, which are respectively attached to two opposite surfaces of the memory module.

如前述之散熱裝置中，該導熱單元包括至少一散熱墊、至少一熱分隔板及至少一夾持單元，該熱分隔板設於該記憶體模組上，該散熱墊設於該熱分隔板上，而該夾持單元用以將熱分隔板夾設於該記憶體模組上。 As in the aforementioned heat dissipation device, the heat conduction unit includes at least one heat dissipation pad, at least one heat separation plate and at least one clamping unit, the heat separation plate is disposed on the memory module, and the heat dissipation pad is disposed on the thermal a separation board, and the clamping unit is used for clamping the thermal separation board on the memory module.

如前述之散熱裝置中，該熱分隔板之截面為梯形。 As in the aforementioned heat dissipation device, the cross section of the thermal separation plate is trapezoidal.

如前述之散熱裝置中，該第一箱體單元具有與該通道單元之截面相符之至少一第一通道開口，且該第二箱體單元具有與該通道單元之截面相符之至少一第二通道開口。 As in the aforementioned heat sink, the first case unit has at least one first channel opening corresponding to the cross section of the channel unit, and the second case unit has at least one second channel corresponding to the cross section of the channel unit Open your mouth.

如前述之散熱裝置中，該第一通道開口及該第二通道開口分別設於該第一箱體單元及該第二箱體單元之底面，該第一開口及該第二開口分別設於該第一箱體單元及該第二箱體單元之側面。 As in the aforementioned heat sink, the first channel opening and the second channel opening are respectively provided on the bottom surfaces of the first case unit and the second case unit, and the first opening and the second opening are respectively provided in the the side surfaces of the first case unit and the second case unit.

如前述之散熱裝置中，更包括第一竹節頭單元及第二竹節頭單元，用以分別設於該第一開口及該第二開口中。 As mentioned above, the heat dissipation device further includes a first bamboo joint head unit and a second bamboo joint head unit, which are respectively disposed in the first opening and the second opening.

如前述之散熱裝置中，該通道單元之數量為複數個，以同時貼附於不同排並列之記憶體模組之相對表面上，且該通道單元之數量大於該記憶體模組之數量。 As in the above-mentioned heat dissipation device, the number of the channel units is plural, so as to be attached to the opposite surfaces of the memory modules arranged in different rows at the same time, and the number of the channel units is greater than the number of the memory modules.

如前述之散熱裝置中，該通道單元內部具有連通該第一箱體單元及該第二箱體單元的複數個毛細通道。 As in the aforementioned heat dissipation device, the channel unit has a plurality of capillary channels connected with the first case unit and the second case unit.

如前述之散熱裝置中，該通道單元之截面為寬1.5mm、高20mm之長方形，且該複數個毛細通道之一者之截面為寬0.76mm、高0.72mm之長方形。 As in the aforementioned heat dissipation device, the cross section of the channel unit is a rectangle with a width of 1.5mm and a height of 20mm, and the cross section of one of the plurality of capillary channels is a rectangle with a width of 0.76mm and a height of 0.72mm.

10:通道單元 10: Channel unit

101:毛細通道 101: capillary channel

11:第一箱體單元 11: The first box unit

111:第一開口 111: The first opening

112:第一通道開口 112: First channel opening

113:第一蓋體 113: The first cover

114:第一箱體 114: The first box

12:第二箱體單元 12: Second cabinet unit

121:第二開口 121: Second Opening

122:第二通道開口 122: Second channel opening

123:第二蓋體 123: Second cover

124:第二箱體 124: Second cabinet

13,13’:導熱單元 13,13': Thermal unit

131,131’:散熱墊 131, 131': Thermal pad

132,132’:熱分隔板 132, 132': Thermal Separator

1321:傾斜面 1321: Inclined surface

133,133’:夾持單元 133,133': Clamping unit

14:第一竹節頭單元 14: The first bamboo joint head unit

15:第二竹節頭單元 15: The second bamboo joint head unit

2,2’:記憶體模組 2,2': memory module

3,3’:記憶體插槽 3,3': memory slot

W1,W2:寬 W1,W2: wide

H1,H2:高 H1,H2: High

圖1為本創作散熱裝置之整體示意圖。 FIG. 1 is an overall schematic diagram of the created heat sink.

圖2為本創作散熱裝置之分解示意圖。 FIG. 2 is an exploded schematic diagram of the created heat sink.

圖3為圖1中沿A-A剖線之剖面示意圖。 FIG. 3 is a schematic cross-sectional view along the line A-A in FIG. 1 .

圖4為圖3中僅繪示二熱分隔板之剖面放大示意圖。 FIG. 4 is an enlarged schematic cross-sectional view showing only two thermal separators in FIG. 3 .

圖5為圖3中僅繪示通道單元之剖面放大示意圖。 FIG. 5 is an enlarged schematic cross-sectional view showing only the channel unit in FIG. 3 .

以下藉由特定之具體實施例加以說明本創作之實施方式，而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本創作之其他優點和功效，亦可藉由其他不同的具體實施例加以施行或應用。 The following specific embodiments are used to illustrate the implementation of the present creation, and those skilled in the art can easily understand other advantages and effects of the present creation from the content disclosed in this specification, and can also use other different specific embodiments. be implemented or applied.

請參閱圖1及圖2，本創作之散熱裝置係應用於複數排並列之記憶體模組2，散熱裝置包括至少一通道單元10、第一箱體單元11、第二箱體單元 12、第一竹節頭單元14及第二竹節頭單元15。通道單元10貼附於記憶體模組2之一表面上，第一箱體單元11設於通道單元10之一端，第二箱體單元12設於通道單元10之另一端。另外，記憶體模組2可插設於記憶體插槽3中。 Please refer to FIG. 1 and FIG. 2 , the heat dissipation device of the present invention is applied to a plurality of parallel memory modules 2 , and the heat dissipation device includes at least one channel unit 10 , a first case unit 11 , and a second case unit 12. The first bamboo joint head unit 14 and the second bamboo joint head unit 15. The channel unit 10 is attached to one surface of the memory module 2 , the first case unit 11 is arranged at one end of the channel unit 10 , and the second case unit 12 is arranged at the other end of the channel unit 10 . In addition, the memory module 2 can be inserted into the memory slot 3 .

在本實施例中，如圖5所示，係為通道單元10之剖面放大示意圖，通道單元10內部具有複數個沿其長度方向延伸之毛細通道101，複數個毛細通道101可為貫通該通道單元10之用以連接第一箱體單元11及第二箱體單元12之相對二端的複數個長形溝槽，構成毛細通道101的結構具有加強結構之功能，可強化通道單元10之結構，使得內部有毛細通道101的通道單元10相較一般內部無毛細通道的通道單元，能承受較大的***壓力。於一實施例中，通道單元10之截面可為近似長方形，其寬W1為1.5mm，高H1為20mm，毛細通道101之截面可為近似長方形，其寬W2為0.76mm，高H2為0.72mm。另外，各毛細通道101之間的間隔厚度可為0.28mm，毛細通道101距離通道單元10之外表面的厚度可為0.37mm，但本創作皆不以上述為限。 In this embodiment, as shown in FIG. 5 , which is an enlarged schematic cross-sectional view of the channel unit 10 , the channel unit 10 has a plurality of capillary channels 101 extending along its length direction inside the channel unit 10 , and the plurality of capillary channels 101 may pass through the channel unit. A plurality of elongated grooves for connecting the opposite ends of the first box unit 11 and the second box unit 12 of 10, the structure constituting the capillary channel 101 has the function of strengthening the structure, which can strengthen the structure of the channel unit 10, so that The channel unit 10 with the capillary channel 101 inside can withstand higher burst pressure than the general channel unit without the capillary channel inside. In one embodiment, the cross-section of the channel unit 10 can be approximately rectangular, the width W1 is 1.5 mm, and the height H1 is 20 mm. The cross-section of the capillary channel 101 can be approximately rectangular, the width W2 is 0.76 mm, and the height H2 is 0.72 mm. . In addition, the thickness of the interval between each capillary channel 101 may be 0.28 mm, and the thickness of the capillary channel 101 from the outer surface of the channel unit 10 may be 0.37 mm, but the present invention is not limited to the above.

第一箱體單元11可由第一箱體114及第一蓋體113所組合而成，經組合之第一箱體114及第一蓋體113可於其內部形成一容納工作流體之腔室。第一箱體114之底面具有至少一第一通道開口112，第一箱體114之側面具有第一開口111。於一實施例中，第一通道開口112之數量可搭配通道單元10之數量，且第一通道開口112之開口形狀與通道單元10之截面相符，使得通道單元10可卡合並密封第一通道開口112。另外，第一開口111可供第一竹節頭單元14卡合並密封。 The first box unit 11 can be formed by combining the first box 114 and the first cover 113 , and the combined first box 114 and the first cover 113 can form a chamber for accommodating the working fluid. The bottom surface of the first box body 114 has at least one first channel opening 112 , and the side surface of the first box body 114 has a first opening 111 . In one embodiment, the number of the first channel openings 112 can match the number of channel units 10 , and the shape of the opening of the first channel opening 112 is consistent with the cross-section of the channel unit 10 , so that the channel unit 10 can snap and seal the first channel opening 112. In addition, the first opening 111 can be used for the first bamboo joint head unit 14 to be clamped and sealed.

第二箱體單元12可由第二箱體124及第二蓋體123所組合而成，經組合之第二箱體124及第二蓋體123可於其內部形成一容納工作流體之腔室。第二箱體124之底面具有至少一第二通道開口122，第二箱體124之側面具有第二開口121。於一實施例中，第二通道開口122之數量可搭配通道單元10之數量，且第二通道開口122之開口形狀與通道單元10之截面相符，使得通道單元10可卡合並密封第二通道開口122。另外，第二開口121可供第二竹節頭單元15卡合並密封。 The second box unit 12 can be formed by combining the second box 124 and the second cover 123 , and the combined second box 124 and the second cover 123 can form a chamber for accommodating the working fluid. the first The bottom surface of the two boxes 124 has at least one second channel opening 122 , and the side surface of the second box 124 has a second opening 121 . In one embodiment, the number of the second channel openings 122 can match the number of the channel units 10 , and the shape of the openings of the second channel openings 122 is consistent with the cross-section of the channel unit 10 , so that the channel unit 10 can snap and seal the second channel openings 122. In addition, the second opening 121 can be used for the second bamboo joint head unit 15 to be clamped and sealed.

由於通道單元10之二端分別連接第一箱體單元11及第二箱體單元12，故複數個毛細通道101可連通第一箱體單元11及第二箱體單元12。填充在第一箱體單元11及第二箱體單元12中的工作流體可流入毛細通道101中，以吸收記憶體模組2所產生之熱能。第一竹節頭單元14及第二竹節頭單元15可透過一管體來將工作流體引出至散熱裝置之外部進行散熱，例如在管體上安裝散熱風扇等等。管體、第一箱體單元11、第二箱體單元12及通道單元10中之工作流體可形成單向循環，例如在毛細通道101中之工作流體吸收記憶體模組2所產生之熱能之後，可經由第二箱體單元12及第二開口121上之第二竹節頭單元15流出至管體來進行冷卻，經冷卻之該工作流體從管體再經由第一開口111上之第一竹節頭單元14及第一箱體單元11而流回毛細通道101中，以進行下一次的散熱循環。 Since two ends of the channel unit 10 are respectively connected to the first case unit 11 and the second case unit 12 , the plurality of capillary channels 101 can communicate with the first case unit 11 and the second case unit 12 . The working fluid filled in the first case unit 11 and the second case unit 12 can flow into the capillary channel 101 to absorb the thermal energy generated by the memory module 2 . The first bamboo joint head unit 14 and the second bamboo joint head unit 15 can lead the working fluid to the outside of the heat dissipation device through a pipe body for heat dissipation, for example, a heat dissipation fan is installed on the pipe body. The working fluid in the tube body, the first case unit 11 , the second case unit 12 and the channel unit 10 can form a unidirectional circulation, for example, after the working fluid in the capillary channel 101 absorbs the thermal energy generated by the memory module 2 , it can flow out to the tube body through the second box body unit 12 and the second bamboo joint head unit 15 on the second opening 121 for cooling, and the cooled working fluid flows from the tube body through the first bamboo joint on the first opening 111 The head unit 14 and the first box unit 11 flow back into the capillary channel 101 for the next heat dissipation cycle.

在本實施例中，為了增加散熱效率，可在通道單元10及記憶體模組2之間設置至少一導熱單元13。導熱單元13包括至少一散熱墊131、至少一熱分隔板132及至少一夾持單元133，熱分隔板132設於記憶體模組2上，夾持單元133用以將熱分隔板132夾設於記憶體模組2上，而散熱墊131可設於熱分隔板132上。於一實施例中，如圖3所示，散熱墊131、熱分隔板132之數量可為二個，以分別設於記憶體模組2之二相對表面上，而夾持單元133之數量亦可為二個，以分別夾設在記憶體模組2之一長邊之相對二端上。 In this embodiment, in order to increase the heat dissipation efficiency, at least one heat conduction unit 13 may be disposed between the channel unit 10 and the memory module 2 . The heat conduction unit 13 includes at least one heat dissipation pad 131 , at least one thermal separation plate 132 and at least one clamping unit 133 . The 132 is clamped on the memory module 2 , and the heat dissipation pad 131 can be disposed on the thermal separation plate 132 . In one embodiment, as shown in FIG. 3 , the number of the heat dissipation pads 131 and the thermal separation plate 132 can be two, so as to be disposed on the two opposite surfaces of the memory module 2 respectively, and the number of the clamping units 133 There may also be two, which are respectively clamped on two opposite ends of one long side of the memory module 2 .

於一實施例中，熱分隔板132為薄鋁擠型，且為單側傾斜結構設計，例如熱分隔板132之截面可為梯形，如圖4所示，且梯形之傾斜面1321為熱分隔板132中貼附記憶體模組2之一側的相對側，這設計可讓散熱墊131貼附於熱分隔板132之後也會具有一傾斜面，使得使用者在拔插記憶體模組2(可連同熱分隔板132或導熱單元13一起拔插)時將不易被通道單元10所阻礙，進一步便於拔插。 In one embodiment, the thermal separation plate 132 is a thin aluminum extrusion type and is designed with a single-sided inclined structure. For example, the cross-section of the thermal separation plate 132 can be a trapezoid, as shown in FIG. 4 , and the inclined surface 1321 of the trapezoid is The thermal separation plate 132 is on the opposite side of the side where the memory module 2 is attached. This design allows the heat dissipation pad 131 to have an inclined surface after being attached to the thermal separation plate 132, so that the user can remove and insert the memory. The body module 2 (which can be plugged and plugged together with the thermal separation plate 132 or the heat conduction unit 13 ) will not be easily blocked by the channel unit 10 , which further facilitates plugging.

於一實施例中，如圖3所示，在具有複數排並列之記憶體模組2、2’及記憶體插槽3、3’時，設在不同排並列之記憶體模組2、2’之間的通道單元10可同時貼附在記憶體模組2、2’之相對表面上。更具體而言，通道單元10可同時貼附在記憶體模組2、2’之相對表面上的導熱單元13、13’之散熱墊131、131’上，以使通道單元10內之工作流體可同時吸收不同記憶體模組2、2’所產生之熱能。另外，為了使複數排並列之記憶體模組2、2’之相對表面皆可貼附有通道單元10，通道單元10之設置數量可大於記憶體模組2、2’之數量，例如圖3所示之記憶體模組之數量為8個，而通道單元10之數量為9個，但本創作並不以此為限。 In one embodiment, as shown in FIG. 3 , when there are multiple parallel rows of memory modules 2 and 2 ′ and memory slots 3 and 3 ′, the parallel memory modules 2 and 2 are arranged in different rows. The channel unit 10 between ' can be attached to the opposite surfaces of the memory modules 2 and 2' at the same time. More specifically, the channel unit 10 can be attached to the heat dissipation pads 131 , 131 ′ of the thermally conductive units 13 , 13 ′ on the opposite surfaces of the memory modules 2 , 2 ′ at the same time, so that the working fluid in the channel unit 10 is The thermal energy generated by different memory modules 2 and 2' can be absorbed at the same time. In addition, in order to enable the channel units 10 to be attached to the opposite surfaces of the memory modules 2 and 2' in a plurality of parallel rows, the number of the channel units 10 can be larger than the number of the memory modules 2 and 2', for example, as shown in FIG. 3 . The number of shown memory modules is 8, and the number of channel units 10 is 9, but the present invention is not limited to this.

綜上所述，藉由本創作之散熱裝置中通道單元同時貼附於記憶體模組之二相對表面之設計，通道單元中的複數個毛細通道可有效吸收所貼附之記憶體模組所產生之熱能，並可有效增加散熱效率。此外，本創作之散熱裝置之各元件為模組化設計，可根據實際需求設置不同數量之通道單元，且更換維護方便。又，本創作之散熱裝置中之熱分隔板具有傾斜面之設計，允許拔插記憶體模組時散熱墊不被破壞且可重複拔插，且散熱墊可吸收組裝公差，確保通道單元與記憶體模組之間的有效接觸。 To sum up, with the design of the channel unit attached to the two opposite surfaces of the memory module in the heat dissipation device of the present invention, the plurality of capillary channels in the channel unit can effectively absorb the generation of the attached memory module. It can effectively increase the heat dissipation efficiency. In addition, each component of the heat dissipation device of the present creation is of modular design, which can set up different numbers of channel units according to actual needs, and is convenient for replacement and maintenance. In addition, the heat-dissipating plate in the heat-dissipating device of the present invention is designed with an inclined surface, which allows the heat-dissipating pad to be undamaged when the memory module is removed and inserted, and the heat-dissipating pad can be inserted and removed repeatedly. Effective contact between memory modules.

上述實施形態僅為例示性說明本創作之技術原理、特點及其功效，並非用以限制本創作之可實施範疇，任何熟習此技術之人士均可在不違背本創作之精神與範疇下，對上述實施形態進行修飾與改變。然任何運用本創作所教示內容而完成之等效修飾及改變，均仍應為下述之申請專利範圍所涵蓋。而本創作之權利保護範圍，應如下述之申請專利範圍所列。 The above-mentioned embodiments are only illustrative of the technical principles, features and effects of this creation, and are not intended to limit the scope of implementation of this creation. Modifications and changes are made to the above-described embodiments. However, any equivalent modifications and changes made by using the content taught in this creation should still be covered by the following patent application scope. The scope of protection of the rights of this creation shall be listed in the following patent application scope.

10:通道單元 10: Channel unit

11:第一箱體單元 11: The first box unit

12:第二箱體單元 12: Second cabinet unit

14:第一竹節頭單元 14: The first bamboo joint head unit

15:第二竹節頭單元 15: The second bamboo joint head unit

2:記憶體模組 2: Memory module

3:記憶體插槽 3: Memory slot

Claims

一種散熱裝置，用於複數排並列之記憶體模組，該散熱裝置包括： A heat dissipation device is used for a plurality of parallel memory modules, the heat dissipation device includes:

至少一通道單元，貼附於該記憶體模組之一表面上； at least one channel unit attached to a surface of the memory module;

第一箱體單元，設於該通道單元之一端並具有第一開口；以及 a first box unit, disposed at one end of the channel unit and having a first opening; and

第二箱體單元，設於該通道單元之另一端並具有第二開口； a second box unit, disposed at the other end of the channel unit and having a second opening;

其中，該通道單元連通該第一箱體單元及該第二箱體單元，且工作流體填充於該第一箱體單元、該第二箱體單元及該通道單元中，該通道單元中之該工作流體用以吸收該記憶體模組所產生之熱能，並經由該第二箱體單元及該第二開口流出進行冷卻，經冷卻之該工作流體再經由該第一開口及該第一箱體單元而流回該通道單元中。 Wherein, the channel unit communicates with the first box unit and the second box unit, and the working fluid is filled in the first box unit, the second box unit and the channel unit, and the channel unit in the The working fluid is used to absorb the thermal energy generated by the memory module, and flows out through the second box unit and the second opening for cooling, and the cooled working fluid passes through the first opening and the first box unit and flow back into the channel unit.

如請求項1所述之散熱裝置，更包括至少一導熱單元，設於該通道單元及該記憶體模組之間。 The heat dissipation device according to claim 1, further comprising at least one heat conduction unit disposed between the channel unit and the memory module.

如請求項2所述之散熱裝置，其中，該導熱單元之數量為二個，分別貼附於該記憶體模組之二相對表面。 The heat dissipation device according to claim 2, wherein the number of the heat conducting units is two, which are respectively attached to two opposite surfaces of the memory module.

如請求項2所述之散熱裝置，其中，該導熱單元包括至少一散熱墊、至少一熱分隔板及至少一夾持單元，該熱分隔板設於該記憶體模組上，該散熱墊設於該熱分隔板上，而該夾持單元用以將熱分隔板夾設於該記憶體模組上。 The heat dissipation device according to claim 2, wherein the heat conduction unit comprises at least one heat dissipation pad, at least one heat separation plate and at least one clamping unit, the heat separation plate is disposed on the memory module, the heat dissipation The pad is arranged on the heat separation plate, and the clamping unit is used for clamping the heat separation plate on the memory module.

如請求項4所述之散熱裝置，其中，該熱分隔板之截面為梯形。 The heat dissipation device according to claim 4, wherein the cross section of the thermal separation plate is a trapezoid.

如請求項1所述之散熱裝置，其中，該第一箱體單元具有與該通道單元之截面相符之至少一第一通道開口，且該第二箱體單元具有與該通道單元之截面相符之至少一第二通道開口。 The heat sink as claimed in claim 1, wherein the first case unit has at least one first channel opening corresponding to the cross section of the channel unit, and the second case unit has a cross section corresponding to the channel unit. At least one second channel opening.

如請求項6所述之散熱裝置，其中，該第一通道開口及該第二通道開口分別設於該第一箱體單元及該第二箱體單元之底面，該第一開口及該第二開口分別設於該第一箱體單元及該第二箱體單元之側面。 The heat dissipation device of claim 6, wherein the first channel opening and the second channel opening are respectively disposed on the bottom surfaces of the first case unit and the second case unit, the first opening and the second The openings are respectively arranged on the side surfaces of the first case unit and the second case unit.

如請求項6所述之散熱裝置，更包括第一竹節頭單元及第二竹節頭單元，用以分別設於該第一開口及該第二開口中。 The heat dissipation device according to claim 6, further comprising a first bamboo joint head unit and a second bamboo joint head unit, which are respectively disposed in the first opening and the second opening.

如請求項1所述之散熱裝置，其中，該通道單元之數量為複數個，以同時貼附於不同排並列之記憶體模組之相對表面上，且該通道單元之數量大於該記憶體模組之數量。 The heat dissipation device according to claim 1, wherein the number of the channel units is plural, so as to be attached to the opposite surfaces of the memory modules arranged in different rows at the same time, and the number of the channel units is larger than the number of the memory modules number of groups.

如請求項1所述之散熱裝置，其中，該通道單元內部具有連通該第一箱體單元及該第二箱體單元的複數個毛細通道。 The heat dissipation device according to claim 1, wherein the channel unit has a plurality of capillary channels connected with the first case unit and the second case unit.

如請求項10所述之散熱裝置，其中，該通道單元之截面為寬1.5mm、高20mm之長方形，且該複數個毛細通道之一者之截面為寬0.76mm、高0.72mm之長方形。 The heat dissipation device according to claim 10, wherein the cross section of the channel unit is a rectangle with a width of 1.5mm and a height of 20mm, and the cross section of one of the plurality of capillary channels is a rectangle with a width of 0.76mm and a height of 0.72mm.